JPH09327785A - Laser beam machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the dropping work of cut works by providing inclined slide plates opposite to each other on an opening part of a working table in an attachable/detachable manner in the longitudinal direction of the work. SOLUTION: When the longitudinal dimension WX of a cut work W1 is larger than the dimension of an opening part 50 of slide plates 20, 21, the work W1 is loaded astride between inclined surfaces 202, 212 of the slide plates 20, 21 opposite to each other, and the work W1 is required to be dropped from the opening part 50. When an operator pushes the work W1 by a work delivering bar appropriately in the X-direction, the work W1 loaded between the inclined surfaces 202, 212 of the slide plates 20, 21 is turned, and the work W1 is dropped downward from the opening part 50 of the slide plates 20, 21. That means, the work W1 is surely dropped downwardly by each work delivering operation after cutting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for mainly cutting a plate material placed on a processing table by a laser beam.

[0002]

2. Description of the Related Art Generally, a laser processing apparatus for performing fine processing based on input NC (numerical control) data is widely used.

Conventionally, for example, the apparatus shown in FIGS. 6 to 12 has been proposed. That is, 2 and 3 are processing tables attached to a fixed frame 1. The processing tables 2 and 3 are provided with a large number of rotatable free bearings 4, 4, ... The work W is placed on the free bearings 4, 4, .... In the central portion of the processing tables 2 and 3 as a whole, an opening 5 in the longitudinal direction of the work W, that is, a vertical direction opposed to the X direction is formed. For example, in the illustrated case, the end portions of the processing tables 2 and 3 are attached at a distance of L _{1 in the} X direction. The opening 5 is used for the cut work W ₁
Is for dropping the work W ₁ to the outside of the apparatus, and therefore the fixed frame 1 has an opening 5
Appropriate passages are formed to guide the falling work W ₁ downward.

6 is a work W placed on the processing table.
While maintaining the longitudinal direction of the workpiece W, that is, the workpiece moving device which moves in the X direction, for example, a work moving device 6 and Y ₁ direction of the end portion holding and releasable retaining members 7 of the workpiece W, the holding The driving mechanism 8 is capable of moving and adjusting the member 7 in the X direction.

A well-known linear movement mechanism is appropriately adopted as the drive mechanism 8. For example, a motor (not shown) and a screw shaft 801 rotated by this motor are used.
And a guide member 80 parallel to the screw shaft 801
The drive mechanism 8 is configured by 2 and a moving base 803 which has a female screw threadedly engaged with the screw shaft 801 and is moved along the guide member 802 in the X direction.

[0006] 9 the laser oscillator appropriate attached to the frame 1 fixed, for example, carbon dioxide gas laser oscillator, the first 10 for reflecting the laser beam output from the laser oscillator 9 width direction of the workpiece W, that is, Y ₁ direction Reflector, 1
Reference numeral 1 denotes a laser processing head. For example, the laser processing head 11 basically transmits a laser beam directed in the Y ₁ direction by the first reflecting mirror 10 in a direction orthogonal to the surface of the workpiece W,
That the second reflecting mirror 12 for reflecting the Z ₁ direction, and the cylindrical body 13, constituted by the condenser lens 14.

The laser processing head 11 is moved to a desired position by an appropriate Y-direction driving mechanism 15. This Y
The drive mechanism 15 in the direction is similar to the drive mechanism 8 in the X direction described above, and includes, for example, a motor 150, a screw shaft 151, a guide member 152, and a female screw screwed to the screw shaft 151. The driving mechanism 15 is configured by the moving table 153 that is moved in the Y direction along 152.

The laser processing head 11 and the driving mechanism 1
5 constitutes a processing head moving device 16.

In the laser processing apparatus configured as described above, one end of the work W placed on the processing tables 2 and 3 is appropriately held by the holding member 7. Thereafter, a power supply device of a laser oscillator (not shown) is operated, and the laser oscillator 9 excites and amplifies the laser, and outputs a desired laser beam from the laser oscillator 9. The output laser light is transmitted to the first and second reflecting mirrors 10, 1.
The work moving device 6 and the processing head moving device 16 are irradiated onto the work W via the light source 2 and the condenser lens 14.
Are appropriately driven based on the NC data input in advance, and desired laser processing is performed.

That is, at the time of laser processing, laser processing is performed by moving the work W in the X direction for processing in the X direction and moving the laser processing head 11 in the Y direction for processing in the Y direction.

Of course, the cut work W ₁ is dropped downward from the opening 5 of the table, and finally the work W ₁ is taken out of the apparatus. In this case, the dimension of the work W ₁ after cutting in the X direction is determined by the distance L in the X direction between the openings 5 of the table.
If it is smaller than _1, laser processing can be performed without problems.

[0012]

However, in the above-described conventional laser processing apparatus, when the dimension Wx of the workpiece W ₁ after cutting in the X direction is larger than the interval L ₁ of the opening 5 of the table, the work is performed. I didn't like it. That is, for example, in FIG. 11, the cutting progresses clockwise from the cutting start point S to a desired shape, returns to the point S again, and, for example, the rectangular work W ₁ is cut. In this case, as shown in FIG. 11, since the work W ₁ is placed over the processing tables 2 and 3, the work W ₁ must be dropped from the opening 5 after cutting.

Of course, if the center portion of the work W _{1 in} the Y direction can be pressed in the X ₁ direction, the work W ₁ can be dropped from the opening 5.

However, when the worker pushes the work W ₁ in the X direction with the work pay-out rod, in reality, the Y of the work W ₁ is
A position shifted from the center of the direction, for example, the workpiece W ₁ Y ₁
In many cases, the end in the direction is pressed.

Thus, for example, when the end portion of the work W _{1 in} the Y ₁ direction is pressed in the X ₁ direction, the work W ₁ placed on the same plane of the processing tables 2 and 3 as shown in FIG.
As indicated by the chain double-dashed line 1 (A), it only rotates on the processing tables 2 and 3, and therefore the operator had to further press the Y ₂ direction portion of the work W ₁ .

That is, when the dimension Wx of the work W ₁ after cutting in the X direction is larger than the interval L ₁ between the openings 5 of the table, the worker drops the work W ₁ as described above after laser cutting. Since the pressing operation for pushing was repeated a plurality of times, the workability was poor.

On the other hand, the laser processing apparatus is a general-purpose machine that specifies the maximum laser output value, and the maximum processing thickness of the work is specified according to various materials. By the way, when a work having a small plate thickness is machined, a work as thin as possible can be machined by appropriately selecting cutting condition values such as a laser output value, a laser machining head, and a moving speed of the work.

That is, in a general-purpose laser machining apparatus, the maximum machining thickness of the work is set by the manufacturer, but the lower limit of the workable plate thickness depends on the selection condition of the cutting condition value. However, the reality is that the manufacturer does not know the lower limit of the thickness.

As described above, the lower limit of the plate thickness of the workable work is a so-called user's know-how matter which depends on the selection condition of the cutting condition value, and the plate thickness predicted by the general-purpose machine manufacturer. A thinner work is processed.

As described above, when a work thinner than the plate thickness predicted by a general-purpose machine manufacturer is machined, the work moving device 6 moves the work W in the X direction while holding one end of the work W. Problem has occurred.

For example, when the work W is moved in the X ₂ direction by the work moving device 6 from a state where the end portion of the work W in the X ₂ direction is located on the processing table 3 side, the work W having a thin plate thickness is processed. As the free bearing 4 located at the end of the table 3 in the X ₂ direction projects in the X ₂ direction, the deflection of the work W with the free bearing 4 as a fulcrum gradually increases.

Therefore, as shown in FIG. 12, when the work is moved, the end of the work W in the X ₂ direction comes into contact with the end of the working table 2 in the X ₁ direction to deform the work W. There is a problem that the work W is displaced with respect to the holding member that holds the work, and the subsequent processing is damaged.

The present invention has been made in view of the above problems, and an object of the present invention is to cut a cut work piece to a lower part of the apparatus when the size of the cut work piece in the longitudinal direction is somewhat larger than a value capable of being automatically cut. (EN) Provided is a laser processing device which can be easily dropped and which can smoothly process a work even if the work is as thin as possible as predicted by the device manufacturer.

[0024]

According to a first aspect of the present invention, a plurality of rotatable free bearings are protruded from an upper surface,
A processing table provided with a vertical opening opposed to the longitudinal direction of the work at the center, and a work moving device that moves in the longitudinal direction of the work while holding one end of the work placed on the processing table; And a processing head moving device for moving the laser processing head in the width direction of the work. The feature is that a slide plate having an upper surface on the opening end side lower than the top of the free bearing and an inclined surface from the opening end side to the lower opening side is provided in the opening of the machining table in the longitudinal direction of the work. That is, they are arranged so as to be opposed to each other in a detachable manner.

The second invention is the same as the first invention.
It is characterized in that at least the inclined surface of the slide plate is provided with a relief groove in the width direction of the work.

The third invention is characterized in that, in the first or second invention, at least the inclined surface of the slide plate is formed of a tetrafluoride resin material.

The fourth invention is characterized in that, in the first or second invention, at least the inclined surface of the slide plate is formed of a copper-based material.

In the opening of the processing table, slide plates having an upper surface on the side of the opening end lower than the top of the free bearing and an inclined surface from the side of the opening end to the lower side of the opening face each other in the longitudinal direction of the work. Therefore, when the size of the cut work in the longitudinal direction is somewhat larger than the value that can be automatically cut, the cut work is placed between the inclined surfaces of the opposite slide plates.

After the cutting, when the worker appropriately presses the cut work in the X direction with the work discharge bar, the work placed between the inclined surfaces is rotated, and at the time of this rotation, a part of the work is inclined. While descending along the surface, the workpiece drops downward between the slide plates facing each other. That is, after cutting, the work is surely dropped downward by one work payout operation.

Further, in the case of laser-working a work that is as thin as possible, which is thinner than the plate thickness predicted by the apparatus manufacturer, the longitudinal end of the work is moved from one working table to the other working table. At this time, the thin work piece bends downward, but since the end of this thin work piece moves while sliding on the inclined surface of the slide plate located on the lower side of the opening of the processing table, the work piece is deformed as in the past. Therefore, the desired laser processing can be smoothly performed.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. 1 to 5 are views showing an embodiment of the present invention. In these configurations, except for slide plates 20 and 21 which will be described later, the configurations are substantially the same as those of the apparatus shown in FIGS. 6 to 12 except that the distance L ₂ between the processing tables 2 and 3 is large. Therefore, in FIG.
12 to 12, the same reference numerals are attached to the same components, but since the configurations and operations of the respective units 1 to 16 are the same as the conventional ones, the description thereof will be omitted.

1 to 4, the processing table 2,
The end of 3 has a space L in the longitudinal direction of the work, that is, in the X direction.
_They are mounted on a fixed frame 1 separated by _two . That is, the ends of the processing tables 2 and 3 form the upper and lower openings 5 which are separated from each other by the distance L ₂ .

Reference numeral 20 denotes a slide plate detachably attached to the end of the processing table 2 in the X ₁ direction. The slide plate 20 has an upper surface 201 on the side of the opening end lower than the top of the free bearing 4, and an opening. It has an inclined surface 202 from the end side to the lower side of the opening.

Reference numeral 21 denotes a slide plate detachably attached to the end of the processing table 3 in the X ₂ direction, which has an upper surface 211 on the opening end side similar to the slide plate 20 and an inclined surface 212 toward the lower opening side. have. In the slide plates 20 and 21, the tip ends of the inclined surfaces 201 and 211 are spaced apart from each other in the X direction by a distance L ₁ , that is, face each other in the longitudinal direction of the work, and the opening 50 is formed to form the processing table 2, 2.
It is detachably attached to 3.

In the laser processing apparatus configured as described above, one end of the work W placed on the processing tables 2 and 3 is appropriately held by the holding member 7. Thereafter, a power supply device of a laser oscillator (not shown) is operated, and a laser beam output from the laser oscillator 9 is irradiated onto the work W via the first and second reflecting mirrors 10 and 12 and the condenser lens 14. Meanwhile, the workpiece moving device 6 and the processing head moving device 16 are appropriately driven based on the NC data input in advance, and desired laser processing is performed.

That is, in the laser processing, the work W is moved in the X direction for the processing in the X direction, and the laser processing head 11 is moved in the Y direction for the processing in the Y direction.

In the above laser processing apparatus, the case where the dimension of the cut work in the longitudinal direction is somewhat larger than the value that can be automatically cut will be described.

For example, in FIG. 3, the cutting progresses clockwise from the cutting start point S to a desired shape, returns to the point S again, and the rectangular work W ₁ is cut.

In this case, as shown in FIG. 3, when the dimension W _{x in} the longitudinal direction of the cut work W ₁ is larger than the opening 50 of the slide plates 20 and 21, FIG.
As shown in (B), the cut work W ₁ has the inclined surfaces 202, 2 of the slide plates 20, 21 facing each other.
Since the work W ₁ is mounted over 12 spaces, it is necessary to drop the work W ₁ from the opening 50 after cutting.

By the way, after the cutting, when the worker appropriately presses the cut work W ₁ with the work discharge bar in the X direction,
The work W ₁ placed between the inclined surfaces 202 and 212 of the slide plates 20 and 21 rotates, and at the time of this rotation, a part of the work W ₁ descends along the inclined surface while the work W ₁ is relatively moved. The slide plates 20 and 21 facing each other fall downward from the openings 50. That is, after cutting, the work is surely dropped downward by one work payout operation.

Next, description will be made on the case of laser processing a work which is as thin as possible, which is thinner than the plate thickness predicted by the apparatus manufacturer.

In FIG. 5, for example, when the work moving device 6 moves the work W in the X ₂ direction from the state where the end of the work W in the X ₂ direction is located on the processing table 3 side, the work having a thin plate thickness is obtained. As W projects in the X ₂ direction from the free bearing 4 located at the end of the machining table 3 in the X ₂ direction, the bending of the work W with the free bearing 4 as a fulcrum gradually increases.

By the way, since the inclined surface 202 of the slide plate 20 is located on the lower side of the opening on the processing table 2, the end portion of the work W in the X ₂ direction is inclined surface 202 of the slide plate 20 when the work is moved. Move in the X ₂ direction while sliding up.

Of course, since the slide plates 20 and 21 are arranged so as to face each other in the X direction, when the work W is moved in the X direction, the end of the work W has the end of the work table 2 or the work table 2 as in the conventional case. There is no fear that the work W will be deformed by contact with the end portion of the work piece 3 or that the work W will be displaced with respect to the holding member that holds the work. That is, the work is not deformed or displaced as in the conventional case, and thus desired laser processing can be smoothly performed.

As shown in FIG. 4, the upper surfaces 201 and 211 of the slide plates 20 and 21 and the inclined surface 2
If the relief grooves 203 and 213 in the width direction of the work, that is, the Y direction, are appropriately arranged in 02 and 212, the frictional force between the work W and the slide plates 20 and 21 can be reduced, and the work W in the X direction can be reduced. The movement can be facilitated.

Of course, the relief grooves 203 and 213 are formed on the upper surface 2
01, 211 and inclined surfaces 202, 212 are more effective, but nevertheless, the escape grooves 203, 2
13 can be arranged at least on the inclined surfaces 202, 212.

Furthermore, for attaching the slide plates 20 and 21, for example, a countersink hole is provided in the slide plate 2.
Although it can be the upper surface of 0, 21, it is more effective if it is provided in the relief grooves 203, 213 as shown in FIG.

Further, if at least the inclined surfaces of the slide plates 20 and 21, and more preferably the inclined surfaces and the upper surfaces, are formed of a tetrafluororesin material, damage to a work made of metal can be minimized as much as possible. it can.

Of course, if at least the inclined surfaces, more preferably the inclined surfaces and the upper surfaces of the slide plates 20 and 21 are made of a copper-based material, it is possible to damage a work made of a metal having a hardness higher than that of the copper-based material. Can be made smaller.

Further, when the laser processing apparatus according to the present invention is used for a long period of time, the slide plate is gradually damaged, but it is needless to say that the slide plate is replaced with a new slide plate if necessary.

Furthermore, there is a space L1 in the longitudinal direction of the work.
The slide plates that are mounted so as to face each other can be replaced with another slide plate so that the interval L ₁ is appropriately increased or decreased depending on the dimension of the workpiece to be cut in the X direction.

Furthermore, when making the target work thin, the angle of the inclined surface of the slide plate can be selected large.

Furthermore, the laser processing apparatus according to the present invention is most suitable for cutting work, but it is needless to say that it is also applied to work such as welding and punching.

[0054]

As is apparent from the above description, in the laser processing apparatus according to the present invention, a large number of rotatable free bearings are protruded from the upper surface, and are opposed to each other at the center in the longitudinal direction of the work. A processing table provided with an opening in the vertical direction, a work moving device that moves in the longitudinal direction of the work while holding one end of the work placed on the processing table, and moves the laser processing head in the width direction of the work A laser processing apparatus comprising:
In the opening of the processing table, slide plates having an upper surface on the opening end side lower than the top of the free bearing and an inclined surface from the opening end side to the lower opening side are opposed to each other in the longitudinal direction of the work. Since it is detachably arranged, if the size of the cut work in the longitudinal direction is somewhat larger than the value that can be automatically cut, the cut work is placed between the inclined surfaces of the opposite slide plates, When the worker presses this work in the X direction, the work placed between the inclined surfaces rotates while a part of the work descends along the inclined surface, and surely falls between the slide plates downward. To do. Therefore, the work of dropping the cut work below the device can be easily performed.

Further, in the case of laser-working a work that is as thin as possible, which is thinner than the plate thickness predicted by the apparatus manufacturer, the longitudinal end of the work is moved from one working table to the other working table. At this time, the thin work piece bends downward, but since the end of this thin work piece moves while sliding on the inclined surface of the slide plate located on the lower side of the opening of the processing table, the work piece is deformed as in the past. Therefore, the desired laser processing can be smoothly performed.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line II-II in FIG.

FIG. 3 is an explanatory view of the usage status in FIG.
3A and 3B are a plan view and a front view.

FIG. 4 is a perspective view showing an enlarged main part in FIG.

FIG. 5 is a front view illustrating another usage state in FIG.

FIG. 6 is a perspective view showing a conventional example.

7 is a sectional view taken along line VII-VII in FIG.

FIG. 8 is an enlarged sectional view showing the processing table in FIG.

9 is a partially sectional front view showing an enlarged main part in FIG.

FIG. 10 is a partial cross-sectional side view showing an enlarged use situation in FIG.

FIG. 11 is an explanatory view of the usage status in FIG. 6, and FIG.
1 (A) and FIG. 11 (B) are a plan view and a front view.

FIG. 12 is a front view for explaining another usage situation in FIG.

[Explanation of symbols]

2, 3 Processing table 4 Free bearing 5, 50 Opening 6 Work moving device 9 Laser oscillator 10 First reflecting mirror 11 Laser processing head 12 Second reflecting mirror 16 Processing head moving device 20, 21 Slide plate 201, 211 Slide The upper surface of the opening end side of the plate 202,212 The inclined surface to the lower side of the opening of the slide plate

Claims (4)

[Claims] 1. A machining table in which a large number of rotatable free bearings are provided so as to protrude from the upper surface, and vertical openings are provided in the central portion so as to oppose each other in the longitudinal direction of the workpiece.
In a laser processing device comprising a work moving device that moves in the longitudinal direction of the work while holding one end of the work placed on the processing table, and a processing head moving device that moves the laser processing head in the width direction of the work, In the opening of the processing table, slide plates having an upper surface on the opening end side lower than the top of the free bearing and an inclined surface from the opening end side to the lower opening side face each other in the longitudinal direction of the workpiece. A laser processing apparatus which is detachably arranged. 2. The laser processing apparatus according to claim 1, wherein an escape groove in the width direction of the work is provided on at least an inclined surface of the slide plate. 3. The laser processing apparatus according to claim 1, wherein at least an inclined surface of the slide plate is made of a tetrafluoride resin material. 4. The laser processing apparatus according to claim 1, wherein at least an inclined surface of the slide plate is made of a copper-based material.