JPH0955539A - Infrared rays casting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of light emitting elements of infrared rays by increasing effective quantity of light emitted from the light emitting elements of infrared rays. SOLUTION: This infrared rays casting device is equipped with a board 1 on which many light emitting elements 2 of infrared rays are mounted, and a reflecting member 5 arranged between the board and the light emitting elements of infrared rays. The reflecting member 5 mounts many light emitting elements 2 of infrared rays. The reflecting member 5 has many rectangular patterns which are constituted of copper foil 7 and formed on both surfaces of an insulating board 6 and penetrating holes 10, and has solder plating patterns 9 formed on the copper foil 7. Lead terminals of the light emitting elements of infrared rays and the solder plating patterns 9 are connected together on the opposite side of the light emitting elements 2 of infrared rays by soldering 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an infrared projector used for displaying lights for surveillance camera devices, electronic bulletin boards, fire alarms and the like.

[0002]

2. Description of the Related Art Conventionally, in a surveillance camera device which is designed to photograph an intruder using a television camera, an infrared projection device is used as an illumination source of the camera so that an intruder can be favorably photographed even at night. Those provided with are known. This infrared light projecting device projects near-infrared light that is invisible to an intruder's eyes, and has a glass epoxy resin substrate on which infrared light emitting elements composed of a large number of LEDs (for example, 100 to 200) are mounted. Is.

[0003]

However, in the above-mentioned conventional infrared projector, a part of the light emitted from the infrared light emitting element is absorbed or transmitted to the substrate side, and the effective light amount is reduced, and only that much. There is a problem that the number of infrared light emitting elements has to be increased.

The present invention solves the above-mentioned conventional problems, and provides an infrared projector capable of increasing the amount of effective light emitted from an infrared light emitting element and reducing the number of infrared light emitting elements. The purpose is.

[0005]

In order to achieve the above object, an infrared projector according to claim 1 has a substrate 1 on which a large number of infrared light emitting elements 2 are mounted, and between the substrate and the infrared light emitting elements. It is characterized by including the arranged reflection member 5.

The infrared projector according to claim 2 is
The reflecting member 5 includes a large number of rectangular patterns made of copper foil 7 formed on the insulating plate 6, solder plating patterns 9 formed on the copper foil, and insertion holes formed at both ends of each solder plating pattern. The lead terminal 3 of the infrared light emitting device having a hole 10 is inserted into an insertion hole of an adjacent solder plating pattern, and the lead terminal is soldered to the solder plating pattern. In the infrared light projecting device, the reflecting member 5 has a reflecting layer 11 formed on the entire surface of the insulating plate 6 by vapor deposition or plating, and an insertion hole 10 formed in the reflecting member. The base part of the terminal 3 is provided with an insulation coating 12, and the insulation coating part is inserted through the insertion hole. Further, the infrared projection device according to claim 4, wherein the reflection member 5 is provided.
Is a cylindrical body 13 that covers the periphery of the infrared light emitting element.

Further, the infrared projection device according to claim 5 comprises a reflection member 5 on which a large number of infrared light emitting elements 2 are mounted, and the reflection member is formed on both surfaces of the insulating plate 6 and the through hole 10. It has a large number of rectangular patterns made of foil 7 and a solder plating pattern 9 formed on the copper foil 7, and solders the lead terminals 3 and the solder plating pattern 9 of the infrared light emitting element on the opposite side of the infrared light emitting element 2. It is characterized in that the connection is made according to Appendix 8. It should be noted that the numbers added to the above-mentioned configurations are for comparison with the drawings in order to facilitate understanding of the present invention, and the configurations of the present invention are not limited thereby.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B show an example of an infrared light projecting device of the present invention. FIG. 1A is a partial sectional view, FIG. 1B is a partial plan view, and FIG. 1C is an electric circuit diagram.

On a substrate 1 made of a resin such as glass epoxy, a large number (for example, 100 to 200) of infrared ray emitting elements 2 made of LEDs are attached and fixed via lead terminals 3. In this embodiment, the substrate 1 and the infrared light emitting element 2
The reflecting member 5 is arranged between the two.

When the infrared light emitting element 2 is used as an illumination source for a camera of a surveillance camera device, it employs an infrared light emitting element which emits near infrared light which is not visible to an intruder.
When used as a display for fire alarms, etc., those that emit visible light shall be used.

The reflecting member 5 includes a large number of rectangular patterns made of copper foil 7 formed on the insulating plate 6, solder plating patterns 9 formed on the copper foil 7, and each solder plating pattern 9.
And the insertion holes 10 formed at both ends thereof.

In assembly, first, the reflection member 5 is fixed to the substrate 1, and then the lead terminal 3 of the infrared light emitting element 2 is attached.
After being inserted into the through holes 10 of the adjacent solder plating patterns 9 and fixed to the substrate 1, the lead terminals 3 and the solder plating patterns 9 are soldered 8, so that each infrared ray can be obtained as shown in FIG. 1 (C). A group of the light emitting elements 2 connected in series is connected in parallel. Since the solder plating is easily oxidized, it is desirable to apply a coating layer made of a transparent resin (for example, silicon resin) on the solder plating pattern 9.

According to the infrared projector having the above structure, the light traveling from the infrared light emitting element 2 to the substrate 1 side is efficiently reflected by the reflecting member 5, so that the effective light amount emitted from the infrared light emitting element 2 is increased. The number of infrared light emitting elements 2 can be reduced accordingly.

FIG. 2 is a partial cross-sectional view showing another example of the infrared projector of the present invention. In this example, the reflection member 5
Has a reflection layer 11 formed on the entire surface of the insulating plate 6 by vapor deposition or plating, and an insertion hole 10 formed in the reflection member 5, and has an insulating coating 12 on the root of the lead terminal 3 of the infrared light emitting element 2. After the insulating coating 12 is inserted into the insertion hole 10 to fix the lead terminal 3 to the substrate 1, the lead terminal 3 is electrically connected to the back side of the substrate 1.

FIG. 3 is a partial cross-sectional view showing another example of the infrared projector of the present invention. In this example, the reflection member 5
Is a cylindrical body 13 that covers the periphery of the infrared light emitting element 2 so that all the light emitted from the infrared light emitting element 2 is directed forward.

FIG. 4 is a partial cross-sectional view showing another example of the infrared projector of the present invention. In this example, the reflection member 5
Is the copper foil 7 formed on both sides of the insulating plate 6 and the insertion hole 10.
And a solder plating pattern 9 formed on the copper foil 7. The lead terminal 3 and the solder plating pattern 9 are connected by soldering 8 on the opposite side of the infrared light emitting element 2. There is. According to this example, the substrate 1 shown in FIG. 1 is unnecessary.

As is apparent from the above description, according to the present invention, the light traveling from the infrared light emitting element to the opposite side is efficiently reflected by the reflecting member, so that the effective light amount emitted from the infrared light emitting element is increased. The number of infrared light emitting elements can be reduced accordingly.

[Brief description of drawings]

FIG. 1 shows an example of an infrared projector of the present invention.
1A is a partial cross-sectional view, FIG. 1B is a partial plan view, and FIG.
(C) is an electric circuit diagram.

FIG. 2 is a partial cross-sectional view showing another example of the infrared light projecting device of the present invention.

FIG. 3 is a partial cross-sectional view showing another example of the infrared light projecting device of the present invention.

FIG. 4 is a partial cross-sectional view showing another example of the infrared light projecting device of the present invention.

[Explanation of symbols]

1 ... Substrate, 2 ... Infrared light emitting element, 3 ... Lead terminal, 5 ...
Reflecting member, 6 ... Insulating plate 7 ... Copper foil, 8 ... Soldering, 9 ... Solder plating pattern, 10
... Insertion hole 11 ... Reflective layer, 12 ... Insulating coating, 13 ... Cylindrical body

Claims (5)

[Claims] 1. A substrate on which a large number of infrared light emitting elements are mounted,
An infrared projector comprising: a substrate and a reflection member arranged between the infrared light emitting element. 2. The reflection member is formed on a large number of rectangular patterns made of copper foil formed on an insulating plate, solder plating patterns formed on the copper foil, and formed on both ends of each solder plating pattern. 2. The infrared projector according to claim 1, further comprising: an insertion hole, wherein the lead terminal of the infrared light emitting element is inserted into an insertion hole of an adjacent solder plating pattern and the lead terminal is soldered to the solder plating pattern. Light equipment. 3. The reflection member has a reflection layer formed on the entire surface of an insulating plate by vapor deposition or plating, and an insertion hole formed in the reflection member, and is insulated at the base of the lead terminal of the infrared light emitting element. The infrared projector according to claim 1, wherein a coating is applied, and the insulating coating portion is inserted into the insertion hole. 4. The infrared projector according to claim 1, wherein the reflecting member is a cylindrical body that covers the periphery of the infrared light emitting element. 5. A reflection member having a large number of infrared light emitting elements mounted thereon, wherein the reflection member has a large number of rectangular patterns made of copper foil formed on both sides and an insertion hole of an insulating plate and on the copper foil. An infrared projector comprising a formed solder plating pattern, wherein the lead terminal of the infrared light emitting element and the solder plating pattern are soldered on the opposite side of the infrared light emitting element.