JPH09289271A - Heat dissipation supporting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase or decrease, especially increase heat dissipation support degree according to the change of the heat generation amount of a heat generation part regardless of the change of a shape and position relation of a heat generation part and a housing. SOLUTION: An integrated circuit package 2 as a heat generation part is mounted on a printed wiring board 8 and a heat collector 3 wherein 36 square plane-like bottomed circular holes 3a are shaped is joined to an upper surface thereof. A square plate-like heat dissipator 4 wherein a hole whose arrangement and size are similar to those of the hole 3a in the heat collector 3 is joined to a circumferential wall inner surface of a housing 1. A soft rod-like heat conductor 5 which is formed to a coated copper line is prepared to be inserted and pulled to and from the hole 3a of the heat collector 3 and a hole of the heat dissipator 4, respectively at each end part thereof whose coating is removed. Generated heat is conducted to the heat dissipator 4 through the heat collector 3 and the heat conductor 5 and is further dissipated to the air through the housing 1. Furthermore, the number of applicable heat conductors 5 can be increased and decreased, especially increased up to 36 pieces by attaching and detaching according to a heat generation amount.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for supporting heat dissipation of an integrated circuit package or the like as a heat-generating component built in a housing, and in particular, the shape of the integrated circuit package and the housing, and their positional relationship. The present invention relates to a heat radiation support device that does not hinder application even if the heat radiation amount changes, and that can increase or decrease the degree of heat radiation support in accordance with a change in the heat generation amount of an integrated circuit package, in particular, increase.

[0002]

2. Description of the Related Art As a conventional example, a method of bonding a heat sink to the surface of a heat generating integrated circuit package, and a method of connecting a heat generating integrated circuit package and a housing made of a heat conductive material through a heat conductive plate. There is. As shown in the perspective view of FIG. 5, one conventional example using a heat sink has a structure in which a heat sink 11 is adhered to the upper surface of the integrated circuit package 2 via an adhesive sheet 7 having good thermal conductivity. The heat sink 11 is a member made of a material having good thermal conductivity such as aluminum, which has a structure in which a large number of small prisms are erected on a rectangular base plate, and the heat generation amount of the integrated circuit package 2 can be naturally adjusted from a large surface area. Or forcibly and efficiently dissipate heat (air cooling).

Another conventional example of using a heat conductive plate is as shown in the side view of FIG. 6, in which heat is applied between the upper surface of the integrated circuit package 2 and the vertical inner surface of the housing 1 made of a heat conductive material. This is a configuration in which an L-shaped heat transfer plate 12 made of a conductive material is interposed. The heat transfer plate 12 is composed of a flat strip-shaped fixed portion 13 bonded to the upper surface of the integrated circuit package 2 via a heat conductive adhesive sheet 7 and an L-shaped strip-shaped movable portion 14, and the fixed portion. 13 and the movable portion 14 are members whose end portions are connected by a machine screw 15 so that the position of the movable portion 14 can be adjusted in the lateral direction.
That is, by loosening the machine screw 15 and adjusting the lateral position of the movable portion 14 with respect to the fixed portion 13, the vertical surface of the L-shaped bent end of the movable portion 14 is brought into close contact with the vertical inner surface of the housing 1. In this way, the heat generated from the integrated circuit package 2 is conducted to the housing 1 via the heat transfer plate 12, and the large surface of the housing 1 can be efficiently dissipated (air-cooled).

[0004]

[Problems to be Solved by the Invention] As described above,
In one conventional example using a heat sink, when the heat generation amount of the integrated circuit package 2 changes (in particular, increases) due to a change in design or specifications, it is necessary to change the corresponding heat sink type. If this format change is not performed properly, heat dissipation may be insufficient and proper performance may not be guaranteed. Further, in another conventional example using a heat conductive plate, when the shape or the positional relationship between the integrated circuit package 2 and the housing 1 is changed beyond the position adjustment possible range due to a change in design or specifications, the original The heat transfer plate 12 cannot be applied.

The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art so that there is no hindrance to the application even if the shape of the heat-generating component and the housing and the positional relationship thereof are changed. It is an object of the present invention to provide a heat radiation support device capable of increasing or decreasing the degree of heat radiation support in accordance with a change in the heat generation amount of a heat generating component, and particularly increasing the degree of heat radiation support.

[0006]

SUMMARY OF THE INVENTION The present invention is an apparatus for assisting heat dissipation of a heat-generating component built in a housing made of a heat-conductive material, the heat-conducting component being provided in close contact with the surface of the heat-generating component. A heat collector made of a conductive material; a heat radiator made of a heat conductive material provided in close contact with the inner surface of the peripheral wall of the housing; a heat collector and a heat radiator that are connected to each other and can be attached and detached at both ends. One or a plurality of flexible heat transfer bodies made of a heat conductive material are provided, and the number of applied heat transfer bodies is selected according to the heat generation amount of the heat generating component.

Further, according to the present invention, the heat transfer member is a rod-like member which is attached / detached by inserting / pulling out into / from a hole formed on the mating side, or is attached / detached by inserting / detaching to / from a groove formed on the mating side. It is possible to adopt a configuration in which a coating layer made of a heat insulating material is provided on the outer peripheral surface of the belt-shaped member. Therefore, in the present invention, after the heat generated from the heat-generating component is collected in the heat collector by conduction, it is partially radiated from the outer peripheral surface of the heat conductor through the flexible and detachable heat conductor. It is conducted to the body and then dissipated from the heat radiating body through the housing to the outside air. In addition, the number of heat transfer elements to be applied can be selected according to the amount of heat generated by the heat-generating component by attaching or detaching the heat transfer body to suit it. Further, when the heat transfer body is provided with the coating layer on the outer peripheral surface, the heat dissipation from the outer peripheral surface is suppressed due to its heat insulating property.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 is a side view of the first embodiment, and FIG. 2 is a sectional view taken along line AA in FIG. In FIG. 1, a printed wiring board 8 is provided on the bottom surface of a housing 1 made of a heat conductive material so as to be floated via a spacer 9. The integrated circuit package 2 as a heat-generating component is mounted on the printed wiring board 8, and a rectangular flat plate made of a heat conductive material is formed on the upper surface of the integrated circuit package 2 with an adhesive sheet 7 having good heat conductivity interposed therebetween. The heat collector 3 is bonded. As shown in FIG. 2, a total of 36 bottomed circular holes 3a are formed on the surface side of the heat collecting body 3 in a matrix arrangement of 6 vertical × 6 horizontal.

A rectangular flat plate-shaped radiator 4 made of a heat conductive material is adhered to the inner surface of the peripheral wall of the housing 1 via an adhesive sheet 7. The heat collector 3 is provided on the surface side facing the inside of the radiator 4.
Holes 4a having the same arrangement and size as the holes 3a in (3) are drilled (see FIG. 2 (a)). 36 heat transfer elements 5 in the shape of a coated copper wire, which are flexible rod-shaped (wire-shaped) and slightly different in length,
The coating on each end on both sides is removed, and each end is directly inserted into and pulled out from the hole 3a of the heat collector 3 and the hole 4a of the radiator 4.

Therefore, the heat generated from the integrated circuit package 2 is collected by the heat collector 3 and then conducted to the radiator 4 via the inserted heat conductor 5, and further the radiator 4
To the outside air through the housing 1. Moreover, the heat transfer body 5
According to the heat generation amount of the integrated circuit package 2, the applicable number can be increased / decreased by attaching / detaching according to the heat generation amount of the integrated circuit package 2. However, in reality, it is used by additionally mounting only for the increase in the amount of heat generation.

In the first embodiment, the amount of heat generated by the heat collector 3 is transferred to the radiator 4 via the heat conductor 5, and the heat generated on the outer peripheral surface of the heat conductor 5 is thermally insulated. Since the coating layer is provided, the amount of radiation from the outer peripheral surface to the inside of the housing 1 is suppressed, and most of the heat is radiated from the housing 1 to the outside air through the radiator 4. On the other hand, when the heat transfer body 5 is a bare copper wire without a coating layer, heat is also radiated from the outer peripheral surface of the heat transfer body 5 in the process of conducting heat from the heat collecting body 3 to the heat radiating body 4. Therefore, if the air flow is created inside the housing 1 by the blower fan, the heat dissipation support function is increased. Further, since the heat transfer member 5 is a rod-shaped member, it has an effect that it is excellent in flexibility in all directions and can be easily attached to and detached from the respective holes 3a, 4a on the mating side.

The second embodiment will be described with reference to the side view of the second embodiment of FIG. 3 and the BB sectional view of FIG. 3 of FIG. The difference between the second embodiment and the first embodiment lies in the shape of the heat transfer member and the mounting / removing method thereof. The heat transfer body 6 in the second embodiment is a strip-shaped member made of a heat conductive material. Therefore, this heat transfer body 6 is used as the heat collecting body 3 and the heat radiating body 4.
On the other hand, the attachment / detachment is carried out by inserting / removing into / from the respective grooves 3b, 4b having a width dimension corresponding to the thickness of the heat transfer body 6 formed therein. Here, by using the band-shaped heat transfer member 6, the flexibility in the thickness direction is excellent, so that it is easy to organize, and particularly when the outer peripheral surface has no coating layer as in the second embodiment, it is bare. The large surface area has the effect of radiating heat from itself and increasing the heat radiation support function. However, in this case, an air flow needs to be created inside the housing 1 by a blower fan.
On the other hand, when there is no blower fan, a heat insulating coating layer is formed on the outer peripheral surface of the heat transfer body 6 to suppress heat radiation from the outer peripheral surface, and the heat radiation body 4 extends to the outside wall through the peripheral wall of the housing 1. It is better to dissipate heat.

[0013]

According to the present invention, the following excellent effects can be expected. (1) Since the heat conductor is flexible and removable, if there is some margin in the length, for example, the shape of the heat-generating components such as integrated circuit packages mounted on the printed wiring board and the housing, and their positional relationship. Even if is changed, there is no hindrance to the application. (2) Even if there is a change in the specifications of heat-generating components such as integrated circuit packages, and the amount of heat generated changes (especially even if it increases),
In accordance therewith, the heat transfer body can be attached / detached (in particular, additionally inserted) to increase / decrease the application number, in particular to increase the heat transfer body, so that it is possible to perform heat radiation support adapted to the heat generation amount. However, when the calorific value decreases,
It is not necessary to reduce the number of applied heat transfer bodies, and the number can be left unchanged. (3) In particular, when the heat transfer member is a rod-shaped member, it has excellent flexibility in all directions and can be easily attached to and detached from the other side. In addition to being easy to do, the large surface area also radiates heat from itself, increasing the heat dissipation support function. (4) When the heat transfer body is provided with the coating layer on the outer peripheral surface, the heat insulating property suppresses heat dissipation from the outer peripheral surface and increases the amount of heat that is dissipated from the heat dissipation body to the peripheral wall of the housing to the outside air. On the other hand, when the heat transfer body does not have the coating layer and is naked, part of the heat transfer body is dissipated from the outer peripheral surface of the heat transfer body in the process of conducting heat from the heat collecting body to the heat dissipating body. By creating an air flow inside the housing with a fan, the heat dissipation support function can be increased.

[Brief description of drawings]

FIG. 1 is a side view of a first embodiment according to the invention.

FIG. 2 is a sectional view taken along line AA in FIG. 1 of the first embodiment.

FIG. 3 is a side view of a second embodiment according to the invention.

FIG. 4 is a sectional view taken along line BB in FIG. 3 of the second embodiment.

FIG. 5 is a perspective view of a conventional example.

FIG. 6 is a side view of another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 case 2 integrated circuit package 3 heat collector 3a hole 3b groove 4 heat radiator 4a hole 4b groove 5,6 heat transfer body 7 adhesive sheet 8 printed wiring board 9 spacing body

Claims (4)

[Claims] 1. A device for assisting heat dissipation of a heat-generating component built in a housing made of a heat-conductive component, the heat-collecting member being made of a heat-conductive material and provided in close contact with the surface of the heat-generating component. ;
A heat radiator made of a heat conductive material provided in close contact with the inner surface of the peripheral wall of the housing; made of a heat conductive material detachably provided at each end on both sides in a form of connecting the heat collector and the heat radiator 1. A heat dissipation support device comprising: one or a plurality of flexible heat transfer members; and the number of applied heat transfer members is selected according to the amount of heat generated by the heat generating component. 2. The apparatus according to claim 1, wherein the heat transfer member is a rod-shaped member that is attached / detached at each end on both sides by inserting / pulling into / from a hole formed in the other side. Support device. 3. The heat dissipation device as claimed in claim 1, wherein the heat transfer member is a strip-shaped member which is attached / detached at respective end portions on both sides by inserting / removing into / from a groove formed on the opposite side. Support device. 4. The heat dissipation support device as claimed in claim 1, wherein the heat transfer body is provided with a coating layer made of a heat insulating material on an outer peripheral surface thereof.