JPH09291199A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPH09291199A
JPH09291199A JP10657696A JP10657696A JPH09291199A JP H09291199 A JPH09291199 A JP H09291199A JP 10657696 A JP10657696 A JP 10657696A JP 10657696 A JP10657696 A JP 10657696A JP H09291199 A JPH09291199 A JP H09291199A
Authority
JP
Japan
Prior art keywords
parts
resin
aramid fiber
phenol
pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10657696A
Other languages
Japanese (ja)
Inventor
Shinichi Ozeki
真一 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Durez Co Ltd filed Critical Sumitomo Durez Co Ltd
Priority to JP10657696A priority Critical patent/JPH09291199A/en
Publication of JPH09291199A publication Critical patent/JPH09291199A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a thermosetting resin compsn. reduced in the decrease in strength after heat hysteresis, and improved in mechanical strength, moldability and heat resistance by using a specific phenolic resin and an aramid fiber. SOLUTION: 1mol of phenol, 0.2-1.3 mol of aldehyde, and an arom. amine in an amt. of 0.2-100 pts.wt. per 100 pts.wt. phenol are subjected to an addn. condensation reaction in the presence of an acid or metal salt catalyst to obtain a phenolic resin. 100 pts.wt. phenolic resin is blended with 3-20 pts.wt. hexamethylenetetramine as a curing agent and 1-500 pts.wt. aramid fiber.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、成形性、耐熱性に
優れる成形品、摩擦材等の複合材を得るために用いられ
る熱硬化性樹脂組成物に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting resin composition used for obtaining a molded product having excellent moldability and heat resistance, and a composite material such as a friction material.

【0002】[0002]

【従来の技術】フェノール樹脂は優れた機械特性、電気
特性、耐熱性及び接着性などを有するバインダーであ
り、電気・電子部品、住宅建材、自動車部品など様々な
用途で使用されている。近年、より過酷な条件下で使用
される分野における用途が急増し、特に耐熱性の要求が
厳しくなっている。このような用途では、従来のフェノ
ール樹脂の耐熱性では十分でなく、様々な変性フェノー
ル樹脂の研究が盛んに行われている。
BACKGROUND OF THE INVENTION Phenolic resins are binders having excellent mechanical properties, electrical properties, heat resistance, adhesiveness, etc., and are used in various applications such as electric / electronic parts, housing construction materials and automobile parts. In recent years, the applications in the fields used under more severe conditions have increased rapidly, and the demand for heat resistance has become particularly strict. In such applications, the heat resistance of conventional phenolic resins is not sufficient, and various modified phenolic resins have been actively researched.

【0003】フェノール樹脂の熱分解は、フェノール核
間のメチレン橋における酸化熱分解によって起こるとさ
れており、メチレン橋の片側をフェノール性水酸基の無
い芳香族炭化水素に置き換える事により、耐熱性は改善
される。即ち、フェノールと芳香族炭化水素の反応にお
いて、フェノール樹脂の耐熱性は芳香族炭化水素の変性
量に比例して増大する。しかし、芳香族炭化水素の変性
量を多くすると、全体としてフェノール性水酸基含有量
が減少するので、基材との密着性の低下、反応性低下に
よる成形性の悪化、分子量増大による流動硬化性の悪化
といった欠点が増大し、複合材としての充分な耐熱性は
得られなかった。
It is said that the thermal decomposition of the phenol resin is caused by the oxidative thermal decomposition at the methylene bridge between the phenol nuclei, and the heat resistance is improved by replacing one side of the methylene bridge with an aromatic hydrocarbon having no phenolic hydroxyl group. To be done. That is, in the reaction of phenol and aromatic hydrocarbon, the heat resistance of the phenol resin increases in proportion to the amount of modification of the aromatic hydrocarbon. However, if the modification amount of the aromatic hydrocarbon is increased, the content of the phenolic hydroxyl group is decreased as a whole, so that the adhesiveness with the substrate is deteriorated, the moldability is deteriorated due to the decrease in reactivity, and the flow curability due to the increase in molecular weight is Defects such as deterioration were increased, and sufficient heat resistance as a composite material could not be obtained.

【0004】一方、フェノール樹脂を用いた成形品、摩
擦材などの複合材は、一般にガラス繊維、アラミド繊
維、金属繊維等の基材と、硫酸バリウム、炭酸カルシウ
ム、ウォラストナイト、銅粉等の無機添加剤が使用され
ている。複合材としての耐熱性はバインダーとなるフェ
ノール樹脂の化学的耐熱性と、これらの基材、フィラー
による補強効果によって発現されるものである。
On the other hand, composite materials such as molded products and friction materials using phenolic resin are generally made of glass fiber, aramid fiber, metal fiber or other base material and barium sulfate, calcium carbonate, wollastonite, copper powder or the like. Inorganic additives are used. The heat resistance of the composite material is expressed by the chemical heat resistance of the phenol resin used as the binder and the reinforcing effect of these base materials and fillers.

【0005】フェノール樹脂の化学的耐熱性は、前述し
たように樹脂の構造中にフェノール性水酸基のない芳香
族炭化水素を導入することにより改善されることが明ら
かになっている。しかしながら、芳香族炭化水素による
変性のため基材との密着性は低下し、特にアラミド繊維
との密着性の低下が顕著である。
It has been revealed that the chemical heat resistance of the phenol resin is improved by introducing an aromatic hydrocarbon having no phenolic hydroxyl group into the structure of the resin as described above. However, due to the modification with an aromatic hydrocarbon, the adhesiveness with the substrate is lowered, and particularly the adhesiveness with the aramid fiber is remarkably reduced.

【0006】[0006]

【発明が解決しようとする課題】本発明は、このような
フェノール樹脂の問題点を解決するため、種々の検討の
結果完成したもので、その目的とするところは、特に成
形性、耐熱性に優れる成形品、摩擦材などの複合材を得
るために用いられる熱硬化性樹脂組成物を提供するもの
である。
The present invention has been completed as a result of various studies in order to solve the problems of the phenolic resin, and the object is to improve the moldability and heat resistance. It is intended to provide a thermosetting resin composition used for obtaining an excellent molded product, a composite material such as a friction material.

【0007】[0007]

【課題を解決するための手段】本発明は、フェノール
類、アルデヒド類及び芳香族アミンとを必須成分として
得られるフェノール樹脂と特定量のアラミド繊維よりな
る熱硬化性樹脂組成物に関するものであり、これにより
成型品、摩擦材などの複合材としての耐熱性が飛躍的に
向上するものである。すなわち、本発明者は、本発明に
用いるフェノール樹脂は構造中に芳香族アミンを有し、
このアミノ基はアラミド繊維との密着性に優れていて、
芳香族アミンを有するフェノール樹脂に特定量のアラミ
ド繊維を配合することにより補強効果を得、更にフェノ
ール樹脂中の芳香族アミンのアミノ基により化学的耐熱
性を発現できることを見出し、本発明を完成するに至っ
たものである。
The present invention relates to a thermosetting resin composition comprising a phenol resin obtained by using phenols, aldehydes and aromatic amines as essential components and a specific amount of aramid fiber, As a result, heat resistance as a composite material such as a molded product and a friction material is dramatically improved. That is, the present inventors have found that the phenolic resin used in the present invention has an aromatic amine in the structure,
This amino group has excellent adhesion to aramid fiber,
The present invention has been completed by finding that a reinforcing effect can be obtained by blending a specific amount of aramid fiber with a phenol resin having an aromatic amine, and further chemical heat resistance can be expressed by the amino group of the aromatic amine in the phenol resin. It came to.

【0008】以下、本発明について具体的に説明する。
本発明において、フェノール樹脂に使用するフェノール
類は、フェノール、クレゾール、キシレノール、エチル
フェノール、プロピルフェノール、カテコール、レゾル
シン、ハイドロキノン、ビスフェノールA、ビスフェノ
ールF、ナフトールなどであり、これらを単独または2
種類以上組合わせて使用してもよい。アルデヒド類は、
ホルムアルデヒド、パラホルムアルデヒド、ベンズアル
デヒド、アセトアルデヒド、サルチルアルデヒド、トリ
オキサンなどであり、これらを単独または2種類以上組
合わせて使用してもよい。芳香族アミン類は、フェニレ
ンジアミン、アニリン、アミノナフタレン、ジアミノナ
フタレン、メシジン、メチルアニリン、メタニル酸、ア
ミノインダン、アミノフェノール、ビスアニリンフルオ
レンなどであり、これらを単独又は2種類以上組合わせ
て使用してもよい。
Hereinafter, the present invention will be described specifically.
In the present invention, the phenols used in the phenol resin are phenol, cresol, xylenol, ethylphenol, propylphenol, catechol, resorcin, hydroquinone, bisphenol A, bisphenol F, naphthol, etc., which may be used alone or in 2 parts.
You may use it in combination of more than one kind. Aldehydes are
Formaldehyde, paraformaldehyde, benzaldehyde, acetaldehyde, saltylaldehyde, trioxane, etc. may be used alone or in combination of two or more kinds. Aromatic amines include phenylenediamine, aniline, aminonaphthalene, diaminonaphthalene, mesidine, methylaniline, methanilic acid, aminoindane, aminophenol, and bisanilinefluorene. These can be used alone or in combination of two or more. May be.

【0009】前記フェノール樹脂において、フェノール
類100重量部に対する芳香族アミンは、2〜100重
量部が好ましく、2重量部以下では十分な基材との密着
性が得られず、一方、100重量部以上では樹脂の硬化
が阻害される。アルデヒドの添加量は、芳香族アミンの
量にもよるが、通常フェノール類1モルに対して0.2
〜1.3モルであり、好ましくは0.5〜0.9であ
る。0.2モル未満では樹脂としての骨格が十分得られ
ず、一方1.3モルを超えると樹脂の流動性が失われ成
形が困難になり、さらには、樹脂への反応中にゲル化す
ることがある。本発明のフェノール樹脂を付加縮合反応
する際の触媒としては、蓚酸、塩酸、硫酸、ジエチル硫
酸、パラトルエンスルホン酸等の酸類、酢酸亜鉛等の金
属塩類を単独または2種類以上併用して使用できる。
In the above-mentioned phenol resin, the aromatic amine is preferably 2 to 100 parts by weight with respect to 100 parts by weight of the phenols, and when the amount is 2 parts by weight or less, sufficient adhesion to the substrate cannot be obtained, while 100 parts by weight. Above, the hardening of the resin is hindered. The addition amount of aldehyde depends on the amount of aromatic amine, but is usually 0.2 with respect to 1 mol of phenols.
Is about 1.3 mol, preferably 0.5 to 0.9. If it is less than 0.2 mol, the skeleton as a resin cannot be sufficiently obtained, while if it exceeds 1.3 mol, the fluidity of the resin is lost and molding becomes difficult, and further, gelation occurs during the reaction to the resin. There is. As a catalyst for the addition condensation reaction of the phenol resin of the present invention, acids such as oxalic acid, hydrochloric acid, sulfuric acid, diethylsulfuric acid and paratoluenesulfonic acid, and metal salts such as zinc acetate can be used alone or in combination of two or more kinds. .

【0010】フェノール樹脂の硬化剤としては必要に応
じて各種の2官能以上のエポキシ化合物、イソシアネー
ト類及びホルムアルデヒド樹脂やヘキサメチレンテトラ
ミンを用いることが出来るが、硬化性、耐熱性の面から
ヘキサメチレンテトラミンが好ましい。ヘキサメチレン
テトラミンの添加量はフェノール樹脂100重量部に対
して3〜20重量部であり、好ましくは7〜17重量部
である。3重量部未満では樹脂の硬化が不十分になり、
また、20重量部を超えるとヘキサメチレンテトラミン
の分解ガスが成形品にふくれ、亀裂などを発生させる。
As the curing agent for the phenol resin, various bifunctional or higher functional epoxy compounds, isocyanates, formaldehyde resin and hexamethylenetetramine can be used if necessary, but hexamethylenetetramine is preferable from the viewpoint of curability and heat resistance. Is preferred. The amount of hexamethylenetetramine added is 3 to 20 parts by weight, preferably 7 to 17 parts by weight, based on 100 parts by weight of the phenol resin. If the amount is less than 3 parts by weight, the resin will be insufficiently cured,
On the other hand, if it exceeds 20 parts by weight, the decomposition gas of hexamethylenetetramine swells or cracks the molded product.

【0011】本発明においては、上記フェノール樹脂と
特定量のアラミド繊維より熱硬化性樹脂組成物を得る。
使用するアラミド繊維は、パラ・フェニレン・テレフタ
ラミドのホモポリマー(商品名ケブラー、トワロン)、
あるいはパラ・フェニレン・テレフタラミドと3,4’
−ジフェニル・テレフタラミドのコポリマー(商品名テ
クノーラ)からなるものである。
In the present invention, a thermosetting resin composition is obtained from the phenol resin and a specific amount of aramid fiber.
The aramid fiber used is a homopolymer of para-phenylene-terephthalamide (trade name: Kevlar, Twaron),
Or para-phenylene terephthalamide and 3,4 '
-A copolymer of diphenyl terephthalamide (trade name: Technora).

【0012】アラミド繊維は強度、弾性率及び耐熱性に
優れる有機繊維であり、複合材の補強材料として用いた
場合、他の有機繊維、無機繊維と比べ強度、耐熱性に優
れた複合材を得ることができる。本発明においては、フ
ェノール樹脂は構造中に芳香族アミンを有している。こ
のアミノ基はアラミド繊維のアミド基との親和性が大き
いので、このフェノール樹脂とアラミド樹脂との密着性
に優れている。従って、芳香族アミンを有するフェノー
ル樹脂に特定量のアラミド繊維を配合することによりよ
り大きな補強効果を得ることができる。
Aramid fiber is an organic fiber excellent in strength, elastic modulus and heat resistance, and when used as a reinforcing material for a composite material, a composite material excellent in strength and heat resistance is obtained as compared with other organic fibers and inorganic fibers. be able to. In the present invention, the phenolic resin has an aromatic amine in its structure. Since this amino group has a large affinity with the amide group of the aramid fiber, it is excellent in the adhesiveness between the phenol resin and the aramid resin. Therefore, a greater reinforcing effect can be obtained by blending a specific amount of aramid fiber with a phenol resin having an aromatic amine.

【0013】本発明におけるアラミド繊維の添加量はフ
ェノール樹脂100重量部に対して1〜500重量部、
好ましくは15〜350重量部である。1重量部未満で
は本発明の特徴であるアラミド繊維による補強効果は得
られない。また500重量部以上では組成物の成形時の
流動性が悪くなり成形が困難になる。
The amount of the aramid fiber added in the present invention is 1 to 500 parts by weight based on 100 parts by weight of the phenol resin,
It is preferably 15 to 350 parts by weight. If it is less than 1 part by weight, the reinforcing effect by the aramid fiber, which is a feature of the present invention, cannot be obtained. On the other hand, if the amount is 500 parts by weight or more, the fluidity of the composition at the time of molding becomes poor and molding becomes difficult.

【0014】本発明の複合材用樹脂組成物の用途として
は、成形材料、ガラス繊維強化プラスチック、有機繊維
強化プラスチック、無機繊維強化プラスチック、ゴム補
強材、研磨材、摩擦材、電子電気部品被覆材、摺動部
材、エポキシ樹脂原料及びエポキシ樹脂硬化剤などが挙
げられる。
The composite resin composition of the present invention can be used as a molding material, a glass fiber reinforced plastic, an organic fiber reinforced plastic, an inorganic fiber reinforced plastic, a rubber reinforcing material, an abrasive material, a friction material, and an electronic / electrical component coating material. , Sliding members, epoxy resin raw materials and epoxy resin curing agents.

【0015】[0015]

【実施例】以下、本発明を実施例により説明する。しか
し本発明はこれらの実施例によって限定されるものでは
ない。また、製造例、実施例及び比較例に記載されてい
る「部」及び「%」は、すべて「重量部」及び「重量
%」を示す。
The present invention will be described below with reference to examples. However, the present invention is not limited to these examples. Moreover, all "parts" and "%" described in the production examples, examples and comparative examples indicate "parts by weight" and "% by weight".

【0016】製造例1 撹拌装置、還流冷却器及び温度計を備えた反応器にフェ
ノール1000部、蓚酸10部を仕込み後昇温し、80
℃でフェニレンジアミンを200部、37%ホルムアル
デヒドを550部添加した後、徐々に昇温し温度が95
℃に達してから180分間還流反応を行った。次いで、
常圧脱水反応を行いながら、系内の温度を130℃に昇
温させた。次に系内を650mmHgの真空下で脱水を
行いながら、系内の温度が160℃に昇温したところで
反応器より取出して常温で固形の樹脂1050部を得
た。
Production Example 1 A reactor equipped with a stirrer, a reflux condenser and a thermometer was charged with 1000 parts of phenol and 10 parts of oxalic acid, and the temperature was raised to 80.
After adding 200 parts of phenylenediamine and 550 parts of 37% formaldehyde at ℃, the temperature was gradually raised to 95
After reaching 0 ° C., a reflux reaction was performed for 180 minutes. Then
While performing the atmospheric pressure dehydration reaction, the temperature in the system was raised to 130 ° C. Next, while dehydrating the inside of the system under a vacuum of 650 mmHg, when the temperature inside the system rose to 160 ° C., it was taken out from the reactor to obtain 1050 parts of a solid resin at room temperature.

【0017】製造例2 フェニレンジアミン200部をアニリン500部とした
以外は製造例1と同様にして常温で固形の樹脂1300
部を得た。
Production Example 2 A resin 1300 which is solid at room temperature was produced in the same manner as in Production Example 1 except that 200 parts of phenylenediamine was changed to 500 parts of aniline.
Got a part.

【0018】製造例3 製造例1と同様の反応装置にフェノール1000部、3
7%ホルマリン630部及び蓚酸20部を仕込み後、徐
々に昇温し温度が95℃に達してから120分間還流反
応を行った。次いで、系内を650mmHgの真空下で
脱水を行いながら、系内の温度が170℃に昇温したと
ころで反応器より取出して常温で固形の樹脂1080部
を得た。
Production Example 3 1000 parts of phenol was added to the same reactor as in Production Example 3
After charging 630 parts of 7% formalin and 20 parts of oxalic acid, the temperature was gradually raised, and after the temperature reached 95 ° C, a reflux reaction was carried out for 120 minutes. Next, while dehydrating the inside of the system under a vacuum of 650 mmHg, when the temperature inside the system rose to 170 ° C., it was taken out from the reactor to obtain 1080 parts of a solid resin at room temperature.

【0019】実施例1 製造例1で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対してアラミド繊維(デュポン社
製 ケブラー)100部を乾式混合し熱硬化性樹脂組成
物を得た。
Example 1 To 1000 parts of the resin obtained in Production Example 1 was added 110 parts of hexamethylenetetramine and the mixture was pulverized to obtain a powder resin. 100 parts of this powder resin was dry mixed with 100 parts of aramid fiber (Kevlar manufactured by DuPont) to obtain a thermosetting resin composition.

【0020】実施例2 製造例2で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対してアラミド繊維(デュポン社
製 ケブラー)100部を乾式混合し熱硬化性樹脂組成
物を得た。
Example 2 To 1000 parts of the resin obtained in Production Example 2 was added 110 parts of hexamethylenetetramine and the mixture was pulverized to obtain a powder resin. 100 parts of this powder resin was dry mixed with 100 parts of aramid fiber (Kevlar manufactured by DuPont) to obtain a thermosetting resin composition.

【0021】実施例3 製造例1で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対してアラミド繊維(デュポン社
製 ケブラー)150部を乾式混合し熱硬化性樹脂組成
物を得た。
Example 3 To 1000 parts of the resin obtained in Production Example 1 was added 110 parts of hexamethylenetetramine and the mixture was pulverized to obtain a powder resin. To 100 parts of this powder resin, 150 parts of aramid fiber (Kevlar manufactured by DuPont) was dry-mixed to obtain a thermosetting resin composition.

【0022】実施例4 製造例1で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対してアラミド繊維(帝人(株)
製 テクノーラ)100部を乾式混合し熱硬化性樹脂組
成物を得た。
Example 4 To 1000 parts of the resin obtained in Production Example 1 was added 110 parts of hexamethylenetetramine and the mixture was pulverized to obtain a powder resin. To 100 parts of this powder resin, aramid fiber (Teijin Co., Ltd.)
100 parts of Technora Co., Ltd.) was dry-mixed to obtain a thermosetting resin composition.

【0023】比較例1 製造例3で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対して炭酸カルシウム100部を
乾式混合し熱硬化性樹脂組成物を得た。
Comparative Example 1 110 parts of hexamethylenetetramine was added to 1000 parts of the resin obtained in Production Example 3 and pulverized to obtain a powder resin. 100 parts of this powder resin was dry-mixed with 100 parts of calcium carbonate to obtain a thermosetting resin composition.

【0024】比較例2 製造例3で得られた樹脂1000部にヘキサメチレンテ
トラミン110部を加え、粉砕し、粉末樹脂を得た。こ
の粉末樹脂100部に対してアラミド繊維(デュポン社
製 ケブラー)100部を乾式混合し熱硬化性樹脂組成
物を得た。
Comparative Example 2 110 parts of hexamethylenetetramine was added to 1000 parts of the resin obtained in Production Example 3 and pulverized to obtain a powder resin. 100 parts of this powder resin was dry mixed with 100 parts of aramid fiber (Kevlar manufactured by DuPont) to obtain a thermosetting resin composition.

【0025】実施例1〜4及び比較例1、2で得られた
5種類の熱硬化性樹脂組成物を温度160℃、圧力20
0kg/cm2で10分間成形した後180℃で3時間
焼成してテストピ−スを作成した。得られた5種の樹脂
組成物のテストピースの常態曲げ強度、熱履歴後の曲げ
強度による評価結果を表1に示す。
The five thermosetting resin compositions obtained in Examples 1 to 4 and Comparative Examples 1 and 2 were used at a temperature of 160 ° C. and a pressure of 20.
A test piece was prepared by molding at 0 kg / cm 2 for 10 minutes and then baking at 180 ° C. for 3 hours. Table 1 shows the evaluation results by the normal bending strength and the bending strength after the heat history of the test pieces of the obtained five kinds of resin compositions.

【0026】[0026]

【表1】 [Table 1]

【0027】表1より明らかなように、実施例1〜4
は、常態強度が高くアラミド繊維による補強効果が明ら
かである。また熱履歴後の曲げ強度の劣化が小さく耐熱
性に優れていることがわかる。
As is clear from Table 1, Examples 1 to 4
Has a high normal strength, and the reinforcing effect of the aramid fiber is clear. Further, it can be seen that the bending strength after heat history is little deteriorated and the heat resistance is excellent.

【0028】[0028]

【発明の効果】本発明のフェノール樹脂組成物は、機械
的強度が高く、熱履歴後の強度低下が小さいので、成形
性、耐熱性に優れる成形品、摩擦材などの複合材として
好適に使用される。
EFFECT OF THE INVENTION The phenol resin composition of the present invention has a high mechanical strength and a small decrease in strength after heat history, and is therefore suitable for use as a composite material such as a molded product and a friction material having excellent moldability and heat resistance. To be done.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 フェノール類、アルデヒド類及び芳香族
アミンを必須成分として反応して得られるフェノール樹
脂100重量部とアラミド繊維1〜500重量部よりな
る熱硬化性樹脂組成物。
1. A thermosetting resin composition comprising 100 parts by weight of a phenol resin obtained by reacting phenols, aldehydes and aromatic amines as essential components and 1 to 500 parts by weight of aramid fiber.
【請求項2】 前記フェノール樹脂100重量部とアラ
ミド繊維15〜300重量部とからなる請求項1記載の
熱硬化性樹脂組成物。
2. The thermosetting resin composition according to claim 1, comprising 100 parts by weight of the phenol resin and 15 to 300 parts by weight of aramid fiber.
JP10657696A 1996-04-26 1996-04-26 Thermosetting resin composition Pending JPH09291199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10657696A JPH09291199A (en) 1996-04-26 1996-04-26 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10657696A JPH09291199A (en) 1996-04-26 1996-04-26 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPH09291199A true JPH09291199A (en) 1997-11-11

Family

ID=14437066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10657696A Pending JPH09291199A (en) 1996-04-26 1996-04-26 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPH09291199A (en)

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