JPH09309137A - Method and device for manufacturing organic polymer film - Google Patents

Method and device for manufacturing organic polymer film

Info

Publication number
JPH09309137A
JPH09309137A JP8150193A JP15019396A JPH09309137A JP H09309137 A JPH09309137 A JP H09309137A JP 8150193 A JP8150193 A JP 8150193A JP 15019396 A JP15019396 A JP 15019396A JP H09309137 A JPH09309137 A JP H09309137A
Authority
JP
Japan
Prior art keywords
organic polymer
die
film
vicinity
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8150193A
Other languages
Japanese (ja)
Other versions
JP3755192B2 (en
Inventor
Kenichi Okubo
賢一 大久保
Tetsuo Ikegami
哲生 池上
Hidetoshi Okashiro
英敏 岡城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP15019396A priority Critical patent/JP3755192B2/en
Publication of JPH09309137A publication Critical patent/JPH09309137A/en
Application granted granted Critical
Publication of JP3755192B2 publication Critical patent/JP3755192B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Landscapes

  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable removal of adhered materials on a cap without discontinuing the manufacture by molding an organic polymer into the film shape while removing the adhered materials in the vicinity of a slit of the cap. SOLUTION: When an organic polymer is extruded from a cap to manufacture a film, the organic polymer is molded into the film shape while removing adhered materials in the vicinity of a slit of the cap. For the purpose of removing the adhered materials, a process of hydrolyzing the adhered materials, a photodissociation process, a decomposition process by using heat and elasticity, a chemical decomposition process or the like is used. To be concrete, a process of providing the humidity in the periphery on the vicinity of a slit section of a cap of preferably to 0.007-0.1kg/kg' by using humidified air, a process of emitting ultraviolet rays of wave length of preferably 300nm or under in the vicinity of the slit of the cap, a process of decomposing electrically or thermally the adhered materials in the vicinity of the slit of the cap by using corona discharge, a thermal decomposition process or a process of spraying ozones in the vicinity of the slit section of the cap can be used.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、磁気記録媒体、包
装材料、インクリボンおよびプリペイドカード等の基材
に用いられる有機高分子体フィルム、とくに芳香族ポリ
エステルフィルムの製造方法および製造装置に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for producing an organic polymer film, particularly an aromatic polyester film, used as a base material for magnetic recording media, packaging materials, ink ribbons, prepaid cards and the like. is there.

【0002】[0002]

【従来の技術】芳香族ポリエステルなどの有機高分子体
をフィルムに成形する場合、該有機高分子体の吐出孔で
ある口金スリット部分の近傍には、いわゆる「目やに」
などと呼ばれる付着物が堆積してゆき、そのためフィル
ムに局所的な厚みむらである口金すじを引き起こす。従
来、この付着物の除去のためには付着物を物理的に掻き
落とす方法以外なかったため、フィルムの製造を一時中
断せざるを得ず、そのため製造ロスの問題があった。そ
の改善のため、例えば特開平4−299115号公報な
どに示されているように、口金スリット部分自身の材質
を改良する方法、あるいは特開昭63−312347号
公報などに示されているように、有機高分子体中に酸化
防止剤などを添加する方法など、が提案されている。
2. Description of the Related Art When an organic polymer such as an aromatic polyester is formed into a film, a so-called "eye area" is formed in the vicinity of a mouth slit portion which is a discharge hole of the organic polymer.
Accumulation of deposits called "," etc., accumulates on the film, causing local unevenness in the thickness of the film. Conventionally, the only method for removing the deposits is to physically scrape off the deposits. Therefore, there is no choice but to temporarily suspend the production of the film, which causes a problem of production loss. In order to improve it, for example, as disclosed in Japanese Patent Laid-Open No. 4-299115 or the like, a method of improving the material of the die slit portion itself, or as disclosed in Japanese Patent Laid-Open No. 63-312347. , A method of adding an antioxidant or the like into an organic polymer has been proposed.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記の
手段はいずれも付着物の発生や付着を抑えるための方法
であり、一旦付着物が口金スリット部分近傍に付着した
場合には、製造を一旦中断して付着物を掻き落とす必要
があり、やはり製造ロスとなるため、その改善が必要で
あった。
However, any of the above means is a method for suppressing the generation or adhesion of deposits, and once the deposits adhere to the vicinity of the die slit portion, the production is temporarily suspended. Therefore, it is necessary to scrape off the adhering substances, which is also a manufacturing loss, and therefore it is necessary to improve it.

【0004】本発明の課題は、このような問題点に着目
し、製造を中断することなく、つまり製造ロスを伴うこ
となく、口金の付着物を除去可能な有機高分子体フィル
ムの製造方法および製造装置を提供することにある。
An object of the present invention is to pay attention to such a problem, and a method for producing an organic polymer film capable of removing deposits on a die without interrupting production, that is, without causing production loss, and To provide a manufacturing apparatus.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
に、本発明の有機高分子体フィルムの製造方法は、有機
高分子体を口金より押し出してフィルムを製造する方法
において、該口金のスリット部分近傍の付着物を除去し
ながら該有機高分子体をフィルム状に成形することを特
徴とする方法からなる。
In order to solve the above-mentioned problems, the method for producing an organic polymer film of the present invention is a method for producing a film by extruding an organic polymer through a die, wherein the slit of the die is used. The method is characterized in that the organic polymer is formed into a film while removing deposits near the portion.

【0006】また、本発明の有機高分子体フィルムの製
造装置は、口金のスリット部分近傍の付着物を口金から
ポリマー吐出中に除去する付着物除去装置を具備してな
ることを特徴とするものからなる。
Further, the apparatus for producing an organic polymer film of the present invention is characterized by comprising an adhering substance removing device for adhering substances in the vicinity of the slit portion of the die while discharging the polymer from the die. Consists of.

【0007】[0007]

【発明の実施の形態】本発明の有機高分子体には、ポリ
エチレンテレフタレート、ポリエチレン−2,6−ナフ
タレート、ポリエチレンα,β−ビス(2−クロルフェ
ノキシ)エタン4,4−ジカルボキシレート、ポリブチ
レンテレフタレートなどの芳香族ポリエステル、芳香族
ポリアミドあるいは芳香族ポリイミド、ポリエチレンや
ポリプロピレンなどのポリオレフィンなどが用いられる
が、主として芳香族ポリエステルであることが好まし
く、特に主としてポリエチレンテレフタレートであるこ
とが好ましい。ここで「主として」とは、芳香族ポリエ
ステルを70モル%以上含むことを指す。なお、上記の
芳香族ポリエステルはホモポリエステルであってもよい
し、コポリエステルであってもよいし、また他の成分を
30モル%未満の割合で単に混合したものでもよい。
BEST MODE FOR CARRYING OUT THE INVENTION The organic polymer of the present invention includes polyethylene terephthalate, polyethylene-2,6-naphthalate, polyethylene α, β-bis (2-chlorophenoxy) ethane 4,4-dicarboxylate, poly Aromatic polyesters such as butylene terephthalate, aromatic polyamides or polyimides, polyolefins such as polyethylene and polypropylene are used, but aromatic polyesters are preferred, and polyethylene terephthalate is particularly preferred. Here, “mainly” means that the aromatic polyester contains 70 mol% or more. The aromatic polyester may be a homopolyester or a copolyester, or may be a mixture of other components in a proportion of less than 30 mol%.

【0008】また、本発明の有機高分子体には、基材フ
ィルムの特性を損なわない程度に滑剤、酸化防止剤、帯
電防止剤その他の添加剤等が添加されていてもよい。
The organic polymer of the present invention may be added with a lubricant, an antioxidant, an antistatic agent and other additives to the extent that the characteristics of the base film are not impaired.

【0009】また、本発明のフィルムは、単層のフィル
ムはもちろんのこと、2層以上からなる複合フィルムで
あってもよい。
The film of the present invention may be a single layer film or a composite film composed of two or more layers.

【0010】本発明の有機高分子体フィルムは、口金の
スリット部分近傍の付着物を除去しながら該有機高分子
体をフィルム状に成形する必要がある。すなわち、口金
からポリマを吐出しつつ、付着物の除去を行うのであ
る。口金のスリット部分近傍は溶融状態にある有機高分
子体に接触あるいは肉薄しているため、有機高分子体の
一部やその変成物などが堆積して付着物を形成し、吐出
直後の未固化状態にある有機高分子体フィルムに凹凸を
生じさせ、結果として口金すじを引き起こすことがある
ので、この付着物を除去するのである。
In the organic polymer film of the present invention, it is necessary to mold the organic polymer into a film while removing the deposits in the vicinity of the slit portion of the die. That is, the deposit is removed while the polymer is discharged from the die. Since the vicinity of the slit part of the die is in contact with or is thin with the molten organic polymer, part of the organic polymer and its metamorphic substances, etc. are deposited to form an adhered substance, which is not solidified immediately after discharge. Since the organic polymer film in a state may have irregularities, and as a result, may cause a streak of the base, the deposit is removed.

【0011】なおここで「付着物」とは、口金すじの原
因物を指すので、口金のスリット部分近傍に付着してい
るものは勿論、有機高分子体からの湧出物や昇華物など
口金のスリット部分近傍に付着する可能性のあるものは
全て含む。またここで「除去」とは、口金すじの解消お
よび軽減を目的としているので、付着物を口金のスリッ
ト部分近傍から掻き落とす方法や付着物を分解して口金
のスリット部分近傍から排除する方法は勿論、該付着物
の粘度および硬度を低下させて吐出直後の有機高分子体
フィルムの凹凸を軽減させる方法も含む。なお口金のス
リット部分近傍とは、吐出孔であるスリット部分自身、
およびスリット部分の外周からの距離が10mm以内の
部分を指す。また、「除去しながら」とは、フィルムの
製造を一時中断し強制的にフィルムを破断した後に付着
物を除去することや付着物の除去による結果としてフィ
ルムの製造の中断が引き起こされる状態を指すものでは
ない。すなわち、付着物の除去によるフィルム破断など
を引き起こすことなく、付着物の除去とフィルムの製造
を同時に実施できることを指す。
The term "adhered matter" as used herein refers to the cause of the streak of the die, so that not only those that are attached in the vicinity of the slit portion of the die, but also those that come out from the organic polymer or sublimate Includes all that may be attached near the slit. In addition, here, "removal" is intended to eliminate and reduce the streak of the base, so a method of scraping off the adhered matter from the vicinity of the slit part of the base or a method of disassembling the adhered matter and removing it from the vicinity of the slit part of the base Of course, a method of reducing the viscosity and hardness of the deposit to reduce the unevenness of the organic polymer film immediately after ejection is also included. Note that the vicinity of the slit portion of the die is the slit portion itself which is a discharge hole,
And a portion within a distance of 10 mm from the outer circumference of the slit portion. Further, "while removing" refers to a state in which the production of the film is temporarily interrupted and the deposit is removed after forcibly breaking the film, or the production of the film is interrupted as a result of the removal of the deposit. Not a thing. That is, it means that the removal of the deposit and the production of the film can be carried out at the same time without causing the film to break due to the removal of the deposit.

【0012】本発明の付着物の除去の方法は、口金から
吐出している有機高分子体に実質的に非接触である方法
が好ましい。すなわち、付着物の除去の方法が実質的に
非接触でなければ、付着物の除去の際に除去装置全体あ
るいはその一部が口金から吐出されている有機高分子体
に接触し、フィルムの厚みむらやフィルム破断を引き起
こし、結果としてフィルムの製造が中断する可能性があ
るためである。口金から吐出されている有機高分子体に
実質的に非接触で付着物を除去する方法としては、例え
ば付着物を加水分解する方法、光分解する方法、熱や電
気で分解する方法や化学反応によって分解する方法など
を用いることができる。すなわち、付着物はフィルムを
構成する有機高分子体自身および/又はその変成物が主
成分であるので、上記の除去の方法を用いることによ
り、該付着物および有機高分子体フィルムに直接に接触
することなく該付着物の分解、粘度低下あるいは硬度低
下が可能となるためである。具体的には、加湿空気を用
いて口金のスリット部分近傍の周辺の湿度を0.005
〜0.5kg/kg’に、好ましくは0.007〜0.
1kg/kg’に上げる方法、400nm以下の短波長
の光、好ましくは350nm以下の波長の紫外線、より
好ましくは300nm以下の波長の紫外線を口金のスリ
ット部分近傍に照射する方法、コロナ放電を用いて口金
のスリット部分近傍の付着物を電気的に、あるいは熱的
に分解する方法、およびオゾンなどの活性気体を口金の
スリット部分近傍に吹付ける、あるいは充填する方法
や、これらの組合せを用いる方法が使用できるが、上記
のうち、加湿空気、紫外線、あるいはこれらの組合せを
用いる方法が実用的で特に好ましい。
The method of removing the deposits of the present invention is preferably a method of being substantially non-contact with the organic polymer discharged from the die. That is, if the method of removing the deposits is not substantially non-contact, the entire or part of the removing device contacts the organic polymer discharged from the die when removing the deposits, and the film thickness This is because unevenness and film breakage may occur, resulting in interruption of film production. Examples of the method for removing the deposits without substantially contacting the organic polymer discharged from the die include a method of hydrolyzing the deposits, a method of photodegrading, a method of decomposing with heat or electricity, and a chemical reaction. It is possible to use a method of decomposing by. That is, since the adhered matter is mainly composed of the organic polymer itself and / or its modified substance forming the film, the adhered matter and the organic polymer film are directly contacted by using the above-mentioned removal method. This is because the deposit can be decomposed, the viscosity can be reduced, or the hardness can be reduced without doing so. Specifically, using humidified air, the humidity around the slit portion of the die is adjusted to 0.005.
~ 0.5 kg / kg ', preferably 0.007-0.
1 kg / kg ', a method of irradiating a short wavelength light of 400 nm or less, preferably an ultraviolet ray of 350 nm or less, more preferably an ultraviolet ray of 300 nm or less to the vicinity of the slit portion of the die, using corona discharge A method of electrically or thermally decomposing the deposits in the vicinity of the slit portion of the die, a method of spraying or filling an active gas such as ozone in the vicinity of the slit portion of the die, or a method using a combination thereof Among them, the method using humidified air, ultraviolet rays, or a combination thereof is practical and particularly preferable.

【0013】上記の理由により本発明のフィルムの製造
装置は、口金のスリット部分近傍への付着物の除去装置
を具備している必要があり、また付着物の除去装置は、
口金から吐出している有機高分子体に実質的に非接触の
方法で付着物を除去する装置であることが好ましい。除
去装置として具体的には、スチームや加湿器などの加湿
装置、ブラックライト、水銀ランプや水銀−キセノンラ
ンプなどの紫外線照射装置、コロナ放電装置、およびオ
ゾンなどの活性気体発生装置などや、これらの組合せか
ら成るものを用いることができる。なお、上記の付着物
除去装置は、製造装置に直接据え付けされていても、あ
るいはポータプル式で必要に応じて取り付けられる装置
であってもよい。
For the above reasons, the film manufacturing apparatus of the present invention must be equipped with a device for removing deposits in the vicinity of the slit portion of the die.
It is preferable that the apparatus removes the deposits by a method that is substantially non-contact with the organic polymer discharged from the die. Specific examples of the removing device include a humidifying device such as a steam or a humidifier, a black light, an ultraviolet irradiation device such as a mercury lamp or a mercury-xenon lamp, a corona discharge device, and an active gas generating device such as ozone. A combination can be used. The adhering matter removing device may be directly installed in the manufacturing device, or may be a portable device that is attached as needed.

【0014】なお本発明の付着物の除去は、フィルムの
製造を妨げることがないので、製造開始から終始実施し
てもよく、口金すじが発生してから実施してもよい。
Since the deposits of the present invention do not interfere with the production of the film, they may be removed from the beginning of production or after the production of the streak.

【0015】次に本発明フィルムの製造方法について、
芳香族ポリエステルフィルムを例に挙げて説明するが、
これに限定されるものではない。
Next, regarding the method for producing the film of the present invention,
An aromatic polyester film will be described as an example,
It is not limited to this.

【0016】まず常法によりポリエステルを重合し、ポ
リエステルペレットを得る。この際に粒子添加法を用い
て適宜粒子を添加してもよい。このポリエステルペレッ
トを十分に乾燥させ、公知の溶融法、押出法、キャスト
法を用いてフィルム状に成形する。なお、口金のスリッ
ト部分近傍は、加湿空気で周辺を加湿する、紫外線を照
射する、コロナ放電を用いる、活性気体を吹付ける、あ
るいは活性気体を充填する方法のうちから選ばれる少な
くとも1種、または2種以上の組合せを、製造開始から
終始、あるいは口金すじが発生した時点で実施する。こ
うして得られた未延伸フィルムに、必要に応じて公知の
延伸方法および熱処理方法を加えてもよい。
First, polyester is polymerized by a conventional method to obtain polyester pellets. At this time, particles may be appropriately added using a particle addition method. The polyester pellets are sufficiently dried and formed into a film by a known melting method, extrusion method or casting method. Incidentally, the vicinity of the slit portion of the die, at least one selected from the method of humidifying the periphery with humidified air, irradiating with ultraviolet rays, using corona discharge, blowing active gas, or filling active gas, or A combination of two or more kinds is carried out from the beginning of manufacturing to the beginning or at the time when a base line is generated. A known stretching method and heat treatment method may be added to the unstretched film thus obtained, if necessary.

【0017】[特性の測定方法]本発明の特性値は次の
測定法、評価基準によるものである。 (1)口金すじの判定 キャストして得られた未延伸フィルムを、長手方向の延
伸を実施する直前の箇所で目視にて観察し、口金すじの
有無を調査し、下記の3段階で評価した。 ◎:口金すじの発生はまったく見られない。 △:軽度の口金すじが発生している。 ×:重度の口金すじが発生している。 なお、口金すじの強度については、長手方向および幅方
向の延伸が終了したフィルムを採取し、該フィルムの幅
方向の厚みを電子マイクロメータ(アンリツ(株)製FI
LM THICKNESS TESTER KG601A)により下記の測定条件で
フィルムを連続的に走行させ測定して得られたチャート
から、該口金すじ箇所の厚みの変位が0.5μm以上の
場合を「強度」、0.5μm未満を「軽度」と定義し
た。 ・測定条件 フィルム引取速度:1.5m/min、チャート速度:
60cm/min
[Characteristic Measuring Method] The characteristic values of the present invention are based on the following measuring methods and evaluation criteria. (1) Judgment of base streak The unstretched film obtained by casting was visually observed at a position immediately before the stretching in the longitudinal direction, and the presence or absence of a streak of the base was investigated and evaluated in the following three stages. . ⊚: No occurrence of base streak is observed. Δ: A slight streak is generated. X: Severe base line is generated. Regarding the strength of the spinneret, a film after stretching in the longitudinal direction and the width direction was sampled, and the thickness in the width direction of the film was measured with an electronic micrometer (FI manufactured by Anritsu Corporation).
LM THICKNESS TESTER KG601A), the film obtained by continuously running the film under the following measurement conditions was measured. From the chart obtained, "strength" was 0.5 μm when the displacement of the thickness of the die streak was 0.5 μm or more. Less than was defined as "mild".・ Measurement conditions Film take-up speed: 1.5 m / min, chart speed:
60 cm / min

【0018】(2)口金のスリット部分近傍の雰囲気の
湿度 口金のスリット部分から40mmの距離で、口金、フィ
ルム、および冷却ドラムに接触しない箇所の湿度を、横
河電気(株)製高温湿度検出器ZH8Dを用いて測定
し、得られた絶対湿度を口金のスリット部分近傍の雰囲
気の湿度とした。
(2) Humidity of the atmosphere in the vicinity of the slit portion of the die The humidity at a location not in contact with the die, film and cooling drum at a distance of 40 mm from the slit portion of the die is the high temperature humidity manufactured by Yokogawa Electric Corporation. The absolute humidity obtained by measurement using a detector ZH8D was used as the humidity of the atmosphere in the vicinity of the slit portion of the die.

【0019】[0019]

【実施例】次に実施例に基づき本発明を更に詳細に説明
する。評価結果を表1に示す。 実施例1 平均粒径1μmの乾式シリカを0.2重量%含むポリエ
チレンテレフタレートを280℃で溶融押出し、280
℃とした口金のスリット部分から吐出して冷却ドラム上
にキャストして未延伸フィルムを作った。なおこの際の
口金のスリット部分の間隙は2mm、口金のスリット部
分近傍の周辺の湿度は0.004kg/kg’であっ
た。
The present invention will be described in more detail based on the following examples. Table 1 shows the evaluation results. Example 1 Polyethylene terephthalate containing 0.2% by weight of dry silica having an average particle size of 1 μm was melt extruded at 280 ° C. and 280
The film was discharged from the slit portion of the die at a temperature of ℃ and cast on a cooling drum to produce an unstretched film. The gap in the slit portion of the die at this time was 2 mm, and the humidity around the slit portion of the die was 0.004 kg / kg '.

【0020】口金スリット部分から、溶融されたポリエ
ステルが吐出した直後から、紫外線照射装置にて口金ス
リット部分近傍に紫外線照射を開始し、製造終了まで使
用した。なお紫外線照射装置は、浜松ホトニクス(株)
製UVスポット光源L2859−01を用いた。なお紫
外線照射装置の照射部分から口金のスリット部分までの
距離は100mmとし、口金幅50mmに対して1基の
割合で設置した。
Immediately after the melted polyester was ejected from the slit portion of the die, ultraviolet irradiation was started in the vicinity of the slit portion of the die by an ultraviolet irradiation device, and it was used until the end of production. The UV irradiation device is Hamamatsu Photonics KK
A UV spot light source L2859-01 manufactured by Mitsui Chemicals, Inc. was used. The distance from the irradiation part of the ultraviolet irradiation device to the slit part of the die was 100 mm, and one unit was installed with respect to the die width of 50 mm.

【0021】得られた未延伸フィルムを長手方向に10
0℃で3倍、幅方向に100℃で4倍に逐次延伸し、延
伸終了後にステンターにて200℃で10秒間、熱処理
を施し、厚さ10μmの二軸延伸ポリエステルフィルム
を製造した。
The resulting unstretched film was stretched in the longitudinal direction by 10
The film was sequentially stretched 3 times at 0 ° C. and 4 times at 100 ° C. in the width direction, and after the stretching was finished, heat treatment was performed at 200 ° C. for 10 seconds with a stenter to produce a biaxially stretched polyester film having a thickness of 10 μm.

【0022】上記未延伸フィルムを観察したところ、製
造を開始してから72時間経過まで、口金すじの発生は
なかった。なお、96時間経過した時点で口金すじの発
生があったが、極めて軽度であった。
Observation of the above-mentioned unstretched film revealed that no die streak was formed until 72 hours after the start of production. In addition, although the streak was generated after 96 hours, it was extremely slight.

【0023】実施例2 実施例1の方法において、紫外線照射装置を用いる代わ
りに、超音波式の加湿器を用いて、口金スリット部分に
加湿空気を照射してスリット部分の周辺の湿度を0.0
07kg/kg’とした他は、実施例1と同じ方法で本
発明を実施した。48時間経過した後に口金すじの発生
はあったが極めて軽度であったため、そのまま96時間
以上製造が継続できた。
Example 2 In the method of Example 1, instead of using the ultraviolet irradiation device, an ultrasonic humidifier was used to irradiate humidified air to the slit portion of the mouthpiece to reduce the humidity around the slit portion to 0. 0
The present invention was carried out in the same manner as in Example 1 except that the amount was set to 07 kg / kg '. After 48 hours had passed, there was a generation of a streak, but it was extremely slight, so that the production could be continued for 96 hours or more.

【0024】実施例3 実施例1の方法において、紫外線照射装置の使用に加え
て、超音波式の加湿器を用いて口金スリット部分に加湿
空気を照射してスリット部分の周辺の湿度を0.007
kg/kg’とした他は、実施例1と同じ方法で本発明
を実施した。96時間以上経過した後も、口金すじの発
生はなかった。
Example 3 In the method of Example 1, in addition to the use of an ultraviolet irradiation device, an ultrasonic humidifier was used to irradiate humidified air to the slit portion of the mouthpiece to reduce the humidity around the slit portion to 0. 007
The present invention was carried out in the same manner as in Example 1 except that kg / kg 'was used. Even after 96 hours or more, there was no occurrence of a stripe of the base.

【0025】比較例1 実施例1の方法において、紫外線照射装置を用いない他
は、実施例1と同じ方法で本発明を実施した。製膜開始
から48時間後にフィルムに重度の口金すじが発生し
た。
Comparative Example 1 The present invention was carried out in the same manner as in Example 1 except that the ultraviolet irradiation device was not used. After 48 hours from the start of film formation, a severe die streak was generated on the film.

【0026】[0026]

【表1】 [Table 1]

【0027】[0027]

【発明の効果】以上説明したように、本発明に係る有機
高分子体フィルムの製造方法および製造装置によれば、
口金すじを発生させることなく、また、口金すじ対策に
伴い製造を中断させることなく、連続して安定的に所望
のフィルムを製造することが可能となる。口金すじ対策
に伴う製造ロスが発生しないので、生産性、収率の向上
を図ることができる。
As described above, according to the method and apparatus for producing an organic polymer film of the present invention,
It is possible to continuously and stably produce a desired film without generating a die streak and without interrupting the production due to a countermeasure for the die streak. Since no production loss occurs due to the countermeasure for the cap streak, productivity and yield can be improved.

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 有機高分子体を口金より押し出してフィ
ルムを製造する方法において、該口金のスリット部分近
傍の付着物を除去しながら該有機高分子体をフィルム状
に成形することを特徴とする有機高分子体フィルムの製
造方法。
1. A method for producing a film by extruding an organic polymer from a die, wherein the organic polymer is formed into a film while removing deposits in the vicinity of the slit portion of the die. Method for producing organic polymer film.
【請求項2】 有機高分子体が主として芳香族ポリエス
テルからなることを特徴とする請求項1に記載の有機高
分子体フィルムの製造方法。
2. The method for producing an organic polymer film according to claim 1, wherein the organic polymer mainly comprises an aromatic polyester.
【請求項3】 付着物の除去を、口金から吐出されてい
る有機高分子体に実質的に非接触で行うことを特徴とす
る、請求項1または2に記載の有機高分子体フィルムの
製造方法。
3. The method for producing an organic polymer film according to claim 1, wherein the deposit is removed substantially without contact with the organic polymer discharged from the die. Method.
【請求項4】 付着物の除去を、加湿空気、紫外線、コ
ロナ放電および活性気体のうちから選ばれる少なくとも
1種または2種以上の組合せを用いて行うことを特徴と
する、請求項1ないし3のいずれかに記載の有機高分子
体フィルムの製造方法。
4. The removal of deposits is performed by using at least one kind selected from humidified air, ultraviolet rays, corona discharge and active gas, or a combination of two or more kinds. A method for producing an organic polymer film according to any one of 1.
【請求項5】 口金のスリット部分近傍の付着物を口金
からポリマー吐出中に除去する付着物除去装置を具備し
てなることを特徴とする有機高分子体フィルムの製造装
置。
5. An apparatus for producing an organic polymer film, comprising an adhering matter removing device for removing adhering matter in the vicinity of the slit portion of the die while discharging the polymer from the die.
【請求項6】 付着物除去装置が、口金から吐出されて
いる有機高分子体に非接触で付着物を除去する装置であ
ることを特徴とする、請求項5に記載の有機高分子体フ
ィルムの製造装置。
6. The organic polymer film according to claim 5, wherein the deposit removing device is a device for removing deposits without contacting the organic polymer discharged from the die. Manufacturing equipment.
【請求項7】 付着物の除去装置が、加湿装置、紫外線
照射装置、コロナ放電装置、および活性気体の発生装置
から選ばれる少なくとも1種または2種以上の組合せか
らなる装置であることを特徴とする、請求項5または6
に記載の有機高分子体フィルムの製造装置。
7. The adhering substance removing device is a device composed of at least one kind or a combination of two or more kinds selected from a humidifying device, an ultraviolet irradiation device, a corona discharge device, and an active gas generating device. Claim 5 or 6
The apparatus for producing an organic polymer film described in 1.
JP15019396A 1996-05-22 1996-05-22 Method and apparatus for producing organic polymer film Expired - Fee Related JP3755192B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15019396A JP3755192B2 (en) 1996-05-22 1996-05-22 Method and apparatus for producing organic polymer film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15019396A JP3755192B2 (en) 1996-05-22 1996-05-22 Method and apparatus for producing organic polymer film

Publications (2)

Publication Number Publication Date
JPH09309137A true JPH09309137A (en) 1997-12-02
JP3755192B2 JP3755192B2 (en) 2006-03-15

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ID=15491557

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3755192B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002120269A (en) * 2000-10-18 2002-04-23 Toray Ind Inc Manufacturing method for thermoplastic resin sheet
WO2018180389A1 (en) * 2017-03-31 2018-10-04 富士フイルム株式会社 Method for producing thermoplastic resin film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002120269A (en) * 2000-10-18 2002-04-23 Toray Ind Inc Manufacturing method for thermoplastic resin sheet
WO2018180389A1 (en) * 2017-03-31 2018-10-04 富士フイルム株式会社 Method for producing thermoplastic resin film
JPWO2018180389A1 (en) * 2017-03-31 2019-11-07 富士フイルム株式会社 Method for producing thermoplastic resin film

Also Published As

Publication number Publication date
JP3755192B2 (en) 2006-03-15

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