JPH0952264A - Manufacture of board for optical disk medium - Google Patents
Manufacture of board for optical disk mediumInfo
- Publication number
- JPH0952264A JPH0952264A JP22290495A JP22290495A JPH0952264A JP H0952264 A JPH0952264 A JP H0952264A JP 22290495 A JP22290495 A JP 22290495A JP 22290495 A JP22290495 A JP 22290495A JP H0952264 A JPH0952264 A JP H0952264A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- substrate
- board
- stamper
- optical disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/43—Removing or ejecting moulded articles using fluid under pressure
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、情報の光学的な書
き込み消去可能な記録媒体に用いられる、薄肉円板状プ
ラスティック製ディスク基板を、射出成形法で成形する
製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing method for molding a thin disk-shaped plastic disk substrate used in a recording medium capable of optically writing and erasing information by injection molding.
【0002】[0002]
【従来の技術】基板を用いた光ディスク媒体は可搬性が
あり、高密度記録媒体として将来の発展が期待されてい
る。基板の材料としてはコストの点からプラスティック
が有利であり、ポリカーボネート(PC)、ポリメチル
メタクリレート(PMMA)などがあり、光学特性、吸
水性などからPCがおもに使用されている。製造方法と
しては量産性の点から各種成形のうち射出成形が用いら
れている。光ディスクにはスタンパから転写された微細
な案内溝やピットが基板の表面に刻まれており、その表
面に記録膜や保護膜が形成されている。記録膜の材料と
しては、TbFeCoなどの光磁気記録タイプや、GeTeSbなど
の相変化記録タイプ等がある。2. Description of the Related Art An optical disk medium using a substrate is portable and is expected to develop in the future as a high density recording medium. As a material for the substrate, plastic is advantageous in terms of cost, and there are polycarbonate (PC), polymethylmethacrylate (PMMA), and the like, and PC is mainly used because of its optical characteristics and water absorption. As a manufacturing method, injection molding is used among various moldings from the viewpoint of mass productivity. On the optical disk, fine guide grooves and pits transferred from the stamper are engraved on the surface of the substrate, and a recording film and a protective film are formed on the surface. Materials for the recording film include magneto-optical recording type such as TbFeCo and phase change recording type such as GeTeSb.
【0003】[0003]
【発明が解決しようとする課題】射出成形によって成形
された基板には表面に案内溝やピットが転写されている
が、成形及び基板取り出し時の条件によってはピットず
れやピットの二重転写が発生することがしばしば見られ
る。これらが発生するとピット部ではIDエラーの原因と
なり、また溝部ではデータのバーストエラーの原因とな
ってしまうという問題があった。本発明の目的は、これ
らピットずれや二重転写のない光ディスク媒体用基板を
射出成形する製造方法の確立にある。Although a guide groove and pits are transferred to the surface of a substrate molded by injection molding, pit misalignment and double transfer of pits may occur depending on conditions during molding and substrate removal. It is often seen to do. When these occur, there is a problem that it causes an ID error in the pit portion and a data burst error in the groove portion. An object of the present invention is to establish a manufacturing method for injection-molding a substrate for an optical disc medium, which is free from these pit shifts and double transfer.
【0004】[0004]
【課題を解決するための手段】本発明者等は基板として
合成樹脂を用いた光ディスクで、ピットずれや二重転写
のない基板の製造技術を確立するため鋭意研究した結
果、ピットずれや二重転写の発生は、基板を金型から離
型させるタイミング、及び金型を開く速度に原因がある
ことを見いだした。すなわち、金型に樹脂を射出し基板
を成形すると基板は金型に密着しており、このままでは
金型を開いた時基板を取り出すことは困難である。その
ため、通常金型を開く前に金型と成形された基板との間
にエアーを供給して、金型と基板とを分離することが行
われている。その際、エアーを供給するタイミングが悪
いと基板にばたつきが発生すること、また、金型を開く
速度が適正でないと、同様にばたつきが発生し、ピット
ずれや二重転写が起こると推測し、以上の諸条件を検討
した結果、ピットずれや二重転写を著しく少なくするこ
とが出来、本発明に到達した。本発明の要旨は次の通り
である。Means for Solving the Problems The inventors of the present invention have conducted extensive studies to establish a substrate manufacturing technique for an optical disc using a synthetic resin as a substrate without pit shift or double transfer. It was found that the occurrence of the transfer was caused by the timing of releasing the substrate from the mold and the speed of opening the mold. That is, when the resin is injected into the mold and the substrate is molded, the substrate is in close contact with the mold, and it is difficult to take out the substrate when the mold is opened as it is. Therefore, before the mold is opened, air is usually supplied between the mold and the molded substrate to separate the mold from the substrate. At that time, if the timing of supplying air is bad, fluttering will occur on the substrate, and if the mold opening speed is not appropriate, fluttering will occur similarly, and it is speculated that pit displacement and double transfer will occur, As a result of examining the above-mentioned various conditions, pit shift and double transfer can be significantly reduced, and the present invention has been achieved. The gist of the present invention is as follows.
【0005】すなわち、固定側金型と可動側金型及びこ
れらの間に設けられたスタンパからなる成形金型のキャ
ビティに、溶融した合成樹脂を射出して樹脂基板を成形
し、金型を開き基板を取り出す光ディスク媒体用基板の
製造方法において、金型を開く4秒〜2秒前からスタン
パを備えた金型に対向する金型と基板との間にエアーを
供給し、これより0.5 秒〜1秒後からスタンパと基板と
の間にエアーを供給し、かつ金型の移動距離0mmから0.
1mm までを3〜20mm/秒(v1)、0.1 mmから1mmまでを
5〜30mm/秒(v2 :ただしv2 ≧v1)の速度で金型を
開くことを特徴とする光ディスク媒体用基板の製造方法
を要旨とするものである。以下、本発明についてさらに
詳述する。That is, molten synthetic resin is injected into a cavity of a molding die including a fixed-side die, a movable-side die and a stamper provided between them to form a resin substrate and open the die. In the method of manufacturing a substrate for an optical disk medium for taking out the substrate, air is supplied between the mold and the substrate facing the mold equipped with the stamper from 4 seconds to 2 seconds before opening the mold, and 0.5 seconds from this. After 1 second, air is supplied between the stamper and the substrate, and the moving distance of the mold is from 0 mm to 0.
For optical disk media characterized by opening the mold at a speed of 3 to 20 mm / sec (v 1 ) up to 1 mm and 5 to 30 mm / sec (v 2 : where v 2 ≧ v 1 ) from 0.1 mm to 1 mm The gist of the invention is a substrate manufacturing method. Hereinafter, the present invention will be described in more detail.
【0006】図1は、本発明において使用される光ディ
スク基板の成形装置を示す断面模式図であり、図2は図
1の装置における基板成形後、金型を開く前の、基板付
近の断面模式図である。溶融した樹脂は射出機構1から
流路4を通り、キャビティ5に充填され、成形されて基
板8となる。この際、スタンパ6表面に形成されている
案内溝やピットが基板8表面に転写・形成される。な
お、キャビティ5を規定するため、外周リング7が設け
られている。この後、可動側金型3が開き、成形された
基板8が取り出される。取り出される時、基板8は金型
2・3に密着しており、予め両金型と基板との間にエア
ーを供給して基板の型離れをさせておく必要がある。す
なわち、金型を開く前にエアーを、固定側金型2と基板
8との間すなわち矢印(1)から供給し固定側金型2か
ら基板8を離型させ、その後、スタンパ6と基板との間
すなわち矢印(2)からエアーを供給し可動側金型3か
ら基板8を離型させ、可動側金型を開き基板を取り出
す。FIG. 1 is a schematic sectional view showing a molding apparatus for an optical disk substrate used in the present invention, and FIG. 2 is a schematic sectional view in the vicinity of the substrate after molding the substrate in the apparatus of FIG. 1 and before opening a mold. It is a figure. The molten resin passes from the injection mechanism 1 through the flow path 4 and is filled in the cavity 5 and molded to form the substrate 8. At this time, guide grooves and pits formed on the surface of the stamper 6 are transferred and formed on the surface of the substrate 8. An outer peripheral ring 7 is provided to define the cavity 5. After that, the movable mold 3 is opened, and the molded substrate 8 is taken out. When taken out, the substrate 8 is in close contact with the molds 2 and 3, and it is necessary to supply air between both molds and the substrate in advance to separate the substrates from each other. That is, before the mold is opened, air is supplied between the fixed side mold 2 and the substrate 8, that is, from the arrow (1) to release the substrate 8 from the fixed side mold 2, and then the stamper 6 and the substrate 8 are separated. Air is supplied in the interval, that is, from the arrow (2) to release the substrate 8 from the movable mold 3, the movable mold is opened, and the substrate is taken out.
【0007】そこで本発明においては、固定側金型2と
基板8との間にエアーを供給するタイミング(A) を金型
を開く4〜2秒前から、またスタンパ6と基板との間に
エアーを供給するタイミング(B) を(A) より0.5 〜1秒
後から行い、かつ金型を開く速度を可動側金型3の移動
距離0mmから 0.1mmまでを3〜20mm/秒(v1)、0.1m
m から1mmまでを5〜30mm/秒(v2 :ただしv2 ≧
v1)で行い、基板を取り出すこととする。上記の条件に
より、基板にばたつきを生じさせずに金型から基板を取
り出すことができる。Therefore, in the present invention, the timing (A) for supplying air between the fixed side mold 2 and the substrate 8 is 4 to 2 seconds before the mold is opened, and between the stamper 6 and the substrate. The timing (B) for supplying air is 0.5 to 1 second after (A), and the speed for opening the mold is 3 to 20 mm / sec (v 1 for the moving distance of the movable mold 3 from 0 mm to 0.1 mm). ), 0.1m
from m to 1mm 5~30mm / s (v 2: where v 2 ≧
v 1 ) and take out the substrate. Under the above conditions, the substrate can be taken out from the mold without causing the substrate to flutter.
【0008】本発明は光ディスク媒体用基板の製造にお
いて、射出成形後の基板離型時の、エアーブロー及び金
型を開く速度を調整して、基板を取り出すものである。
これにより基板にばたつきを生じさせずに金型から基板
を取り出すことができ、ピットずれ、二重転写を低減す
ることができる。According to the present invention, in manufacturing a substrate for an optical disc medium, the substrate is taken out by adjusting the air blow and the opening speed of the mold at the time of releasing the substrate after injection molding.
As a result, the substrate can be taken out from the mold without causing the substrate to flutter, and pit shift and double transfer can be reduced.
【0009】[0009]
【発明の実施の形態】以下に本発明の実施の形態を実施
例、比較例を挙げて具体的に説明するが、本発明はこれ
らに限定されるものではない。 実施例1 平均分子量約15,000のポリカーボネート(帝人化成
(株)製 商品名:AD-9000TG)を射出成形機を用いて直
径86mm、厚さ1.2mm のディスク状に成形した。スタンパ
は可動側金型にセットし、型締力30ton 、金型温度 1
20℃、シリンダ温度340 ℃、射出充填0.3 秒、射出後金
型内での冷却を10秒行った。成形終了後金型を開く3
秒前から固定側金型と成形されたディスク基板との間に
エアーを3リットル/分供給した。更に金型を開く2秒
前からディスク基板とスタンパとの間にエアー3リット
ル/分供給した。また金型は移動距離0mmから0.1mm ま
でを5mm/秒、0.1mm から1mmまでを10mm/秒、その
後140mm/秒の速度で開き、基板を取り出した。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below with reference to Examples and Comparative Examples, but the present invention is not limited thereto. Example 1 A polycarbonate having an average molecular weight of about 15,000 (trade name: AD-9000TG, manufactured by Teijin Chemicals Ltd.) was molded into a disk shape having a diameter of 86 mm and a thickness of 1.2 mm by using an injection molding machine. Set the stamper on the movable side mold, mold clamping force 30ton, mold temperature 1
The temperature was 20 ° C., the cylinder temperature was 340 ° C., the injection filling was 0.3 seconds, and the injection was followed by cooling in the mold for 10 seconds. Open the mold after molding 3
From the second before, air was supplied at a rate of 3 liters / minute between the fixed side mold and the molded disk substrate. Further, 2 liters / minute of air was supplied between the disk substrate and the stamper 2 seconds before opening the mold. The mold was opened at a moving distance of 5 mm / sec from 0 mm to 0.1 mm, 10 mm / sec from 0.1 mm to 1 mm, and then at 140 mm / sec, and the substrate was taken out.
【0010】成形したディスク基板25枚を顕微鏡、及
びトンネル顕微鏡(STM 倉敷紡績(株)製 KURASURF-10
1 )で観察したところ、ID部などのプレピット部にピッ
トずれや二重転写は見られなかった。これら基板に光磁
気記録タイプの磁性材料をスパッタ法で製膜し、IDエラ
ー及びバーストエラーを光ディスクドライブで測定し
た。表1に示すように、25枚のディスクを測定したと
ころ、エラーは平均23個であり、データ部のバースト
エラーは見られなかった。A microscope and a tunnel microscope (STM KURASURF-10 manufactured by STM Kurashiki Spinning Co., Ltd.)
As a result of observation in 1), no pit displacement or double transfer was observed in the pre-pit portion such as the ID portion. A magneto-optical recording type magnetic material was formed on these substrates by a sputtering method, and an ID error and a burst error were measured by an optical disk drive. As shown in Table 1, when 25 disks were measured, the average number of errors was 23, and no burst error in the data part was observed.
【0011】[0011]
【表1】 [Table 1]
【0012】比較例1 比較のために、金型を開く3秒前から固定側金型とディ
スク基板との間に、また、金型を開くと同時にスタンパ
とディスク基板との間にエアーを供給し、移動距離0mm
から1mmまでを30mm/秒の速度で金型を開く以外は、
実施例1と同じ条件で行った。結果を表1に併記する。Comparative Example 1 For comparison, air is supplied between the fixed side mold and the disk substrate from 3 seconds before the mold is opened, and between the stamper and the disk substrate at the same time when the mold is opened. And moving distance 0 mm
Except for opening the mold from 1 to 1 mm at a speed of 30 mm / sec,
It carried out on the same conditions as Example 1. The results are also shown in Table 1.
【0013】比較例2 比較のために、金型を開く3秒前から固定側金型とディ
スク基板との間に、また、金型を開くと同時にスタンパ
とディスク基板との間にエアーを供給した以外は、実施
例1と同じ条件で行った。結果を表1に併記する。Comparative Example 2 For comparison, air is supplied between the fixed side mold and the disk substrate from 3 seconds before the mold is opened, and between the stamper and the disk substrate at the same time when the mold is opened. The conditions were the same as in Example 1 except for the above. The results are also shown in Table 1.
【0014】比較例3 比較のために、金型を開く3秒前から、固定側金型とデ
ィスク基板との間、及びスタンパとディスク基板との間
に、エアーを供給した以外は、実施例1と同じ条件で行
った。結果を表1に併記する。COMPARATIVE EXAMPLE 3 For comparison, an example was applied except that air was supplied from 3 seconds before opening the mold to between the fixed mold and the disk substrate and between the stamper and the disk substrate. It carried out on the same conditions as 1. The results are also shown in Table 1.
【0015】比較例4 比較のために、移動距離0mmから1mmまでを30mm/秒
の速度で金型を開く以外は、実施例1と同じ条件でおこ
なった。結果を表1に併記する。Comparative Example 4 For comparison, the same conditions as in Example 1 were used except that the mold was opened at a moving distance of 0 mm to 1 mm at a speed of 30 mm / sec. The results are also shown in Table 1.
【0016】表1に示すように、比較例では成形基板の
内周部または外周部に二重転写が見られ、さらに記録膜
をつけ、エラーを測定したところ、この二重転写に起因
するバーストエラーが発生した。As shown in Table 1, in the comparative example, double transfer was observed on the inner peripheral portion or the outer peripheral portion of the molded substrate. Further, when a recording film was attached and an error was measured, a burst due to this double transfer was observed. An error has occurred.
【0017】[0017]
【発明の効果】以上に述べたように本発明によれば、光
ディスク媒体用基板の射出成形後の、基板離形時におけ
る二重転写が著しく減少するため、光ディスクのエラー
を大幅に低減することができる。As described above, according to the present invention, the double transfer at the time of releasing the substrate after the injection molding of the substrate for the optical disc medium is remarkably reduced, so that the error of the optical disc is significantly reduced. You can
【図1】本発明の実施例に使用される射出成形装置の断
面模式図である。FIG. 1 is a schematic sectional view of an injection molding apparatus used in an example of the present invention.
【図2】図1の装置における基板成形後、金型を開く前
の、基板付近の断面模式図である。2 is a schematic cross-sectional view of the vicinity of the substrate after the substrate is molded and before the mold is opened in the apparatus of FIG.
1 射出機構 2 固定側金型 3 可動側金型 4 流路 5 キャビティ 6 スタンパ 7 外周リング 8 基板 (1),(2) 離型エアー 1 Injection Mechanism 2 Fixed Side Mold 3 Movable Side Mold 4 Flow Path 5 Cavity 6 Stamper 7 Outer Ring 8 Substrate (1), (2) Release Air
───────────────────────────────────────────────────── フロントページの続き (72)発明者 斉藤 誠 群馬県安中市磯部2丁目13番1号 信越化 学工業株式会社精密機能材料研究所内 (72)発明者 小林 利美 群馬県安中市磯部2丁目13番1号 信越化 学工業株式会社精密機能材料研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Makoto Saito 2-13-1 Isobe, Gunma Prefecture, Annaka City, Shin-Etsu Kagaku Kogyo Co., Ltd., Institute for Precision Materials (72) Inventor, Toshimi Kobayashi Annaka City, Gunma Prefecture 2-13-1 Isobe Shin-Etsu Chemical Co., Ltd. Precision Materials Research Laboratory
Claims (1)
に設けられたスタンパからなる成形金型のキャビティ
に、溶融した合成樹脂を射出して樹脂基板を成形し、金
型を開き基板を取り出す光ディスク媒体用基板の製造方
法において、金型を開く4秒〜2秒前からスタンパを備
えた金型に対向する金型と基板との間にエアーを供給
し、これより0.5 秒〜1秒後からスタンパと基板との間
にエアーを供給し、かつ金型の移動距離0mmから0.1mm
までを3〜20mm/秒(v1)、0.1 mmから1mmまでを5〜
30mm/秒(v2 :ただしv2 ≧v1)の速度で金型を開く
ことを特徴とする光ディスク媒体用基板の製造方法。1. A molten synthetic resin is injected into a cavity of a molding die including a fixed-side die, a movable-side die, and a stamper provided therebetween to form a resin substrate, and the die is opened. In the method of manufacturing a substrate for an optical disk medium for taking out the substrate, air is supplied between the mold and the substrate facing the mold equipped with the stamper from 4 seconds to 2 seconds before opening the mold, and 0.5 seconds from this. Air is supplied between the stamper and the substrate after 1 second, and the moving distance of the mold is from 0 mm to 0.1 mm.
3 to 20 mm / sec (v 1 ), 0.1 mm to 1 mm 5 to
A method for manufacturing a substrate for an optical disk medium, which comprises opening the mold at a speed of 30 mm / sec (v 2 : where v 2 ≧ v 1 ).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22290495A JPH0952264A (en) | 1995-06-06 | 1995-08-31 | Manufacture of board for optical disk medium |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13896995 | 1995-06-06 | ||
JP7-138969 | 1995-06-06 | ||
JP22290495A JPH0952264A (en) | 1995-06-06 | 1995-08-31 | Manufacture of board for optical disk medium |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0952264A true JPH0952264A (en) | 1997-02-25 |
Family
ID=26471889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22290495A Pending JPH0952264A (en) | 1995-06-06 | 1995-08-31 | Manufacture of board for optical disk medium |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0952264A (en) |
-
1995
- 1995-08-31 JP JP22290495A patent/JPH0952264A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4184091B2 (en) | Injection molding method | |
JPH0952264A (en) | Manufacture of board for optical disk medium | |
JP3473149B2 (en) | Method of manufacturing resin disk substrate | |
JPH01264822A (en) | Molding method for optical disc board containing preformat and die to be used for that | |
JPH01264816A (en) | Molding method for optical disc board containing format | |
JPH10320848A (en) | Method for molding disk substrate for optical information recording | |
JPH0763991B2 (en) | Mold for molding optical disc substrate with format | |
JP2000061994A (en) | Manufacture of optical disk substrate | |
JP2003305756A (en) | Manufacturing method for disc substrate, mold device, and injection molding device | |
JPH0825434A (en) | Molding method for board of disk | |
JPH0631782A (en) | Device and method for producing optical information recording medium substrate | |
JP2002144377A (en) | Tapered molding apparatus | |
JP2603584Y2 (en) | Vacuum injection mold | |
JPH09180252A (en) | Substrate of optical recording medium and its manufacture | |
JP2000000851A (en) | Metal mold for disk substrate | |
JPH06297514A (en) | Method for molding preformat substrate | |
JP2006255942A (en) | Mold assembly for molding optical disk substrate | |
JPH09198723A (en) | Manufacture of substrate of optical recording medium and optical recording medium | |
JP2000322781A (en) | Mold device and production of disk substrate | |
JPH09174611A (en) | Molding method of disk base plate | |
JP2002127193A (en) | Optical disk substrate molding die, and molding method for optical disk substrate | |
JP2002166454A (en) | Method for injection-molding disk substrate | |
JP2000229339A (en) | Mold for injection molding and production of disk substrate | |
JP2000015644A (en) | Mold for molding disk board | |
JPH11242832A (en) | Optical disk and its manufacture |