JPH0990259A - Light deflector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light deflector simple in optical design and capable of positioning a small light emitting device optically with high accuracy improving the workability and minaturizing the deflector. SOLUTION: In this light deflector having a frame body 2 and a twisting vibrator 4 arranged in the frame body 2 formed from the same semiconductor single crystal substrate 1 and twisting springs 31 , 32 arranged at both ends of the frame body 2 and supporting the twisting vibrator 4, a driving source 6 formed on the twisting pendulum 4 and generating a torsional oscillation in the twisting vibrator 4, a surface light emitting laser 5 formed on the twisting vibrator 4 positioned on the line with the twisting springs 31 , 32 as axis and a light receiving element 10 for detecting the light beam from the surface light emitting laser 5 are provided, and the driving source 6, the surface light emitting laser 5 and the light receiving element 10 are monolithically formed on the semiconductor single crystal substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical deflector,
Especially used for laser printers and bar code scanners,
The light beam relates to a light deflecting device that scans in at least one direction.

[0002]

2. Description of the Related Art As an example of an optical deflector, there is known an optical deflector which is provided with a light source on a leaf spring and which deflects light from the light source by vibrating the leaf spring with a piezoelectric element or the like. As such an optical deflecting device, for example, the device shown in FIG. 13 is known (Japanese Patent Laid-Open No. 273485/1993).

Reference numeral 131 in the figure denotes a leaf spring-like elastically deforming portion having a bending deforming mode. A thick vibration input section 132 is provided at one end of the elastically deformable section 131, and a scan section 133 is provided at the other end. The lower surface of the vibration input section 132 is joined to the free end of the piezoelectric element 134. A recess 135 is provided on the upper surface of the scanning unit 133, and the recess 13
A light emitting element 136 such as an LED chip is mounted inside the device 5. A micro Fresnel lens 137 is mounted on the upper surface of the scanning unit 133.

In this optical deflector, the piezoelectric element 134 propagates vibration to the elastically deformable portion 131, and the light emitting element 136 at the tip of the elastically deformable portion 131 is deflected by the vibration of the elastically deformable portion 131. At this time, the light emitting element 136 rotates with the fixed end of the elastically deformable portion 131 as the origin according to the vibration of the elastically deformable portion 131. Further, when the light beam α is emitted from the light emitting element 136,
The light beam α is also scanned at the scan angle θ as the scanning unit 133 rotates.

[0005]

However, as shown in FIG.
Although the optical deflector shown in (1) constitutes a small-sized and high-precision optical deflector, it has the following problems. In designing the optical path, it is desirable that the origin of the light emitting element 136 does not move even when the light is deflected. However, the light emitting element 136 formed on the elastically deformable portion 131 is rotated by the vibration with the fixed end of the elastically deformable portion 131 as the origin. Therefore, the light emitting element being deflected
The 136 origin is constantly moving, complicating the optical design.

Further, no light receiving element is formed in the above optical deflector, and the light emitting element 136 is not formed on the substrate. Therefore, it is necessary to optically align the small light emitting element 136 with high accuracy. This takes time and labor for positioning, causes an increase in the size of the device, and reduces the productivity of the optical deflector.

Further, since the light receiving element is not integrally formed on the substrate on which the light emitting element is provided, it is disadvantageous in terms of downsizing and simplification of manufacturing. Further, there is a problem that the vibration mode of light emitted from the light emitting element supported by the leaf spring is easily changed by an external force.

The present invention has been made in consideration of these circumstances, and has a simpler optical design than the conventional one, and a small light emitting element can be optically formed by forming the light emitting element and the light receiving element on the same substrate. It is an object of the present invention to provide an optical deflecting device that can perform highly accurate positioning, improve workability, and realize downsizing.

[0009]

According to a first aspect of the present invention, there is provided a frame body formed from the same semiconductor single crystal substrate, a torsional oscillator arranged in the frame body and arranged at both ends of the frame body. In an optical deflector having a torsion spring that supports the torsion oscillator, the optical deflection device is formed on the torsion oscillator,
A drive source for generating a torsional vibration in the torsional oscillator, a surface emitting laser formed on the torsional oscillator located on a line about the torsion spring, and a light for detecting light from the surface emitting laser. An optical deflector comprising a light receiving element, wherein the drive source, the surface emitting laser and the light receiving element are monolithically formed on the semiconductor single crystal substrate.

(Structure) This corresponds to the first embodiment. The frame part means that the semiconductor single crystal substrate has one or more hollow parts. The inside of the frame portion indicates an end portion forming a hollow portion, and the “arranged at both ends” indicates that there are two torsion springs, and each of them is connected to the end portion of the hollow portion. For example, an amplifier circuit may be formed together with the light receiving element.

(Operation / Effect) The light receiving portion, the light emitting portion, and the light deflecting portion can be integrally formed on the semiconductor single crystal substrate,
The control circuit can be integrally formed on the same substrate, and the adjustment of the optical axis is automatically determined at the time of manufacturing.Since the surface emitting laser is formed on the vibrator, the vibrator vibrates during light emission. It is also possible to cool the surface emitting laser. The oscillator supported by two torsion springs is strong against external force,
Since the mode does not change, stable operation is possible. As a result, it is possible to provide a highly precise optical deflector with an ultra-compact and easy configuration.

According to a second invention of the present application, a first semiconductor single crystal substrate having a light deflector, a light receiving element, a light emitting window below the light deflector, and a second semiconductor single crystal substrate having a surface emitting laser are provided. In a light deflecting device formed in a hybrid so that the light deflector is arranged on an optical path of light emitted from the surface emitting laser, the light deflector and the light receiving element are integrally formed on a first semiconductor single crystal substrate. The optical deflector is formed and has a linear type drive source, one end of which is provided on the first semiconductor single crystal substrate, and a lattice spacing which is formed integrally with the drive source and is continuous in the moving direction of the drive source. It is an optical deflecting device characterized by being configured by a diffraction grating that changes to.

(Structure) The first, second, and third embodiments correspond.
The light emission window means a hollow portion in the substrate, a slit portion, or a portion formed of a material capable of transmitting emitted light. "Formed into a hybrid" means
This means that two or more substrates are joined and bonded together by an adhesive technique. The linear drive source means a comb drive source or an electrostatic distribution drive source.

(Operation / Effect) When the diffraction grating linearly moves by the linear drive source, the diffraction grating has a continuous grating interval with respect to the moving direction. The angle at which the light from the laser is deflected as it passes through the grating also changes continuously. This time,
The diffraction grating determines the grating interval so that the emitted light can be continuously deflected by the given linear movement.

Although the two substrates are formed as a hybrid, since the surface emitting laser, the light deflector and the light receiving element are integrally formed, it is possible to provide a microminiature light deflecting device, which is a component of the light deflecting device. A light receiving part and a light deflection part on the same substrate,
By forming the light emitting portion on another substrate, the manufacturing risk can be dispersed, and the optical deflector can be manufactured easily and safely.

A third invention of the present application is a first semiconductor single crystal substrate having a light deflector and a light emitting window below the light deflector, a second semiconductor single crystal substrate having a surface emitting laser, a light receiving element and a hollow structure portion. In a light deflecting device in which a crystal substrate and a light emitting element are hybrid-formed so that the light deflector is arranged on the optical path of the light emitted from the surface emitting laser, the light receiving element is the light source of the second semiconductor single crystal substrate. The light deflector is formed on the back surface of the surface, the light deflector is formed on the hollow structure portion in the first semiconductor substrate, and at least one layer having a reflecting surface for reflecting light from the surface emitting laser is a conductive material. The formed diaphragm, the spacer formed on the first semiconductor single crystal substrate and having a hollow structure on the diaphragm, and the electrode formed at a position corresponding to the hollow structure of the spacer are formed in a hybrid. Is an optical deflection device according to claim is.

(Structure) The first, second, and third embodiments correspond.
The light emission window means a hollow portion in the substrate, a slit portion, or a portion formed of a material capable of transmitting emitted light. "Formed into a hybrid" means
This means that two or more substrates are joined and bonded together by an adhesive technique.

(Operation / Effect) An electrostatic attractive force is generated by applying a voltage to two opposing electrodes. This force deforms the diaphragm having the reflecting surface. The amount of deformation is determined by the applied voltage, and the light can be continuously deflected by continuously changing the voltage. In this structure, the surface emitting laser is not exposed on the surface, and the structure is resistant to external damage.

Although the two substrates are formed in a hybrid manner, since the surface emitting laser, the light deflector and the light receiving element are integrally formed, it is possible to provide a microminiature light deflecting device, which is a component of the light deflecting device. A light receiving part and a light deflection part on the same substrate,
By forming the light emitting portion on another substrate, the manufacturing risk can be dispersed, and the optical deflector can be manufactured easily and safely.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) Reference is made to FIGS. 1 (A) and 1 (B). Here, FIG. 1A is a perspective view of the optical deflecting device according to the first embodiment, and FIG. 1B is a perspective view of FIG. 1A viewed from the back. Reference numeral 1 in the figure is a gallium arsenide substrate as a semiconductor single crystal substrate. A frame body 2, torsion springs 3 ₁ and 3 ₂ , and a torsion oscillator 4 are formed from the substrate 1.
The torsion oscillator 4 is supported by _two torsion springs 3 ₁ and 3 _2, and the torsion springs 3 ₁ and 3 ₂ are respectively coupled to both ends of the frame body portion 2. A vertical cavity surface emitting laser 5 as a surface emitting laser is formed on the torsion oscillator 4, and the surface emitting laser 5 has a torsion spring 3 coupled to the frame 2 from both ends of the torsion oscillator 4. ₁ ,
_They are arranged on a line with 3 ₂ as the axis.

On the edge of the torsional oscillator 4, an electromagnetic coil 6 is formed so as to circulate. Wirings 7 ₁ and 7 ₂ and contact pads 8 ₁ and 8 ₂ for the surface emitting laser 5 and common to the surface emitting laser 5 and the electromagnetic coil 6 are formed on the substrate 1. A wiring 7 ₃ for the electromagnetic coil 6 and a contact pad 8 ₃ are formed on the substrate 1. A heat dissipation plate 9 processed by etching is provided on the lower surface of the torsion oscillator 4. The substrate 1 has p
A −n junction (light receiving element) 10 is formed.
Further, contact pads 8 ₄ and 8 ₅ of the p layer and the n layer of the light receiving element 10 are also formed on the substrate 1. In addition, reference numerals 12 and 13 in the drawing are insulating films formed on the torsional oscillator 4 in order to pass wiring to the surface emitting laser 5.

Next, the operation of the optical deflector having the above structure will be described. Laser light is emitted from the surface emitting laser 5 by passing a direct current through the contact pad 8 ₁ . Also, when the optical deflector is in a magnetic field in a direction parallel to the substrate plane and perpendicular to the torsion axis, an alternating current is applied to the contact pad 8 ₃
By causing the electric current to flow through, the torsion oscillator 4 vibrates with the frequency of the alternating current. The deflection angle of the emitted light and the scanning speed are determined by the vibration amplitude and frequency of the torsional oscillator 4. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 10. The data is detected as a current value from the contact pads 8 ₄ and 8 ₅ .

Therefore, the optical deflecting device of the first embodiment has the following effects. In Example 1, the vertical cavity surface emitting laser 5 was used as the surface emitting laser.
The vertical cavity surface emitting laser 5 does not require an optical element such as a lens because the emitted beam is narrow and sharp. Since the surface emitting laser 5 is arranged on the axial lines of the torsion springs 3 ₁ and 3 ₂ , the origin of the surface emitting laser does not change when the light is deflected, which simplifies the optical design.

Further, a general semiconductor laser is of an edge emitting type and must be used by being bonded to a substrate. Therefore, even if the surface-emitting laser is made small, it is cut out to a size necessary for handling, and thus the oscillator is large. However, since the optical deflecting device shown in the first embodiment is formed integrally on the gallium arsenide substrate by epitaxial growth directly, the surface emitting laser 5 is very small in size and the torsional oscillator 4 is also small in size. can do. Since the torsional oscillator 4 is supported by the two torsion springs 3 ₁ and 3 ₂ , there is no vibration change due to an external force and stable operation is possible. Further, since the torsion springs 3 ₁ and 3 ₂ and the frame body portion 2 are also formed on the same substrate 1, this optical deflector is provided in a very small size while having the surface emitting laser 5, the optical deflector and the light receiving element 10 together. be able to.

Further, the thermal problem of the surface emitting laser hinders continuous oscillation of the laser. However, the above-mentioned Example 1
Since the surface emitting laser 5 is formed on the torsional oscillator 4, a considerable cooling effect can be expected due to torsional vibration during light emission. Further, by forming the heat radiating plate 9, a large current can be passed through the surface emitting laser 5, and high output light can be obtained.

It should be noted that each structure of the first embodiment can of course be variously modified and changed. For example, two permanent magnets may be arranged instead of the electromagnetic coil. At this time, the two permanent magnets must be arranged so that their polar directions are opposite to each other. Further, the heat dissipation plate formed on the back surface of the torsional vibrator is not always necessary.

(Embodiment 2) FIG. 2 and FIG.
Reference is made to (D). Here, FIG. 2 is a perspective view of an optical deflecting device in which a permanent magnet is hybridized according to a second embodiment of the present invention, and FIG. 3 (A) is a perspective view of a first substrate to which a permanent magnet is bonded. 3B is a perspective view of the first substrate of FIG. 3A viewed from the back surface. 3C is a perspective view of a perspective view of the second substrate, on which the surface emitting laser of the optical deflector of FIG. 2 is formed, viewed from the back side, and FIG. 3D is a second perspective view of FIG. 3C. The perspective view which looked at the board | substrate from the surface is shown. Further, FIG. 2 is completed by joining the first substrate of FIG. 3A and the second substrate of FIG. 3C. The same members as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

A silicon substrate is used as the first substrate 21. The surface of the first substrate 21 corresponding to the lower part of the vibrator is KOH.
Processed surface that has been machined by etching using, etc., and the torsional vibrator has been dug down to a depth where a prescribed vibration angle can be obtained.
22 are formed. The processing surface 22 is for allowing the torsional vibrator to rotate. This machined surface 22
Permanent magnets 23 and 24 are adhered to the back surface of the. The bonding position should be determined so that the magnetic field works efficiently, and the magnetic flux density depends on the magnetization directions of the permanent magnets 23 and 24 and their shapes.

A gallium arsenide substrate is used as the second substrate 25. This second substrate 25 is shown in FIG.
The optical deflector is configured by being bonded to the first substrate 21 in the state of (A). At this time, anodic bonding is used to bond the two substrates 21 and 25 together. That is, a low melting point glass is formed on the bonding surface of the gallium arsenide substrate, and a voltage is applied to the low melting point glass and the silicon substrate surface to bond them.

Next, the operation of the optical deflecting device according to the second embodiment will be described. When forming the permanent magnets 23, 24 in a hybrid manner, it is necessary to optimize the positional relationship between the permanent magnets 23, 24 and the electromagnetic coil 6, and the following equation is used to form the magnetic field that works most efficiently. Approximate analysis can be performed using (1). The magnetic flux density in the magnetic field formed by the two magnets can be expressed by equation (1).

[0031] _{dB y (x, y, z} ) = (B 0 / 4π) × (y-y 0) / {(x-x 0) 2 + (y-y 0) 2 + (z-z 0) } ^3/2 (1) In the above formula 1, B ₀ is the residual magnetic flux density, π is the circular constant,
(X ₀ , y ₀ , z ₀ ) represents an arbitrary surface position of the magnet,
Magnetic flux density B _y at any point (x, y, z) in the magnetic field
Find (x, y, z). The obtained magnetic flux density is the following formula 2
Given in.

Ψ = n · B _y · L ₂ · L _b · I _c / G · I _p (2) In the above formula (2), n is the number of turns of the electromagnetic coil, B _y is the magnetic flux density, and L is the twist. The size of the torsional oscillator in the direction perpendicular to the spring, L _b is the length of the torsional spring in the longitudinal direction, G is the lateral elastic modulus, I _c is the current value flowing in the electromagnetic coil, I _p is the second polar moment of inertia, and above The deflection angle ψ is obtained from the parameter of.

The permanent magnet is arranged at a position optimized by the above equation. The processing depth of the processed surface 22 of the silicon substrate can also be determined by the deflection angle ψ.
Therefore, the optical deflector according to the second embodiment has the following effects.

An optical deflecting device according to a second aspect of the invention has an electromagnetic coil which is driven in a magnetic field having a component parallel to the plane of the substrate and perpendicular to the torsion axis. However, a magnet is required to form this magnetic field except when used in a place where the above-mentioned magnetic field atmosphere already exists, and the optical deflecting device itself becomes large depending on its configuration. This configuration is a permanent magnet
By arranging 23 and 24 at optimum positions for driving the electromagnetic coil 6 and forming them into a hybrid, it is possible to provide an ultra-small and high-performance optical deflector.

Furthermore, the thermal problem of the surface emitting laser hinders continuous oscillation of the laser. However, since the surface emitting laser 5 is formed on the torsional oscillator 4 in the first embodiment, a considerable cooling effect can be expected due to the torsional vibration during light emission. Further, by forming the heat dissipation plate 9,
A large current can be passed through the surface emitting laser 5, and high output light can be obtained.

Incidentally, each structure of the second embodiment can of course be modified and changed in various ways. For example, an electromagnetic coil may be arranged instead of the permanent magnet. At this time, one or two electromagnetic coils may be formed. In one case, as shown in FIG. 4, the coil portion 41 parallel to the torsion axis is formed at the same position as in the case of the permanent magnet, and the coil portion in the vertical direction adversely affects the vibration. It is formed at a position away from the vibrator. The current to the electromagnetic coil is passed in the direction opposite to the direction applied to the electromagnetic coil formed on the vibrator. As a result, attractive force and repulsive force are generated, and the vibrator is rotated by applying an alternating current.

When two electromagnetic coils are formed, one side of the electromagnetic coil which is formed in a loop is formed at the place where the permanent magnet is arranged. Torsional vibration is applied to each electromagnetic coil by applying a current in the same direction as that of the opposite coil formed on the vibrator and by applying a current in the same direction alternately to each opposite coil group. Rotate the child.

(Embodiment 3) FIGS. 5 and 6A to 6D.
Refer to. Here, FIG. 5 is a perspective view of an optical deflecting device according to a third embodiment of the present invention, and FIG. 6A is a perspective view of a first substrate on which two electrodes for generating electrostatic attraction are formed.
FIG. 6B shows a perspective view of the substrate of FIG.
6C is a perspective view of the second substrate on which the surface-emitting light source is formed, viewed from the back side, and FIG. 6D is a perspective view of the second substrate of FIG. 6C viewed from the front side. . Note that FIG. 5 is shown in FIG.
The surface and the second substrate in the state of FIG. 6C are bonded to the first substrate in the state of FIG. However, the same members as those in FIG.

A silicon substrate is used as the first substrate 51. The surface of the first substrate 51 under the vibrator is KOH.
Processed surface that has been machined by etching using, etc., and the torsional vibrator has been dug down to a depth where a prescribed vibration angle can be obtained.
52 are formed. The processed surface 52 is for allowing the torsional oscillator to rotate. This machined surface 42
Electrodes 53 ₁ and 53 ₂ are formed on the. The electrodes 53 ₁ ,
Contact holes 54 ₁ and 54 ₂ are formed on the back surface of the machined surface 52 opposite to 53 ₂ , respectively.
The 54 _first contact pads 56 ₁ through the wiring 55 ₁ is formed, the _two other contact holes 54 contact pads 56 ₂ via a line 55 ₂ is formed.

A gallium arsenide substrate is used as the second substrate 57. This second substrate 57 is shown in FIG.
The optical deflector is configured by being bonded to the first substrate 51 in the state of (A). At this time, anodic bonding is used for bonding both substrates 51 and 57. That is, a low melting point glass is formed on the bonding surface of the gallium arsenide substrate, and a voltage is applied to the low melting point glass and the silicon substrate surface to bond them. The back side second substrate 51 opposing positions on the electrodes 53 _1, 53 _2, electrodes 58 _1, 58 ₂
Are formed. The one electrode 58 ₁ is the contact pads 60 ₁ through the wiring 59 ₁ is formed, the other electrode 58 ₂ contact pads 60 ₂ through the wiring 59 ₂ is formed. The electrodes 58 ₁ , 58 ₂ and the contact pad 60 ₁ ,
60 ₂ is formed in the substrate by thermal diffusion or ion implantation because the back surface of the second substrate 57 is used as a bonding surface in anodic bonding.

Next, the operation of the optical deflector according to the third embodiment will be described. A laser beam is emitted from the surface emitting laser 5 by applying a direct current from the contact pad 8 ₃ . Further, by applying a voltage to the electrodes 58 ₁ and 53 ₁ or applying a voltage to the electrodes 58 ₂ and 53 ₂ ,
An electrostatic attractive force is generated between the electrodes, and the torsional oscillator 4 rotates. Since the torsional oscillator 4 vibrates by alternately applying a voltage between the electrodes, the vibration frequency of the torsional oscillator 4 is determined by controlling the application time of each. The deflection angle of the emitted light and the scanning speed are determined by the vibration amplitude and frequency of the torsional oscillator 4. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 10. The data is detected as a current value from the contact pads 8 ₄ and 8 ₅ .

Therefore, the above optical deflector has the following effects. In Example 3, a vertical cavity surface emitting laser was used as the light emitting element. The vertical cavity surface emitting laser does not require an optical element such as a lens because the emitted beam is narrow and sharp. And the torsion springs 3 ₁ , 3 ₂
Since the surface emitting laser is arranged on the axis line of, the origin of the light source does not change when the light is deflected, which simplifies the optical design.
A general semiconductor laser is an edge-emitting type and has to be used by being bonded to a substrate. Therefore, even if the surface-emitting laser is made small, it is cut out to a size necessary for handling, and thus the oscillator is large. However, since the optical deflecting device shown in the third embodiment is formed integrally by directly epitaxially growing it on gallium arsenide, the surface emitting laser 5 has a very small size and the torsional oscillator 4 is used.
Can be formed small. Also, the torsion spring 3
_{Since 1} and 3 ₂ and the frame 2 are also formed on the same substrate, this optical deflecting device can be provided in a very small size while having the surface emitting laser 5, the optical deflector and the light receiving element 10.

Incidentally, each structure of this modification can of course be modified and changed in various ways. For example, a heat dissipation plate processed by etching may be formed on the back surface of the surface of the gallium arsenide substrate forming the torsion oscillator on which the surface emitting laser is formed. The thermal problems of surface emitting lasers prevent continuous oscillation of the light source. However, since the surface emitting laser is formed on the torsional oscillator, a considerable cooling effect can be expected due to the torsional vibration during light emission. Further, by forming a heat dissipation plate, a large current can be passed through the surface emitting light source, and high output light can be obtained.

(Embodiment 4) FIGS. 7A, 7B and 8
Refer to. Here, FIG. 7A is a perspective view of the optical deflecting device according to the fourth embodiment of the present invention, FIG. 7B is an enlarged view of the torsion spring portion X of FIG. 7A, and FIG. 8 is a torsion spring. The exploded view of a part is shown. However, the same members as those in FIG.

From the gallium arsenide substrate 1 as a semiconductor single crystal substrate, the frame body 2, the torsion springs 71 ₁ and 71 ₂ , and the torsion oscillator 4 are formed. Wherein the torsion spring 71 _1, 71 _2, using nickel by electroless plating made from a plating metal formed by plating techniques. Nickel forms a torsion spring, and the frame body 2 and the torsional oscillator 4
Has a key-shaped portion 72 at the connecting portion. A part of the wiring used for the surface emitting laser 5 and the electromagnetic coil 6 is made of plated metal that forms the torsion springs 71 ₁ and 71 ₂ .

The electromagnetic coil 6 and the surface emitting laser 5 have a common ground, and one of the torsion springs made of nickel is used as a contact pad for common wiring. One of the torsion springs made of nickel is an electromagnetic coil 6 and a surface emitting laser 5.
It is used to supply power to. The electromagnetic coil 6 that requires a larger current than the surface emitting laser 5 uses a torsion spring as a wiring, and the wiring 74 ₁ is formed up to the contact pad 73 ₁ . The electrical connection 73 to the torsion spring uses solder because the torsion spring uses nickel. On the other hand, the wiring 74 ₂ to the surface emitting laser 5 is formed on the insulating film 75 formed on the torsion spring and the electromagnetic coil and connected to the contact pad 73 ₂ .

Next, the operation of the optical deflecting device according to the fourth embodiment will be described. By passing a direct current from the contact pads _712, laser light is emitted from the surface emitting laser 5. Further, when the optical deflecting device is in the magnetic field in the direction perpendicular to the torsion axis parallel to the substrate plane, by supplying an alternating current to the contact pads 71 _1, torsional vibrator vibrates with the frequency of the alternating current. The deflection angle of the emitted light and the scanning speed are determined by the vibration amplitude and frequency of the vibrator. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 10. The data is detected as a current value from the contact pads 8 ₄ and 8 ₅ .

Therefore, the optical deflector according to the fourth embodiment has the following effects. In Example 4, nickel, which is a plating metal, was used for the torsion spring. for that reason,
Compared with the case of using a gallium arsenide substrate, the torsional rigidity is lower, it is possible to rotate largely with a small force, and nickel is less likely to break and the possibility of damage due to external impact is lower. Further, the nickel torsion spring can be used as a wiring, and the process can be simplified. Also,
A vertical cavity surface emitting laser was used as the light emitting element. The vertical cavity surface emitting laser does not require an optical element such as a lens because the emitted beam is narrow and sharp. Since the light source is arranged on the axis of the torsion spring, the origin of the light source does not change during light deflection, which simplifies the optical design.

A general semiconductor laser is of an edge emitting type and must be used by being bonded to a substrate. for that reason,
Even if the surface-emitting laser was made small, it was cut out to the size required for handling, and the oscillator was large. However, since the optical deflecting device shown in the fourth embodiment is formed integrally on the gallium arsenide by directly epitaxially growing it, the surface emitting laser can be very small in size and the torsional oscillator can be formed small. it can. Therefore,
By using the plated metal as the torsion spring, it is possible to provide an ultra-compact and highly durable optical deflector having a surface emitting laser, an optical deflector and a light receiving element on the same substrate.

Naturally, various modifications and changes can be made to the respective structures of this modification. For example, a heat dissipation plate processed by etching may be formed on the back surface of the surface of the gallium arsenide substrate forming the torsion oscillator on which the surface emitting laser is formed. The thermal problems of surface emitting lasers prevent continuous oscillation of the light source. However, since the surface emitting laser is formed on the torsional oscillator, a considerable cooling effect can be expected due to the torsional vibration during light emission. Further, by forming a heat dissipation plate, a large current can be passed through the surface emitting laser, and high output light can be obtained.

(Embodiment 5) FIGS. 9A, 9B and 10
Refer to. Here, FIG. 9A is a perspective view of the optical deflecting device according to the fifth embodiment, FIG. 9B is a sectional view taken along line XX of FIG. 9A, and FIG. It is explanatory drawing of the actuator which is one structure of an apparatus.

In Example 5, a silicon substrate 91 is used as the first semiconductor single crystal substrate and a gallium arsenide substrate 92 is used as the second semiconductor single crystal substrate. A static electricity distribution type actuator 93 is formed on the silicon substrate 91, and a diffraction grating 94 integrally formed with the actuator 93 is provided at the center portion.
The silicon substrate 91 immediately below 94 has been removed. The actuator 93 and the diffraction grating 94 are supported by this electrode 95 while leaving the silicon substrate below the electrode 95 of the actuator 93. A pn junction (light receiving element) 96 is formed on the same substrate surface as the surface on which the diffraction grating 94 is formed. Contact pads 97 ₁ and 97 for the p layer and the n layer of the light receiving element 96, respectively
₂ is formed on the substrate 91.

A surface emitting laser 98 is formed on the gallium arsenide substrate 92. In the fifth embodiment, the surface emitting laser 98
A vertical cavity surface emitting laser was used as the device. Further, the gallium arsenide substrate 92 is bonded to the silicon substrate 91 in accordance with the position where the light from the surface emitting laser 98 is incident on the diffraction grating on the silicon substrate 91. Bonding is performed by depositing a low melting point glass on a gallium arsenide substrate and performing anodic bonding between the low melting point glass and the silicon substrate. The electrostatic distribution type actuator 93
Are located on both sides of the diffraction grating 84, and the ground electrodes 99 of these two actuators 93 are used in common. The electrode for voltage application also serves as a supporting portion of the actuator. The wirings 100 ₁ and 100 ₂ of the surface emitting laser 98 are formed on the gallium arsenide substrate. The contact pads 97 ₃ and 97 ₄ are provided at locations other than the joint with the silicon substrate 91. A heat dissipation plate 101 is provided on the back surface of the gallium arsenide substrate 92 corresponding to the lower part of the formation region of the diffraction grating 94 and the actuator 93. Note that reference numeral 102 in FIG. 10 is an insulator provided between the + side member 93a and the − side member 93b.

Next, the operation of the optical deflecting device according to the fifth embodiment will be described. By passing a direct current from the contact pad 97 _3, the laser light is emitted from the surface emitting laser 98. Electrostatic distribution type actuator 93 has a mechanism in which electrodes having opposite waveforms form one actuator and are integrated to generate a large force. By alternately applying a voltage to the two voltage application electrodes, electrostatic attraction is generated in each actuator 93, and contraction occurs.
Along with this, the diffraction grating 94 is swung in the contracting direction of the actuator 93. The diffraction grating 94 is formed perpendicularly to the swing direction, and the grating interval is continuously changed so that the light from the surface emitting laser 98 can be continuously deflected. Therefore, the light is deflected when passing through the swinging diffraction grating 94.
It is scanned in the swing direction of 94. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 96. The data is detected as a current value from the contact pads 87 ₁ and 87 ₂ .

Therefore, the optical deflector according to the fifth embodiment has the following effects. In Example 5, a vertical cavity surface emitting laser was used as the light emitting element. The vertical cavity surface emitting laser has a narrow and sharp emission beam,
No optical elements such as lenses are required. Since a diffraction grating is used for light deflection, the origin of the light source does not change during light deflection, which simplifies optical design.

A general semiconductor laser is of an edge emitting type, and the process yield is reduced when processing the edge.
In addition, since it has to be bonded to a substrate and used, it is difficult to perform the alignment. Therefore, even if the laser light source is made small, it is cut out to a size necessary for handling, and thus the vibrator is large. However, since the optical deflecting device shown in the fifth embodiment is formed integrally by directly epitaxially growing it on the gallium arsenide substrate, the size of the surface emitting laser 98 is very small, and the optical deflecting device itself is miniaturized. can do. As a result, this optical deflecting device can be provided in an extremely small size while having the surface emitting laser 98, the optical deflector and the light receiving element 96 together.

Incidentally, each structure of the fifth embodiment can of course be modified or changed in various ways. For example, a comb-shaped electrostatic actuator may be used instead of the electrostatic distribution type actuator. A kamaboko-shaped lens may be used instead of the diffraction grating.

(Embodiment 6) Referring to FIG. here,
A silicon substrate 111 is used as the first semiconductor single crystal substrate, and a gallium arsenide substrate 112 is used as the second semiconductor single crystal substrate. A diaphragm 113 is provided on the hollow structure portion of the silicon substrate 111. This diaphragm 113 is formed by depositing an aluminum vapor deposition film on a polyimide film, and its end portion is bonded to the silicon substrate 111. Diaphragm 113
A wiring portion and a contact pad for applying a voltage to the aluminum thin film are formed on the silicon substrate 111. Further, a glass spacer 114 is bonded to the same substrate surface as the surface on which the polyimide is formed, and a Si substrate 115 is bonded to the spacer 114. The Si substrate 115 has a low resistance so that it serves as an electrode and has characteristics similar to a conductor.

The diaphragm 113 of the silicon substrate 111
The gallium arsenide substrate 112 is bonded to the surface opposite to the surface on which the surface-emitting laser is formed. 116 is formed, and light from the surface emitting laser 116 is emitted from the diaphragm 113.
A hollow structure portion is formed at a position where it is reflected by and is emitted to the back surface of the gallium arsenide substrate 112. In Example 6, a vertical cavity surface emitting laser was used as the surface emitting laser. Further, the bonding was performed by forming a low melting point glass film on the gallium arsenide substrate 102 and performing anodic bonding between the low melting point glass and the silicon substrate.

A pn junction (light receiving element) 117 is formed on the surface opposite to the junction surface of the gallium arsenide substrate 112. The low resistance Si substrate 115 can take electrodes from anywhere. The wiring of the surface emitting laser 116 is formed on the gallium arsenide substrate 112. The contact pad is provided in a place other than the joint with the silicon substrate. Contact pads for the p layer and the n layer of the light receiving element are also formed on the gallium arsenide substrate. Further, a heat dissipation plate 118 is provided on the back surface of the gallium arsenide substrate 112 corresponding to the lower part of the hollow structure portion of the silicon substrate 111.

Next, the operation of the optical deflecting device according to the sixth embodiment will be described. Laser light is emitted from the surface emitting laser 116 by applying a direct current. The diaphragm 113 is deformed by applying a voltage between the aluminum electrode on the polyimide film and the low-resistance Si substrate 115, and the vapor-deposited aluminum film on the polyimide film also serving as an electrode forms a concave mirror. Light from the surface emitting laser 116 is reflected by the vapor deposition film and emitted from the hollow structure portion formed on the gallium arsenide substrate 112. At this time, the reflection angle of light can be changed by controlling the voltage between the vapor deposition film on the polyimide film and the Si substrate 115, and the light can be scanned by continuously changing the voltage. it can. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 117. The data is detected as a current value from the contact pad.

Therefore, the optical deflector according to the sixth embodiment has the following effects. In Example 6, a vertical cavity surface emitting laser was used as the light emitting element. The vertical cavity surface emitting laser does not require an optical element such as a lens because the emitted beam is narrow and sharp. A general semiconductor laser is an edge emitting type, and when processing the edge, the process yield is lowered. In addition, since it has to be bonded to a substrate and used, it is difficult to perform the alignment. Therefore, even if the laser light source is made small, it is cut out to a size necessary for handling, and thus the vibrator is large. However, since the light deflector shown in the sixth embodiment is formed integrally by directly epitaxially growing it on the gallium arsenide substrate, the size of the light source is very small, and the light deflector itself can be miniaturized. it can. As a result, this optical deflecting device includes the surface emitting laser 116, the optical deflector and the light receiving element 11.
It can be offered in an ultra-compact size while holding 7 together.

Naturally, various modifications and changes can be made to the respective structures of the sixth embodiment. For example, a leaf spring may be used instead of the diaphragm. (Embodiment 7) Referring to FIG. In the seventh embodiment, the first embodiment
Based on the optical deflecting device used in 1., the configuration, action, and effect when the device is integrated are shown below.

A gallium arsenide substrate 121 is used as the substrate. Torsional oscillator 122 ₁ , 1 supported by a torsion spring
22 _2, 122 _3, 122 ₄ are four forms. Each of the oscillators has a surface emitting laser 123 ₁ , 123 ₂ , 123 ₃ , 123 on a line centered on a driving electromagnetic coil and a torsion spring.
₄ are formed. In Example 7, a vertical cavity surface emitting laser was used as the surface emitting laser. The seventh embodiment shows a case where four torsional vibrators are integrated. The electromagnetic coil formed on each oscillator and the surface emitting laser share the ground line 123, and alternating current is applied to the electromagnetic coil and direct current is applied to the surface emitting laser. Ground wiring 123
And the contact pad 124 are shared by the respective oscillators, and the wiring on the power supply side and the contact pad are formed independently. P- on the same surface as the surface emitting laser
An n-junction (light receiving element) 125 is formed.
Contact pads for p-layer and n-layer of light-receiving element 125
126 and 127 are also formed on the gallium arsenide substrate 121.

Next, the operation of the optical deflector according to the seventh embodiment will be described. By passing a direct current from the contact pad 128, laser light is emitted from the surface emitting laser. Further, when the optical deflector is in a magnetic field in a direction parallel to the substrate plane and perpendicular to the torsion axis, by applying an alternating current to the contact pad 129, the torsion oscillator vibrates with the frequency of the alternating current. The deflection angle of the emitted light and the scanning speed are determined by the vibration amplitude and frequency of the vibrator. Laser is emitted from the leftmost torsional oscillator 122 ₁ to this optical deflector, and the torsional oscillator starts to rotate. The torsional oscillator rotates clockwise from the left side. Leftmost torsional vibrator 122
Just before ₁ reaches the deflection end position, the second torsional vibrator 122 ₂ from the left starts to rotate, and the leftmost torsional vibrator emits a laser at the deflection end position, and a short time from the leftmost end. The rotation starts while overlapping with the light. By repeating this operation and transmitting it to the left torsional vibrator, an apparently large deflection angle can be obtained. Here, of the four surface-emitting lasers, only one emits light at all times except for the regions where the lasers overlap. Other surface emitting lasers do not emit light. When this light deflector is used in the reading section of the bar code reader, the emitted light is reflected by the bar code to generate scattered light. The scattered light is received by the light receiving element 125. The data is the current value of the contact pad 126,
Detected from 127.

Therefore, the optical deflecting device according to the seventh embodiment has the following effects. The seventh embodiment can be applied to an application requiring a maximum deflection angle of one light deflector or more. Further, since the surface emitting laser repeatedly emits and stops the light, it is possible to give time to release the heat generated in the surface emitting laser, so that a high power type surface emitting laser can be formed. In this example, a vertical cavity surface emitting laser was used as the light emitting element. The vertical cavity surface emitting laser does not require an optical element such as a lens because the emitted beam is narrow and sharp. Since the light source is arranged on the axis of the torsion spring, the origin of the light source does not change during light deflection, which simplifies the optical design.

Further, a general semiconductor laser is of an edge emitting type and must be used by being bonded to a substrate. Therefore, even if the surface-emitting laser is made small, it is cut out to a size necessary for handling, and thus the oscillator is large. However, since the optical deflecting device shown in the seventh embodiment is formed integrally by directly epitaxially growing it on the gallium arsenide substrate, the size of the surface emitting laser is very small and the torsional oscillator is also small. You can Also, since the torsion spring and the frame body are also formed on the same substrate,
This optical deflector can be provided in a very small size while having a light source, an optical deflector having a large deflection angle, and a light receiving element.

The various structures of the seventh embodiment can of course be modified and changed in various ways. For example, two permanent magnets may be arranged instead of the electromagnetic coil. At this time, the two permanent magnets must be arranged so that their polar directions are opposite to each other. Further, a heat dissipation plate processed by etching may be formed on the back surface of the surface of the gallium arsenide substrate forming the torsional vibrator on which the surface emitting light source is formed. The heat problem of the surface emitting light source prevents continuous oscillation of the light source. However, since the surface-emitting light source is formed on the torsional oscillator, a considerable cooling effect can be expected due to torsional vibration during light emission. Further, by forming a heat dissipation plate, a large current can be passed through the surface emitting light source, and high output light can be obtained.

The above description is based on the embodiment,
The present invention includes the following inventions. 1. An optical deflecting device having a frame body formed from the same semiconductor single crystal substrate, a torsion oscillator arranged in the frame body, and a torsion spring arranged at both ends of the frame body to support the torsion oscillator. In, a drive source formed on the torsional oscillator, for generating a torsional vibration in the torsional oscillator, and a surface emitting laser formed on the torsional oscillator located on a line about the torsion spring, An optical deflector comprising a light receiving element for detecting light from the surface emitting laser, wherein the drive source, the surface emitting laser and the light receiving element are monolithically formed on the semiconductor single crystal substrate. .

(Structure) This corresponds to the first embodiment. The frame portion means that the semiconductor single crystal substrate has one or more hollow portions. The inside of the frame portion indicates the end portion forming the hollow portion, and "disposed at both ends" indicates that there are two torsion springs, and each of them is connected to the end portion of the hollow portion. is there. For example, an amplifier circuit may be formed together with the light receiving element.

(Operation / Effect) The light receiving portion, the light emitting portion, and the light deflecting portion can be integrally formed on the semiconductor single crystal substrate,
The control circuit can be integrally formed on the same substrate, and the optical axis adjustment is automatically determined at the time of manufacturing, and since the surface emitting laser is formed on the oscillator, the oscillator vibrates during light emission. The surface emitting laser can also be cooled. The oscillator supported by the two torsion springs is strong against external force and does not change modes, so stable operation is possible. As a result, it is possible to provide a highly precise optical deflector with an ultra-compact and easy configuration.

2. 1. In the optical deflector, the driving source for torsional vibration is an electromagnetic coil formed around the outer periphery of the oscillator which is driven in a magnetic field in a direction parallel to the substrate plane and perpendicular to the torsion axis. Optical deflector.

(Structure) This corresponds to the first embodiment. (Operation / effect) By forming an electromagnetic coil near the outer circumference of the torsional oscillator and applying an alternating current to the coil, a magnetic field is generated in the direction parallel to the torsional oscillator and perpendicular to the torsion axis, and the semiconductor single crystal substrate In a magnetic field parallel to and perpendicular to the torsion axis, the torsion oscillator can rotate by the repulsive force and attractive force of the magnetic fields. In addition, the electromagnetic coil can be integrally formed, is extremely small, and can provide a highly accurate optical deflector with an easy configuration.

3. 2. 2. The optical deflector according to claim 1, wherein the substrate on which a permanent magnet is fixedly mounted and the semiconductor single crystal substrate are hybridly formed. (Structure) Corresponding to the second embodiment. The term “hybridized” means that two or more substrates are joined and bonded together by an adhesion technique.

(Operation / Effect) The permanent magnet is placed at a position where an attractive force and a repulsive force are generated between the magnetic field generated in the direction parallel to the torsional vibrator and perpendicular to the torsional axis by passing an alternating current through the electromagnetic coil. By bonding the semiconductor single crystal substrate and the substrate on which the permanent magnets are fixed so as to be arranged, it is possible to provide a highly precise optical deflector with an ultra-compact and easy configuration.

4. 1. In the optical deflector, the semiconductor single crystal substrate having the vibrator, on the back surface of which the two electrodes divided into two with the torsion spring as an axis are formed;
An optical deflecting device, characterized in that a substrate having two electrodes formed thereon is hybridized at a position where the electrode of the vibrator and the electrode of the substrate face each other.

(Structure) This corresponds to the third embodiment. (Operation / Effect) Two opposing electrodes form a capacitor, and when a voltage is applied to one of them, an electrostatic attractive force is generated and the torsion spring rotates to the electrode to which the voltage is applied. By repeating this alternately, vibration can be given to the vibrator. Since this configuration is easy to form, it is possible to provide a light deflection device that is smaller than the method using electromagnetic force.

5. 1. 2. The optical deflector according to claim 1, wherein the semiconductor single crystal substrate is a compound semiconductor single crystal substrate. (Structure) This corresponds to the first, second, and third embodiments.

(Function / Effect) As the surface emitting laser, it is general to use a surface emitting laser epitaxially grown on a gallium arsenide substrate. Further, it is also possible to form a light receiving element using a pn junction on a gallium arsenide substrate,
It goes without saying that the substrate can be processed.

6. 5. 2. The optical deflector according to claim 2, wherein the torsion spring is formed of plated metal, and the plated metal has a key shape at a connecting portion between the frame body portion and the vibrator.

(Structure) This corresponds to the first, second, third, and fourth embodiments. The plated metal means a metal material formed by electroplating or electroless plating. (Operation / Effect) For the torsion spring, a material having low torsional rigidity and high toughness is desired. However, since the semiconductor single crystal substrate has high rigidity and is a brittle material, it is not suitable for a torsion spring. If the torsion spring is made of metal, the rigidity is low and brittle fracture is unlikely to occur. Therefore, the vibrator can be rotated with a small driving force, and damage due to an external force is unlikely to occur. In addition, the torsion spring can be made hard to come off by forming the connecting portion with the semiconductor substrate into a hook shape.

7. Light emitted from the surface emitting laser includes a light deflector, a light receiving element, a first semiconductor single crystal substrate having a light emitting window below the light deflector, and a second semiconductor single crystal substrate having a surface emitting laser. In a light deflecting device formed as a hybrid so that the light deflector is arranged on the optical path of the optical deflector, the light deflector and the light receiving element are integrally formed on a first semiconductor single crystal substrate, and the light deflector is Is composed of a linear drive source provided on the first semiconductor single crystal substrate, and a diffraction grating formed integrally with the drive source and having a grating spacing continuously changing in the moving direction of the drive source. An optical deflection device characterized by the above.

(Structure) This corresponds to the first, second, and third embodiments.
The light emission window means a hollow portion in the substrate, a slit portion, or a portion formed of a material capable of transmitting emitted light. "Formed into a hybrid" means
This means that two or more substrates are joined and bonded together by an adhesive technique. The linear drive source means a comb drive source or an electrostatic distribution drive source.

(Operation / Effect) When the diffraction grating moves linearly by the linear type driving source, the diffraction grating continuously changes the grating interval with respect to the moving direction. Therefore, from the light source fixed to another substrate, The angle of deflection of the light of when the light passes through the diffraction grating also changes continuously. At this time, the diffraction grating determines the grating interval so that the emitted light can be continuously deflected by the given linear movement.

Although the two substrates are formed as a hybrid, since the surface emitting laser, the light deflector and the light receiving element are integrally formed, it is possible to provide an ultra-small light deflecting device. By forming the light receiving portion and the light deflecting portion on the same substrate and the light emitting portion on another substrate, the manufacturing risk can be dispersed, and the light deflecting device can be simply and safely manufactured.

8. A first semiconductor single crystal substrate having a light deflector and a light emitting window below the light deflector, and a second semiconductor single crystal substrate having a surface emitting laser, a light receiving element, and a hollow structure portion are provided from the surface emitting laser. In a light deflecting device formed in a hybrid so as to arrange the light deflector on an optical path of emitted light, a light receiving element is formed on a back surface of a surface of the second semiconductor single crystal substrate having the light source, The deflector is formed on a hollow structure portion in the first semiconductor substrate, and has a diaphragm having at least one layer having a reflecting surface for reflecting light from the surface emitting laser and made of a conductive material, and a first semiconductor unit. Optical deflection characterized in that a spacer formed on a crystal substrate and having a hollow structure on the diaphragm and an electrode formed at a position corresponding to the hollow structure of the spacer are formed in a hybrid manner. Location.

(Structure) This corresponds to the first, second, and third embodiments.
The light emission window means a hollow portion in the substrate, a slit portion, or a portion formed of a material capable of transmitting emitted light. The term “hybridized” means that two or more substrates are joined and bonded together by an adhesive technique.

(Operation / Effect) An electrostatic attractive force is generated by applying a voltage to two opposing electrodes. This force deforms the diaphragm having the reflecting surface. The amount of deformation is determined by the applied voltage, and the light can be continuously deflected by continuously changing the voltage. In this configuration, the surface emitting laser does not appear on the surface,
The structure is strong against external damage.

Although the two substrates are formed as a hybrid, since the surface emitting laser, the light deflector and the light receiving element are integrally formed, it is possible to provide a microminiature light deflecting device, and By forming the light receiving portion and the light deflecting portion on the same substrate and the light emitting portion on another substrate, the manufacturing risk can be dispersed, and the light deflecting device can be simply and safely manufactured.

9. 7. 2. The optical deflector according to claim 1, wherein the diaphragm comprises a polyimide film and a metal thin film. (Structure) This corresponds to the first, second, and third embodiments.

(Operation / Effect) A diaphragm made of a material having low rigidity such as polyimide can reduce electrostatic attraction force and voltage value required for deformation. Further, since polyimide has excellent chemical resistance, it has great manufacturing advantages.
However, since polyimide is insulative and the adhesion between polyimide and metal is good, a metal is formed on the surface and this is used as an electrode.

By using a multilayer film of a polyimide film and a metal thin film for the diaphragm, a large deflection angle can be obtained with a small voltage, and a power-saving optical deflecting device can be provided.

10. 1. And 7. And the above 8. The optical deflector according to claim 1, wherein a heat dissipation plate is formed on a substrate below the light source of the semiconductor single crystal substrate on which the surface-emitting light source is formed.

(Structure) This corresponds to the first, second, and third embodiments. (Operation / Effect) The heat dissipation plate radiates heat generated by the surface emitting laser on the substrate below the surface emitting laser of the semiconductor single crystal substrate,
Used for cooling the surface emitting laser. The surface emitting laser may not be able to continuously oscillate due to heat generated by itself. This problem can be solved by forming a heat dissipation plate directly below the light source, and an optical deflecting device that can constantly and continuously oscillate a surface emitting laser is provided.

11. 1. And 7. And the above 8. In the optical deflecting device according to the description, a plurality of the surface-emitting light sources are formed in a line, each of the optical deflectors has a different deflection start position, and adjacent light deflectors have the deflection end position and the deflection start position overlapping with each other. An optical deflector having a large deflection angle as a whole.

(Structure) This corresponds to the first, second, and third embodiments.
This presupposes that the light deflection device is used in a bar code scanner. (Operation / Effect) A light deflector having a light source is much smaller than a bar code. Therefore, a plurality of barcodes are arranged in a direction perpendicular to the longitudinal direction. At this time, the adjacent light deflectors are arranged so that the deflection end position and the deflection start position slightly overlap each other. The light is deflected by the light deflector to the vicinity of the deflection end position, and at the same time, the adjacent light deflector irradiates the light to the deflection start position and starts the deflection. This is performed continuously by a plurality of light deflectors cooperating with each other.

With this configuration, it is possible to obtain a large deflection angle even if an optical deflector that cannot set a large deflection angle is used. Further, since the light is deflected once by using a plurality of surface emitting lasers, each surface emitting laser emits light in a pulsed manner, which greatly contributes to the cooling of the surface emitting lasers. Therefore, it is possible to provide a stable light deflecting device for a surface emitting laser that can obtain a large deflection angle.

[0098]

As described in detail above, according to the present invention, the optical design is simpler than the conventional one, and the light emitting element and the light receiving element are formed on the same substrate, so that a small light emitting element can be optically used. It is possible to provide an optical deflecting device that can perform positioning with high accuracy, improve workability, and realize downsizing.

[Brief description of drawings]

1A and 1B are explanatory views of an optical deflecting device according to a first embodiment of the present invention, FIG. 1A is a perspective view, and FIG. 1B is FIG. 1A.
The perspective view seen from the back.

FIG. 2 is an explanatory diagram of an optical deflecting device according to a second embodiment of the invention.

3A is a perspective view of a first substrate which is one configuration of an optical deflecting device according to a second embodiment of the invention, and FIG. 3B is FIG.
FIG. 3C is a perspective view of the first substrate of FIG. 3A seen from the back side, FIG. 3C is a perspective view of the second substrate which is one configuration of the optical deflector seen from the back side, and FIG. 3 is a perspective view of the second substrate viewed from the front side.

FIG. 4 is a perspective view showing a modified example of the second substrate of the optical deflecting device according to the second embodiment.

FIG. 5 is an explanatory diagram of an optical deflecting device according to a third embodiment of the invention.

FIG. 6 is an explanatory diagram of an optical deflecting device according to a third embodiment of the invention, and FIG. 6A shows one configuration of the optical deflecting device.
6B is a perspective view of the first substrate of FIG. 6A viewed from the back side, and FIG. 6C is a back view of the second substrate which is one configuration of the optical deflector. FIG. 6 is a perspective view and FIG.
The perspective view which looked at the 2nd board of (C) from the surface side.

7A and 7B are explanatory views of an optical deflecting device according to a fourth embodiment of the invention, FIG. 7A is a perspective view, and FIG. 7B is FIG. 7A.
FIG. 3 is an enlarged view of a torsion spring portion which is a configuration of the optical deflector of FIG.

FIG. 8 is an exploded view of the torsion spring portion of FIG. 7 (B).

9A and 9B are explanatory views of an optical deflecting device according to a fifth embodiment of the invention. FIG. 9A is a perspective view and FIG. 9B is FIG. 9A.
Sectional view taken along line XX of FIG.

FIG. 10 is an explanatory diagram of an actuator which is one configuration of the optical deflector of FIG.

FIG. 11 is a perspective view of an optical deflecting device according to a sixth embodiment of the invention.

FIG. 12 is a perspective view of an optical deflecting device according to a seventh embodiment of the invention.

FIG. 13 is a perspective view of a conventional light deflector.

[Explanation of symbols]

1, 92, 112, 121 ... Gallium arsenide substrate, 2 ... Frame part,
3 ₁ , 3 ₂ , 71 ₁ , 71 ₂ ... Torsion spring, 4, 122 ₁ ~ 1
24 ₄ … Torsional vibrator, 5, 98, 116, 123 ₁ to 124 ₄ …
Surface emitting laser, 6 ... electromagnetic coil, 7 ₁ , 7 ₂ , 74 ₁ , 74
₂ ... Wiring, 8 ₁ , 8 ₂ , 71 ₁ , 71 ₂ ... Contact pad, 9, 101, 118 ... Heat sink, 10, 96 ... Light receiving element, 2
1,51 ... First substrate, 22,52 ... Processed surface, 23,24
… Permanent magnets, 25, 57… Second substrate, 53 ₁ , 53
₂ , 58 ₁ , 58 ₂ , 95 ... Electrode, 54 ₁ , 54 ₂ , 56 ₁ , 56 ₂ , 56 ₂ ,
57 ₁ , 57 ₂ , 97 ₁ , 97 ₂ , 123, 124, 128, 129 ... Contact pad, 55 ₁ , 55 ₂ , 59 ₁ , 59 ₂ , 90 ₁ , 90 ₂
… Wiring, 72… Key-shaped part, 73… Connection part, 9
1, 111, 115 ... Silicon substrate, 93 ... Electrostatic distribution type actuator, 94 ... Diffraction grating, 99 ... Ground electrode, 113 ... Diaphragm, 114 ... Spacer.

Claims (3)

[Claims] 1. Formed from the same semiconductor single crystal substrate,
An optical deflection device having a frame body portion, a torsional oscillator disposed in the frame body portion, and a torsion spring disposed at both ends of the frame body portion to support the torsional oscillator, wherein the optical deflection device is formed on the torsional oscillator. Further, a drive source for generating a torsional vibration in the torsional oscillator, a surface emitting laser formed on the torsional oscillator located on a line about the torsion spring, and light from the surface emitting laser are detected. And a light receiving element for the light source, wherein the drive source, the surface emitting laser, and the light receiving element are monolithically formed on the semiconductor single crystal substrate. 2. A surface emitting laser comprising a first semiconductor single crystal substrate having a light deflector, a light receiving element, a light emitting window below the light deflector, and a second semiconductor single crystal substrate having a surface emitting laser. In a light deflecting device formed in a hybrid so as to arrange the light deflector on the optical path of the light emitted from the optical deflector and the light receiving element, the light deflector and the light receiving element are integrally formed on a first semiconductor single crystal substrate. The deflector has a linear drive source, one end of which is provided on the first semiconductor single crystal substrate, and a diffraction grating which is formed integrally with the drive source and in which the grating spacing continuously changes in the moving direction of the drive source. An optical deflecting device comprising: 3. A light deflector, a first semiconductor single crystal substrate having a light emitting window below the light deflector, and a second semiconductor single crystal substrate having a surface emitting laser, a light receiving element, and a hollow structure portion,
In a light deflecting device formed in a hybrid so that the light deflector is arranged on an optical path of light emitted from the surface emitting laser, a light receiving element is provided on a back surface of a surface of the second semiconductor single crystal substrate having the light source. A diaphragm having at least one layer formed of a conductive material, the light deflector being formed on a hollow structure portion in the first semiconductor substrate, and having a reflecting surface for reflecting light from the surface emitting laser; And a spacer formed on the first semiconductor single crystal substrate and having a hollow structure on the diaphragm, and an electrode formed at a position corresponding to the hollow structure of the spacer are formed in a hybrid manner. Light deflection device.