JPH09295225A - Device and method for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with the memory chip write-in in a separate process from a memory chip mounting process, and to improve the productivity of a printed circuit board on which the memory chip is mounted. SOLUTION: A transfer head 17 to transfer a memory chip 5 before write-in to be fed to a tray parts feed stage 13 of an electronic parts mounting device 6 to a write-in stage 18. In addition, a write-in device 19 to write in the information necessary for the memory chip 5 transferred to a ROM socket 18a of the write-in stage 18 is provided, and the memory chip 5 in which the necessary information is written in by the write-in device 19 is mounted on the prescribed position of a printed circuit board 2 by a mount head 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for automatically mounting a memory chip (ROM) in which necessary information is written at a predetermined position on a printed wiring board in an automatic printed wiring board assembly line. It belongs to the technical field of mounting methods.

[0002]

2. Description of the Related Art Generally, an assembly line for automatically assembling a printed wiring board on which a memory chip is mounted includes an electronic component mounting apparatus capable of automatically mounting the memory chip at a predetermined position on the printed wiring board. However, a memory chip (ROM: Read Only Me) that normally writes before mounting
mory), eg Flash ROM, EP
ROM (Erasable Programmable ROM), EEPROM
When mounting (Electrically Erasable Programmable ROM) etc., it is necessary to prepare a memory chip in which necessary information is written in advance.

[0003]

However, in the prior art, since the writing process to the memory chip is performed in a process completely separated from the automatic assembly process, the process is dispersed and the productivity is lowered. In addition, if the writing process is performed externally (another factory, subcontractor, etc.), it is necessary to open the protective vacuum pack, perform the writing process, and then vacuum-pack again before delivery. There is the inconvenience that extra costs such as opening / packing costs and logistics costs are not allowed, as artificial defects may occur during opening / packing.

[0004]

SUMMARY OF THE INVENTION The present invention has been made with the object of providing an electronic component mounting apparatus and mounting method capable of solving these problems in view of the above-mentioned circumstances. An electronic component mounting apparatus for automatically mounting a memory chip in which necessary information is written at a predetermined position of a printed wiring board, the electronic component mounting apparatus comprising:
A supply unit to which a memory chip before writing is supplied, a writing unit that writes necessary information to the memory chip transferred from the supply unit, and a written memory chip is taken out from the writing unit to determine a predetermined size of a printed wiring board. And a mounting portion to be mounted at a position. That is, since the writing function for writing necessary information to the memory chip is incorporated in the electronic component mounting device that mounts the memory chip at the predetermined position of the printed wiring board, it is not necessary to perform the writing process of the memory chip in advance.
Therefore, the writing process to the memory chip can be integrated into the automatic assembly process to improve the productivity without performing the writing process in a separate process or outside (another factory, subcontractor, etc.). As in the case of carrying out, it is possible to eliminate the inconvenience that artificial defects occur at the time of opening and packing, and that extra costs such as opening and packing costs and physical distribution costs are required.

Alternatively, there is provided an electronic component mounting method using an electronic component mounting apparatus for automatically mounting a memory chip in which necessary information is written at a predetermined position on a printed wiring board,
Prior to the mounting step of automatically mounting the written memory chip at a predetermined position on the printed wiring board, a transfer step of transferring the unwritten memory chip supplied to the supply unit of the electronic component mounting apparatus to the writing unit. And a writing step of writing necessary information to the memory chip transferred from the supply unit. In other words, since the writing process of writing necessary information to the memory chip before writing is incorporated in the mounting process of the memory chip, the writing process of the memory chip is performed in another process or outside (another factory, subcontractor, etc.). Without being able to integrate it into the automatic assembly process to improve productivity, artificial defects may occur during opening and packing, such as when writing externally, opening and packing costs, It is possible to eliminate the inconvenience that extra costs such as physical distribution costs are required.

[0006]

Next, one embodiment of the present invention will be described with reference to the drawings. In the drawings, reference numeral 1 denotes an automatic assembly line for a printed wiring board 2. The automatic assembly line 1 is a solder paste printing device 3 for printing a solder paste (solder paste for joining electronic components) on a printed wiring board material. , A first electronic component mounting device 4 for mounting various electronic components at predetermined positions on the printed wiring board 2, and a second electronic component mounting device 4 for mounting various electronic components and a memory chip (ROM) 5 at predetermined positions on the printed wiring board 2. Various devices such as an electronic component mounting device 6, an air reflow device 7 for melting and melting the printed wiring board 2 on which various electronic components are mounted, and a mounted component appearance inspection device 8 for inspecting the electronic components mounted on the printed wiring board 2. Are connected in series through a transfer device 9 that sequentially transfers the printed wiring board 2, and the basic configurations of these are all the same as in the related art.

Reference numeral 10 denotes a mount head (mounting portion) provided in the electronic component mounting apparatus 6, and the mount head 10 includes a tape component 12 (a plurality of electronic components previously taped to a tape component supply stage 11). Or a tray component 14 (a plurality of electronic components stored in a matrix tray in advance) supplied to the tray component supply stage (supply unit) 13 is automatically selected according to the component shape. Extraction equipment (tool, nozzle)
The mount head 1 is used to automatically pick up the picked-up electronic parts at predetermined positions of the printed wiring board 2 on the mount stage 15.
A series of operations of 0 is controlled by the controller 16.

Reference numeral 17 denotes a transfer head provided on the tray supply stage 13. The transfer head 17 is provided with a predetermined amount from the matrix tray when the memory chip 5 before writing is supplied to the tray supply stage 13. While taking out the memory chip 5 using a nozzle (air nozzle),
The taken-out memory chip 5 is transferred to the tray supply stage 13
Writing stage (writing section) 18 provided adjacent to
The transferred memory chips 5 are mounted in the ROM sockets 18 a arranged in plural in the writing stage 18.

A writing device (ROM) 19 is electrically connected to the ROM socket 18a of the writing stage 18.
A writing programmer), said writing device 1
9 is a controller 16 (or an external controller)
Necessary information is written in the memory chip 5 attached to the ROM socket 18a based on the write command from the. That is, when a single memory chip 5 is mounted on the printed wiring board 2, the same information is written every time the memory chip 5 before writing is mounted on the ROM socket 18a, while the same printed wiring board 2 is mounted. When a plurality of memory chips 5 are attached to the memory socket 5, the write information is automatically selected every time the memory chip 5 before writing is attached to the ROM socket 18a, and different information is written to each memory chip 5. ing. Then, after the writing process is performed, the written memory chips 5 are sequentially taken out by the mount head 10 described above, and the taken-out memory chips 5 are automatically placed at predetermined positions on the printed wiring board 2 on the mount stage 15. It will be installed. It should be noted that the mount head 10 has a function of detecting a defective part using a recognition camera (not shown) during component transfer, and when it is recognized as a defective part, it is adjacent to the writing stage 18. The defective part is designed to be dropped into the provided defective part shooter 20.

In the configuration as described above, when the memory chip 5 before writing is supplied to the tray component supply stage 13, the memory chip 5 is transferred to each ROM socket 18a of the write stage 18 by the transfer head 17. After the writing, necessary information is written by the writing device 19, and then the mounting head 10 mounts the information on a predetermined position of the printed wiring board 2. That is, since the electronic component mounting device 6 for mounting various electronic components on the printed wiring board 2 has a writing function for writing necessary information in the memory chip 5 before writing, the writing process of the memory chip 5 is performed in advance. As a result, it is possible to integrate the writing process of the memory chip 5 performed in a separate process into the automatic assembling process, and improve the productivity based on the shortening of the working process and the working time.

In addition, as in the case where the writing process of the memory chip 5 is performed outside (another factory, subcontractor, etc.)
Since there is no need to carry out packing work, it is possible to eliminate the inconvenience that artificial defects occur during opening and packing, or it is possible to reduce opening and packing costs and logistics costs, and to achieve a significant cost reduction. .

Further, it is possible to simultaneously execute the writing process and the mounting process with a structure as simple as adding the transfer head 17 and the writing device 19 (including the ROM socket 18a) to the general-purpose electronic component mounting device. Therefore, it can be handled as a so-called optional device in which the transfer head 17 and the writing device 19 are set, and as a result, there is an advantage that a writing mechanism can be added if necessary, or it can be attached to various electronic component mounting devices. It can be a possible general-purpose option device.

Of course, the present invention is not limited to the above-described embodiment, and for example, the memory chip 5 that has been written is temporarily transferred from the write stage 18 to a buffer stage (not shown) and The transferred memory chip 5 may be taken out by the mount head 10, and in the case of such a configuration, there is an advantage that a strict defect check can be performed in the buffer stage.

[Brief description of drawings]

FIG. 1 is a block diagram showing an automatic assembly line for a printed wiring board.

FIG. 2 is a schematic plan view of an electronic component mounting device.

FIG. 3 is a block diagram showing input / output of a controller.

[Explanation of symbols]

 1 Automatic Assembly Line 2 Printed Wiring Board 5 Memory Chip 6 Electronic Component Mounting Device 10 Mount Head 11 Tape Component Supply Stage 13 Tray Component Supply Stage 15 Mount Stage 17 Transfer Head 18 Writing Stage 19 Writing Device 20 Defective Parts Shooter

Claims (2)

[Claims] 1. An electronic component mounting apparatus for automatically mounting a memory chip in which necessary information is written at a predetermined position on a printed wiring board, wherein the electronic chip mounting apparatus stores a memory chip before writing. A supply unit to be supplied, a writing unit that writes necessary information to the memory chip transferred from the supply unit, and a mounting unit that takes out the written memory chip from the writing unit and mounts it at a predetermined position on the printed wiring board. And an electronic component mounting device having a section. 2. An electronic component mounting method using an electronic component mounting device for automatically mounting a memory chip on which necessary information is written at a predetermined position on a printed wiring board, wherein the written memory chip is used. Prior to the mounting process that automatically mounts the memory chip at a predetermined position on the printed wiring board, the transfer process that transfers the unwritten memory chips supplied to the supply unit of the electronic component mounting device to the write unit and the transfer process from the supply unit. A method of mounting an electronic component, which comprises a writing step of writing necessary information to a mounted memory chip.