JPH09283361A - Laminated coil - Google Patents
Laminated coilInfo
- Publication number
- JPH09283361A JPH09283361A JP8125182A JP12518296A JPH09283361A JP H09283361 A JPH09283361 A JP H09283361A JP 8125182 A JP8125182 A JP 8125182A JP 12518296 A JP12518296 A JP 12518296A JP H09283361 A JPH09283361 A JP H09283361A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- peripheral side
- coil
- terminal
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は高磁場に設置して磁
力によって誘導される電力を得るための積層型コイル
や、高磁場を必要とする装置に用いられる積層型コイル
に関し、特には、小さなスペースに配置できて、かつ、
コイルの巻き数が多く、耐熱性、強度に優れている積層
型コイルに関する。さらに詳しくは、リニアモーターカ
ーを浮上させるための磁束を利用して該リニアモーター
カーに使用する電力の一部を発電し供給する積層型コイ
ルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated coil installed in a high magnetic field to obtain electric power induced by a magnetic force, and a laminated coil used in an apparatus requiring a high magnetic field. Can be placed in a space, and
The present invention relates to a laminated coil that has a large number of coil turns and is excellent in heat resistance and strength. More specifically, the present invention relates to a laminated coil that uses a magnetic flux for levitating a linear motor car to generate and supply a part of electric power used for the linear motor car.
【０００２】[0002]
【従来の技術】磁束をコイルで切ることにより発電する
ことは周知であるが、通常のコイルは絶縁した導線をコ
アに捲いた形状のものであって立体的に大きい形状をし
ている。発電量を大きくするためコイルの線の捲き量を
大きくすればますます大きな形状とならざるを得ない。
狭い空間に巻き量の大きいコイルを配置することは困難
であった。2. Description of the Related Art It is well known that electric power is generated by cutting a magnetic flux with a coil, but an ordinary coil has a shape in which an insulated conductive wire is wound around a core and has a three-dimensionally large shape. Increasing the winding amount of the coil wire in order to increase the amount of power generation will inevitably result in a larger shape.
It was difficult to arrange a coil having a large winding amount in a narrow space.
【０００３】[0003]
【発明が解決しようとする課題】本発明は小さなスペー
スに設置可能な厚さの薄い積層型コイルであって、しか
も、コイル巻き数が多くて、効率がよく、耐熱性、強度
に優れている積層型コイルを提供するものである。特に
は高磁場の狭いスペースに設置されて、発電する積層型
発電コイルである。リニアモーターカーは磁界を利用
し、車体を浮上させて摩擦抵抗を減少し走行するもので
あるが、車体の周囲には強い磁界が形成され、濃密な磁
束が存在するので、本発明はこの磁束を利用し発電を行
い、その電力をリニアモーターカーの必要とする電力の
一部に利用するための積層型コイルを提供するものであ
る。リニアモーターカーの外側面に磁束を充分に利用す
る大型のコイルを設置することは車輌の構造から不可能
であり、特にコアに導線を捲いた形状のコイルでは充分
な集電を行う大きさのコイルとすることができない。ま
た、高磁場で大きい電力を得るため発電時に発生する応
力に耐える強度が必要であり、また発生する熱に耐える
耐熱性が要求され、使用温度１５５℃に耐える必要があ
る。この使用温度は、絶縁材料使用区分Ｆ種に相当す
る。DISCLOSURE OF THE INVENTION The present invention is a thin laminated coil which can be installed in a small space, and has a large number of coil turns, is efficient, and is excellent in heat resistance and strength. A laminated coil is provided. In particular, it is a laminated power generating coil that is installed in a narrow space with a high magnetic field to generate power. A linear motor car uses a magnetic field to levitate the vehicle body to reduce frictional resistance for running, but a strong magnetic field is formed around the vehicle body, and a dense magnetic flux exists. It is intended to provide a laminated coil for generating electric power by utilizing the electric power and utilizing the electric power for a part of the electric power required by the linear motor car. It is not possible to install a large coil that fully utilizes the magnetic flux on the outer surface of the linear motor car because of the structure of the vehicle. Especially, a coil with a wire wound around the core has a size sufficient to collect current. Cannot be a coil. Further, in order to obtain a large amount of electric power in a high magnetic field, strength that can withstand the stress generated during power generation is required, and heat resistance that can withstand the heat generated is required, and it is necessary to withstand a use temperature of 155 ° C. This use temperature corresponds to the insulating material use category F class.
【０００４】[0004]
【課題を解決するための手段】本発明は、 「１． Ａ．ａ．ガラスクロスに耐熱性樹脂を含浸し乾
燥させたプリプレグの片面に銅板を積層し加熱、加圧し
て得た銅張り積層板の銅部をエッチングして、渦巻状の
１本または複数本の回路を形成し、この回路の外周側端
部に回路の外周側に突出する、出力または入力端子とな
る１個の外周側端子を配設し、 ｂ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた表側単層コイル状の回路と、 Ｂ．ｃ．同様に銅部をエッチングして、形成した１本ま
たは複数本の渦巻状の回路の夫々の外周側端部に回路の
外周側に突出する、出力または入力端子となる１個の外
周側端子を配置し、 ｄ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた裏側単層コイル状の回路とからなり、 Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側コイ
ル状の単層回路または複数層重ねた複層回路と裏側コイ
ル状の単層回路または複数層重ねた複層回路を、 Ｄ．各銅面の間にガラスクロスに耐熱性樹脂を含浸し乾
燥させ内周側端子部分を削除して切り抜き部としたプリ
プレグを挾んで加熱、加圧して端子部に向かって流れる
樹脂を端子の近傍の銅板に配置した樹脂流入孔に収容し
て内周外周両側端子を非被覆状端子とし、夫々の回路間
をプリプレグから流れる樹脂で充填して絶縁し、コイル
積層体の重なった内周側端子および外周側端子をそれぞ
れ溶接して表裏の回路を連結してなる、積層型コイル。 ２． Ａ．ａ．ガラスクロスに耐熱性樹脂を含浸し乾燥
させたプリプレグの片面に銅板を積層し加熱、加圧して
得た銅張り積層板の銅板をエッチングして、渦巻状の１
本または複数本の回路を形成し、この渦巻状の回路の夫
々の外周側端部には外周側に突出した出力端子または入
力端子となる外周側端子を設け、 ｂ．一方の外周側端子に接続する回路の内周側端部に
は、端子の近傍に樹脂流入孔を設けた裏面側回路との接
続端子となる内周側端子を配置し、 ｃ．他方の外周側端子に接続する回路は延長して隣の位
置に渦巻状の１本または複数本の回路を形成し、この回
路の内周側端部には、端子の近傍に樹脂流入孔を設けた
接続端子となる内周側端子を配置した表側単層コイル状
の回路と、 Ｂ．表側単層コイルと同様に銅板をエッチングして、夫
々の内周側端部に、端子の近傍に樹脂流入孔を設けた接
続端子となる内周側端子を配置した、渦巻状の１本また
は複数本の回路を形成し、、両内周側端子に接合する回
路を延長して隣の位置に渦巻状の１本または複数本の回
路を形成し、この回路の内周側端部にも、端子の近傍に
樹脂流入孔を設けた接続端子となる内周側端子を配置し
た裏側単層コイル状の回路の Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側コイ
ル状の単層回路または複数層重ねた複層回路と裏側コイ
ル状の単層回路または複数層重ねた複層回路を、 Ｄ．各銅面の間にガラスクロスに耐熱性樹脂を含浸し乾
燥させ内周側端子部分を削除して切り抜き部としたプリ
プレグを挾んで加熱、加圧して端子部に向かって流れる
樹脂を端子の近傍の銅板に配置した樹脂流入孔に収容し
て内周外周両側端子を非被覆状端子とし、夫々の回路間
をプリプレグから流れる樹脂で充填して絶縁し、コイル
積層体の重なった内周側端子および外周側端子をそれぞ
れ溶接して表裏の回路を連結してなる、積層型コイル。 ３． Ａ．ａ．ガラスクロスに耐熱性樹脂を含浸し乾燥
させたプリプレグの両面に銅板を積層し加熱、加圧して
得た銅張り積層板の表面側の銅部をエッチングして、渦
巻状の１本または複数本の回路を形成し、この回路の外
周側端部に回路の外周側に突出する、出力または入力端
子となる１個の外周側端子を配設し、 ｂ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた表側単層コイル状の回路と、 Ｂ．ｃ．同様に裏面側の銅部をエッチングして、形成し
た１本または複数本の渦巻状の回路の夫々の外周側端部
に回路の外周側に突出する、出力または入力端子となる
１個の外周側端子を配置し、 ｄ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた裏側単層コイル状の回路とからなり、 Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側単層
コイル状の回路と裏側単層コイル状の回路を対向させて
重ねた回路の複数層を、 Ｄ．銅面の間にガラスクロスに耐熱性樹脂を含浸し乾燥
させ内周側端子部分を削除して切り抜き部としたプリプ
レグを挾んで加熱、加圧して端子部に向かって流れる樹
脂を端子の近傍の銅板に配置した樹脂流入孔に収容して
内周外周両側端子を非被覆状端子とし、夫々の回路間を
プリプレグから流れる樹脂で充填して絶縁したコイル積
層体の重なった内周側端子を溶接して表裏の回路を連結
し、必要により外周側端子も溶接してなる、積層型コイ
ル。 ４． Ａ．ａ．ガラスクロスに耐熱性樹脂を含浸し乾燥
させたプリプレグの両面に銅板を積層し加熱、加圧して
得た銅張り積層板の表面側の銅板をエッチングして、渦
巻状の１本または複数本の回路を形成し、この渦巻状の
回路の夫々の外周側端部には外周側に突出した出力端子
または入力端子となる外周側端子を設け、 ｂ．一方の外周側端子に接続する回路の内周側端部に
は、端子の近傍に樹脂流入孔を設けた裏面側回路との接
続端子となる内周側端子を配置し、 ｃ．他方の外周側端子に接続する回路は延長して隣の位
置に渦巻状の１本または複数本の回路を形成し、この回
路の内周側端部には、端子の近傍に樹脂流入孔を設けた
裏面側回路との接続端子となる内周側端子を配置した表
側単層コイル状の回路と、 Ｂ．表側単層コイルと同様に裏面側の銅板をエッチング
して、夫々の内周側端部に、端子の近傍に樹脂流入孔を
設けた表面側回路との接続端子となる内周側端子を配置
した、渦巻状の１本または複数本の回路を形成し、両内
周側端子に接合する回路を延長して隣の位置に渦巻状の
１本または複数本の回路を形成し、この回路の内周側端
部にも、端子の近傍に樹脂流入孔を設けた表面側回路と
の接続端子となる内周側端子を配置した裏側単層コイル
状の回路の Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側単層
コイル状の回路と裏側単層コイル状の回路を対向させて
重ねた回路の複数層を、 Ｄ．銅面の間にガラスクロスに耐熱性樹脂を含浸し乾燥
させたプリプレグから端子部分を削除したプリプレグを
挾んで加熱、加圧して端子部に向かって流れる樹脂を端
子の近傍の銅板に配置した樹脂流入孔に収容して内周外
周両側端子を非被覆状端子とし、夫々の回路間をプリプ
レグから流れる樹脂で充填して絶縁したコイル積層体の
重なった内周側端子を夫々溶接して表裏の回路を連結し
必要に応じて外周側端子も溶接してなる、積層型コイ
ル。 ５． 耐熱性樹脂がビス−マレイミド−トリアジン樹脂
である、１項ないし４項のいずれか１項に記載された積
層型コイル。 ６． 銅部をエッチングして形成した回路が２本の回路
である、１項ないし５項のいずれか１項に記載された積
層型コイル。 ７． 表側コイル状の回路と裏側コイル状の回路が裏返
した形状の関係にある、１項ないし６項のいずれか１項
に記載された、積層型コイル。 ８． 銅張り積層板の銅部をエッチングして、コイルを
形成する際に回路の外周部および／または内周部にコイ
ルとは接触しないコイル外周とほぼ同形状の銅板で形成
された絶縁保護枠を配置した、１項ないし７項のいずれ
か１項に記載された、積層型コイル。 ９． 積層型集電コイルの外周部および／または内周部
に絶縁体で形成した保護枠体を配設した、１項ないし８
項のいずれか１項に記載された、積層型コイル。 １０． 単層コイルの回路の内周部や外周部の不要のガ
ラスクロスと端子のガラスクロスと樹脂を除去してから
プリプレグと加熱、加圧し積層した、１項ないし９項の
いずれか１項に記載された、積層型コイル。 １１． 銅部をエッチングして形成した回路間を耐熱性
樹脂で予め充填して絶縁してから積層した、１項ないし
１０項のいずれか１項に記載された積層型コイル。」に
関する。MEANS FOR SOLVING THE PROBLEMS The present invention provides "1. Aa. A copper-clad laminate obtained by laminating a copper plate on one surface of a prepreg obtained by impregnating a glass cloth with a heat-resistant resin and drying, and heating and pressing. The copper part of the plate is etched to form one or more spiral circuits, and one outer peripheral side that serves as an output or input terminal projects to the outer peripheral side of the circuit at the outer peripheral side end of this circuit. A front side single-layer coil-shaped circuit provided with terminals and b. Inner peripheral side terminals which are circuit connecting terminals having resin inflow holes and which are respectively coupled to inner peripheral side end portions of one or a plurality of circuits. Bc, the copper portion is similarly etched to form an output or input terminal projecting to the outer peripheral side of the circuit at each outer peripheral side end of the formed spiral circuit or spiral circuits. Arrange the outer peripheral side terminals and connect them to the inner peripheral side end of one or more circuits. And a backside single-layer coil-shaped circuit having an inner peripheral side terminal which is a circuit connecting terminal having a resin inflow hole, and C. A cutout portion is formed by removing the glass cloth portion of the base body near the inner peripheral side terminal. D. Between the copper surfaces, the front coiled single layer circuit or multiple layered multilayer circuit and the back coiled single layer circuit or multiple layered multilayer circuit A glass cloth was impregnated with a heat-resistant resin, dried to remove the inner peripheral side terminal part, sandwiched the prepreg that was cut out and heated and pressed to place the resin flowing toward the terminal part on the copper plate near the terminal The inner and outer peripheral side terminals are housed in resin inflow holes to form uncoated terminals, and the resin flowing from the prepreg is filled between the circuits to insulate the terminals, and Weld each and connect the front and back circuits 2. Laminated coil 2. Aa Glass cloth impregnated with heat-resistant resin is laminated with a copper plate on one side of the prepreg and heated and pressed to etch the copper plate of the copper-clad laminate , Spiral one
A plurality of circuits or a plurality of circuits are formed, and each spiral-shaped circuit is provided with an outer peripheral side terminal that is an output terminal or an input terminal protruding toward the outer peripheral side at each outer peripheral side end, b. At the inner circumference side end of the circuit connected to one outer circumference side terminal, an inner circumference side terminal serving as a connection terminal with the back side circuit having a resin inflow hole provided in the vicinity of the terminal is arranged, and c. The circuit connected to the other outer peripheral side terminal is extended to form one or more spiral circuits at the adjacent positions. At the inner peripheral side end of this circuit, a resin inflow hole is provided near the terminal. A front-side single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals are provided, and B. Similar to the front-side single-layer coil, the copper plate is etched, and the inner peripheral side terminals serving as the connection terminals having the resin inflow holes provided in the vicinity of the terminals are arranged at the respective inner peripheral side end portions of one spiral or Form a plurality of circuits, extend the circuit that is connected to both inner circumference side terminals, and form one or more spiral circuits at the adjacent positions. Also at the inner circumference side end of this circuit. C. of a backside single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals provided with resin inflow holes in the vicinity of the terminals are arranged. A single-layer circuit in which the glass cloth portion of the base body near the inner peripheral side terminal is removed to form a cutout portion is a front coiled single-layer circuit or a multi-layered circuit in which multiple layers are stacked and a back coiled single layer. A circuit or a multi-layer circuit in which a plurality of layers are stacked, D. A glass cloth is impregnated with a heat-resistant resin between each copper surface, and the inner peripheral side terminal part is removed to sandwich the prepreg that has been cut out and heated and pressed to flow resin toward the terminal part near the terminal Inner and outer terminals on both sides of the inner and outer circumferences are covered with resin flowing from the prepreg to be insulated by accommodating in resin inflow holes arranged on the copper plate. A laminated coil in which front and rear circuits are connected by welding the outer peripheral side terminal and the outer peripheral side terminal. 3. A. a. A copper plate is laminated on both sides of a prepreg that is obtained by impregnating a glass cloth with a heat-resistant resin, and is heated and pressed to etch the copper portion on the surface side of the copper-clad laminate, and one or more spirals are formed. Forming a circuit, and arranging one peripheral side terminal projecting to the outer peripheral side of the circuit at the outer peripheral side end of the circuit and serving as an output or input terminal, b. A front-side single-layer coil-shaped circuit having inner peripheral side terminals, which are circuit connecting terminals having resin inflow holes, respectively coupled to inner peripheral side end portions of one or a plurality of circuits; c. Similarly, the copper portion on the back surface side is etched to form one or more spiral-shaped circuits, each of which has an outer peripheral end that protrudes toward the outer peripheral side of the circuit and has an outer periphery serving as an output or input terminal. Arranging side terminals, d. A back side single-layer coil-shaped circuit having inner peripheral side terminals which are circuit connecting terminals having resin inflow holes and which are respectively coupled to inner peripheral side end portions of one or a plurality of circuits; A circuit in which a front side single layer coil-shaped circuit and a back side single layer coil-shaped circuit are made to face each other by stacking a plurality of copper-clad laminates that are cut out by removing the glass cloth part of the substrate near the inner peripheral side terminal Multiple layers of D. A glass cloth is impregnated with a heat-resistant resin between copper surfaces, the inner peripheral side terminal part is removed, and the prepreg that is a cutout part is sandwiched and heated and pressed to flow the resin flowing toward the terminal part near the terminal. Welded the inner peripheral side terminals of the coil laminated body, which are housed in the resin inflow holes arranged on the copper plate and made both terminals on the inner peripheral side and outer peripheral side uncoated terminals, and filled between the circuits with resin flowing from the prepreg and insulated. Then, the laminated coil is formed by connecting the circuits on the front and back and welding the outer peripheral side terminals as necessary. 4. A. a. A copper plate is laminated on both sides of a prepreg that is obtained by impregnating glass cloth with a heat-resistant resin, and is heated and pressed to etch the copper plate on the surface side of the copper-clad laminate, and one or more spiral-shaped copper plates are etched. A circuit is formed, and an outer peripheral side terminal serving as an output terminal or an input terminal protruding toward the outer peripheral side is provided at each outer peripheral side end of the spiral circuit, b. At the inner circumference side end of the circuit connected to one outer circumference side terminal, an inner circumference side terminal serving as a connection terminal with the back side circuit having a resin inflow hole provided in the vicinity of the terminal is arranged, and c. The circuit connected to the other outer peripheral side terminal is extended to form one or more spiral circuits at the adjacent positions. At the inner peripheral side end of this circuit, a resin inflow hole is provided near the terminal. A front-side single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals with the provided rear side circuit are arranged, and B. Similar to the front side single layer coil, the copper plate on the back side is etched, and the inner peripheral side terminals, which are the connection terminals with the front side circuit with resin inflow holes near the terminals, are placed at each inner peripheral side end. And forming one or more spiral circuits, and extending the circuit joined to both inner peripheral side terminals to form one or more spiral circuits at the adjacent position. C. of the backside single-layer coil-shaped circuit in which the inner peripheral side terminal serving as a connection terminal with the front surface side circuit having the resin inflow hole provided in the vicinity of the terminal is also arranged at the inner peripheral side end portion. A circuit in which a front side single layer coil-shaped circuit and a back side single layer coil-shaped circuit are made to face each other by stacking a plurality of copper-clad laminates that are cut out by removing the glass cloth part of the substrate near the inner peripheral side terminal Multiple layers of D. A resin in which a resin is placed on a copper plate near the terminals by sandwiching the prepreg with the heat-resistant resin impregnated in a glass cloth between the copper surfaces and removing the terminal part from the prepreg The terminals on both the inner and outer circumferences are housed in the inflow holes to form uncoated terminals, and the inner terminals on the inner and outer sides of the coil laminate, which are insulated by filling the resin between the circuits with resin flowing from the prepreg, are welded. Laminated coil made by connecting circuits and welding outer peripheral side terminals if necessary. 5. The laminated coil according to any one of items 1 to 4, wherein the heat resistant resin is a bis-maleimide-triazine resin. 6. The laminated coil according to any one of items 1 to 5, wherein the circuit formed by etching the copper portion is two circuits. 7. The laminated coil according to any one of items 1 to 6, wherein the front-side coil-shaped circuit and the back-side coil-shaped circuit are in an inverted shape. 8. When the copper part of the copper-clad laminate is etched to form a coil, an insulation protection frame made of a copper plate that has almost the same shape as the coil outer circumference does not contact the coil at the outer and / or inner circumference of the circuit. The laminated coil according to any one of items 1 to 7, which is arranged. 9. 1 to 8, wherein a protective frame body made of an insulating material is arranged on the outer peripheral portion and / or the inner peripheral portion of the laminated type current collecting coil.
The laminated coil according to any one of items. 10. Item 10. The single-layer coil circuit according to any one of items 1 to 9, which is obtained by removing unnecessary glass cloth on the inner and outer peripheral parts, the glass cloth of the terminal and the resin, and then laminating by heating, pressurizing and prepreg. Laminated coil. 11. 11. The laminated coil according to any one of items 1 to 10, wherein a circuit formed by etching the copper portion is preliminarily filled with a heat resistant resin to insulate and then laminated. About.
【０００５】[0005]
【発明の実施の形態】本発明において、ガラスクロスに
耐熱性樹脂を含浸乾燥したプリプレグを用いるのは発電
中に発生する熱に耐えるためである。耐熱性の面から、
ビス−マレイミド−トリアジン樹脂が最適であった。従
来用いられている、エポキシ樹脂を用いたプリプレグで
は耐熱性が充分でないからである。ビス−マレイミド−
トリアジン以外の樹脂でもコイルの使用温度である１５
５℃に耐えることのできる絶縁材料使用区分Ｆ種に相当
ずるものは使用できる。銅板をエッチングしてコイル状
の回路を形成し、プリプレグを介して積層し、コイル内
周側の端子で回路を溶接したのは、コイルにおける導線
の捲数を平面的に多数回とするためである。コアに捲い
た形状では立体的に大きくなり、リニアモーターカーの
外壁のようなせまい外側に設置できない。銅板にエッチ
ングによりコイル状回路を形成すると、厚さの薄い、捲
数の多い回路が形成できる利点がある。回路には、コイ
ル内周側に内部端子を形成し、かつ、積層したときに、
コイル外周側に２個の外部端子が形成されるように構成
する。例えば、内部端子と外部端子を形成した表側単層
コイルと、この表側コイルを裏返した回路である裏側単
層コイルの２種類の単層コイルを重ねて用いるのであ
る。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the reason why a prepreg obtained by impregnating and drying a glass cloth with a heat resistant resin is used is to withstand heat generated during power generation. From the viewpoint of heat resistance,
The bis-maleimide-triazine resin was the optimum. This is because the heat resistance of the prepreg using the epoxy resin, which has been conventionally used, is not sufficient. Bis-maleimide-
Even with resins other than triazine, the operating temperature of the coil is 15
Insulating materials that can withstand 5 ° C and those corresponding to the use category F of the insulating materials can be used. The copper plate was etched to form a coil-shaped circuit, which was laminated via a prepreg, and the circuit was welded at the terminal on the inner circumference side of the coil in order to make the number of turns of the conductor wire in the coil two-dimensionally. is there. The shape wrapped around the core is three-dimensionally large and cannot be installed outside the small space such as the outer wall of a linear motor car. Forming a coil-shaped circuit on a copper plate by etching has an advantage that a circuit having a small thickness and a large number of turns can be formed. In the circuit, when the internal terminals are formed on the inner circumference side of the coil and they are stacked,
Two external terminals are formed on the outer peripheral side of the coil. For example, two types of single-layer coils, that is, a front-side single-layer coil having an internal terminal and an external terminal formed thereon and a back-side single-layer coil which is a circuit in which the front-side coil is turned upside down, are used.
【０００６】また、後に実施例で示すが、２個の内部端
子と２個の外部端子を形成した表側単層コイルと、２個
の内部端子のみを形成した裏側単層コイルを用いること
もでき、特に限定されるものではない。また、表側・裏
側の名称も、区別するためのものであり、どちらが表側
と決まっているものではない。また、回路を複数列に、
例えば２列や３列、４列等の複数列に分割することも、
導線の巻き数を増やすのに有効である。こうして形成さ
れた各コイルの回路の導体間に樹脂を充填して互いに絶
縁して単層コイルとする。絶縁樹脂としは、耐熱性の点
からガラスクロスの含浸に用いたビス−マレイミド−ド
リアジン樹脂が好ましい。回路間はプリプレグを挾んで
積層する時プリプレグから流れる耐熱性樹脂で充填され
て絶縁されるが、予め耐熱性樹脂で充填しておいても良
い。次に単層コイルを、裏側コイル面と単層コイルの表
側コイル面と対向させてその間に端子部等の不要部を除
いたプリプレグを挾み込んで複数層重ね加圧、加熱して
積層体とするのである。表側単層コイルと裏側単層コイ
ルの積層の順番は、特に限定されず、例えば交互に積層
してもよいが、表側コイルを一方にまとめて積層し、も
う一方に裏側コイルをまとめて積層した方が、積層しや
すく、また、外部端子が片側に積層されて外部端子間に
隙間が発生しないため、溶接が容易で望ましい。このよ
うにして、積層することにより内部端子は接合して導通
するのでコイルは一体となる。そして外部端子から電力
が取り出される。積層形成する際、端子に向かって樹脂
が流れると端子が絶縁され導通できなくなるので端子の
近傍の銅板は樹脂流入孔を配置し、積層形成時にプリプ
レグから端子に向かって流れて来た樹脂をここに収納し
て絶縁を防止する。特に内部端子には該流入孔が必要で
ある。Further, as will be shown later in embodiments, a front side single layer coil having two internal terminals and two external terminals and a back side single layer coil having only two internal terminals can be used. It is not particularly limited. Also, the names of the front side and the back side are for distinguishing, and which is not decided as the front side. In addition, circuits in multiple columns,
For example, you can divide it into multiple columns such as 2 columns, 3 columns, and 4 columns.
It is effective in increasing the number of turns of the conductor. A resin is filled between the conductors of the circuits of the coils thus formed and insulated from each other to form a single-layer coil. From the viewpoint of heat resistance, the insulating resin is preferably the bis-maleimide-driazine resin used for impregnating the glass cloth. Between the circuits, when the prepregs are sandwiched to be stacked, they are filled with a heat resistant resin flowing from the prepregs to be insulated, but may be filled with a heat resistant resin in advance. Next, the single-layer coil is made to face the back coil surface and the front coil surface of the single-layer coil, and a prepreg excluding unnecessary portions such as terminals is sandwiched between them to stack a plurality of layers, pressurize and heat the laminate. And The order of stacking the front-side single-layer coil and the back-side single-layer coil is not particularly limited, and may be stacked alternately, for example, but the front-side coil is stacked together on one side and the back-side coil is stacked together on the other side. This is preferable because it is easier to stack, and since the external terminals are stacked on one side and no gap is generated between the external terminals, welding is easy. In this way, by stacking the internal terminals, the internal terminals are joined and brought into conduction, so that the coil is integrated. Then, electric power is taken out from the external terminal. When laminating resin, if the resin flows toward the terminal, the terminal will be insulated and it will not be able to conduct electricity.Therefore, the copper plate near the terminal has a resin inflow hole, and the resin flowing from the prepreg toward the terminal at the time of laminating To prevent insulation. Especially, the inflow hole is necessary for the internal terminal.
【０００７】基材のプリプレグの両面に銅板を配置して
形成した両面銅張り積層板の夫々の銅面に表側コイルと
裏側コイルをエッチングにより配設し、これらの銅板の
複数枚をプリプレグを介して表側コイルと裏側コイルと
対向して積層して多層コイルとすることもでき、また両
面に表側回路または裏側回路を形成して表側または裏側
回路を夫々積層しこの表側回路層と裏側回路層を積層す
ることもできる。A front side coil and a back side coil are arranged by etching on each copper surface of a double-sided copper-clad laminate formed by arranging copper plates on both sides of a prepreg of a base material, and a plurality of these copper plates are passed through the prepreg. It is also possible to stack the front side coil and the back side coil so as to face each other to form a multi-layer coil, or to form the front side circuit or the back side circuit on both sides and stack the front side or the back side circuit respectively to form the front side circuit layer and the back side circuit layer. It can also be laminated.
【０００８】また、単層コイルの積層形成の際にコイル
の最外周の回路が、取扱中に治具や保護体等に触れて変
形を生じ絶縁不良を発生する危険があるので、回路の外
周を取りまく、外周とほぼ同一形状の枠体を回路のエッ
チング形成に同時に形成して配置することが好ましい。
この枠体は回路とは接触せず、絶縁されている。万一単
層コイルの取扱中に治具等に触れてもこの枠があるので
回路の絶縁は保護される。これにより製品の歩留まりが
著しく向上する。Further, when a single-layer coil is laminated, the outermost circuit of the coil may be deformed by touching a jig or a protective member during handling, resulting in insulation failure. Therefore, it is preferable to form and arrange a frame body having substantially the same shape as the outer periphery at the same time as the circuit etching formation.
This frame does not contact the circuit and is insulated. Even if a jig or the like is touched during handling of the single-layer coil, the frame protects the insulation of the circuit. This significantly improves the product yield.
【０００９】単層コイルを積層した積層コイルの外周に
は絶縁体で形成した保護枠体を配設し、積層コイルの取
扱時の破損や変形を防止する。積層コイルは使用時に大
きな応力を発生するため、保護体を設置して強度を増す
のである。A protective frame body made of an insulating material is provided around the outer periphery of the laminated coil in which the single-layer coils are laminated to prevent damage or deformation during handling of the laminated coil. Since the laminated coil generates a large amount of stress during use, a protective body is installed to increase the strength.
【００１０】また、積層型コイルは、使用時に熱膨張し
て、寸法が変化するため、設置する場合に、別に作成し
た、設置板に寸法変化を吸収できるように取り付けるこ
とが好ましい。例えば、積層型コイルのコイル内周部の
保護体に余裕を持たせた孔径のボルト孔を設置し、設置
板にボルトで取り付けるのである。なお、設置板も、保
護体と同様、プリプレグ積層体で形成することが好まし
い。銅張り積層板は銅板とガラスクロスに耐熱樹脂を含
浸させたプリプレグとを積層して高温、高圧条件下にし
て数時間おき、樹脂を硬化させて一体化させることによ
り得ることができる。Since the laminated coil undergoes thermal expansion during use to change its dimensions, it is preferable to attach it to a separately prepared installation plate so as to absorb the dimensional changes when it is installed. For example, a bolt hole having a hole diameter with a margin is installed in a protector on the inner circumference of the laminated coil, and the bolt is attached to the installation plate. The installation plate is also preferably formed of a prepreg laminated body, like the protective body. The copper-clad laminate can be obtained by laminating a copper plate and a prepreg in which glass cloth is impregnated with a heat-resistant resin, and leaving the resin for several hours under high-temperature and high-pressure conditions to cure and integrate the resin.
【００１１】単層コイルは上記の銅張り積層板の銅板を
エッチングして渦巻状の回路を形成して作成する。銅板
はコイル状の回路を形成しても基板のプリプレグが積層
されているため姿勢安定性は優れており取扱が容易であ
る。回路には、積層される回路間が内周側端子で溶接で
き、外周側に２個の外周側端子が形成できるように内周
側端子と外周側端子を配設する。単層コイルに積層され
ているプリプレグの回路外周部や内周部の端子近傍プリ
プレグのみの部分は端子の溶接を行うためにカッター等
で除去し中空の空洞状とする。また、端子部に積層され
ているプリプレグも後に端子間を溶接するため除去して
おく必要がある。The single-layer coil is formed by etching the copper plate of the above copper-clad laminate to form a spiral circuit. The copper plate has excellent posture stability and is easy to handle because the prepreg of the substrate is laminated even if a coil-shaped circuit is formed. The circuit is provided with an inner peripheral side terminal and an outer peripheral side terminal so that the laminated circuits can be welded at the inner peripheral side terminal and two outer peripheral side terminals can be formed on the outer peripheral side. Portions of the prepreg laminated on the single-layer coil, only the prepreg near the terminal in the outer peripheral portion and the inner peripheral portion of the circuit, are removed by a cutter or the like so as to weld the terminal, and are made into hollow cavities. Further, the prepreg laminated on the terminal portion also needs to be removed in order to weld the terminals later.
【００１２】不要部のブリプレグを除去した単層コイル
を不要部を除去したほぼ同形状のプリプレグとを挟んで
積層する。このプリプレグは単層コイル間を絶縁して接
着させるためと、強度を備えるためのものである。この
積層体をオートクレーブ等で高温、高圧条件下に数時間
保ち、樹脂を硬化させて一体化させる。この硬化工程で
回路の導線間はプリプレグから流出する樹脂により充填
され絶縁される。内周側端子に樹脂流入孔を設けること
により、加熱、加圧時に端子部に向かって流出してくる
樹脂を該孔に収容して、端子間が絶縁されるトラブルを
防止することができる。The single layer coil from which the prepreg of the unnecessary portion is removed is laminated with the prepreg from which the unnecessary portion is removed having substantially the same shape. This prepreg is for insulating and adhering between the single-layer coils and for providing strength. This laminated body is kept under high temperature and high pressure conditions for several hours in an autoclave or the like to cure the resin and integrate it. In this curing step, the space between the conductors of the circuit is filled and insulated by the resin flowing out from the prepreg. By providing the resin inflow hole in the inner peripheral side terminal, the resin flowing out toward the terminal portion at the time of heating and pressurizing can be accommodated in the hole, and the trouble of insulation between the terminals can be prevented.
【００１３】次いで、端子部を溶接して積層コイルを得
ることができる。内周側端子部、コイル内周部の不要な
プリプレグが除去され中空の空洞状とされているため問
題なく端子部に溶接治具を挿入して溶接することができ
る。積層コイルのコイル外周やコイル内周の空洞部、上
下面には強度を増大するために保護体を設置することが
望ましい。保護体はプリプレグの積層体を必要な形状に
形成してコイルのそれぞれの位置に配置し、オートクレ
ーブ等で高温、高圧条件下に保って数時間おき、樹脂を
硬化させて一体化させて形成することができる。Next, the terminal portion can be welded to obtain a laminated coil. Since unnecessary prepregs on the inner peripheral side terminal portion and the coil inner peripheral portion are removed to form a hollow cavity, a welding jig can be inserted and welded to the terminal portion without any problem. It is desirable to install a protector on the outer circumference of the laminated coil, the cavity on the inner circumference of the coil, and the upper and lower surfaces in order to increase the strength. The protector is formed by forming a laminate of prepregs in the required shape and arranging them at each position of the coil, keeping them under high temperature and high pressure conditions in an autoclave etc. for several hours and then curing and integrating the resin. be able to.
【００１４】[0014]
【実施例】本発明の実施例を図面に基づいて説明する。
図１と図２は本発明の実施例の単層コイルの平面図であ
る。図１は表側単層コイル、図２は裏側単層コイルであ
る。An embodiment of the present invention will be described with reference to the drawings.
1 and 2 are plan views of a single layer coil according to an embodiment of the present invention. 1 is a front side single layer coil, and FIG. 2 is a back side single layer coil.
【００１５】表側単層コイル１と裏側単層コイル２は形
状が表裏逆の関係にある。本実施例では表側単層コイル
１と裏側単層コイル２を夫々４層間にプリプレグを介在
させて積層し表側単層コイル１の内周側端子４と裏側単
層コイル２の内周側端子４を互いに一体に溶接して積層
コイルを形成するのである。図１の表側単層コイル１
は、プリプレグ６の片面に積層した銅板をエッチングし
て形成された渦巻状の回路３が配置されている。この回
路の外周側端部には外周側端子５が設けられ、また内周
側端子には内周側端子４が設けられている。この実施例
では回路はエッチング時に分割線８で２分割されてい
る。これは回路の巻数を多くするためで、この分割線８
には積層時にプリプレグから流れる樹脂が流入し絶縁さ
れる。勿論、積層前に樹脂を充填して絶縁しても良い。
回路は必要に応じて３分割、４分割等所望の数に分割で
きる。各回路の内周側端部には内周側端子４が設けられ
ている。内周側端子には樹脂流入口７が設けられてお
り、積層時に、プリプレグから流れ出す樹脂をこの孔に
流入させて内周側端子に流れるのを防ぎ端子が絶縁され
ないようにする。プリプレグ６の内周側端子の周辺部は
裁断して中空状にしてある。これは積層したコイルの内
周側端子を溶接するためである。回路の外周には回路と
は接触せず、絶縁されている絶縁保護枠９が設置されて
いる。本実施例では絶縁保護枠は回路の外周に設けられ
ているが内周にも設けることができる。この絶縁保護枠
はエッチングによる回路の形成時に同時に形成すること
が好ましい。The front-side single-layer coil 1 and the back-side single-layer coil 2 have a reverse shape relationship. In this embodiment, the front-side single-layer coil 1 and the back-side single-layer coil 2 are laminated by interposing four prepregs with prepregs interposed therebetween, and the inner-side terminal 4 of the front-side single-layer coil 1 and the inner-side terminal 4 of the back-side single-layer coil 2 are laminated. Are welded together to form a laminated coil. Front side single layer coil 1 of FIG.
Has a spiral circuit 3 formed by etching a copper plate laminated on one surface of the prepreg 6. An outer peripheral side terminal 5 is provided at the outer peripheral side end of this circuit, and an inner peripheral side terminal 4 is provided at the inner peripheral side terminal. In this embodiment, the circuit is divided into two by a dividing line 8 during etching. This is to increase the number of turns in the circuit.
The resin flowing from the prepreg during the lamination flows into and is insulated. Of course, resin may be filled before the lamination to insulate.
The circuit can be divided into a desired number such as 3 divisions or 4 divisions as required. An inner peripheral side terminal 4 is provided at the inner peripheral side end of each circuit. A resin inflow port 7 is provided in the inner peripheral side terminal, and when laminating, the resin flowing out from the prepreg is allowed to flow into this hole to prevent the resin from flowing to the inner peripheral side terminal so that the terminal is not insulated. The peripheral portion of the inner peripheral side terminal of the prepreg 6 is cut into a hollow shape. This is for welding the inner peripheral side terminals of the laminated coils. An insulating protection frame 9 that is insulated and is not in contact with the circuit is installed on the outer periphery of the circuit. In this embodiment, the insulating protection frame is provided on the outer circumference of the circuit, but it may be provided on the inner circumference. This insulating protection frame is preferably formed at the same time when the circuit is formed by etching.
【００１６】図２は裏側単層コイルを示す。このコイル
は表側単層コイルを裏返した形状であり、外周側端子
５、内周側端子４、回路３、樹脂流入口７、保護枠９全
て同一である。この表側単層コイルと裏側単層コイル
を、回路形成したプリプレグと同一形状のプリプレグを
挾んで加圧加熱して積層すると内周端子が接続して回路
は一本につながる。次に本実施例の単層コイルの製造方
法を説明する。密着性向上のために脱脂およびサンディ
ングした厚さが０．６ｍｍ、導電率が９８％の無酸素銅
板の片面にガラスクロスにビス−マレイミド−トリアジ
ン樹脂を含浸させた０．０４ｍｍのプリプレグを積層し
てオートクレーブにより高温、高圧条件下に数時間お
き、一体化して銅張り積層板を作成する。作成時に離形
シートを挾むことにより、１回で複数枚作成することが
できる。次に、銅張り積層板の銅板をエッチングしてコ
イル状の回路３とコイル内周側に内周側端子４と外周側
に外周側端子５を形成する。また、同時にエッチングで
内周側端子４に樹脂流入孔７と、回路３の中央部に回路
を分割する分割線８と、回路の外周に回路とは接触せず
に絶縁されている絶縁保護枠９を形成する。FIG. 2 shows a backside single layer coil. This coil has a shape in which a front-side single-layer coil is turned upside down, and the outer peripheral side terminal 5, the inner peripheral side terminal 4, the circuit 3, the resin inlet 7, and the protective frame 9 are all the same. When the front-side single-layer coil and the back-side single-layer coil are laminated by pressing and heating a prepreg having the same shape as the circuit-formed prepreg, the inner peripheral terminals are connected and the circuit is connected. Next, a method for manufacturing the single-layer coil of this embodiment will be described. A 0.04 mm prepreg obtained by impregnating glass cloth with a bis-maleimide-triazine resin was laminated on one surface of an oxygen-free copper plate having a thickness of 0.6 mm degreased and sanded to improve adhesion and a conductivity of 98%. After a few hours under high temperature and high pressure conditions in an autoclave, they are integrated to form a copper clad laminate. By sandwiching the release sheet at the time of creation, multiple sheets can be created at one time. Next, the copper plate of the copper-clad laminate is etched to form the coil-shaped circuit 3, the inner peripheral side terminal 4 on the inner peripheral side of the coil, and the outer peripheral side terminal 5 on the outer peripheral side. At the same time, a resin inflow hole 7 is formed in the inner peripheral side terminal 4 by etching, a dividing line 8 that divides the circuit in the center of the circuit 3, and an insulating protective frame that is insulated from the outer periphery of the circuit without contacting the circuit. 9 is formed.
【００１７】エッチングは銅板に感光剤を塗布して乾燥
し、感光剤にパターンの描画されたマスクを密着させ、
紫外線をあて転写し、次いで転写されたパターンを現像
し、現像パターンをエッチングし、感光剤を除去して行
う。エッチング後、積層されているプリプレグの回路外
周部や内周部のプリプレグのみの不要部分をカッター等
で除去する。また、端子部に積層されているプリプレグ
もサンディング等で完全に除去し、整面する。ここで、
回路間に樹脂を充填して絶縁しておくと安全で好まし
い。勿論端子部には樹脂が付着してはならない。In etching, a copper plate is coated with a photosensitizer and dried, and a mask having a pattern drawn is brought into close contact with the photosensitizer.
The pattern is transferred by applying ultraviolet rays, then the transferred pattern is developed, the developed pattern is etched, and the photosensitive agent is removed. After the etching, unnecessary portions of only the prepregs on the circuit outer peripheral portion and the inner peripheral portion of the laminated prepregs are removed by a cutter or the like. Further, the prepreg laminated on the terminal portion is also completely removed by sanding or the like and the surface is adjusted. here,
It is safe and preferable to insulate the circuit by filling it with resin. Of course, the resin should not adhere to the terminals.
【００１８】この単層コイルを不要部を除去した回路を
形成したプリプレグ６とほぼ同形状に成形した挾み込み
プリプレグを介して表側コイルと裏側コイルを夫々複数
層重ね、さらに表側コイル層と裏側コイル層を対向させ
て挾み込みプリプレグを介して積層する。この積層体を
オートクレーブで高温、高圧条件下にして数時間おき、
樹脂を硬化させて一体化させる。内周側端子に樹脂流入
孔を設けることにより、上記の加熱、加圧時に端子部に
向かって流出してくる樹脂を収容して、絶縁されるトラ
ブルを防止することができる。また挟んだプリプレグか
ら流出する樹脂が分割線８に流れ込んで絶縁する。次い
で、端子部をアルゴン溶接してヤスリ等で形を整えて、
積層コイルを得ることができる。この後、外周側を囲む
形状、内周側の空間部の形状、上面、下面に合わせて成
形したプリプレグ積層体をそれぞれの位置に配置し、オ
ートクレープ等で高温、高圧条件下に保って数時間お
き、樹脂を硬化させて一体化させて保護体を形成する。A plurality of layers of the front side coil and the back side coil are layered on each other through the sandwiched prepreg formed into a shape substantially the same as that of the prepreg 6 in which the circuit in which the unnecessary portion is removed is formed from this single layer coil, and the front side coil layer and the back side coil are further laminated. The coil layers are made to face each other and are laminated through a sandwiched prepreg. This laminate is placed in an autoclave under high temperature and high pressure conditions for several hours,
The resin is cured and integrated. By providing the resin inflow hole in the inner peripheral side terminal, the resin flowing out toward the terminal portion at the time of heating and pressurizing can be accommodated and the trouble of insulation can be prevented. Further, the resin flowing out from the sandwiched prepreg flows into the parting line 8 to insulate it. Next, the terminals are welded with argon and the shape is adjusted with a file, etc.
A laminated coil can be obtained. After this, the prepreg laminate molded to match the shape surrounding the outer peripheral side, the shape of the space on the inner peripheral side, the upper surface and the lower surface is placed at each position and kept under high temperature and high pressure conditions with an autoclave etc. At intervals, the resin is cured and integrated to form a protective body.
【００１９】図３が積層コイルの断面図である。上側に
表側単層コイル１が４層、下側に裏側単層コイル２が４
層積層されている。各単層コイルの間にはプリプレグ１
０が設置されて絶縁されていることが理解される。ま
た、コイル外周には絶縁された絶縁保護枠９が配設され
ている。図面では不要部を除去したプリプレグ６とほぼ
同形状に成形した挾み込みプリプレグが一体となってプ
リプレグ１０として図示されている。１１が保護体であ
る。本実施例ではコイル内周側の空間に合わせて成形し
たプリプレグ積層体を挾み込むと共に隙間に樹脂を充填
し、次に４枚のプリプレグで全体を包み込み、外周側に
外枠のようにプリプレグ積層体を配置し、さらに上下に
２枚のプリプレグとプリプレグ積層体を配置して、オー
トクレーブで高温、高圧条件下にして数時間おき、樹脂
を硬化させて一体化させた。プリプレグ積層体１１や複
数枚のプリプレグ１０は一体化されているため、図面で
は一体化した状態で示している。FIG. 3 is a sectional view of the laminated coil. There are 4 layers of front side single layer coil 1 on the upper side and 4 layers of back side single layer coil 2 on the lower side.
The layers are stacked. Prepreg 1 between each single layer coil
It is understood that 0 is installed and insulated. Further, an insulating protection frame 9 which is insulated is arranged on the outer circumference of the coil. In the drawing, a sandwiched prepreg molded into substantially the same shape as the prepreg 6 from which unnecessary parts are removed is shown as a prepreg 10 integrally. 11 is a protector. In this embodiment, the prepreg laminate formed to fit the space on the inner circumference side of the coil is sandwiched and resin is filled in the gap, and then the whole is wrapped with four prepregs, and the prepreg is formed on the outer circumference side like an outer frame. The laminated body was arranged, and further two prepregs and the prepreg laminated body were arranged on the upper and lower sides, and the resin was cured by the autoclave under high temperature and high pressure conditions for several hours to be integrated. Since the prepreg laminate 11 and the plurality of prepregs 10 are integrated, they are shown in an integrated state in the drawings.
【００２０】図４、図５は他の実施例の単層コイルの形
状を示す平面図である。図４が基材の片面に形成された
表側単層コイル、図５が基材の片面に形成された裏側単
層コイルである。本実施例では１枚の単層コイルに２つ
のコイルを形成した実施例である。図４の表側単層コイ
ル１の右側のコイルには内周側端子１３が、表側単層コ
イル１の左側のコイルには１６が配置されている。図５
の裏側単層コイル２の右側のコイルには内周側端子１４
が、裏側単層コイル２の左側のコイルには１５が、それ
ぞれのコイルの内周側に配設されている。本実施例でも
回路を分割線８によって２分割しているため、それぞれ
の内周側端子４も２分割されている。また、表側単層コ
イルに２個の外周側端子１２、１７を配設し、裏側単層
コイルには外周側端子を配設していない。FIGS. 4 and 5 are plan views showing the shape of a single layer coil of another embodiment. FIG. 4 shows a front single-layer coil formed on one surface of the base material, and FIG. 5 shows a back single-layer coil formed on one surface of the base material. This embodiment is an embodiment in which two coils are formed on one single layer coil. Inner peripheral side terminals 13 are arranged on the right side coil of the front side single layer coil 1 in FIG. 4, and 16 are arranged on the left side coil of the front side single layer coil 1. FIG.
The inner side terminal 14 is provided on the right side coil of the backside single-layer coil 2.
However, 15 is arranged on the inner side of each coil on the left side of the back single-layer coil 2. Also in this embodiment, since the circuit is divided into two by the dividing line 8, each inner peripheral side terminal 4 is also divided into two. Further, two outer peripheral side terminals 12 and 17 are arranged on the front side single layer coil, and no outer peripheral side terminals are arranged on the back side single layer coil.
【００２１】積層コイルでは表側単層コイル１と裏側単
層コイル２が積層され、表側単層コイル１の内周側端子
１３と裏側単層コイル２の内周側端子１４が溶接され、
表側単層コイル１の内周側端子１６と裏側単層コイル２
の内周側端子１５が溶接されるのである。勿論、表側単
層コイルを複数層プリプレグを介して積層した表側複数
層コイルと、同様に形成した裏側複数層コイルとを積層
しても良い。なお、それぞれの内周側端子に形成した２
個の孔１８は溶接時にリベット等でかしめるための、か
しめ用孔である。かしめて溶接すると作業性がよい。In the laminated coil, the front side single layer coil 1 and the back side single layer coil 2 are laminated, and the inner peripheral side terminal 13 of the front side single layer coil 1 and the inner peripheral side terminal 14 of the back side single layer coil 2 are welded,
Inner peripheral side terminal 16 of front side single layer coil 1 and back side single layer coil 2
The inner peripheral side terminal 15 is welded. Of course, the front-side multi-layer coil in which the front-side single-layer coil is laminated via the multi-layer prepreg and the back-side multi-layer coil formed in the same manner may be laminated. In addition, 2 formed on each inner peripheral side terminal
The individual holes 18 are caulking holes for caulking with a rivet or the like during welding. Workability is good when caulking and welding.
【００２２】次に回路を簡単に説明する。表側単層コイ
ル１の下側の外周側端子１２を入り口側とし、上側の外
周端子１７を出口側とすると、回路は外周側端子１２か
ら時計回りに、内周側に向かってコイルを形成して内周
側端子１３に達する。内周側端子１３は内周側端子１４
と溶接されているため、回路は裏側単層コイル２に移
る。次いで、回路は内周側端子１４から時計回りに、今
度は外周側に向かってコイルを形成し、外周側の回路か
ら左側のコイルに移り、外周側から反時計回りに内周側
に向かってコイルを形成し、内周側端子１５に達する。
内周側端子１５は内周側端子１６と溶接されているた
め、回路は再び表側単層コイル１に移る。さらに回路は
内周側端子１６から反時計回りに、外周側に向かってコ
イルを形成し、最外周の回路が右側コイルの最外周に時
計回りに沿って伸び、出口側の外周側端子１７に達して
一連の回路を形成するのである。この表側コイルと裏側
コイルを挟み込みプリプレグを介して所望枚数組み合わ
せて積層することにより積層回路とすることができる。Next, the circuit will be briefly described. When the outer peripheral terminal 12 on the lower side of the front single-layer coil 1 is the inlet side and the outer peripheral terminal 17 on the upper side is the outlet side, the circuit forms a coil clockwise from the outer terminal 12 toward the inner peripheral side. To reach the inner peripheral side terminal 13. The inner peripheral side terminal 13 is the inner peripheral side terminal 14
Since it is welded to, the circuit moves to the back single-layer coil 2. Next, the circuit forms a coil clockwise from the inner peripheral side terminal 14 toward the outer peripheral side this time, and moves from the outer peripheral side circuit to the left coil, and from the outer peripheral side counterclockwise toward the inner peripheral side. A coil is formed and reaches the inner peripheral side terminal 15.
Since the inner peripheral side terminal 15 is welded to the inner peripheral side terminal 16, the circuit moves to the front side single layer coil 1 again. Further, the circuit forms a coil counterclockwise from the inner peripheral side terminal 16 toward the outer peripheral side, and the outermost peripheral circuit extends clockwise along the outermost peripheral side of the right side coil to the outer peripheral side terminal 17 on the outlet side. It reaches and forms a series of circuits. The front side coil and the back side coil are sandwiched and a desired number of them are combined and laminated through a prepreg to form a laminated circuit.
【００２３】[0023]
【発明の効果】本発明は銅板をエッチングすることによ
り単層コイルを形成し、薄いガラスクロスを介して多層
に積層しているため、導体の占有率が高く、巻数の多
い、厚さの薄いコイルが形成でき、小さなスペースに設
置して、効率よく電気を供給することができる。また、
単層コイル間を介するガラスクロスには耐熱樹脂を含浸
させたプリプレグを使用し、加熱、加圧して強固に一体
化されており、必要に応じて、プリプレグ積層体で形成
した保護体を形成することができるため強度、耐熱性に
非常に優れているのである。よって、高磁場に設置され
ても、発生する熱や応力に十分に絶えることができる。According to the present invention, a single-layer coil is formed by etching a copper plate and is laminated in multiple layers through a thin glass cloth. Therefore, the conductor occupancy is high, the number of turns is large, and the thickness is thin. A coil can be formed and installed in a small space to efficiently supply electricity. Also,
A prepreg impregnated with a heat-resistant resin is used for the glass cloth between the single-layer coils, and it is firmly integrated by heating and pressurizing, and if necessary, a protective body formed of a prepreg laminate is formed. Therefore, it has excellent strength and heat resistance. Therefore, even when installed in a high magnetic field, it is possible to sufficiently withstand heat and stress generated.
【図１】本発明の実施例の表側単層コイルの平面図であ
る。FIG. 1 is a plan view of a front single-layer coil of an embodiment of the present invention.
【図２】本発明の実施例の裏側単層コイルの平面図であ
る。FIG. 2 is a plan view of the back single-layer coil of the embodiment of the present invention.
【図３】本発明の実施例の積層型コイルの断面図であ
る。FIG. 3 is a sectional view of a laminated coil according to an embodiment of the present invention.
【図４】本発明の他の実施例の表側単層コイルの平面図
である。FIG. 4 is a plan view of a front single-layer coil of another embodiment of the present invention.
【図５】本発明の他の実施例の裏側単層コイルの平面図
である。FIG. 5 is a plan view of a backside single-layer coil of another embodiment of the present invention.
１ 表側単層コイル ２ 裏側単層コイル ３ 回路 ４ 内周側端子 ５ 外周側端子 ６ 不要部を除去したプリプレグ ７ 樹脂流入孔 ８ 分割線 ９ 絶縁保護枠 １０ 挾み込みプリプレグ １１ 保護体 １２ 外周側端子 １３ 内周側端子 １４ 内周側端子 １５ 内周側端子 １６ 内周側端子 １７ 外周側端子 １８ かしめ用孔 1 front side single layer coil 2 back side single layer coil 3 circuit 4 inner peripheral side terminal 5 outer peripheral side terminal 6 prepreg with unnecessary parts removed 7 resin inlet hole 8 dividing line 9 insulation protection frame 10 sandwiched prepreg 11 protector 12 outer peripheral side Terminal 13 Inner circumference side terminal 14 Inner circumference side terminal 15 Inner circumference side terminal 16 Inner circumference side terminal 17 Outer circumference side terminal 18 Caulking hole
Claims (11)
浸し乾燥させたプリプレグの片面に銅板を積層し加熱、
加圧して得た銅張り積層板の銅部をエッチングして、渦
巻状の１本または複数本の回路を形成し、この回路の外
周側端部に回路の外周側に突出する、出力または入力端
子となる１個の外周側端子を配設し、 ｂ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた表側単層コイル状の回路と、 Ｂ．ｃ．同様に銅部をエッチングして、形成した１本ま
たは複数本の渦巻状の回路の夫々の外周側端部に回路の
外周側に突出する、出力または入力端子となる１個の外
周側端子を配置し、 ｄ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた裏側単層コイル状の回路とからなり、 Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側コイ
ル状の単層回路または複数層重ねた複層回路と裏側コイ
ル状の単層回路または複数層重ねた複層回路を、 Ｄ．各銅面の間にガラスクロスに耐熱性樹脂を含浸し乾
燥させ内周側端子部分を削除して切り抜き部としたプリ
プレグを挾んで加熱、加圧して端子部に向かって流れる
樹脂を端子の近傍の銅板に配置した樹脂流入孔に収容し
て内周外周両側端子を非被覆状端子とし、夫々の回路間
をプリプレグから流れる樹脂で充填して絶縁し、コイル
積層体の重なった内周側端子および外周側端子をそれぞ
れ溶接して表裏の回路を連結してなる、積層型コイル。1. A. First Embodiment a. A copper plate is laminated on one side of a prepreg that is made by impregnating glass cloth with heat-resistant resin and heating,
The copper part of the copper-clad laminate obtained by pressurizing is etched to form one or more spiral circuits, and the outer peripheral end of this circuit projects to the outer peripheral side of the circuit. Arranging one outer peripheral side terminal to be a terminal, b. A front-side single-layer coil-shaped circuit having inner peripheral side terminals, which are circuit connecting terminals having resin inflow holes, respectively coupled to inner peripheral side end portions of one or a plurality of circuits; c. Similarly, a copper portion is etched to form one outer peripheral side terminal, which is an output or input terminal, at the outer peripheral side end of each of the formed one or more spiral circuits. And d. A back side single-layer coil-shaped circuit having inner peripheral side terminals which are circuit connecting terminals having resin inflow holes and which are respectively coupled to inner peripheral side end portions of one or a plurality of circuits; A single-layer circuit in which the glass cloth portion of the base body near the inner peripheral side terminal is removed to form a cutout portion is a front coiled single-layer circuit or a multi-layered circuit in which multiple layers are stacked and a back coiled single layer. A circuit or a multi-layer circuit in which a plurality of layers are stacked, D. A glass cloth is impregnated with a heat-resistant resin between each copper surface, and the inner peripheral side terminal part is removed to sandwich the prepreg that has been cut out and heated and pressed to flow resin toward the terminal part near the terminal Inner and outer terminals on both sides of the inner and outer circumferences are covered with resin flowing from the prepreg to be insulated by accommodating in resin inflow holes arranged on the copper plate. A laminated coil in which front and rear circuits are connected by welding the outer peripheral side terminal and the outer peripheral side terminal.
浸し乾燥させたプリプレグの片面に銅板を積層し加熱、
加圧して得た銅張り積層板の銅板をエッチングして、渦
巻状の１本または複数本の回路を形成し、この渦巻状の
回路の夫々の外周側端部には外周側に突出した出力端子
または入力端子となる外周側端子を設け、 ｂ．一方の外周側端子に接続する回路の内周側端部に
は、端子の近傍に樹脂流入孔を設けた裏面側回路との接
続端子となる内周側端子を配置し、 ｃ．他方の外周側端子に接続する回路は延長して隣の位
置に渦巻状の１本または複数本の回路を形成し、この回
路の内周側端部には、端子の近傍に樹脂流入孔を設けた
接続端子となる内周側端子を配置した表側単層コイル状
の回路と、 Ｂ．表側単層コイルと同様に銅板をエッチングして、夫
々の内周側端部に、端子の近傍に樹脂流入孔を設けた接
続端子となる内周側端子を配置した、渦巻状の１本また
は複数本の回路を形成し、、両内周側端子に接合する回
路を延長して隣の位置に渦巻状の１本または複数本の回
路を形成し、この回路の内周側端部にも、端子の近傍に
樹脂流入孔を設けた接続端子となる内周側端子を配置し
た裏側単層コイル状の回路の Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側コイ
ル状の単層回路または複数層重ねた複層回路と裏側コイ
ル状の単層回路または複数層重ねた複層回路を、 Ｄ．各銅面の間にガラスクロスに耐熱性樹脂を含浸し乾
燥させ内周側端子部分を削除して切り抜き部としたプリ
プレグを挾んで加熱、加圧して端子部に向かって流れる
樹脂を端子の近傍の銅板に配置した樹脂流入孔に収容し
て内周外周両側端子を非被覆状端子とし、夫々の回路間
をプリプレグから流れる樹脂で充填して絶縁し、コイル
積層体の重なった内周側端子および外周側端子をそれぞ
れ溶接して表裏の回路を連結してなる、積層型コイル。2. A. a. A copper plate is laminated on one side of a prepreg that is made by impregnating glass cloth with heat-resistant resin and heating,
The copper plate of the copper-clad laminate obtained by pressurizing is etched to form one or more spiral circuits, and the spiral circuits each have an outer peripheral end portion with an output projecting to the outer peripheral side. Providing an outer peripheral side terminal that serves as a terminal or an input terminal, b. At the inner circumference side end of the circuit connected to one outer circumference side terminal, an inner circumference side terminal serving as a connection terminal with the back side circuit having a resin inflow hole provided in the vicinity of the terminal is arranged, and c. The circuit connected to the other outer peripheral side terminal is extended to form one or more spiral circuits at the adjacent positions. At the inner peripheral side end of this circuit, a resin inflow hole is provided near the terminal. A front-side single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals are provided, and B. Similar to the front-side single-layer coil, the copper plate is etched, and the inner peripheral side terminals serving as the connection terminals having the resin inflow holes provided in the vicinity of the terminals are arranged at the respective inner peripheral side end portions of one spiral or Form a plurality of circuits, extend the circuit that is connected to both inner circumference side terminals, and form one or more spiral circuits at the adjacent positions. Also at the inner circumference side end of this circuit. C. of a backside single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals provided with resin inflow holes in the vicinity of the terminals are arranged. A single-layer circuit in which the glass cloth portion of the base body near the inner peripheral side terminal is removed to form a cutout portion is a front coiled single-layer circuit or a multi-layered circuit in which multiple layers are stacked and a back coiled single layer. A circuit or a multi-layer circuit in which a plurality of layers are stacked, D. A glass cloth is impregnated with a heat-resistant resin between each copper surface, and the inner peripheral side terminal part is removed to sandwich the prepreg that has been cut out and heated and pressed to flow resin toward the terminal part near the terminal Inner and outer terminals on both sides of the inner and outer circumferences are covered with resin flowing from the prepreg to be insulated by accommodating in resin inflow holes arranged on the copper plate. A laminated coil in which front and rear circuits are connected by welding the outer peripheral side terminal and the outer peripheral side terminal.
浸し乾燥させたプリプレグの両面に銅板を積層し加熱、
加圧して得た銅張り積層板の表面側の銅部をエッチング
して、渦巻状の１本または複数本の回路を形成し、この
回路の外周側端部に回路の外周側に突出する、出力また
は入力端子となる１個の外周側端子を配設し、 ｂ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた表側単層コイル状の回路と、 Ｂ．ｃ．同様に裏面側の銅部をエッチングして、形成し
た１本または複数本の渦巻状の回路の夫々の外周側端部
に回路の外周側に突出する、出力または入力端子となる
１個の外周側端子を配置し、 ｄ．１本または複数本の回路の内周側端部に夫々結合す
る、樹脂流入孔を有する回路接続端子である内周側端子
を備えた裏側単層コイル状の回路とからなり、 Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側単層
コイル状の回路と裏側単層コイル状の回路を対向させて
重ねた回路の複数層を、 Ｄ．銅面の間にガラスクロスに耐熱性樹脂を含浸し乾燥
させ内周側端子部分を削除して切り抜き部としたプリプ
レグを挾んで加熱、加圧して端子部に向かって流れる樹
脂を端子の近傍の銅板に配置した樹脂流入孔に収容して
内周外周両側端子を非被覆状端子とし、夫々の回路間を
プリプレグから流れる樹脂で充填して絶縁したコイル積
層体の重なった内周側端子を溶接して表裏の回路を連結
し、必要により外周側端子も溶接してなる、積層型コイ
ル。3. A. a. Heat the glass prepreg by laminating copper plates on both sides of a prepreg that is made by impregnating glass cloth with heat-resistant resin.
The copper portion on the surface side of the copper-clad laminate obtained by pressurizing is etched to form one or more spiral circuits, and the outer peripheral end of this circuit projects to the outer peripheral side of the circuit. Arranging one outer peripheral side terminal to be an output or input terminal, b. A front-side single-layer coil-shaped circuit having inner peripheral side terminals, which are circuit connecting terminals having resin inflow holes, respectively coupled to inner peripheral side end portions of one or a plurality of circuits; c. Similarly, the copper portion on the back surface side is etched to form one or more spiral-shaped circuits, each of which has an outer peripheral end that protrudes toward the outer peripheral side of the circuit and has an outer periphery serving as an output or input terminal. Arranging side terminals, d. A back side single-layer coil-shaped circuit having inner peripheral side terminals which are circuit connecting terminals having resin inflow holes and which are respectively coupled to inner peripheral side end portions of one or a plurality of circuits; A circuit in which a front side single layer coil-shaped circuit and a back side single layer coil-shaped circuit are made to face each other by stacking a plurality of copper-clad laminates that are cut out by removing the glass cloth part of the substrate near the inner peripheral side terminal Multiple layers of D. A glass cloth is impregnated with a heat-resistant resin between copper surfaces, the inner peripheral side terminal part is removed, and the prepreg that is a cutout part is sandwiched and heated and pressed to flow the resin flowing toward the terminal part near the terminal. Welded the inner peripheral side terminals of the coil laminated body, which are housed in the resin inflow holes arranged on the copper plate and made both terminals on the inner peripheral side and outer peripheral side uncoated terminals, and filled between the circuits with resin flowing from the prepreg and insulated. Then, the laminated coil is formed by connecting the circuits on the front and back and welding the outer peripheral side terminals as necessary.
浸し乾燥させたプリプレグの両面に銅板を積層し加熱、
加圧して得た銅張り積層板の表面側の銅板をエッチング
して、渦巻状の１本または複数本の回路を形成し、この
渦巻状の回路の夫々の外周側端部には外周側に突出した
出力端子または入力端子となる外周側端子を設け、 ｂ．一方の外周側端子に接続する回路の内周側端部に
は、端子の近傍に樹脂流入孔を設けた裏面側回路との接
続端子となる内周側端子を配置し、 ｃ．他方の外周側端子に接続する回路は延長して隣の位
置に渦巻状の１本または複数本の回路を形成し、この回
路の内周側端部には、端子の近傍に樹脂流入孔を設けた
裏面側回路との接続端子となる内周側端子を配置した表
側単層コイル状の回路と、 Ｂ．表側単層コイルと同様に裏面側の銅板をエッチング
して、夫々の内周側端部に、端子の近傍に樹脂流入孔を
設けた表面側回路との接続端子となる内周側端子を配置
した、渦巻状の１本または複数本の回路を形成し、両内
周側端子に接合する回路を延長して隣の位置に渦巻状の
１本または複数本の回路を形成し、この回路の内周側端
部にも、端子の近傍に樹脂流入孔を設けた表面側回路と
の接続端子となる内周側端子を配置した裏側単層コイル
状の回路の Ｃ．内周側端子の近傍の基体のガラスクロス部分を削除
して切り抜き部とした複数枚の銅張り積層板を表側単層
コイル状の回路と裏側単層コイル状の回路を対向させて
重ねた回路の複数層を、 Ｄ．銅面の間にガラスクロスに耐熱性樹脂を含浸し乾燥
させたプリプレグから端子部分を削除したプリプレグを
挾んで加熱、加圧して端子部に向かって流れる樹脂を端
子の近傍の銅板に配置した樹脂流入孔に収容して内周外
周両側端子を非被覆状端子とし、夫々の回路間をプリプ
レグから流れる樹脂で充填して絶縁したコイル積層体の
重なった内周側端子を夫々溶接して表裏の回路を連結し
必要に応じて外周側端子も溶接してなる、積層型コイ
ル。4. A. a. Heat the glass prepreg by laminating copper plates on both sides of a prepreg that is made by impregnating glass cloth with heat-resistant resin.
The copper plate on the surface side of the copper-clad laminate obtained by pressurizing is etched to form one or more spiral circuits, and the outer peripheral side ends of the spiral circuit are formed on the outer peripheral side. Providing a projecting output terminal or an outer peripheral side terminal as an input terminal, b. At the inner circumference side end of the circuit connected to one outer circumference side terminal, an inner circumference side terminal serving as a connection terminal with the back side circuit having a resin inflow hole provided in the vicinity of the terminal is arranged, and c. The circuit connected to the other outer peripheral side terminal is extended to form one or more spiral circuits at the adjacent positions. At the inner peripheral side end of this circuit, a resin inflow hole is provided near the terminal. A front-side single-layer coil-shaped circuit in which inner peripheral side terminals serving as connection terminals with the provided rear side circuit are arranged, and B. Similar to the front side single layer coil, the copper plate on the back side is etched, and the inner peripheral side terminals, which are the connection terminals with the front side circuit with resin inflow holes near the terminals, are placed at each inner peripheral side end. And forming one or more spiral circuits, and extending the circuit joined to both inner peripheral side terminals to form one or more spiral circuits at the adjacent position. C. of the backside single-layer coil-shaped circuit in which the inner peripheral side terminal serving as a connection terminal with the front surface side circuit having the resin inflow hole provided in the vicinity of the terminal is also arranged at the inner peripheral side end portion. A circuit in which a front side single layer coil-shaped circuit and a back side single layer coil-shaped circuit are made to face each other by stacking a plurality of copper-clad laminates that are cut out by removing the glass cloth part of the substrate near the inner peripheral side terminal Multiple layers of D. A resin in which a resin is placed on a copper plate near the terminals by sandwiching the prepreg with the heat-resistant resin impregnated in a glass cloth between the copper surfaces and removing the terminal part from the prepreg The terminals on both the inner and outer circumferences are housed in the inflow holes to form uncoated terminals, and the inner terminals on the inner and outer sides of the coil laminate, which are insulated by filling the resin between the circuits with resin flowing from the prepreg, are welded. Laminated coil made by connecting circuits and welding outer peripheral side terminals if necessary.
ジン樹脂である、請求項１ないし４のいずれか１項に記
載された積層型コイル。5. The laminated coil according to claim 1, wherein the heat resistant resin is a bis-maleimide-triazine resin.
本の回路である、請求項１ないし５のいずれか１項に記
載された積層型コイル。6. A circuit formed by etching a copper part has two parts.
The laminated coil according to claim 1, which is a book circuit.
路が裏返した形状の関係にある、請求項１ないし６のい
ずれか１項に記載された、積層型コイル。7. The laminated coil according to claim 1, wherein the front-side coil-shaped circuit and the back-side coil-shaped circuit have an inverted shape relationship.
コイルを形成する際に回路の外周部および／または内周
部にコイルとは接触しないコイル外周とほぼ同形状の銅
板で形成された絶縁保護枠を配置した、請求項１ないし
７のいずれか１項に記載された、積層型コイル。8. A copper part of a copper-clad laminate is etched to obtain
8. An insulating protective frame formed of a copper plate having substantially the same shape as the outer circumference of the coil, which does not come into contact with the coil, is arranged at the outer peripheral portion and / or the inner peripheral portion of the circuit when the coil is formed. The laminated coil described in the above item.
は内周部に絶縁体で形成した保護枠体を配設した、請求
項１ないし８のいずれか１項に記載された、積層型コイ
ル。9. The laminated type according to any one of claims 1 to 8, wherein a protective frame body made of an insulating material is arranged on an outer peripheral portion and / or an inner peripheral portion of the laminated type current collecting coil. coil.
不要のガラスクロスと端子のガラスクロスと樹脂を除去
してからプリプレグと加熱、加圧し積層した、請求項１
ないし９のいずれか１項に記載された、積層型コイル。10. The prepreg is heated and pressurized to be laminated after removing unnecessary glass cloth and resin of the terminal and glass on the inner and outer peripheral portions of the circuit of the single layer coil.
9. The laminated coil according to any one of items 1 to 9.
を耐熱性樹脂で予め充填して絶縁してから積層した、請
求項１ないし１０のいずれか１項に記載された積層型コ
イル。11. The laminated coil according to claim 1, wherein the circuit formed by etching the copper portion is pre-filled with a heat-resistant resin to insulate and then laminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125182A JPH09283361A (en) | 1996-04-12 | 1996-04-12 | Laminated coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125182A JPH09283361A (en) | 1996-04-12 | 1996-04-12 | Laminated coil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09283361A true JPH09283361A (en) | 1997-10-31 |
Family
ID=14903938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8125182A Pending JPH09283361A (en) | 1996-04-12 | 1996-04-12 | Laminated coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09283361A (en) |
-
1996
- 1996-04-12 JP JP8125182A patent/JPH09283361A/en active Pending
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