JPH0948123A - Ink jet recording head, production thereof, ink jet recording apparatus and data processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To always form a stable high-grade image by integrally forming ink passages and an ink passage covering part on a semiconductor substrate. SOLUTION: A resist is applied to both surfaces of a silicon substrate 1 and patternwise exposure is performed in matching relation to an ink flow groove shape to remove the unnecessary resist. The anodic chemical forming processing of this substrate 1 is performed to make a region where ink passages 2 are formed porous. Next, an etching-resistant protective layer 8 (also used as a heat-resistant protective layer) is formed on the porous layer excepting an ink injecting port 5. A heating resistor layer, an electrode applying voltage thereto, a heat insulating layer and a radiation layer are formed to form an emitting element 4. Selective etching is performed to selectively remove the porous layer of the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording apparatus for recording information such as characters and images on a recording medium in an information processing system such as a copying machine, a facsimile, a printer, a word processor, a personal computer and the like. The present invention relates to an inkjet recording head mounted in an apparatus and a method of manufacturing the recording head. Here, the term “recording” includes the application of ink (printing, image formation, printing, dyeing, etc.) to all ink supports to which ink is applied, such as cloth, thread, paper, and sheet material. Is applicable not only in the information processing field, but also in a wide range of industrial fields such as the apparel industry using an ink support to which ink is applied, such as cloth, thread, paper, and sheet material.

[0002]

2. Description of the Related Art Conventionally, paper, cloth, plastic sheet, O
A recording apparatus for recording on a recording medium such as a HP sheet (hereinafter also simply referred to as recording paper) can be equipped with recording heads of various recording methods, for example, a wire dot method, a thermal method, a thermal transfer method, and an inkjet method. It has been proposed as a form.

Among these methods, the ink-jet method is a method for recording characters and figures by ejecting ink as minute liquid droplets from a nozzle, and is excellent as a means for outputting high-definition images and high-speed recording. Have advantages. Among them, a recording head of a method of ejecting a liquid by utilizing thermal energy (utilizing a film boiling phenomenon) (so-called bubble jet method) has a high resolution recording because the liquid ejection ports can be arranged at high density. It is possible to
In particular, a method using bubble pressure generated by an electrothermal converter (hereinafter, heater) or the like, a so-called thermal ink jet recording method (Japanese Patent Publication No. 61-59911-4), downsizes the device and increases the image density. It is easy to use.

Generally, an ink jet recording apparatus comprises a carriage on which a recording means (recording head) and an ink tank are mounted, a conveying means for conveying recording paper, and a control means for controlling these. Then, the recording head for ejecting ink droplets from the plurality of ejection ports is serially scanned in the direction (main scanning direction) orthogonal to the recording paper conveyance direction (sub-scanning direction), while the recording paper is set to the recording width when not recording. The same amount is intermittently conveyed. The recording principle of the ink jet recording apparatus is described in, for example, "Imaging Part 2, pp114-148, Photographic Industry Supplement, edited by The Institute of Electrophotography".

By the way, in an ink jet recording head to which the above thermal ink jet recording method (hereinafter, also referred to as a thermal recording method) is applied, a flow path portion for ink flow and an ejection element portion for ejecting ink are separately prepared, and then these It is manufactured by joining the members of.

The following methods (1) and (2) are known as methods for producing a thermal recording type ink jet recording head.

(1) First Method (Reference: Journal of the Television Society, vol. 37, No. 2, 1983) A groove in which ink flows is formed in a resin by pressing using a die. On the other hand, an electrode layer, a heating resistance layer, a protective layer, etc. are formed at positions corresponding to the resin grooves on the silicon substrate, and the silicon substrate and the resin are bonded using an adhesive.

(2) Second method (Reference: Japanese Patent Laid-Open No. 2-16
No. 4549) Anisotropic etching is performed on the surface of the silicon substrate A with potassium hydroxide to form grooves in which ink flows. Next, an electrode layer, a heating resistance layer, a protective layer, etc. are formed at positions corresponding to the grooves of the silicon substrate A of the silicon substrate B to form an ejection element portion, and the silicon substrates A and B are anodically bonded.

FIG. 6 shows an example of an ink jet recording head manufactured according to the conventional method.

The ink jet recording head is obtained by joining the top plate 51 and the substrate 52. As shown in the figure, the top plate 51 has a plurality of grooves 53 serving as nozzles for passing ink, and grooves 5 serving as liquid chambers communicating with these grooves.
4, and a supply port 55 for supplying ink to the liquid chamber
Are formed. On the other hand, an electrothermal converter 56 corresponding to each nozzle and an electrode 57 for supplying an electrode to each electrothermal converter are integrally formed on the substrate 52 by a film forming technique.

[0011]

However, the above-mentioned conventional methods have the following problems to be solved. That is, the above methods (1) and (2) require a high degree of alignment accuracy when joining two substrates. In the case of the above (1), since the resin and silicon have different thermal expansion coefficients when the ink is heated, the head is easily deformed or the internal stress is easily received when the ink is heated. Further, in the case of the above (2), two silicon substrates are required, which increases the cost.

Therefore, the present invention solves the above-mentioned problems,
Provided are an inkjet recording head that can be manufactured at low cost and can always form a stable and high-quality image, a manufacturing method thereof, a recording apparatus including the head, and an information processing system using the apparatus as an output unit. The purpose is to

[0013]

In order to solve the above problems, an ink jet recording head according to the present invention is mounted on a recording apparatus for recording input image information by ejecting ink droplets onto a recording medium. In an ink jet recording head, an ink flow path having an ink discharge port for discharging an ink droplet on a recording medium at one end and an ink injection port for receiving ink supplied at the other end, and an ink flow channel covering the ink flow channel The covering portion is integrally formed on the semiconductor substrate.

Preferably, an ejection element portion for generating energy for ejecting ink is formed integrally with the ink flow path coating portion.

Preferably, the ejection element portion has a heating resistance layer and an electrode layer.

Preferably, the heating resistance layer is an electrothermal converter that generates heat energy that causes film boiling in the ink, as an energy generating means for ejecting ink droplets.

Next, in the ink jet recording apparatus according to the present invention, a carriage for mounting the ink jet recording head having the above structure as a recording means, a conveying means for conveying a recording medium, an ink jet recording head and a carriage. , And control means for controlling the drive of the transport means.

Further, the information processing system according to the present invention is characterized by using the ink jet recording apparatus having the above-mentioned configuration as an output means.

Furthermore, a method of manufacturing an ink jet recording head according to the present invention is a method of manufacturing an ink jet recording head mounted on a recording apparatus for recording input image information by ejecting ink droplets on a recording medium. An ink flow path having an ink discharge port for discharging an ink droplet on the recording medium as one end and an ink injection port receiving the ink supply as the other end, and an ink flow path covering portion for covering the ink flow path, It is characterized by being integrally formed on a semiconductor substrate.

Preferably, an ejection element portion for generating energy for ejecting ink is formed integrally with the ink flow path coating portion.

Preferably, the ejection element portion has a heating resistance layer and an electrode layer.

Preferably, the heating resistance layer is an electrothermal converter that generates heat energy that causes film boiling in the ink, as an energy generating means for ejecting ink droplets.

Preferably, the method further comprises a step of forming a porous layer on the semiconductor substrate by anodization and forming a flow channel covering layer on the porous layer.

An ink jet recording head (hereinafter, also simply referred to as a head) according to the present invention has a flow path of ink on a semiconductor substrate and an ejection element portion (electrode layer, heating resistance layer, etc.) for ejecting ink. It has an integrally manufactured structure. Therefore, it is not necessary to perform high-level alignment by bonding when manufacturing the head, and the head can be manufactured by a simple method. As a result, the manufacturing cost of the head can be reduced, and the head can be provided to the consumer at a lower price than the conventional one.

In the ink jet recording head according to the present invention, the ink flow path is covered when the ink flow path and the ejection element portion for ejecting the ink are integrally formed on the semiconductor substrate. A side shooter type head is obtained by forming an ink ejection port in the portion.

Further, by forming the ink ejection element portion on the head surface, the circuit structure can be easily assembled, and at the same time, the control circuit can be easily formed integrally.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION An ink jet recording head and a method for manufacturing the same according to the present invention, an ink jet recording apparatus equipped with the head, and an information processing system using the apparatus as output means will be described below.

FIG. 1 is for explaining a schematic structure of an ink jet recording head according to the present invention.
(A) is a perspective view, (b) is sectional drawing which follows the II 'line of (a). The ink jet recording head 100 is provided on the semiconductor substrate 1 so as to cover the ink flow passage 2, the ink discharge port 3, and the flow passage 2 which are formed in a groove shape on the surface of the semiconductor substrate 1. 2 is integrally formed with a protective layer 8 having an ink inlet for supplying ink to 2 and an ejection element portion 4 for ejecting ink.

FIG. 2 is a sectional view taken along line II 'of FIG. 1A for explaining a method of manufacturing the ink jet recording head shown in FIG.
It is equivalent to the sectional view along a line, and (a) to (d) are sectional views corresponding to the respective steps.

The method of manufacturing the ink jet recording head is as follows.
It has the following processes (1)-(5).

(1) A resist 6 is applied to both surfaces of the silicon substrate 1, and pattern exposure is performed according to the shape of the groove through which the ink flows to remove unnecessary resist (FIG. 2A).

(2) The substrate 7 is anodized to make the portion 7 where the ink flow path is formed porous.

(3) Next, a protective layer 8 having etching resistance (which also serves as a heat-resistant protective layer) is formed on the porous layer except for the ink inlet 5 (FIG. 2B).

(4) Heat generating resistance layer 9, and electrode 10 for applying voltage to the heat generating resistance layer, heat insulating layer 11, heat radiating layer 12
And the like to form a discharge element.

(5) Selective etching is performed to selectively remove the porous layer of the substrate.

Here, anodization and etching will be described.

First, a method for making a silicon substrate porous by anodization will be described.

A silicon substrate coated with silicon nitride, a resist or the like and a platinum electrode are immersed in a container containing hydrofluoric acid having a volume concentration of 5 to 50%, leaving necessary openings. When the platinum electrode is connected to the negative electrode and the silicon substrate is connected to the positive electrode and a current of 5 to several 100 mA / cm ² is applied, the silicon substrate is 0.5 to 10 μm / mi through the opening.
n. It becomes porous at the speed of. The inside of the container may be divided into two so as to isolate hydrofluoric acid that contacts both surfaces of the silicon substrate, and an electrode may be inserted into each of the divided containers to pass an electric current. In this case, it is not necessary to mask the back surface of the silicon substrate. Further, the selective porosification of the silicon surface may utilize the difference in the p-type and n-type porosification rates instead of masking.

When a silicon substrate partially having a porous layer is dipped in a sodium hydroxide solution or a hydrofluoric acid solution, only the porous layer is formed due to the difference in etching rate between the porous layer and the non-porous layer of silicon. It is selectively etched.

In this way, a large number of heads having a plurality of ink nozzles can be manufactured on the silicon substrate.

In order to clean the end face shape of the ink nozzles, patterning may be performed so that the ejection faces of the ink nozzles of the two ink jet heads face each other, and the substrate may be cut after etching. Alternatively, the head may be first cut (diced) to expose the ink ejection end surface of the head, and then protected by wax or the like for etching.

It is also a good method to change the width of the groove near the nozzle discharge port to control the discharge amount of ink or change the discharge speed.

The present invention will be described below with reference to specific examples.

Example 1 An edge shooter type ink jet recording head is manufactured (see FIG. 2 for manufacturing process).

(1) A resist 6 is spin-coated on both surfaces of the silicon substrate 1 to form a groove shape (width 60 μm) in which ink flows.
The pattern exposure is performed according to the above step, and unnecessary resist corresponding to the groove is removed by washing.

(2) The substrate 1 is anodized (soaked in 30% by volume of hydrofluoric acid) to make the portion 7 for forming the ink flow path porous to a depth of 50 μm.

(3) Next, a protective layer (s-Si) 8 having a thickness of 1 μm is formed on the porous layer except the ink inlet 5. Also,
SiO ₂ is deposited to a thickness of 1 μm as an insulating layer.

(4) The heating resistance layer (ZrB ₂ ) 9 is set to 0.1
μm, and an electrode layer 1 for applying a voltage to the heating resistance layer
Then, Au was laminated to 0.3 μm, and then a 50 μm × 100 μm heating element was prepared by selective photoetching. After that, SiO ₂ is 3 μm as the heat insulating layer 11 and p-Si is 10 μm as the heat dissipation layer 12 so as to cover the heat insulating layer.
Form a film.

(5) The substrate 1 is dipped in 40% by volume of hydrofluoric acid and etched to selectively remove the porous layer to form the channel 3.

The selective etching in the above step (5) does not have to be the final step if the necessary layer exposed on the surface of the substrate is a film having good etching resistance. For example, selective etching may be performed after the step (3), and then the heating resistance layer and the like may be formed. This makes it possible to form a film of a material that is easily corroded by hydrofluoric acid in a later step.

When recording is continuously performed and the heat radiation in the head becomes insufficient, a metal such as copper or aluminum is brought into contact with the heat radiation portion or joined by anodic bonding, or the ink storage portion is arranged on the heat radiation layer. It is also a good method to make heat dissipation more efficient by doing so. This method also has the effect of preventing the phenomenon that when the ink foams, the membrane is deformed and part of the pressure is dispersed.

Example 2 A side shooter type ink jet recording head is manufactured. That is, in this embodiment, the ink ejection port 13 is formed on the surface of the substrate 1.

FIG. 3 is for explaining a schematic structure of the ink jet recording head according to this embodiment.
(A) is a perspective view, (b) is sectional drawing which follows the III-III 'line of (a).

(1) A resist is spin-coated on both surfaces of the silicon substrate 1, pattern exposure is performed in accordance with the groove shape (width 80 μm) in which ink flows, and unnecessary resist corresponding to the groove is removed by washing.

(2) The substrate 1 is anodized (soaked in 50% by volume of hydrofluoric acid) to make the portion for forming the ink flow path porous.

(3) Next, the protective layer (s-Si, Ta) 8 is 1.0 on the porous layer except for the ink inlet and the outlet 13.
μm, passivation film (Ta ₂ O ₅ 0.2 μm,
A film of SiO ₂ of 2.0 μm, not shown) is formed.

(4) The heating resistance layer (HfB ₂ ) 9 is set to 0.1
A Pt layer having a thickness of 3 μm and Pt having a thickness of 0.2 μm as an electrode layer 10 for applying a voltage to the heating resistor layer is formed, and then 60 μm × 150 μm is formed by selective photoetching. After that, SiO ₂ is deposited to 3 μm as the heat insulating layer 11 and p-Si is deposited to 7 μm as the heat dissipation layer 12 so as to cover the heat insulating layer.

(5) The substrate 1 is dipped in hydrofluoric acid and etched to selectively remove the porous layer.

<Third Embodiment> The ink jet recording head of the first or second embodiment is manufactured by the same structure and the same manufacturing method as described above, except for the points described below.

FIG. 4 is for explaining an electrode structure applied to the ejection element portion of the ink jet recording head.
(A) is a schematic plan view showing a conventional configuration example, (b) is a sectional view taken along the line AB of (a), and (c) is a configuration of electrodes applied to the inkjet recording head of the present embodiment. Is a schematic plan view showing the above, and (d) is a sectional view taken along the line C-D of (c). In the figure, reference numeral 9 is a heating resistance layer, 10 is an electrode layer, and 14 is an insulating layer.

As shown in FIGS. 4A to 4D, according to the structure of this embodiment, as compared with the conventional one, the heating resistance layer 9 is used.
The width of the ejection element portion 4 can be narrowed while the width of the ejection element portion 4 is widened.

The ejection element section 4 applied to the ink jet recording head of this embodiment has a heating resistance layer (HfB ₂ ) 9 of 0.1 μm and one electrode layer 10 for applying a voltage to the heating resistance layer. After 0.5 μm of Al was laminated, an electrode pattern having a width of 50 μm was produced by selective etching. Further, an insulating layer (SiO ₂ ) 14 having a thickness of 2 μm was formed, and the insulating layer 14 was selectively etched so that the length of the heating resistor layer was 100 μm to expose a part of the heating resistor layer.

Further, 0.5 μm of Al was laminated and patterned as the other electrode layer 10. As described above, with the electrode configuration as shown in this embodiment, the width of the ejection element portion 4 can be narrowed without narrowing the width of the heating resistance layer, and the nozzle width can be narrowed. It is possible to further increase the density of the inkjet head.

As a modification of the electrode portion of the third embodiment, a heating resistance layer is arranged around the ink ejection port (at least before and after the flow path direction) so that bubbles are generated from both sides of the ink ejection port. Good. By generating bubbles from both sides of the ejection port, the ejection efficiency of ink can be improved.

When the porous layer is removed by etching, it is possible to leave a part of the porous layer behind the ejection element portion of the nozzle. In this case, when bubbles of ink are generated, the ink moves at a high speed so that it hardly passes through the porous layer and has an effect of preventing ink backflow, and when not recording, the ink slowly passes through the porous layer and is sent to the nozzle tip. The ink is supplied. In this case, the porous layer is heated to a high temperature (about 100
It is effective to increase the size of the pores by heating to 0 ° C).

Depending on the reaction conditions, films resistant to hydrofluoric acid include Mo, W, Pb, Al, Mg and F.
e, Ni, Ag, Cu, Ti, Zr, Hf, V, Nb,
SiN, Ta, monel metal, etc. can be used.

Although the case where the present invention is applied to the thermal type ink jet has been described above, the present invention can also be applied to the similar type such as the electric field suction type slit jet.

Next, a brief description will be given of a bubble jet type ink droplet forming process performed by the recording head having the above-described structure.

First, when the heating resistance layer (heater) reaches a predetermined temperature, film bubbles covering the heater surface are generated. The internal pressure of this bubble is very high, pushing out the ink in the nozzle. The ink is moved by the inertial force of this extrusion toward the ink injection port outside the nozzle and in the opposite direction. As the movement of the ink proceeds, the internal pressure of the bubble becomes negative, and the flow velocity resistance is added, so that the speed of the ink inside the nozzle becomes slow. Since the ink discharged from the nozzle opening (orifice) is faster than the inside of the nozzle, constriction occurs due to the balance of inertial force, flow path resistance, shrinkage of air bubbles, and ink surface tension, resulting in separation and droplet formation. Simultaneously with the contraction of the bubbles, ink is supplied from the common liquid chamber into the nozzle by the capillary force and waits for the next pulse.

As described above, the recording head using the electrothermal conversion element composed of the heat generation resistance layer as the energy generating means can generate bubbles in the ink of the liquid path in a one-to-one correspondence with the driving electric pulse signal. Moreover, since bubbles can be grown and contracted immediately and appropriately, it is possible to achieve ink droplet ejection with excellent responsiveness. Also,
It is easy to make the recording head compact, and recent technological advances and reliability improvements in the semiconductor field are remarkable.
We can make full use of the advantages of C technology and micromachining technology,
This is advantageous because high-density mounting is easy and the manufacturing cost is low.

Next, an example of an ink jet recording apparatus equipped with the ink jet recording head having the above structure will be described.

FIG. 5 is a schematic diagram of an example of an ink jet recording apparatus equipped with an ink jet cartridge IJC in which an ink jet recording head having the above-described structure and an ink tank for supplying ink to the recording head are integrated. It is a perspective view which shows a dynamic structure. This ink jet recording apparatus IJRA has a lead screw 2040 that rotates via driving force transmission gears 2020 and 2030 in conjunction with forward and reverse rotation of a driving motor 2010. The carriage HC on which the inkjet cartridge IJC is mounted has a pin (not shown) that is supported by the carriage shaft 2050 and the lead screw 2040 and engages with the groove 2041 of the lead screw 2040. With the rotation of 2040, it is reciprocated in the directions of arrows a and b. Reference numeral 2060 denotes a paper pressing plate, which presses the paper P against the platen roller 2070 in the carriage movement direction. 2080 and 2090
Is a photocoupler, which operates as a home position detecting means for confirming the presence of the lever 2100 provided on the carriage HC in this area and switching the rotation direction of the motor 2010 and the like. 2110, a cap member for capping the front surface of the recording head;
Supported by 0. Reference numeral 2130 denotes suction means for sucking the inside of the cap, and performs suction recovery of the recording head through the opening in the cap. A cleaning blade 2140 for cleaning the end face of the recording head is provided on a member 2150 so as to be movable in the front-rear direction, and these are supported by a main body support plate 2160.

Reference numeral 2170 is a lever for starting suction for suction recovery, which is moved along with the movement of the cam 2180 engaged with the carriage HC, whereby the driving force from the drive motor 2010 is set. Is controlled to move by transmission means such as clutch switching.

Since the ink jet recording apparatus having the above structure is capable of high density and high speed recording operation,
A printer as an output terminal of the information processing system, for example, an output terminal such as a copying machine, a facsimile, an electronic typewriter, a word processor, a workstation, or a handy or portable printer provided in a personal computer, a host computer, an optical disk device, a video device, or the like. Available as In this case, the inkjet recording apparatus has a configuration corresponding to the function, usage pattern, etc. peculiar to these apparatuses.

Further, in the case of a color-compatible ink jet recording apparatus, a color image is formed by superposing ink droplets ejected by recording heads of a plurality of colors or by arranging colors in a matrix (N × N). Generally, when performing color recording, four types of recording heads and ink cartridges corresponding to four primary colors of yellow (Y), magenta (M) and cyan (C) or four colors including black (B) in these three primary colors. Need.

Furthermore, the above-mentioned ink jet recording apparatus can be configured so that large-format recording such as A1 can be performed relatively easily. That is, it can be used as a plotter such as a printer for CAD output, which is a recording device compatible with A1 version color recording for connecting an image reading reader and copying an original. On the other hand, various uses are possible,
For example, it can be recorded on transparencies that can be projected for presentations at conferences, lectures, etc.

As described above, the ink jet recording apparatus equipped with the ink jet recording head of the present invention can be used as an excellent recording means in a wide range of industrial fields (for example, the apparel industry) and is higher than the conventional one. It would be possible to provide quality images.

[0078]

As described above, the ink jet recording head according to the present invention and the manufacturing method of the head,
According to a recording device equipped with the head and an information processing system using the recording device as an output unit, the ink jet recording head has a flow path of ink on a semiconductor substrate and an ejection element portion (electrode layer) for ejecting ink. , A heating resistance layer and the like) are integrally formed, and therefore, high-level alignment due to bonding at the time of head production is not required, and an inkjet recording head is provided by a simple method.
As a result, it is possible to reduce the size and cost of the inkjet recording head and the recording apparatus, and it is possible to always form a high-quality image.

[Brief description of drawings]

FIG. 1 is a view for explaining a schematic configuration of an inkjet recording head according to the present invention, in which (a) is a perspective view,
FIG. 2B is a cross-sectional view taken along the line II ′ of FIG.

FIG. 2 corresponds to a cross-sectional view taken along the line II ′ of FIG. 1A for explaining the method for manufacturing the inkjet recording head shown in FIG. 1, and FIGS. It is sectional drawing corresponding to.

FIG. 3 is a view for explaining a schematic configuration of an inkjet recording head according to the present invention, in which (a) is a perspective view,
(B) is a sectional view taken along the line III-III ′ of (a).

4A and 4B are diagrams for explaining an electrode configuration applied to an ejection element portion of an inkjet recording head, in which FIG. 4A is a schematic plan view showing a conventional configuration example, and FIG. B
A sectional view taken along the line, (c) is a schematic plan view showing the configuration of an electrode applied to the inkjet recording head of the present embodiment,
(D) is sectional drawing which follows the CD line of (c).

FIG. 5 is a perspective view showing a schematic configuration of an example of an ink jet recording apparatus in which an ink jet cartridge having an ink jet recording head according to the present invention and an ink tank for supplying ink to the recording head is integrated. is there.

FIG. 6 is a perspective view for explaining the configuration of a conventional inkjet recording head.

[Explanation of symbols]

 1 Substrate (silicon substrate) 2 Ink flow path 3 Ink ejection port 4 Ejection element section 5 Ink injection port 8 Protective layer 9 Heat generation protective layer 10 Electrode layer

Claims (11)

[Claims] 1. An ink jet recording head mounted in a recording device for recording input image information by ejecting ink droplets onto a recording medium, the ink ejection port for ejecting ink droplets onto the recording medium. And an ink flow path covering part for covering the ink flow path and an ink flow path having the other end as an ink injection port for receiving the ink supply, and an ink flow path coating part are integrally formed on the semiconductor substrate. Inkjet recording head. 2. The ink jet recording head according to claim 1, wherein an ejection element portion for generating energy for ejecting ink is formed integrally with the ink flow path coating portion. 3. The ink jet recording head according to claim 2, wherein the ejection element portion has a heating resistance layer and an electrode layer. 4. The heat-generating resistance layer is an electrothermal converter that generates heat energy that causes film boiling in the ink, as an energy generating unit that discharges the ink droplets. 3. The inkjet recording head according to item 3. 5. A carriage for mounting the inkjet recording head according to any one of claims 1 to 4 as recording means, a conveying means for conveying a recording medium, the inkjet recording head, and the carriage. And a control means for controlling the driving of the conveying means. 6. An information processing system using the ink jet recording apparatus according to claim 5 as output means. 7. A method of manufacturing an ink jet recording head mounted on a recording apparatus for recording input image information by ejecting ink droplets onto a recording medium, the method comprising ejecting ink droplets onto the recording medium. An ink flow path having an ink discharge port as one end and an ink injection port for receiving ink as the other end, and an ink flow path covering portion that covers the ink flow path are integrally formed on a semiconductor substrate. And a method for manufacturing an inkjet recording head. 8. The ink jet recording head manufacturing method according to claim 7, wherein an ejection element portion for generating energy for ejecting ink is formed integrally with the ink flow path coating portion. Method. 9. The method for manufacturing an ink jet recording head according to claim 8, wherein the ejection element portion has a heating resistance layer and an electrode layer. 10. The heat-generating resistance layer is an electrothermal converter that generates heat energy that causes film boiling in the ink, as an energy generating unit that discharges the ink droplets. 9. The method for manufacturing an inkjet recording head according to item 9. 11. The method according to claim 7, further comprising a step of forming a porous layer on the semiconductor substrate by anodization, and forming the flow path coating layer on the porous layer.
9. The method for manufacturing an inkjet recording head according to any one of items 1.