JPH0964537A - Multilayered printed wiring board and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board having a highly precise pattern by a structure wherein a wiring pattern layer comprises a conductive layer, an insulation layer and a resin layer formed sequentially thereunder wherein the resin layer is formed by curing adhesive photosensitive resin. SOLUTION: Each wiring layer 3-5 comprises a conductive layer 3a-5a, an insulation layer 3b-5b and a resin layer 3c-5c formed thereunder wherein the resin layer is formed by curing adhesive photosensitive resin. It has an overlapped printing structure where the wiring pattern layer 3 is transferred onto a board 2 and each wiring pattern layer 4, 5 is transferred sequentially onto the underlying wiring pattern layer. At each intersection of wiring pattern layers, insulation between upper and lower wiring pattern layers is ensured by an insulation layer constituting the upper wiring pattern layer. This structure realizes a multilayer printed wiring board having a highly precise pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method for manufacturing the same, and more particularly to a multilayer printed wiring board having a high-definition pattern, and such a multilayer printed wiring board can be manufactured at low cost. Manufacturing method

[0002]

2. Description of the Related Art Due to the rapid development of semiconductor technology, downsizing of semiconductor packages, increase in pin count, fine pitch,
The miniaturization of electronic components has rapidly progressed, and the era of so-called high-density mounting has entered. Along with that, printed wiring boards are being further multilayered and thinned from single-sided wiring to double-sided wiring.

At present, a subtractive method and an additive method are mainly used for forming a copper pattern on a printed wiring board.

The subtractive method is a method in which a hole is formed in a copper-clad laminate, copper is plated on the inside and the surface of the hole, and a pattern is formed by photoetching. Although this subtractive method is technically highly complete and inexpensive, it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil.

On the other hand, in the additive method, a resist is formed on a portion other than a circuit pattern forming portion on a laminated plate containing a catalyst for electroless plating, and a circuit is formed on the exposed portion of the laminated plate by electroless copper plating or the like. This is a method of forming a pattern. Although the additive method can form a fine pattern, it is difficult in terms of cost and reliability.

In the case of a multi-layer substrate, a method of pressure laminating a single-sided or double-sided printed wiring board produced by the above method or the like together with a semi-cured prepreg obtained by impregnating glass cloth with an epoxy resin or the like is preferred. It is used. In this case, the prepreg plays a role of an adhesive for each layer, and the connection between layers is made by forming a through hole and applying electroless plating or the like inside.

Further, due to the progress of high-density mounting, thin and lightweight multi-layer boards are required, and on the other hand, high wiring capability per unit area is required.
Ingenuity has been made in the connection between layers and the mounting method of parts.

[0008]

However, the production of a multilayer substrate using the double-sided printed wiring board produced by the subtractive method described above requires the precision of drilling for forming holes in the double-sided printed wiring board and the There is a limit to the densification from the viewpoint of the limit of materialization, and it was difficult to reduce the manufacturing cost.

On the other hand, in recent years, a multilayer wiring board manufactured by sequentially laminating a conductor pattern layer and an insulating layer on a base material has been developed to satisfy the above-mentioned requirements. Since this multilayer wiring board is manufactured by alternately performing photoetching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at arbitrary positions are possible.

However, in this method, copper plating and photo-etching are performed alternately a plurality of times, which complicates the process. In addition, if a trouble occurs in an intermediate process due to a series process of stacking one layer on a substrate, Reproduction becomes difficult, which hinders reduction in manufacturing cost.

Further, in the conventional multilayer wiring board, since the connection between the layers is made by forming via holes, a complicated photolithography step is required, which hinders a reduction in manufacturing cost.

The present invention has been made in view of the above circumstances, and a multilayer printed wiring board having a high-definition pattern and such a multilayer printed wiring board on a substrate without including a photolithography process. An object of the present invention is to provide a manufacturing method that can be manufactured by a transfer stacking method.

[0013]

In order to achieve such an object, a multilayer printed wiring board according to the present invention comprises a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate. Has a conductive layer, an insulating layer and a resin layer in this order below the conductive layer, and the resin layer is formed by curing an adhesive photosensitive resin.

Further, the multilayer printed wiring board comprises a substrate and a plurality of wiring pattern layers successively transferred onto the substrate, the wiring pattern layer being a conductive layer and an insulating resin formed under the conductive layer. The insulating resin layer has a layer, and the insulating resin layer is formed by curing an adhesive insulating photosensitive resin.

Further, the multilayer printed wiring board of the present invention is
The wiring pattern layers are configured to be connected to each other at required portions where the wiring pattern layers intersect and / or are close to each other.

In the method for manufacturing a multilayer printed wiring board according to the present invention, a pattern made of an insulating material is formed on a transparent transfer substrate having at least a conductive surface, and the area where the pattern is not formed is made conductive by a plating method. A layer is formed, an insulating layer is further formed on the conductive layer, and then a film having a negative-type adhesive photosensitive resin layer on a support is provided on the surface of the transparent transfer substrate. Is stacked and pressed so as to be in contact with the insulating layer, exposed to light from the back surface of the transparent transfer substrate to expose the adhesive photosensitive resin layer using the conductive layer as a mask, and then peeling off the support. Forming a resin layer on the insulating layer, the conductive layer,
A plurality of wiring pattern layer transfer plates provided with a wiring pattern layer having the insulating layer and the resin layer are produced, and then the wiring pattern layer is provided on one surface of a substrate for a multilayer printed wiring board via the resin layer. An operation of transferring a plurality of the wiring pattern layers on the substrate by sequentially repeating an operation of transferring the wiring pattern layers by pressure-bonding a transfer plate and peeling off the transparent transfer substrate, further comprising the insulating layer Is formed by any one of an electrodeposition method, an electrolytic polymerization method, and a photolithography method.

Further, in the method for manufacturing a multilayer printed wiring board according to the present invention, a pattern made of an insulating material is formed on a transparent transfer substrate having at least a conductive surface, and a portion where the pattern is not formed is plated by a plating method. A conductive layer is formed, and a film having a negative type adhesive insulating photosensitive resin layer on a support is laminated on the surface of the transparent transfer substrate so that the adhesive insulating photosensitive resin layer is in contact with the conductive layer. Crimp,
After irradiating light from the back surface of the transparent transfer substrate and exposing the adhesive insulating photosensitive resin layer using the conductive layer as a mask,
By forming an insulating resin layer on the conductive layer by peeling the support, to produce a plurality of wiring pattern layer transfer plate provided with a wiring pattern layer having the conductive layer and the insulating resin layer, Then, the wiring pattern layer transfer plate is pressure-bonded to one surface of the substrate for the multilayer printed wiring board via the insulating resin layer, and the transparent transfer substrate is peeled off to transfer the wiring pattern layer. The wiring pattern layers are formed on the substrate by repeating the process in sequence.

Further, in the method for manufacturing a multilayer printed wiring board according to the present invention, each wiring pattern layer is formed at a required portion where the wiring pattern layers intersect with each other and / or where the wiring pattern layers are close to each other. By forming a bonding portion so as to extend between the conductive layers, the wiring pattern layers are connected to each other.

In such a multilayer printed wiring board according to the present invention, the wiring pattern layer formed on the substrate is a laminate comprising a conductive layer, an insulating layer and a resin layer formed by curing an adhesive photosensitive resin, or This is a so-called overprint type structure that includes a laminate composed of a conductive layer and an insulating resin layer formed by curing an adhesive insulating photosensitive resin. The conductive layer of each wiring pattern layer is always partially bare. Since the formation of the wiring pattern is performed by sequentially transferring the wiring pattern layers on the wiring pattern layer transfer plate onto the substrate, the plating and photoetching steps on the substrate are unnecessary, and the multilayer wiring It is possible to simplify the plate manufacturing process. In addition, since a film having an adhesive photosensitive resin layer on a support or a film having an adhesive insulating photosensitive resin layer on a support is used in the manufacturing process, so-called dry treatment is possible.

[0020]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an example of the multilayer printed wiring board of the present invention. In FIG. 1, a multilayer printed wiring board 1 includes an insulating substrate 2, a first wiring pattern layer 3 provided on the substrate 2, and the wiring pattern layer 3
A multilayer printed wiring board having a three-layer structure including a second wiring pattern layer 4 formed on the wiring pattern layer 4 and a third wiring pattern layer 5 further formed on the wiring pattern layer 4.

The wiring pattern layers 3, 4, and 5 which compose the multilayer printed wiring board 1 are conductive layers 3a and 4 respectively.
a, 5a and the insulating layer 3 formed under the conductive layer
b, 4b, 5b and resin layers 3c, 4c, 5c formed by curing an adhesive photosensitive resin. And
The multilayer printed wiring board 1 has an overprint type structure in which the wiring pattern layer 3 is sequentially transferred onto the substrate 2 and the respective wiring pattern layers 4 and 5 are sequentially transferred onto the lower wiring pattern layer. In the region where the two intersect with each other (intersection), the insulation between the upper and lower wiring pattern layers is maintained by the insulating layer forming the upper wiring pattern layer.

Therefore, the multilayer printed wiring board 1 of the present invention is
Does not have a wiring pattern covering with an insulating layer as seen in a conventional multilayer printed wiring board, and the conductive layers 3a, 4a, 5a of the respective wiring pattern layers 3, 4, 5 are always partially exposed. Therefore, as will be described later, the wiring pattern layers can be easily connected to each other at the intersections of the wiring pattern layers or the portions (proximity portions) where the wiring pattern layers are close to each other.

The substrate 2 constituting the multilayer printed wiring board 1 of the present invention is a substrate known as a substrate for a multilayer printed wiring board, such as a glass epoxy substrate, a polyimide substrate, an alumina ceramic substrate, a composite substrate of glass epoxy and polyimide. Can be used. The thickness of the substrate 2 is 5 to 1
It is preferably in the range of 000 μm. Also, the substrate 2
Alternatively, a semi-cured prepreg substrate obtained by impregnating glass cloth with epoxy resin can be used.

The thickness of each of the wiring pattern layers 3, 4, and 5 is set to 100 μm or less, preferably 10 to 60 μm, in order to perform the transfer of the lower wiring pattern layer in the lamination transfer described later without defects. The thickness of the conductive layers 3a, 4a, 5a constituting each of the wiring pattern layers 3, 4, 5 is 1 μm in order to keep the electric resistance of the wiring pattern layers low.
As described above, the thickness is preferably in the range of 5 to 40 μm. further,
The thickness of the insulating layers 3b, 4b, 5b is at least 1 μm in order to maintain insulation between the upper and lower wiring pattern layers at the intersection.
m or more, preferably 5 to 50 μm. Also,
The thickness of the resin layers 3c, 4c, 5c is preferably about 1 to 100 μm. The line width of such wiring pattern layers 3, 4, 5 can be arbitrarily set up to a minimum width of about 10 μm.

The material of the conductive layers 3a, 4a and 5a is not particularly limited as long as it can form a thin film by a plating method as described later, and for example, copper, silver, gold, nickel, chromium, zinc, Tin, platinum or the like can be used.

The insulating layers 3b, 4b and 5b can be formed of a conventionally known electrically insulating material.

The resin layers 3c, 4c and 5c are formed by curing a negative type adhesive photosensitive resin. Resin layer 3
As the adhesive photosensitive resin for forming c, 4c, and 5c, a conventionally known negative photosensitive resin to which a resin such as a rosin-based, terpene-based, or petroleum-based resin is added as a tackifier. Can be used.

Next, the manufacturing method of the multilayer printed wiring board according to the present invention will be described with reference to FIGS. 2 to 5 by taking the above-mentioned multilayer printed wiring board 1 as an example.

First, on the surface, indium tin oxide (IT
A photoresist is applied on the transparent transfer substrate 11 having a transparent conductive film 11a such as O) to form a photoresist layer 12. Then, the photoresist layer 12 is contact-exposed and developed using a predetermined photomask to develop the transparent transfer substrate 11
The wiring pattern portion 11b is exposed (see FIG. 2).
(A)). Next, the conductive layer 14 is formed on the wiring pattern portion 11b of the transparent transfer substrate 11 by a plating method (FIG. 2 (B)).

Next, the insulating layer 15 is formed on the conductive layer 14 (FIG. 2C). The insulating layer 15 can be formed by an electrodeposition method, an electrolytic polymerization method, a photolithography method, or the like.

The insulating layer 15 is formed on the conductive layer 14 by the electrodeposition method.
In the case of forming, an electrodepositable insulating substance made of an anionic or cationic synthetic polymer resin having an insulating property can be used. Specifically, as the anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, or the like can be used alone or as a mixture of any combination of these resins. Further, the above-mentioned anionic synthetic polymer resin may be used in combination with a crosslinkable resin such as melamine resin, phenol resin and urethane resin.

As the cationic synthetic polymer resin,
Acrylic resin, epoxy resin, urethane resin, polybutadiene resin, polyamide resin, polyimide resin and the like can be used alone or as a mixture of any combination thereof. Further, the above-mentioned cationic synthetic polymer resin may be used in combination with a crosslinkable resin such as polyester resin and urethane resin.

A known thermosetting resin having a heat-polymerizable unsaturated bond such as blocked isocyanate is added to the above-mentioned electrodepositable insulating substance for the purpose of enhancing the reliability such as the insulating property and heat resistance. After transferring and forming all layers of the printed wiring board, all insulating layers may be cured by heat treatment. Of course,
In addition to the thermosetting resin, if a resin having a polymerizable unsaturated bond (eg, acrylic group, vinyl group, allyl group, etc.) is added to the electrodepositable insulating material, all layers of the multilayer printed wiring board will be After transfer formation, all insulating resin layers can be cured by electron beam irradiation.

When the insulating layer 15 is formed on the conductive layer 14 by the electrolytic polymerization method, either electrolytic reduction polymerization or electrolytic oxidation polymerization may be used. That is, the insulating layer 15 is
It can be formed by an electrolytic polymerization method using the following electrolytic polymerization solution for electrolytic reduction polymerization, or the following electrolytic polymerization solution for electrolytic oxidative polymerization, and the insulating layer of the insulating layer by adjusting the applied voltage, energization time, etc. The thickness can be controlled. (Electrolytic Polymerization Solution for Electrolytic Reduction Polymerization) At least one of the following monomers alone, one obtained by adding a polymerizable functional group to the following monomers, and at least one copolymer of the following monomers is described below. Which is dissolved in the solvent or the mixture thereof, and the following additives can be added if necessary.

Monomer -Acrylonitrile or its derivative-Acrolein or its derivative-Acrylic acid or its derivative-Acrylamide or its derivative-Maleic anhydride-Styrene or its derivative-Vinylpyridine or its derivative-Vinylimidazole or its derivative- Xylene derivatives such as xylene or halogenated xylenes ・ Divinylbenzene or its derivative solvents・ Alcohols such as methanol, ethanol, propanol, isopropyl alcohol ・ Methyl cellosolve, cellosolve, butyl cellosolve,
Cellosolve-based solvents such as cellosolve acetate-Glycols such as ethylene glycol, propylene glycol, trimethylene glycol, and 1,5-pentadiol-Dimethylformamide-Dimethylacetamide-Acetone-Acetonitrile-Dichloromethane-Ion exchange water additive -Allylamine, ethylenediamine, Amine derivatives such as propylamine ・ Polyoxyethylene, surfactants such as Triton X-100 (made by Rohm and Haas) ・ Bases such as potassium hydroxide and sodium hydroxide ・ Acids such as oxalic acid ・ Sodium silicate, sulfite Salts of sodium, ammonium perchlorate, etc. (electrolytic polymerization solution for electrolytic oxidative polymerization) The following monomers alone, those obtained by adding a polymerizable functional group to the following monomers, and the following monomers At least one of the polymers is a solvent Others are obtained by dissolving the mixture, it can be added the following additives as required.

Monomers / phenols or derivatives thereof: diphenylphenol, dimethylphenol, hydroxybenzaldehyde, hydroxypropiophenone, 4- (P-hydroxyphenyl) -2-butanone, hydroxyacetophenone, hydroxybenzophenone, allylphenol, hydroxysilicon. Cinnamic acid, halogenated phenols, etc.-Aniline or its derivative: aminocinnamic acid, phenylenediamine, dicarboxyaniline, etc.-Thiophene or its derivative-Thiophenol or its derivative-Pyrrole or its derivative-Quinolinol or its derivative: Aminoquinolinol, etc. -Quinone or its derivative: Solvent such as 1,4-naphthoquinone-Alcohol such as methanol, ethanol, propanol, isopropyl alcohol-Methyl Lucersolve, Cellsolve, Butylcellsolve,
Cellosolve-based solvents such as cellosolve acetate-Glycols such as ethylene glycol, propylene glycol, trimethylene glycol, and 1,5-pentadiol-Dimethylformamide-Dimethylacetamide-Acetone-Acetonitrile-Dichloromethane-Ion exchange water additive -Allylamine, ethylenediamine, Amine derivatives such as propylamine ・ Polyoxyethylene, surfactants such as Triton X-100 (made by Rohm and Haas) ・ Bases such as potassium hydroxide and sodium hydroxide ・ Acids such as oxalic acid ・ Sodium silicate, sulfite In addition, when the insulating layer 15 is formed on the conductive layer 14 by photolithography, a salt of sodium or the like is added to a novolac resin, a polyimide resin, or the like as a substance that promotes dissolution by light irradiation, such as a quinonediazide-based compound or a nitrobenzene compound. The insulating layer 15 can be formed by applying a positive type insulating photosensitive resin added with a dilsulfonic acid ester type, a dihydropyridine type, etc., and exposing and developing from below the transparent transfer substrate 11 using the conductive layer as a mask. .

Next, a film 16 having a negative adhesive photosensitive resin layer 18 on a support 17 is overlaid on the transparent transfer substrate 11 so as to be in contact with the insulating layer 15 and pressure-bonded (FIG. 2).
(D)). A resin film made of polyethylene terephthalate, polyethylene, polypropylene, polycarbonate, polyvinyl alcohol, or the like is preferably used as the support 17 constituting the film 16. In addition, the negative-type adhesive photosensitive resin layer 18 is disclosed in, for example, JP-A-3-28.
It can be formed by using the photosensitive resin described in Japanese Patent No. 404, specifically, a photosensitive resin composed of a negative type diazo resin and a binder, a photopolymerizable composition, an azide compound and a binder. It can be formed in a thickness range of 1 to 50 μm by using a photosensitive resin, a cinnamic acid photosensitive resin, or the like. Then, the back surface of the transparent transfer substrate 11 (the surface on which the insulating layer 15 is not formed) is irradiated with light to expose the adhesive photosensitive resin layer 18 using the conductive layer 14 as a mask (FIG. 2D. )). At the location irradiated with light by exposure, the adhesive photosensitive resin layer 18 is cured to lose its adhesiveness and is fixed to the support 17, while
Since the portion not irradiated with light has adhesiveness as it is, it is attached to the insulating layer 15. In this exposure process, the mask alignment that has been conventionally performed is not necessary, and the apparatus and process can be simplified. After that, the support 17
The adhesive photosensitive resin layer 18 remains only on the insulating layer 15 by peeling off and developing the adhesive resin layer 1
9 is formed (FIG. 2 (E)).

Thus, the wiring pattern layer transfer plate 10 provided with the wiring pattern layer 13 for the first layer having the conductive layer 14, the insulating layer 15 and the adhesive resin layer 19 is obtained.

Similarly, as shown in FIGS. 3 and 4, the conductive layers 24, 3 are formed on the transparent transfer substrates 21, 31.
4, insulating layers 25 and 35, and adhesive resin layers 29 and 3
9 to form a second pattern having wiring pattern layers 23 and 33.
The wiring pattern layer transfer plate 20 for layers and the wiring pattern layer transfer plate 30 for the third layer are produced.

Each of the above wiring pattern layer transfer plates 10 and 2
The films 0 and 30 do not include the coating step, and the film 16 is used, so that so-called dry processing can be performed.

Next, the wiring pattern layer transfer plate 10 is pressure-bonded onto the insulating substrate 2 so that the adhesive resin layer 19 contacts the substrate 2. This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. Moreover, when the above-mentioned adhesive resin layer 19 exhibits adhesiveness or adhesiveness by heating, thermocompression bonding can be performed. After that, the transparent transfer substrate 11 is peeled off and the wiring pattern layer 13 is transferred onto the substrate 2, whereby the first wiring pattern layer 3 having the conductive layer 3a, the insulating layer 3b and the resin layer 3c is formed on the substrate 2. Form on top (Fig. 5
(A)). After that, the wiring pattern layer transfer plate 20 for the second layer is used to perform alignment with the first wiring pattern layer on the substrate 2 on which the first wiring pattern layer 3 has been transferred and formed. Similarly, the wiring pattern layer is transferred to form the second wiring pattern layer 4 having the conductive layer 4a, the insulating layer 4b and the resin layer 4c (FIG. 5).
(B)). Further, on the substrate 2 on which the first wiring pattern layer 3 and the second wiring pattern layer 4 have been transferred and formed, alignment is similarly performed using the wiring pattern layer transfer plate 30 for the third layer. The transfer of the wiring pattern layer is performed to perform the third process including the conductive layer 5a, the insulating layer 5b, and the resin layer 5c.
The wiring pattern layer 5 of the layer is formed (FIG. 5C).

As described above, each wiring pattern layer 3, 4,
5 is formed by sequentially transferring the wiring pattern layers 13, 23, 33 of the wiring pattern layer transfer plates 10, 20, 30 onto the substrate, so that the multilayer printed wiring board 1 can form the wiring pattern layers 3, 4 , 5 is a so-called overprint type structure. Then, for example, the wiring pattern layer 3 and the wiring pattern layer 4 constituting this multilayer printed wiring board 1
As shown in FIG. 6, the conductive layers 3a, 4a of the wiring pattern layers 3, 4 are always partially exposed. At the intersection, the wiring pattern layers 3 and 4 are exposed.
The insulation between and is maintained by the insulating layer 4b that constitutes the upper wiring pattern layer 4. In addition, an intersection of the wiring pattern layers or a portion where the respective wiring pattern layers are close to each other as shown in FIG. 7 (proximity portion, in the illustrated example, the wiring pattern layer 3 and the wiring pattern layer 4 are close to each other). ), The wiring pattern layers can be easily connected to each other.

FIG. 8 is a schematic sectional view showing another example of the multilayer printed wiring board of the present invention. In FIG. 8, a multilayer printed wiring board 41 includes an insulating substrate 42, a first wiring pattern layer 43 provided on the substrate 42, and a second wiring pattern layer 43 formed on the wiring pattern layer 43. And a third wiring pattern layer 45 formed on the wiring pattern layer 44, and is a multilayer printed wiring board having a three-layer structure.

Each of the wiring pattern layers 43, 44, 45 constituting the multilayer printed wiring board 41 is a conductive layer 43a, 44a, 45a and an adhesive insulating photosensitive resin located under the conductive layer is cured. It has the insulating resin layers 43b, 44b, and 45b formed in this way. The multilayer printed wiring board 41 has an overprint type structure in which the wiring pattern layer 43 is sequentially transferred onto the substrate 42, and the wiring pattern layers 44 and 45 are sequentially transferred onto the lower wiring pattern layer,
In a portion where each wiring pattern layer intersects with each other (intersection portion), insulation between upper and lower wiring pattern layers is maintained by an insulating resin layer that constitutes the upper wiring pattern layer.

Therefore, the multilayer printed wiring board 4 of the present invention is
No. 1 does not have a wiring pattern covering with an insulating layer as seen in a conventional multilayer printed wiring board, and the conductive layers 43a, 44a, 45a of the wiring pattern layers 43, 44, 45 are always partially exposed. As described later, the wiring pattern layers can be easily connected to each other at the intersections of the wiring pattern layers or the portions (proximity portions) where the wiring pattern layers are close to each other.

The substrate 42 constituting the multilayer printed wiring board 41 of the present invention can be the same as the substrate 2 constituting the multilayer printed wiring board 1 described above.

The thickness of each wiring pattern layer 43, 44, 45 is 100 μm or less, preferably 1 μm or less so that the wiring pattern layer underneath can be overcome without defects in the laminated transfer.
The range is from 0 to 60 μm. In addition, each wiring pattern layer 4
Conductive layers 43a, 44a, 4 forming 3, 44, 45
The thickness of 5a is set to 1 μm or more, preferably 5 to 40 μm in order to keep the electric resistance of the wiring pattern layer low. Furthermore, the thickness of the insulating resin layers 43b, 44b, 45b is at least 1 μm or more, preferably 5 to 50 μm in order to maintain insulation between upper and lower wiring pattern layers at the intersection.
The range is m. Such wiring pattern layers 43, 4
The line width of 4, 45 can be arbitrarily set up to a minimum width of about 10 μm.

The materials for the conductive layers 43a, 44a and 45a are the conductive layers 3a and 4 of the multilayer printed wiring board 1 described above.
It can be the same as a and 5a.

The insulating resin layers 43b, 44b and 45b are formed by curing a negative type adhesive insulating photosensitive resin. As a negative type adhesive insulating photosensitive resin for forming the insulating resin layers 43b, 44b, 45b, there is, for example, JP-A-3-
The photosensitive resin described in Japanese Patent No. 28404 can be used, and specifically, a photosensitive resin containing a negative diazo resin and a binder, a photopolymerizable composition, and a photosensitive resin containing an azide compound and a binder. Resin, cinnamic acid photosensitive resin, etc. can be used.

Next, another example of the method for manufacturing a multilayer printed wiring board according to the present invention will be described with reference to FIG. 9 by taking the above-mentioned multilayer printed wiring board 41 as an example.

First, indium tin oxide (IT
A photoresist is applied on the transparent transfer substrate 51 having a transparent conductive film 51a such as O) to form a photoresist layer 52. Then, the photoresist layer 52 is contact-exposed and developed using a predetermined photomask to develop the transparent transfer substrate 51.
The wiring pattern portion 51b is exposed (see FIG. 9).
(A)). Next, the conductive layer 54 is formed on the wiring pattern portion 51b of the transparent transfer substrate 51 by a plating method (FIG. 9B).

Next, a film 56 having a negative type adhesive insulating photosensitive resin layer 58 on a support 57 is superposed on the transparent transfer substrate 51 so as to be in contact with the conductive layer 54 and pressure-bonded (FIG. 9 ( C)). Support 5 that constitutes this film 56
The same material as the support 17 forming the film 16 can be used as the material 7. In addition, the negative type adhesive insulating photosensitive resin layer 58 is disclosed in, for example, Japanese Patent Laid-Open No. 28404/1993.
It can be formed by using the photosensitive resin described in Japanese Patent Publication, specifically, a photosensitive resin composed of a negative type diazo resin and a binder, a photopolymerizable composition, and an azide compound and a binder. A photosensitive resin, a cinnamic acid photosensitive resin, or the like can be used to form the film having a thickness of about 1 to 50 μm. Then, the back surface of the transparent transfer substrate 51 (the conductive layer 5
By irradiating light from the surface on which the adhesive layer 4 is not formed), the adhesive insulating photosensitive resin layer 58 is exposed using the conductive layer 54 as a mask (FIG. 9C). The portion which is irradiated with light by exposure is adhered to the support 57 while the adhesive insulating photosensitive resin layer 58 is cured to lose its adhesiveness, while the portion which is not irradiated with light has adhesiveness as it is. Therefore, it is attached to the conductive layer 54. In this exposure process, the mask alignment that has been conventionally performed is not necessary, and the apparatus and process can be simplified. After that, the support 57 is peeled off and peeling development is performed, so that the adhesive insulating photosensitive resin layer 58 remains only on the conductive layer 54 to form the adhesive insulating resin layer 19 (FIG. 9D). ).

As a result, the wiring pattern layer 53 for the first layer having the conductive layer 54 and the adhesive insulating resin layer 59 is formed.
A wiring pattern layer transfer plate 50 provided with is obtained.

Similarly, a conductive layer and an adhesive insulating resin layer are formed on a transparent transfer substrate to form a wiring pattern layer transfer plate for the second layer having a wiring pattern layer, and a wiring pattern for the third layer. A layer transfer plate is prepared (not shown).

The production of each wiring pattern layer transfer plate described above
Since the film 56 is used without including the coating step, so-called dry processing is possible.

Next, the wiring pattern layer transfer plate 50 is pressure-bonded onto the insulating substrate 42 so that the adhesive insulating resin layer 57 contacts the substrate 42. This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. Further, when the above-mentioned tacky resin layer exhibits tackiness or adhesiveness by heating, thermocompression bonding can be performed. After that, the transparent transfer substrate 51 is peeled off and the wiring pattern layer 53 is transferred onto the substrate 42 to form the first wiring pattern layer 43 having the conductive layer 43a and the insulating resin layer 43b on the substrate 42. can do. Then, on the substrate 42 on which the first wiring pattern layer 43 has been transferred and formed, the wiring pattern layer transfer plate for the second layer is used to perform alignment with the first wiring pattern layer. Similarly, the wiring pattern layer is transferred to form the second wiring pattern layer 44 having the conductive layer 44a and the insulating resin layer 44b. Further, on the substrate 42 on which the wiring pattern layer 43 of the first layer and the wiring pattern layer 44 of the second layer have been transferred and formed, the same alignment is performed using the wiring pattern layer transfer plate for the third layer. The wiring pattern layer is transferred to the third wiring pattern layer 4 having the conductive layer 45a and the insulating resin layer 45b.
5 is formed.

As described above, each wiring pattern layer 43, 4
Since the wiring patterns 45 and 45 are formed by sequentially transferring the wiring pattern layers of the respective wiring pattern layer transfer plates onto the substrate, the multilayer printed wiring board 41 has the wiring pattern layers 43,
This is a so-called overprint type structure composed of 44 and 45. The wiring pattern layer 43 and the wiring pattern layer 44 that compose the multilayer printed wiring board 41 are the same as the wiring pattern layer 3 and the wiring pattern layer 4 that compose the multilayer printed wiring board 1 described above. , 44 of the conductive layers 43a and 44a are always barely exposed, and the insulation between the wiring pattern layers 43 and 44 forms the upper wiring pattern layer 44 at the intersection. It is maintained by the insulating resin layer 44b. Also,
It is possible to easily connect the wiring pattern layers to each other at the intersections of the wiring pattern layers or the portions where the wiring pattern layers are close to each other.

Next, the connection at the intersection or the proximity of each wiring pattern layer will be described by taking the multilayer printed wiring board 41 of the present invention as an example.

FIGS. 10 to 14 are perspective views showing the connection state of the intersections of the wiring pattern layers of the multilayer printed wiring board 41. In FIG. 10, the joint portion 61 is formed and connected to the through hole formed in the upper wiring pattern layer 44. Further, in FIG. 11, a joint portion 62 is formed at a part of the intersecting portion to connect the conductive layer 43a of the wiring pattern layer 43 and the conductive layer 44a of the wiring pattern layer 44. Further, FIG. 12 shows the wiring pattern layer 43 and the wiring pattern layer 4.
The joint portion 63 is formed so as to cover the intersecting portion with 4. Further, FIG. 13 shows the wiring pattern layer 43 and the wiring pattern layer 44 connected by forming the joint portion 64 so as to extend over a part of the adjacent portion, and FIG. 14 shows the wiring pattern layer 43 and the wiring pattern. The joint portion 65 is formed and connected so as to cover the portion close to the layer 44.

As the connection by forming a joint at the intersection or the proximity of each wiring pattern layer,
(1) printing method, (2) dispensing method, (3) ultra fine particle spraying method, (4) laser drawing method, (5) selective electroless plating method,
(6) Selective vapor deposition method, (7) Welding joining method and the like.

The connection of the crossing portions or the proximity portions of the wiring pattern layers of the multilayer printed wiring board 1 by the printing method of the above (1) is made so as to extend between the conductive layers constituting each wiring pattern layer by printing. This is performed by fixing a conductive paste or solder to form a joint. The printing method used is not particularly limited, but screen printing, which is generally suitable for thick film printing and widely used in the electronic industry, is preferable. When performing screen printing, create a screen printing plate that has openings in the areas corresponding to the connections between wires in advance, place it in position on the multilayer wiring board, and place a conductive paste such as silver paste. Just print the ink.

Further, the connection at the intersection or the proximity of the wiring pattern layers of the multilayer printed wiring board 1 by the dispensing method of the above (2) is similar to the above-mentioned printing method, but the conductive ink is finely divided. This is performed by ejecting from a nozzle and directly drawing and forming a joint between wirings. Specifically, a dispenser having a needle-shaped ejection port, which is generally used for attaching a small amount of an adhesive or the like to a required place, can be used. Further, depending on the viscosity of the conductive ink used, an inkjet method used in an output device such as a computer can also be used.

In the method (3) of spraying ultrafine particles, the ultrafine particles are carried by being carried on a high-speed air stream, and sprayed onto the multilayer printed wiring board from fine nozzles provided close to the multilayer printed wiring board. A method of forming a film by sintering the ultrafine particles and the multilayer printed wiring board with each other by collision energy, and a method called a gas deposition method can be used. The apparatus used in this method is basically composed of two vacuum tanks of high vacuum and low vacuum, and a connecting pipe connecting each vacuum tank. The ultrafine particles are formed by a vacuum evaporation method in a low vacuum tank into which argon gas or the like is introduced, and the substrate is placed in a high vacuum tank. The connection pipe has an opening in the vicinity of the ultra-fine particles generated in the low vacuum tank and in the vicinity of the multilayer printed wiring board in the high vacuum tank and in a direction orthogonal to the wiring board. There is. Since each vacuum tank is kept at a constant pressure by the vacuum exhaust system, a high-speed air flow (gas flow) from the low vacuum tank to the high vacuum tank in the connecting pipe due to the pressure difference between the vacuum tanks. The ultrafine particles generated and generated in the low vacuum tank are carried on this air stream and conveyed to the high vacuum tank side, and collide with the wiring pattern layer of the multilayer printed wiring board to be sintered to form a film. By using this method with a metal such as gold, silver, copper or nickel as a base material, it is possible to selectively form a conductor (joint portion) at a place where a connection between wirings is required.

In the laser drawing method of the above (4), a solution in which conductive fine particles are dispersed is applied to a multilayer printed wiring board, and a desired portion of this coating film is heated by a laser to decompose or decompose the resin binder. It is vaporized and removed, and conductive fine particles are deposited and aggregated at the heated portions to selectively form a conductor. As the solution, a conductive resin fine particle such as gold or silver dispersed in a polyester resin, an acrylic resin, or the like is used, and a fine line of about several tens of μm can be drawn by irradiating with squeezing an argon laser or the like.

As the selective electroless plating method (5), a selective electroless plating technique generally known as a photoforming method can be used. This technique is capable of reducing and forming a photosensitizer layer containing a metal in an oxidized state serving as a catalyst for electroless plating on a multilayer printed wiring board, and selectively exposing the photosensitizer layer, In the electroless plating, metal particles serving as a catalyst are deposited and then immersed in an electroless plating solution to selectively plate only the exposed portion.

The selective vapor deposition method (6) uses a selective film deposition technique which is one of thin film forming techniques. That is, a metal, an organometallic gas containing a conductive element such as carbon, or an organic substance vapor containing a conductive element is introduced into the vacuum chamber, and the above gas or the above gas is applied to the surface of the multilayer printed wiring board installed in the vacuum chamber. The vapor is adsorbed, and then the laser or ion beam is condensed or converged to irradiate the substrate, and the gas or vapor adsorbed on the portion is decomposed by heat or collision energy to generate metal,
A conductive material such as carbon is deposited on the multilayer printed wiring board. Such a selective vapor deposition method has been put to practical use as a wiring correction technique for LSI. Specifically, with a focused argon laser, chromium, cobalt, platinum,
A technique for decomposing an organometallic gas containing tungsten and depositing these metals at a desired correction position, or a technique for decomposing a vapor of an organic material such as pyrene by an ion beam of gallium to deposit a carbon film is proposed. Can be used.

Further, in the welding joining method of the above (7), the intersecting portion of the wiring pattern layers is selectively heated by a laser, and the insulating resin layer (upper layer is formed between the conductive layers of the upper and lower wiring pattern layers is formed. Insulating resin layer) is melted and evaporated, and
By heating the conductive layer itself to a high temperature, the conductive layers forming the respective wiring pattern layers are fused to each other to form a joint portion and connect them.

Further, the wiring pattern layers constituting the multilayer printed wiring board of the present invention are connected to each other by (8) wire bonding method and (9) wire bonding apparatus.
Shot method, (10) laser plating method, (11) batch transfer method of laminated body of conductor and solder plating, (12) metal lump insertion method, (13) electroless plating method and the like can be performed.
The wire bonding method of (8) above is, for example, as shown in FIG.
As shown in FIG. 3, the non-conducting adjacent portions of the wiring pattern layers 43 and 44 (which can also be dealt with at the crossing portions) are wire-bonded by using a wire bonding device to form conductive layers 43a and 44a. This is a method of connecting and by the wire bridge 66.

The one-shot method using the wire bonding apparatus of the above (9) is, for example, as shown in FIG. 16, the non-conducting proximity portions of the wiring pattern layers 43 and 44 (the same can be dealt with at the intersection portion). Is bonded for one shot (once) using a wire bonding device, and the conductive layer 43 is formed without a bridge.
In this method, a and 44a are connected by a bonding block (pad) 67.

In the laser plating method of the above (10), for example, a predetermined spot diameter, power on the irradiation surface, etc. were adjusted in a state where the multilayer printed wiring board before the connection operation was immersed in a palladium plating solution. This is a method of irradiating a laser (for example, an argon laser) at a proximity portion or a crossing portion to be conducted for a predetermined time, and depositing a Pd film at a predetermined thickness on the irradiation portion and connecting the same. It is preferable to irradiate the laser while circulating the palladium plating solution. In addition, the plating solution is removed by washing with water, as shown in FIG.
The conductive film 43a and 44a are connected by the plated film 68 deposited as shown in FIG.

The batch transfer method of the laminated body of the conductor and the solder plating of the above (11) is performed as shown in FIGS. 18 (A) and 18 (B). First, as shown in FIG. 18B, a laminated body 70 of a conductor layer 71 and a solder plating layer 72 is manufactured by the following procedure. That is, on the conductive substrate 75,
On a transparent transfer substrate which has been developed using a resist method and formed with a desired pattern (conductive pattern), for example, electrolytic plating is applied to form a conductive layer 71, and a predetermined solder plating bath is formed on this conductive layer. Solder plating is performed using the composition to form the solder plating layer 72. The solder plating layer 72
In addition to solder plating, screen printing of solder paste,
It can be formed by dipping as well. The laminated body 70 laminated in this way is collectively thermally transferred to the non-conducting proximity portions (which can also be dealt with at the intersection portion) of the wiring pattern layers 43 and 44 as shown in FIG. , The conductive layers 43a and 44a are connected. At this time, the thermal transfer temperature is set within a temperature range of about 200 to 300 ° C., which is a temperature at which the solder plating layer 72 can be melted and deformed.

The above method (12) for inserting a metal block is shown in FIG.
As shown in (A), for example, a diameter of 30
A metal ball 81 having a thickness of about 100 μm is arranged, and thereafter, as shown in FIG. 19B, a sheet 82 coated with a pressure-sensitive adhesive is pressure-bonded thereto to form conductive layers 43 a and 4
It is a method of connecting with 4a. The use of metal balls is a more preferable mode of use, but metal balls (lumps) that are not spherical can also be used. Further, such a metal ball (lump) can also be used to further improve the reliability of the connection portion in the printing method and the dispensing method. That is, the above-mentioned printing or dispensing is performed after the metal balls are installed.

FIG. 20 shows the electroless plating method of (13) above.
A description will be given based on (A) to (F). First, Figure 2
An electroless plating catalyst is applied to the entire surface of a multilayer printed wiring board having wiring pattern layers 43 and 44 as shown in FIG. 0 (A) to form a catalyst layer 91 (FIG. 20 (B)). Next, a photoresist is applied on this to form a resist layer 9
3 is formed, the resist layer 93 is exposed to light and developed using a predetermined photomask to expose the portion H corresponding to the position of the wiring pattern to be connected (FIG. 20).
(C)). Then, after activating this exposed portion H,
Conductive layer 43a is formed by electroless plating to form connection portion 95.
And 44a are connected (FIG. 20 (D)). Thereafter, the remaining unnecessary resist and the catalyst layer are sequentially removed to leave only the connecting portion 95 (catalyst layer 91a) (FIG. 20 (E),
(F)).

The multilayer printed wiring board of the present invention has been described above.
By using the connection method such as (2) to (13), it is possible to connect between the wiring pattern layers at any place without being restricted by the place where the through hole is formed. The degree of freedom in changing the circuit design is greater than that of the conventional multilayer printed wiring board.

In the above example, the multilayer printed wiring board 1 has a three-layer structure, but in the method for manufacturing a multilayer printed wiring board of the present invention, a desired number of wiring pattern layers can be obtained by repeating the same layer transfer. It is possible to manufacture a multilayer printed wiring board provided with.

The multi-layer printed wiring board of the present invention having a two-layer structure has a problem in the conventional double-sided printed wiring board, that is, high density due to the precision of the drilling process for forming holes in the double-sided printed wiring board. Can solve the problem. This is because, as described above, in the multilayer printed wiring board of the present invention, the conductive layer of each wiring pattern layer is always partially exposed, and the intersection of the wiring pattern layers without forming a through hole, or This is because it is possible to easily connect the wiring pattern layers to each other in the proximity portion.

[0078]

Next, the present invention will be described in more detail with reference to examples. (Example 1) (1) Formation of a conductive layer in a wiring pattern layer transfer plate (corresponding to FIG. 2 (B)) As a transparent transfer substrate, an ITO transparent conductive film (thickness 2) was formed on the surface.
A glass substrate (thickness: 1.1 mm) equipped with 000 Å) is prepared, and a commercially available photoresist for plating (PMER P-AR900 manufactured by Tokyo Ohka Kogyo Co., Ltd.) having a thickness of 2 is prepared on the transparent transfer substrate.
Wiring pattern is formed by coating and drying to 0 μm 3
After carrying out contact exposure using each of the photomasks of three types, development, washing with water, drying, and further heat curing were carried out to produce a transparent transfer substrate (three types) in which the wiring pattern portion was exposed.

A copper pyrophosphate plating bath having the following composition (pH = 8, liquid temperature =
55 ° C.), the platinum electrode is connected to the anode of the DC power supply, the transparent transfer substrate is connected to the cathode, and the current density is 1
A current of 0 A / dm ² was applied for 5 minutes, and a thickness of 1 was applied to the bare ITO portion of the transparent transfer substrate not covered with the photoresist.
A copper plating film having a thickness of 0 μm was formed as a conductive layer. This conductive layer formation was performed on three types of transparent transfer substrates.

(Composition of copper pyrophosphate plating bath) Copper pyrophosphate: 94 g / l Potassium pyrophosphate: 340 g / l Ammonia water: 3 g / l (2) Preparation of insulating photosensitive resin liquid for insulating layer 4, 4 ′ Diaminophenyl ether (hereinafter abbreviated as DDE) 4.00 g and pyromellitic acid dimethyl ester dichloride 6.38 g as N-methylpyrrolidone (hereinafter NM
(Abbreviated as P) dissolved in 95 g of sodium carbonate 8.
6 g was added and reacted at room temperature for 6 hours.

After the completion of the reaction, this solution was put into 1 liter of water, and the precipitate was separated by filtration and dried to obtain 8.06 g of resin powder. 3 g of the obtained resin powder was redissolved in 17 g of NMP,
A polyamic acid ester solution having a solid content of 15% by weight was prepared.

On the other hand, 4.00 g of DDE and 4.23 g of pyromellitic dianhydride were dissolved in 47 g of NMP, and the mixture was allowed to stand at room temperature for 6 hours.
The reaction was carried out for a time to obtain a polyamic acid solution. 2 g of this polyamic acid solution was mixed with 18 g of the above polyamic acid ester solution to prepare a polyamic acid ester / polyamic acid mixed solution having a solid content of 15% by weight.

1,2-naphthoquinone-2 of 2,3,4,4'-tetrahydroxybenzophenone was added to this mixed solution.
-3 mol substitution compound of diazide-5-sulfonic acid 0.9
0 g was added and the mixture was stirred at room temperature for 3 hours, and then filtered through a 1.0 μm filter to prepare a positive type insulating photosensitive resin liquid. (3) Formation of Insulating Layer in Wiring Pattern Layer Transfer Plate (Corresponding to FIG. 2C)) On the conductive layer forming surface side of the transparent transfer substrate (3 types) on which the conductive layer is formed in the above (1), The insulating photosensitive resin liquid prepared in (2) above was applied by spin coating and dried (80 ° C., 60 minutes) to form an insulating photosensitive resin layer. Then, using the conductive layer as a mask, exposure (back exposure) is performed from the lower side of the transparent transfer substrate under the following conditions, and then,
Develop, rinse and dry, then heat cure (250 ℃,
30 minutes) to form an insulating layer (thickness about 12) on the conductive layer.
μm).

(Exposure Conditions) Contact exposure machine: P-20 manufactured by Dainippon Screen Mfg. Co., Ltd.
2-G Vacuuming: 60 seconds Exposure time: 600 counts (4) Preparation of film provided with adhesive photosensitive resin layer for resin layer Vinylidene chloride / methyl acrylate / itaconic acid copolymer was applied as a support 100 μm thick polyethylene naphthalate film (Lumirror T- manufactured by Toray Industries, Inc.)
60) was prepared, and an undercoat layer coating solution having the following composition was applied onto the support by a die coating method to form an undercoat layer (thickness: 5 μm).

(Composition of coating liquid for undercoat layer) -Ethylene-vinyl acetate copolymer: 7 parts by weight Paraffin wax: 3 parts by weight-Benzene: 90 parts by weight Next, the following composition was formed on the undercoat layer. The adhesive photosensitive resin liquid was applied by a die coating method to form a negative adhesive photosensitive resin layer (thickness 5 μm).

(Composition of adhesive insulating photosensitive resin liquid) Pentaerythritol triacrylate ester monomer 2.5 parts by weight Cellulose butyrate acetate 2.0 parts by weight 2-Ethylanthraquinone 0.5 parts by weight Methyl Reaction product of amine with polyethylene glycol dichloride Product (30.7% methyl cellosolve solution) 1.0 part by weight-glacial acetic acid ... 0.0446 part by weight-acetone ... 13.0 parts by weight (5) Wiring pattern layer transfer plate Of the resin layer in (corresponding to FIG. 2E)) In the above (3), the transparent transfer substrate (3 types) in which the insulating layer is formed on the conductive layer is formed on the side where the conductive layer and the insulating layer are formed. The film prepared in (4) above is laminated so that the adhesive photosensitive resin layer is in contact with the insulating layer and thermocompression-bonded under the following conditions, and then the conductive layer is used as a mask to back the transparent transfer substrate. From the surface under the following conditions (rear surface exposure), and then peeling and developing to form an adhesive resin layer (thickness of about 5 μm) on the insulating layer to form three types of wiring pattern layer transfer plates A1 and A2. , A3
I got

(Thermo-compression condition) Pressure: 0.45 kgf / cm ² Temperature: 100 ° C. (Exposure condition) Contact exposure machine: P-20 manufactured by Dainippon Screen Mfg. Co., Ltd.
2-G Vacuuming: 60 seconds Exposure time: 30 counts (6) Fabrication of multilayer printed wiring board (corresponding to FIG. 5) For a wiring pattern layer fabricated in (5) above on a polyimide film substrate having a thickness of 25 μm. The original plate A1 for transfer was thermocompression bonded under the following conditions to transfer the first wiring pattern layer composed of a conductive layer, an insulating layer and an adhesive resin layer.

(Thermo-compression condition) Pressure: 10 kgf / cm ² Temperature: 100 ° C. Next, on the film substrate on which the first wiring pattern layer is formed, the wiring pattern prepared in (5) above The transfer master A2 for layers was subjected to thermocompression bonding under the same conditions as above to transfer the second wiring pattern layer composed of the conductive layer, the insulating layer and the adhesive resin layer.

Similarly, on the film substrate on which the second wiring pattern layer was formed, the transfer pattern master A3 for wiring pattern layer prepared in (5) above was thermocompression bonded under the same conditions as above. As a result, a third wiring pattern layer including a conductive layer, an insulating layer and an adhesive resin layer was transferred.

Next, the adhesive resin layer was cured under the conditions of 180 ° C. for 30 minutes to prepare a multilayer printed wiring board of the present invention having three wiring pattern layers as shown in FIG.

[0091]

As described in detail above, according to the present invention, the wiring pattern layer provided on the transparent transfer substrate is transferred onto the substrate, so that the conductive layer is formed on the upper side and the insulating layer and the resin layer are formed on the lower side. It is possible to form a wiring pattern layer provided with a wiring pattern layer having a conductive layer on the upper side and an insulating resin layer on the lower side in multiple layers on the substrate. This multilayer formation forms a predetermined wiring pattern layer. Since it is a parallel serial process in which a plurality of transfer substrates are manufactured in parallel and sequentially transferred using these transfer substrates, defective products can be eliminated by inspection before transfer, and the manufacturing yield is improved, and The throughput is high, and the plating and photoetching steps for forming and patterning the wiring layer, which have been conventionally performed on the substrate, are unnecessary, and the manufacturing process can be simplified.

When the above-mentioned wiring pattern layer is formed on the transparent transfer substrate to prepare a wiring pattern layer transfer plate,
Since the adhesive photosensitive resin layer or the adhesive insulating photosensitive resin layer formed on the transparent transfer substrate is exposed using the conductive layer as a mask by irradiating light from the back surface of the transparent transfer substrate, it is possible to perform exposure from the upper side of the conventional transfer substrate. No mask alignment is required in the exposure, and the apparatus and process can be simplified.
Furthermore, since a film having an adhesive photosensitive resin layer or a film having an adhesive insulating photosensitive resin layer is used in the manufacturing process, so-called dry processing becomes possible,
Greatly improve the efficiency of the manufacturing process.

Further, the multilayer printed wiring board does not have a wiring pattern covering with an insulating layer as seen in the conventional multilayer printed wiring board, and the conductive layers constituting each wiring pattern layer are partially always bare. It is possible to easily connect the wiring pattern layers to each other at the intersections of the wiring pattern layers or the portions where the wiring pattern layers are close to each other, and a multilayer printed wiring board with extremely high versatility is possible. Becomes

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention.

FIG. 2 is a diagram illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 3 is a schematic cross-sectional view showing an example of a wiring pattern layer transfer plate used in the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 4 is a schematic cross-sectional view showing an example of a wiring pattern layer transfer plate used in the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 6 is a perspective view showing an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 7 is a perspective view showing the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 8 is a schematic cross-sectional view showing another example of the multilayer printed wiring board of the present invention.

FIG. 9 is a drawing for explaining another example of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 10 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 11 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 12 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 13 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 14 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 15 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 16 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 17 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 18 is a diagram for explaining a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 19 is a perspective view showing a state in which connections are sequentially formed in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 20 is a diagram for explaining a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

[Explanation of symbols]

1, 40 ... Multilayer printed wiring board 2, 42 ... Substrate 3, 4, 5, 43, 44, 45 ... Wiring pattern layer 3a, 4a, 5a, 43a, 44a, 45a ... Conductive layer 3b, 4b, 5b ... Insulation Layers 3c, 4c, 5c ... Resin layers 43b, 44b, 45b ... Insulating resin layers 10, 20, 30, 50 ... Wiring pattern layer transfer plate 11, 51 ... Transparent transfer substrate 11a, 51a ... Transparent conductive film 13, 23, 33 , 53 ... Wiring pattern layer 16, 56 ... Film 17, 57 ... Support 18 ... Adhesive photosensitive resin layer 58 ... Adhesive insulating photosensitive resin layer 19 ... Resin layer 59 ... Insulating resin layer 61, 62, 63, 64, 65 , 66, 67, 68, 7
0, 81, 91 ... Joint

Claims (7)

[Claims] 1. A substrate, a plurality of wiring pattern layers sequentially transferred onto the substrate, the wiring pattern layer having a conductive layer and an insulating layer and a resin layer below the conductive layer in this order. ,
A multilayer printed wiring board, wherein the resin layer is formed by curing an adhesive photosensitive resin. 2. A substrate, a plurality of wiring pattern layers sequentially transferred onto the substrate, the wiring pattern layer having a conductive layer and an insulating resin layer formed under the conductive layer, The insulating resin layer is formed by curing an adhesive insulating photosensitive resin, and is a multilayer printed wiring board. 3. The wiring pattern layers are connected to each other at necessary portions such as a portion where the wiring pattern layers intersect with each other and / or a portion where the wiring pattern layers are close to each other. Multilayer printed wiring board. 4. A pattern made of an insulating material is formed on a transparent transfer substrate having a conductive surface at least, and a conductive layer is formed on a portion where the pattern is not formed by a plating method, and the conductive layer is further formed. An insulating layer is formed on the transparent transfer substrate, and then a film having a negative adhesive photosensitive resin layer on a support is laminated on the surface of the transparent transfer substrate so that the adhesive photosensitive resin layer is in contact with the insulating layer. After pressure-bonding, irradiating light from the back surface of the transparent transfer substrate to expose the adhesive photosensitive resin layer using the conductive layer as a mask, the support is peeled off to form a resin layer on the insulating layer. A plurality of wiring pattern layer transfer plates provided with a wiring pattern layer having the conductive layer, the insulating layer and the resin layer, and then the resin layer on one surface of the substrate for a multilayer printed wiring board. Through the distribution Crimping the line pattern layer transfer plate,
A method for manufacturing a multilayer printed wiring board, wherein the operation of transferring the wiring pattern layer by peeling off the transparent transfer substrate is sequentially repeated to form a plurality of the wiring pattern layers on the substrate. 5. The method for manufacturing a multilayer printed wiring board according to claim 4, wherein the insulating layer is formed by any one of an electrodeposition method, an electrolytic polymerization method, and a photolithography method. 6. A transparent transfer substrate having a conductive surface at least a surface of which a pattern made of an insulating material is formed, and a conductive layer is formed on a portion where the pattern is not formed by a plating method. A film having a negative-type adhesive insulating photosensitive resin layer on a support is superposed on the surface so that the adhesive insulating photosensitive resin layer is in contact with the conductive layer and pressure-bonded, and light is applied from the back surface of the transparent transfer substrate. After exposing the adhesive insulating photosensitive resin layer using the conductive layer as a mask, to form an insulating resin layer on the conductive layer by peeling the support, the conductive layer and the A plurality of wiring pattern layer transfer plates provided with a wiring pattern layer having an insulating resin layer are produced, and then the wiring pattern layer transfer plate is provided on one surface of a substrate for a multilayer printed wiring board via the insulating resin layer. Crimp the front The operation of transferring the wiring pattern layer by peeling off the transparent transfer substrate is sequentially repeated,
A method for manufacturing a multilayer printed wiring board, comprising forming a plurality of the wiring pattern layers on the substrate. 7. A bonding portion is formed at a necessary portion of a portion where the wiring pattern layers intersect with each other and / or a portion where the wiring pattern layers are close to each other so as to extend between the conductive layers forming the wiring pattern layers. 7. The method for manufacturing a multilayer printed wiring board according to claim 4, wherein the wiring pattern layers are connected to each other by forming a portion.