JPH09323221A - Gas feeding nozzle and radical reaction type precision working unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly spray extending over the full length from a spray slit. SOLUTION: Since reaction gas fed into a spray side gas dome F from a gas inlet 3a is dispersed in the longitudinal direction of a bulkhead 5 by a dispersive slit Bs of a partition plate 6 and flows into the spray split FS, it is made so as to be uniformly sprayed over the full length from this spray slit Fs in consequence. As a suction slit Ks sucks a reaction product generated by a radical reaction, such a fear that this radical reaction is impeded by the reaction product or the like is eliminated, therefore speedy working can be done. In the case where a gas feed nozzle is required to be cooled, a cooling medium of water or the like is made to flows into a passage 5c of the partition plate 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas supply nozzle for supplying a required gas with a predetermined width to a predetermined position, and a radical reaction type precision machining apparatus using the gas supply nozzle.

[0002]

2. Description of the Related Art The applicant of the present invention, as a radical-reaction-type precision processing apparatus, applies a voltage to a wire electrode while sending out a wire electrode from a wire supply mechanism and picking it up by a wire drawing mechanism so that the wire electrode is supported by a supporting device. The discharge gas is generated between the wire electrode and the work piece, and the reaction gas is supplied between the wire electrode and the work piece by the gas supply nozzle to activate the reaction gas by the discharge to generate radicals in the reaction gas. Then, a radical-reacting reaction between the radicals and the constituent atoms or molecules of the object to be processed has been developed (Japanese Patent Application No. 5-21117).

In order to accurately and smoothly process a workpiece in this new radical reaction type precision processing apparatus, it is necessary to uniformly supply a reaction gas between the wire electrode and the workpiece facing the wire electrode over the entire length thereof. There is.

[0004]

As a basic means for uniformly ejecting the reaction gas from each portion of the ejection slit,
It is possible to improve the manufacturing accuracy of the gas supply nozzle.
However, that alone has its limits, and it has not been possible to obtain satisfactory products.

[0005]

In order to solve the above-mentioned problems, a gas supply nozzle according to the present invention is a gas supply nozzle for ejecting gas fed from a gas inlet to the outside from an ejection slit. And a jet slit, a jet-side gas reservoir is provided between the jet slit and the jet slit, and the partition plate has a dispersion slit in which the gas sent from the gas inlet is dispersed in the jet slit lengthwise direction to flow to the jet slit side. The structure is formed by.

A suction slit for sucking the gas jetted from the jet slit may be formed adjacent to the jet slit, and the suction slit may be connected to the suction port through the suction side gas reservoir. It is preferable that the ejection side gas reservoir and the suction side gas reservoir be partitioned by a partition plate, and a passage for the cooling medium be formed in the partition plate.

In the radical reaction type precision machining apparatus according to the present invention, the wire electrode is fed from the wire supply mechanism and is taken up by the wire take-up mechanism while applying a voltage to the wire electrode to be machined supported by the supporting device. A discharge gas is generated between the wire electrode and the workpiece, and a reaction gas is supplied between the wire electrode and the workpiece by a gas supply nozzle to activate the reaction gas by the discharge and generate a radical by the reaction gas. In a radical reaction type precision machining device for machining a workpiece by radically reacting radicals with constituent atoms or molecules of the workpiece, the support device moves the workpiece linearly in one direction with respect to the wire electrode. A Y-axis moving mechanism, an X-axis moving mechanism that linearly moves the workpiece with respect to the wire electrode in a direction orthogonal to the moving direction of the Y-axis moving mechanism, and the Y-axis moving mechanism. In the mobile plane of the workpiece by the X-axis moving mechanism is constituted by a rotary mechanism for rotating the workpiece relative to the wire electrode, the gas supply nozzle has a structure in which a gas supply nozzle above. A Z-axis moving mechanism that moves the gas supply nozzle relative to the workpiece perpendicularly to the plane of movement of the workpiece by the Y-axis moving mechanism and the X-axis moving mechanism can be provided.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described based on examples with reference to the drawings. 1 to 4 show an embodiment of a gas supply nozzle according to the present invention. In this gas supply nozzle A, side plates 1 and 1, end plates 2 and 2, a top plate 3 and bottom plates 4 and 4 are assembled into a box shape to provide a partition plate 5, and one side plate 1 and the partition plate 5 are provided. A partition plate 6 is provided between them.

That is, the side plates 1 and 1 are parallel to each other with a space therebetween, and the upper plate 3 has a plurality of bolts 8 at its upper end.
(Only one is shown in FIG. 3) and it is airtightly fixed, and bottom plates 4 and 4 are airtightly attached to the lower end by a plurality of bolts 9 (only one is shown in FIG. 3). Fixed, side plates 1, 1, top plate 3, bottom plates 4, 4
End plates 2 and 2 are airtightly fixed to a plurality of bolts 10 (only one of which is shown in FIG. 2) on the end face to form a box.

The partition plate 5 divides the ejection side gas reservoir F and the suction side gas reservoir K into the inside of the box body, and the wedge-shaped inclined surfaces 5a and 5b at the lower end portion and the bottom plate 4, respectively.
A jet Fs and a suction slit Ks are formed between the inclined surfaces 4a and 4b of the upper plate 3 and the plurality of bolts 11 on the upper plate 3 and the end plate 2.
(Only one is shown in FIG. 1.) It is airtightly fixed.

Further, the partition plate 6 has a dispersion slit Bs formed near the side plate 1 and is hermetically attached to the side plate 1 and the end plate 2 by bolts or the like. Each slit Fs, Ks,
Bs are formed parallel to each other over the entire length of the partition plate 5, and the ejection slit Fs and the suction slit Ks have the same shape.

The upper plate 3 is provided with gas inlets 3a, 3a, suction ports 3b, 3b, and an inlet 3c and an outlet 3d for a cooling medium such as water. The gas inlet 3a and the suction port 3b are formed near the center near the partition plate 5, and the jet side gas reservoir F is formed.
And the suction side gas reservoir K, respectively. Seal connectors 13, 14, 15, and 16 are individually and airtightly screwed to the gas inlet 3a, the suction port 3b, the inflow port 3c, and the outflow port 3d, respectively, and the seal connectors 13 and 14 are gas supply devices (not shown). ), And another seal connector 1
5 and 16 are respectively connected to a cooling medium supply device (not shown).

The partition plate 5 has a cooling medium passage 5c.
Both ends of the passage 5c communicate with the inflow port 3c and the outflow port 3d. A groove 5d is formed at the center of the lower end surface of the partition plate 5. Reference numeral 17 in FIG. 1 is a sealing plug, which is also provided in the left end plate 2 portion in FIG.

The side plate 1, the end plate 2, the upper plate 3, the bottom plate 4, the partition plate 5 and the partition plate 6 are usually made of metal, ceramics or resin material.

FIG. 5 shows an embodiment of the radical reaction type precision processing apparatus according to the present invention. This radical reaction type precision processing apparatus includes the above-described gas supply nozzle A, a wire supply mechanism 21 that sends out a wire electrode W (for example, made of SUS304, diameter 0.3 mm), a wire drawing mechanism 22 that draws the wire electrode W, The support device 23 for supporting the workpiece H such as a wafer is mainly used.

The gas supply nozzle A is held by a holding member 26 of the Z-axis moving mechanism 25. The Z-axis moving mechanism 25 rotates the screw shaft by the motor 27 to move the nut screwed to the screw shaft up or down, thereby holding the holding member 26 attached to the nut via the interposition member 28. Together with this, the gas supply nozzle A is vertically moved up and down.

Positioning rollers 29 and 30 for positioning the wire electrode W are provided directly below the groove 5d (FIG. 4) of the gas supply nozzle A at the left and right ends of the holding member 26. The gas supply nozzle A can be tilted up and down about the groove 5d, and the distance between the groove 5d and the wire electrode W can be adjusted.

The wire supply mechanism 21 includes a wire supply bobbin 33 rotated by a motor 32 and a guide roller 3.
4, 35, 36, 37 and the like.

The wire take-up mechanism 22 has a motor 39.
Wire take-up bobbin 40 rotated by
A pinch roller 42 rotated by a roller, a traverse roller 44 moved by a moving means 43 such as a cylinder in the direction of the central axis of the wire take-up bobbin 40, and guide rollers 45, 4.
6, 47, etc.

Guide rollers 34, 35, 36, 37, 4
5, 46, etc. are attached to ceramic plates 49, 50. The wire electrode W is insulated from the frame 51 and stretched around the roller 34 or the like, and a high-frequency power source (for example, 150 MHz) is fed through positioning rollers (power feeding brushes) 29, 30 or a power feeding brush (not shown).
More power (for example, 800 to 1000 w) can be supplied.

The supporting device 23 is provided with a Y-axis moving member 54 provided on a base 53 so as to be movable in a horizontal direction orthogonal to the length direction of the gas supply nozzle A in a plan view, and a movement of the Y-axis moving member 54. An X-axis moving member 55 provided on the Y-axis moving member 54 so as to be movable in the horizontal direction (the length direction of the gas supply nozzle A) orthogonal to the direction, and both members 54 on the X-axis moving member 55. And a rotating member 56 rotatably provided within a moving plane (horizontal plane) 55.

The Y-axis moving member 54 is connected to a nut screwed to the screw shaft, and can be moved together with the nut in the Y-axis direction by rotation of the screw shaft by a motor or the like. Together with this, it constitutes a Y-axis moving mechanism.

Similarly, the X-axis moving member 55 is connected to a nut screwed to the screw shaft, and can be moved together with the nut in the X-axis direction by rotation of the screw shaft by a motor or the like. An X-axis moving mechanism is configured together with the screw shaft and the like.

The rotating member 56 is adapted to be rotated by a motor or the like, and constitutes a rotating mechanism together with the motor or the like. The workpiece H is attached to the rotary member 56.
The attachment and fixing function of is added.

Wire supply mechanism 21 and wire take-up mechanism 2
2. Servo motors are usually used for the motors of the moving mechanisms 25, 54, 55 and the rotating mechanism 56, and a ball screw shaft is used for the screw shaft, and a ball nut is used for the nut. Z-axis moving mechanism 25 protruding outside the frame 51
And the intervening member 28 inside the frame 51 are airtightly covered by metal bellows 58 and 59.

Reference numeral 60 is an equipment frame (chamber) in which the radical reaction type precision processing apparatus is housed.

Next, the operation of the present gas supply nozzle A and the present radical reaction type precision machining apparatus configured as described above will be described. The holding member 26 of the Z-axis moving mechanism 25 is lowered from the state of FIG. 5 to bring the gas supply nozzle A and the wire electrode W close to the upper surface of the workpiece H supported by the rotating member 56, and the wire supply mechanism 21 and the wire. While the winding mechanism 22 is operated to wind the wire electrode W wound around the wire supply bobbin 33 around the wire pulling bobbin 40, a voltage is applied to the wire electrode W to generate electric discharge between the wire electrode W and the workpiece H. , The reaction gas is sent to the gas inlet 3a of the gas supply nozzle A and supplied from the ejection slit Fs between the wire electrode W and the workpiece H, and the gas between the wire electrode W and the workpiece H and the like is suction slit Ks. Aspirate.

The reaction gas supplied between the wire electrode W and the workpiece H from the ejection slit Fs of the gas supply nozzle A is
The discharge causes a plasma state to be activated to generate radicals, and the workpiece H is processed by a radical reaction between the radicals and constituent atoms or molecules of the workpiece H.

In the above, the reaction gas sent from the gas inlet 3a to the jet side gas reservoir F is dispersed in the longitudinal direction of the partition plate 5 by the dispersion slit Bs of the partition plate 6 and flows into the jet slit Fs. The slits Fs are evenly ejected over the entire length. For this reason, the processing progresses uniformly over the entire length of the gas supply nozzle A, and the processing accuracy is improved.

Further, since the suction slit Ks sucks the reaction product generated by the radical reaction, the radical reaction is not hindered by the reaction product and the like, so that the processing can be carried out quickly. In addition, when polishing the same surface multiple times for the purpose of improving the roughness of the polished surface, the gas after the reaction may be redeposited on the polished surface and fogging may occur on the surface. In this case, since the supplied reaction gas is sucked in almost at the same time as the reaction is completed, the polishing surface is not fogged and is kept clean.

In the case of surface machining of the workpiece H, as the machining progresses, the Y-axis moving mechanism 54, the X-axis moving mechanism 55, and the rotating mechanism 56 are operated individually or simultaneously by two or more simultaneous operations to gas the workpiece H. Move to supply nozzle. When it is necessary to cool the gas supply nozzle, the passage 5 of the partition plate 5
A cooling medium such as water is passed through c.

The inclined surfaces 4a, 4b of the gas supply nozzle shown in FIG.
The inclination angles of 5a, 5b are 30 degrees, and the inclined surfaces 4a, 5a, 4
The gap (gap) between b and 5b and the dispersion slit Bs are both 0.
Although it is set to 5 mm, this is merely an example and the present invention is not limited to the above. When the volume of the pool portion Fa of the jet side gas reservoir F on the side of the gas inlet 3a on the partition plate 6 and the pool portion Fb of the jet slit Fs side under the partition plate 6 is restricted by the height of the nozzle (for example, , Fa + Fb = about 50 mm or less) is generally defined as Fa ≦ Fb.

The present gas supply nozzle can be used not only in the radical reaction type precision processing apparatus but also in other apparatus such as a drying apparatus. In this case, it goes without saying that the supply gas is changed depending on the device used.

[0034]

As described above, the gas supply nozzle according to the present invention is a gas supply nozzle for ejecting the gas fed from the gas inlet from the ejection slit to the outside.
An ejection side gas reservoir is provided between the gas inlet and the ejection slit, and the gas fed from the gas inlet is dispersed in the ejection side gas reservoir in the length direction of the ejection slit to flow toward the ejection slit side. Since the dispersion slit is formed by the partition plate, the gas can be uniformly ejected from the ejection slit over its entire length.

When the suction slit for sucking the gas jetted from the jet slit is formed adjacent to the jet slit and the suction port is connected to the suction slit through the suction side gas reservoir, It is possible to prevent stagnation at the supply location and always supply fresh gas to the target location.

Further, when the jet side gas reservoir and the suction side gas reservoir are partitioned by the partition plate, the structure becomes simple and the cost can be easily reduced. Further, if the partition plate is provided with a passage for the cooling medium, the temperature control becomes easy, and a constant temperature can be maintained at all times.

In the radical reaction type precision machining apparatus according to the present invention, the wire electrode is fed from the wire supply mechanism and is taken up by the wire take-up mechanism while applying a voltage to the wire electrode to be machined supported by the supporting device. A discharge gas is generated between the wire electrode and the workpiece, and a reaction gas is supplied between the wire electrode and the workpiece by a gas supply nozzle to activate the reaction gas by the discharge and generate a radical by the reaction gas. In a radical-reaction-type precision processing device that processes a workpiece by radically reacting radicals with constituent atoms or molecules of the workpiece, the supporting device linearly moves the workpiece in one direction with respect to the wire electrode. A Y-axis moving mechanism, an X-axis moving mechanism that linearly moves the workpiece with respect to the wire electrode in a direction orthogonal to the moving direction of the Y-axis moving mechanism, and the Y-axis moving mechanism. A gas supply nozzle according to any one of claims 1 to 4, further comprising a rotating mechanism for rotating the workpiece with respect to the wire electrode within a plane in which the workpiece is moved by the X-axis moving mechanism. With this configuration, the reaction gas can be uniformly supplied from the ejection slit of the gas supply nozzle between the wire electrode and the workpiece over the entire length of the ejection slit, and processing such as polishing can be performed accurately. And it can be done efficiently.

If a Z-axis moving mechanism for moving the gas supply nozzle relative to the workpiece is provided perpendicularly to the plane of movement of the workpiece by the Y-axis moving mechanism and the X-axis moving mechanism, The position of the gas supply nozzle with respect to the workpiece can be optimally set, and better processing is possible.

[Brief description of drawings]

FIG. 1 shows an embodiment of a gas supply nozzle according to the present invention, and is a front view with a right half sectioned.

FIG. 2 is a plan view showing a right half of the gas supply nozzle of FIG. 1 as a cross section.

FIG. 3 is a sectional view of a portion (III-III) in FIG. 1;

FIG. 4 is a diagram showing a relationship between a partition plate and a bottom plate.

FIG. 5 is an external view showing an embodiment of a radical reaction type precision processing apparatus according to the present invention.

[Explanation of symbols]

 3a Gas inlet 3b Suction port 5 Partition plate 5c Passage 6 Partition plate 21 Wire supply mechanism 22 Wire take-up mechanism 23 Support device 25 Z-axis moving mechanism 54 Y-axis moving member (Y-axis moving mechanism) 55 X-axis moving member (X-axis moving member) 56) Rotating member (rotating mechanism) A Gas supply nozzle H Workpiece F F ejection side gas reservoir K Suction side gas reservoir W Wire electrode Fs Ejection slit Ks Suction slit Bs Dispersion slit

Claims (6)

[Claims] 1. A gas supply nozzle for ejecting gas fed from a gas inlet to the outside from an ejection slit,
An ejection side gas reservoir is provided between the gas inlet and the ejection slit, and the gas fed from the gas inlet is dispersed in the ejection side gas reservoir in the length direction of the ejection slit to flow toward the ejection slit side. A gas supply nozzle characterized in that a dispersion slit is formed by a partition plate. 2. A suction slit for sucking the gas jetted from the jet slit is formed adjacent to the jet slit, and a suction port is connected to the suction slit via a suction side gas reservoir. The gas supply nozzle according to claim 1. 3. The gas supply nozzle according to claim 2, wherein the ejection side gas reservoir and the suction side gas reservoir are partitioned by a partition plate. 4. The gas supply nozzle according to claim 3, wherein a passage for a cooling medium is formed in the partition plate. 5. A wire electrode is sent from a wire supply mechanism and is drawn by a wire drawing mechanism, while applying a voltage to the wire electrode to generate an electric discharge between the wire electrode and a workpiece supported by a supporting device and A reaction gas is supplied between the electrode and the work piece by a gas supply nozzle to activate the reaction gas by the discharge, and a radical is generated by the reaction gas to generate the radical and the constituent atoms or molecules of the work piece. In a radical reaction type precision machining apparatus for machining a workpiece by radical reaction, the support device includes a Y-axis moving mechanism for linearly moving the workpiece in one direction with respect to the wire electrode, and the Y-axis moving mechanism. In the moving plane of the workpiece by the Y-axis moving mechanism and the X-axis moving mechanism, the X-axis moving mechanism linearly moving the workpiece in the direction orthogonal to the moving direction of A radical reaction type precision machining, comprising: a rotating mechanism for rotating a workpiece with respect to a wire electrode, wherein the gas supply nozzle is the gas supply nozzle according to any one of claims 1 to 4. apparatus. 6. A Z-axis moving mechanism for moving the gas supply nozzle relative to the workpiece perpendicularly to the plane of movement of the workpiece by the Y-axis moving mechanism and the X-axis moving mechanism. A radical reaction type precision processing device according to claim 5.