JPH09297018A - Position detecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately detect a position of a reticule and a plate, etc., without affected by a vibration, in a position detecting device for a semiconductor manufacturing device, etc. SOLUTION: Supporting leg's tips 15a and 16a are connected to supporting leg's roots 15b and 16b with magnets 31 and 32. Though a reticule position detection system 49 is vibrated by a vibration applied to a device, the vibration is absorbed by the magnets 31 and 32 attached to the supporting leg's tips 15a and 16a. Since the vibration of the reticule position detection system 49 is also absorbed, a position of reticule R is accurately detected without being affected by the vibration.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a position detecting device, and more particularly to a device for detecting the position of a wafer, a glass plate, a reticle or a mask used in a semiconductor manufacturing device or a liquid crystal display plate manufacturing device.

[0002]

2. Description of the Related Art As a conventional position detecting device, for example,
A semiconductor manufacturing apparatus shown in FIG. 10 is known. As shown in FIG. 10, the semiconductor manufacturing apparatus includes an XY stage 43 and a pedestal 44 on a surface plate 42 supported by a vibration isolation pad 41.
Has been fixed. A plate P on which the pattern of the reticle R is transferred and exposed is placed on the XY stage 43 as described later, and the plate P is moved in the X direction, the Y direction, and the θ direction. A hole is formed in the upper part of the gantry 44, and the projection lens P is inserted into this hole through the fixing member 46.
L is fixed. Further, the microscope 4 is attached to the fixing member 46.
5a and 45b are attached. A pedestal 47 is further attached to the fixing member 46, and a reticle stage 48 for mounting the reticle R is fixed to the pedestal 47. A reticle position detection system 49 for detecting the position of the reticle is fixed to the reticle stage 48. The reticle position detection system 49 includes a microscope 49
a and 49b are attached.

Positioning marks are formed on the reticle R and the plate P. The marks on the reticle R are detected by the microscopes 49a and 49b, and the marks on the plate P are detected by the microscopes 45a and 45b. The reticle R and the plate P are aligned with each other based on these detection results. Then, after the alignment is completed, the reticle R is irradiated with light emitted from a light source (not shown), so that the pattern formed on the reticle R is placed on the XY stage 43 via the projection lens PL. It is projected on P.

[0004]

In the above-described semiconductor manufacturing apparatus, since a very precise pattern is transferred onto the plate P, the reticle R and the plate P are accurately aligned. Is required.
In order to perform the accurate alignment between the reticle R and the plate P, the reticle position detection system 49 is completely stopped, or the vibration of the position detection system 49 is negligible as compared with the detection amount to be detected. It is necessary to reduce it to (1 μm or less). Since the surface plate 42 of the device is supported by the vibration isolation pad 41, most of the vibration from the floor surface on which the device is installed is absorbed by the vibration isolation pad 41.
Vibration-proof pad 41 for low-frequency vibrations with a frequency of 10 Hz or less
Some may not be absorbed. Further, the movement of the XY stage 43 may cause the reticle position detection system 49 to vibrate.

Such vibration can be prevented by increasing the rigidity of the members constituting the device. However, if the rigidity of the device is increased, the members constituting the device are increased in size, and as a result, the weight of the device is increased, so that the place where the device is installed may require reinforcement. Also,
The space for placing the reticle and the plate, and further the space for performing the maintenance of the apparatus are reduced, and it becomes difficult to place the reticle and the plate and maintain the apparatus.

An object of the present invention is to provide a position detecting device which can suppress the vibration of the position detecting system without increasing the rigidity of the members constituting the device.

[0007]

FIG. 1 shows an embodiment of the present invention.
Describing with reference to FIGS. 3A to 3C, the invention of claim 1 is applied to a position detection device that detects the position of the position detection member R, and large vibration parts 15a and 16a in which the vibration of the device is large and small vibrations are small. The above object is achieved by connecting the vibrating portion 48a with the absorbing means 11 to 14, 31, 32 for absorbing the vibration energy of the device.

According to a second aspect of the present invention, the absorbing means absorbs the vibration energy by the frictional force between the large vibration portions 15a and 16a. In the invention of claim 3, the absorbing means is
Both ends have large vibration parts 15a and 16a and small vibration parts 48a.
The magnets 31 and 32 are respectively attracted to and.

The invention of claim 4 is applied to an exposure apparatus provided with a mask stage 48 on which the mask R is placed and a position detecting means 49 for detecting the position of the mask R, and a portion provided with the mask stage 48. The above object is achieved by connecting the portion where the position detecting means 49 is provided with the magnets 31 and 32 whose both ends are attracted to each portion.

According to the invention of claim 1, the large vibration parts 15a and 16a of the position detecting device and the large vibration parts 15a and 16
Since the absorbing means 11 to 14, 31, and 32 are connected between the small vibrating portion 48a whose vibration is sufficiently smaller than that of a, the vibration of the large vibrating portions 15a and 16a is absorbed by the absorbing means 11 to 11.
It is absorbed by 14, 31, 32.

A mask stage 48 on which the mask R is placed
In the exposure apparatus including the position detecting means 49 for detecting the position of the mask R, the vibration of the portion including the position detecting means 49 is relatively large, and the vibration of the portion including the mask stage 48 is the position detecting means 49. Is sufficiently small as compared with the vibration of the part provided with. Therefore, as in the invention of claim 4, the portion provided with the mask stage 48 and the portion provided with the position detection means 49 are connected by the magnets 31, 32 whose both ends are attracted between the respective portions. Due to
The vibration of the position detecting means 49 is absorbed by the frictional force with the magnets 31, 32 attracted to the part.

In the section of the means for solving the above-mentioned problems, which explains the configuration of the present invention, the drawings of the embodiments of the present invention are used to make the present invention easy to understand. However, the present invention is not limited to this.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic sectional view showing the structure of a semiconductor manufacturing apparatus to which the position detecting device according to the present invention is applied, and FIGS. 2 and 3 are side views showing the detailed structure of a damper described later. Note that, in FIG. 1, the same configurations as those of FIG. 10 described in the above-mentioned related art are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG. 1, the reticle position detection system 49 is supported by support legs 15 and 16 projecting from the reticle stage 48. And
The tips 15a and 16a of the support legs 15 and 16 and the edge portion 48a of the reticle stage 48 are connected by the dampers 11 and 12. On the other hand, the mounting portions 17 and 19 of the fixing member 46 that fixes the projection lens PL and the mounting portions 18 inside the pedestal 44,
The dampers 13 and 14 are also mounted between the dampers 20 and 20. Although FIG. 1 shows that the support leg fixing member 46 is provided with two dampers, in reality, as shown in FIG. 5, the dampers are provided so as to absorb vibrations in not only one direction but two directions. To be

As shown in FIGS. 2 and 3, the damper 11,
Reference numeral 12 is composed of magnets 31 and 32, and extends from the edge portion 48 a of the reticle stage 48 to the tip 1 of the support legs 15 and 16.
It is attracted to the attraction surface 48A of the reticle stage 48 while being inclined at a predetermined angle toward 5a and 16a. Magnet 3
One end of the stoppers 33, 34 is attached to the magnets 1, 3
2 is attached by a screw 35 at a distance from the other end, and the other ends of the stoppers 33, 34 are supported by screws 36 on the supporting legs 15, 16
It is attached closely to. The diameter of the through hole of the screw 35 of the detents 33, 34 is made larger than the screw diameter, so that the magnets 31, 32 can be moved with respect to the detents 33, 34 and can be detached from the attraction surface 48A. To be prevented. In the present embodiment, the tips 15a and 16a of the support legs constitute a large vibration portion where the vibration is large, and the edge portion 48a of the reticle stage 48 constitutes a small vibration portion where the vibration is small.

FIG. 4 is a diagram showing a detailed structure of the dampers 13, 14. Since the dampers 13 and 14 have the same configuration, only the damper 13 will be described here. As shown in FIG. 4, in the damper 13, one end of the rod 13a is attached to the attachment portion 17 of the fixing member 46, and the piston 13c is fixed to the other end. The piston 13c is slidable inside the cylinder 13b. The inside of the cylinder 13b is filled with the liquid 13d, and the liquid 13d moves back and forth between the bottom chamber and the rod chamber of the cylinder 13b through the orifice 13f formed in the piston 13c. Cylinder 13b is rod 13e
Is fixed to one end of the mounting base 18
Attached to. When the fixing member 46 vibrates and the rod 13a moves in the direction of arrow A, the liquid 13d filled in the cylinder 13b becomes the orifice 13f.
And move in the direction of arrow B. The viscous resistance at this time absorbs the vibration of the fixing member 46, and the amplitude becomes smaller.

Next, the operation of this embodiment will be described. The vibration of the floor surface during the use of the device is absorbed by the vibration isolation pad 41, but the low frequency vibration of 10 Hz or less is not absorbed by the vibration isolation pad 41 and is applied to the device. Further, the vibration when the XY stage 43 is moved is also applied to the entire device. These vibrations cause the reticle stage 48 and the fixing member 46 to vibrate. On this occasion,
The support legs 15 and 16 of the reticle stage 48 also vibrate, but the support leg tips 15a and 16a have support leg bases 15b and 1a.
It vibrates with an amplitude larger than 6b. Therefore, the reticle detection system 49 also vibrates with the same amplitude as that of the support leg tips 15a and 16a.

In the present embodiment, the support leg tip 15
a, 16a and the edge portion 48a of the reticle stage 48 to which the support leg roots 15b, 16b are attached are magnets 31, 3.
Since they are connected by 2, the support leg tips 15a, 16
When a vibrates in the direction of the arrow in FIG. 2, the support leg tips 15a,
Slip occurs between the magnet 16a and the magnets 31, 32. As a result, the product of the attraction forces F1 and F2 of the magnets 31 and 32 and the friction coefficients μ1 and μ2 between the support leg tips 15a and 16a and the magnets 31 and 32, that is, F1 × μ1 and F2 ×
The frictional resistance of μ2 is equal to that of the support leg tips 15a and 16a and the magnet 3
It occurs between 1 and 32. Meanwhile, reticle stage 4
The edge portion 48a of No. 8 has a very small amplitude as compared with the tips 15a and 16a of the supporting legs, so that the magnets 31 and 32 have the edge portion 48a.
A substantially fixed relationship is maintained between and. Therefore, the frictional resistances F1 × μ1 and F2 × μ2 absorb the vibrations of the support leg tips 15a and 16a, and the amplitude thereof becomes substantially the same as the edge portion 48a of the reticle stage 48, and as a result, the reticle position is reduced. The amplitude of the detection system 49 also decreases.

On the other hand, the fixing member 46 vibrates and the microscope 45
Although a and 45b also vibrate, since the dampers 13 and 14 are attached to the attachment portion of the fixing member 46, the vibrations are absorbed by the dampers 13 and 14. On the other hand, damper 1
The pedestal 44 to which the other ends of 3, 14 are attached is the fixing member 4
Since the vibration is much smaller than that of 6, the fixing member 4
The vibration of 6 is absorbed, and its amplitude becomes substantially the same as that of the pedestal 44 and becomes smaller.

As described above, in this embodiment, the microscopes 49a and 49b attached to the reticle position detecting system 49 are mounted.
And the microscopes 45a, 4 attached to the fixing member 46
The amplitude of 5b also becomes small. Therefore, the mark on the reticle R is detected by the microscopes 49a and 49b, and the plate P
Even when the upper marks are detected by the microscopes 45a and 45b and the reticle R and the plate P are aligned based on the detection results, the reticle R and the plate P are not affected by the vibration of the apparatus. It is possible to accurately detect the formed mark and accurately align the reticle R and the plate P. Also, the magnets 31, 3
It suffices to adsorb both end portions of 2 to the large vibration portion and the small vibration portion, and can be easily added to the already delivered device.

After the alignment is completed, the reticle R is irradiated with light emitted from a light source (not shown), and the pattern formed on the reticle R is projected onto the projection lens PL.
It is projected on the plate P placed on the XY stage 43 via. It should be noted that in the above-described embodiment, FIG.
The magnets 31 and 32 are arranged so as to absorb the vibration in the direction of the arrow. However, in order to absorb the vibration in the direction perpendicular to the paper surface of FIG. Two
A magnet may be attracted as in the embodiment shown in FIG.

Further, in the above embodiment, as shown in FIGS. 2 and 3, the magnets 31 and 32 are attached to the support leg tip 1.
Although it is arranged between 5a and 16a and the edge portion 48a of the reticle stage 48, for example, as shown in FIG. 6, the edge portion 48a of the reticle stage 48 is deformed into an L shape and is formed into an L shape. The rigidity of the broken portion is made higher than that of the other portions, and the tip 48b of this L-shaped portion and the support leg tips 15a and 16a are connected by the magnets 31 and 32. It can also absorb the vibration of. In addition, in FIG. 6, a retaining member for attaching the magnets 31 and 32 is omitted.

In the above embodiment, the magnet 3 is used.
Instead of 1, 32, a damper having the structure shown in FIG. 4 can be used. In this case, four dampers are attached so as to absorb vibration in two directions, as in the case shown in FIG. Further, as shown in FIG. 7, the reticle position detection system 4
The member 50 is attached to the tip of the spring 9, the spring 52 is attached to the support legs 15 and 16, and the sliding member 51 is attached to the tip of the spring 52.
It is also possible to absorb the vibration in the direction perpendicular to the plane of the paper of FIG. 7 by mounting the above and pressing the sliding member 51 against the member 50 by the spring 52 to slide the sliding member 51 and the member 50.

Further, in the embodiment shown in FIG. 2, the magnets 31 and 32 are connected to the edge portion 4 of the reticle stage 48.
8a is inclined toward the tips 15a, 16a of the support legs 15, 16 by a predetermined angle and is adsorbed on the adsorption surface 48A.
As shown in FIG. 8, the magnet 3 is provided along the supporting legs 15 and 16.
Even if 1 and 32 are attracted, the vibration of the reticle position detection system 49 can be eliminated by the frictional force between the tips 15a and 16a of the support legs and the tips of the magnets 31 and 32. Furthermore,
As shown in FIG. 9, the magnets 31 and 32 may be fixed to the edge portion 48 a of the reticle stage 48 with screws 39. In this case, even if only the tip portions of the magnets 31, 32 are attracted to the support leg tips 15a, 16a as having a magnetic force, the vibration can be suppressed by the same attraction friction force.

Further, in the above embodiment, an example in which the position detecting device of the present invention is applied to a semiconductor manufacturing device has been described, but the present invention is applicable to a liquid crystal display plate manufacturing device, an electron microscope, or other target object. The present invention can be applied to any device as long as the device can detect the position.

In the correspondence between the above-described embodiment and the claims, the dampers 11, 12, 13, 14 and the magnets 31, 32 and the spring 52 constitute the absorbing means, and the reticle position detecting system 49 constitutes the position detecting means.

[0026]

As described in detail above, according to the present invention, the large vibration portion and the small vibration portion are connected by the absorbing means, and the vibration of the large vibration portion is absorbed by the absorbing means. Without increasing the rigidity of each part of
It is possible to absorb the vibration of the large vibration part. Further, since it is not necessary to increase the rigidity of the device, it is possible to reduce the size and weight of the device, and it is not necessary to strengthen the floor structure at the installation location of the device, and the cost of the equipment can be reduced. Further, since the vibration of the large vibration part can be absorbed without changing the basic configuration of the device, it can be easily applied to the existing device.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing the configuration of a semiconductor manufacturing apparatus to which a position detection device according to this embodiment is applied.

FIG. 2 is a partial cross-sectional view showing the structure of absorbing means.

FIG. 3 is a partial cross-sectional view showing the structure of absorbing means.

FIG. 4 is a cross-sectional view showing a configuration of a damper.

FIG. 5 is a perspective view for explaining a mounting state of the damper.

FIG. 6 is a partial cross-sectional view showing another embodiment of the absorbing means of the present invention.

FIG. 7 is a partial sectional view showing still another embodiment of the absorbing means of the present invention.

FIG. 8 is a partial sectional view showing still another embodiment of the absorbing means of the present invention.

FIG. 9 is a partial sectional view showing still another embodiment of the absorbing means of the present invention.

FIG. 10 is a sectional view showing a configuration of a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 11-14 Damper 15,16 Support leg 15a, 16a Support leg tip 15b, 16b Support leg base 17-20 Attachment part 41 Vibration-proof pad 42 Surface plate 43 XY stage 44 Frame 45a, 45b, 49a, 49b Microscope 46 Fixing member 47 Frame 48 Reticle stage 49 Reticle position detection system R Reticle P plate

Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location H01L 21/68 H01L 21/30 503F

Claims (4)

[Claims] 1. A position detection device for detecting the position of a position detection member, wherein absorbing means for absorbing vibration energy of the device between a large vibration part where the vibration of the device is large and a small vibration part where the vibration is small. A position detecting device characterized by being connected by. 2. The position detecting device according to claim 1, wherein the absorbing means is means for absorbing the vibration energy by a frictional force with the large vibration portion. 3. The position detecting device according to claim 1, wherein the absorbing means is a magnet whose both ends are attracted to the large vibration portion and the small vibration portion, respectively. 4. An exposure apparatus comprising a mask stage on which a mask is placed and position detecting means for detecting the position of the mask, wherein a portion where the mask stage is provided and a portion where the position detecting means is provided. The exposure apparatus is characterized in that the gaps are connected by magnets whose both ends are attracted to the respective portions.