JPH09286843A - Epoxy resin composition, prepreg and insulating base - Google Patents
Epoxy resin composition, prepreg and insulating baseInfo
- Publication number
- JPH09286843A JPH09286843A JP9845496A JP9845496A JPH09286843A JP H09286843 A JPH09286843 A JP H09286843A JP 9845496 A JP9845496 A JP 9845496A JP 9845496 A JP9845496 A JP 9845496A JP H09286843 A JPH09286843 A JP H09286843A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- content
- resin composition
- weight
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板等
の材料となる絶縁基板等の製造に使用されるエポキシ樹
脂組成物及びそれを用いたプリプレグ及びこのプリプレ
グを用いた絶縁基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition used for producing an insulating substrate or the like which is a material for a printed wiring board, a prepreg using the same and an insulating substrate using the prepreg.
【０００２】[0002]
【従来の技術】近年のエレクトロニクスの急速な発展に
伴って、電話交換機用プリント配線板等に用いられる、
エポキシ樹脂組成物を原材料として製造される絶縁基板
に対して、低誘電率化、低誘電正接化、難燃化の要求が
高まっている。この低誘電率化及び低誘電正接化を達成
する手段として、例えば特開平７−１０９６２号に示さ
れるように、アルキル置換基を持つベンゼン環を有する
３官能エポキシ樹脂と、特定の構造を有するフェノール
系硬化剤を含んでなるエポキシ樹脂組成物であって、エ
ポキシ樹脂組成物の固形分に対して、アルキル置換基を
７〜２５重量％含有するエポキシ樹脂組成物が提案され
ている。しかし、この特開平７−１０９６２号に示され
る方法によって得られるエポキシ樹脂組成物を用いて得
られる絶縁基板は誘電率及び誘電正接については良好な
性能を備えるが、難燃性については不十分であるという
問題点があった。2. Description of the Related Art With the rapid development of electronics in recent years, it is used for printed wiring boards for telephone exchanges.
There is an increasing demand for insulating substrates manufactured using an epoxy resin composition as a raw material to have a low dielectric constant, a low dielectric loss tangent, and flame retardancy. As means for achieving this low dielectric constant and low dielectric loss tangent, for example, as shown in JP-A-7-10962, a trifunctional epoxy resin having a benzene ring having an alkyl substituent and a phenol having a specific structure are disclosed. An epoxy resin composition containing a system curing agent, which contains 7 to 25% by weight of an alkyl substituent with respect to the solid content of the epoxy resin composition, has been proposed. However, the insulating substrate obtained by using the epoxy resin composition obtained by the method disclosed in JP-A-7-10962 has good performance in terms of dielectric constant and dielectric loss tangent, but is insufficient in flame retardancy. There was a problem.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記のような
事情に鑑みてなされたものであって、その目的とすると
ころは、低誘電率及び低誘電正接であって、かつ難燃性
の優れる絶縁基板が得られるエポキシ樹脂組成物を提供
することであり、また、このエポキシ樹脂組成物を用い
たプリプレグを提供することであり、さらに、このプリ
プレグを用いた絶縁基板を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to have a low dielectric constant and a low dielectric loss tangent and a flame retardant property. An object of the present invention is to provide an epoxy resin composition capable of obtaining an excellent insulating substrate, to provide a prepreg using the epoxy resin composition, and to provide an insulating substrate using the prepreg. .
【０００４】[0004]
【課題を解決するための手段】請求項１に係る発明のエ
ポキシ樹脂組成物は、アルキル置換基を持つベンゼン環
を有し、このアルキル置換基の分子中での含有率が７〜
３０重量％であるノボラック型エポキシ樹脂と、分子中
に５〜５０重量％の含有率でアルキル置換基を有するフ
ェノール系硬化剤と、ブロムを有する難燃剤を含んでな
るエポキシ樹脂組成物であって、エポキシ樹脂、硬化剤
及び難燃剤の合計量に対する、エポキシ樹脂、硬化剤及
び難燃剤が有する全アルキル置換基の含有率が７〜３０
重量％であり、全ブロムの含有率が１８〜２５重量％で
あるエポキシ樹脂組成物である。The epoxy resin composition of the invention according to claim 1 has a benzene ring having an alkyl substituent, and the content of the alkyl substituent in the molecule is 7 to.
An epoxy resin composition comprising a novolac type epoxy resin of 30% by weight, a phenolic curing agent having an alkyl substituent in an amount of 5 to 50% by weight in a molecule, and a flame retardant having bromine. , The total content of alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant is 7 to 30 relative to the total amount of the epoxy resin, the curing agent and the flame retardant.
The epoxy resin composition has a content of total bromine of 18 to 25% by weight.
【０００５】請求項２に係る発明のプリプレグは、請求
項１記載のエポキシ樹脂組成物を基材に含浸し、半硬化
させてなるプリプレグである。The prepreg of the invention according to claim 2 is a prepreg obtained by impregnating a base material with the epoxy resin composition according to claim 1 and semi-curing it.
【０００６】請求項３に係る発明の絶縁基板は、請求項
２記載のプリプレグを加熱、硬化させてなる絶縁基板で
ある。An insulating substrate according to a third aspect of the invention is an insulating substrate obtained by heating and curing the prepreg according to the second aspect.
【０００７】本発明のエポキシ樹脂組成物において、エ
ポキシ樹脂、硬化剤及び難燃剤の合計量に対する、エポ
キシ樹脂、硬化剤及び難燃剤が有する全アルキル置換基
の含有率が７〜３０重量％であり、全ブロムの含有率が
１８〜２５重量％であることは、このエポキシ樹脂組成
物を用いて得られる絶縁基板を、低誘電率及び低誘電正
接であって、かつ優れた難燃性を具備する絶縁基板とす
る作用がある。In the epoxy resin composition of the present invention, the total content of alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant is 7 to 30% by weight based on the total amount of the epoxy resin, the curing agent and the flame retardant. The fact that the total bromine content is 18 to 25% by weight means that the insulating substrate obtained by using this epoxy resin composition has a low dielectric constant and a low dielectric loss tangent and excellent flame retardancy. It acts as an insulating substrate.
【０００８】[0008]
【発明の実施の形態】本発明のエポキシ樹脂組成物中に
は、アルキル置換基を持つベンゼン環を有し、このアル
キル置換基の分子中での含有率が７〜３０重量％である
ノボラック型エポキシ樹脂を含有する。このアルキル置
換基の存在により、エポキシ樹脂組成物の硬化物の誘電
率が低くなる。なお、本発明のエポキシ樹脂組成物に用
いるエポキシ樹脂としては、上述のノボラック型エポキ
シ樹脂と共に、ビスフェノールＡ型エポキシ樹脂、ブロ
ム化ビスフェノールＡ型エポキシ樹脂、ブロム化ノボラ
ック型エポキシ樹脂等を併用するようにしてもよい。BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin composition of the present invention has a benzene ring having an alkyl substituent, and the content of the alkyl substituent in the molecule is 7 to 30% by weight. Contains an epoxy resin. The presence of this alkyl substituent reduces the dielectric constant of the cured product of the epoxy resin composition. As the epoxy resin used in the epoxy resin composition of the present invention, a bisphenol A type epoxy resin, a brominated bisphenol A type epoxy resin, a brominated novolak type epoxy resin, or the like may be used in combination with the above novolac type epoxy resin. May be.
【０００９】本発明のエポキシ樹脂組成物中には、硬化
剤として、分子中に５〜５０重量％の含有率でアルキル
置換基を有するフェノール系硬化剤を含有している。こ
のアルキル置換基の存在により、エポキシ樹脂組成物の
硬化物の誘電率が低くなる。さらに、本発明のエポキシ
樹脂組成物中には、ブロムを有する難燃剤を含有してい
る。そして、本発明では、エポキシ樹脂、硬化剤及び難
燃剤の合計量に対する、エポキシ樹脂、硬化剤及び難燃
剤が有する全アルキル置換基の含有率が７〜３０重量％
であり、全ブロムの含有率が１８〜２５重量％であるこ
とが重要である。全アルキル置換基の含有率及び全ブロ
ムの含有率が上記の範囲内であることにより、本発明の
エポキシ樹脂組成物を用いて得られる絶縁基板は、低誘
電率及び低誘電正接であって、かつ優れた難燃性を具備
する絶縁基板となる。全アルキル置換基の含有率が７重
量％未満であると、得られる絶縁基板の低誘電率化及び
低誘電正接化が達成できず、３０重量％を超えると得ら
れる絶縁基板の曲げ弾性率等の機械強度が低下するとい
う問題が生じる。また、全ブロムの含有率が１８重量％
未満であると、難燃性が不十分となり、２５重量％を超
えると得られる絶縁基板の耐熱性が不十分となるという
問題が生じる。The epoxy resin composition of the present invention contains, as a curing agent, a phenolic curing agent having an alkyl substituent in the molecule in an amount of 5 to 50% by weight. The presence of this alkyl substituent reduces the dielectric constant of the cured product of the epoxy resin composition. Further, the epoxy resin composition of the present invention contains a flame retardant having bromine. And in this invention, the content rate of all the alkyl substituents which an epoxy resin, a hardening | curing agent, and a flame retardant have with respect to the total amount of an epoxy resin, a hardening | curing agent, and a flame retardant is 7-30 weight%.
It is important that the total bromine content is 18 to 25% by weight. When the content of all alkyl substituents and the content of all bromine are within the above ranges, the insulating substrate obtained by using the epoxy resin composition of the present invention has a low dielectric constant and a low dielectric loss tangent, In addition, the insulating substrate has excellent flame retardancy. When the content of all alkyl substituents is less than 7% by weight, it is not possible to achieve a low dielectric constant and low dielectric loss tangent of the obtained insulating substrate, and when it exceeds 30% by weight, the bending elastic modulus of the obtained insulating substrate, etc. There is a problem that the mechanical strength of the Also, the total bromine content is 18% by weight.
If it is less than 25% by weight, the flame retardancy becomes insufficient, and if it exceeds 25% by weight, the heat resistance of the obtained insulating substrate becomes insufficient.
【００１０】本発明のエポキシ樹脂組成物は、上記のエ
ポキシ樹脂、硬化剤及び難燃剤の他に、必要に応じて、
第３級アミン類、イミダゾール類等の触媒（硬化促進
剤）やプロピレングリコールモノメチルエーテル、ジメ
チルホルムアミド（以下ＤＭＦと記す）等の溶媒等を含
有させることができる。本発明のエポキシ樹脂組成物の
製造方法については、特に限定はなく、例えば上述の原
材料を単に混合しても得ることができる。The epoxy resin composition of the present invention contains, in addition to the above-mentioned epoxy resin, curing agent and flame retardant, if necessary,
A catalyst (curing accelerator) such as tertiary amines and imidazoles, a solvent such as propylene glycol monomethyl ether and dimethylformamide (hereinafter referred to as DMF), and the like can be contained. The method for producing the epoxy resin composition of the present invention is not particularly limited, and can be obtained, for example, by simply mixing the above-mentioned raw materials.
【００１１】本発明のプリプレグは、上記エポキシ樹脂
組成物を基材に含浸し、樹脂を半硬化して得られる。こ
の基材としては、特に限定するものではないが、ガラス
繊維等の無機材料からなる基材が耐熱性の点で優れるた
め好ましい。The prepreg of the present invention is obtained by impregnating a base material with the above epoxy resin composition and semi-curing the resin. The base material is not particularly limited, but a base material made of an inorganic material such as glass fiber is preferable in terms of heat resistance.
【００１２】本発明の絶縁基板は、上記プリプレグを１
枚又は複数枚重ね、必要により、銅箔等の金属箔を外側
に配し、加熱、硬化させて得られる。An insulating substrate according to the present invention comprises the above prepreg 1
It can be obtained by stacking one or a plurality of sheets, and if necessary, disposing a metal foil such as a copper foil on the outside and heating and curing.
【００１３】[0013]
（実施例１）エポキシ樹脂として、アルキル置換基（メ
チル基）を持つベンゼン環を有し、このアルキル置換基
の分子中での含有率が８．７重量％であるクレゾールノ
ボラック型エポキシ樹脂（大日本インキ化学工業（株）
製、商品名ＥＰＩＣＬＯＮＮ−６７３）を５００重量部
（以下単に部と記す）、硬化剤としてアルキル置換基
（エチル基）を持つフェノール系硬化剤（日本石油化学
（株）製、品番ＰＰ−１５００−１８０、アルキル置換
基含有率１０．４重量％）を１１４０部、難燃剤として
アルキル置換基（メチル基）及びブロムを含有する化合
物（帝人化成（株）製、品番ＦＧ−８５００、ブロム含
有率１８重量％、アルキル置換基含有率４．１７重量
％）を７４０部、触媒として２エチル４メチルイミダゾ
ール９．５部、溶媒としてＤＭＦを１２８０部配合・混
合して、エポキシ樹脂組成物を得た。このエポキシ樹脂
組成物における、エポキシ樹脂、硬化剤及び難燃剤の合
計量に対する、エポキシ樹脂、硬化剤及び難燃剤が有す
る全アルキル置換基の含有率は８．１重量％であり、全
ブロムの含有率は１８重量％であった。(Example 1) As an epoxy resin, a cresol novolac type epoxy resin having a benzene ring having an alkyl substituent (methyl group) and the content of the alkyl substituent in the molecule is 8.7% by weight (large Nippon Ink Chemical Co., Ltd.
Manufactured by Nippon Petrochemical Co., Ltd., product number EP-1500-, with 500 parts by weight (trade name: EPICLONN-673) (hereinafter simply referred to as “part”) and an alkyl substituent (ethyl group) as a curing agent. 180, an alkyl substituent content of 10.4% by weight, 1140 parts, a compound containing an alkyl substituent (methyl group) and bromine as a flame retardant (manufactured by Teijin Chemicals Ltd., product number FG-8500, bromine content of 18) 740 parts by weight, the content of alkyl substituents is 4.17% by weight), 9.5 parts of 2 ethyl 4-methylimidazole as a catalyst, and 1280 parts of DMF as a solvent were mixed and mixed to obtain an epoxy resin composition. In this epoxy resin composition, the content of all alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant with respect to the total amount of the epoxy resin, the curing agent and the flame retardant was 8.1% by weight, and the content of all bromine was contained. The rate was 18% by weight.
【００１４】基材として重量が１０４ｇ／ｍ2 のガラス
布（日東紡績（株）製）を用い、この基材に上記エポキ
シ樹脂組成物を含浸し、加熱して、樹脂が半硬化したプ
リプレグを得た。このプリプレグのエポキシ樹脂組成物
の含有率は５２．１重量％であった。A glass cloth having a weight of 104 g / m 2 (manufactured by Nitto Boseki Co., Ltd.) was used as a base material, and the base material was impregnated with the epoxy resin composition and heated to prepare a semi-cured resin prepreg. Obtained. The content of the epoxy resin composition in this prepreg was 52.1% by weight.
【００１５】次に上記プリプレグを５枚重ね、厚みが１
８μｍの銅箔を両外側に配し、温度１７０℃、圧力３０
ｋｇ／ｃｍ2 で９０分、加熱加圧して、樹脂を硬化させ
て絶縁基板を得た。Next, 5 sheets of the above prepreg are piled up to have a thickness of 1
8μm copper foil is placed on both outside, temperature 170 ℃, pressure 30
The resin was cured by heating and pressing at 90 kg / cm 2 for 90 minutes to obtain an insulating substrate.
【００１６】（実施例２）難燃剤として、アルキル置換
基（メチル基）及びブロムを含有する化合物（帝人化成
（株）製、品番ＦＧ−８５００、ブロム含有率１８重量
％、アルキル置換基含有率４．１７重量％）を９３０部
使用した。他の原材料については、実施例１と同じもの
を表１に示す配合割合で配合し、混合してエポキシ樹脂
組成物を得た。このエポキシ樹脂組成物における、エポ
キシ樹脂、硬化剤及び難燃剤の合計量に対する、エポキ
シ樹脂、硬化剤及び難燃剤が有する全アルキル置換基の
含有率は７．８重量％であり、全ブロムの含有率は２１
重量％であった。Example 2 As a flame retardant, a compound containing an alkyl substituent (methyl group) and bromine (manufactured by Teijin Kasei Co., Ltd., product number FG-8500, bromine content 18% by weight, alkyl substituent content) 4.17% by weight) was used. As to other raw materials, the same materials as in Example 1 were blended at the blending ratio shown in Table 1 and mixed to obtain an epoxy resin composition. In this epoxy resin composition, the content of all the alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant with respect to the total amount of the epoxy resin, the curing agent and the flame retardant is 7.8% by weight, and the content of all the bromine is contained. The rate is 21
% By weight.
【００１７】次いで、実施例１と同様の基材を用い、エ
ポキシ樹脂組成物の含有率が５１．８重量％のプリプレ
グを得た。次に、実施例１と同様にして絶縁基板を得
た。Then, using the same substrate as in Example 1, a prepreg having an epoxy resin composition content of 51.8% by weight was obtained. Next, an insulating substrate was obtained in the same manner as in Example 1.
【００１８】（実施例３）難燃剤として、アルキル置換
基（メチル基）及びブロムを含有する化合物（帝人化成
（株）製、品番ＦＧ−８５００、ブロム含有率１８重量
％、アルキル置換基含有率４．１７重量％）を１２４０
部使用した。他の原材料については、実施例１と同じも
のを表１に示す配合割合で配合し、混合してエポキシ樹
脂組成物を得た。このエポキシ樹脂組成物における、エ
ポキシ樹脂、硬化剤及び難燃剤の合計量に対する、エポ
キシ樹脂、硬化剤及び難燃剤が有する全アルキル置換基
の含有率は７．４重量％であり、全ブロムの含有率は２
５重量％であった。Example 3 As a flame retardant, a compound containing an alkyl substituent (methyl group) and bromine (manufactured by Teijin Kasei Co., Ltd., product number FG-8500, bromine content 18% by weight, alkyl substituent content) 4.17 wt%) 1240
Part used. As to other raw materials, the same materials as in Example 1 were blended at the blending ratio shown in Table 1 and mixed to obtain an epoxy resin composition. In this epoxy resin composition, the content ratio of all the alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant to the total amount of the epoxy resin, the curing agent and the flame retardant was 7.4% by weight, and the content of all the bromine was contained. Rate is 2
It was 5% by weight.
【００１９】次いで、実施例１と同様の基材を用い、エ
ポキシ樹脂組成物の含有率が５２．４重量％のプリプレ
グを得た。次に、実施例１と同様にして絶縁基板を得
た。Then, using the same substrate as in Example 1, a prepreg having an epoxy resin composition content of 52.4% by weight was obtained. Next, an insulating substrate was obtained in the same manner as in Example 1.
【００２０】（比較例１）エポキシ樹脂として、アルキ
ル置換基を分子内に含有しないノボラック型エポキシ樹
脂（大日本インキ化学工業（株）製、商品名ＥＰＩＣＬ
ＯＮ Ｎ−８６５）を５００部使用した。他の原材料に
ついては、実施例１と同じものを表１に示す配合割合で
配合し、混合してエポキシ樹脂組成物を得た。このエポ
キシ樹脂組成物における、エポキシ樹脂、硬化剤及び難
燃剤の合計量に対する、エポキシ樹脂、硬化剤及び難燃
剤が有する全アルキル置換基の含有率は６．３重量％で
あり、全ブロムの含有率は１８重量％であった。(Comparative Example 1) As a epoxy resin, a novolac type epoxy resin containing no alkyl substituent in the molecule (manufactured by Dainippon Ink and Chemicals, Inc., trade name EPICL)
ON N-865) was used at 500 parts. As to other raw materials, the same materials as in Example 1 were blended at the blending ratio shown in Table 1 and mixed to obtain an epoxy resin composition. In this epoxy resin composition, the content of all the alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant was 6.3% by weight, and the content of all the bromine was based on the total amount of the epoxy resin, the curing agent and the flame retardant. The rate was 18% by weight.
【００２１】次いで、実施例１と同様の基材を用い、エ
ポキシ樹脂組成物の含有率が５１．９重量％のプリプレ
グを得た。次に、実施例１と同様にして絶縁基板を得
た。Then, using the same substrate as in Example 1, a prepreg having an epoxy resin composition content of 51.9% by weight was obtained. Next, an insulating substrate was obtained in the same manner as in Example 1.
【００２２】（比較例２）難燃剤として、アルキル置換
基（メチル基）及びブロムを含有する化合物（帝人化成
（株）製、品番ＦＧ−８５００、ブロム含有率１８重量
％、アルキル置換基含有率４．１７重量％）を４３０部
使用した。他の原材料については、実施例１と同じもの
を表１に示す配合割合で配合し、混合してエポキシ樹脂
組成物を得た。このエポキシ樹脂組成物における、エポ
キシ樹脂、硬化剤及び難燃剤の合計量に対する、エポキ
シ樹脂、硬化剤及び難燃剤が有する全アルキル置換基の
含有率は８．７重量％であり、全ブロムの含有率は１２
重量％であった。Comparative Example 2 As a flame retardant, a compound containing an alkyl substituent (methyl group) and bromine (manufactured by Teijin Kasei Co., Ltd., product number FG-8500, bromine content 18% by weight, alkyl substituent content) 4.17% by weight) was used. As to other raw materials, the same materials as in Example 1 were blended at the blending ratio shown in Table 1 and mixed to obtain an epoxy resin composition. In this epoxy resin composition, the content of all alkyl substituents contained in the epoxy resin, the curing agent and the flame retardant relative to the total amount of the epoxy resin, the curing agent and the flame retardant was 8.7% by weight, and the total content of bromine was contained. Rate is 12
% By weight.
【００２３】次いで、実施例１と同様の基材を用い、エ
ポキシ樹脂組成物の含有率が５２．２重量％のプリプレ
グを得た。次に、実施例１と同様にして絶縁基板を得
た。Then, using the same substrate as in Example 1, a prepreg having an epoxy resin composition content of 52.2% by weight was obtained. Next, an insulating substrate was obtained in the same manner as in Example 1.
【００２４】実施例１〜３及び比較例１、２で得られた
絶縁基板の難燃性、誘電率及び誘電正接を評価し、その
結果を表１に示した。なお、試験方法は難燃性について
はＵＬ規格、誘電率及び誘電正接についてはＪＩＳ−Ｃ
６４８１に基づいて行った。表１の結果から明らかなよ
うに、実施例１〜３の絶縁基板の難燃性は９４Ｖ−０で
あり、誘電率は４．２以下であり、誘電正接は０．０１
０以下であり何れも優れた性能であった。The flame retardancy, dielectric constant and dielectric loss tangent of the insulating substrates obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were evaluated, and the results are shown in Table 1. The test method is UL standard for flame retardancy and JIS-C for dielectric constant and dielectric loss tangent.
6481. As is clear from the results of Table 1, the insulating substrates of Examples 1 to 3 have a flame retardancy of 94 V-0, a dielectric constant of 4.2 or less, and a dielectric loss tangent of 0.01.
It was 0 or less, and all had excellent performance.
【００２５】[0025]
【表１】 [Table 1]
【００２６】[0026]
【発明の効果】本発明のエポキシ樹脂組成物を用いる
と、低誘電率及び低誘電正接であって、かつ難燃性の優
れる絶縁基板を得ることができる。また、本発明のプリ
プレグを用いると低誘電率及び低誘電正接であって、か
つ難燃性の優れる絶縁基板を得ることができる。また、
本発明の絶縁基板は、低誘電率及び低誘電正接であっ
て、かつ難燃性が優れるので、電話交換機用プリント配
線板等の材料として有用である。By using the epoxy resin composition of the present invention, an insulating substrate having a low dielectric constant and a low dielectric loss tangent and excellent flame retardancy can be obtained. Further, by using the prepreg of the present invention, an insulating substrate having a low dielectric constant and a low dielectric loss tangent and excellent flame retardancy can be obtained. Also,
INDUSTRIAL APPLICABILITY The insulating substrate of the present invention has a low dielectric constant and a low dielectric loss tangent and is excellent in flame retardancy, and thus is useful as a material for a printed wiring board for a telephone exchange.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 石田 武広 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takehiro Ishida 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd.
Claims (3)
し、このアルキル置換基の分子中での含有率が７〜３０
重量％であるノボラック型エポキシ樹脂と、分子中に５
〜５０重量％の含有率でアルキル置換基を有するフェノ
ール系硬化剤と、ブロムを有する難燃剤を含んでなるエ
ポキシ樹脂組成物であって、エポキシ樹脂、硬化剤及び
難燃剤の合計量に対する、エポキシ樹脂、硬化剤及び難
燃剤が有する全アルキル置換基の含有率が７〜３０重量
％であり、全ブロムの含有率が１８〜２５重量％である
エポキシ樹脂組成物。1. A benzene ring having an alkyl substituent, the content of the alkyl substituent in the molecule is 7 to 30.
5% by weight of novolac type epoxy resin and 5 in the molecule
An epoxy resin composition comprising a phenolic curing agent having an alkyl substituent at a content of ˜50 wt% and a flame retardant having bromine, the epoxy being based on the total amount of the epoxy resin, the curing agent and the flame retardant. An epoxy resin composition in which the content of total alkyl substituents contained in the resin, the curing agent, and the flame retardant is 7 to 30% by weight, and the content of total bromine is 18 to 25% by weight.
材に含浸し、半硬化させてなるプリプレグ。2. A prepreg obtained by impregnating a base material with the epoxy resin composition according to claim 1 and semi-curing the base material.
させてなる絶縁基板。3. An insulating substrate obtained by heating and curing the prepreg according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9845496A JPH09286843A (en) | 1996-04-19 | 1996-04-19 | Epoxy resin composition, prepreg and insulating base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9845496A JPH09286843A (en) | 1996-04-19 | 1996-04-19 | Epoxy resin composition, prepreg and insulating base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09286843A true JPH09286843A (en) | 1997-11-04 |
Family
ID=14220166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9845496A Pending JPH09286843A (en) | 1996-04-19 | 1996-04-19 | Epoxy resin composition, prepreg and insulating base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09286843A (en) |
-
1996
- 1996-04-19 JP JP9845496A patent/JPH09286843A/en active Pending
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