JPH09283914A - Method and apparatus for manufacturing component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize the amount of surplus solder to be discarded and to make the solder supply amount proper by a method wherein in a state that a circuit component is positioned on a circuit board, a solder plated layer is heated and melted and the circuit board is connected to the circuit component. SOLUTION: First, a rectangular chip component 1 is introduced into an electrolytic plating tank 3 for a solder plating operation, a plating treatment is executed, and solder plated layers 4 are grown so as to be formed on the surface of electrode films 2 at the rectangular chip component 1. In a state that the chip component 1 on which the solder plated layers 4 are formed is positioned in land parts 7 in a circuit board 6 by a ship mounter device 5, the component is mounted on the circuit board 6. Then, the circuit board 6 on which the rectangular chip component 1 is mounted is heated. Thereby, the solder plated layer 4 are melted, and the electrode film 2 at chip component 1 and the land parts 7 on the circuit board 6 are bonded firmly via solder bonding layers 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a component mounting board, and more particularly, to optimize the amount of solder supplied to each joint portion, and to prevent excess environmental pollution caused by lead during manufacturing. The present invention relates to a method and apparatus for manufacturing a component mounting board that minimizes the generation of solder.

[0002]

2. Description of the Related Art In recent years, environmental pollution by lead has been becoming a problem in various industrial fields.
Lead contained in solder has been regarded as a problem. As a solution to such a problem, while minimizing the amount of surplus solder discarded at the time of manufacturing the component mounting board, we aim to optimize the amount of solder supplied to each joint on the board, thereby reducing It is conceivable to reduce the amount of eluted lead as much as possible.

Conventionally, in a method of manufacturing a component mounting board on which surface mount components are mounted, a solder supplying step using a screen printing technique is adopted. In this solder supplying step, as shown in FIG. 8, a screen mask b is covered with an appropriate gap on the circuit board a, and the solder paste c is squeegeeed on the screen mask b from above. It is pressed so as to be rubbed, and the solder paste c pushed out from the opening e of the screen mask b at that time is transferred to a predetermined joining position on the circuit board a. 1A is a schematic top view of the screen printing machine, FIG.
(B) is the same side sectional view, and f is a print mask frame.

According to such a solder supplying process, the amount of solder paste supplied to each joint is controlled in accordance with the accuracy of the screen mask, so that an appropriate amount of solder paste is supplied to each joint without waste. can do. On the other hand, a large amount of solder paste is always left on the screen mask b due to the transfer principle of pushing out the solder paste c from the opening e while rubbing with the squeegee d, and this kind of solder paste deteriorates with time. As a result, there is a problem that a large amount of solder paste is wasted.

As a method of manufacturing a component mounting board on which surface mount components are mounted, a solder supply process using a dispenser which is an injection type viscous fluid supply device is also known. According to such a solder supplying step, wasteful solder paste can be reduced due to its property of ejecting only the used amount. On the other hand,
It is difficult to control the solder paste injection amount from the dispenser with high precision by hand, and as a result, there is a problem that the solder paste supply amount varies for each joint portion, and it is difficult to optimize the solder supply amount. is there.

[0006]

As described above, in the conventional method of manufacturing a component mounting board, when the solder paste is supplied using the screen printing technique, the solder supply amount is optimized. However, since a large amount of solder paste is wastefully discarded, environmental pollution due to the solder discarded at the manufacturing stage becomes a problem. On the other hand, when the solder paste is supplied by using a dispenser, there is little waste of the solder paste in the manufacturing stage, but it is difficult to control the injection amount. there were.

The present invention has been made in order to solve the above problems, and an object of the present invention is to minimize the amount of excess solder discarded at the time of manufacturing a component mounting board, and An object of the present invention is to provide a component mounting board and a method for manufacturing the same in which the amount of solder supplied to a joint is optimized so that the amount of lead eluted into the environment after product disposal is reduced as much as possible.

[0008]

According to a first aspect of the present invention, there is provided a step of growing a solder plating layer on a surface of a terminal portion of a circuit component to be mounted, and a circuit in which the solder plating layer is formed. Positioning and mounting the component at the connection location on the circuit board, and connecting the circuit board and the circuit component by heating and melting the solder plating layer with the circuit component positioned on the circuit board. A method of manufacturing a component mounting board, comprising:

Here, the term "circuit component" mainly means a surface mount component, preferably a rectangular or cylindrical chip component.

The term "terminal surface" means, for example, in the case of a chip component, the surface of the metal coating applied to the outer periphery of the terminal.

The term "solder plating layer" means a solder layer formed by plating, and the thickness of the solder layer is relatively large, for example, a chip component of about 1.0 mm × 1.0 mm. In this case, the thickness is set to about 150 to 200 μm.

Further, "positioning and mounting" means mounting by a conventional chip mounter or the like.

For the "heating", any heating means generally used in the reflow method (eg infrared rays, hot air, electron induction, laser irradiation) can be applied.

According to the first aspect of the invention, by adjusting the thickness of the solder plating layer, an appropriate amount of solder can be supplied to the joint portion, and the solder is not wasted. Moreover, since the electrolytic solution for solder plating can be reused to some extent, the amount of solder discarded at the manufacturing stage is smaller than that in the case of the screen printer.

According to a second aspect of the present invention, the step of applying an adhesive to the surface of the terminal portion of the circuit component to be mounted, and the solder pellet matching the shape of the terminal portion of the circuit component to be mounted. And holding the solder pellets in the terminal portion of the circuit component by the adhesive force of the adhesive, and positioning the circuit component in which the solder pellets are held in the terminal portion at the connection point on the circuit board. And mounting, and connecting the circuit board and the circuit component by heating and melting the solder pellet while the circuit component is positioned on the circuit board. And a method of manufacturing a component mounting board.

Here, the "adhesive" is sufficient as long as it has an adhesive strength such that the solder pellet does not drop, and for example, flux may be used as the adhesive.

Further, "matching with the shape of the terminal portion" means that the shape and size of the terminal portion are substantially matched.

Further, "to be held by adhesive force" means to move together with the circuit component while being retained.

According to the second aspect of the present invention, by adjusting the shape and size of the solder pellet, an appropriate amount of solder can be supplied to the joint, and the solder is not wasted. Further, since the solder pellets can sufficiently withstand long-term storage, the solder is not wastefully discarded at the manufacturing stage.

According to a third aspect of the present application, there is provided a step of preparing a solder pellet matching a shape of a terminal portion of a circuit component to be mounted, a step of attaching an adhesive to the surface of the solder pellet, A step of holding the solder pellet to which the adhesive is adhered to the terminal portion of the circuit component by the adhesive force of the adhesive, and positioning the circuit component in which the solder pellet is retained to the terminal portion at a connection point on a circuit board And mounting, and connecting the circuit board and the circuit component by heating and melting the solder pellet while the circuit component is positioned on the circuit board. Method for manufacturing a component mounting board.

According to the third aspect of the present invention, by adjusting the shape and size of the solder pellet, an appropriate amount of solder can be supplied to the joint, and the solder is not wasted. Further, since the solder pellets can sufficiently withstand long-term storage, the solder is not wastefully discarded at the manufacturing stage.

The invention according to claim 4 of this application comprises the steps of preparing a solder pellet that matches the shape of the terminal portion of the circuit component to be mounted, and a step of attaching an adhesive to the surface of the solder pellet. The step of holding the solder pellets having the adhesive attached to the surface at the connection points on the circuit board by the adhesive force of the adhesive, and positioning the circuit component at the connection points on the circuit board holding the solder pellets. And mounting the circuit board on the circuit board by heating and melting the solder pellets while the circuit part is positioned on the circuit board. It is a method of manufacturing a component mounting board.

According to the invention of claim 4, by adjusting the shape and size of the solder pellet, an appropriate amount of solder can be supplied to the joint portion, and the solder is not wasted. Further, since the solder pellets can sufficiently withstand long-term storage, the solder is not wastefully discarded at the manufacturing stage.

The invention according to claim 5 of this application comprises the steps of preparing a solder pellet that matches the shape of the terminal portion of the circuit component to be mounted, and the step of attaching an adhesive to the connection point on the circuit board. A step of holding the solder pellet at a connection point on a circuit board by an adhesive force of the adhesive, and a step of positioning and mounting a circuit component at the connection point on the circuit board where the solder pellet is held, And a step of connecting the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit board. is there.

According to the fifth aspect of the present invention, by adjusting the shape and size of the solder pellet, an appropriate amount of solder can be supplied to the joint portion, and the solder is not wasted. Further, since the solder pellets can sufficiently withstand long-term storage, the solder is not wastefully discarded at the manufacturing stage.

In the invention according to claim 6 of this application, the step of attaching the adhesive to the surface of the terminal portion of the circuit component, the surface of the solder pellet, or the connection portion of the circuit board comprises:
6. The method for manufacturing a component mounting board according to claim 2, wherein the adhesive mounting is performed by supplying an adhesive to the planned adhesion site with a dispenser.

Here, the "dispenser" is well known in the technical field of this kind, and means an injection type minute amount supply device for discharging a viscous substance from a nozzle.

Further, according to the invention described in claim 6, by supplying an appropriate amount of the adhesive to only the necessary place,
Do not waste the adhesive.

The invention according to claim 7 of this application is characterized in that the step of attaching the adhesive to the surface of the terminal portion of the circuit component or the surface of the solder pellet is performed by immersing them in the adhesive. The method for manufacturing a component mounting board according to any one of claims 2 to 4.

Here, "soaking" means so-called dipping.

According to the seventh aspect of the invention, the process can be simplified by only picking and immersing the circuit component or the solder pellet in the container filled with the adhesive.

The invention according to claim 8 of this application provides a means for growing a solder plating layer on the surface of a terminal portion of a circuit component to be mounted, and a circuit component on which the solder plating layer is formed on a circuit board. And a means for joining the circuit board and the circuit component by heating and melting the solder plating layer while the circuit component is positioned on the circuit board. This is an apparatus for manufacturing a component mounting board.

The invention according to claim 9 of this application is a means for adhering an adhesive to the surface of the terminal portion of the circuit component to be mounted, and a solder pellet matching the shape of the terminal portion of the circuit component to be mounted. And means for supplying the solder pellets to the terminal portion of the circuit component and holding the solder pellets by the adhesive force of the adhesive, and connecting the circuit component having the solder pellets on the terminal portion on the circuit board. Means for positioning and mounting at a location, means for connecting the circuit board and the circuit component by heating and melting the solder pellet in a state where the circuit component is positioned on the circuit board,
An apparatus for manufacturing a component mounting board, comprising:

According to a tenth aspect of the present invention, means for preparing solder pellets matching the shape of the terminal portion of the circuit component to be mounted, means for attaching an adhesive to the surface of the solder pellets, A means for supplying the solder pellet to which the adhesive is attached to the terminal portion of the circuit component and holding it by the adhesive force of the adhesive, and connecting the circuit component on which the solder pellet is retained to the terminal portion on the circuit board. And a means for joining the circuit board and the circuit component by heating and melting the solder pellet in a state where the circuit component is positioned on the circuit board. Equipment for manufacturing component mounting boards.

According to an eleventh aspect of the present application, means for preparing a solder pellet that matches the shape of the terminal portion of the circuit component to be mounted, means for attaching an adhesive to the surface of the solder pellet, A means for supplying solder pellets having an adhesive attached to the surface thereof to a connecting portion on a circuit board and holding the solder pellets by the adhesive force of the adhesive, and a circuit component at a connecting portion on the circuit board holding the solder pellets. And a means for joining the circuit board and the circuit component by heating and melting the solder pellet in a state where the circuit component is positioned on the circuit board. Is a device for manufacturing a component mounting board.

According to a twelfth aspect of the present application, means for preparing a solder pellet matching the shape of the terminal portion of the circuit component to be mounted, and means for adhering an adhesive to the connection point on the circuit board are provided. A means for supplying the solder pellets to a connection point on a circuit board and holding the solder pellets by the adhesive force of the adhesive, and a means for positioning and mounting a circuit component at the connection point on the circuit board holding the solder pellets And a means for joining the circuit board and the circuit component by heating and melting the solder pellet in a state where the circuit component is positioned on the circuit substrate, and manufacturing the component mounting board. apparatus.

According to a thirteenth aspect of the present application, the means for attaching the adhesive to the surface of the terminal portion of the circuit component, the surface of the solder pellet, or the connection portion of the circuit board is a dispenser to the attachment point. 10. The method according to claim 9, wherein the pressure-sensitive adhesive is supplied by the adhesive.
2 is a device for manufacturing a component mounting board according to item 2.

The invention as set forth in claim 14 of this application is characterized in that the means for attaching the adhesive to the surface of the terminal portion of the circuit component or the surface of the solder pellet is performed by immersing them in the adhesive. Claims 9 to 1
1 is a device for manufacturing a component mounting board according to item 1.

[0039]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As described above, in the solder supply process using the screen printing technique or the dispenser, it is difficult to satisfy both the demand for preventing the generation of excess solder and the demand for the proper amount of solder supply in the manufacturing stage. Have difficulty. Therefore, in the present invention, the use of a fluid solder material such as a solder paste, which is difficult to supply in a fixed amount, is stopped, and an appropriate amount of solder is supplied in a solid or pellet form for each joint.

As a first embodiment of the present invention, as shown in FIG. 1, a suitable amount of solder is supplied to the joint portion by previously applying a solder plating layer to the surface of the terminal portion of the circuit component. Can be considered. Here, as circuit parts,
As shown in FIG. 1A, a square chip component 1 having electrode coatings 2 and 2 on both ends thereof will be described as an example. In this embodiment, first, as shown in FIG. 1 (a), the rectangular chip component 1 is introduced into an electrolytic plating bath 3 for solder plating and plated under a predetermined condition. The solder plating layer 4 is grown and formed to a predetermined thickness on the surface of the first electrode coating 2. The thickness of this solder plating layer is calculated so that the total amount of solder forming the solder plating layer 4 is substantially equal to the total amount of solder required to bond the rectangular chip component 1 to the corresponding land portion on the substrate. Has been done. Next, as shown in FIG. 1C, the rectangular chip component 1 having the solder plating layer 4 formed thereon is transferred to land portions 7 and 7 which are joints on the circuit board 6 by a known chip mounter device 5. It is mounted on the circuit board 6 in a state of being positioned. At this time, if it is desired to temporarily fix the mounted component 1, it is sufficient to apply an adhesive material such as flux to the surfaces of the land portions 7, 7 in advance. Next, the circuit board 6 on which the rectangular chip component 1 is mounted is heated by sending it to a reflow furnace or the like, whereby the solder plating layer is melted, and as shown in FIG. 2 and the land portion 7 on the circuit board 6 are firmly bonded via the solder bonding layer 8. Further, according to this embodiment, the thickness of the solder plating layer 4 is calculated in advance so as to be an appropriate amount of solder supplied to the joint portion, so that the appropriate amount of solder supply is achieved. Moreover, since the electrolytic solution in the electrolytic plating tank 3 is repeatedly reused, the amount of discarded solder is sufficiently reduced as compared with the case of the screen printing machine.

Next, as a second embodiment of the present invention, as shown in FIG. 2, by holding solder pellets on the surface of the terminal portion of the circuit component with an adhesive material, an appropriate amount for the joint portion is obtained. It is conceivable to supply the solder. In this embodiment, first, as shown in FIG.
Electrode coating 2 corresponding to the end faces of both ends of the rectangular chip component 1
A flux 10 which is an adhesive material is supplied to the surface of the above using a dispenser 9. Next, as shown in FIG. 2B, a rectangular solder pellet 11 formed to match the shape of the end face is pressed against the surface on which the flux 10 is supplied and applied, and the viscosity of the flux 10 is increased. Held by. Here, the volume of the square solder pellets 11 is calculated so as to be substantially equal to the total amount of solder required to bond the square chip component 1 to the corresponding land portion on the substrate. Next, solder pellets 11 are attached to both ends thereof.
As shown in FIG. 2C, the rectangular chip component 1 to which is attached is positioned by the known chip mounter device 5 into the land portions 7 and 7 which are the joints on the circuit board 6. Mounted on the circuit board 6. At this time, if it is desired to temporarily fix the mounted component 1, it is sufficient to apply an adhesive material such as flux to the surfaces of the land portions 7, 7 in advance. Next, the circuit board 6 on which the rectangular chip component 1 is mounted is heated by sending it to a reflow furnace or the like, whereby the solder plating layer is melted, and FIG.
As shown in FIG. 5, the electrode coating film 2 of the chip component 1 and the land portion 7 on the circuit board 6 are firmly bonded via the solder bonding layer 8. Further, according to this embodiment, since the volume of the solder pellet 11 is calculated in advance so as to be an appropriate amount of solder supplied to the joint portion, an appropriate amount of solder supply is achieved. Moreover, the solder pellet 11
Since there is no risk of deterioration even after long-term storage, there is no problem of excess solder disposal during manufacturing.

In the second embodiment, FIG.
As shown in FIG. 3, the flux 10 which is an adhesive material is supplied to the solder pellet 11 side in advance (a in the figure), and then the solder pellet 11 is pressed against the component 1 side, so that the solder pellet is attached to the component 1. 11 may be held.

As a modified example of the second embodiment, as shown in FIG. 4, application or attachment of an adhesive material to a circuit component is subjected to a dipping process (immersing in an adhesive liquid).
It is possible to do in. In this modification, first, as shown in FIG. 4A, the rectangular chip component 1 is handled by the chip mounter device 5, and the flux 10 is applied or deposited relatively thickly on the surface of the stage 12. Soak (dip), which results in electrode coating 2,
Flux 10 as an adhesive material is attached to the lower surface of 2.
Next, as shown in FIG. 4B, the chip component 1 to which the flux 10 is attached on the lower surface of the solder pellet 1 while being handled by the chip mounter device 5.
1 is carried onto the stage 13 on which it is placed, and then descends and is pressed against the upper surface of the solder pellet 11, whereby the solder pellet 11 is viscous due to the flux 10.
It is adhesively held on the lower surface of the electrode coating of the chip component 1. Next, as shown in FIG. 4C, the chip component 1 holding the solder pellets 11 is transferred to the land portions 7, 7 on the circuit board 6 while being handled by the chip mounter device 5. Figure 4 (d) after being carried and positioned
As shown in FIG. 3, the circuit board 6 descends and is mounted on the circuit board 6. Next, the circuit board 6 on which the rectangular chip component 1 is mounted is heated by sending it to a reflow oven or the like, whereby the solder plating layer is melted, and as shown in FIG. 2 and the land portion 7 on the circuit board 6 are firmly bonded via the solder bonding layer 8. Then, according to the modified example of this embodiment, the flow from the adhesion of the adhesive material to the holding of the solder pellets and the mounting on the substrate can be smoothly progressed by using the chip mounter device 5.

Next, as a third embodiment of the present invention, as shown in FIG. 5, solder pellets are supplied to the joint portion on the side of the circuit board and held by an adhesive material to thereby form the joint portion. It is possible to supply an appropriate amount of solder to In this embodiment, first, as shown in FIG. 5A, a solder pellet 11 formed so as to match the shape of the land portion on the circuit board is prepared, and this is handled by the chip mounter device 5. As shown in FIG. 5B, the container is dipped in the flux 10 that is shallowly filled, so that the flux 10 is attached to the lower surface side of the solder pellet 11. Next, flux 11 on the lower surface side
As shown in FIG. 5 (c), the solder pellets 11 to which is attached are carried to the land portions 7, 7 on the circuit board 6 while being handled by the chip mounter device 5 and are dropped as they are. Is pressed against the land portions 7, 7 and held on the circuit board 6. Then, on the circuit board 6 holding the solder pellets 11 in this manner,
As shown in FIG. 5 (d), the rectangular chip component 1 handled by the chip mounter device 5 is positioned and mounted on the circuit board 6 by descending as it is. At this time, if it is desired to temporarily fix the mounted component 1, an adhesive material such as flux may be applied to the surface of the solder pellet 11 in advance. Next, the circuit board 6 on which the rectangular chip component 1 is mounted is heated by sending it to a reflow oven or the like, whereby the solder plating layer is melted, and as shown in FIG. 2 and the land portion 7 on the circuit board 6 are firmly bonded via the solder bonding layer 8. Further, according to this embodiment, since the volume of the solder pellet 11 is calculated in advance so as to be an appropriate amount of solder supplied to the joint portion, an appropriate amount of solder supply is achieved. Moreover,
Since the solder pellets 11 are not likely to deteriorate even if stored for a long period of time, there is no problem of discarding excess solder during manufacturing.

In the third embodiment, FIG.
As shown in FIG. 4, the flux 10 which is an adhesive material is previously supplied to the land portions 7, 7 side (a and b in the same figure),
After that, the solder pellet 11 may be pressed against the land portions 7, 7 to hold the solder pellet 11 on the circuit board 6.

The solder pellets 11 used in each of the above embodiments can be prepared by various methods as shown in FIG. That is, as shown in FIG. 7A, a rectangular small piece cut out from the sheet-shaped solder 14 is used as the solder pellet 14a. FIG. 7 (b)
The one shown in (1) is a solder pellet 15a which is a small piece cut from the tape-shaped solder 15 wound on the reel 16. Further, as shown in FIG. 7 (c), the solder pellets 18 thus cut out are supplied while being conveyed by the carrier tape 17. Further, the one shown in FIG.
A flux layer 19 which constitutes an adhesive material is formed on the solder paste 4, and rectangular pieces cut out from the flux layer 19 are solder pellets 2
It is set to 0, and according to this example, the step of applying the adhesive material can be omitted.

[0048]

As is apparent from the above description, according to the present invention, it is possible to minimize the amount of excess solder discarded at the time of manufacturing a component mounting board and to adjust the amount of solder supplied to each joint on the board. Therefore, the amount of lead eluted into the environment after product disposal can be reduced as much as possible.

[Brief description of drawings]

FIG. 1 is a first method of manufacturing a component mounting board according to the present invention.
FIG. 6 is a process explanatory view showing the embodiment of FIG.

FIG. 2 is a second method of manufacturing a component mounting board according to the present invention.
FIG. 6 is a process explanatory view showing the embodiment of FIG.

FIG. 3 is a second method of manufacturing a component mounting board according to the present invention.
FIG. 7 is a process explanatory view showing another example of the embodiment of FIG.

FIG. 4 is a second method of manufacturing a component mounting board according to the present invention.
FIG. 9 is a process explanatory view showing a modified example of the embodiment of FIG.

FIG. 5 is a third method of manufacturing a component mounting board according to the present invention.
FIG. 6 is a process explanatory view showing the embodiment of FIG.

FIG. 6 is a third method of manufacturing a component mounting board according to the present invention.
FIG. 7 is a process explanatory view showing another example of the embodiment of FIG.

FIG. 7 is a diagram for explaining a method of supplying solder pellets.

FIG. 8 is a diagram illustrating a screen printing machine used in a conventional solder supply process.

[Explanation of symbols]

 1 Rectangular Chip Component 2 Electrode Coating 3 Electrolytic Plating Tank 4 Solder Plating Layer 5 Chip Mounter Device 6 Circuit Board 7 Land Part 8 Solder Bonding Layer 9 Dispenser 10 Adhesive Flux 11 Solder Pellet 12 Stage 13 Stage 14 Sheet Solder 15 Tape Solder 16 Reel 17 Carrier tape 18 Solder pellet 19 Flux layer 20 Solder pellet

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hiromi Sugihara, Inoue 10 Hanazono Todocho, Ukyo-ku, Kyoto Prefecture Kyoto Omron Co., Ltd. Incorporated (72) Inventor Tomoyuki Nakai, 10 Hanazono Todocho, Ukyo-ku, Kyoto, Kyoto Prefecture Omron Co., Ltd. (72) Inventor Tsunematsu, Yuno 10 Hanazono Todo-cho, Kyoto, Kyoto City

Claims (14)

[Claims] 1. A step of growing a solder plating layer on a surface of a terminal portion of a circuit component to be mounted, and a step of positioning and mounting the circuit component on which the solder plating layer is formed at a connection point on a circuit board. And a step of connecting the circuit board and the circuit component by heating and melting the solder plating layer in a state where the circuit component is positioned on the circuit board, the component mounting board comprising: Production method. 2. A step of attaching an adhesive to a surface of a terminal portion of a circuit component to be mounted, a step of preparing a solder pellet matching a shape of the terminal portion of the circuit component to be mounted, and a step of preparing the circuit component. A step of holding the solder pellets in a terminal portion by an adhesive force of the adhesive, a step of positioning and mounting a circuit component in which the solder pellets are held in the terminal portion at a connection point on a circuit board; And a step of connecting the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit board. 3. A step of preparing a solder pellet that matches a shape of a terminal part of a circuit component to be mounted, a step of attaching an adhesive to the surface of the solder pellet, and a step of attaching the solder pellet to which the adhesive is attached. A step of holding the terminal part of the circuit component by an adhesive force of the adhesive, a step of positioning and mounting the circuit component, in which the solder pellet is held in the terminal part, at a connection point on a circuit board; And a step of connecting the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit board. 4. A step of preparing a solder pellet matching a terminal shape of a circuit component to be mounted, a step of attaching an adhesive to the surface of the solder pellet, and a solder having the adhesive attached to the surface. A step of holding the pellet at a connection point on the circuit board by the adhesive force of the adhesive; a step of positioning and mounting a circuit component at the connection point on the circuit board where the solder pellet is held; And a step of connecting the circuit board and the circuit component by heating and melting the solder pellets in a state where the circuit component is positioned, and a method for manufacturing a component mounting board. 5. A step of preparing a solder pellet matching a terminal shape of a circuit component to be mounted, a step of applying an adhesive to a connecting portion on the circuit board, and a step of connecting the solder pellet on the circuit board. Holding by the adhesive force of the adhesive at a location, positioning and mounting a circuit component at a connection location on the circuit board where the solder pellet is held, and positioning the circuit component on the circuit board And a step of connecting the circuit board and the circuit component by heating and melting the solder pellets in a state, and a method of manufacturing a component mounting board. 6. The step of adhering the adhesive to the surface of the terminal portion of the circuit component, the surface of the solder pellet, or the connection part of the circuit board is performed by supplying the adhesive to the planned adhesion part with a dispenser. The method for manufacturing a component mounting board according to claim 2, wherein the component mounting board is manufactured. 7. The method according to claim 2, wherein the step of attaching the adhesive to the surface of the terminal portion of the circuit component or the surface of the solder pellet is performed by immersing the adhesive in the adhesive. Manufacturing method of component mounting board. 8. A means for growing a solder plating layer on a surface of a terminal portion of a circuit component to be mounted, and a means for positioning and mounting the circuit component on which the solder plating layer is formed at a connection point on a circuit board. An apparatus for manufacturing a component mounting board, comprising: means for joining the circuit board and the circuit component by heating and melting the solder plating layer while the circuit component is positioned on the circuit substrate. . 9. A means for attaching an adhesive to the surface of a terminal portion of a circuit component to be mounted, a means for preparing a solder pellet that matches the shape of the terminal portion of the circuit component to be mounted, and A means for supplying the solder pellets to a terminal portion and holding the solder pellets by the adhesive force of the adhesive, and a means for positioning and mounting a circuit component in which the solder pellets are held in the terminal portion at a connection point on a circuit board, An apparatus for manufacturing a component mounting board, comprising: means for joining the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit substrate. 10. A means for preparing solder pellets conforming to the shape of a terminal portion of a circuit component to be mounted, a means for attaching an adhesive to the surface of the solder pellets, and a solder pellet to which the adhesive is attached. A means for supplying to the terminal portion of the circuit component and holding it by the adhesive force of the adhesive, and a means for positioning and mounting the circuit component in which the solder pellet is held at the terminal portion at a connection point on a circuit board, An apparatus for manufacturing a component mounting board, comprising: means for joining the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit substrate. 11. A means for preparing a solder pellet that conforms to the shape of a terminal portion of a circuit component to be mounted, a means for attaching an adhesive to the surface of the solder pellet, and a solder to which the adhesive is attached on the surface. A means for supplying a pellet to a connection point on a circuit board and holding it by the adhesive force of the adhesive, a means for positioning and mounting a circuit component at the connection point on the circuit board where the solder pellet is held, An apparatus for manufacturing a component mounting board, comprising: means for connecting the circuit board and the circuit component by heating and melting the solder pellets while the circuit component is positioned on the circuit substrate. 12. A means for preparing a solder pellet that matches the shape of a terminal portion of a circuit component to be mounted, a means for attaching an adhesive to a connection point on the circuit board, and a connection for connecting the solder pellet on the circuit board. Means for supplying to the location and holding by the adhesive force of the adhesive, means for positioning and mounting the circuit component at the connection location on the circuit board where the solder pellet is held, and the circuit component on the circuit board A device for manufacturing a component mounting board, comprising: a unit for connecting a circuit board and a circuit component by heating and melting the solder pellet in a positioned state. 13. The means for adhering the adhesive to the surface of the terminal portion of the circuit component, the surface of the solder pellet, or the connection part of the circuit board is performed by supplying the adhesive to the planned adhesion part with a dispenser. 13. The component mounting board manufacturing apparatus according to claim 9, which is characterized in that. 14. The method according to claim 9, wherein the means for attaching the adhesive to the surface of the terminal portion of the circuit component or the surface of the solder pellet is performed by immersing them in the adhesive. Manufacturing equipment for component mounting boards.