JPH0964086A - Connecting pad - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily connect a plurality of printed circuits on a substrate at one time with small manufacture cost increase when they must be connected in the middle of the manufacturing process and allow small characteristic change after manufacture. SOLUTION: A connecting pad is provided for connecting a plurality of wires B which are patterned on a substrate, and is composed of a plurality of pad pieces A which are arranged closely without making contact with one another around the center point.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a wiring pad for finally connecting a plurality of wiring patterns formed on a substrate to each other.

[0002]

^2. Description of the Related Art For example, an E ² PROM chip may be mounted on a substrate as a simple information storage device. Generally, an E ² PROM chip includes a ground (GND) terminal pad, a logic power supply (V _DD ) terminal pad, a clock signal (CLK) terminal pad,
Data in / out (D _{IN, OUT} ) terminal pads, a plurality of address (A ₀ , A ₁ ) terminal pads, and a test (T
EST) terminal pads are provided. However,
For simplification as a device, the number of external connection terminals provided on the substrate may be reduced instead of guiding all the wirings that are electrically connected to all the terminal pads to the external connection terminals of the substrate.

For example, as shown in FIG. 15, address (A ₀ , A ₁ ) terminal pads and ground (GND).
In some cases, the wirings that are electrically connected to the respective terminal pads are connected to the same external connection terminal for use. In the example shown in FIG. 15, the wiring that conducts to the test (TEST) terminal pad is also commonly connected to the external connection terminal for ground. In this case, the storage address of the input data can be defined by the command inserted at the beginning or in the middle of the data string and the data following the command.

Conventionally, when the terminal pads of the element chips mounted on the substrate are commonly connected to the external connection terminals as described above, as shown in FIG. 15, the common connection portion is formed on the wiring pattern provided on the substrate. Was only provided.

In this case, in the manufacturing process of the information storage device, it is possible to easily check whether or not the chip mounted on each substrate, that is, the E ² PROM chip in the example shown in FIG. 15 functions normally. Was difficult. That is, in the example shown in FIG. 15, the two address terminals (A ₀ , A ₁ ) are connected to the ground terminal (GN).
Since it is commonly connected to D), it is difficult to easily perform the function check via the address terminal.

In order to solve this problem, the function check of the E ² PROM chip is performed without connecting the two address terminals (A ₀ , A ₁ ) and the ground terminal (GND) in common, and then the jumper wire is used. Alternatively, it is conceivable to connect them in common via a switch or the like.

[0007]

However, when the common connection is made by using jumper wires or switches, not only the cost of the jumper wires or the switch itself is required, but also both ends of each jumper wire are connected to the pads by soldering. There is a problem in that an extra step for mounting the switch on the substrate is required, which significantly increases the manufacturing cost. Moreover, there is a possibility that the characteristics may change after manufacturing due to deterioration of the jumper wire, failure of the switch, or the like.

The present invention has been devised under the circumstances as described above, and reduces the manufacturing cost when a plurality of printed wirings on a board need to be commonly connected during the manufacturing process. The problem is to make it possible to easily connect the common connections with almost no increase and to prevent the characteristics from being changed after manufacturing.

[0009]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

That is, the wiring pad provided by the first aspect of the present invention is a wiring pad for finally connecting a plurality of wiring patterns formed on the substrate to each other, and It is characterized in that it is composed of a plurality of pad pieces which are arranged close to each other without being in contact with each other and can be connected to each other via solder by one soldering.

Since the plurality of pad pieces are arranged close to each other on the substrate without making contact with each other, it is possible to easily perform a function check of the element before they are commonly connected by soldering. Moreover, since the plurality of pad pieces can be connected to each other through the solder by one soldering, all the wirings connected to each pad piece can be easily shared by only one soldering. Can be connected. For this reason, jumper wires, switches, etc. are not necessary, and soldering and mounting thereof are not necessary, so that the manufacturing cost is hardly increased. Further, the deterioration of the jumper wire, the failure of the switch, etc. do not occur, and the characteristic change after manufacturing does not occur.

The wiring pad provided by the second aspect of the present invention is a wiring pad for finally connecting a plurality of wiring patterns formed on the substrate to each other, and In addition, it is characterized in that it is composed of a plurality of pad pieces that are arranged in proximity to each other around the center point without touching each other.

Since the plurality of pad pieces are arranged close to each other around the center point around the center point on the substrate without contacting each other, they are coated with a conductive material such as solder. It is possible to easily check the functions of the elements before making a common connection. In addition, all the wiring connected to each pad piece can be performed only by applying the conductive material such as soldering once. Common connection is possible. For this reason, jumper wires, switches, etc. are not necessary, and soldering and mounting thereof are not necessary, so that the manufacturing cost is hardly increased. Further, the deterioration of the jumper wire, the failure of the switch, etc. do not occur, and the characteristic change after manufacturing does not occur.

In a preferred embodiment, the plurality of pad pieces form a generally circular shape. For example, 3
In the case of a connection pad composed of individual pad pieces, each pad piece has a fan shape of approximately 120 degrees, and when viewed as the connection pad as a whole, a thin disk has three predetermined widths along the radial direction at intervals of 120 degrees. It is shaped like a slit.

The connection pad provided by the third aspect of the present invention is a connection pad for finally connecting a plurality of wiring patterns formed on the substrate to each other. , A plurality of pad pieces having slits radially formed from the center point, which are arranged close to each other around the center point without touching each other. And a radial conductor that extends radially toward the inside of the slit of each pad piece.

Since the radial conductors extend radially from the center point into the slits of the respective pad pieces without contacting the respective pad pieces, not only the conductive material for connecting the adjacent pad pieces to each other but also the respective pad pieces. Since the pad pieces are also connected to each other by the conductive material that connects the radial conductors, the application work of the conductive material such as soldering can be easily performed, and the pad pieces can be surely connected to each other.

Other features and advantages of the present invention will be apparent from the detailed description given below with reference to the accompanying drawings.

[0018]

1 is a plan view of a wire connection pad according to the present invention. The wire connection pad is composed of three fan-shaped pad pieces A, and is formed on a substrate together with wiring B by etching or the like. The pattern is formed by the method. The linear edge of each pad piece A opposes the linear edge of the adjacent pad piece A at a predetermined interval, and when viewed as a whole connection pad, a thin disk is arranged in the radial direction. Along 1
The shape is such that it is divided by three slits each having a predetermined width at intervals of 20 degrees.

FIG. 2 shows a form of one surface side of the electronic component manufacturing substrate provided with the connection pad of the present invention, and FIG.
Shows the form of the other side. The manufacturing substrate 1 has a form in which a plurality of unit substrates 10 each having a predetermined shape are connected via a bridging portion 2, and a predetermined wiring is provided on one surface side and the other surface side of a substrate material such as glass epoxy. After forming terminals or various pads, each unit substrate 10
It is obtained by punching out a slit 3 for partitioning the substrate, leaving the bridging portion 2. The wiring, terminals or pads can be formed by a method in which a metal conductor layer such as copper is formed on the surface of the substrate material by vapor deposition and then unnecessary portions are removed by etching.

The unit substrate 10 will be focused below. Each unit substrate 10 has a planar shape such that a thin extension 12 extends from a rectangular main body 11. The rectangular main body 11 may have a size necessary and sufficient for mounting an element to be described later, for example, a size of several mm to ten and several mm square.

The four external connection terminals 161, 162, 163, 1 are provided on the one-side extended portion 12a of the unit substrate 10.
64 are formed. Each terminal 161, 162, 16
3, 164 are through holes 171, 172, 173,
By 174, it is connected to a predetermined wiring pattern-formed on the other surface side of the substrate. The thickness of the metal conductor layer forming the terminal is, for example, 20 to 30 μm. Further, three inspection pads 181, 182, 183 are formed near the upper side of the rectangular main body 11 of the unit substrate 10, and wirings 181a, 182a connected to the inspection pads 181, 182, 183 are formed. , 183a are through holes 1
91, 192, and 193 connect to predetermined wirings 26e, 26f, and 26g that are patterned on the other surface side of the substrate. In the embodiment shown in the drawings, the external connection terminals 161-164 and the inspection pads 181, 182 are provided at the central portion on one surface side of the rectangular main body 11 of the unit substrate 10.
A rectangular sacrificial pattern 20 is formed by the metal conductor layer formed simultaneously with the formation of 183. Then, the one surface side of the unit substrate 10 has the external connection terminals 161 and 1 connected thereto.
62, 163, 164 and inspection pads 181, 1
Insulating layer 2 such as green resist leaving 82 and 183
1 (FIG. 6). As a result, as shown in FIG.
A bulging portion 22 corresponding to the thickness of the conductor layer is formed in the central portion of the rectangular main body portion 11 on one surface side of the unit substrate 10.

On the other hand, as shown in FIG. 3, predetermined wirings 26a to 26g or pads 25a to 25g, 27a, 27e and 27f are patterned on the other surface of the unit substrate 10, that is, the substrate. It is formed by a method of removing an unnecessary portion of the metal conductor layer formed on the material by etching. Pads 27a, 27e, 27f
Respectively correspond to the pad piece A of FIG. 1,
The pads 27a, 27e, and 27f form a connection pad. As shown in FIG. 3, the element mounting region 23 is formed in the central region of the rectangular main body 11 of the unit substrate 10 on the other surface side.
Is set, and in this area 23, the E ² PROM chip 1
5a is bonded. Bonding pads 25a, 25b, 25c, 25d, 25e, 25f for wire bonding with the terminal pads on the E ² PROM chip 15a so as to surround the element mounting region 23.
25 g are formed. On the upper surface of the E ² PROM chip 15a, as shown in detail in FIG. 4, a ground (GND) terminal pad 24a, a logic power (V _DD ) terminal pad 24b, and a clock signal (CLK) terminal pad 24c.
And a terminal pad 24 for data in / out (D _{IN, OUT} )
d and two address (A ₀ , A ₁ ) terminal pads 24
e, 24f, and test (TEST) terminal pad 24g
And the bonding pads 25a, 25b, and
25c, 25d, 25e, 25f and 25g are arranged on the substrate.

A ground wiring 26a connected to a ground (GND) terminal pad 24a on the E ² PROM chip 15a and a corresponding bonding pad 25a on the substrate.
Are routed on the other surface of the substrate to the back surface side of the external connection terminal 161 for ground, and are connected to the external connection terminal 161 for ground by the through hole 171. Logic power supply wiring 26 connected to the bonding pad 25b corresponding to the logic power supply (V _DD ) terminal pad 24b
b is the external connection terminal 162 for logic power supply on the other surface of the substrate.
Is routed to the back surface side of and is connected to the logic power source external connection terminal 162 by a through hole 172. The clock signal wiring 26c connected to the bonding pad 25c corresponding to the clock signal (CLK) terminal pad 24c is also routed to the back surface side of the clock signal external connection terminal 163 on the other surface of the substrate, and the through hole 173 is used to form the above. External connection terminal 163 for clock signal
It is connected to the. In addition, data in / out (D
_The data wiring 26d connected to the bonding pad 25d corresponding to the ( _{IN, OUT} ) terminal pad 24d is also routed on the other side of the substrate to the back side of the data connecting terminal 164, and the through hole 174 is used to connect the data external connecting terminal. 164 is connected.

On the other hand, the first on the E ² PROM chip 15a
At the other end of the first address wiring 26e connected to the bonding pad 25e on the substrate corresponding to the address (A ₀ ) terminal pad 24e, a fan-shaped common connection auxiliary pad 27e having a central angle of 120 ° is formed. Is provided,
The middle portion of the first address wiring 26e is connected to the above-described inspection pad 181 formed on the one surface side of the substrate via the through hole 191 via the wiring 181a. In addition, the second address (A ₁ ) terminal pad 24f on the device and the bonding pad 25f on the substrate corresponding to the terminal pad 24f.
The other end portion of the second address wiring 26f connected to is connected to the common connection auxiliary pad 27 formed at the other end portion of the first address wiring 26e, and has a fan shape having a central angle of 120 °. A common connection auxiliary pad 27f is provided, and an intermediate portion of the second address wiring 26f communicates with the above-described inspection pad 182 formed on the one surface side of the substrate through the through hole 192 through the wiring 182a. Has been made. Further, the ground wiring 26a
In order to form a circular connection pad as a whole at the tip of the branch portion formed in the middle part of the above, in cooperation with the common connection auxiliary pads 27e and 27f for the first and second address wirings. In addition, a fan-shaped auxiliary pad 27a for common connection having a central angle of 120 ° is formed. That is, as described above, the common connection auxiliary pad 27a,
27e and 27f respectively correspond to the pad piece A of FIG. 1, and these common connection auxiliary pads 27a, 27e and 2 are provided.
7f constitutes a connection pad. Furthermore, E
² Bond pads 2 on the substrate corresponding to the test (TEST) terminal pads 24g on the PROM chip 15a
The test wiring 26g connected to 5g has a through hole 1
Inspection pad 183 formed on one surface of the substrate via 93
To the wiring via a wire 183a.

As a result, on the other surface of the substrate, the ground wiring 26a, the logic power wiring 26b, the clock signal wiring 26c and the data wiring 26d are connected to the external connection terminals 161, 162, 163 on the one surface of the substrate. 164
While being connected to each of the two address wirings 26
e, 26f and the test wiring 26f are connected to the respective test pads 181, 182, 183 on the one surface side of the substrate, and are further arranged close to the ground wiring 26a and the two address wirings 26e, 26f. Auxiliary pads 27a, 2 for common connection that form a pad for connection
7e and 27f will be formed. The other surface of the substrate is covered with an insulating layer 29 (FIG. 6) such as a green resist, leaving the element mounting region 23 and the common connection auxiliary pads 27a, 27e and 27f.

An E ² PROM using the collective substrate 1 in which the above wiring, terminals and pads are formed on each unit substrate 10 is used.
A procedure for manufacturing a simple information storage device using the chip 15a will be described.

First, the board mounting area 23 of each unit board 10
The E ² PROM chip 15a is bonded to the
Terminal pads 24a, 24b, 24c, 2 on this chip
Bonding pads 25a, 25b, 25c, 25d and 25 corresponding to 4d, 24e, 24f and 24g, respectively.
The wires e, 25f and 25g are connected by wire bonding. Then, the E ² PROM chip 15a and the wire bonding portion are covered with a protective layer 28 (FIG. 6) formed by applying and curing a thermosetting resin. In this state, since the common connection auxiliary pads 27a, 27e, 27f arranged in a group are separated from each other, the seven terminal pads 24a, 24b, 24c, 24d, 24e, 24 formed on the chip are formed.
Electrical connection to f, 24g, 4 external connection terminals 1
The measurement can be performed from the one surface side of the substrate by bringing the measurement terminals into contact with 61, 162, 163, 164 and the three inspection pads 181, 183, 184. Therefore, the inspection related to all the terminal pads on the E ² PROM chip 15a can be performed without any problem, and the defective chip can be specified at this point.

Next, a conductive material is applied to the connection pads composed of the auxiliary pads for common connection 27a, 27e, and 27f collectively arranged by a method such as soldering to form two address wirings 26e, 26f, and by extension, the two address terminal pads 24e and 24f on the E ² PROM chip 15a can be commonly connected to the ground wiring 26a. In this way, after performing the above-mentioned steps for each unit substrate 10 in the manufacturing substrate 1,
By punching out the bridge portion 2, a unit device as shown in FIGS. 5 and 6 is obtained.

As already mentioned, the existing general E ²
By using the PROM chip 15a and commonly connecting the address terminal to the ground terminal, a simple information storage element with a reduced number of external connection terminals can be realized. In this case, the address for storing the data to be input is determined by the address data specified by the command in the data string.

FIG. 7 shows a state in which the information storage device D having the above configuration is attached to an attachment target. As the object to be attached, for example, the video tape cassette case 30 is selected. In such a cassette case, an internal space is defined by combining the lower member 30a and the upper member 30b, and in addition to the tape reel, functional components are incorporated in the internal space. A slit 31 that is substantially parallel to the outer surface 32 of the cassette case 30 is formed at the edge portion.

As shown in FIGS. 8 and 9, the slit 31 is close to the outer surface 32 of the casing case and the first inner wall 311 parallel to the outer surface of the cassette case.
And a second inner wall 312 facing the first inner wall 311.

The first inner wall 311 of the slit 31 has a flat shape, and an opening window 33 penetrating the cassette case outer surface 32 is cut out in a part thereof.
As will be described later, the first inner wall 311 has the slit 31
When the information storage device D is inserted into the, the bulging portion 22 on the one surface side is supported. Further, the opening window 33 is
External connection terminals 161, 1 of the inserted device D
The 62, 163 and 164 are exposed to the outer surface of the cassette case.

The second inner wall 312 of the slit 31 is provided on the other surface side element portion (E ² PROM) of the inserted device D.
A concave portion 312a for accommodating the mounting portion) and the concave portion 312a
On both sides of the device, there are substrate receiving surfaces 312b and 312b for receiving the other ends of the device on the other surface side. A distance L ₁ (FIG. 9) between the substrate receiving / supporting surface 312b and the first inner wall 311 is a dimension L from the other surface of the substrate of the device to the top of the bulging portion 22 in a natural state.
It is set slightly smaller than ₂ (Fig. 6).

FIG. 10 shows a state in which the thin plate information storage device D is inserted into the slit 31. As described above, the gap L ₁ (FIG. 9) between the substrate receiving surface 312b of the second inner wall 312 of the slit 31 and the first inner wall 311 is the bulging portion from the other surface of the substrate of the device D in the natural state. Since it is set to be slightly smaller than the dimension L ₂ up to the top of 22 (FIG. 6), the device D inserted in the slit 31 is elastically flexibly deformed, and the bulging portion is formed. Reference numeral 22 denotes the first inner wall 311, and both end portions on the other surface side of the substrate are substrate support surfaces 312 of the second inner wall 312.
b and 312b are elastically brought into contact with each other. Therefore, due to the frictional resistance force generated by such elastic contact, the thin plate-shaped information storage device D inserted into the slit 31 is stably held without rattling and preventing accidental disengagement. To be done. Then, the work of attaching the thin plate-shaped information storage device D may be simply inserted into the slit 31 and is extremely simple.
After the thin plate information storage device is inserted and held in the slit 31 of the lower member 30a of the video tape cassette case 30 as described above, the end opening of the slit 31 in the component insertion direction is a video tape cassette. -Closed by the upper member 30b of the case 30.

As a result, an E ² PROM having a predetermined storage capacity in an appropriate portion of the video tape cassette case 30.
An information storage device such as the above is properly incorporated, and the terminal portion used for writing or reading data properly faces the selected outer surface of the video tape cassette case 30.

For example, in a video tape recorder,
The terminals 161, 162, 163, 1 when the video tape cassette case 30 is inserted as described above.
A data writing or reading terminal capable of contacting 64 is provided so that, for example, index information such as the date and title together with the tape running counter number is appropriately written in the device element at the start of recording. . Further, the contents stored in the device element are read out appropriately and displayed on the video screen. In this way, for example, when the digital video tape recorder is used, it becomes extremely easy to search the contents recorded in the digital video tape cassette capable of recording for a long time.

The information storage device such as the E ² PROM is incorporated in not only the video tape cassette case 30 but also, for example, a digital tape recorder to store the index of the recorded contents of the tape. You can also

The connection pad of the present invention is not limited to the structure shown in FIG. For example, FIG.
As shown in FIG. 3, it may have a donut shape as a whole.
Further, as shown in FIG. 12, it may be composed of four pad pieces A. Of course, it may be composed of two or five or more pad pieces. Furthermore, FIG.
As shown in FIG. 3, it may be rectangular as a whole. Of course, it may be a triangle or a polygon having five or more sides.

Further, as shown in FIG. 14, slits S formed radially from the center point of the connection pad are formed in each pad piece A without contacting each pad piece A.
The connection pad may include a radial conductor C that extends radially from the center of the connection pad into the slit S of each pad piece A. In this way, the pad pieces A are connected to each other not only by the conductive material that connects the adjacent pad pieces A and A to each other, but also by the conductive material that connects the pad pieces A and the radial conductors C. Therefore, the application work of the conductive material such as soldering can be easily performed, and each pad piece A
Can be reliably connected to each other. Such a configuration is particularly effective when the size of the connection pad is large.

The connection pad of the present invention is E ² P
It can be widely used not only for testing an element such as a ROM but also when it is necessary to finally connect a plurality of wiring patterns formed on a substrate to each other.

[Brief description of drawings]

FIG. 1 is a plan view of a connection pad of the present invention.

FIG. 2 is a partial plan view of one side of a collective substrate for manufacturing an information storage device, which is an example of an electronic component including a connection pad of the present invention.

FIG. 3 is a partial plan view on the other surface side of the collective substrate for manufacturing an information storage device which is an example of an electronic component provided with the connection pad of the present invention.

FIG. 4 is an E ² PRO used for manufacturing an information storage device which is an example of an electronic component provided with a connection pad of the present invention.
It is a layout view of terminal pads on the M chip.

FIG. 5 is a plan view of one side of an information storage device which is an example of an electronic component including the connection pad of the present invention.

6 is a cross-sectional view taken along the line VV of FIG.

FIG. 7 is an external perspective view showing a state in which the information storage device is attached to a video tape cassette as an example of an attachment target.

8 is an explanatory diagram showing a state in which a mounting slit is formed in a lower member of the cassette shown in FIG.

FIG. 9 is a detailed view of the slit.

10 is an explanatory diagram showing a state in which the information storage device is inserted and held in the slit shown in FIG.

FIG. 11 is a plan view of a connection pad according to another embodiment of the present invention.

FIG. 12 is a plan view of a connection pad according to still another embodiment of the present invention.

FIG. 13 is a plan view of a connection pad according to still another embodiment of the present invention.

FIG. 14 is a plan view of a connection pad according to still another embodiment of the present invention.

FIG. 15 is an explanatory diagram of a conventional example.

[Explanation of symbols]

 27a, 27e, 27f Common connection auxiliary pad A Pad piece C Radial conductor

Claims (4)

[Claims] 1. A wiring connection pad for finally connecting a plurality of wiring patterns formed on a substrate to each other, which are closely arranged on the substrate without contacting each other and soldered once. A wire connection pad comprising a plurality of pad pieces which can be connected to each other via solder. 2. A wiring connecting pad for finally connecting a plurality of wirings patterned on a substrate to each other, wherein one point is a center on the substrate, and the wirings are connected to each other around the center point. A connection pad, characterized in that it is composed of a plurality of pad pieces arranged in close proximity to each other without contacting with. 3. The connection pad according to claim 2, wherein the plurality of pad pieces form a substantially circular shape as a whole. 4. A connection pad for finally connecting a plurality of wiring patterns formed on a substrate to each other, wherein one point is a center on the substrate, and the wiring pads are connected to each other around the center point. A plurality of pad pieces having slits radially formed from the center point, which are arranged in proximity to each other without contacting with, and radially from the center point into the slits of the pad pieces without contacting the pad pieces. A connection pad, comprising: a radial conductor extending to the.