JPH09284656A - Solid-state image pickup unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid state image pickup unit whereby a row or a column adding a faulty pixel is skipped so as to obtain an image with high quality, the admission number of the faulty pixels in the solid-state image pickup unit is increased so as to improve a production stop and low cost conversion is attained. SOLUTION: The solid-state image pickup unit is provided with the solid-state image pickup element 4 capable of selectively reading a pixel signal from a plurality of pixels arranged in a matrix-shape by a longitudinal signal line and a horizontal signal line and a position where the faulty pixel without having a normal function within a plurality of pixels exists is detected by a faulty pixel detecting part 6 and a correction judging part 8. Then, the reading of the pixel signal adding the faulty pixel which is detected by the faulty pixel detecting part 6 from the longitudinal signal line and the horizontal signal line is prohibited by the correction judging part 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device having a function of detecting a defective pixel generated on a solid-state image pickup element and correcting the defective pixel.

[0002]

2. Description of the Related Art Conventionally, in a solid-state image pickup device, the following interpolation method has been mainly used as a method for correcting a defective pixel having no normal function on the solid-state image pickup device. For example, if the output of the defective pixel is the output one pixel before or 1
As a method of replacing with the output after the pixel, Japanese Patent Publication No. 4-73
The following is disclosed in Japanese Patent No. 675. A block configuration diagram of this device and a pixel output waveform diagram are shown in FIGS. 11 and 12, respectively. In the output waveform diagram shown in FIG. 12, the horizontal axis represents the horizontal position on the solid-state image sensor (screen), and the vertical axis represents the signal level.

In FIG. 11, each pixel signal from the solid-state image sensor 101 is sequentially read by the scanning drive circuit 102. A defect signal is extracted from the pixel signals, and the position of the defective pixel that generates this defect signal is stored in the defect position storage circuit 103. This defective pixel storage circuit 1
03 indicates that the signal from the defective pixel is the first S / H circuit 10
This S / H pulse is masked when passing 4
Replace with the data before the pixel.

However, as shown in FIG. 13A, when the defective pixel Xn indicated by A is present at the switching point between the white subject and the shaded black subject in the screen, the above-mentioned replacement method causes the defective pixel Xn. A white output is generated in the one pixel portion of the boundary where Xn is located. It is assumed that there is the defective pixel Xn indicated by A in the nth row (n is a positive integer) on the screen, and an enlarged view of the state is shown in FIG. At this time,
Output waveform diagrams of the pixels on the (n-1) th row to the (n + 1) th row are as shown in FIGS. 12 (a) to 12 (c). In addition,
"0" represents a black level and "1" represents a white level.

Here, from the data shown in FIGS. 12D to 12F passing through the 1-pixel delay circuit (DL) 106, shown in FIGS. 12A to 12C not passing through the 1-pixel delay circuit 106. Subtract each of the data. Further, as a result, regarding the pixel Xn which is replaced by the data of the previous pixel and becomes unnatural, the output of the subtractor 107 shown in FIG. 12G is passed only when the output of the corresponding pixel Xn is passed by the switch 108. Further, the final subtractor 109 subtracts the output of the subtractor 107 shown in FIG. 12 (g) from the output of the one-pixel delay circuit 106 shown in FIG. 12 (e) to obtain the waveform shown in FIG. 12 (h). To get

Regarding the other pixel signal outputs, the switch 108 subtracts the subtractor 10 so that the output of the final subtractor 109 in the subsequent stage becomes equal to the output of the 1-pixel delay circuit 106.
The output signal of 7 is turned on and off.

By the above operation, only the signal output of the defective pixel Xn on the n-th row is replaced with the data Yn one pixel later, and the waveforms on the (n-1) th column to the (n + 1) th column are shown in FIG. It is composed of the outputs shown in (d), (h), and (f). As a result, as shown in FIG. 13B, the defective pixel Xn becomes difficult to output the white level.

As a method of averaging the output levels of several pixels around the defective pixel and replacing the average output level with the output of the defective pixel, Japanese Examined Patent Publication No. 63-23257.
The following is disclosed in Japanese Patent No. 9: FIG. 14 is a block diagram showing the configuration of this device.

The output signal of each pixel on the solid-state image pickup device 200 is sequentially read by the scanning drive circuit 201 and converted into a digital signal by an analog / digital (A / D) converter 202. The frame memory 203 is
Whole screen for the solid-state image sensor 200 (entire image sensor)
The image sensor output when uniform incident light over
It is a memory for accumulating as an offset signal. Then, in this solid-state image pickup device, the arithmetic operation unit 204 subtracts the offset signal stored in the frame memory 203 from the output signal of the image pickup device at the time of normal exposure to obtain a corrected output.

A level detector 205 is connected to the frame memory 203, and the level detector 205 is connected to the frame detector 203.
Thus, an output having an offset signal exceeding a certain threshold is identified as an output of a defective pixel. Here, among the outputs from the pixels, the signals that do not exceed the threshold value are output as they are.
On the other hand, the output from the pixel identified as the defective pixel is X
22 is an average value of output signals of eight neighboring pixels centered on the output X22 of the defective pixel from a part of the shift registers SR1, SR2 and SR3 having a delay time corresponding to the scanning line of the pixel { (X11 + X12 + X13
+ X21 + X23 + X31 + X32 + X33) / 8}.

The position of the defective pixel determined by the level detector 205 sends a defect recognition flag to the spatial operation circuit 207 at the timing when the defective pixel arrives, and the spatial operation circuit 207 receives the defect recognition flag. Only at this time, a predetermined average value calculation is performed to correct the defective pixel, and the defective pixel is replaced and output.

However, the shift register SRn represents a shift register capable of delaying the input signal by n rows, and the pixel output Xnm is the nth row and the mth column (n, m) on the image sensor.
Represents a pixel output of a positive integer).

[0013]

As described above, by replacing the defective pixel with the pixel output one pixel before,
In the case of correcting the output of the defective pixel, it is not possible to perform an appropriate correction when the defective pixel is continuous or occurs every other pixel. For example, when a defective pixel is generated continuously for two pixels, a signal output for three consecutive pixels is displayed at that portion. This is extremely annoying because the resolution is remarkably deteriorated locally when it is necessary to display a high-definition image. This correction is
Even if the two pixels before and after are replaced, there is a limit to the replacement, and it is obvious that it is not possible to deal with defective pixels that are continuous.

The same applies to the case where several pixels around the defective pixel are sampled and replaced by the average level, and the number of samples can be increased for defective pixels that are continuous or concentrated in several pixels. As described above, the possibility of continuous replacement with pixel signals of different levels that are distant as described above is reduced, but the larger the area, the greater the number of defective pixels in that area. It doesn't always happen.

Further, in order to obtain a high-definition image, a solid-state image pickup device having a large number of pixels is required, the number of defective pixels increases in proportion thereto, and the occurrence rate of continuous defective pixels also increases. This significantly lowers the yield of high-definition multi-pixel solid-state image pickup devices and raises the price of the entire image pickup apparatus.

Therefore, the present invention has been made in view of the above problems, and detects a defective pixel which does not have a normal function on a solid-state image pickup device and skips a row or a column including the defective pixel. An object of the present invention is to provide a solid-state imaging device capable of obtaining a high-quality image, improving the manufacturing yield thereof by increasing the allowable number of defective pixels in the solid-state imaging device, and reducing the cost. And

[0017]

In order to achieve the above object, a solid-state image pickup device of the present invention has a plurality of pixels arranged in a matrix, and the plurality of pixels are formed by vertical signal lines and horizontal signal lines. An image sensor capable of selectively reading out pixel signals from the pixel, defective pixel position detecting means for detecting a position where a defective pixel having no normal function exists among the plurality of pixels, and defective pixel position detecting means Read control means for prohibiting reading of pixel signals from the vertical signal line and the horizontal signal line including the defective pixel detected by the above method.

Further, in the solid-state image pickup device of the present invention, the image pickup device has a preliminary light-receiving pixel around a predetermined effective light-receiving pixel, and the read control means allows a specific vertical signal line of the effective light-receiving pixel. And when the reading of the pixel signal from the horizontal signal line is prohibited, a plurality of pixels of the preliminary light receiving pixels are newly supplemented to the predetermined effective light receiving pixel as effective light receiving pixels.

Further, in the solid-state image pickup device of the present invention, when the position of the defective pixel detected by the defective pixel position detecting means is within a predetermined area with the substantially central portion of the image pickup element as a reference, the reading is performed. It is characterized in that reading of pixel signals from the vertical signal line and the horizontal signal line including the defective pixel by the control means is prohibited.

That is, the solid-state image pickup device of the present invention has an image pickup device capable of selectively reading pixel signals from a plurality of pixels arranged in a matrix by vertical signal lines and horizontal signal lines. The position where the defective pixel having no normal function exists is detected by the defective pixel position detecting means from the plurality of pixels. Then, the reading control means prohibits the reading of the pixel signal from the vertical signal line and the horizontal signal line including the defective pixel detected by the defective pixel position detection means.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of the solid-state imaging device according to the first embodiment of the present invention.

In FIG. 1, the output signal from the solid-state image pickup device 4 read by the scan drive circuit 2 is output to the defective pixel detection unit 6. The defective pixel detection unit 6 detects a defective pixel from the output signal and sends the detection result to the correction determination unit 8. The correction determination unit 8 detects the position of the defective pixel from the received detection result of the defective pixel, and sends the detected position to the scan drive circuit 2. The scan driving circuit 2 receives the position of the defective pixel and controls the pixel reading so as not to correct the corresponding defective pixel, that is, not to read the row or the column in which the corresponding defective pixel exists.

The defective pixel detection unit 6 fetches the element (pixel) output when, for example, uniform exposure and light-shielding imaging are performed, into the memory in the defective pixel detection unit 6, and the output level at this time is an abnormal output level. In other words, when the average output level of the entire screen does not fall within the appropriately set range, this is regarded as a defective pixel. Further, as will be described later, the correction determination unit 8 determines whether to perform the correction of the defective pixel, that is, whether to skip the row or the column in which the defective pixel exists, and scans the determination result. It is sent to the drive circuit 2.

Next, using the algorithm shown in FIG.
The operation of the solid-state imaging device will be described. The correction determination unit 8 monitors the read control pulse for reading the pixel emitted from the scan drive circuit 2 and the timing of the output of the defective pixel detection unit 6 to detect the row on the solid-state imaging device in which the defective pixel exists. Recognize columns. In addition, the correction determination unit 8
Uses the independent reading function of rows and columns on the solid-state imaging device to search for rows and columns in which the abnormal output level is masked. Then, the position of the defective pixel is specified from the obtained row and column (step S1). After that, the scan drive circuit 2
Thus, a pulse for masking this reading is sent to the scanning drive circuit 2 at the timing of reading the row or column in which the defective pixel exists (step S2).

Next, the skipping operation of the defective pixel by the scanning drive circuit 2 is performed by the CMD (C (C
The following description will be made by taking the case of using the harge Modulation Device as an example.

FIG. 3 is a diagram showing a simple structure of a MOS type solid-state image pickup device in which all pixels are composed of pixels of a rows × b columns.
The solid-state imaging device includes a vertical scanning control unit 10 that collectively controls reading for each row, and a horizontal scanning control unit 12 that collectively controls reading for each column.
A pixel signal is output by transmitting a drive pulse from the horizontal scanning control unit 12 to each row and each column.

Further, FIGS. 4 and 5 are timing charts showing the drive pulse necessary for outputting the pixel signal when time is taken on the horizontal axis. The readout of the pixels on the solid-state image sensor is controlled by the following procedure.

In the vertical scanning controller 10, φSTV is given to start reading. As a result, the reading of the first row is started, and at the same time, the read control potential pulse φGn (n = 1, 2, ...) Is simultaneously applied to each row. There are four types of potentials of the read control potential pulse .phi.Gn. The potential is accumulated in the period of V1 [V], the read state is reached at V2 [V], and all the accumulated charge is released at V3 [V] after the completion of the read. V4 [V]
Is a potential for discharging the excess charge, and the charge accumulation by V1 [V] and the discharge of the excess charge by V4 [V] are repeated until the read potential V2 [V] again.

On the other hand, also in the horizontal scanning controller 12, similarly, a read start pulse φSTH synchronized with φSTV is given to start the reading of the first column. φ STH repeats the operation of generating a pulse for each horizontal read cycle so that the read column is returned to the first row. The output of the n-th column is read by sequentially controlling the switches of each column by φPm (m = 1, 2, ...) And the charges are sent to the output amplifier to output the charges shown in FIG.
(G), the signal output Sig.out shown in FIG. 5 (f) is obtained.

Scanning for actually skipping the defective pixel A in the nth row and the mth column (n and m are positive integers) shown in FIG. 3 will be described below. First, the scanning pulse used for correction by skipping the line reading will be described. In φGn for controlling the reading of the n-th row, if the n-th row is read, the reading potential as shown by the dotted line in FIG. V2
[V] and the total accumulated charge emission potential V3 [V] are given.

However, in order to skip the reading of the nth row, the potential shown by the dotted line in FIG.
The surplus charge emission potential V4 [V] as shown by the solid line in (d)
And the charge storage potential V1 [V] are repeatedly applied. This makes it possible to skip the reading of the pixels in the nth row on the solid-state image sensor and mask the pixels in the nth row.

Since the signal output of the (n + 1) th row is read at the timing when the nth row is originally read,
The read potential of φGn + 1 as shown in FIG. 4E is applied earlier by one horizontal scanning period. Similarly, the read timing of the (n + 1) th row and subsequent rows is sequentially shifted one horizontal scanning period earlier. The above scanning is repeated every frame or every field to always skip the nth row.

Next, the scanning pulse when the correction is performed by skipping the column reading will be described with reference to FIG.
In φPm for controlling the reading of the m-th column, if the m-th column is to be read, during the 1-pixel scanning period (1P) at this timing, the reading as shown by the dotted line in FIG. A control pulse is given. Therefore, FIG.
By not applying the potential shown by the dotted line in (d),
The reading of the m-th column is skipped, and the pixels of the m-th column are masked.

Then, in order to read the signal output of the (m + 1) th column at the timing when the m-th column is originally read, a read potential of φPm + 1 as shown in FIG. . Similarly, the read timing of the (m + 1) th and subsequent columns is sequentially shifted earlier by one pixel scanning period. The above scanning is repeated every horizontal scanning period to always skip the m-th column.

As described above, according to the first embodiment, it is possible to read out an arbitrary arbitrary row or column on the solid-state image pickup element, so that a row or a row in which defective pixels continuously exist. By skipping the columns, it is possible to prevent the local deterioration in resolution that occurs due to replacement of consecutive defective pixels. Further, by allowing continuous pixel defects on the solid-state image sensor, the manufacturing yield of the multi-pixel solid-state image sensor can be improved and the price of the solid-state image sensor can be reduced.

Next, the solid-state image pickup device according to the second embodiment will be described. In the second embodiment, the solid-state imaging device 4 is provided with preliminary light-receiving pixels, and other configurations are the same as those in the first embodiment shown in FIG. The description will be omitted.

FIG. 6 is a simplified diagram of a pixel array form of a solid-state image pickup device provided with preliminary light receiving pixels. This solid-state imaging device 4
In addition to (a rows × b columns) (a and b are positive integers) effective light-receiving pixels, in the vertical and horizontal directions, respectively, c rows and d columns (c,
(d is a positive integer) has pixels capable of receiving pre-light, and it is possible to independently read out pixels in arbitrary rows and columns. Further, the solid-state imaging device 4 includes an optical black (hereinafter referred to as OB) portion for each horizontal row with respect to the preliminary light receiving pixel row. However, the OB portion does not need to be prepared for each row in the horizontal direction in particular, and may be arranged so that the processing using the OB portion can be performed on the preliminary light receiving pixels in the same manner as a normal effective light receiving pixel.

In this solid-state image pickup device, in the first embodiment, the rows or columns prepared as preliminary light-receiving pixels are handled as effective light-receiving pixels by the number of rows or columns for which reading has been skipped. To do so.

For example, when reading is skipped in x rows and y columns (x and y are positive integers) in the vertical and horizontal directions, from the side adjacent to the effective light receiving pixels in the preliminary light receiving pixel row or column,
The readout is changed so that x lines (rows) and y lines (columns) are treated as effective light receiving pixel rows or columns. Below, the first
By the operation exactly the same as that of the above embodiment, the skip reading is executed.

In the first embodiment, if the number of rows or columns to be skipped is increased according to the occurrence state of defective pixels, the read cycle is shortened by the number of rows or columns skipped, and the load on the timing generator is increased. At the same time, the number of resolutions decreases due to the lack of images. Therefore, by reducing the number of effective light-receiving pixels in the pre-light-receiving pixel column or row that is already held, the load on the timing generator caused by skipping is reduced, and the number of resolutions is also reduced due to image loss. Can be prevented.

Next, a solid-state image pickup device according to the third embodiment will be described. The third embodiment is a modification of the algorithm shown in FIG. 2 of the first embodiment,
That is, a flow for determining whether or not to skip pixel reading is added. For other configurations,
Since it is similar to the first embodiment shown in FIG. 1,
The description will be omitted here.

In the solid-state image pickup device in which the effective light receiving pixels are constructed by a rows × b columns (a and b are positive integers), the case where the pixel at the nth row and the mth column is determined to be defective will be described. When the defective pixel exists in the region β shown in FIG. 7, that is, when it falls within the range of the e-row and the f-column from the screen edge, the correction determination unit 8 affects the appearance on the screen display. It is determined that there is no defective pixel, and correction by skipping is not instructed, that is, a mask pulse for stopping the reading of the row or the column in which the defective pixel exists is not generated. Here, it is assumed that the e-th row and the f-th column are values that can cover the peripheral portion that does not affect the appearance on the screen display.

When the defective pixel is located in the central portion of the screen within the area α shown in FIG. 7, the correction determination unit 8 determines that it is a defective pixel that affects the appearance on the screen display.
A mask pulse for stopping the reading of the row or the column in which the defective pixel exists is generated and sent to the scan drive circuit 2. After that, the flow up to the skip processing is the first
This is the same as the embodiment.

Although the example in which the defective pixel at the edge of the screen is not corrected has been described here, the invention can be similarly applied to the specification that the defective pixel outside the region of interest is not corrected. As described above, according to the third embodiment,
Only the defective pixels near the center of the screen of the solid-state image sensor are corrected, and the defective pixels that occur at the edge of the screen are less likely to cause annoying eyes. The time can be shortened.

Next, a solid-state image pickup device according to the fourth embodiment will be described. The fourth embodiment is a modification of the algorithm shown in FIG. 2 of the first embodiment,
That is, a flow for determining whether or not to skip pixel reading is added. For other configurations,
Since it is similar to the first embodiment shown in FIG. 1,
The description will be omitted here.

FIG. 8 is a diagram for explaining an algorithm in the solid-state image pickup device of the fourth embodiment. The operation of the solid-state imaging device will be described with reference to FIG. In this solid-state imaging device, the position of the pixel detected as a defect by the defective pixel detection unit 6 on the solid-state imaging device 4 is stored in association with, for example, an address map of a CPU (not shown). Then, every time a defective pixel is detected (step S10), the correction determination unit 8 determines whether or not the correction is performed, that is, a pixel existing within z rows × w columns around this defective pixel is a defective pixel. It is determined whether or not (steps S11 and S13). That is, it is checked pixel by pixel whether or not the pixel adjacent to the defective pixel is defective, and this is repeated z times in the row direction and w times in the column direction to determine the surrounding z rows × w.
Confirm the pixel defect status of the column (steps S11, S1)
3).

If a defective pixel is confirmed in this process,
The correction determination unit 8 generates a mask pulse for skipping the row or column in which the corresponding pixel exists (step S12,
S14), and sends this to the scan drive circuit 2. After that, the flow up to the skip processing is the same as in the first embodiment.

As described above, according to the fourth embodiment, the surroundings of the pixel determined to be defective are z rows × w columns (z,
w is a positive integer) determines whether or not another defective pixel exists in a predetermined range, and when there is no defective pixel, correction by skipping is not performed, that is, in a discrete pixel unit. For a defective pixel that has occurred, correction is not performed by skipping the row or column in which the defective pixel exists, so that it is possible to suppress the occurrence of a local abnormal image due to a missing image due to excessive skipping. .

Next, a solid-state image pickup device according to the fifth embodiment will be described. This fifth embodiment is a modification of the algorithm shown in FIG. 2 of the first embodiment,
That is, a flow for determining whether or not to skip pixel reading is added. In the above determination flow, it is confirmed whether or not the correction by skipping is continuous in the vertical (row) or horizontal (column) direction, or extremely close to each other, and it is determined whether or not to skip the reading. The other structure is the same as that of the first embodiment shown in FIG. 1, and therefore the description is omitted here.

FIG. 9 is a diagram for explaining an algorithm in the solid-state image pickup device of the fifth embodiment. The operation of the solid-state imaging device will be described with reference to FIG.
In this solid-state imaging device, on the solid-state imaging device 4, it is assumed that the row or column in which a pixel detected as a defect by the defective pixel detection unit 6 exists is skipped (skipping row or column). CPU not shown
It is stored in association with the address map of (step S20). The correction determination unit 8 determines whether the row or column before or after the row or column where the defective pixel exists is skipped for each row or column where the defective pixel exists in the address map that stores the position of the skipped row or column. It is confirmed whether or not it has been done (steps S21 and S23). Here, if it is recognized that the reading has not been skipped, a mask pulse for skipping the row or column in which the defective pixel exists is generated (steps S22 and S24).

If it is determined in steps S21 and S23 that the row or column before or after the row or column in which the defective pixel exists is skipped, the skipping of the row or column in which the defective pixel exists is stopped. Yes (step S2
5). Further, when the skip of the row or column in which the defective pixel exists is stopped, this result is fed back to the address map storing the position of the skipped row or column to update the data. After that, the flow up to the skip processing is the same as in the first embodiment.

As described above, according to the fifth embodiment, when the image signal of the row or the column near the row or the column in which the defective pixel is present is already skipped, By not performing the correction by skipping the reading, it is possible to suppress the occurrence of a local abnormal image due to the dropout of the image due to the skipped reading.

Next, a solid-state image pickup device according to the sixth embodiment will be described. The sixth embodiment is different from the algorithm shown in FIG. 2 of the first embodiment in that defective pixels are skipped in the vertical (row) direction including the defective pixels or in the horizontal (column) direction. A flow is added to determine whether to skip the reading. That is, in this embodiment, attention is paid to any defective pixel, and when another defective pixel exists in the same row or column as this defective pixel, the other defective pixel includes the defective pixel in the horizontal (row) direction. More or vertical (columns)
Judge whether there are many directions and skip rows or columns that have many directions.

FIG. 10 is a diagram for explaining an algorithm in the solid-state image pickup device of the sixth embodiment. The operation of the solid-state imaging device will be described with reference to FIG.

As in the fourth embodiment, the position of the defective pixel is address-mapped (step S30), and the number of defective pixels is counted row by row and column by row based on this data. L. stores the number of defective pixels for each row and column for existing rows or columns. U. T. (Look Up Tabl
e) is created (step S31).

In this solid-state image pickup device, the number of defective pixels existing in each row or column in which any detected defective pixel is present is determined by the defective pixel number L. U. T. It is assumed that u defective pixels are confirmed in the row direction and v defective pixels are confirmed in the column direction.

Subsequently, the correction determination unit 8 determines whether u <v holds (step S32). Where u <v
If so, it is considered that there are more defective pixels in the column direction than in the row direction, and a mask pulse for skipping the column direction is generated (step S34). On the other hand, when u <v is not satisfied, a mask pulse for skipping in the row direction is generated assuming that there are more defective pixels in the row direction than in the column direction (step S3).
3).

In the sixth embodiment, the above L.
U. T. Based on the information from, the defective pixel on the row or column where the defective pixel is most present is skipped preferentially, and the defective pixel on the corrected row or column is not considered as a defect, Only the above determination flow is repeated. As a result, if the defective pixels are sequentially reduced, more efficient correction can be performed. The flow up to the skip processing is the same as in the first embodiment.

As described above, according to the sixth embodiment, paying attention to an arbitrary defective pixel, the number of other defective pixels is large in the horizontal (row) direction including the defective pixel or vertical (column). The number of rows or columns for which reading is skipped is reduced by determining whether there are many readings in the direction and skipping the rows or columns in the many directions. As a result, it is possible to suppress the omission of an image due to skipped reading and perform more efficient defect correction.

In the third to sixth embodiments, each effect can be arbitrarily combined to obtain each effect at the same time. According to the above embodiment of the present invention, the following configurations can be obtained. (1) An image sensor having a plurality of pixels arranged in a matrix, a reading means for independently reading out rows or columns on the image sensor, and a defective pixel position deriving means for detecting or storing the position of a defective pixel, A solid-state imaging device comprising: a read control unit that controls reading of a pixel signal from a row or a column including the defective pixel derived by the defective pixel position deriving unit. (2) In the above-mentioned image sensor, the number of light receiving regions necessary for displaying an image is a pixel in the row direction and b pixels (a,
b is a positive integer), and in addition to this, auxiliary light-receiving pixels of row c and row d (where c and d are positive integers) are provided in the row and column directions, respectively. The solid-state imaging device according to 1). (3) The read control means, when the position of the defective pixel derived by the defective pixel position deriving means is substantially in the center of the image sensor, the image captured by the image sensor affects appearance. The solid-state imaging device according to (1), wherein reading is not performed on a row or a column in which the defective pixel exists. (4) The read control means, if a defective pixel is present in succession to the detected defective pixel or at a position in a predetermined vicinity of the defective pixel, a line in which the detected defective pixel exists or The solid-state imaging device according to (1), wherein the pixel signals of the columns are skipped. (5) In the case where the read control unit has already skipped the row or column in which the defective pixel exists, or for the row or column in the vicinity of a predetermined position from the defective pixel. The solid-state imaging device according to (1), characterized in that reading is not skipped for a row or a column in which the defective pixel exists. (6) The read control means recognizes the number of defective pixels existing in the same row or column as the defective pixel of interest, and when the recognized number of defective pixels is large in the row direction, in the row direction or in the column. The solid-state imaging device according to (1) is characterized in that the pixel signals are not read out in the column direction when there are many in the direction.

[0061]

As described above, according to the present invention, by detecting a defective pixel which does not have a normal function on the solid-state image pickup device and skipping a row or a column including the defective pixel, a high quality image is obtained. It is possible to provide a solid-state image pickup device capable of obtaining an image, improving the manufacturing yield thereof by increasing the allowable number of defective pixels in the solid-state image pickup device, and reducing the cost.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a solid-state imaging device.

FIG. 2 is a diagram for explaining the operation of the solid-state imaging device according to the first embodiment.

FIG. 3 is a diagram showing a simple structure of a MOS type solid-state imaging device in which all pixels are composed of pixels of a row × b column.

FIG. 4 is a timing chart showing drive pulses for outputting pixel signals.

FIG. 5 is a timing chart showing drive pulses for outputting pixel signals.

FIG. 6 is a simplified diagram of a pixel array form of a solid-state imaging device provided with preliminary light receiving pixels.

FIG. 7 is a simplified diagram of a pixel array form for explaining the operation of the solid-state imaging device according to the third embodiment.

FIG. 8 is a diagram for explaining the operation of the solid-state imaging device according to the fourth embodiment.

FIG. 9 is a diagram for explaining the operation of the solid-state imaging device according to the fifth embodiment.

FIG. 10 is a diagram for explaining the operation of the solid-state imaging device according to the sixth embodiment.

FIG. 11 is a block diagram showing a configuration of a conventional device.

FIG. 12 is an output waveform diagram of a pixel in the device shown in FIG.

FIG. 13 is a diagram showing defective pixels and a screen display state.

FIG. 14 is a block diagram showing the configuration of a conventional device.

[Explanation of symbols]

 2 Scanning drive circuit 4 Solid-state imaging device 6 Defective pixel detection unit 8 Correction determination unit 10 Vertical scanning control unit 12 Horizontal scanning control unit

Claims (3)

[Claims] 1. An image pickup device having a plurality of pixels arranged in a matrix, capable of selectively reading pixel signals from the plurality of pixels by a vertical signal line and a horizontal signal line; Defective pixel position detecting means for detecting a position where a defective pixel having no normal function exists, and pixel signals from the vertical signal line and the horizontal signal line including the defective pixel detected by the defective pixel position detecting means. A solid-state imaging device comprising: a reading control unit that prohibits reading of the image. 2. The image pickup device has a preliminary light-receiving pixel around a predetermined effective light-receiving pixel, and the read control means outputs a pixel signal from a specific vertical signal line and horizontal signal line of the effective light-receiving pixel. The solid-state imaging device according to claim 1, wherein when the reading is prohibited, a plurality of pixels of the preliminary light receiving pixels are newly supplemented to the predetermined effective light receiving pixels as effective light receiving pixels. 3. When the position of the defective pixel detected by the defective pixel position detecting means is within a predetermined area with reference to the substantially central portion of the image pickup device, a vertical direction including the defective pixel by the read control means. The solid-state imaging device according to claim 1, wherein reading of pixel signals from the signal line and the horizontal signal line is prohibited.