JPH098102A - Pellet take out device - Google Patents

Abstract

PURPOSE: To make it possible to reliably remove a large diameter pellet adhering to an adhesive sheet by a method wherein the second thrust-up member, with which the pellet located adjacent to the pellet expected to be taken out, is arranged in the vicinity of the first thrust-up member which thrusts up the pellet expected to be taken out. CONSTITUTION: An adhesive sheet 6, on which pellets 3 are formed by cutting a wafer into the prescribed shape and size are bonded in an aligned state, can be moved horizontally. Especially, the second thrust-up member 11, with which the pellet 3a adjacent to the pellet 3 which is expected to be taken out is selectively thrusted up, is arranged in the vicinity of the first thrust-up member 9 with which the pellet 3 to be taken out is thrusted up. Accordingly, the pellet 3a to be taken out after the pellet 3, which is expected to be taken out, can be removed in the state wherein the tip part only of the pellet 3a, to be taken out after the pellet 3, is bonded. As a result, the pellet 3 can be taken out accurately, and a pellet of large diameter adhering to the adhesive sheet can be removed accurately.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for taking out pellets stuck on an adhesive sheet while keeping them aligned.

[0002]

2. Description of the Related Art An example of an electronic component such as a resin mold type semiconductor device will be described with reference to FIG. In the figure, 1 is a heat dissipation plate having a mounting hole 1a at one end, 2 is a set of three leads in the illustrated example, one lead 2a is connected to the other end of the heat dissipation plate 1, and the other is The leads 2b and 2c are arranged in parallel on both sides of the lead 2a, and one ends thereof are arranged near the heat sink 1. 3 is a semiconductor pellet mounted on the heat sink 1,
Reference numerals 4 and 4 denote wires for electrically connecting electrodes (not shown) on the semiconductor pellet 3 to the respective lead free ends, and reference numeral 5 denotes a resin coating a main portion including the semiconductor pellet 3. In this semiconductor device, generally, a wafer on which a large number of semiconductor elements having the same pattern are formed is attached to an adhesive sheet, and the semiconductor pellets individually divided by cutting the wafer from adjacent portions of the semiconductor elements are attached to the adhesive sheet. They are taken out one by one and mounted on the heat sink 1 to be manufactured. Here, an example of a device for taking out the semiconductor pellets attached to the adhesive sheet in an aligned state will be described with reference to FIG.

In the figure, 6 is a pressure-sensitive adhesive sheet in which a large number of semiconductor pellets 3 are adhered in an aligned state at predetermined intervals, 7 is a support ring for supporting the pressure-sensitive adhesive sheet 6 while maintaining flatness, and 8 is a support ring 7. An XY table for holding a part of each of them and moving the semiconductor pellets 3 attached to the support ring 8 in a horizontal direction at a predetermined pitch, and 9 is arranged at a fixed position below the moving region of the support ring 7 moved by the XY table 8. Then, the push-up member 10 that is moved up and down to push up the adhesive sheet 6 and push up the semiconductor pellet 3 at a predetermined position is a suction collet that is arranged above the push-up member 9 and has a suction port opened on the lower surface. The semiconductor pellet 3 pushed up by is sucked, vertically moved and horizontally moved, and is taken out and supplied onto a heat dissipation plate (not shown). This device moves the semiconductor pellets 3 adhered to the pressure-sensitive adhesive sheet 6 by the XY table 8 in one direction along the arrangement direction, and when it reaches the end, moves it by one pitch in the orthogonal direction and moves it in the opposite direction. By sequentially repeating the operation, the semiconductor pellets 3 on the adhesive sheet 6 are sequentially positioned at the take-out position above the push-up member 9.

When the semiconductor pellets 3 are formed by cutting a circular semiconductor wafer adhered to the adhesive sheet 6, the semiconductor pellets on the peripheral portion are indefinite and defective as an element. Since there are some electrically defective products, the XY table 8 is driven so that only the non-defective products are selected and moved. When the semiconductor pellet 3 comes to the take-out position in this way, the XY table 8 is stopped,
The push-up member 9 is raised to push up the semiconductor pellet 3 via the adhesive sheet 6. Thereby, the adhesive sheet 6
Is deformed into a conical shape, the sheet 6 adhered to the back surface of the semiconductor pellet 3 is peeled off from the peripheral edge of the pellet 3, and the semiconductor pellet 3 sucked and held by the suction collet 10 is easily peeled off from the adhesive sheet 6 and taken out.

By the way, even if the adhesive force of the adhesive sheet 6 is constant, the force required for peeling varies depending on the size of the semiconductor pellet 3, and a larger diameter pellet requires a larger force than a smaller diameter pellet. Therefore, the pressure-sensitive adhesive sheet 6 having the optimum adhesive strength may be prepared according to the size of the pellet 3, but the management becomes complicated when the number of types of the pressure-sensitive adhesive sheet 6 increases. In addition, the amount used depends on the size of the semiconductor pellet 3,
Since there is a problem that the adhesive strength of the less frequently used ones decreases when stored for a long period of time, one adhesive sheet 6 is used for several pellets having different sizes. Further, when the adhesive force of the adhesive sheet 6 is strong and the semiconductor pellets 3 cannot be peeled off at once, a predetermined number of times, for example, three times,
The peeling work is repeated, and when the peeling is still impossible, the next semiconductor pellet is taken out.

[0006]

As described above, since the pressure-sensitive adhesive sheet 6 is adapted to the semiconductor pellets having several different sizes, a large-diameter semiconductor pellet requires a large peeling force, but the push-up member 9 has a large peeling force. Since the push-up height is determined, the peeling force applied to the semiconductor pellets cannot be increased, and if the semiconductor pellets that could not be peeled at once were peeled multiple times, the pellet pick-up device There is a problem in that the other connected manufacturing apparatuses are stagnant and work is delayed. Especially semiconductor pellet 3
In the case where the semiconductor pellets 3 are soldered and fixed to the heat sink 1, if the supply of the semiconductor pellets 3 is delayed, the molten solder supplied on the heat sink 1 is exposed to the outside air for a long time, and an oxide film is formed on the solder surface. However, there is a problem that the connection of the semiconductor pellet becomes uncertain and the reliability is lowered.

Further, if the adhesive force of the adhesive sheet 6 is set to be optimum for the largest of the semiconductor pellets having different sizes, the pellet having a small diameter can be easily peeled off even with a slight force. In particular, when the semiconductor pellet to be taken out is peeled off, if the adhesive sheet is deformed to the adjacent semiconductor pellet portion, the semiconductor pellet may peel off or may be displaced without peeling off. If the amount of misalignment with respect to the suction collet 10 is large, not only cannot it be taken out, but also the suction collet 10 presses an undesired portion of the semiconductor pellet, and the semiconductor pellet is chipped, and the fragment becomes a foreign matter. It is necessary to attach even the semiconductor pellets of the above to a pressure-sensitive adhesive sheet that has sufficient adhesive strength. It was not how is to remain to some extent above. In this way, the semiconductor pellets 3 remaining on the adhesive sheet 6 are taken out one by one with tweezers or the like,
The pellets can be taken out by rearranging them on the adhesive sheet 6 in an aligned state, but there is a problem that the operation is complicated and takes time.

[0008]

The present invention has been proposed in order to solve the above-mentioned problems, and a wafer having a predetermined shape,
An XY table that moves the adhesive sheet that is stuck by keeping the aligned state of the pellets that are formed by cutting into the size, and a protrusion that pushes up the pellets on the adhesive sheet that are positioned at predetermined positions from the lower surface of the adhesive sheet. In a pellet pick-up device having a pick-up member and a suction collet which is arranged above the push-up member and which picks up the pellet pushed up by the push-up member and which moves vertically and horizontally, a first protrusion for pushing up the pellet to be taken out. Provided is a pellet take-out device characterized in that a second push-up member for selectively pushing up a pellet adjacent to a take-out target pellet is arranged in the vicinity of the take-up member. The second
The push-up member is the first that pushes up the pellet to be taken out.
It is possible to move up and down when lowering the push-up member. Further, a plurality of second push-up members are arranged around the first push-up member and selectively operate according to the state of the pellet to be taken out next. Further, the second push-up member horizontally moves a minute distance with the adhesive sheet pushed up.

[0009]

[Function] When the back surface of the semiconductor pellet attached to the adhesive sheet is pushed out from below the adhesive sheet and taken out,
Since the semiconductor pellet adjacent to this semiconductor pellet is selectively pushed up by the second push-up pin, even a large-diameter semiconductor pellet attached to an adhesive sheet giving sufficient adhesive force to a small-diameter pellet Can be reliably peeled off.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG. In the figure, the same symbols as those in FIG. 8 indicate the same things, and duplicate explanations are omitted. The feature of the present invention resides in the second push-up member denoted by reference numeral 11. That is, the second thrust member 11
Is arranged in the vicinity of a conventional push-up member (first push-up member) 9 arranged so as to face the suction collet 10, and selectively pushes up a pellet to be taken out next to a pellet to be taken out. To work. The operation of this device will be described below. First, as shown in FIG. 1, the first push-up member 9 is operated in the same manner as in the conventional device described in FIG. 8, and the suction collet 10 is waiting above the semiconductor pellet to be taken out at a predetermined position. It is pushed up toward and picked up by the suction collet 10. As shown in FIG. 2, within a period from the start of the upward movement of the first push-up member 9 until the upper end of the push-up member 9 comes into contact with the back surface of the adhesive sheet 6 and pushes up and lowers the semiconductor pellet 3, as shown in FIG. Raise 11.

At this time, the entire surface of the back surface of the semiconductor pellet 3a located near the semiconductor pellet to be taken out is fixed to the adhesive sheet 6 in an inclined state. In this way, when the first push-up member 9 is lowered while the second push-up member 11 is raised, the pressure-sensitive adhesive sheet 6 is reached at an intermediate point.
Is the first and second push-up members 9, 11 as shown in FIG.
The adhesive sheet 6 is peeled off from the peripheral portion of the back surface of the semiconductor pellet 3a by deforming into a saddle shape with a horizontal gap, and the horizontal portion of this saddle-like convex portion is aligned with the upper end of the second push-up member 11 as shown in FIG. The semiconductor pellet 3a adheres to the illustrated area A on one side from the central portion of the back surface of the semiconductor pellet 3a, and complete peeling or displacement of the semiconductor pellet 3a is prevented. When the first push-up member 9 descends from the state shown in FIG. 3, the adhesive region A on the back surface of the semiconductor pellet 3a shown in FIG. 4 peels off from the outer periphery thereof, and the central portion faces the second push-up member 11. Only the adhesive sheet 6 holds the sheet.

At this time, since the peeling of the area A requires only a small force, the semiconductor pellet 3a is not completely peeled from the adhesive sheet 6. Since the second push-up member 11 can be lowered from the time when the first push-up member 9 is separated from the adhesive sheet 6, the working time is the same as the conventional one. In this way, the semiconductor pellet 3a to be taken out next is in a state of being easily peeled off in advance, so that it can be surely peeled off even if an adhesive sheet having a large adhesive force is used. Therefore, the pressure-sensitive adhesive sheet can be selected according to the small-diameter semiconductor pellet that is easily peeled off, and one pressure-sensitive adhesive sheet can be used for a plurality of semiconductor pellets having different diameters. Further, since the semiconductor pellets can be reliably taken out by one take-out operation, it is not necessary to repeat the take-out operation for the same pellet a plurality of times, and the manufacturing can be smoothly performed. Furthermore, since the semiconductor pellets to be taken out are not displaced, the semiconductor pellets are not damaged by the suction collet, and defects due to pellet fragments can be prevented.

FIG. 5 shows a more specific embodiment of the present invention. In the figure, the same symbols as those in FIG. 1 indicate the same things, and detailed explanations are omitted. In the figure, reference numeral 12 denotes a cylindrical bearing which is fixed to a base 13 with the shaft oriented in the up-down direction and through which the first push-up member 9 is inserted, and 14 is supported by the base 13 through which the bearing 12 is inserted, and around the shaft of the bearing 12. In the rotatable table, concave portions 14a and 14b are formed at equiangular positions on a concentric circle centered on the bearing 12 on the lower surface. Also, one recess 14a
Has a through hole 14c that extends parallel to the bearing 12 and opens at the upper surface.
Are in communication. Further, a gear 14d is formed on the outer circumference of the rotary table 14, and a small gear 16 of a motor 15 supported by the base 13 is screwed into the gear 14d so that the motor 15 controls the rotation. 17 is inserted into one concave portion 14a formed on the lower surface of the rotary table 14 while being prevented from falling.
The lower end of the second push-up member 11 is a movable piece that moves up and down inside and is fixed by means such as magnetic attraction.

The second thrust member 11 is eccentric with respect to the movable piece 17 in the illustrated example. Reference numeral 18 denotes a movable table which vertically moves through the bearing 12 below the base 13. The pin 19 is provided at the equiangular position on the concentric circle corresponding to the concave portions 14a and 14b of the rotary table 14, and is drilled in the base 13. Through the through-hole 13a, the recesses 14a and 14b are projected and retracted. Although not shown, the first push-up member 9 and the movable table 18 are moved up and down by a vertical drive mechanism such as a cam mechanism and a cylinder mechanism, and the movable table 18 is moved up and down, so that the pin 19 and the movable piece in the rotary table 14 are moved. The second push-up member 11 moves up and down via 17. The operation of this device will be described below. First, the semiconductor pellet 3 is positioned on the first push-up member 9 by an XY table (not shown). During this operation, the rotary table 14 is driven by the motor 15 so that the second push-up member 11 can take out the semiconductor pellet 3 next to the semiconductor pellet 3 to be taken out.
Position on a. Next, as shown in FIG. 6, the first push-up member 9 is raised to take out the semiconductor pellet 3 to be taken out.
And then the second push-up member 11 is raised following the start of the rise of the first push-up member 9.

The timing of raising the second pushing-up member 11 is the second timing when the semiconductor pellets 3 are sucked by the suction collet 10 by the first pushing-up member 9 and the first pushing-up member 9 starts descending. Push-up member 11
Is set to reach top dead center. Therefore, while the first push-up member 9 is descending, the first and second push-up members 9 and 11 are at the same height position, and the adhesive sheet 6 is deformed into a saddle shape, and the adhesive sheet 6 is radially ( The semiconductor pellet 3a is peeled off from the peripheral corners to the center while leaving the adhesive portion in the region A) of FIG. When the first push-up member 9 further descends, the area A in FIG.
The adhesive sheet 6 is peeled from the back surface of the semiconductor pellet 3a from the outer periphery to the center, and the back surface of the semiconductor pellet 3a is formed only by the end face portion of the second push-up member 11.
Is held.

After this, the second push-up member 11 descends following the first push-up member 9. When the taking-out of one semiconductor pellet is completed in this way, the XY table is operated to operate the semiconductor pellet 3a to be taken out next.
Is located above the first push-up member 9. At this time, when the semiconductor pellet is at the end in the X direction as shown in FIG. 7, the motor 15 is operated to turn the rotary table 1 on.
4 is rotated 90 degrees clockwise, and the second push-up member 1
1 is positioned below the semiconductor pellet 3a to be taken out next to the semiconductor pellet 3a to be taken out.
Hereinafter, the above operation can be repeated to sequentially take out the semiconductor pellets. In this device, since the second push-up member 11 is rotatable about the first push-up member 9, the second push-up member 11 is located at the semiconductor pellet position in front of the moving direction of the adhesive sheet 6 by the XY table. be able to. The present invention is not limited to the above-described embodiment, and for example, as shown in FIG.
The second push-up members 11 are arranged at 4b positions,
Each second push-up member 11 can be independently controlled to move up and down, it is not necessary to rotate the table 14, and the motor 15 can be omitted. Thereby, even when defective pellets continue, the second push-up member 11 can be controlled so that the semiconductor pellets to be taken out can be peeled from the adhesive sheet in advance. Semiconductor pellets that have been determined to be defective in advance and do not need to be taken out can be passed through the push-up members 9 and 11, and can be left on the adhesive sheet with a strong adhesive force.

[0017]

As described above, according to the present invention, the semiconductor pellet to be taken out next to the semiconductor pellet to be taken out is peeled off from the adhesive sheet by the second push-up member 11 in a state in which only the tip portion thereof is bonded. Therefore, the semiconductor pellets can be reliably taken out by the first push-up member 9, and the semiconductor pellets can be surely held until they are taken out by using an adhesive sheet having a sufficiently large adhesive force.
Since it is easy to take out the semiconductor pellets, the adhesive strength of the adhesive sheet can be adjusted to the semiconductor pellets with a small diameter to prevent undesired peeling, and even a semiconductor pellet with a large diameter can be taken out surely in a single take-out operation. , Work can be done smoothly.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a main part of a pellet extracting device according to the present invention.

FIG. 2 is a side sectional view for explaining the operation of the apparatus shown in FIG.

FIG. 3 is a side sectional view for explaining the operation of the apparatus shown in FIG.

FIG. 4 is a rear view of the semiconductor pellet showing an adhesive state of the adhesive sheet by the second pushing member of the apparatus shown in FIG.

FIG. 5 is a side sectional view showing a modified example of the apparatus shown in FIG.

FIG. 6 is a side sectional view for explaining the operation of the apparatus shown in FIG.

FIG. 7 is a layout view of semiconductor pellets on a pressure-sensitive adhesive sheet for explaining the operation of the apparatus shown in FIG.

FIG. 8 is a partial cross-sectional perspective view showing an example of an electronic component.

FIG. 9 is a side sectional view showing an example of a semiconductor pellet take-out device.

[Explanation of symbols]

 3 Electronic Component Main Body (Semiconductor Pellet) 3a Electronic Component Main Body (Semiconductor Pellet) 6 Adhesive Sheet 9 First Pushup Member 10 Adsorption Collet 11 Second Pushup Member

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] November 30, 1995

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of drawings]

FIG. 1 is a side sectional view showing a main part of a pellet extracting device according to the present invention.

FIG. 2 is a side sectional view for explaining the operation of the apparatus shown in FIG.

FIG. 3 is a side sectional view for explaining the operation of the apparatus shown in FIG.

FIG. 4 is a rear view of the semiconductor pellet showing an adhesive state of the adhesive sheet by the second pushing member of the apparatus shown in FIG.

FIG. 5 is a side sectional view showing a modified example of the apparatus shown in FIG.

FIG. 6 is a layout view of semiconductor pellets on a pressure-sensitive adhesive sheet for explaining the operation of the apparatus shown in FIG.

FIG. 7 is a partial sectional perspective view showing an example of an electronic component.

FIG. 8 is a side sectional view showing an example of a semiconductor pellet take-out device.

[Explanation of reference numerals] 3 electronic component main body (semiconductor pellet) 3a electronic component main body (semiconductor pellet) 6 adhesive sheet 9 first push-up member 10 adsorption collet 11 second push-up member ───────────── ───────────────────────────────────────────

[Procedure amendment]

[Submission date] November 30, 1995

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

After this, the second push-up member 11 descends following the first push-up member 9. When the taking-out of one semiconductor pellet is completed in this way, the XY table is operated to operate the semiconductor pellet 3a to be taken out next.
Is located above the first push-up member 9. At this time, when the semiconductor pellet is at the end in the X direction as shown in FIG. 6 , the motor 15 is operated to turn the rotary table 1 on.
4 is rotated 90 degrees clockwise, and the second push-up member 1
1 is positioned below the semiconductor pellet 3a to be taken out next to the semiconductor pellet 3a to be taken out.
Hereinafter, the above operation can be repeated to sequentially take out the semiconductor pellets. In this device, since the second push-up member 11 is rotatable about the first push-up member 9, the second push-up member 11 is located at the semiconductor pellet position in front of the moving direction of the adhesive sheet 6 by the XY table. be able to. The present invention is not limited only to the above embodiments, for example, the recess 14a of FIG. 5 device, 14
The second push-up members 11 are arranged at the positions b, and the second push-up members 11 can be independently controlled to move up and down. It is not necessary to rotate the table 14 and the motor 1
5 can be omitted. Thereby, even when defective pellets continue, the second push-up member 11 can be controlled so that the semiconductor pellets to be taken out can be peeled from the adhesive sheet in advance. Semiconductor pellets that have been determined to be defective in advance and do not need to be taken out can be passed through the push-up members 9 and 11, and can be left on the adhesive sheet with a strong adhesive force.

Claims (4)

[Claims] 1. An XY table for horizontally moving a pressure-sensitive adhesive sheet to which pellets formed by cutting a wafer into a predetermined shape and size are attached while maintaining an aligned state,
A push-up member that pushes up the pellet on the adhesive sheet positioned at a predetermined position from the lower surface of the adhesive sheet, and a pellet that is located above the push-up member and that is pushed up by the push-up member, and that moves vertically and horizontally In a pellet take-out device having a collet, a second push-up member for selectively pushing up a pellet adjacent to the take-out scheduled is arranged in the vicinity of the first push-up member pushing up the pellet to be taken out. Pellet takeout device. 2. The pellet take-out device according to claim 1, wherein the second push-up member is moved up and down when the first push-up member pushing up the pellet to be taken out is lowered. 3. The second push-up member according to claim 1, wherein a plurality of the second push-up members are arranged around the first push-up member, and the second push-up members are selectively operated depending on a state of pellets to be taken out next. Pellet extractor. 4. The second push-up member horizontally moves a minute distance with the adhesive sheet pushed up.
The pellet take-out device described in 1.