JPH0935820A - Connector with built-in electronic component - Google Patents

Connector with built-in electronic component

Info

Publication number
JPH0935820A
JPH0935820A JP20842295A JP20842295A JPH0935820A JP H0935820 A JPH0935820 A JP H0935820A JP 20842295 A JP20842295 A JP 20842295A JP 20842295 A JP20842295 A JP 20842295A JP H0935820 A JPH0935820 A JP H0935820A
Authority
JP
Japan
Prior art keywords
electronic component
connector
cable
built
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP20842295A
Other languages
Japanese (ja)
Inventor
Hiroyuki Masuda
浩之 増田
Yoji Imai
庸二 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP20842295A priority Critical patent/JPH0935820A/en
Publication of JPH0935820A publication Critical patent/JPH0935820A/en
Withdrawn legal-status Critical Current

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Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the circuit characteristics from varying even if a mold resin exists around electronic component and therefore, as a result, obtain the desired circuit characteristics. SOLUTION: A connector fitted internally with electronic component is equipped with a connector part 7 to be connected with the terminal of an electronic appliance, electronic component 1 installed at the base of the connector part 7, and a cable 6 connected with the connector part 7 on its side with the base. The electronic component 1 is encased in a case 8, and the connecting end part of the cable 6 and the component 1 are enclosed in a single piece with the case 8, and a mold resin 9 is applied in such a way that these parts are fixed to the base of the connector part 7.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器を相互に接続
するコネクターに関し、特にノイズ除去部品等のよう
に、電子部品を備え、その電子部品がケーブルの接続端
部と共にモールド樹脂で一体に覆われた電子部品内蔵コ
ネクターに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for connecting electronic devices to each other, and in particular, it has an electronic component such as a noise removing component, and the electronic component is integrally formed with a connecting end portion of a cable by a molding resin. The present invention relates to a covered electronic component built-in connector.

【0002】[0002]

【従来の技術】電子機器の電子回路がデジタル化される
のに伴い、回路の内部で使用する高調波が電磁波とな
り、これがノイズとなって他の電子機器の回路に悪影響
を及ぼすという問題がある。このようなノイズは、空間
或はケーブル等の導線を介して伝搬するが、空間に輻射
されるノイズはケーブルから発生することが多い。その
ために、電気機器を相互に接続するケーブルとコネクタ
ーとの間にノイズ除去回路を挿入し、電子機器から発生
するノイズを除去し、或は電子機器に侵入しようとする
ノイズを除去することが行われている。
2. Description of the Related Art As electronic circuits of electronic devices are digitized, harmonics used inside the circuits become electromagnetic waves, which become noise and adversely affect the circuits of other electronic devices. . Such noise propagates through a space or a conductor such as a cable, but noise radiated into the space is often generated from the cable. To this end, a noise elimination circuit is inserted between the cable and the connector that connect electrical equipment to each other to remove the noise generated by the electronic equipment or the noise that tries to enter the electronic equipment. It is being appreciated.

【0003】このような目的に使用されるノイズ除去部
品を有するコネクターは、コネクター部にノイズ除去回
路を設け、このノイズ除去回路を介してケーブルをコネ
クター部に接続する。そして、従来におけるこの種のコ
ネクターでは、ノイズ除去回路を外力から保護するた
め、ケーブルの接続端部とノイズ除去回路の部分を一体
にモールド樹脂で覆い、これらケーブルの接続端部とノ
イズ除去回路をコネクター部の基端部に固定している。
In a connector having a noise removing component used for such a purpose, a noise removing circuit is provided in the connector section, and a cable is connected to the connector section via the noise removing circuit. In this type of conventional connector, in order to protect the noise removal circuit from external force, the connection end of the cable and the noise removal circuit are integrally covered with mold resin, and the connection end of the cable and the noise removal circuit are covered. It is fixed to the base end of the connector.

【0004】[0004]

【発明が解決しようとしている課題】ノイズ除去回路
は、キャパシターとインダクターとからなるLCフィル
ターが使用される。これらのキャパシターとインダクタ
ーとは、殆どのものがチップ化されており、特に積層チ
ップ部品が使用される。ところが、前述のようにしてノ
イズ除去部品をモールド樹脂で覆う場合、モールド成形
中や成形後の樹脂の収縮等により、前記のようなノイズ
除去回路を構成するチップ状電子部品の内部に応力が発
生し、チップ素体に歪を生じる。そうすると、キャパシ
ターのキャパシタンスやインダクターのインダクタンス
が変化してしまい、ノイズ除去回路の回路特性が変動し
てしまう。そのため、結果として所望の回路特性が得ら
れず、充分なノイズ除去効果が得られない、という課題
があった。
The noise removing circuit uses an LC filter composed of a capacitor and an inductor. Most of these capacitors and inductors are made into chips, and especially laminated chip parts are used. However, when the noise removal component is covered with the mold resin as described above, stress is generated inside the chip-shaped electronic components that make up the noise removal circuit due to shrinkage of the resin during molding or after molding. However, the chip body is distorted. Then, the capacitance of the capacitor and the inductance of the inductor change, and the circuit characteristics of the noise removing circuit change. As a result, there is a problem that desired circuit characteristics cannot be obtained and a sufficient noise removing effect cannot be obtained.

【0005】本発明はこのような従来の電子部品を内蔵
したコネクターにおける課題に鑑み、電子部品の周囲に
モールド樹脂を成形しても回路特性が変動せず、従って
結果として所望の回路特性が得られる電子部品内蔵コネ
クターを提供することを目的とする。
In view of the problems in the conventional connector having a built-in electronic component, the present invention does not change the circuit characteristic even if the molding resin is molded around the electronic component, and as a result, the desired circuit characteristic is obtained. It is intended to provide a connector with a built-in electronic component.

【0006】[0006]

【課題を解決するための手段】本発明では、前記の目的
を達成するため、モールド樹脂9を成形する際に、その
収縮等の変形がモールド樹脂9で覆われる電子部品1に
直接及ばないようにした。すなわち、電子部品1をケー
ス8や軟質部材8’等の保護部材で覆い、その上からモ
ールド樹脂9で覆うことで、モールド樹脂9の収縮等の
変形を保護部材で受け止め、或は吸収し、電子部品1に
及ばないようにした。
According to the present invention, in order to achieve the above-mentioned object, when molding the molding resin 9, deformation such as shrinkage thereof does not directly affect the electronic component 1 covered with the molding resin 9. I chose That is, by covering the electronic component 1 with a protective member such as the case 8 or the soft member 8 ′ and then with the mold resin 9, the deformation such as shrinkage of the mold resin 9 is received or absorbed by the protective member, I tried not to reach the electronic component 1.

【0007】すなわち、本発明による電子部品内蔵コネ
クターは、電子機器のターミナル端子に接続されるコネ
クター部7と、このコネクター部7の基部側に設けられ
た電子部品1と、コネクター部7の基部側で同コネクタ
ー部7に接続されたケーブル6と、このケーブル6の接
続端部及び電子部品1を一体に覆い、且つそれらを前記
コネクター部7の基部に固定したモールド樹脂9とを備
えている。そして特に、前記電子部品1が保護部材で覆
われ、この保護部材を覆うように前記モールド樹脂9が
施されていることを特徴とする。
That is, the connector with a built-in electronic component according to the present invention includes a connector portion 7 connected to a terminal terminal of an electronic device, an electronic component 1 provided on the base side of the connector portion 7, and a base portion side of the connector portion 7. The cable 6 is connected to the connector section 7, and the molding resin 9 integrally covering the connection end of the cable 6 and the electronic component 1 and fixing them to the base of the connector section 7 is provided. In particular, the electronic component 1 is covered with a protective member, and the mold resin 9 is applied so as to cover the protective member.

【0008】ここで、電子部品1はコネクター部7の基
部に取り付けられた回路基板3の上に搭載され、この回
路基板3の回路パターン4にケーブル6が接続されてい
る。例えば保護部材としては、ケース8を使用し、これ
を回路基板3の上に固定し、電子部品1を覆う。また、
保護部材の他の例として、モールド樹脂9より軟らかい
軟質部材8’をあげることができ、これで電子部品1を
覆い、その上にモールド樹脂9を施す。
Here, the electronic component 1 is mounted on the circuit board 3 attached to the base of the connector portion 7, and the cable 6 is connected to the circuit pattern 4 of the circuit board 3. For example, a case 8 is used as a protective member, which is fixed on the circuit board 3 to cover the electronic component 1. Also,
As another example of the protective member, a soft member 8 ′ that is softer than the mold resin 9 can be cited, which covers the electronic component 1 and the mold resin 9 is applied thereon.

【0009】[0009]

【作用】前記本発明による電子部品内蔵コネクターで
は、電子部品1が回路基板3やケース8に覆われ、この
上にモールド樹脂9が施されるため、モールド樹脂9の
成形中或は成形後に生じる収縮等の変形がケース8で受
け止められ、電子部品1には及ばない。そのため、電子
部品1の内部に応力が発生せず、歪が生じないので、電
子部品1の特性変動が起らない。この結果、回路特性の
変化が起らず、所望の回路特性が得られる。また、保護
部材として軟質部材8’を使用した場合も、モールド樹
脂9の成形中或は成形後の収縮等の変形を軟質部材8’
が吸収するため、モールド樹脂9の変形が電子部品1に
は殆ど及ばない。このため、やはり電子部品1の特性変
動が起らない。
In the connector with a built-in electronic component according to the present invention, since the electronic component 1 is covered with the circuit board 3 and the case 8 and the mold resin 9 is applied on it, it occurs during or after the molding of the mold resin 9. Deformation such as shrinkage is received by the case 8 and does not reach the electronic component 1. Therefore, no stress is generated inside the electronic component 1 and no distortion is generated, so that the characteristic variation of the electronic component 1 does not occur. As a result, the circuit characteristics do not change and desired circuit characteristics are obtained. Even when the soft member 8'is used as the protective member, the soft member 8'is not deformed during the molding of the molding resin 9 or after the molding.
Is absorbed, the deformation of the mold resin 9 hardly reaches the electronic component 1. Therefore, the characteristic variation of the electronic component 1 does not occur.

【0010】[0010]

【実施例】次に、図面を参照しながら、本発明の実施例
について具体的且つ詳細に説明する。図1〜図4は、本
発明の実施例による電子部品内蔵コネクターを示すもの
である。この電子部品内蔵コネクターは、電子機器のタ
ーミナル端子に接続されるコネクター部7を有してお
り、図1、図2及び図4に示されたように、このコネク
ター部7の電子機器のターミナル端子に嵌合される先端
と反対側、すなわち基端側に印刷基板等の回路基板3が
取り付けられている。
Embodiments of the present invention will now be described specifically and in detail with reference to the drawings. 1 to 4 show a connector with a built-in electronic component according to an embodiment of the present invention. This electronic component built-in connector has a connector portion 7 connected to a terminal terminal of an electronic device. As shown in FIGS. 1, 2, and 4, the connector portion 7 has a terminal terminal of the electronic device. The circuit board 3 such as a printed circuit board is attached to the side opposite to the front end fitted to the base, that is, the base end side.

【0011】図1及び図4に示された通り、この回路基
板3上には回路パターン4が形成され、この上にキャパ
シターやインダクター等の電子部品1が搭載され、それ
らの端子電極2が回路パターン4に半田付けされ、これ
によりノイズ除去フィルター等の回路が構成されてい
る。前記回路パターンは図示してない導体によりコネク
ター部7の導体端子に接続されている。また、他方の回
路パターン4に半田5でケーブル6が接続され、これに
よりケーブル6が回路基板3上に構成した回路を介して
コネクター部7に接続される。図示のケーブル6は、同
軸ケーブルであり、内側導線12と外側導線13とが各
々回路パターン4に接続されている。
As shown in FIGS. 1 and 4, a circuit pattern 4 is formed on the circuit board 3, and electronic parts 1 such as capacitors and inductors are mounted on the circuit pattern 4, and their terminal electrodes 2 are connected to the circuit. The pattern 4 is soldered to form a circuit such as a noise removal filter. The circuit pattern is connected to a conductor terminal of the connector portion 7 by a conductor (not shown). Further, the cable 6 is connected to the other circuit pattern 4 with the solder 5, and thus the cable 6 is connected to the connector portion 7 through the circuit formed on the circuit board 3. The illustrated cable 6 is a coaxial cable, and an inner conducting wire 12 and an outer conducting wire 13 are connected to the circuit pattern 4, respectively.

【0012】前記回路基板3の電子部品1よりケーブル
6側の中央部とコネクター部7側の中央部とに各々スリ
ット状の取付孔10が設けられており、図1ではコネク
ター部7側の取付孔はコネクター部7の基部の陰に隠れ
ていて見えない。この回路基板3の取付孔10の間隔と
同じ間隔で下側の両端に突起11が突設され、底面が開
口したケース8が備えられている。このケース8は回路
基板3上に搭載された電子部品1を全体的に覆うことが
できる内部寸法を有している。そしてこのケース8は、
図2に示すように、その突起11を前記回路基板3の取
付孔10に嵌合することで、回路基板3上に取り付けら
れ、これによって回路基板3上の電子部品1を覆う。ケ
ース8としては、金属ケースを使用することができ、こ
の場合はケース8を回路基板3のアース配線に接続し、
シールドケースと兼用することもできる。
A slit-shaped mounting hole 10 is provided in each of the central portion on the cable 6 side and the central portion on the connector portion 7 side of the electronic component 1 of the circuit board 3, and in FIG. The hole is hidden behind the base of the connector part 7 and cannot be seen. The case 8 is provided with protrusions 11 projecting from both ends on the lower side at the same intervals as the intervals of the mounting holes 10 of the circuit board 3 and the bottom surface of which is open. The case 8 has an internal size capable of covering the electronic component 1 mounted on the circuit board 3 as a whole. And in this case 8,
As shown in FIG. 2, the protrusions 11 are fitted into the mounting holes 10 of the circuit board 3 to be mounted on the circuit board 3, thereby covering the electronic component 1 on the circuit board 3. A metal case can be used as the case 8, and in this case, the case 8 is connected to the ground wiring of the circuit board 3,
It can also be used as a shield case.

【0013】さらに、このようにケース8を取り付けた
状態で、図3及び図4に示すように、ケーブル6の接続
端部、回路基板3及びケース8の全体を覆い、且つコネ
クター部7の基部に達するようにモールド樹脂9が成形
される。このモールド樹脂9によってケーブル6の接続
端部、回路基板3、ケース8及びコネクター部7が一体
に固定される。このモールド樹脂9は、塩化ビニル樹脂
等からなり、コネクター部7からケーブル6の接続端部
にわたって細くなるようなテーパーを形成している。こ
れによって、コネクター部7はモールド樹脂9にしっか
りと固定される一方、ケーブル6の端部側には或る程度
の可撓性が得られる。このモールド樹脂9はケース8に
よって電子部品1に接触せず、このためその成形時や成
形後の収縮力が電子部品1には及ばない。
Further, with the case 8 attached in this manner, as shown in FIGS. 3 and 4, the connection end portion of the cable 6, the circuit board 3 and the case 8 are entirely covered, and the base portion of the connector portion 7 is provided. Mold resin 9 is molded so as to reach. The molding resin 9 integrally fixes the connection end of the cable 6, the circuit board 3, the case 8 and the connector 7. The mold resin 9 is made of vinyl chloride resin or the like, and forms a taper that becomes thin from the connector portion 7 to the connection end portion of the cable 6. As a result, the connector portion 7 is firmly fixed to the molding resin 9, while a certain degree of flexibility is obtained on the end side of the cable 6. The mold resin 9 does not come into contact with the electronic component 1 due to the case 8, and therefore, the contracting force during or after the molding does not reach the electronic component 1.

【0014】図5と図6に本発明の他の実施例による電
子部品内蔵コネクターを示す。この実施例では、前記ケ
ース8に代えて、回路基板3上の電子部品1をモールド
樹脂9より軟らかい軟質部材8’で覆っている。この軟
質部材8’は、例えばモールド樹脂9が塩化ビニル樹脂
等からなる場合、シリコーンゴム等の軟質な材料を使用
し、例えばディスペンサー等で回路基板3上に滴下して
設ける。その後、前述と同様にしてモールド樹脂9を成
形する。この軟質部材8’は、モールド樹脂9の成形時
や成形後に生じるモールド樹脂9の収縮等の変形を吸収
し、その収縮力が電子部品1に及びのを防止する。
5 and 6 show an electronic component built-in connector according to another embodiment of the present invention. In this embodiment, instead of the case 8, the electronic component 1 on the circuit board 3 is covered with a soft member 8'which is softer than the molding resin 9. For example, when the molding resin 9 is made of vinyl chloride resin or the like, the soft member 8'is made of a soft material such as silicone rubber and is dropped on the circuit board 3 by a dispenser or the like. After that, the molding resin 9 is molded in the same manner as described above. The soft member 8 ′ absorbs deformation such as shrinkage of the mold resin 9 that occurs during or after the molding of the mold resin 9 and prevents the shrinkage force from reaching the electronic component 1.

【0015】なお、以上の実施例では何れも回路基板3
を使用しているが、例えば、電子部品1がLCチップ部
品のような複合チップ部品である場合、或はハイブリッ
ドIC等のような単体状の機能部品である場合、かなら
ずしも回路基板3を必要としない。この場合は、電子部
品を前記のケース8等に収納した状態でコネクター部7
の基部に取り付ける。
In each of the above embodiments, the circuit board 3 is used.
However, for example, when the electronic component 1 is a composite chip component such as an LC chip component or a single functional component such as a hybrid IC, the circuit board 3 is always required. do not do. In this case, the connector part 7 should be accommodated with the electronic parts housed in the case 8 or the like.
Attach to the base of.

【0016】[0016]

【発明の効果】以上説明した通り、本発明によれば、モ
ールド樹脂9の成形中或は成形後に生じる収縮等の変形
が電子部品1に及ばないため、電子部品1の内部に応力
が発生せず、歪が生じない。これにより、電子部品1の
特性変動による回路特性の変化が起らず、所望の回路特
性が得られる。
As described above, according to the present invention, deformation such as shrinkage during or after molding of the molding resin 9 does not affect the electronic component 1, so that stress is generated inside the electronic component 1. No distortion occurs. As a result, the circuit characteristics do not change due to the characteristic changes of the electronic component 1, and the desired circuit characteristics are obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例による電子部品内蔵コネクター
のモールド樹脂を施す前の回路基板からケースを分解し
た状態の斜視図である。
FIG. 1 is a perspective view showing a state in which a case is disassembled from a circuit board before a mold resin is applied to a connector with a built-in electronic component according to an embodiment of the present invention.

【図2】同実施例による電子部品内蔵コネクターのモー
ルド樹脂を施す前のケースを回路基板に取り付けた状態
の斜視図である。
FIG. 2 is a perspective view showing a state in which the case before applying the molding resin of the electronic component built-in connector according to the embodiment is attached to the circuit board.

【図3】同実施例による電子部品内蔵コネクターのモー
ルド樹脂を施した状態の斜視図である。
FIG. 3 is a perspective view showing a state in which a mold resin is applied to the electronic component built-in connector according to the embodiment.

【図4】同実施例による電子部品内蔵コネクターのモー
ルド樹脂を一部切り欠いた側面図である。
FIG. 4 is a side view in which the mold resin of the connector with a built-in electronic component according to the embodiment is partially cut away.

【図5】本発明の他の実施例による電子部品内蔵コネク
ターのモールド樹脂を一部切り欠いた斜視図である。
FIG. 5 is a perspective view of the connector with a built-in electronic component according to another embodiment of the present invention with a part of the molding resin cut away.

【図6】同実施例による電子部品内蔵コネクターのモー
ルド樹脂を一部切り欠いた側面図である。
FIG. 6 is a side view of the connector with a built-in electronic component according to the embodiment with a part of the molding resin cut away.

【符号の説明】[Explanation of symbols]

1 電子部品 3 回路基板 4 回路基板の回路パターン 6 ケーブル 7 コネクター部 8 ケース 8’ 軟質部材 9 モールド樹脂 DESCRIPTION OF SYMBOLS 1 Electronic component 3 Circuit board 4 Circuit pattern of circuit board 6 Cable 7 Connector part 8 Case 8'Soft member 9 Mold resin

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 電子機器のターミナル端子に接続される
コネクター部(7)と、このコネクター部(7)の基部
側に設けられた電子部品(1)と、コネクター部(7)
の基部側で同コネクター部(7)に接続されたケーブル
(6)と、このケーブル(6)の接続端部及び電子部品
(1)を一体に覆い、且つそれらを前記コネクター部
(7)の基部に固定したモールド樹脂(9)とを備える
電子部品内蔵コネクターにおいて、前記電子部品(1)
が保護部材で覆われ、この保護部材を覆うように前記モ
ールド樹脂(9)が施されていることを特徴とする電子
部品内蔵コネクター。
1. A connector part (7) connected to a terminal terminal of an electronic device, an electronic component (1) provided on the base side of the connector part (7), and a connector part (7).
The cable (6) connected to the connector part (7) at the base side of the, the connection end part of the cable (6) and the electronic component (1) are integrally covered, and they are connected to the connector part (7). A connector with a built-in electronic component, comprising a mold resin (9) fixed to a base, wherein the electronic component (1)
Is covered with a protective member, and the molding resin (9) is applied so as to cover the protective member.
【請求項2】 電子部品(1)がコネクター部(7)の
基部に取り付けられた回路基板(3)の上に搭載され、
この回路基板(3)の回路パターン(4)にケーブル
(6)が接続されていることを特徴とする請求項2に記
載の電子部品内蔵コネクター。
2. An electronic component (1) is mounted on a circuit board (3) attached to the base of a connector part (7),
The electronic component built-in connector according to claim 2, wherein a cable (6) is connected to the circuit pattern (4) of the circuit board (3).
【請求項3】 保護部材が回路基板(3)の上に固定さ
れ、電子部品(1)を覆ったケース(8)からなること
を特徴とする電子部品内蔵コネクター。
3. A connector with a built-in electronic component, wherein a protective member is fixed on a circuit board (3) and comprises a case (8) covering the electronic component (1).
【請求項4】 保護部材が電子部品(1)を覆ったモー
ルド樹脂(9)より軟らかい軟質部材(8’)からなる
ことを特徴とする請求項1または2に記載の電子部品内
蔵コネクター。
4. The connector with a built-in electronic component according to claim 1, wherein the protective member is made of a soft member (8 ') softer than the molding resin (9) covering the electronic component (1).
JP20842295A 1995-07-24 1995-07-24 Connector with built-in electronic component Withdrawn JPH0935820A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20842295A JPH0935820A (en) 1995-07-24 1995-07-24 Connector with built-in electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20842295A JPH0935820A (en) 1995-07-24 1995-07-24 Connector with built-in electronic component

Publications (1)

Publication Number Publication Date
JPH0935820A true JPH0935820A (en) 1997-02-07

Family

ID=16555965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20842295A Withdrawn JPH0935820A (en) 1995-07-24 1995-07-24 Connector with built-in electronic component

Country Status (1)

Country Link
JP (1) JPH0935820A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009093852A (en) * 2007-10-05 2009-04-30 Hitachi Ltd Connector sealing structure
EP2061298A2 (en) 2007-11-14 2009-05-20 Hosiden Corporation Shield case and printed circuit board assembly incorporating same
DE102011005570A1 (en) 2010-03-16 2011-09-22 Hitachi Automotive Systems, Ltd. Electronic device
EP2958196A1 (en) 2014-06-17 2015-12-23 Hitachi Metals, Ltd. Cable with molded resin

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009093852A (en) * 2007-10-05 2009-04-30 Hitachi Ltd Connector sealing structure
EP2061298A2 (en) 2007-11-14 2009-05-20 Hosiden Corporation Shield case and printed circuit board assembly incorporating same
DE102011005570A1 (en) 2010-03-16 2011-09-22 Hitachi Automotive Systems, Ltd. Electronic device
US8530759B2 (en) 2010-03-16 2013-09-10 Hitachi Automotive Systems, Ltd. Electronic apparatus
EP2958196A1 (en) 2014-06-17 2015-12-23 Hitachi Metals, Ltd. Cable with molded resin
US9640302B2 (en) 2014-06-17 2017-05-02 Hitachi Metals, Ltd. Cable with molded resin

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