JPH08307054A - Multilayer printed wiring board and its manufacture - Google Patents

Abstract

PURPOSE: To enhance the density of wiring patterns and reduce the inductance of wiring by placing an insulating resin layer between an upper layer and a lower layer where multiple wiring pattern layers are crossed to each other or superposed on one another. CONSTITUTION: A multilayer printed board 1 includes a first wiring pattern layer 3, a second wiring pattern layer 5, and a third wiring pattern layer 7 that are formed on a substrate 2. An insulating layer 4, 6 is formed between an upper wiring pattern layer and a lower wiring pattern layer in areas where the wiring pattern layers 3, 5, 7 are crossed to each other or superposed on one another. The insulating layers 4, 6 are formed only under the wiring patterns 5, 7. The conductive layers 3a, 5a, 7a in the wiring pattern layers 3, 5, 7 are partly exposed. This makes it easy connect wiring pattern layers together in areas where they are crossed to each other, or in a position where they are close to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board and a method for manufacturing the same, and more particularly to a multilayer printed wiring board having a high-definition pattern, and such a multilayer printed wiring board can be manufactured at low cost. It relates to a manufacturing method.

[0002]

2. Description of the Related Art Due to the rapid development of semiconductor technology, downsizing of semiconductor packages, increase in pin count, fine pitch,
With the rapid miniaturization of electronic components, we have entered the era of so-called high-density mounting. Along with that, printed wiring boards are being further multilayered and thinned from single-sided wiring to double-sided wiring.

At present, a subtractive method and an additive method are mainly used for forming a copper pattern on a printed wiring board.

The subtractive method is a method in which a hole is formed in a copper-clad laminate, copper is plated on the inside and the surface of the hole, and a pattern is formed by photoetching. This subtractive method is technically high in perfection and low in cost, but it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil.

On the other hand, in the additive method, a resist is formed on a portion other than a circuit pattern forming portion on a laminated plate containing a catalyst for electroless plating, and a circuit is formed on the exposed portion of the laminated plate by electroless copper plating or the like. This is a method of forming a pattern. Although this additive method can form a fine pattern, it is difficult in terms of cost and reliability.

In the case of a multi-layer substrate, a method of pressure laminating a single-sided or double-sided printed wiring board produced by the above method or the like together with a semi-cured prepreg obtained by impregnating glass cloth with an epoxy resin or the like is preferred. It is used. in this case,
The prepreg plays the role of an adhesive for each layer, and the layers are connected by forming through holes and performing electroless plating or the like inside.

Further, due to the progress of high-density mounting, thin and lightweight multi-layer boards are required, and on the other hand, high wiring capability per unit area is required.
Ingenuity has been made in the connection between layers and the mounting method of parts.

[0008]

However, the production of a multilayer substrate using the double-sided printed wiring board produced by the subtractive method described above requires the precision of drilling for forming holes in the double-sided printed wiring board and the There is a limit to the densification from the viewpoint of the limit of materialization, and it was difficult to reduce the manufacturing cost.

On the other hand, in recent years, in order to satisfy the above requirements, a multilayer wiring board manufactured by sequentially laminating a conductor pattern layer and an insulating layer on a base material has been developed. Since this multilayer wiring board is manufactured by alternately performing photoetching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at arbitrary positions are possible.

However, in this method, copper plating and photo-etching are alternately performed a plurality of times, which complicates the process. Further, since a serial process of stacking one layer on a substrate causes trouble in the intermediate process, Reproduction became difficult, which hindered reduction of manufacturing costs.

Further, in the conventional multi-layer wiring board, since the interlayer connection is made by forming via holes, a complicated photolithography process is required, which hinders the reduction of manufacturing cost. In addition, the via hole is more likely to be broken due to the effect of thermal expansion of the resin as the total thickness of the substrate is increased, leading to a decrease in reliability.

The present invention has been made in view of the above circumstances, and has an electric characteristic that has a high-definition pattern and that the wirings can intersect or overlap each other to reduce the inductance of the wirings. It is an object of the present invention to provide a multilayer printed wiring board having excellent properties and a method for manufacturing the multilayer printed wiring board capable of manufacturing such a multilayer printed wiring board by a transfer lamination method onto a substrate.

[0013]

In order to achieve such an object, a first invention of a multilayer printed wiring board according to the present invention comprises a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate. , The wiring pattern layer has a conductive layer and an adhesive layer formed under the conductive layer, and has an insulating resin layer between the upper and lower wiring pattern layers at a portion where the wiring pattern layers intersect with each other or overlap each other in multiple layers. It was configured like this.

The second aspect of the multilayer printed wiring board of the present invention
The invention of claim 1 is provided with a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate, the wiring pattern layer has a conductive layer, and upper and lower wirings are provided at portions where the wiring pattern layers intersect each other or overlap each other in multiple layers. The structure was such that an insulating resin layer was provided between the pattern layers.

The first invention of the method for producing a multilayer printed wiring board according to the present invention is to provide a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate. Step 1 of preparing a plurality of transfer original plates, and transferring the wiring pattern layer by pressing the desired transfer original plate onto one surface of a substrate for a multilayer printed wiring board and peeling off the conductive substrate. Step 2, and an insulating photosensitive resin layer is formed on the substrate so as to cover the wiring pattern layer, and the desired transfer original plate is pressure-bonded onto the insulating photosensitive resin layer to peel off the conductive substrate. The wiring pattern layer is transferred by doing so, and then the operation of exposing and developing the insulating photosensitive resin layer using the transferred wiring pattern layer as a mask is repeated to form a plurality of the wiring pattern layers on the substrate. Stacking process When was the like have configure.

A second invention of the method for manufacturing a multilayer printed wiring board according to the present invention is to provide a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate. Step 1 of preparing a plurality of transfer original plates, and transferring the wiring pattern layer by pressing the desired transfer original plate onto one surface of a substrate for a multilayer printed wiring board and peeling off the conductive substrate. And the step of forming an insulating resin layer on the substrate so as to cover the wiring pattern layer, press-bonding the desired transfer original plate onto the insulating resin layer, and peeling off the conductive substrate. Transfer the wiring pattern layer,
After that, the operation of etching the insulating resin layer using the transferred wiring pattern layer as a mask is repeated to stack a plurality of the wiring pattern layers on the substrate 3.
And is configured to have.

A third invention of the method for manufacturing a multilayer printed wiring board according to the present invention comprises a step 1 of preparing a plurality of transfer original plates having a wiring pattern layer made of a conductive layer on a conductive substrate. By forming an adhesive insulating photosensitive resin layer on one surface of a substrate for a multilayer printed wiring board, pressing the desired transfer original plate on the adhesive insulating photosensitive resin layer, and peeling off the conductive substrate. Transferring the wiring pattern layer, then,
Repeating the operation of exposing and developing the adhesive insulating photosensitive resin layer using the transferred wiring pattern layer as a mask,
Step 2 of stacking a plurality of the wiring pattern layers on the substrate is adopted.

A fourth invention of the method for manufacturing a multilayer printed wiring board according to the present invention is a wiring pattern layer having a conductive layer on a conductive substrate and an adhesive layer laminated on the conductive layer. Step 1 of preparing a plurality of transfer masters provided with the wiring pattern layer by pressing the desired transfer master onto one surface of a substrate for a multilayer printed wiring board and peeling off the conductive substrate. Step 2 of transferring the conductive pattern, and an insulating photosensitive resin layer is formed on the substrate so as to cover the wiring pattern layer, and the desired transfer original plate is pressure-bonded onto the insulating photosensitive resin layer to press the conductive substrate. A step 3 of repeating the operation of transferring the wiring pattern layer by peeling off the wiring pattern layer to stack a plurality of the wiring pattern layers on the substrate;
And Step 4 of exposing and developing the insulating photosensitive resin layer using the wiring pattern layer transferred in Step 3 as a mask.

The fifth invention of the method for producing a multilayer printed wiring board according to the present invention is a wiring pattern layer having a conductive layer on a conductive substrate and an adhesive layer laminated on the conductive layer. Step 1 of preparing a plurality of transfer masters provided with the wiring pattern layer by pressing the desired transfer master onto one surface of a substrate for a multilayer printed wiring board and peeling off the conductive substrate. And a step of transferring an insulating resin layer on the substrate so as to cover the wiring pattern layer, press the desired transfer original plate on the insulating resin layer, and peel off the conductive substrate. The step 3 of stacking a plurality of the wiring pattern layers on the substrate by repeating the operation of transferring the wiring pattern layer by the step 3, the step 2 and the step 3
Step 4 of etching the insulating resin layer using the wiring pattern layer transferred in step 1 as a mask.

Further, the sixth invention of the method for producing a multilayer printed wiring board according to the present invention is a step 1 of producing a plurality of transfer original plates having a wiring pattern layer made of a conductive layer on a conductive substrate. And an adhesive insulating photosensitive resin layer is formed on one surface of a substrate for a multilayer printed wiring board, and the desired transfer original plate is pressure-bonded onto the adhesive insulating photosensitive resin layer to peel off the conductive substrate. By repeating the operation of transferring the wiring pattern layer to stack a plurality of the wiring pattern layers on the substrate, and the adhesive insulating photosensitive resin using the wiring pattern layer transferred in the step 2 as a mask. And a step 3 of exposing and developing the layer.

According to the present invention, the wiring pattern layer laminated on the substrate is provided with a conductive layer, and an insulating resin layer exists between the upper and lower wiring pattern layers at a portion where the wiring pattern layers intersect with each other. Insulation is maintained between the pattern layers, and the wiring pattern layers are laminated by sequentially transferring the wiring pattern layers on the transfer master onto the substrate, and the insulating resin layer is patterned by masking the wiring pattern layers. Since the exposure / development is performed, the complicated alignment process is significantly reduced, and the manufacturing process of the multilayer wiring board can be simplified. In addition, it is possible to design the wirings so that they intersect or overlap each other in multiple layers, whereby the inductance of the wirings can be reduced.

[0022]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an example of the multilayer printed wiring board of the present invention. In FIG. 1, a multilayer printed wiring board 1 is laminated with a substrate 2, a first wiring pattern layer 3 provided on the substrate 2, and an insulating resin layer 4 on the wiring pattern layer 3. A multilayer printed wiring board having a three-layer structure including a second wiring pattern layer 5 and a third wiring pattern layer 7 further laminated on the wiring pattern layer 5 with an insulating resin layer 6 interposed therebetween. is there.

The wiring pattern layers 3, 5 and 7 which constitute the multilayer printed wiring board 1 are made of conductive layers 3a and 5 respectively.
a, 7a and the adhesive layer 3 formed under the conductive layer
b, 5b, 7b. The multilayer printed wiring board 1 has an overprint type structure in which the wiring pattern layers 3, 5 and 7 are sequentially transferred and laminated on the substrate 2 or on the lower wiring pattern layer via the insulating resin layer. Yes, at the portion where each wiring pattern layer intersects (intersection),
Insulation between the upper and lower wiring pattern layers is maintained by the insulating resin layers 4 and 6. The insulating resin layers 4 and 6 are formed by exposing and developing the insulating photosensitive resin layer using the wiring pattern layers 5 and 7 as a mask as described later, or the insulating resin layers using the wiring pattern layers 5 and 7 as a mask. It is formed by etching the layers, and the insulating resin layers 4 and 6 exist only below the wiring pattern layers 5 and 7. Therefore, the multilayer printed wiring board 1 of the present invention does not have a wiring pattern covering with an insulating layer as seen in the conventional multilayer printed wiring board, and the conductive layers 3a,
5a and 7a are always exposed partially, and as will be described later, it is easy to connect the wiring pattern layers to each other at the intersections of the wiring pattern layers or the portions (proximity portions) where the wiring pattern layers are close to each other. Can be done.

The substrate 2 constituting the multilayer printed wiring board 1 of the present invention is a substrate known as a substrate for a multilayer printed wiring board, such as a glass epoxy substrate, a polyimide substrate, an alumina ceramic substrate, or a glass epoxy / polyimide composite substrate. Can be used. The thickness of this substrate 2 is 5 to 1
It is preferably in the range of 000 μm.

The thickness of each of the wiring pattern layers 3, 5 and 7 is set to 100 μm or less, preferably 10 to 60 μm so that the wiring pattern layer as a lower layer can be overridden without defects in the layered transfer as described later. In addition, the conductive layers 3a, 5a, 7a that form the wiring pattern layers 3, 5, 7
Has a thickness of 1 μm or more, preferably 5 to 40 μm in order to keep the electric resistance of the wiring pattern layer low. Further, the thickness of the adhesive layers 3b, 5b, 7b is set in the range of 3 to 40 μm. The line width of such wiring pattern layers 3, 5, and 7 can be arbitrarily set up to a minimum width of about 10 μm.

The material of the conductive layers 3a, 5a, 7a is not particularly limited as long as it can form a thin film by the electrodeposition method as described later, and for example, copper, silver, gold, nickel, chromium, zinc. , Tin, platinum or the like can be used.

The materials of the adhesive layers 3b, 5b and 7b are
Any electrodepositable adhesive material that exhibits tackiness at room temperature or heating may be used. For example, as the polymer to be used, anionic or cationic synthetic polymer resin having adhesiveness can be mentioned.

Specifically, as the anionic synthetic polymer resin, an acrylic resin, a polyester resin, a maleated oil resin, a polybutadiene resin, an epoxy resin, a polyamide resin, a polyimide resin or the like may be used alone, or any of these resins may be used. Can be used as a mixture of Further, the above-mentioned anionic synthetic polymer resin may be used in combination with a crosslinkable resin such as melamine resin, phenol resin and urethane resin.

As the cationic synthetic polymer resin,
Acrylic resin, epoxy resin, urethane resin, polybutadiene resin, polyamide resin, polyimide resin and the like can be used alone or as a mixture of any combination thereof. Further, the above-mentioned cationic synthetic polymer resin may be used in combination with a crosslinkable resin such as polyester resin and urethane resin.

If necessary, a tackifying resin such as a rosin-based resin, a terpene-based resin, or a petroleum resin-based resin can be added in order to impart tackiness to the polymer resin.

The above-mentioned polymer resin is subjected to the electrodeposition method in a state in which it is solubilized in water by being neutralized with an alkaline or acidic substance or in a water-dispersed state in the production method of the present invention described later. That is, the anionic synthetic polymer resin is neutralized with amines such as trimethylamine, diethylamine, dimethylethanolamine and diisopropanolamine, and inorganic alkali such as ammonia and caustic potash. Also,
The cationic synthetic polymer resin is neutralized with an acid such as acetic acid, formic acid, propionic acid and lactic acid. The polymer resin neutralized and solubilized in water is used in a state of being diluted with water as a water dispersion type or a dissolution type.

For the purpose of enhancing the reliability of the above-mentioned adhesive material such as insulation and heat resistance, a known thermosetting resin having a thermopolymerizable unsaturated bond such as blocked isocyanate is added to the above polymer resin. Then, after transferring and forming all layers of the multilayer printed wiring board, all adhesive layers may be cured by heat treatment. Of course, in addition to the thermosetting resin, if a resin having a polymerizable unsaturated bond (eg acrylic group, vinyl group, allyl group, etc.) is added to the adhesive material, all layers of the multilayer printed wiring board will be transferred. After formation, all adhesive layers can be cured by electron beam irradiation.

As the material for the adhesive layer, in addition to the above-mentioned materials, not only a thermoplastic resin but also a thermosetting resin may be used so long as it exhibits tackiness at room temperature or heating. It may be an adhesive resin. Further, it may contain an organic or inorganic filler in order to enhance the strength of the coating film.

The material of the adhesive layers 3b, 5b and 7b is
It may be an electrodeposition adhesive that exhibits fluidity at room temperature or by heating.

Further, as the insulating resin for forming the insulating resin layers 4 and 6, novolac resin, polyimide resin or the like can be used. On the other hand, examples of the insulating photosensitive resin for forming the insulating resin layers 4 and 6 include novolac resin, polyimide resin, and the like, and quinonediazide-based, nitrobenzylsulfonic acid ester-based, dihydropyridine-based, and the like as substances that accelerate dissolution by light irradiation. And the like. Further, as the insulating photosensitive resin, a novolac resin, a polyimide resin or the like having a substituent in the resin that promotes dissolution by light irradiation can also be used.

The thickness of the insulating photosensitive resin or the insulating resin layer formed of the insulating resin depends on the insulating photosensitive resin or insulating resin used, but insulation between the upper and lower wiring pattern layers is maintained at the intersection. Therefore, and in order to prevent the defect of overcoming the wiring pattern layer of the lower layer,
The range is 1 μm or more, preferably 3 to 10 μm. Further, a known thermosetting resin having a thermopolymerizable unsaturated bond such as blocked isocyanate is added to the above-mentioned insulating photosensitive resin, and after transferring and forming each layer of the multilayer printed wiring board, the insulating resin layer is cured by heat treatment. be able to. Of course,
In addition to the thermosetting resin, if a resin having a polymerizable unsaturated bond (eg acrylic group, vinyl group, allyl group, etc.) is added to the insulating photosensitive resin, each layer of the multilayer printed wiring board is transferred and formed. After that, the insulating resin layer can be cured by electron beam irradiation.

Next, the manufacturing method of the multilayer printed wiring board of the present invention will be described with reference to FIGS. 2 to 6 by taking the above-mentioned multilayer printed wiring board 1 as an example.

First, a transfer original plate for manufacturing the multilayer printed wiring board 1 is prepared. In this method, a photoresist is applied to a conductive substrate 11 as a transfer substrate to form a photoresist layer 12 (FIG. 2A), and the photoresist layer 12 is exposed to light and developed using a predetermined photomask. Then, the insulating layer 12 'is formed to expose the wiring pattern portion 11a of the conductive substrate 11 (FIG. 2B). Next, the conductive layer 14 is formed on the wiring pattern portion 11a of the conductive substrate 11 by a plating method (FIG. 2C). After that, the adhesive layer 15 is formed over the conductive layer 14 by an electrodeposition method (FIG. 2D). As a result, the transfer pattern original plate 10 for the wiring pattern layer, in which the first wiring pattern layer 13 having the conductive layer 14 and the adhesive layer 15 is provided, is obtained. Similarly,
As shown in FIGS. 3 and 4, the conductive substrates 21, 3
Wiring pattern layers 23, 3 having insulating layers 22 ', 32', conductive layers 24, 34, and adhesive layers 25, 35 on 1
Transfer master 2 for the second wiring pattern layer provided with 3
0, a transfer original plate 30 for the third wiring pattern layer is prepared.

Conductive substrates 11 and 2 of the above-mentioned transfer original plate
As 1,1, at least the surface may have conductivity, aluminum, copper, nickel, iron, stainless steel, a conductive metal plate such as titanium, or a glass plate, polyester, polycarbonate, polyimide, polyethylene, It is possible to use an insulating substrate such as a resin film made of acrylic or the like having a conductive thin film formed on the surface thereof. The thickness of such conductive substrates 11, 21, 31 is preferably about 0.05 to 1.0 mm. Further, in order to improve printing durability as an original plate, a thin film of chromium (Cr), ceramic Kanigen (Ni + P + SiC manufactured by Kanigen) may be formed on the surface of the conductive substrate. The thickness of this thin film is preferably about 0.1 to 1.0 μm.

Next, the transfer original plate 10 for the wiring pattern layer is pressure-bonded onto the substrate 2 so that the adhesive layer 15 contacts the substrate 2. This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. Further, when the adhesive layer 15 exhibits tackiness or adhesiveness by heating, thermocompression bonding can be performed. afterwards,
The conductive substrate 11 is peeled off to form the wiring pattern layer 13 on the substrate 2
By transferring to the top and curing the adhesive layer 15, the first wiring pattern layer 3 having the conductive layer 3a and the adhesive layer 3b is formed on the substrate 2 (FIG. 5A).

After that, an insulating photosensitive resin layer 4'or an insulating resin layer 4'is formed on the substrate 2 so as to cover the first wiring pattern layer 3 (FIG. 5 (B)). Similarly, after the transfer master 20 for the second wiring pattern layer is used on the resin layer 4 ′ or the insulating resin layer 4 ′ to perform alignment with the first wiring pattern layer, Is transferred to form the second wiring pattern layer 5 having the conductive layer 5a and the adhesive layer 5b (FIG. 5).
(C)). Next, by using the wiring pattern layer 5 as a mask, the insulating photosensitive resin layer 4 ′ is exposed and developed, or the insulating resin layer 4 ′ is etched, so that the insulating resin layer 4 is provided only below the wiring pattern layer 5. Then, the insulating resin layer 4 and the adhesive layer 5b are cured (FIG. 5D).

Next, an insulating photosensitive resin layer 6'or an insulating resin layer 6'is formed on the substrate 2 so as to cover the second wiring pattern layer 5 (FIG. 6 (A)). The wiring pattern layer is transferred to the resin layer 6'or the insulating resin layer 6'in the same manner using the third transfer pattern layer transfer master 30, and the wiring pattern layer is transferred to the conductive layer 7a. A third wiring pattern layer 7 having the layer 7b is formed (FIG. 6B). Next, by using the wiring pattern layer 7 as a mask, the insulating photosensitive resin layer 6 ′ is exposed and developed, or the insulating resin layer 6 ′ is etched, so that the insulating resin layer 6 is provided only below the wiring pattern layer 7. And the insulating resin layer 6 and the adhesive layer 7b are cured (see FIG. 6).
(C)).

As described above, each wiring pattern layer 3, 5,
7 is a transfer master 10 or 2 for a wiring pattern layer.
Since the wiring pattern layers 0, 30 are sequentially transferred onto the substrate, the multilayer printed wiring board 1 has a so-called overprint type structure composed of the respective wiring pattern layers 3, 5, 7. is there.

In the transfer of the first wiring pattern layer 3, an insulating photosensitive resin layer is previously formed on the substrate 2, and the first wiring pattern layer is formed on the insulating photosensitive resin layer. 3 may be performed, and then the insulating photosensitive resin layer may be exposed and developed using the wiring pattern layer 3 as a mask to form the insulating resin layer only below the wiring pattern layer 3.

In the transfer of the first wiring pattern layer 3, an insulating resin layer is previously formed on the substrate 2,
The wiring pattern layer 3 of the first layer is transferred onto this insulating resin layer, and then the insulating resin layer is etched using this wiring pattern layer 3 as a mask, so that the insulating resin layer is provided only below the wiring pattern layer 3. May be formed.

In the above-mentioned example, the transfer original plates 10, 20, 30 for the wiring pattern layer are composed of an insulating layer made of a photoresist, a conductive layer, and an adhesive layer formed on the conductive layer. However, the transfer original plate 10 for the first wiring pattern layer may not have the adhesive layer 15. In this case, if the adhesive layer is provided on the substrate 2 in advance, the first wiring pattern layer can be transferred onto the substrate 2.

Next, another embodiment of the multilayer printed wiring board of the present invention will be described. FIG. 7 is a schematic sectional view showing another example of the multilayer printed wiring board of the present invention. In FIG. 7, the multilayer printed wiring board 41 includes a substrate 42 and a substrate 42.
A first wiring pattern layer 44 provided on top of the insulating resin layer 43, and a second wiring pattern layer 46 stacked on the wiring pattern layer 44 via an insulating resin layer 45. A multilayer printed wiring board having a three-layer structure further including a third wiring pattern layer 48 laminated on the wiring pattern layer 46 with an insulating resin layer 47 interposed therebetween.

Each of the wiring pattern layers 44, 46, 48 constituting the multilayer printed wiring board 41 is made of a conductive layer, and is sequentially transferred onto the substrate 42 or a lower wiring pattern layer via an insulating resin layer. In the laminated overprint type structure, the insulation between the upper and lower wiring pattern layers is maintained by the insulating resin layers 45 and 47 at the portions (intersections) where the respective wiring pattern layers intersect with each other. This insulating resin layer 43,
45 and 47 are wiring pattern layers 44 and 4 as described later.
Exposing the adhesive insulating photosensitive resin layer using 6, 48 as a mask,
The wiring pattern layer 44, which is formed by development,
Insulating resin layers 43, 45, 47 are present only below 46, 48. Therefore, the multilayer printed wiring board 41 of the present embodiment also does not have the wiring pattern covered by the insulating layer as seen in the conventional multilayer printed wiring board, and the wiring pattern layers 44, 46 and 48 are always partially bare. As described later, the wiring pattern layers can be easily connected to each other at the intersections of the wiring pattern layers or the portions (proximity portions) where the wiring pattern layers are close to each other.

The substrate 42 constituting the above-mentioned multilayer printed wiring board 41 can be the same as the substrate 2 of the above-mentioned multilayer printed wiring board 1, and the description thereof is omitted here.

The thickness of each of the wiring pattern layers 44, 46 and 48 is 1 μm or more in order to overcome the defect of the lower wiring pattern layer in the laminated transfer as will be described later and to keep the electric resistance of the wiring pattern layer low. Preferably 5
˜40 μm. Such a wiring pattern layer 4
The line width of 4, 46 and 48 can be arbitrarily set up to a minimum width of about 10 μm.

The material of the conductive layers constituting the wiring pattern layers 44, 46, 48 is the above-mentioned conductive layers 3a, 5a, 7a.
The same materials as those mentioned above can be mentioned.

Further, the adhesive insulating photosensitive resin for forming the insulating resin layers 43, 45, 47 may be any insulating photosensitive resin which exhibits adhesiveness at room temperature or by heating. For example, as the polymer to be used, anionic or cationic synthetic polymer resin having adhesiveness can be mentioned.

Specifically, as the anionic synthetic polymer resin, acrylic resin, polyester resin, maleated oil resin, polybutadiene resin, epoxy resin, polyamide resin, polyimide resin or the like may be used alone, or any of these resins may be used. Can be used as a mixture of Further, the above-mentioned anionic synthetic polymer resin may be used in combination with a crosslinkable resin such as melamine resin, phenol resin and urethane resin.

As the cationic synthetic polymer resin,
Acrylic resin, epoxy resin, urethane resin, polybutadiene resin, polyamide resin, polyimide resin and the like can be used alone or as a mixture of any combination thereof. Further, the above-mentioned cationic synthetic polymer resin may be used in combination with a crosslinkable resin such as polyester resin and urethane resin.

If necessary, a tackifying resin such as a rosin-based resin, a terpene-based resin, or a petroleum resin-based resin may be added to impart tackiness to the polymer resin.

For the purpose of enhancing the reliability of the above-mentioned adhesive insulating photosensitive resin such as insulation and heat resistance, the above-mentioned polymer resin is a known thermosetting resin having a thermopolymerizable unsaturated bond such as blocked isocyanate. After the resin is added and each layer of the multilayer printed wiring board is transferred and formed, the insulating resin layer can be cured by heat treatment. Of course, besides thermosetting resin,
If a resin having a polymerizable unsaturated bond (eg, acrylic group, vinyl group, allyl group, etc.) is added to the insulating photosensitive resin, each layer of the multilayer printed wiring board is transferred and formed, and then the insulating resin is irradiated by electron beam irradiation. The layer can be cured.

The thickness of the insulating resin layer formed by curing the adhesive insulating photosensitive resin depends on the insulating photosensitive resin used, but in order to maintain the insulation between the upper and lower wiring pattern layers at the intersection, and the lower layer. 1 μm or more, preferably 3 to 1 in order to prevent a defect from overcoming the wiring pattern layer of
The range is 0 μm.

Next, another embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention will be described with reference to FIGS. 7 to 10 by taking the above-mentioned multilayer printed wiring board 41 as an example.

First, a transfer original plate for manufacturing the multilayer printed wiring board 41 is prepared. A photoresist is applied on a conductive substrate 51 as a transfer substrate to form a photoresist layer, and the photoresist layer is contact-exposed and developed using a predetermined photomask to form an insulating layer 52. A transfer pattern master 50 for a wiring pattern layer is obtained in which a conductive layer is formed on the exposed portion by a plating method to provide a first wiring pattern layer 53 (FIG. 8A). Similarly, the transfer original plate 60 for the second wiring pattern layer, in which the wiring pattern layers 63 and 73 made of conductive layers are provided on the conductive substrates 61 and 71, and the wiring pattern layer for the third layer An original plate 70 for transfer is prepared (FIGS. 8B and 8C).

Next, an adhesive insulating photosensitive resin layer 43 'is formed on the substrate 42 (FIG. 9A), and the transfer original plate for the wiring pattern layer is formed on the adhesive insulating photosensitive resin layer 43'. 5
0 is pressure-bonded so that the wiring pattern layer 53 contacts. This pressure bonding may be performed by any method such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding. Further, when the adhesive insulating photosensitive resin layer 43 'exhibits adhesiveness or adhesiveness by heating, thermocompression bonding can be performed. After that, the conductive substrate 51 is peeled off and the wiring pattern layer 53 is transferred onto the substrate 2 (FIG. 9B), and the adhesive insulating photosensitive resin layer 43 'is exposed and developed using the wiring pattern layer 53 as a mask. As a result, the insulating resin layer 43 is formed only below the wiring pattern layer 53, and the insulating resin layer 43 is cured. As a result, the first wiring pattern layer 44 made of a conductive layer is formed on the substrate 42 via the insulating resin layer 43 (FIG. 9C).

After that, an adhesive insulating photosensitive resin layer 45 'is formed on the substrate 42 so as to cover the first wiring pattern layer 44 (FIG. 9D), and this adhesive insulating photosensitive resin layer 45 is formed.
′ Is aligned with the wiring pattern layer of the first layer by using the transfer original plate 60 for the wiring pattern layer of the second layer, and then the wiring pattern layer is transferred in the same manner as described above. Then, the second wiring pattern layer 63 is transferred (FIG. 9E). Next, the adhesive insulating photosensitive resin layer 45 ′ is exposed and developed by using the wiring pattern layer 63 as a mask to form the insulating resin layer 45 only below the wiring pattern layer 63, and the insulating resin layer 45 is cured. To do. As a result, the second wiring pattern layer 4 made of a conductive layer is formed.
6 is formed on the substrate 42 through the insulating resin layer 45 (FIG. 10A).

Next, an adhesive insulating photosensitive resin layer 47 'is formed on the substrate 42 so as to cover the second wiring pattern layer 46 (FIG. 10B), and this adhesive insulating photosensitive resin layer 4 is formed.
A transfer master plate 70 for the third wiring pattern layer is formed on 7 '.
Similarly, the wiring pattern layer is transferred by using, and the third wiring pattern layer 73 made of a conductive layer is transferred (FIG. 10C). Next, using the wiring pattern layer 73 as a mask, the adhesive insulating photosensitive resin layer 47 '
Is exposed and developed to form an insulating resin layer 47 only below the wiring pattern layer 73.
To cure. As a result, the third wiring pattern layer 48 made of a conductive layer is provided on the substrate 42 via the insulating resin layer 47.
It is formed on top (FIG. 10D).

As described above, each wiring pattern layer 44, 4
The lamination of 6, 48 is a transfer master 5 for the wiring pattern layer.
Since the wiring pattern layers 53, 63, 73 of 0, 60, 70 are sequentially transferred onto the substrate through the adhesive insulating photosensitive resin layer, the multilayer printed wiring board 41 has the wiring pattern layers 44, 46, It is a so-called overprint type structure composed of 48.

In any of the above-described methods for producing a multilayer printed wiring board of the present invention, the insulating photosensitive resin layer or the adhesive insulating photosensitive resin layer is exposed to light each time each wiring pattern layer is formed,
Although the development is performed or the insulating resin layer is etched, in the method for producing a multilayer printed wiring board of the present invention, exposure, development or etching may be performed at the final stage. For example, as shown in FIG.
The first wiring pattern layer 3 including the conductive layer 3a and the adhesive layer 3b, the insulating photosensitive resin layer 4 '(or the insulating resin layer 4'), the conductive layer 5a and the adhesive layer 5b Two
Wiring pattern layer 5, insulating photosensitive resin layer 6 '(or insulating resin layer 6'), conductive layer 7a and adhesive layer 7b
The third wiring pattern layer 7 is sequentially laminated, and finally the insulating photosensitive resin layer 4'and the insulating photosensitive resin layer 6'are collectively exposed (using the wiring pattern layers 3, 5, and 7 as masks). Alternatively, the insulating resin layer 4'and the insulating resin layer 6'are collectively etched). Thereby, as shown in FIG. 11B, it is possible to form a multilayer printed wiring board 1 ′ in which the insulating resin layers 4 and 6 exist only below the wiring pattern layers 3, 5 and 7.

FIG. 12 shows a multilayer printed wiring board 1 according to the present invention.
FIG. 3 is a perspective view showing an intersecting portion where wiring pattern layers configuring the above intersect. As shown in FIG. 12, the insulating resin layer 4 is provided between the wiring pattern layer 3 and the wiring pattern layer 5 at the intersection.
Since there is a (hatched portion), the insulation of both wiring pattern layers intersecting with each other is maintained, and the insulating resin layer 4 exists only below the wiring pattern layer 5. The conductive layers 3a, 5a of layers 3, 5 are always exposed.

Further, the multilayer printed wiring board of the present invention may have not only the wirings in which the upper and lower wiring pattern layers intersect as described above, but also a multi-layered overlapping portion. FIG. 13 is a perspective view showing a portion in which the wiring pattern layers forming the multilayer printed wiring board 1 of the present invention overlap each other in multiple layers. Wiring pattern layers 3, 5 as shown in FIG.
And the wiring pattern layer 3, as shown in FIG.
By providing the overlap of 5, the wiring distance can be shortened, and the inductance of the wiring can be reduced by appropriately designing the signal wiring, the GND wiring, the power wiring, and the like.

The portions where the wiring pattern layers intersect or the portions where the wiring pattern layers overlap each other may be formed in the multilayer printed wiring board 41 shown in FIG. 7 or the multilayer printed wiring board 1'shown in FIG. Of course.

Further, FIG. 14 is a perspective view showing a portion where the wiring pattern layers constituting the multilayer printed wiring board 7 of the present invention are close to each other. As shown in FIG. 14, the wiring pattern layer 44 and the wiring pattern layer 46 are close to each other in the proximity portion, and the insulating resin layers 43 and 45 (hatched portions) are below the wiring pattern layer 44 and the wiring pattern layer 46, respectively. The wiring pattern layers 44 and 46 are always exposed.

In the multilayer printed wiring board according to the present invention, since each wiring pattern layer is exposed at the intersection or the proximity of the wiring pattern layers as described above, it is possible to easily connect the wiring pattern layers. You can

Then, the connection between the wiring pattern layers constituting the multilayer printed wiring board of the present invention will be described below.

FIGS. 15 to 19 are perspective views showing the connection state of the intersections of the wiring pattern layers of the multilayer printed wiring board 1. In FIG. 15, the joint portion 81 is formed and connected to the through hole formed in the upper wiring pattern layer 5. In addition, in FIG. 16, a joint portion 82 is formed at a part of the intersection to form the conductive layer 3 a of the wiring pattern layer 3 and the wiring pattern layer 5.
Is connected to the conductive layer 5a. Furthermore, FIG.
Reference numeral 7 shows a joint portion 83 formed so as to cover the intersection of the wiring pattern layer 3 and the wiring pattern layer 5. In addition, FIG. 18 shows a wiring pattern layer 44 and a wiring pattern layer 46 which are connected to each other by forming a bonding portion 84 so as to extend over a part of the proximity portion, and FIG. 19 shows a wiring pattern layer 44 and a wiring pattern. The connection portion 85 is formed and connected so as to cover the portion close to the layer 46.

As a connection by forming a joint at the intersection or the proximity of each wiring pattern layer as described above,
(1) printing method, (2) dispensing method, (3) ultra fine particle spraying method, (4) laser drawing method, (5) selective electroless plating method,
(6) Selective vapor deposition method, (7) Welding joining method and the like.

The connection of the crossing portions or the proximity portions of the wiring pattern layers of the multilayer printed wiring board 1 by the printing method of the above (1) is made by printing so as to extend between the conductive layers constituting each wiring pattern layer. This is performed by fixing a conductive paste or solder to form a joint. The printing method used is not particularly limited, but screen printing, which is generally suitable for thick film printing and widely used in the electronic industry, is preferable. When performing screen printing, create a screen printing plate that has openings in the areas corresponding to the connections between wires in advance, place it in position on the multilayer wiring board, and place a conductive paste such as silver paste. Just print the ink.

Further, the connection at the intersection or the proximity of the wiring pattern layers of the multilayer printed wiring board 1 by the dispensing method of the above (2) is similar to the above-mentioned printing method, but the conductive ink is finely divided. This is performed by ejecting from a nozzle and directly drawing and forming a joint between wirings. Specifically, a dispenser having a needle-shaped ejection port, which is generally used for attaching a small amount of an adhesive or the like to a required place, can be used. Further, depending on the viscosity of the conductive ink used, an inkjet method used in an output device such as a computer can also be used.

In the ultrafine particle spraying method of the above (3), the ultrafine particles are carried by being carried on a high-speed air flow, and sprayed onto the multilayer printed wiring board from a fine nozzle provided close to the multilayer printed wiring board. A method of forming a film by sintering the ultrafine particles and the multilayer printed wiring board with each other by collision energy, and a method called a gas deposition method can be used. The apparatus used in this method is basically composed of two vacuum tanks of high vacuum and low vacuum, and a connecting pipe connecting each vacuum tank. The ultrafine particles are formed by a vacuum evaporation method in a low vacuum tank into which argon gas or the like is introduced, and the substrate is placed in a high vacuum tank. The connection pipe has an opening in the vicinity of the ultra-fine particles generated in the low vacuum tank and in the vicinity of the multilayer printed wiring board in the high vacuum tank and in a direction orthogonal to the wiring board. There is. Since each vacuum tank is kept at a constant pressure by the vacuum exhaust system, a high-speed air flow (gas flow) from the low vacuum tank to the high vacuum tank in the connecting pipe due to the pressure difference between the vacuum tanks. The ultrafine particles generated and generated in the low vacuum tank are carried on this air stream and conveyed to the high vacuum tank side, and collide with the wiring pattern layer of the multilayer printed wiring board to be sintered to form a film. By using this method with a metal such as gold, silver, copper or nickel as a base material, it is possible to selectively form a conductor (joint portion) at a place where a connection between wirings is required.

In the laser drawing method of the above (4), a solution in which conductive fine particles are dispersed is applied to a multilayer printed wiring board, and a desired portion of this coating film is heated by a laser to decompose or decompose the resin binder. It is vaporized and removed, and conductive fine particles are deposited and aggregated at the heated portions to selectively form a conductor. As the solution, a conductive resin fine particle such as gold or silver dispersed in a polyester resin, an acrylic resin, or the like is used, and a fine line of about several tens of μm can be drawn by irradiating with squeezing an argon laser or the like.

As the selective electroless plating method (5), a selective electroless plating technique generally known as a photoforming method can be used. This technique is capable of reducing and forming a photosensitizer layer containing a metal in an oxidized state serving as a catalyst for electroless plating on a multilayer printed wiring board, and selectively exposing the photosensitizer layer, In the electroless plating, metal particles serving as a catalyst are deposited and then immersed in an electroless plating solution to selectively plate only the exposed portion.

The selective vapor deposition method (6) uses a selective film deposition technique which is one of thin film forming techniques. That is, a metal, an organometallic gas containing a conductive element such as carbon, or an organic substance vapor containing a conductive element is introduced into the vacuum chamber, and the above gas or the above gas is applied to the surface of the multilayer printed wiring board installed in the vacuum chamber. The vapor is adsorbed, and then the laser or ion beam is condensed or converged to irradiate the substrate, and the gas or vapor adsorbed on the portion is decomposed by heat or collision energy to generate metal,
A conductive material such as carbon is deposited on the multilayer printed wiring board. Such a selective vapor deposition method has been put to practical use as a wiring correction technique for LSI. Specifically, with a focused argon laser, chromium, cobalt, platinum,
A technique for decomposing an organometallic gas containing tungsten and depositing these metals at a desired correction position, or a technique for decomposing a vapor of an organic material such as pyrene by an ion beam of gallium to deposit a carbon film is proposed. Can be used.

Further, in the welding joining method of the above (7), the intersecting portion of the wiring pattern layers is selectively heated by a laser, and the insulating resin layer (upper layer is formed between the conductive layers of the upper and lower wiring pattern layers is formed. Insulating resin layer) is melted and evaporated, and
By heating the conductive layer itself to a high temperature, the conductive layers forming the respective wiring pattern layers are fused to each other to form a joint portion and connect them.

Further, the wiring pattern layers constituting the multilayer printed wiring board of the present invention are connected to each other by (8) wire bonding method and (9) wire bonding apparatus.
Shot method, (10) laser plating method, (11) batch transfer method of laminated body of conductor and solder plating, (12) metal lump insertion method, (13) electroless plating method and the like can be performed.
The wire bonding method of (8) above can be performed by, for example, the method shown in FIG.
As shown in Fig. 5, the non-conductive proximity portions of the wiring pattern layers 3 and 5 (the same can be dealt with at the intersection portion).
Is wire-bonded using a wire-bonding device, and the conductive layers 3a and 5a are connected by a wire bridge 86.

The one-shot method using the wire bonding apparatus of the above (9) is, for example, as shown in FIG. 21, the wiring pattern layers 3 and 5 can be similarly dealt with in the proximity portion (intersection portion) which is not electrically connected. 1) is bonded for one shot (once) using a wire bonding device, and the conductive layers 3a and 5a are connected by a bonding block (pad) 87 in a state without a bridge.

In the laser plating method of the above (10), for example, the predetermined spot diameter, the power on the irradiation surface, etc. were adjusted while the multilayer printed wiring board before the connection operation was immersed in the palladium plating solution. This is a method of irradiating a laser (for example, an argon laser) at a proximity portion or a crossing portion to be conducted for a predetermined time, and depositing a Pd film at a predetermined thickness on the irradiation portion and connecting the same. It is preferable to irradiate the laser while circulating the palladium plating solution. In addition, the plating solution is removed by washing with water, and
The conductive film 3a and 5a are connected by the plated film 88 deposited as shown in FIG.

The collective transfer method of the laminated body of the conductor and the solder plating of the above (11) is performed as shown in FIGS. 23 (A) and 23 (B). First, as shown in FIG. 23 (B), a laminated body 90 of a conductor layer 91 and a solder plating layer 92 is manufactured by the following procedure. That is, on the conductive substrate 95,
A conductive layer 91 is formed by, for example, electrolytic plating on a transfer substrate which is developed using a resist method to form a desired pattern (conductive pattern), and a predetermined solder plating bath composition is formed on the conductive layer. Solder plating is performed using a material to form the solder plating layer 92. The solder plating layer 92 can be formed in the same manner by solder printing, screen printing of solder paste, or dipping. As shown in FIG. 23A, the laminated body 90 laminated in this way is collectively thermally transferred to the non-conducting proximity portions of the wiring pattern layers 3 and 5 (which can also be dealt with at the intersection portion). , The conductive layers 3a and 5a are connected. At this time, the thermal transfer temperature is 200 to which the solder plating layer 92 can be melted and deformed.
It is performed in a temperature range of about 300 ° C.

The above method (12) for inserting a metal lump is shown in FIG.
As shown in (A), for example, a diameter of 30 to 1 is set in the wiring gap in the non-conducting proximity portion of the wiring pattern layers 3 and 5.
A metal ball 101 of about 00 μm is arranged, and then,
As shown in FIG. 24 (B), a sheet 102 coated with a pressure-sensitive adhesive is pressure-bonded from above, and the conductive layers 3a and 5a are connected. The use of metal balls is a more preferable mode of use, but metal balls (lumps) that are not spherical can also be used. Further, such a metal ball (lump) can also be used to further improve the reliability of the connection portion in the printing method and the dispensing method. That is, the above-mentioned printing or dispensing is performed after the metal balls are installed.

FIG. 25 shows the electroless plating method of (13) above.
A description will be given based on (A) to (F). First of all,
An electroless plating catalyst is applied to the entire surface of a multilayer printed wiring board having wiring pattern layers 3 and 5 as shown in FIG. 5 (A) to form a catalyst layer 111 (FIG. 25 (B)). Next, a photoresist is applied on this to form a photoresist, and then the resist layers 113, 113 are contact-exposed and developed using a predetermined photomask to form a portion H corresponding to a position where the wiring pattern is to be connected. Expose (Fig. 25
(C)). Then, after activating this exposed portion H,
Conductive layer 3a is formed by electroless plating to form the connecting portion 115.
And 5a are connected (FIG. 25 (D)). After that, the remaining unnecessary resist and the catalyst layer are sequentially removed to leave only the connection portion 115 (catalyst layer 111a) (FIG. 25).
(E)).

The multilayer printed wiring board of the present invention has been described above.
By using the connection method such as (2) to (13), it is possible to connect between the wiring pattern layers at any place without being restricted by the place where the through hole is formed. The degree of freedom in changing the circuit design is greater than that of the conventional multilayer printed wiring board.

In the above example, the multilayer printed wiring board 1,
Although each of 1'and 41 has a three-layer structure, the method for manufacturing a multilayer printed wiring board according to the present invention provides a multilayer printed wiring board having a desired number of wiring pattern layers by repeating the same layer transfer. It can be manufactured.

In the multilayer printed wiring board of the present invention, for example, the multilayer printed wiring board 1 having the above-mentioned three-layer structure is pressure laminated together with a semi-cured prepreg obtained by impregnating glass cloth with an epoxy resin. In this case, the number of layers can be increased.

Furthermore, the multi-layer printed wiring board of the present invention having a two-layer structure has a problem in the conventional double-sided printed wiring board, that is, high density due to the precision of the drilling process for forming holes in the double-sided printed wiring board. Can solve the problem. This is because, as described above, in the multilayer printed wiring board of the present invention, the conductive layer of each wiring pattern layer is always partially exposed, and the intersection of the wiring pattern layers without forming a through hole, or This is because it is possible to easily connect the wiring pattern layers to each other in the proximity portion.

[0091]

EXAMPLES Next, the present invention will be described in more detail by showing examples. Example 1 (1) Preparation of Insulating Photosensitive Resin Liquid for Insulating Resin Layer 4.04 g of 4,4 ′ diaminophenyl ether (hereinafter abbreviated as DDE) and 6.38 g of dimethyl ester of pyromellitic acid dichloride N-methylpyrrolidone (Hereafter, NM
(Abbreviated as P) dissolved in 95 g of sodium carbonate 8.
6 g was added and reacted at room temperature for 6 hours.

After completion of the reaction, this solution was put into 1 liter of water, and the precipitate was separated by filtration and dried to obtain 8.06 g of resin powder. 3 g of the obtained resin powder was redissolved in 17 g of NMP,
A polyamic acid ester solution having a solid content of 15% by weight was prepared.

On the other hand, 4.00 g of DDE and 4.23 g of pyromellitic dianhydride were dissolved in 47 g of NMP, and the mixture was stirred at room temperature for 6 hours.
The reaction was carried out for a time to obtain a polyamic acid solution. 2 g of this polyamic acid solution was mixed with 18 g of the above polyamic acid ester solution to prepare a polyamic acid ester / polyamic acid mixed solution having a solid content of 15% by weight.

To this mixed solution, 1,2-naphthoquinone-2 of 2,3,4,4'-tetrahydroxybenzophenone was added.
-3 mol substitution compound of diazide-5-sulfonic acid 0.9
0 g was added, the mixture was stirred at room temperature for 3 hours, and then filtered through a 1.0 μm filter to prepare a desired liquid. (2) Preparation of Electrodeposition Solution for Adhesive Layer 13.2 parts by weight of butyl acrylate, 1.6 parts by weight of methyl methacrylate, 0.2 parts by weight of divinylbenzene and 85 parts by weight of 1% aqueous solution of potassium persulfate were mixed. , 80 ℃,
Polymerization was carried out for 5 hours to carry out emulsion-free emulsion polymerization to prepare a polybutyl acrylate / polymethyl methacrylate copolymer emulsion solution.

Next, 65 parts by weight of this emulsion solution,
2 parts by weight of an acrylic copolymer resin having a carboxyl group as an electrodeposition carrier, 0.85 parts by weight of hexamethoxymelamine, 0.35 parts by weight of trimethylamine as a neutralizing agent,
3 parts by weight of ethanol, 3 parts by weight of butyl cellosolve and 18.8 parts by weight of water were mixed and stirred to prepare an anion-type electrodeposition liquid for an adhesive layer. (3) Formation of conductive layer in transfer original plate (see FIG. 2)
(Compatible with (C))) As a conductive substrate, a 0.2 mm thick stainless plate with a polished surface is prepared, and a commercially available photoresist for plating (PMER P-AR9 manufactured by Tokyo Ohka Kogyo Co., Ltd.) is provided on the stainless plate.
00) to a thickness of 10 μm and dried, and contact exposure is performed using each of the three types of photomasks on which wiring patterns are formed, followed by development, washing with water and drying, and then heat curing to form an insulating layer. The prepared transfer original plates (3 types) were prepared.

With the above-mentioned transfer original plate and the platinum electrode facing each other, a copper pyrophosphate plating bath having the following composition (pH = 8, liquid temperature = 5)
5 ° C.), the platinum electrode was connected to the anode of the DC power supply, and the above-mentioned transfer substrate was connected to the cathode, and the current density was 5 A at 5 A / dm ² .
A current was supplied for 5 minutes to form a 10 μm-thick copper plating film on the bare portion of the conductive substrate which was not covered with the photoresist, to form a conductive layer. This conductive layer formation was carried out on three kinds of transfer original plates.

(Composition of copper pyrophosphate plating bath) Copper pyrophosphate: 94 g / l Potassium pyrophosphate: 340 g / l Ammonia water: 3 cc / l (4) Formation of an adhesive layer on the original plate for transfer (FIG. 2 (D))
Correspondence)) Each of the three types of transfer original plates on which the conductive layer is formed in (3) above and the platinum electrode are opposed to each other and immersed in the electrodeposition liquid A for the adhesive layer prepared in (2) above, Connect the transfer master to the anode of the DC power source and the platinum electrode to the cathode, and perform electrodeposition at a voltage of 50 V for 1 minute, and dry and heat this at 150 ° C for 30 minutes to obtain a thick layer on the conductive layer. A transfer master A for forming three types of wiring pattern layers by forming an adhesive layer having a thickness of 20 μm
It was set to 1, A2, and A3. (5) Preparation of multi-layer printed wiring board (corresponding to FIG. 5 and FIG. 6) The original plate A1 for transfer for wiring pattern layer prepared in (4) above was pressure-bonded on a polyimide film substrate having a thickness of 25 μm under the following conditions. Then, the first wiring pattern layer consisting of the conductive layer and the adhesive layer is transferred, and then 180
The adhesive layer was cured under the condition of 30 ° C. for 30 minutes to complete the formation of the first wiring pattern layer.

(Crimping condition) Pressure: 10 kgf / cm² Temperature: 80 ° C Next, the film on which the first wiring pattern layer is formed
The insulating photosensitive resin liquid prepared in (1) above is applied on the substrate.
Apply by spin coating method and dry (80 ℃, (60 minutes)
Then, an insulating photosensitive resin layer having a thickness of 12 μm was formed. That
Then, on the insulating photosensitive resin layer, in (4) above.
The transfer master A2 for the wiring pattern layer thus prepared is
Second layer wiring consisting of conductive layer and adhesive layer
The pattern layer was transferred.

(Pressure Bonding Conditions) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Then, the insulating photosensitive resin layer is exposed under the following conditions using the transferred second wiring pattern layer as a mask, and the immersion method is used. After that, the insulating photosensitive resin layer and the adhesive layer were cured under the conditions of 250 ° C. and 30 minutes to complete the formation of the second wiring pattern layer.

(Exposure Conditions) Contact exposure machine: P-20 manufactured by Dainippon Screen Mfg. Co., Ltd.
2-G Vacuum drawing: 60 seconds Exposure time: 600 counts Similarly, the insulating photosensitive resin liquid prepared in the above (1) was spin-coated on the film substrate on which the second wiring pattern layer was formed. And dried (80 ° C., 60 minutes) to form an insulating photosensitive resin layer having a thickness of 12 μm.
Then, on the insulating photosensitive resin layer, the transfer master A3 for the wiring pattern layer prepared in the above (4) is pressure bonded under the same pressure conditions as the transfer master A2 and bonded to the conductive layer. The third wiring pattern layer consisting of layers was transferred.

Next, using the transferred third wiring pattern layer as a mask, the insulating photosensitive resin layer is exposed under the above conditions and developed by a dipping method, and then at 250 ° C. for 3 minutes.
The insulating photosensitive resin layer and the adhesive layer were cured under the condition of 0 minutes to complete the formation of the third wiring pattern layer.

As described above, the multilayer printed wiring board of the present invention having the three wiring pattern layers was produced. Example 2 First, original plates A1, A2, and A3 for transfer were produced in the same manner as in (2), (3), and (4) of Example 1.

Next, on the 25 μm-thick polyimide film substrate, the transfer original plate A1 for the wiring pattern layer was prepared.
A pressure-sensitive adhesive layer under the following conditions to form a conductive layer and an adhesive layer.
Transfer the wiring pattern layer of the second layer, and then 180 ° C, 3
The adhesive layer was cured under the condition of 0 minutes to complete the formation of the first wiring pattern layer.

(Pressing condition) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Next, a polyimide coating solution (Semicofine manufactured by Toray Industries, Inc.) was placed on the film substrate on which the first wiring pattern layer was formed. SP-341) was applied by a spin coating method and dried (110 ° C. for 5 minutes on a hot plate) to form an insulating resin layer having a thickness of 5 μm.

Then, onto the insulating resin layer, the transfer master A2 for wiring pattern layer thus produced was pressure-bonded under the following conditions to transfer the second wiring pattern layer consisting of a conductive layer and an adhesive layer. .

(Pressing condition) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Then, the insulating resin layer was weakly alkaline developing solution (Tokyo Ohka Kogyo Co., Ltd.) using the transferred second wiring pattern layer as a mask. Etching with NMD-3), and further, the insulating resin layer and the adhesive layer were cured in a nitrogen atmosphere at 350 ° C. for 30 minutes to complete the formation of the second wiring pattern layer.

Similarly, a polyimide coating solution (Semicofine SP-341 manufactured by Toray Industries, Inc.) was applied onto a film substrate having a second wiring pattern layer formed thereon by spin coating and dried (on a hot plate). At 110
Then, the insulating resin layer having a thickness of 10 μm was formed.

Thereafter, the transfer master A3 for the wiring pattern layer thus prepared was transferred onto the insulating resin layer.
The third wiring pattern layer including the conductive layer and the adhesive layer was transferred by pressure bonding under the same pressure bonding conditions as in No. 2.

Next, using the transferred third wiring pattern layer as a mask, the insulating resin layer was etched with a weak alkaline developing solution (NMD-3 manufactured by Tokyo Ohka Kogyo Co., Ltd.), and further 350 ° C. in a nitrogen atmosphere. The insulating resin layer and the adhesive layer were cured under the condition of 30 minutes to complete the formation of the third wiring pattern layer.

As described above, the multilayer printed wiring board of the present invention having the three wiring pattern layers was produced. Example 3 (1) Preparation of adhesive insulating photosensitive resin liquid for insulating resin layer 75 parts by weight of methyl methacrylate, Aronix M11
10 parts by weight of 3 (manufactured by Toagosei Kagaku Co., Ltd.) and 0.5 parts by weight of azobisisobutyronitrile were heated and stirred in the reaction solution at 70 ° C., and 50 parts by weight of ethyl acetate was added dropwise over about 2 hours. Hold for 2 hours. Next, a solution prepared by dissolving 2 parts by weight of azobisisobutyronitrile in 25 parts by weight of ethyl acetate was added dropwise to this solution over about 3 hours, and a holding reaction was further performed for 3 hours. Then, it heated at 140 degreeC and solvent-removed and obtained the acrylic copolymer.

The acrylic copolymer obtained as described above was mixed and stirred with the insulating photosensitive resin solution prepared in Example 1 to prepare an adhesive insulating photosensitive resin solution. (2) Formation of Conductive Layer in Original Plate for Transfer (corresponding to FIG. 8) As a conductive substrate, a stainless plate having a thickness of 0.2 mm prepared by polishing the surface is prepared, and a commercially available photoresist for plating is placed on the stainless plate. (PMER P-AR9 manufactured by Tokyo Ohka Kogyo Co., Ltd.
00) to a thickness of 10 μm and dried, and contact exposure is performed using each of the three types of photomasks on which wiring patterns are formed, followed by development, washing with water and drying, and then heat curing to form an insulating layer. The prepared transfer original plates (3 types) were prepared.

The transfer original plate and the platinum electrode were opposed to each other and immersed in a copper pyrophosphate plating bath (pH = 8, liquid temperature = 55 ° C.) having the same composition as that used in Example 1, and a DC power source was used. A platinum electrode was connected to the anode, and the above transfer substrate was connected to the cathode, and electricity was applied for 5 minutes at a current density of 10 A / dm ² , and a 10 μm-thick copper plating was applied to the bare portion of the conductive substrate not covered with photoresist. A film was formed and used as a conductive layer. This conductive layer formation was carried out on three kinds of transfer original plates to obtain three kinds of transfer original plates B1, B2, B3 for wiring pattern layers. (3) Fabrication of multilayer printed wiring board (FIGS. 9 and 10)
Correspondence) A polyimide film substrate having a thickness of 25 μm was coated with the adhesive insulating photosensitive resin liquid prepared in (1) above by a spin coating method and dried (80 ° C., 30 minutes) to give a thickness of 10
A μm adhesive insulating photosensitive resin layer was formed. Thereafter, the transfer original plate B1 for a wiring pattern layer prepared in the above (2) was pressure-bonded onto the insulating photosensitive resin layer under the following conditions to form a first wiring pattern layer made of a conductive layer. It was transcribed.

(Pressure bonding conditions) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Then, the adhesive insulating photosensitive resin layer is exposed under the following conditions using the transferred first wiring pattern layer as a mask, and immersed. Then, the adhesive insulating photosensitive resin layer was cured at 150 ° C. for 30 minutes to complete the formation of the first wiring pattern layer.

(Exposure Conditions) Contact exposure machine: P-20 manufactured by Dainippon Screen Mfg. Co., Ltd.
2-G Vacuum drawing: 60 seconds Exposure time: 30 count Next, the adhesive insulating photosensitive resin liquid prepared in (1) above was spin-coated on the film substrate on which the first wiring pattern layer was formed. Method and then dried (80 ° C., 30 minutes) to form an adhesive insulating photosensitive resin layer having a thickness of 10 μm. Then, the transfer printing plate B2 for wiring pattern layer prepared in the above (2) was pressure-bonded onto the adhesive insulating photosensitive resin layer under the same conditions as the first layer to form a second layer made of a conductive layer. The wiring pattern layer was transferred.

Next, using the transferred second wiring pattern layer as a mask, the adhesive insulating photosensitive resin layer is exposed under the same conditions as the first layer and developed by the dipping method.
The adhesive insulating photosensitive resin layer was cured under the conditions of 150 ° C. for 30 minutes to complete the formation of the second wiring pattern layer.

Similarly, the adhesive insulating photosensitive resin solution prepared in the above (1) was applied onto the film substrate on which the second wiring pattern layer was formed by spin coating and dried (80 ° C., 30 ° C.). Then, an adhesive insulating photosensitive resin layer having a thickness of 10 μm was formed. After that, the transfer original plate B3 for wiring pattern layer prepared in the above (2) was pressure-bonded onto the adhesive insulating photosensitive resin layer under the same conditions as the first layer to form a third layer composed of a conductive layer. The wiring pattern layer was transferred.

Next, using the transferred third wiring pattern layer as a mask, the adhesive insulating photosensitive resin layer is exposed under the same conditions as the first layer, and developed by the dipping method.
The adhesive insulating photosensitive resin layer was cured at 150 ° C. for 30 minutes to complete the formation of the third wiring pattern layer.

As described above, the multilayer printed wiring board of the present invention having the three wiring pattern layers was produced. Example 4 First, in the same manner as (3) and (4) of Example 1, 3
Transfer original plates C1, C2, and C3 for seed wiring pattern layers were prepared.

Next, a transfer pattern master C1 for a wiring pattern layer was pressure-bonded on a polyimide film substrate having a thickness of 25 μm under the following conditions to form a first wiring pattern layer consisting of a conductive layer and an adhesive layer. It was transcribed.

(Pressing condition) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Next, the insulating photosensitive resin liquid prepared in Example 1 was placed on the film substrate on which the first wiring pattern layer was transferred. It was applied by spin coating and dried (80 ° C., 30 minutes) to form an insulating photosensitive resin layer having a thickness of 12 μm. After that, the transfer original plate C2 for wiring pattern layer was pressure-bonded onto the insulating photosensitive resin layer under the following conditions to transfer the second wiring pattern layer including the conductive layer and the adhesive layer.

(Pressure bonding conditions) Pressure: 10 kgf / cm ² Temperature: 80 ° C. Further, the insulating photosensitive resin liquid prepared in Example 1 was placed on the film substrate on which the second wiring pattern layer was transferred. It was applied by spin coating and dried (80 ° C., 30 minutes) to form an insulating photosensitive resin layer having a thickness of 12 μm. Thereafter, the transfer original plate C3 for the wiring pattern layer is pressure-bonded onto the insulating photosensitive resin layer under the same pressure conditions as those of the transfer original plate C2 to form a third layer including a conductive layer and an adhesive layer. The eye wiring pattern layer was transferred.

Then, using the transferred first to third wiring pattern layers as masks, the insulating photosensitive resin layer is exposed under the following conditions and developed by a dipping method, and then at 250 ° C. The insulating photosensitive resin layer and the adhesive layer were cured under the condition of 30 minutes.

(Exposure Conditions) Contact exposure machine: P-20 manufactured by Dainippon Screen Mfg. Co., Ltd.
2-G Vacuuming: 60 seconds Exposure time: 700 counts or more By the above, the multilayer printed wiring board of the present invention provided with three wiring pattern layers was produced. Example 5 (Connection by Printing Method) A conductive paste ink was prepared by using a screen printing plate having openings corresponding to the intersections of the wiring pattern layers of the multilayer printed wiring board prepared in Example 1. Print (Silvest P-225 manufactured by Tokuriki Kagaku Kenkyusho),
After drying, the continuity between each wiring pattern layer was confirmed. Example 6 (Connection by Dispense Method) The multilayer printed wiring board produced in Example 1 was manufactured by
Automatic coating device (XYD 4550 manufactured by Iinuma Gauge Co., Ltd.
ZC2-2 type), a needle (needle-shaped ejection port) with an inner diameter of 0.2 mm connected to a dispenser is moved to the intersection of each wiring pattern layer, and a conductive paste ink (Tokuriki Chemical Laboratory) Silvest P-225) was sprayed and applied in a small amount on the intersection, and after drying, conduction between the wiring pattern layers was confirmed. Example 7 (Connection by Ultrafine Particle Spraying Method) Two vacuum chambers each independently equipped with an exhaust pump were connected with a stainless connection pipe having a diameter of 2 mm having a stop valve at the center, and each valve was closed. The inside of the vacuum chamber was evacuated to 500 Torr while introducing 2 × 10 ^-3 Torr (high vacuum chamber) into one and argon gas into the other.
(Low vacuum tank). Then, the multilayer printed wiring board prepared in Example 1 was installed in the high vacuum chamber. In this high vacuum chamber, the tip portion (tip diameter = 80 μm) of the above connection pipe was aligned with the intersection of each wiring pattern layer of the multilayer printed wiring board and was perpendicular to the wiring board. Further, in the low vacuum tank, gold was charged into a resistance heating type evaporation source, and one opening end of the connection pipe was positioned about 2 cm above the evaporation source.

Next, the resistance heating type evaporation source is energized to start the evaporation of gold, and fine gold particles are sprayed from the tip of the connection pipe in the high vacuum chamber to the intersection of the wiring pattern layers, and the diameter is applied to the intersection. About 1 μm of 100 μm thick 30 μm thick gold film (joint)
It was formed in seconds and the continuity between each wiring pattern layer was confirmed. Example 8 (Connection by Laser Drawing Method) A fine particle dispersion solution having the following composition was applied on the multilayer printed wiring board prepared in Example 1 by spin coating and dried to form a coating film. (Composition of fine particle dispersion solution) Gold fine particles (prepared by gas evaporation method, diameter of about 0.1 μm) 30 parts by weight Polyester resin (Vylon 200 manufactured by Toyobo Co., Ltd.) 2 parts by weight Toluene 50 parts by weight -Methyl ethyl ketone ... 50 parts by weight Next, the spot diameter is 100 μm, and the power on the irradiation surface is 1
An argon laser adjusted to W was applied to the intersection of each wiring pattern layer of the multilayer printed wiring board for about 3 ms to evaporate and remove the polyester resin in the coating film to form a gold thin film on the intersection. Then, the solvent (toluene: methylethylketone = 1: 1 mixed solvent) was used to dissolve and remove the coating film in the unirradiated portion, and after washing and drying, conduction between the wiring pattern layers was confirmed. Example 9 (Connection by Selective Electroless Plating Method) Example 1 in a photosensitive aqueous solution (liquid temperature = 40 ° C.) having the following composition
The multilayer printed wiring board prepared in 1. was dipped and then dried to form a photosensitive layer.

(Composition of Photosensitive Aqueous Solution) Copper acetate: 8 g / l Glycerin: 16 g / l Sorpitol: 110 g / l Pentaerythritol: 10 g / l Next, each wiring pattern layer of the multilayer printed wiring board intersects. A photomask prepared so that only the exposed area is exposed to the above wiring board is exposed and washed with water, and this is immersed in an electroless plating bath (bath temperature = 68 ° C.) of the following composition for 3 hours to leave nothing. After electroplating, washing with water and drying, the continuity between each wiring pattern layer was confirmed.

(Composition of electroless plating bath) Copper sulfate ... 0.03 mol / l Caustic soda ... 0.125 mol / l Sodium cyanide ... 0.0004 mol / l Formalin ... 0.09 mol / l -Ethylenediaminetetraacetic acid sodium ... 0.036 mol / l Example 10 (connection by selective vapor deposition method) The multilayer printed wiring board prepared in Example 1, the evaporation source of pyrene, and the ion source of gallium were placed in a vacuum chamber. It was installed and the vacuum chamber was evacuated to 3 × 10 ⁻⁶ Torr. The gallium ion source was arranged so that the ion beam was incident vertically on the wiring board.

Next, the evaporation source is heated to about 70 ° C. to evaporate pyrene, and a gallium ion beam is applied to the intersection of each wiring pattern layer of the multilayer printed wiring board under the following conditions to deposit a carbon film. I went. As a result, a carbon film having a film thickness of 3 μm could be formed on the intersection, and conduction between the wiring pattern layers was confirmed.

(Ion beam irradiation conditions) ・ Beam accelerating voltage: 20 kV ・ Beam irradiation area: 30 μm □ ・ Irradiation time: 15 minutesExample 11 (Connection by Welding Joining Method) In Example 1, the inside of the container was replaced with argon gas.
Produced multilayer printed wiring board and argon laser
The laser spot diameter is 80 μm.
The power on the irradiated surface was adjusted to 1W. And the multi-layer pre
At the intersection of each wiring pattern layer on the
The upper layer wiring pattern at the intersection
The insulating resin layer between the lower layer and the lower wiring pattern layer is removed by evaporation.
Fuse the conductive layers of each wiring pattern layer to each other and
The continuity between the line pattern layers was confirmed. Example 12 (Connection by Wire Bonding Method) Each wiring of the multilayer printed wiring board manufactured in Example 1
Use a patterned layer to remove these non-conducting neighbors.
Gold wire (diameter 40μ
m) is used for wire bonding and is shown in FIG.
They were connected by a wire bridge as shown in the schematic diagram.
After that, between each wiring pattern wired in this way
Was confirmed to be continuous.Example 13 (One show using wire bonding equipment
Wiring method) Each wiring of the multilayer printed wiring board manufactured in Example 1
Use a patterned layer to remove these non-conducting neighbors.
Using a wire bonding device, use a gold wire (diameter 100
Bonding for 1 shot (1 time)
As shown in the schematic diagram of FIG.
They were connected by forming (pads). After that,
Check the continuity between the wiring patterns that are routed in this way.
I accepted.Example 14 (Connection by Laser Plating Method) In Example 1 in a palladium plating solution having the following composition
The produced multilayer printed wiring board was immersed.

(Palladium plating solution composition) PdCl ₂ 1.7733 g / l Ethylenediamine 5.3 ml / l Thiodiglycolic acid 30 mg / l NaH ₂ PO ₂ H ₂ O 6 6.3594 g / l Pb (CH ₃ COO) ₂ ... ₃ p.pb Next, the spot diameter is 100 μm and the power on the irradiation surface is 1.
The argon laser adjusted to 0 W is irradiated to the intersection which is not conducted for about 90 seconds, and the Pd film is irradiated on the irradiated portion for about 50 seconds.
μm was deposited (FIG. 22). Then, after washing with water and drying, the continuity between the wired wiring patterns was confirmed. Example 15 (Connection of Laminated Body of Conductor and Solder Plating by Batch Transfer Method) First, a laminated body of a conductor layer and a solder plating layer was prepared and prepared according to the following procedure. That is, a conductive layer is formed in the following manner on a transfer substrate on which a desired pattern (conductive pattern) is formed by using a resist method on a conductive substrate, and the following is formed on the conductive layer. Solder plating was performed using the plating bath composition to form a solder plating layer. The solder plating layer can be obtained by solder printing, screen printing of solder paste, or dipping.

In forming the conductor layer, the transfer substrate and the platinum electrode are opposed to each other and immersed in a copper pyrophosphate plating bath (pH = 8.8, liquid temperature = 55 ° C.) having the following composition, and a DC power source is used. Platinum electrode is connected to the anode of the above, and the above-mentioned transfer substrate is connected to the cathode, and the current density is 3 A / dm ² for 2 minutes.
A copper plating film was formed on the conductive pattern (bare portion of the conductive surface) to form a conductor layer (thickness 2.0 μm).

(Composition of copper pyrophosphate plating bath) Copper pyrophosphate: 94 g / l Copper potassium pyrophosphate: 340 g / l Ammonia water: 3 cc / l The solder plating bath composition for forming the solder plating layer is as follows. The composition.

(Plating bath composition) Stannous tin: 40 g / l Lead: 15 g / l Free borofluoric acid: 100 g / l Formalin (37%): 10 ml / l Brightening agent: 60 ml / l Dispersing agent: 40 g / l , The above brightener is 28 in a 2% sodium carbonate solution.
The precipitate obtained by reacting 0 ml of acetaldehyde and 106 ml of O-toluidine at 15 ° C. for 10 days was dissolved in isopropanol to prepare a 20% solution. As the dispersant, polyethylene glycol nonyl phenyl ether, which is a product obtained by adding 15 mol of ethylene oxoid to 1 mol of nolyl alcohol, was used.

When forming the solder plating layer, current was applied at room temperature and a current density of 3 A / dm ² for 3 minutes to form a 5.0 μm thick solder plating layer on the conductor layer of the copper plating film.

Next, using FIG. 23 (A), the non-conductive proximity portion of each wiring pattern layer of the multilayer printed wiring board prepared in Example 1 was formed by using the above-mentioned laminated body of the conductor layer and the solder plating layer. By thermal transfer, the laminate of the conductor layer and the solder plating layer was transferred and connected as shown in FIG.
The thermal transfer temperature was 350 ° C. Then, the continuity between the wiring patterns thus wired was confirmed. Example 16 (Connection by Metal Ingot Insertion Method) Using each wiring pattern layer of the multilayer printed wiring board prepared in Example 1, a metal ball made of Au having a diameter of 50 μm ( Lump) was placed, and the sheet coated with the pressure-sensitive adhesive was pressure-bonded onto the lump to form a connection part. Then, the continuity between the wiring patterns thus wired was confirmed. Example 17 (Connection by Electroless Plating Method) An electroless plating catalyst was applied over the entire surface of the multilayer printed wiring board prepared in Example 1 to form a catalyst layer. Next, a photoresist was applied and formed on this, and then the resist layer was contact-exposed and developed using a predetermined photomask to expose a portion corresponding to a position of the wiring pattern to be connected. After activating this exposed portion, electroless copper plating was performed to form a connection portion. After that, the remaining unnecessary resist and the catalyst layer were sequentially removed, and the continuity between the wired wiring patterns was confirmed.

The composition and operating conditions for the electroless plating catalyst, activation (accelerator) and electroless plating were as follows.

(Electroless plating catalyst) Catalyst: palladium chloride 0.2 g / l stannous chloride 20 g / l concentrated hydrochloric acid 200 ml Operating conditions: room temperature, treatment time 5 minutes (activation (accelerator)) Activator : Sulfuric acid: 150 g / l Operating condition: 50 ° C., treatment time: 5 minutes (composition of electroless plating bath): Copper sulfate: 7 g / l ・ EDTA: 25 g / l ・ Formaldehyde: 50 g / l ・ NaCN: 60 mg / l Operation Conditions: pH = 12.6, bath temperature 70 ° C., treatment time 20 minutes Formed film thickness: 0.5 μm

[0137]

As described above in detail, according to the present invention, the wiring is formed by transferring the conductive layer provided on the transfer original plate or the wiring pattern layer including the conductive layer and the adhesive layer onto the substrate. The pattern layers can be laminated in multiple layers on the substrate. In this multilayer lamination, a plurality of transfer masters each having a predetermined wiring pattern layer formed in parallel are prepared, and the transfer masters are sequentially transferred. Since it is a serial process, defective products can be eliminated by inspection before transfer, manufacturing yield is improved, throughput is high, and there is an insulating resin layer between wiring pattern layers that intersect or overlap each other. Insulation between the wiring pattern layers is maintained, and such an insulating resin layer is formed by exposing and developing the insulating photosensitive resin layer or the adhesive insulating photosensitive resin layer using the wiring pattern layer as a mask. Is performed by etching the insulating resin layer using the wiring pattern layer as a mask, the plating for patterning and patterning the wiring layer and the multiple alignment steps, which were conventionally performed on the substrate, are unnecessary. Therefore, the manufacturing process can be simplified. In addition, the multilayer printed wiring board does not have a wiring pattern covering with an insulating layer as seen in the conventional multilayer printed wiring board, and the conductive layers constituting each wiring pattern layer are always partially exposed. Therefore, the wiring pattern layers can be easily connected to each other at the intersections of the wiring pattern layers or the portions where the wiring pattern layers are close to each other, and a multi-layer printed wiring board having extremely high versatility can be realized. Further, by appropriately designing the wirings, for example, the signal wirings, the GND wirings, and the power supply wirings so as to intersect with each other or overlap with each other as described above, the inductance of the wirings can be reduced, and the multilayer printed wiring having excellent electric characteristics can be obtained. Plates are possible.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention.

FIG. 2 is a drawing for explaining an example of a transfer original plate used in the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 3 is a schematic cross-sectional view showing an example of a transfer original plate used in the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 4 is a schematic cross-sectional view showing an example of a transfer original plate used in the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 5 is a diagram illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 6 is a diagram illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 7 is a schematic cross-sectional view showing another example of the multilayer printed wiring board according to the present invention.

FIG. 8 is a diagram illustrating an example of a transfer original plate used in another example of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 9 is a drawing for explaining another example of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 10 is a drawing for explaining another example of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 11 is a drawing for explaining another example of the method for manufacturing a multilayer printed wiring board according to the present invention.

FIG. 12 is a perspective view showing an intersection of wiring pattern layers in an example of the multilayer printed wiring board according to the present invention.

FIG. 13 is a perspective view showing an intersection of wiring pattern layers in another example of the multilayer printed wiring board according to the present invention.

FIG. 14 is a perspective view showing a proximity portion of a wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 15 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 16 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 17 is a perspective view showing a connection state at an intersection of wiring pattern layers of the multilayer printed wiring board according to the present invention.

FIG. 18 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 19 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 20 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 21 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 22 is a perspective view showing a connection state in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 23 is a diagram for explaining the connection in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 24 is a perspective view showing a state in which connections are sequentially formed in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

FIG. 25 is a diagram for explaining the connection in the vicinity of the wiring pattern layer of the multilayer printed wiring board according to the present invention.

[Explanation of symbols]

1, 1 ', 41 ... Multilayer printed wiring board 2, 42 ... Substrate 3, 5, 7, 44, 46, 48 ... Wiring pattern layer 3a, 5a, 7a ... Conductive layer 3b, 5b, 7b ... Adhesive layer 4, 6, 43, 45, 47 ... Insulating resin layer 4 ', 6' ... Insulating photosensitive resin layer (insulating resin layer) 43 ', 45', 47 '... Adhesive insulating photosensitive resin layer 10, 20, 30, 50, Reference numeral 60, 70 ... Original plate for transfer 11, 21, 31, 51, 61, 71 ... Conductive substrate 81, 82, 83, 84, 85, 86, 87, 88, 9
0, 101, 115 ... Joint

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H05K 3/40 7511-4E H05K 3/20 A // H05K 3/20 H01L 21/90 S

Claims (16)

[Claims] 1. A substrate, a plurality of wiring pattern layers sequentially transferred onto the substrate, the wiring pattern layer having a conductive layer and an adhesive layer formed under the conductive layer, and a wiring pattern. A multilayer printed wiring board having an insulating resin layer between upper and lower wiring pattern layers at a portion where the layers cross each other or overlap each other in multiple layers. 2. The insulating resin layer is formed by curing an insulating photosensitive resin.
The multilayer printed wiring board according to. 3. The multilayer printed wiring board according to claim 1, wherein the insulating resin layer is formed by curing an insulating resin. 4. A substrate, and a plurality of wiring pattern layers sequentially transferred onto the substrate, wherein the wiring pattern layer has a conductive layer, and the wiring pattern layers are provided above and below a portion where they intersect each other or overlap each other in multiple layers. A multilayer printed wiring board having an insulating resin layer between wiring pattern layers. 5. The multilayer printed wiring board according to claim 4, wherein the insulating resin layer is formed by curing an adhesive insulating photosensitive resin. 6. The wiring pattern layers are connected to each other at a required location of an intersection where the wiring pattern layers intersect with each other and / or a proximity where the wiring pattern layers are close to each other. The multilayer printed wiring board according to any one of claims 1 to 5. 7. A step 1 of preparing a plurality of transfer original plates provided with a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate, and a multi-layer printing. Step 2 of transferring the wiring pattern layer by pressure-bonding the desired transfer original plate onto one surface of the wiring board substrate and peeling off the conductive substrate; and the substrate so as to cover the wiring pattern layer. An insulating photosensitive resin layer is formed on the insulating photosensitive resin layer, the desired transfer original plate is pressure-bonded onto the insulating photosensitive resin layer, and the conductive substrate is peeled off to transfer the wiring pattern layer. And a step 3 of stacking a plurality of the wiring pattern layers on the substrate by repeating an operation of exposing and developing the insulating photosensitive resin layer using the wiring pattern layer as a mask. Wiring board Production method. 8. In the step 2, an insulating photosensitive resin layer is previously formed on one surface of the substrate for the multilayer printed wiring board, the wiring pattern layer is transferred, and then the transferred wiring pattern is transferred. The method for manufacturing a multilayer printed wiring board according to claim 7, wherein the insulating photosensitive resin layer is exposed and developed using the layer as a mask. 9. A step 1 of preparing a plurality of transfer original plates provided with a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate, and a multilayer printing. Step 2 of transferring the wiring pattern layer by pressure-bonding the desired transfer original plate onto one surface of the wiring board substrate and peeling off the conductive substrate; and the substrate so as to cover the wiring pattern layer. The wiring pattern layer is transferred by forming an insulating resin layer on the insulating resin layer, pressing the desired transfer original plate onto the insulating resin layer, and peeling off the conductive substrate, and then transferring the transferred wiring pattern. A step 3 of stacking a plurality of the wiring pattern layers on the substrate by repeating an operation of etching the insulating resin layer using the layer as a mask, the method for manufacturing a multilayer printed wiring board. 10. In the step 2, an insulating resin layer is formed in advance on one surface of the substrate for the multilayer printed wiring board, the wiring pattern layer is transferred, and the transferred wiring pattern layer is removed. The method for manufacturing a multilayer printed wiring board according to claim 9, wherein the insulating resin layer is etched as a mask. 11. A step 1 of producing a plurality of transfer original plates having a wiring pattern layer made of a conductive layer on a conductive substrate, and an adhesive insulating photosensitive film on one surface of the substrate for a multilayer printed wiring board. Conductive resin layer is formed, the desired transfer original plate is pressure-bonded onto the adhesive insulating photosensitive resin layer, and the conductive substrate is peeled off to transfer the wiring pattern layer, and then the transferred wiring is transferred. A step 2 of stacking a plurality of the wiring pattern layers on the substrate by repeating an operation of exposing and developing the adhesive insulating photosensitive resin layer using the pattern layer as a mask;
A method for manufacturing a multilayer printed wiring board, comprising: 12. A step 1 of preparing a plurality of transfer original plates provided with a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate, and a multilayer printing. Step 2 of transferring the wiring pattern layer by pressure-bonding the desired transfer original plate onto one surface of the wiring board substrate and peeling off the conductive substrate; and the substrate so as to cover the wiring pattern layer. An insulating photosensitive resin layer is formed on the insulating photosensitive resin layer, the desired transfer original plate is pressure-bonded onto the insulating photosensitive resin layer, and the conductive substrate is peeled off to transfer the wiring pattern layer. Step 3 of stacking a plurality of the wiring pattern layers on a substrate
And exposing the insulating photosensitive resin layer by using the wiring pattern layer transferred in the steps 2 and 3 as a mask.
And a step 4 of developing the multilayer printed wiring board. 13. The multilayer printed wiring board according to claim 12, wherein in step 2, an insulating photosensitive resin layer is formed in advance on one surface of the substrate for the multilayer printed wiring board. Production method. 14. A step 1 of preparing a plurality of types of transfer original plates provided with a wiring pattern layer having a conductive layer and an adhesive layer laminated on the conductive layer on a conductive substrate, and a multi-layer printing. Step 2 of transferring the wiring pattern layer by pressure-bonding the desired transfer original plate onto one surface of the wiring board substrate and peeling off the conductive substrate; and the substrate so as to cover the wiring pattern layer. An insulating resin layer is formed on the insulating resin layer, and the desired transfer original plate is pressure-bonded onto the insulating resin layer to separate the conductive substrate to transfer the wiring pattern layer. A step 3 of stacking the wiring pattern layers, and a step 4 of etching the insulating resin layer using the wiring pattern layers transferred in the steps 2 and 3 as a mask. Manufacturing method of printed wiring board. 15. The method for manufacturing a multilayer printed wiring board according to claim 14, wherein in step 2, an insulating resin layer is formed in advance on one surface of the substrate for the multilayer printed wiring board. . 16. A step 1 of preparing a plurality of transfer original plates each having a wiring pattern layer made of a conductive layer on a conductive substrate, and an adhesive insulating photosensitive film on one surface of the substrate for a multilayer printed wiring board. Conductive resin layer is formed, and the desired transfer original plate is pressure-bonded onto the pressure-sensitive adhesive insulating photosensitive resin layer to peel off the conductive substrate, thereby repeating the operation of transferring the wiring pattern layer onto the substrate. It has a step 2 of laminating a plurality of the wiring pattern layers, and a step 3 of exposing and developing the adhesive insulating photosensitive resin layer using the wiring pattern layer transferred in the step 2 as a mask. Method for manufacturing multilayer printed wiring board.