JPH09283913A - Reflow soldering method and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflow soldering method and apparatus therefor which is capable of soldering lead-inserted electronic parts and surface-mounting parts mixed and mounted on a board at once, without damaging the electronic parts; a cream solder being fed onto lead solder zones of the electronic parts. SOLUTION: During heating a reflow soldering face of a printed circuit board 1 a means 10 for cooling less-heat durable parts in this board 1 is disposed to allow lead-inserted parts which could not pass through a reflow apparatus to heat the entire printed circuit board 1 in the prior art, to be also reflow- soldered. A mask is laid on the heating face to control the temp. of this face, thereby enabling the reflow soldering of the surface-mounted parts at once.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow method and a reflow apparatus for soldering and mounting electronic components on a printed circuit board.

[0002]

2. Description of the Related Art There are various soldering techniques for collectively mounting electronic components on a printed circuit board. For example, a flow method of collectively soldering the insertion mounting component and the surface mounting component, a reflow method of collectively soldering the surface mounting component, a batch soldering of the surface mounting component, and then a soldering of the insertion mounting component locally. It is a retrofitting method.

In the conventional reflow apparatus, the entire printed circuit board is uniformly heated by air heated to a predetermined temperature or radiant heat of a panel heater, or locally heated to melt the solder and solder the electronic component. Attached.

FIG. 8 shows a conventional reflow apparatus. As can be seen from this figure, in the conventional reflow device, the hot air box 40 for storing the gas heated to the temperature for melting the cream solder, and the printed circuit board 4 in the opening 41 of the hot air box.
2 is provided with a top plate 45 having a plurality of hot air blowing holes 44 formed therein so that the hot air 43 can be selectively blown only to a necessary portion, and a printed circuit board transfer means 46. It is possible to perform soldering, soldering of components weak against heat, and simultaneous soldering of the lead component 47 and the chip component 48 in which the tips of the leads project below the substrate.

[0005]

However, in the structure of such a conventional reflow apparatus, the lead parts 47 and the chip parts 48 are locally blown with hot air.
Soldering parts for electronic parts such as 230 in 20 to 30 seconds
The temperature of the hot air needs to be approximately 350 ° C. or higher because it has a structure in which the temperature rises to a temperature in the vicinity of ° C. Therefore, partial soldering by selectively blowing hot air to a necessary portion, post-soldering of lead components 47 vulnerable to heat scattered in the substrate, and simultaneous reflow of some chip components 48. Although soldering can be achieved, the entire surface of the board is heated to a temperature of around 230 ° C.
It was not possible to batch reflow solder the insert mounting components such as 7 and the surface mounting components such as the chip component 48.

Because the hot air temperature as a heat source is 350
Since the temperature is higher than 0 ° C., if this hot air is blown over the entire surface of the printed circuit board 42, the temperature of the printed circuit board 42 is likely to rise, and the hot air temperature approaches the hot air temperature. Even though it is 250 ° C.), it exceeds the heat resistant temperature. Therefore, if the temperature of the hot air is lowered to the heat resistant temperature of 250 ° C., the place on the printed circuit board 42 where the temperature does not rise easily may not be heated to the temperature required for soldering within a predetermined time. Further, since one side of the printed circuit board 42 is entirely heated, the amount of heat transfer from the lead soldering portion of the lead component 47 to the component body, which is a weak heat resistant portion, is different from the case of partial heating. Therefore, the body of the lead component 47 rises above the heat resistant temperature,
Damage. Therefore, according to this method, the printed circuit board 4 on which the insertion mounting component and the surface mounting component are mixedly mounted is mounted.
There is a problem in that it is difficult to perform reflow soldering of the two simultaneously.

The present invention solves the above problems by providing a mixed mounting board of a lead insertion component and a surface mounting component in a state where cream solder is supplied to a lead soldering portion of the electronic component without damaging the electronic component. An object of the present invention is to provide a reflow method and a reflow apparatus that can perform simultaneous batch reflow soldering.

[0008]

In order to solve the above problems, a reflow method of the present invention is to heat a reflow soldering surface of a printed circuit board while cooling weak heat resistant parts of electronic parts in the printed circuit board. Thus, the electronic components of the printed circuit board to which the cream solder is supplied are collectively reflow-soldered. Further, the reflow device of the present invention includes a heating unit that heats a printed circuit board on which an electronic component is mounted by a heating unit, and a weak heat-resistant component in the electronic component of the printed circuit board that is heated in the heating unit is cooled by a cooling unit. And a cooling unit for controlling the temperature.

According to such a reflow method and a reflow apparatus, a mixed mounting board of a lead insertion component and a surface mounting component in a state where cream solder is supplied to a lead soldering portion of the electronic component without damaging the electronic component. It is possible to perform simultaneous reflow soldering at the same time.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The reflow method according to claim 1 of the present invention is a method for heating a reflow soldering surface of a printed circuit board while cooling weak heat-resistant parts of electronic parts in the printed circuit board. This is to reflow solder all the electronic components of the printed circuit board to which solder has been supplied.The weak heat resistant components of the electronic components are reflow soldered while cooling, so damage to the weak heat resistant components of the electronic components can be prevented. Moreover, the electronic components of the printed circuit board can be collectively reflow-soldered.

In the reflow method according to the second aspect of the present invention, the electronic components mounted on the printed circuit board include surface mounting components and insertion mounting components, and these surface mounting components and insertion mounting components are included. Since the reflow soldering is performed in a lump, it is possible to reflow solder even a lead-inserted mounting component that could not be passed through a reflow device that conventionally heats the entire substrate.

According to a third aspect of the reflow method of the present invention, at the same time as heating one surface of the printed circuit board,
The other surface of the printed circuit board is cooled, so that reflow soldering can be performed without trouble even if the other surface includes a weak heat resistant component.

According to a fourth aspect of the present invention, there is provided a reflow device in which a heating portion for heating a printed circuit board on which an electronic component is mounted by a heating means and a printed circuit board heated in the heating portion are weak in the electronic component. It is provided with a cooling unit for cooling the heat-resistant component by the cooling means, and reflow soldering can be performed while cooling the weak heat-resistant component in the electronic component, so damage to the weak heat-resistant component in the electronic component can be prevented, Moreover, the electronic components of the printed circuit board can be collectively reflow-soldered.

According to a fifth aspect of the present invention, in the reflow apparatus, a conveying means for conveying the printed circuit board to the heating section is provided, and the cooling means can be moved toward and away from the printed circuit board conveyed to the heating section. It is arranged,
If necessary, the cooling means can be moved closer to or separated from each other so that the cooling operation can be performed in an appropriate posture, and it is also possible to avoid obstructing the transport operation by the cooling means.

According to a sixth aspect of the present invention, in the reflow apparatus, as a heating means of the heating unit, a radiant heating heating element such as a panel heater for radiatively heating the printed circuit board and a convection heating for the printed circuit board. And a hot air generator that heats the printed circuit board more appropriately. That is, when the body of the lead insertion mounted component is cooled, a large amount of heat that heats the lead soldering portion is lost from the cooling body portion due to heat conduction. Therefore, the amount of heat lost to this large amount and the amount of heat required to raise the temperature of the lead soldering portion to around 200 ° C., which is higher than the solder melting temperature (183 ° C. for eutectic solder), are within a predetermined time (for example, reheating main heating). About 20-30 hours
Seconds). Here, when hot air is used as the heat supply means, in order to supply a large amount of heat energy in a short time, there is a means of increasing the temperature of the hot air or increasing the speed of the hot air colliding with the soldering portion. Taken.
On the heating surface of the printed circuit board, the lead insertion mounting component and the surface mounting component are arranged on the substrate via cream solder, so there is no way to increase the hot air velocity in view of the displacement of the surface mounting component. . Therefore, if a means for raising the temperature of the hot air is taken, the temperature of the hot air needs to be around 350 ° C. However, since the lead insertion component and the surface mount component are arranged on the heating surface of the printed circuit board, the surface mount component that is not the cooling target is heated to a temperature higher than its heat resistant temperature and destroyed. Therefore, a panel heater or the like that generates infrared rays, which is radiant heating, is used as a heat supply means. In order to supply a large amount of heat energy in a short time, the temperature of the panel heater may be raised.

According to a seventh aspect of the present invention, in the reflow apparatus, a panel heater for radiant heating is arranged substantially directly above the substrate carrying surface, and hot air is provided between the substrate carrying surface and the panel heater as a printed circuit board. A ventilation port for blowing air in parallel and an intake port for collecting hot air are arranged, and according to this, the hot air set at a constant temperature, for example, about 230 ° C. which is the maximum reflow temperature of the mounting board is circulated. As a result, the ambient temperature of the heating section can be stabilized.

In the reflow apparatus according to the eighth aspect of the present invention, a radiant heating element for radiatively heating the printed circuit board is provided as a heating means of the heating section, and the radiant heating element and the printed circuit board are combined. A mask that partially shields the radiant energy of the radiant heating element is placed between them, and this allows the radiant heat energy to be supplied to the surface-mounted components and unmounted board parts that are not cooled by the mask. It can be shielded and the temperature rise can be controlled.

According to a ninth aspect of the present invention, in the reflow apparatus, the heating means of the heating section heats one surface of the printed circuit board and the cooling means of the cooling section cools the other surface of the printed circuit board. A plate that surrounds the printed circuit board and prevents interference between the heating atmosphere of the heating unit and the cooling atmosphere of the cooling unit is arranged substantially parallel to the substrate transport surface. It is possible to prevent interference between the heating atmosphere of the cooling section and the cooling atmosphere of the cooling section.

According to a tenth aspect of the present invention, in the reflow apparatus, a heating / cooling temperature interference prevention plate provided with a hole having a size equal to or larger than the board outer dimension is provided above the board carrying surface, and the printed circuit board is drawn. A substrate stopping mechanism for stopping at a predetermined position with respect to the hole, and a substrate lifting mechanism for lifting the substrate from the substrate transport surface to a height in contact with or close to the heating / cooling temperature interference prevention plate are arranged. According to this, the printed circuit board can be satisfactorily lifted from the board transport surface to a height at which it comes in contact with or close to the heating / cooling temperature interference prevention plate, and the interference between the heating atmosphere of the heating section and the cooling atmosphere of the cooling section can be prevented. It can be prevented more reliably.

According to the eleventh aspect of the present invention, in the reflow apparatus, the board elevating mechanism is provided with a cooling air blowing structure for locally cooling the weak heat-resistant components mounted on the printed circuit board. According to this, it is possible to realize the cooling air blowing according to the arrangement of the weak heat resistant components of the printed circuit board, and it is possible to optimize the cooling location.

In the reflow apparatus according to the twelfth aspect of the present invention, as the cooling air blowing structure, the plate is provided with holes corresponding to the arrangement of the weak heat-resistant components of the printed circuit board. Cooling air can be blown out according to the arrangement of the weak heat-resistant components on the circuit board, and the cooling location can be optimized.

A reflow apparatus according to a thirteenth aspect of the present invention is provided with a nozzle for adjusting a distance from a portion to be cooled of the printed circuit board, which also contributes to weak heat resistance of the printed circuit board. The cooling air can be blown out more appropriately according to the arrangement of parts, and the cooling place can be optimized.

A reflow apparatus according to a fourteenth aspect of the present invention has a cooling air blowing structure in which a blowing hole is formed in a block of metal or resin, and a cooling air blowing distance corresponding to the height of an inserted mounting component is engraved in the block. The cooling air can be more appropriately realized according to the arrangement of the weak heat resistant components of the printed circuit board, and the cooling locations can be optimized.

A reflow apparatus according to a fifteenth aspect of the present invention comprises a heating section including a preheating section and a main heating section for heating a printed circuit board on which electronic components are mounted, and a carrying section for carrying the printed circuit board. In the preheating portion, a heating source for preheating the reflow soldering surface on one surface (for example, the upper surface) of the printed circuit board and an atmosphere for the other surface (for example, the lower surface) of the printed circuit board which is not particularly heated are printed. An exhaust duct for exhausting in a direction substantially parallel to the circuit board and in a direction substantially perpendicular to the carrying direction, and another surface side of the printed circuit board, for example, arranged below the board carrying surface to keep the other surface at a low temperature. An outside air intake port is provided, which allows the ambient temperature on the bottom surface of the board to be maintained at a temperature near room temperature, while keeping the body of the insertion mounting component at a low temperature. Top can go heated heating.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. FIG. 2 shows a cross-sectional view of the printed circuit board 1. On the printed circuit board 1, surface mounting components 2 such as QFP 2A and chip components 2B and insertion mounting components 3 such as aluminum electrolytic capacitors 3A and switches 3B are mounted together. Has been implemented. The printed circuit board 1 is conveyed to the reflow device in a posture in which the body portion of the insertion mounting component 3 is located on the lower surface side.

FIG. 1 shows a reflow apparatus according to the present invention. FIG.
As shown in FIG. 4, a conveyor 5 is arranged to penetrate the preheating unit 4, and a main heating unit 6 for reflow provided on the downstream side of the preheating unit 4 is arranged to penetrate a conveyor 7 as a conveying means. ing. Then, when the printed circuit board 1 on which the surface mounting component 2 and the insertion mounting component 3 are mixed and mounted is supplied from the previous process, the printed circuit board 1 is transferred to the conveyor 5
Are conveyed and passed through the preheating unit 4 at a predetermined speed.

Between the pre-heating section 4 and the main heating section 6, a board pushing-in section 8 for pushing the printed circuit board 1 on the way into the main heating section 6 is installed. A board stopper 9 as a board stopping mechanism for stopping the printed circuit board 1 at a predetermined position is installed on the board transfer surface of the main heating unit 6, and a local part for cooling the printed circuit board 1 locally under the board transfer surface. A cooling device 10, a blower fan 11 for blowing air to the local cooling device 10, and an elevating cylinder 12 for moving the local cooling device 10 up and down are installed.

Further, on the downstream side of the main heating section 6, a conveyor 13 for conveying the printed circuit board 1 to the subsequent process side, and a fan 14 and a fan 15 for blowing air from below and above the printed circuit board 1 are installed. ing. Between each zone (between pre-heating section 4 and main heating section 6 and before and after)
An exhaust duct 16 is installed in each.

FIG. 3 shows a cross section of the preheating section 4. As shown in FIG. 3, the preheating unit 4 includes a hot air heater 17 for preheating the printed circuit board 1 with hot air, a hot air circulation fan 18 for circulating the hot air, and a printed circuit board provided in the middle of the circulation path. It is composed of a catalyst 19 for burning and purifying a solvent or flux generated from cream solder or the like during the heating of 1, a panel heater 20, and an under-conveyance atmosphere exhaust duct 21.

FIG. 4 shows a cross section of the main heating section 6. As shown in FIG. 4, the main heating unit 6 includes a hot air heater 23 and a hot air circulation fan 24 for convectively heating the printed circuit board 1, and a hot air generator provided in the middle of the circulation path. 1, a catalyst 25 for burning and purifying a solvent or flux generated from cream solder or the like during heating, a panel heater 26 as a radiant heating heating element for radiatively heating a printed circuit board, and a board slightly larger than the board external dimensions. A temperature interference prevention plate 27 having a hole formed therein, an infrared shielding mask 28 for shielding infrared rays from a panel heater, a small hole arrangement block 29 for local cooling provided with small holes for blowing cold air, and a substrate support. It is composed of 30 and.

The small hole arrangement block 29 for local cooling is used.
As shown in (a) and (b) of FIG.
Even if the plate 35 is opened, as shown in (c) and (d) of FIG. 6, a nozzle 36 matching the height of the printed circuit board 1 is attached to the plate 35 so that the nozzle 36 can be removed from the hole 34 of the nozzle 36. It may have a structure that blows out cold air. Here, the distance to the cooled portion of the printed circuit board 1 may be adjusted by the nozzle 36, but a blowing hole may be opened in a block of metal or resin to provide a cooling air blowing distance according to the height of the inserted mounting component. It may be adjusted by engraving the blocks. In addition, as shown in FIG. 7, the cooling unit in which the local cooling device 12 is disposed is provided with a fan 36 that blows a part of the blown air to the lower surface of the substrate by the wind direction plate 37.

FIG. 5 shows the substrate pushing portion 8. As shown in FIG. 5, the board pushing portion 8 includes a chain 31, a drive motor 32, and a lever 33 fixed to the chain 31.
It is composed of

The operation of the reflow apparatus configured as above will be described. The printed circuit board 1 configured by mounting the surface mounting component 2 and the insertion mounting component 3 together is carried into the preheating section 4 at a constant speed by the conveyor 5. In the preheating unit 4, the upper surface of the printed circuit board 1 is heated to a temperature around 150 ° C. by the radiant heat of the panel heater 20 and the hot air of the side flow. The load of the hot air heater 17 is reduced by keeping the atmospheric temperature in the preheating unit 4 constant and circulating the hot air at a constant temperature. The temperature of the body portion of the insertion mounting component 3 that is conveyed in the posture of being arranged on the lower surface side of the printed circuit board 1 is raised by heat conduction from the lead portion on the upper surface of the printed circuit board 1. For this reason, the atmosphere on the lower surface of the substrate is always sucked by the exhaust duct 21 to guide the room-temperature atmosphere to the lower surface of the substrate to remove heat from the body portion of the insertion mounting component 3 and suppress the temperature rise of the body portion.

The printed circuit board 1 which has been preheated is
The rear end portion is pushed by the lever 33 of the substrate pushing-in portion 7 so that the transfer between the conveyor 5 and the conveyor 7 can be smoothly performed. The reason why the board pushing-in section 7 is provided is that the preheating section 4 in which the conveyor 5 runs heats the printed circuit board 1 while continuously conveying it, so that it is, for example, 0.8 m.
The main heating unit 6 in which the conveyor 7 runs runs at a speed of / min, but heats the printed circuit board 1 by stopping it at a predetermined position, so that the printed circuit board 1 is quickly sent to the board stopper 9 until the front portion of the printed circuit board 1 hits. Because it is necessary.

The printed circuit board 1 sent to the main heating section 6 is stopped at a predetermined position by the board stopper 9, and the conveyor 7 of the main heating section 6 is also stopped. Then, the local cooling device 11 is lifted up by the lifting cylinder 12. The printed circuit board 1 on the conveyor 7 is the board support 3
It is held at 0 and lifted to the height of the temperature interference prevention plate 27 having a hole notched to be slightly larger than the outer dimension of the substrate. The temperature interference prevention plate 27 and the printed circuit board 1 separate the heating region and the cooling region.

The inserted mounting component 3 placed on the lower surface of the printed circuit board 1 is cooled by a local cooling small hole placement block 29 having holes 34 for blowing cold air in accordance with the placement. The upper surface side of the printed circuit board 1 is heated to a temperature around 200 ° C. to 230 ° C. by the radiant heat of the panel heater 26 and the hot air of the side flow. The hot air having a constant temperature keeps the ambient temperature in the main heating section 6 constant and circulates the hot air to reduce the load on the hot air heater 23. Further, by providing the catalyst 25 in the middle of the circulation path, the solvent and flux generated from the cream solder or the like during the heating of the printed circuit board 1 is burned and purified. The upper surface side of the printed circuit board 1 is 200 ° C to 2 ° C.
In order to heat and raise the temperature to around 30 ° C., the set temperature of the panel heater 26 is raised to 500 ° C. or higher. At this time, radiant heat is applied to the upper surface of the printed circuit board 1 more than necessary, and some parts are overheated to a temperature of 230 ° C. or higher. A mask 28 for shielding radiant heat is set in this portion to prevent overheating of the upper surface of the substrate.

In this way, it is possible to prevent the weak heat-resistant components such as the body portion of the insertion mounting component 3 in the electronic component from being damaged, and the electronic components of the printed circuit board 1 can be reflow-soldered together. Further, since the mask 28 is arranged between the panel heater 26 and the printed circuit board 1, it is possible to block the supply of radiant heat energy to the surface mount components 3 and the like that are not cooling targets, and to raise the temperature rise. Can be controlled. In addition, the temperature interference prevention plate 2
7 makes it possible to prevent interference between the heating atmosphere of the main heating section 6 and the cooling atmosphere.

When the predetermined heating is completed, the printed circuit board 1 is lowered again to the position of the conveyor 7, and the local cooling unit 11 is further lowered. That is, the local cooling unit 11 is further lowered to the panel heater 26.
The heating of the local cooling unit 10 due to radiation is suppressed by moving away from the. Further, when the local cooling device 12 starts descending, the cooling of the insertion mounting component 3 becomes insufficient. Therefore, in order to compensate for this, a part of the air is blown by the fan 36 to the lower surface of the substrate by the wind direction plate 37. When the printed circuit board 1 is carried out from the main heating section 6, the air flow direction plate 37 is set horizontally and the air flow direction of the fan 36 is such that the entire local cooling device 10 is cooled.

Printed circuit board 1 after predetermined heating
Moves from conveyor 7 to conveyor 13. Conveyor 7
When the predetermined heating is completed, the printed circuit board 1 is immediately unloaded from the main heating section 6, and the printed circuit board 1 transferred to the conveyor 13 is transported to the outlet of the reflow device at a transport speed of about 0.8 m / min. . During this time, the printed circuit board 1 is cooled by the fans 14 and 15.

Further, by providing the exhaust duct 16 between each zone, the interference of the atmospheric temperature between the zones is prevented and each zone is stabilized at a predetermined temperature.

[0041]

As described above, according to the present invention, the cooling means for cooling the weak heat-resistant component in the printed circuit board while arranging the reflow soldering surface of the printed circuit board is arranged. It also enables reflow soldering of lead insertion components that could not be passed through a reflow device that heats the entire circuit board. Also, by placing a mask on the heating surface, the temperature of the heating surface can be controlled and surface mounted components can be reflow soldered at the same time.

As a result, the soldering quality is improved by performing the reflow soldering, which was conventionally performed by the flow dip soldering, and the product cost can be increased by using the inserted mounting parts as they are. Absent. In the flow method, the heat history is taken twice because the surface mount component is temporarily fixed with an adhesive and then passed through a curing furnace and then through a flow device. According to the present invention, it is only necessary to pass the reflow device once, and the heat history is only one.
It also helps prevent performance deterioration of electronic components.

[Brief description of drawings]

FIG. 1 is a sectional view of a reflow device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a printed circuit board configured by mounting surface mounting components and insertion mounting components together.

FIG. 3 is a sectional view of a preheating unit of the reflow apparatus according to the embodiment of the present invention.

FIG. 4 is a sectional view of a main heating portion of the reflow apparatus.

5 (a) and 5 (b) are cross-sectional views of a substrate pressing portion of the reflow apparatus.

6 (a), (c) and (b), (d) are a perspective view and a sectional view of a local cooling small hole arrangement of the reflow apparatus, respectively.

FIG. 7 is a view showing a structure in the vicinity of a local cooling device of the reflow device.

FIG. 8 is a sectional view of a main part of a conventional reflow device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Surface mounting component 3 Insert mounting component 4 Preheating part 5 Conveyor 6 Main heating part 7 Conveyor (conveying means) 8 Board pushing part 9 Board stopper (board stopping mechanism) 10 Local cooling device 11 Blower fan 12 Lifting cylinder 16 Exhaust Duct 17 Hot Air Heater (Heating Source) 21 Exhaust Duct 23 Hot Air Heater 24 Hot Air Circulation Fan 26 Panel Heater (Radiative Heating Heater) 27 Temperature Interference Prevention Plate 28 Infrared Shield Mask 29 Local Cooling Small Hole Arrangement Block

Claims (15)

[Claims] 1. The electronic components of the printed circuit board to which the cream solder is supplied are collectively packaged by heating the reflow soldering surface of the printed circuit board while cooling the weak heat resistant components of the electronic components in the printed circuit board. Reflow soldering reflow method. 2. The electronic component mounted on the printed circuit board includes a surface mount component and an insert mount component, and the surface mount component and the insert mount component are collectively reflow soldered. Reflow method. 3. The reflow method according to claim 1, wherein one surface of the printed circuit board is heated and at the same time, the other surface of the printed circuit board is cooled. 4. A heating unit that heats a printed circuit board on which electronic components are mounted by a heating unit, and a cooling unit that cools weak heat resistant components of the electronic components of the printed circuit board that are heated in the heating unit by a cooling unit. Reflow device equipped with. 5. The reflow apparatus according to claim 4, further comprising a transfer means for transferring the printed circuit board to the heating section, and the cooling means being arranged so as to be able to approach and separate from the printed circuit board transferred to the heating section. . 6. The heating means for heating the heating unit, comprising: a radiant heating heating element for radiatively heating the printed circuit board; and a hot air generator for convectively heating the printed circuit board. Reflow equipment. 7. A panel heater for radiant heating is disposed substantially directly above the substrate carrying surface, and a blower opening for blowing hot air substantially parallel to the printed circuit board and the hot air are collected between the substrate carrying surface and the panel heater. A suction port is arranged.
The reflow device described in. 8. A radiant heating element for radiatively heating a printed circuit board is provided as heating means of the heating section, and the radiant energy of the radiant heating element is partly provided between the radiant heating element and the printed circuit board. The reflow device according to any one of claims 4 to 7, wherein a mask that selectively shields is disposed. 9. The heating means of the heating section heats one surface of the printed circuit board, and the cooling means of the cooling section cools the other surface of the printed circuit board. 9. The reflow apparatus according to claim 4, wherein a plate that prevents interference between the heating atmosphere of the cooling section and the cooling atmosphere of the cooling section is arranged substantially parallel to the substrate transfer surface. 10. A heating / cooling temperature interference prevention plate having a hole having a size equal to or larger than a board outer dimension above a substrate carrying surface, and a substrate for stopping a printed circuit board at a predetermined position with respect to the hole. 10. The reflow apparatus according to claim 9, further comprising a stop mechanism and a substrate elevating mechanism for elevating the substrate from the substrate transfer surface to a height in contact with or close to the heating / cooling temperature interference prevention plate. 11. The reflow apparatus according to claim 10, wherein the board lifting mechanism is provided with a cooling air blowing structure for locally cooling the weak heat resistant component mounted on the printed circuit board. 12. The reflow device according to claim 11, wherein the cooling air blowing structure has holes formed in the plate according to the arrangement of the weak heat resistant components of the printed circuit board. 13. The reflow apparatus according to claim 12, further comprising a nozzle for adjusting a distance to a cooled portion of the printed circuit board. 14. The reflow device according to claim 11, wherein as a cooling air blowing structure, an air blowing hole is formed in a block of metal or resin, and a cooling air blowing distance is adjusted by engraving the block according to the height of the inserted mounting component. . 15. A heating unit including a preheating unit and a main heating unit for heating a printed circuit board on which an electronic component is mounted, and a carrying unit for carrying the printed circuit board. A heating source that preheats the reflow soldering surface on one surface, and an exhaust duct that exhausts the atmosphere on the other surface of the printed circuit board that is not particularly forcibly heated in a direction substantially parallel to the printed circuit board and substantially perpendicular to the transport direction,
The reflow device according to any one of claims 4 to 14, wherein the reflow device is provided on the other surface side of the printed circuit board and is provided with an outside air intake port for keeping the other surface at a low temperature.