JPH09283673A - Heat sink structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipating surface area of a heat sink by using a planar type heat sink in contrast to the conventionally realized three dimensional heat dissipation in a space above an integrated circuit plane by joining thermal conduction blocks whose heights being set separately to integrated circuits and by laminating a plate type heat sink on the integrated circuits in correspondence with above-mentioned heights so that the heat sink is counterposed with a logic package. SOLUTION: A plurality of integrated circuits 2 are mounted on a logic package 1 and thermal conduction blocks 3 are joined to the integrated circuits at the surfaces thereof, and the thermal conduction blocks 3 are provided with fixing means such as female screws on the surface thereof joining with the thermal conductor 3 and on the other surface thereof. The thermal conduction blocks 3 whose heights being set separately are joined on a plurality of integrated circuit 2 and a plate type heat sink 6 is stacked on the integrated circuits 2 in correspondence with above-mentioned heights so that the heat sink 6 is counterposed with a logic package 1. Thus, the heat dissipating surface area of the heat sink 6 can be realized in a planar form, the mounting efficiency of the logic package can be improved, the shape of the heat sink 6 can be simplified, and the cost can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink structure, and more particularly to a cooling structure for a logic package suitable for use in a computer or the like.

[0002]

2. Description of the Related Art Conventionally, in the structure of a heat sink for heat dissipation of an integrated circuit mounted on a logic package, in order to improve heat dissipation efficiency, for example, as a heat dissipation fin, for example, Japanese Patent Laid-Open No. 3-2.
Japanese Patent No. 11863 proposes a shape as shown in FIGS. 3 and 4 and is generally adopted. FIG. 3 is a perspective view of a conventional ceramic package with a heat sink proposed in the above publication, and FIG. 4 is a sectional view thereof. Referring to FIGS. 3 and 4, this conventional package with a heat sink has a chip 12 adhered on a ceramic substrate 11, a cap 16 adhered on the ceramic substrate 11 so as to cover the chip 12, and The heat sink 17 is adhered onto the cap 16, and the heat sink 17 has a plurality of columns 17a to which horizontal fins 17b are attached in parallel on the heat radiation surface.

The reason why such a heat sink structure for heat dissipation is used is that the mounting arrangement of integrated circuits in the logic package is becoming denser year by year for the purpose of ensuring performance and achieving low cost, and the heat dissipation surface area of the heat sink is ensured. In order to do so, it is necessary to adopt a method of securing the surface area of the fins 17b of the heat sink 17 as needed as shown in FIG. 3 in the space directly above, that is, on the surface of each integrated circuit.

[0004]

However, the first problem with the above-described conventional heat sink structure for heat dissipation is to secure the required heat dissipation surface area of the fins of the heat sink in the space above the surface of the integrated circuit. Is becoming difficult.

This is due to the recent downsizing and high performance of computers, and it has become necessary to make the mounting interval of a plurality of logic packages mounted in a housing as narrow as possible. This is because the usable range in the space above the surface of the integrated circuit (surface mounting height) has decreased as in the prior art.

The second problem with the conventional heat sink structure for heat dissipation is that the structure of the heat sink is complicated and the low cost cannot be expected.

The reason for this is that in the conventional heat sink structure for heat dissipation, as described above, the shape of the heat dissipation fin with good heat dissipation efficiency must be realized in the space on the surface of the integrated circuit. Due to the need to increase the heat dissipation surface area.

Therefore, the present invention has been made in view of the above circumstances, and an object thereof is to realize a heat dissipation surface area of a heat sink which is three-dimensionally realized in a space on the surface of an integrated circuit with a flat type. Another object of the present invention is to provide a heat sink structure capable of improving the packaging efficiency of the logic package, simplifying the shape of the heat sink, and reducing the cost.

[0009]

In order to achieve the above-mentioned object, the heat sink structure of the present invention joins a heat conduction block whose height is individually set on a plurality of integrated circuits mounted on a logic package. A heat sink having a flat plate shape is stacked corresponding to the height of the heat conduction block so as to face the logic package.

Further, the heat sink structure of the present invention is provided with a heat conduction block formed by joining one end face on the surface of a plurality of integrated circuits mounted on the logic package, and each of the plurality of integrated circuits. The heat sink members corresponding to the one or more heat conduction blocks are stacked by stacking flat heat sink members individually provided facing the logic package according to the difference in height of the other end surface of the heat conduction block. If there is another heat conduction block having a height higher than that of the heat conduction block corresponding to the self heat sink member, the heat conduction block has means for fixing one or a plurality of heat conduction blocks corresponding to the heat sink member. It is characterized by having an opening for inserting the conductive block into the upper layer.

In the present invention, the area of the heat sink is substantially equal to the area of the logic package.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1 and 2 are diagrams for explaining the embodiment of the present invention.

In the embodiment of the present invention, a heat conductor 3 such as a solder is vertically joined to the surface of the logic package 1 and a plurality of integrated circuits 2 mounted on the logic package 1 so as to conduct heat. A heat conduction block 3 provided with fixing means such as an internal screw 5 is provided on the joint surface with the body and the other end surface. The heat conduction block 3 has an integrated circuit whose height in the vertical direction with respect to the integrated circuit surface is individually set. It is prepared separately for each. Further, it is provided with one or a plurality of layers of flat plate heat sinks 6 each having an area substantially equal to that of the logic package 1 and prepared individually for each integrated circuit. Each heat sink 6 is provided on an end face of an arbitrary heat conductor. A fixing hole 7 that faces the formed female screw and an interference escape hole 8 through which another heat conductor penetrates are provided.

In the embodiment of the present invention, by adopting the above structure, it is possible to secure a large heat dissipation surface area substantially equal to that of the logic package without being affected by the arrangement of other integrated circuits in the logic package. .

Further, in the embodiment of the present invention, since it is not necessary to occupy the space on the surface of the integrated circuit so much, the mounting interval of each plurality of logic packages can be narrowed, the performance of the device can be improved, and the device can be miniaturized. Can contribute to.

Furthermore, according to the embodiment of the present invention, the cost of the heat sink can be reduced because the shape of the heat sink can be greatly simplified.

[0017]

Embodiments of the present invention will now be described in detail with reference to the drawings.

Referring to FIGS. 1 and 2, it is assumed that four integrated circuits 2, 2 ', 2 ", 2"' are mounted on the logic package 1. Although FIG. 1 and FIG. 2 show a configuration in which four integrated circuits are mounted on the logic package 1, it goes without saying that the present invention is not limited to this configuration.

As shown in FIG. 1A as a plan view and a view taken along the line AA ', a preset heat conduction block 3 is soldered to the integrated circuit 2 mounted on the logic package 1. ing. The heat conduction block 3 on the integrated circuit 2 is provided with at least one female screw 5 on the end surface opposite to the solder joint surface.

Referring to FIG. 1A, the heat sink 6
Has a surface area substantially equal to that of the surface of the logic package 1, is fixed to the heat conduction block 3 on the integrated circuit 2 so that the fixing holes face each other, and is fixed to the female screw 5 of the heat conduction block 3 with the male screw 7.

In this heat sink 6, in addition to the fixing holes for the heat conduction block 3, other heat conduction blocks 3 ', 3 ",
Interference escape holes (openings) 8, 8 ', 8 "having a predetermined clearance for avoiding interference with 3""are provided, and heat conduction heat on the integrated circuits 2', 2", 2 "'is provided. The conductive blocks 3 ′, 3 ″, 3 ″ ″ pass through the interference escape holes 8, 8 ′, 8 ″ of the heat sink 6.

In the embodiment of the present invention, the heat sinks 6, 6 ', 6 "and 6"' are laminated corresponding to the heat conduction blocks 3, 3 ", 3""3 having different heights. Are mounted as described above to form a cooling structure of the logic package.

That is, referring to FIG. 1B, the heat sink 6'of the second layer has an area substantially equal to that of the surface of the logic package 1 and has a fixing hole in the heat conduction block 3'on the integrated circuit 2 '. Are superposed so as to face each other and fixed to the female screw 5'of the heat conduction block 3'with the male screw 7 '. The heat sink 6'has an interference escape hole (opening) 8'having a predetermined clearance for avoiding interference with other heat conduction blocks 3 ", 3"'in addition to the fixing hole with the heat conduction block 3'. , 8 "are provided for the integrated circuit 2",
The heat conduction blocks 3 "and 3""on the 2""are inserted through the interference escape holes 8'and 8" of the heat sink 6 '.

Similarly, referring to FIG. 2A, the heat sink 6 "of the third layer also has an area substantially equal to the surface of the logic package 1 and is fixed to the heat conduction block 3" on the integrated circuit 2 ". The holes are stacked so that they face each other, and the heat conduction block 3 "
It is fixed to the female screw 5 ″ of FIG. The heat sink 6 ″ has an interference escape hole (opening) 8 ″ ″ having a predetermined clearance for avoiding interference with another heat conduction block 3 ″ ″, in addition to a fixing hole for the heat conduction block 3 ″.
Is provided, the heat conduction heat conduction block 3 ″ ″ on the integrated circuit 2 ″ ″ is inserted through the interference escape hole 8 ″ ″ of the heat sink 6 ″, and as shown in FIG. The block 3 "" is superposed on the heat sink 6 "" of the fourth layer so that its fixing holes face each other, and is fixed to the female screw 5 "" of the heat conduction block 3 "" by the male screw 7 "".

[0025]

As described above, according to the present invention,
It is possible to have a wide area almost equal to that of the logic package, and it is possible to efficiently dissipate the heat generated by the integrated circuit.

According to the present invention, a heat sink having an escape hole which does not interfere with a heat conduction block on another integrated circuit is attached so as to be stacked on the logic package, so that a necessary heat radiation surface area is sufficiently secured. It becomes possible to do.

Further, according to the present invention, since the shape of the heat sink can be greatly simplified, low cost can be realized.

This is because, in the present invention, a large heat dissipation area can be secured without being affected by the arrangement of the integrated circuits in the logic package.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing an embodiment of the present invention.

FIG. 3 is a perspective view showing an example of a conventional technique.

FIG. 4 is a cross-sectional view showing an example of a conventional technique.

[Explanation of symbols]

 1 Logic Package 2 Integrated Circuit 3 Thermal Conduction Block 4 Solder 5 Female Thread of Thermal Conduction Block 3 6 Heat Sink

Claims (5)

[Claims] 1. A heat conduction block, the height of which is individually set, is bonded onto a plurality of integrated circuits mounted on a logic package, and a flat heat sink is provided corresponding to the height of the heat conduction block. A heat sink structure, wherein the heat sink structure is stacked so as to face the logic package. 2. A logic package having a plurality of integrated circuits mounted thereon, and a fixing member on the surfaces of the plurality of integrated circuits which are vertically bonded to each other by a heat conductor and which are fixed to the bonding surface and the other end surface. A plurality of heat conduction blocks; a fixing hole having an area equal to that of the logic package and facing one or a plurality of the heat conduction blocks of the plurality of heat conduction blocks; and a hole through which another heat conduction block penetrates. A heat sink structure comprising: one or a plurality of plate-shaped heat sinks provided. 3. The heat sink structure according to claim 2, wherein the heat conduction block is provided with a screw member on the other end surface, and is screwed by being superposed on the corresponding heat sink in the fixing hole. 4. A heat conduction block comprising a plurality of integrated circuits mounted on a logic package, one surface of which is joined to the surface of the integrated circuit, the other heat conduction blocks being provided for each of the plurality of integrated circuits. Plate-shaped heat sink members individually provided facing the logic package according to the height difference of the side end face are stacked, and the heat sink member corresponding to the one or the plurality of heat conduction blocks corresponds to its own heat sink member. Or, if there is a means for fixing a plurality of heat conduction blocks and there is another heat conduction block whose height is higher than the heat conduction block corresponding to the heat sink member, the heat conduction block is inserted into the upper layer. A heat sink structure, which is provided with an opening for. 5. The heat sink structure according to claim 4, wherein the area of the heat sink is substantially equal to the area of the logic package.