JPH09281055A - Inspection method for chip - Google Patents

Inspection method for chip

Info

Publication number
JPH09281055A
JPH09281055A JP8086213A JP8621396A JPH09281055A JP H09281055 A JPH09281055 A JP H09281055A JP 8086213 A JP8086213 A JP 8086213A JP 8621396 A JP8621396 A JP 8621396A JP H09281055 A JPH09281055 A JP H09281055A
Authority
JP
Japan
Prior art keywords
contour
pixel
line
pixels
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8086213A
Other languages
Japanese (ja)
Inventor
Nobukatsu Igi
宣克 伊儀
Shigeyuki Nishi
重幸 西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moldino Tool Engineering Ltd
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Hitachi Tool Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd, Hitachi Tool Engineering Ltd filed Critical Hitachi Metals Ltd
Priority to JP8086213A priority Critical patent/JPH09281055A/en
Publication of JPH09281055A publication Critical patent/JPH09281055A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an inspection method by which a defective chip in an outline part can be detected by an image processing method with reference to an object to be inspected, which comprises a plurality of outline lines composed of different kinds of lines. SOLUTION: Outline coordinate data on an object to be detected is found by an image processing operation, an inspection vector is installed on the contour coordinate data, a prescribed vector out of it is used as a reference vector, an angle which is formed by the inspection vector with reference to the reference vector is computed, and the conversion point of the outline shape in the object to be inspected and its shape in the mean time are found. Then, an outline approximate line in which the outline shape is changed into a numerical formula on the basis of the data is found, the outline coordinate data is scanned on the basis of the outline approximate line, a chip which exists in the outline part of the object to be inspected is detected, and its size is computed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、切削工具などのよ
うに、輪郭形状が直線と曲線との組み合わせによって形
成されているような被検査物の、輪郭部に発生している
欠けを画像処理により検査する方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention image-processes a chip in a contour portion of an inspection object such as a cutting tool whose contour shape is formed by a combination of straight lines and curved lines. Regarding how to inspect.

【0002】[0002]

【従来の技術】直線状周辺部の欠けを画像処理により検
査する方法が特開1−263774に開示されている
(以下、従来例1と呼ぶ)。これは、被検査物の撮像信
号を二値化画素データとして画像メモリに記憶し、直線
状周辺部を囲むように設定した走査領域内で、周辺部を
表す二値化画素データの座標をもとに、最小二乗法で直
線式を算出して輪郭近似線とした後、前記画素データ座
標のうち該算出した輪郭近似線から所定距離以上離れた
画素を除外し、改めて輪郭近似線を算出することを繰り
返して精度の良い輪郭近似線を求め、求めた輪郭近似線
のうち、相隣る輪郭近似線の交点を算出し、該交点座標
をもとに、所定ピッチで複数の走査線を設定し、該走査
線と周辺部を表す二値化画素データの交点を求め、相隣
る交点座標の差分から欠け部を認識するとともに、欠け
の幅と深さを算出し、判定値と比較することによって欠
けの有無を検査する方法である。また直接欠けを検出す
る技術ではないが、輪郭部の形状を同定する方法とし
て、特開1−116772(以下、従来例2と呼ぶ)に
線形図形の撮像信号の画像データから、図形の線種を一
次直線なのか円曲線なのかを認識する方法が開示されて
いる。これは、図形を二値画像データとして読みとり、
画像処理して輪郭座標点データを得て、得た座標点デー
タを複数点毎に短線分化してショートベクトルで表し、
ショートベクトルが一つ前のショートベクトルに対し持
っている変位角が略零か正か負かを算出することによっ
て、線種を、略零なら直線、正なら反時計回りの円弧、
負なら時計回りの円弧であると認識する方法である。
2. Description of the Related Art A method for inspecting a defect in a linear peripheral portion by image processing is disclosed in Japanese Patent Application Laid-Open No. 1-263774 (hereinafter referred to as Conventional Example 1). This is because the image pickup signal of the object to be inspected is stored in the image memory as binarized pixel data, and the coordinates of the binarized pixel data representing the peripheral portion are also stored in the scanning area set so as to surround the linear peripheral portion. In addition, after calculating a linear equation by the least-squares method to form a contour approximation line, pixels that are apart from the calculated contour approximation line by a predetermined distance or more are excluded from the pixel data coordinates, and the contour approximation line is calculated again. By repeating the above steps to obtain a highly accurate contour approximation line, calculate the intersections of the contour approximation lines that are adjacent to each other, and set multiple scanning lines at a predetermined pitch based on the intersection coordinates. Then, the intersection of the scan line and the binarized pixel data representing the peripheral portion is obtained, the notch is recognized from the difference between the adjacent intersection coordinates, and the width and depth of the notch are calculated and compared with the determination value. This is a method of inspecting for the presence or absence of a chip. As a method of identifying the shape of the contour portion, which is not a technique for directly detecting a chip, a line type of a figure is disclosed in Japanese Patent Laid-Open No. 1-1116772 (hereinafter referred to as Conventional Example 2) from image data of a linear figure imaging signal. There is disclosed a method of recognizing whether the is linear or circular. This reads the figure as binary image data,
Image processing is performed to obtain contour coordinate point data, and the obtained coordinate point data is divided into a plurality of short lines and represented by a short vector,
By calculating whether the displacement angle of the short vector with respect to the previous short vector is approximately zero, positive or negative, the line type is a straight line if it is approximately zero, a counterclockwise arc if positive,
If it is negative, it is a method to recognize it as a clockwise arc.

【0003】[0003]

【発明が解決しようとする課題】切削工具の切れ刃部の
輪郭は、直線と円又は他の曲線等を組合せた、一つの関
数で表示できない複雑な形状をしているものが多い。こ
れに対して従来例1では、輪郭が直線だけで形成されて
いる部分を対象としており、他の曲線を含んでいる部分
には対応できない。また、この欠け検出方法は、画面内
の垂直又は水平に引いた走査ピッチ線と周辺部を表す二
値化画素データの交点をもとに、走査ピッチ線方向の差
分で求める方法のため、検査対象である直線状周辺部が
傾いていると、求めた欠けの大きさと実際の欠けの大き
さとに誤差が生じると言う問題がある。従来例2では、
撮像した線種が一次直線か円曲線かの識別方法について
述べられているが、欠け検出に対しては言及されていな
い。また、その識別方法では、実際の被検査物の輪郭線
の周辺部に存する微少な欠陥・欠けや表面粗さ、さらに
画素の量子化誤差に影響されて、直線であるべきはずの
所で差分が略零を示さなかったり、曲線であるべき所で
略零を示したりする事が多くあり、線種の同定精度に問
題がある。本発明は、従来技術では対応が難しい複雑な
輪郭形状を有する被検査物に対しても、その輪郭形状を
認識し、その形状に沿って欠けを検出して検査すること
を目的としている。
The contour of the cutting edge of a cutting tool often has a complicated shape that cannot be displayed by one function, which is a combination of straight lines and circles or other curved lines. On the other hand, in Conventional Example 1, the contour is formed only by a straight line, and cannot be applied to a portion including another curve. In addition, this chipping detection method is a method of obtaining the difference in the scanning pitch line direction based on the intersection of the scanning pitch line drawn vertically or horizontally in the screen and the binarized pixel data representing the peripheral portion, If the target linear peripheral portion is inclined, there is a problem in that an error occurs between the calculated size of the chip and the actual size of the chip. In Conventional Example 2,
A method for discriminating whether the imaged line type is a linear line or a circular curve is described, but no reference is made to the defect detection. In addition, the identification method is affected by minute defects / chips and surface roughness existing in the peripheral part of the contour line of the actual inspection object, and by the quantization error of the pixel, and the difference should be made at the place where it should be a straight line. Often does not show substantially zero, or shows almost zero when it should be a curve, and thus there is a problem in the accuracy of line type identification. It is an object of the present invention to recognize the contour shape of an object having a complicated contour shape, which is difficult to be dealt with by the conventional technique, and detect a chip along the shape to inspect it.

【0004】[0004]

【課題を解決するための手段】本発明は、輪郭部の欠け
を画像処理を用いて検査する欠け検査方法において、 1)検査対象部の撮像入力を二値化し、二値境を形成す
る画素を輪郭画素とし、 2)輪郭画素の一端に、設定数離れた画素に向かって基
準ベクトルを設定するとともに、各輪郭画素から前記と
同一な設定数離れた画素に向かった検査ベクトルを設定
し、各検査ベクトルと基準ベクトルの方向の違いを表す
角度差の絶対値を算出し、 3)角度差の絶対値が、予め設定した値を超えたとき、
該検査ベクトルの開始画素を輪郭形状変換画素として認
識し、 4)前記で認識した輪郭形状変換画素間にある線種を、
輪郭形状変換画素間にある角度差の絶対値の累積度数分
布と、予め設定した累積度数分布形状と線種の関係をも
とに同定し、 5)前記同定した線種と、輪郭形状変換画素間にある輪
郭画素の有する座標値をもとに、検査対象の輪郭形状を
各々数式で表した輪郭近似線を算出し、 6)画面上で輪郭画素に輪郭近似線を重ね、 7)輪郭近似線が通過している画素を、画面枠と交わる
画素から、輪郭画素に達するまで走査し、 8)該輪郭画素から再び輪郭近似線に達するまで輪郭画
素を走査し、 9)走査した輪郭画素のうち、画面に設定したXY平面
で、まずX方向の最大及び最小位置の画素を抽出してX
座標値で表わすとともに、この点を通りX軸に垂直な直
線を引き、次にY方向の最大及び最小位置の画素を抽出
してY座標値で表わすとともに、この点を通りY軸に垂
直な直線を引き、これらの直線の交点を算出し、 10)この交点の内、検査対象部内部側にある3点を抽出
し、 11)この3点の内、輪郭近似線に近接する2点からは輪
郭近似線に垂直な線を、残りの点からは輪郭線に沿った
線を引き、 12)前記3つの線各々について、輪郭座標に接するまで
平行移動し、 13)平行移動後の各3つの線で囲まれた範囲を欠けと
し、その大きさを検査することを特徴としている。
According to the present invention, there is provided a defect inspection method for inspecting a defect in a contour portion by using image processing. 1) Pixels forming a binary boundary by binarizing an imaging input of an inspection object portion. Is set as a contour pixel, and 2) a reference vector is set at one end of the contour pixel toward a pixel that is a set number apart, and an inspection vector is set from each contour pixel to a pixel that is the same set number as described above. The absolute value of the angle difference representing the difference between the directions of each inspection vector and the reference vector is calculated. 3) When the absolute value of the angle difference exceeds a preset value,
The start pixel of the inspection vector is recognized as a contour shape conversion pixel, and 4) the line type between the contour shape conversion pixels recognized above is
Identification is performed based on the cumulative frequency distribution of the absolute values of the angular differences between the contour shape conversion pixels and the relationship between the preset cumulative frequency distribution shape and the line type, and 5) the identified line type and the contour shape conversion pixel Based on the coordinate values of the contour pixels in between, calculate the contour approximation line that expresses the contour shape of the inspection target by a mathematical formula, 6) overlay the contour approximation line on the contour pixel on the screen, and 7) contour approximation The pixels through which the line passes are scanned from the pixels intersecting the screen frame until the contour pixel is reached, 8) The contour pixel is scanned from the contour pixel until the contour approximate line is again reached, and 9) The contour pixel scanned is scanned. Of these, on the XY plane set on the screen, first, the pixels at the maximum and minimum positions in the X direction are extracted and X
In addition to being represented by coordinate values, a straight line passing through this point and perpendicular to the X axis is drawn, and then pixels at maximum and minimum positions in the Y direction are extracted and represented by Y coordinate values. Draw a straight line and calculate the intersections of these straight lines. 10) Extract 3 points on the inside of the inspection part from these intersections. 11) From these 3 points, close to the contour approximation line. Draw a line perpendicular to the contour approximation line, and draw a line along the contour line from the remaining points. 12) For each of the three lines, translate until they come into contact with the contour coordinates, and 13) For each 3 after translation. The feature is that the area surrounded by two lines is cut and the size is inspected.

【0005】[0005]

【発明の実施の形態】以下、本発明の実施の形態を図1
〜図7に基づいて説明する。図1は、本発明に係わる装
置の概要を示す図である。被検査物1の欠けを強調する
照明手段2と、被検査物を撮像する工業用テレビジョン
カメラからなる撮像手段3と、撮像手段3と接続され、
撮像信号を二値化画素データに変換してメモリーに記憶
し、この二値化画素データをモニター7に画面表示する
画像処理装置4と、画像処理装置4に接続され、画像処
理装置4のメモリーをもとに欠け検査処理を行うコンピ
ューターを有する制御装置5と、制御装置5に接続され
て欠け検査結果等を表示するCRT6とを備えている。
FIG. 1 is a block diagram showing an embodiment of the present invention.
~ It demonstrates based on FIG. FIG. 1 is a diagram showing an outline of an apparatus according to the present invention. The illumination means 2 for emphasizing the chipping of the inspection object 1, the imaging means 3 including an industrial television camera for imaging the inspection object, and the imaging means 3 are connected,
An image processing device 4 which converts an image pickup signal into binarized pixel data and stores the binarized pixel data in a memory, and displays the binarized pixel data on a screen on a monitor 7, and a memory of the image processing device 4 connected to the image processing device 4. A controller 5 having a computer for performing a chipping inspection process based on the above, and a CRT 6 connected to the controller 5 for displaying a chipping inspection result and the like are provided.

【0006】本発明の作用について、図2に示す処理フ
ローに従って説明する。最初に、処理目的別のブロック
201〜205をもとに、処理の概要を簡単に説明す
る。ブロック201は、検査対象の撮像信号を画像処理
装置4により、二値化画素データとしてしてメモリーに
記憶するとともに画面表示する。ブロック202以降は
制御装置5が主として処理し、ブロック202におい
て、前記2値化した画素データをもとに、輪郭を成す線
種とその構成を識別する。ブロック203では前記輪郭
構成線毎に線種を数式化した輪郭近似線と、それらの交
点を求める。ブロック204では、輪郭近似線をもとに
二値化された輪郭を表す画素を順次走査し、欠けとその
大きさを算出する。ブロック205は、ブロック204
で算出した欠けの大きさと、予め設定した判定値から、
欠けとすべきかどうかの判定を行うものである。
The operation of the present invention will be described according to the processing flow shown in FIG. First, the outline of the processing will be briefly described based on the processing purpose blocks 201 to 205. In the block 201, the image processing apparatus 4 stores the image pickup signal of the inspection target as binarized pixel data in the memory and displays it on the screen. After the block 202, the control device 5 mainly processes, and in the block 202, the line type forming the contour and its configuration are identified based on the binarized pixel data. In block 203, a contour approximation line in which a line type is mathematically expressed for each of the contour constituent lines and their intersections are obtained. In block 204, pixels representing the binarized contour are sequentially scanned based on the contour approximation line, and the chip and its size are calculated. Block 205 is block 204
From the size of the chip calculated in and the preset judgment value,
It is to determine whether or not it should be omitted.

【0007】以下、図2に示すステップ番号順に従い処
理内容を説明する。ステップ101において、照明手段
2により被検査物1の輪郭を強調し、撮像手段3で所定
の検査対象部を撮像し、撮像信号を画像処理装置4に入
力する。このとき、前記検査対象部の輪郭形状は、画面
内に入るようにしておく。ステップ102において、画
像処理装置4はステップ101で入力された撮像信号
を、二値化画素データ(例えば、被検査物部分を1、背
景や欠け部分を0とする)としてメモリに収納するとと
もに、モニター上に横方向をX軸、縦方向をY軸として
画像表示する。図3に二値化され、XY座標平面上に表
示された検査部分の画像の例を示す。以降この画像をも
とに説明する。
The processing contents will be described below in the order of step numbers shown in FIG. In step 101, the illuminating unit 2 emphasizes the contour of the inspection object 1, the image capturing unit 3 captures an image of a predetermined inspection target portion, and an image capturing signal is input to the image processing apparatus 4. At this time, the contour shape of the inspection target portion is set within the screen. In step 102, the image processing device 4 stores the image pickup signal input in step 101 in the memory as binarized pixel data (for example, the inspected object part is 1, and the background and missing parts are 0), and An image is displayed on the monitor with the horizontal direction as the X axis and the vertical direction as the Y axis. FIG. 3 shows an example of an image of the inspection portion which is binarized and displayed on the XY coordinate plane. The following description is based on this image.

【0008】ステップ103は、制御装置5において、
モニタ画面内の前記二値化データをX又はY方向に1画
素ずつ走査し、例えば1と判定された画素のうち、0の
画素に接する画素を輪郭画素として抽出し、まず画面枠
と交わる2箇所の輪郭画素である画素S、及び画素Eの
各座標(x0,y0)、(xn-1,yn-1)を算出する。ス
テップ104は、画素Sより画素Eまで境界画素を一画
素づつ走査して、画素S及び画素Eを含んだ全部でn個
の輪郭画素の中心部の座標データを算出する。以降、画
素の中心部の座標データを画素座標と称する。なお、座
標データとしては、画面内に設定したXY座標の原点
(図3において、左下隅部とする)から、該画素の中心
部位置までのX、Y方向距離とする。
In step 103, the control device 5
The binarized data in the monitor screen is scanned one pixel at a time in the X or Y direction, and, for example, of the pixels determined to be 1, pixels in contact with pixels of 0 are extracted as contour pixels, and first, the pixels intersecting the screen frame 2 The coordinates (x 0 , y 0 ) and (x n-1 , y n-1 ) of the pixel S and the pixel E, which are the contour pixels of the location, are calculated. In step 104, the boundary pixels from the pixel S to the pixel E are scanned pixel by pixel, and the coordinate data of the central portion of a total of n contour pixels including the pixel S and the pixel E are calculated. Hereinafter, the coordinate data of the central portion of the pixel will be referred to as pixel coordinates. The coordinate data is the distance in the X and Y directions from the origin of the XY coordinates (indicated as the lower left corner in FIG. 3) set in the screen to the center position of the pixel.

【0009】ステップ105において、基準ベクトルa
(以降、単にaとも記す。図3では符号aの上に矢印を
記して表す。)と、複数の検査ベクトルbi(i=0〜
n−t−1。以降、単にbiとも記す。図3では符号b
の上に矢印を記して表す。)を設け、aに対して各bi
が作る角度の絶対値(以降単に角度差と称する)θiを
求める。ここでaは、画素S座標からt個目(例えばt
=30)の輪郭画素座標(Xt、Yt)を結ぶベクトル
である。biはベクトルの始点が、画素S座標から始ま
り順次隣接する輪郭画素座標である(n−t)個のベク
トルであり、各ベクトルの終点は、始点からt個目の輪
郭画素座標である。a、bi及び角度差θiは、輪郭画
素座標をもとに下記のように表すことができる。 a =(Xt−X0,Yt−Y0) bi=(Xt+i−Xi,Yt+i−Yi) θi=|tan-1((Yt−Y0)/(Xt−X0))−tan-1((Yt
+i−Yi)/(Xt+i−Xi))| (ただし、i=0〜n−t−1) iを0、1、2・・・・、n−t−1としたときの、a
に対する各biの(n−t)個の角度差、θ0、θ1、θ
2、・・・・、θn−t−1を求める。
In step 105, the reference vector a
(Hereinafter, it is also simply referred to as a. In FIG. 3, an arrow is shown above the symbol a.) And a plurality of check vectors bi (i = 0 to 0).
nt-1. Hereinafter, it is also simply referred to as bi. In FIG. 3, reference numeral b
Is indicated by an arrow above. ), And each bi for a
The absolute value (hereinafter simply referred to as an angle difference) θi of the angle created by is calculated. Here, a is a t-th pixel (for example, t
= 30) is a vector connecting the contour pixel coordinates (Xt, Yt). In bi, the start point of the vector is (n−t) vectors which are the contour pixel coordinates sequentially starting from the pixel S coordinate and being adjacent, and the end point of each vector is the t-th contour pixel coordinate from the start point. The a, bi and the angle difference θi can be expressed as follows based on the contour pixel coordinates. a = (Xt−X0, Yt−Y0) bi = (Xt + i−Xi, Yt + i−Yi) θi = | tan −1 ((Yt−Y0) / (Xt−X0)) − tan −1 ( (Yt
+ i−Yi) / (Xt + i−Xi)) | (where i = 0 to n−t−1), where i is 0, 1, 2, ..., Nt−1, a
(N−t) angle differences of each bi with respect to θ0, θ1, θ
2, ..., Find θn-t-1.

【0010】次にステップ106において、角度差θi
をもとに輪郭形状の変換点を求める。図4(a)に示す
ように、横軸に(n−t)個の検査ベクトルbiの開始
点画素順序を、縦軸に角度差θiをプロットし、例えば
検査部分の輪郭形状が3種類の形状の組合せから成って
いるとすれば、角度差θiが、予め設定した2個の閾値
th1及びth2を越えたとき、その検査ベクトルbi
の開始点画素J及びKを形状の変換画素とし、その画素
座標(Xj,Yj)及び(Xk,Yk)が形状の変換点
となる(図3参照)。なお、輪郭形状がr種類の形状の
組合せで成っているとすれば、予め(r−1)個の角度
差θiの閾値を制御装置5に設定しておく。
Next, at step 106, the angle difference θi
Based on, the conversion point of the contour shape is obtained. As shown in FIG. 4A, the abscissa plots the starting point pixel order of (nt) inspection vectors bi and the ordinate plots the angle difference θi. For example, the contour shape of the inspection portion is three types. If the angle difference θi exceeds two preset thresholds th1 and th2, the inspection vector bi
The starting point pixels J and K are set as shape conversion pixels, and their pixel coordinates (Xj, Yj) and (Xk, Yk) are shape conversion points (see FIG. 3). If the contour shape is made up of a combination of r types of shapes, (r-1) threshold values of the angle difference θi are set in the control device 5 in advance.

【0011】ステップ107において、各形状を数式で
定義するための各輪郭近似線を算出するために、輪郭画
素座標データの内から近似用座標データを区分けする。
前記説明において、3種類の形状に対し、形状変換点と
しての座標(Xj,Yj)及び(Xk,Yk)を求め
た。これより、下記輪郭近似線を算出するための近似用
座標データ(Xi,Yi)は、下記のiで示す範囲の輪
郭画素の中心部で表す。 第1の形状を近似…i=0 〜j 第2の形状を近似…i=j+1〜k 第3の形状を近似…i=k+1〜n−1
In step 107, the approximation coordinate data is divided from the contour pixel coordinate data in order to calculate each contour approximation line for defining each shape by a mathematical expression.
In the above description, the coordinates (Xj, Yj) and (Xk, Yk) as the shape conversion points were obtained for the three types of shapes. From this, the approximation coordinate data (Xi, Yi) for calculating the outline approximation line below is represented by the central portion of the outline pixel in the range indicated by i below. Approximate first shape ... i = 0 to j Approximate second shape ... i = j + 1 to k Approximate third shape ... i = k + 1 to n-1

【0012】ステップ108は、各輪郭近似線の線種を
認識するもので、角度差θiの度数分布を求め、これよ
り同定する。制御装置5には予め、線種、例えば直線、
円、2次曲線等と角度差θiの度数分布の関係データ
と、例えば度数に集中がみられれば一次直線、度数が平
坦であれば円であるというように判定する論理を登録し
ておく。図4(a)で示す角度差θi変化について、図
4(b)にその度数分布を示す。この場合、i=0〜j
の範囲の第1の形状の線種は直線、i=(j+1)〜kの
範囲の第2の形状の線種は円、i=(k+1)〜(n−
1)の範囲の第3の形状の線種は直線というふうに判定
できる。図5に別の輪郭形状の例を示すが、図5(b)
のような角度差θiの度数分布の場合、i=0〜jの範
囲の第1の形状の線種は直線、i=(j+1)〜kの範囲
の第2の形状の線種も直線、i=(k+1)〜(n−1)
の範囲の第3の形状の線種も直線というように判定でき
る。ここで、i=jの周辺とi=kの周辺は度数が平坦
であり、円形状の部分があることを示している。即ち、
第1の形状の直線と第2の形状の直線は、円弧でつなが
っていると判断することができる。第2の形状の直線と
第3の形状の直線についても同様である。以上のように
して、各輪郭線の線種を自動的に同定する。なお、予め
輪郭形状と線種の関係を登録しておき、この情報を用い
るようにしてもよい。
In step 108, the line type of each contour approximation line is recognized, and the frequency distribution of the angle difference θi is obtained and identified from this. The control device 5 is previously provided with a line type, for example, straight line,
The relational data of the frequency distribution of the circle, the quadratic curve, etc. and the angle difference θi, and the logic for determining that it is a linear straight line when the frequency is concentrated and a circle when the frequency is flat are registered. FIG. 4B shows the frequency distribution of the change in the angle difference θi shown in FIG. In this case, i = 0 to j
, The line shape of the first shape in the range of i = (j + 1) to k is the circle of the line shape of the second shape in the range of i = (j + 1) to k.
The line shape of the third shape in the range of 1) can be judged as a straight line. An example of another contour shape is shown in FIG. 5, but FIG.
In the case of the frequency distribution of the angle difference θi such as, the line shape of the first shape in the range of i = 0 to j is a straight line, and the line shape of the second shape in the range of i = (j + 1) to k is also Straight line, i = (k + 1) to (n-1)
The line type of the third shape in the range can also be determined as a straight line. Here, the frequency around i = j and the frequency around i = k are flat, indicating that there is a circular portion. That is,
It can be determined that the straight line of the first shape and the straight line of the second shape are connected by an arc. The same applies to the second shape straight line and the third shape straight line. As described above, the line type of each contour line is automatically identified. The relationship between the contour shape and the line type may be registered in advance and this information may be used.

【0013】ステップ109において、第1の形状から
第3の形状までの各輪郭形状を、前記同定した線種と近
似用座標データを用いて計算し、各々の数式化した輪郭
近似線L1、輪郭近似線L2及び輪郭近似線L3を算出
する(以降、単にL1、L2、L3と表すこともあ
る)。図4で示す輪郭形状では、前記説明したようにL
1とL3は一次直線式の最小二乗近似を用いて、またL
2は円方程式の最小二乗近似を用いて算出する。ステッ
プ110は、ステップ109で得られた輪郭近似線L
1、L2及びL3を表す数式をもとに、画面枠とL1と
の交点p1、L1とL2との交点p2、L2とL3との
交点p3、L3と画面枠との交点p4を求める。図6に
二値化画像と、これをもとにしたL1、L2、L3及び
前述した各交点p1、p2、p3、p4の関係を示す。
In step 109, each contour shape from the first shape to the third shape is calculated by using the identified line type and the approximation coordinate data, and the respective contoured approximation lines L1 and contours are calculated. An approximate line L2 and a contour approximate line L3 are calculated (hereinafter, also simply referred to as L1, L2, L3). In the contour shape shown in FIG. 4, as described above, L
1 and L3 are linear least-squares approximations, and L
2 is calculated using the least squares approximation of the circle equation. In step 110, the contour approximation line L obtained in step 109
An intersection p1 between the screen frame and L1, an intersection p2 between L1 and L2, an intersection p3 between L2 and L3, and an intersection p4 between L3 and the screen frame are obtained based on the mathematical expressions representing 1, L2, and L3. FIG. 6 shows the relationship between the binarized image and L1, L2, L3 based on the binarized image and the above-described intersection points p1, p2, p3, p4.

【0014】以下、ステップ111〜121に基づいて
欠け検出及び検査方法を説明する。ステップ111にお
いて、輪郭近似線に沿って、輪郭近似線を含んだ画素を
走査し、1から0に変わる直前の画素Uを抽出する。画
素Uは二値化された輪郭画素を走査して欠けを検出する
ための欠け検出開始画素である。輪郭近似線としてまず
L1について、交点p1からp2の間を処理する。この
間に複数の欠けがあれば、複数の欠け検出開始画素が存
在することになり、後述の欠け検出処理は各々の欠け検
出開始画素について行う。ステップ112において、画
素Uを出発点にして、輪郭近似線L1に対して被検査物
内部方向に輪郭画素上を再び輪郭近似線L1が通過する
画素に達するまで走査し、走査した輪郭画素座標を求め
る。図7は、図6における交点p1から交点p2に至る
範囲を拡大したものであり、以下図7をもとに説明す
る。ステップ113において、前記走査した輪郭画素座
標データから得られたX方向の最大値Xmaxと最小値X
min、及びY方向の最大値Ymaxと最小値Yminを求め
る。ステップ114において、X方向の最大値Xmax
最小値Xminを通るX軸に垂直な直線と、Y方向の最大
値Ymaxと最小値Yminを通るY軸に垂直な直線を引き、
4本の直線の4つの交点から被検査物内部側に位置する
点A、B及びCを求める。即ち、点A、B及びCを頂点
とするXY軸に平行な長方形は、欠けを内包しており、
欠けの大きさを表すことができる。図7においては、点
A、B、Cの座標は以下のようにした。 A(Xmin、Ymax) B(Xmax、Ymin) C(Xmax、Ymax
The method of detecting and inspecting a chip will be described below with reference to steps 111 to 121. In step 111, the pixels including the contour approximation line are scanned along the contour approximation line, and the pixel U immediately before changing from 1 to 0 is extracted. The pixel U is a defect detection start pixel for detecting a defect by scanning the binarized contour pixel. As the contour approximation line, first, with respect to L1, the area between intersection points p1 and p2 is processed. If there are a plurality of missing detections during this period, there will be a plurality of missing detection start pixels, and the later-described missing detection processing is performed for each missing detection start pixel. In step 112, using the pixel U as a starting point, scanning is performed on the contour pixel with respect to the contour approximation line L1 in the inward direction of the inspection object until a pixel at which the contour approximation line L1 passes again is reached, and the scanned contour pixel coordinates are determined. Ask. FIG. 7 is an enlarged view of the range from the intersection p1 to the intersection p2 in FIG. 6, which will be described below with reference to FIG. In step 113, the maximum value X max and the minimum value X in the X direction obtained from the scanned contour pixel coordinate data.
min , and the maximum value Y max and the minimum value Y min in the Y direction are obtained. In step 114, a straight line perpendicular to the X axis passing through the maximum value X max and the minimum value X min in the X direction and a straight line perpendicular to the Y axis passing through the maximum value Y max and the minimum value Y min in the Y direction are drawn.
The points A, B, and C located inside the object to be inspected are obtained from the four intersections of the four straight lines. That is, the rectangle parallel to the XY axis having the points A, B, and C as vertices contains a chip,
It can represent the size of the chip. In FIG. 7, the coordinates of points A, B, and C are as follows. A (X min , Y max ) B (X max , Y min ) C (X max , Y max )

【0015】ステップ115において、欠け検出補助線
v1、v2及びhを求める。v1は点Aを通り輪郭近似
線L1に垂直な直線、v2は点Bを通りL1に垂直な直
線、hは点Cを通りL1に沿った線である。ステップ1
16では、L1とv1とv2とhの線の交点を求める。
この交点を結ぶ図形は、輪郭近似線を一辺とする長方形
又は略四辺形であり、欠けの大きさの評価を、XY軸に
平行な基準から、輪郭近似線を基準とするものに変換す
るために設けるものである。ステップ117において、
まずv1上をL1との交点からhとの交点まで走査し
て、輪郭画素が存在するかどうかを調べる。hとの交点
までで輪郭画素が検出されなかった場合、v1を欠けの
ある側に一画素分シフトして、新規な直線v1とし、再
度L1との交点からhとの交点まで走査をして輪郭画素
の有無を調べる。この処理を輪郭画素が検出されるまで
繰り返す。ステップ118において、輪郭画素が検出さ
れたときのv1を、欠け検出線v1aとして算出する。
In step 115, the defect detection auxiliary lines v1, v2 and h are obtained. v1 is a straight line passing through the point A and perpendicular to the contour approximation line L1, v2 is a straight line passing through the point B and perpendicular to L1, and h is a line passing through the point C and along L1. Step 1
At 16, the intersection of the lines L1, v1, v2, and h is obtained.
The figure connecting the intersections is a rectangle or a quadrangle with one side of the contour approximation line, and for converting the evaluation of the size of the chip from a reference parallel to the XY axes to one based on the contour approximation line. It is provided in. In step 117,
First, v1 is scanned from the intersection with L1 to the intersection with h to check whether or not there is a contour pixel. When the contour pixel is not detected up to the intersection with h, v1 is shifted by one pixel to the side with a defect to form a new straight line v1, and scanning is performed again from the intersection with L1 to the intersection with h. Check for the presence of contour pixels. This process is repeated until the contour pixel is detected. In step 118, v1 when the contour pixel is detected is calculated as the missing detection line v1a.

【0016】ステップ119は、残りの欠け検出補助線
v2及びhに対して、ステップ117及び118の処理
をするための繰り返しループである。従って、ステップ
119を抜けたときには、図7に示すように欠け検出補
助線v2とhに対して、v1の場合と同様にして、欠け
検出線v2a及びhaが算出されている。ステップ12
0において、前記算出したv1aとv2aの垂直距離
W、L1とhaの垂直距離Dを計算する。このWとDを
検査部分に存在する欠けの幅及び深さとする。このた
め、被検査物の輪郭が画面内でどのように傾いていて
も、この傾きに影響されずに欠けの幅と深さを算出でき
る。この値は輪郭を基準とした実際の検査に則してい
る。
Step 119 is an iterative loop for performing the processing of steps 117 and 118 on the remaining defect detection auxiliary lines v2 and h. Therefore, when step 119 is exited, as shown in FIG. 7, with respect to the defect detection auxiliary lines v2 and h, the defect detection lines v2a and ha are calculated in the same manner as in the case of v1. Step 12
At 0, the calculated vertical distance W between v1a and v2a and the vertical distance D between L1 and ha are calculated. Let W and D be the width and depth of the chip existing in the inspection portion. Therefore, no matter how the contour of the inspection object is tilted on the screen, the width and depth of the chip can be calculated without being affected by the tilt. This value is based on the actual inspection based on the contour.

【0017】ステップ121は、ステップ111〜12
0の操作をL2とL3についても行うためのループであ
る。従ってステップ121をぬけた時点で、L2とL3
の範囲にある欠けの幅Wと深さDは求められいる。L2
に対しては、被検査物の円弧状の第2の形状にほぼ沿う
ような輪郭近似線L2をもとに、前述したと同様な欠け
検出処理を行うことになる。前述したように欠け検出開
始画素が何カ所かあれば、各々に対して上述の処理を行
う。ステップ122においては、ステップ121までで
求めた全ての欠けに対し、その幅Wと深さDを、予め決
めておいた判定値と比較し、判定値よりも大きければ被
検査物に欠けがあると判定する判定処理をする。欠け判
定結果は、CRT6に適宜表示する等で、外部に情報出
力することができる。
Step 121 includes steps 111 to 12
This is a loop for performing the operation of 0 for L2 and L3. Therefore, when step 121 is skipped, L2 and L3
The width W and the depth D of the chip in the range of are required. L2
In contrast, the same chipping detection processing as described above is performed based on the contour approximation line L2 that substantially follows the arc-shaped second shape of the inspection object. As described above, if there are a plurality of missing detection start pixels, the above processing is performed for each pixel. In step 122, the width W and the depth D are compared with a predetermined determination value for all the defects obtained up to step 121. If the width W and the depth D are larger than the determination values, the inspection object has a defect. The determination process for determining is performed. The lack determination result can be output to the outside by appropriately displaying it on the CRT 6.

【0018】[0018]

【発明の効果】以上説明したように、本発明は以下の効
果を有している。輪郭形状が一つの数式で表現できない
複雑な形状の被検査物に対しても、形状の組合せ数に関
する情報だけを設定すれば、実際の輪郭形状に近似した
輪郭近似線を自動設定できるため、予め詳細に輪郭形状
を形成する全ての線種とその位置等の情報を登録する必
要がなく、被検査物の輪郭形状変更に対して容易に対応
できるため、欠け検査の適用範囲が拡大する。また、撮
像画面のXY軸に平行な基準でなく、輪郭近似線を基準
として欠けの幅と長さを計測するため、被検査物の輪郭
が画面上どのようにXY軸に対して傾いていても、欠け
の大きさは同等に算出され、信頼性の高い欠け検査がで
きる。さらに、輪郭近似線をもとに撮像した二値化輪郭
画素を走査して欠けを検出検査するため、輪郭形状部の
みを欠け検査対象とできるので、効率的な欠け検査がで
きる。
As described above, the present invention has the following effects. Even for an inspected object with a complicated shape whose contour shape cannot be expressed by a single mathematical expression, if only the information about the number of combinations of shapes is set, the contour approximation line that approximates the actual contour shape can be set automatically. Since it is not necessary to register information about all the line types forming the contour shape in detail and their positions and the like, it is possible to easily deal with the change of the contour shape of the inspection object, so that the application range of the chipping inspection is expanded. In addition, since the width and length of the chip are measured with reference to the contour approximation line, not with the reference parallel to the XY axes of the imaging screen, the contour of the object to be inspected on the screen may be inclined with respect to the XY axes. However, the size of the chip is calculated equally, and the chip inspection with high reliability can be performed. Further, since the binarized contour pixels imaged on the basis of the contour approximation line are scanned to detect and inspect for defects, only the contour shape portion can be subjected to the defect inspection, so that efficient defect inspection can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施の形態を説明するための装置構成を示す
図。
FIG. 1 is a diagram showing a device configuration for explaining an embodiment.

【図2】実施の形態を説明するフローを示す図。FIG. 2 is a diagram showing a flow for explaining an embodiment.

【図3】輪郭画素と基本ベクトル、検査ベクトルの関係
を示す概念図。
FIG. 3 is a conceptual diagram showing the relationship between contour pixels, basic vectors, and inspection vectors.

【図4】検査ベクトル位置と基本ベクトルに対する方向
の違いの絶対値と示す例。
FIG. 4 is an example showing an absolute value of a difference between an inspection vector position and a direction with respect to a basic vector.

【図5】検査ベクトル位置と基本ベクトルに対する方向
の違いの絶対値と示す別の例。
FIG. 5 is another example showing the absolute value of the difference between the inspection vector position and the direction with respect to the basic vector.

【図6】欠けの検出方法を説明する図。FIG. 6 is a diagram illustrating a method of detecting a chip.

【図7】欠けの大きさを算出する方法を説明する図。FIG. 7 is a diagram illustrating a method of calculating the size of a chip.

【記号の説明】[Explanation of symbols]

1…被検査物 3…撮像手段 4…画像処理装置 5…制御装置 a…基本ベクトル b…検査ベクトル θ…aとbの作る角度の絶対値 L1、L2、L3…輪郭近似線 U…欠けの検出開始画素 v1a、v2a、ha…輪郭近似線基準で欠けを囲む線 W…欠けの幅 D…欠けの深さ DESCRIPTION OF SYMBOLS 1 ... Inspected object 3 ... Imaging means 4 ... Image processing device 5 ... Control device a ... Basic vector b ... Inspection vector θ ... Absolute value of angle formed by a and b L1, L2, L3 ... Contour approximation line U ... Missing Detection start pixel v1a, v2a, ha ... A line that surrounds the chip on the basis of the contour approximation line W ... Chip width D ... Chip depth

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 輪郭部の欠けを画像処理を用いて検査す
る欠け検査方法において、 1)検査対象部の撮像入力を二値化し、二値境を形成す
る画素を輪郭画素とし、 2)輪郭画素の一端に、設定数離れた画素に向かって基
準ベクトルを設定するとともに、各輪郭画素から前記と
同一な設定数離れた画素に向かった検査ベクトルを設定
し、基準ベクトルに対して各検査ベクトルが作る角度の
絶対値を算出し、 3)角度の絶対値が、予め設定した値を超えたとき、該
検査ベクトルの開始画素を輪郭形状変換画素として認識
し、 4)前記で認識した輪郭形状変換画素間にある線種を、
輪郭形状変換画素間にある角度の絶対値の累積度数分布
と、予め設定した累積度数分布形状と線種の関係をもと
に同定し、 5)前記同定した線種と、輪郭形状変換画素間にある輪
郭画素の有する座標値をもとに、検査対象の輪郭形状を
各々数式で表した輪郭近似線を算出し、 6)該輪郭近似線に沿って欠け検査処理を行うことを特
徴とする欠け検査方法。
1. A defect inspection method for inspecting a defect in a contour portion by using image processing, comprising: 1) binarizing an imaging input of a portion to be inspected and defining pixels forming a binary boundary as contour pixels; 2) contour At one end of the pixel, a reference vector is set toward a pixel that is a set number apart, and an inspection vector is set from each contour pixel to the same set number of pixels apart from the above, and each inspection vector is set to the reference vector. And 3) when the absolute value of the angle exceeds a preset value, the start pixel of the inspection vector is recognized as a contour shape conversion pixel, and 4) the contour shape recognized above. The line type between the converted pixels is
Identification is performed based on the cumulative frequency distribution of the absolute values of the angles between the contour shape conversion pixels and the relationship between the preset cumulative frequency distribution shape and the line type, and 5) the identified line type and the contour shape conversion pixel Based on the coordinate values of the contour pixels in, the contour approximation line expressing each contour shape of the inspection target by a mathematical formula is calculated, and 6) the chipping inspection process is performed along the contour approximation line. Chip inspection method.
【請求項2】 輪郭部の欠けを画像処理を用いて検査す
る欠け検査方法において、 1)検査対象部の撮像入力を二値化し、二値境を形成す
る画素を輪郭画素とし、 2)輪郭画素と輪郭形状を成す線種情報をもとに、輪郭
近似線を算出し、 3)画面上で輪郭画素に輪郭近似線を重ね、 4)輪郭近似線が通過している画素を、画面枠と交わる
画素から、輪郭画素に達するまで走査し、 5)該輪郭画素から再び輪郭近似線に達するまで輪郭画
素を走査し、 6)走査した輪郭画素のうち、画面に設定したXY平面
で、まずX方向の最大及び最小位置の画素を抽出してX
座標値で表わすとともに、この点を通りX軸に垂直な直
線を引き、次にY方向の最大及び最小位置の画素を抽出
してY座標値で表わすとともに、この点を通りY軸に垂
直な直線を引き、これらの直線の交点を算出し、 7)この交点の内、検査対象部内部側にある3点を抽出
し、 8)この3点の内、輪郭近似線に近接する2点からは輪
郭近似線に垂直な線を、残りの点からは輪郭線に沿った
線を引き、 9)前記3つの線各々について、輪郭座標に接するまで
平行移動し、 10)平行移動後の各3つの線で囲まれた範囲を欠けと
し、その大きさを検査することを特徴とする欠け検査方
法。
2. A defect inspection method for inspecting a defect in a contour portion by using image processing, comprising: 1) binarizing an imaging input of an inspection object portion, and pixels forming a binary boundary are contour pixels; and 2) contour The contour approximation line is calculated based on the line type information that forms the contour shape with the pixel, and 3) the contour approximation line is superimposed on the contour pixel on the screen, and 4) the pixels through which the contour approximation line passes are displayed on the screen frame. From the pixel intersecting with the contour pixel, scanning is performed until the contour pixel is reached. 5) The contour pixel is scanned until the contour approximation line is again reached from the contour pixel. 6) Among the scanned contour pixels, first, in the XY plane set on the screen, The pixels at the maximum and minimum positions in the X direction are extracted and X
In addition to being represented by coordinate values, a straight line passing through this point and perpendicular to the X axis is drawn, and then pixels at maximum and minimum positions in the Y direction are extracted and represented by Y coordinate values. Draw a straight line and calculate the intersections of these straight lines. 7) Extract 3 points on the inside of the inspection part from these intersections. 8) From these 3 points, close to the contour approximation line. Draw a line perpendicular to the contour approximation line, and draw a line along the contour line from the remaining points. 9) For each of the three lines, move in parallel until they touch the outline coordinates, and 10) For each 3 after the parallel movement, A chipping inspection method characterized in that the area surrounded by two lines is chipped and the size is inspected.
【請求項3】 輪郭部の欠けを画像処理を用いて検査す
る欠け検査方法において、 1)検査対象部の撮像入力を二値化し、二値境を形成す
る画素を輪郭画素とし、 2)輪郭画素の一端に、設定数離れた画素に向かって基
準ベクトルを設定するとともに、各輪郭画素から前記と
同一な設定数離れた画素に向かった検査ベクトルを設定
し、基準ベクトルに対して各検査ベクトルが作る角度の
絶対値を算出し、 3)角度の絶対値が、予め設定した値を超えたとき、該
検査ベクトルの開始画素を輪郭形状変換画素として認識
し、 4)前記で認識した輪郭形状変換画素間にある線種を、
輪郭形状変換画素間にある角度の絶対値の累積度数分布
と、予め設定した累積度数分布形状と線種の関係をもと
に同定し、 5)前記同定した線種と、輪郭形状変換画素間にある輪
郭画素の有する座標値をもとに、検査対象の輪郭形状を
各々数式で表した輪郭近似線を算出し、 6)画面上で輪郭画素に輪郭近似線を重ね、 7)輪郭近似線が通過している画素を、画面枠と交わる
画素から、輪郭画素に達するまで走査し、 8)該輪郭画素から再び輪郭近似線に達するまで輪郭画
素を走査し、 9)走査した輪郭画素のうち、画面に設定したXY平面
で、まずX方向の最大及び最小位置の画素を抽出してX
座標値で表わすとともに、この点を通りX軸に垂直な直
線を引き、次にY方向の最大及び最小位置の画素を抽出
してY座標値で表わすとともに、この点を通りY軸に垂
直な直線を引き、これらの直線の交点を算出し、 10)この交点の内、検査対象部内部側にある3点を抽出
し、 11)この3点の内、輪郭近似線に近接する2点からは輪
郭近似線に垂直な線を、残りの点からは輪郭線に沿った
線を引き、 12)前記3つの線各々について、輪郭座標に接するまで
平行移動し、 13)平行移動後の各3つの線で囲まれた範囲を欠けと
し、その大きさを検査することを特徴とする欠け検査方
法。
3. A defect inspection method for inspecting a defect in a contour portion by using image processing, comprising: 1) binarizing an imaging input of a portion to be inspected, a pixel forming a binary boundary being a contour pixel, and 2) a contour. At one end of the pixel, a reference vector is set toward a pixel that is a set number apart, and an inspection vector is set from each contour pixel to the same set number of pixels apart from the above, and each inspection vector is set to the reference vector. And 3) when the absolute value of the angle exceeds a preset value, the start pixel of the inspection vector is recognized as a contour shape conversion pixel, and 4) the contour shape recognized above. The line type between the converted pixels is
Identification is performed based on the cumulative frequency distribution of the absolute values of the angles between the contour shape conversion pixels and the relationship between the preset cumulative frequency distribution shape and the line type, and 5) the identified line type and the contour shape conversion pixel Based on the coordinate value of the contour pixel in, the contour approximation line that represents the contour shape of the inspection target by a mathematical formula is calculated, and 6) the contour approximation line is superimposed on the contour pixel on the screen, and 7) the contour approximation line. The pixels passing through are scanned from the pixels intersecting the screen frame until the contour pixel is reached, 8) The contour pixel is scanned until the contour approximate line is again reached from the contour pixel, and 9) Of the scanned contour pixels , First, in the XY plane set on the screen, the pixels at the maximum and minimum positions in the X direction are extracted and X
In addition to being represented by coordinate values, a straight line passing through this point and perpendicular to the X axis is drawn, and then pixels at maximum and minimum positions in the Y direction are extracted and represented by Y coordinate values. Draw a straight line and calculate the intersections of these straight lines. 10) Extract 3 points on the inside of the inspection part from these intersections. 11) From these 3 points, close to the contour approximation line. Draw a line perpendicular to the contour approximation line, and draw a line along the contour line from the remaining points. 12) For each of the three lines, translate until they come into contact with the contour coordinates, and 13) For each 3 after translation. A chipping inspection method characterized in that the area surrounded by two lines is chipped and the size is inspected.
JP8086213A 1996-04-09 1996-04-09 Inspection method for chip Pending JPH09281055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP8086213A JPH09281055A (en) 1996-04-09 1996-04-09 Inspection method for chip

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Publication Number Publication Date
JPH09281055A true JPH09281055A (en) 1997-10-31

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JP2010091514A (en) * 2008-10-10 2010-04-22 Nippon Steel Corp Surface defect inspection system, method and program
US8194948B2 (en) 2007-01-31 2012-06-05 Olympus Corporation Instrumentation endoscope apparatus
US8200042B2 (en) 2007-01-31 2012-06-12 Olympus Corporation Endoscope apparatus and program
JP2014169961A (en) * 2013-03-05 2014-09-18 Takako:Kk Tool inspection method and tool inspection apparatus
CN105181704A (en) * 2015-08-26 2015-12-23 浙江江山三友电子有限公司 Lamp-filament bepowdering quality real-time detection method
JP2017003389A (en) * 2015-06-09 2017-01-05 東芝機械株式会社 Cutter position measurement method and cutter position measurement device
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005204724A (en) * 2004-01-20 2005-08-04 Olympus Corp Endoscope apparatus for measurement
US8194948B2 (en) 2007-01-31 2012-06-05 Olympus Corporation Instrumentation endoscope apparatus
US8200042B2 (en) 2007-01-31 2012-06-12 Olympus Corporation Endoscope apparatus and program
JP2008295512A (en) * 2007-05-29 2008-12-11 Olympus Corp Endoscope apparatus for measurement, and program
JP2009014914A (en) * 2007-07-03 2009-01-22 Olympus Corp Endoscope device for measurement
JP2010091514A (en) * 2008-10-10 2010-04-22 Nippon Steel Corp Surface defect inspection system, method and program
JP2014169961A (en) * 2013-03-05 2014-09-18 Takako:Kk Tool inspection method and tool inspection apparatus
JP2017003389A (en) * 2015-06-09 2017-01-05 東芝機械株式会社 Cutter position measurement method and cutter position measurement device
CN105181704A (en) * 2015-08-26 2015-12-23 浙江江山三友电子有限公司 Lamp-filament bepowdering quality real-time detection method
CN113269743A (en) * 2021-05-20 2021-08-17 北京理工大学重庆创新中心 Chip quantity detection method based on iterative translation verification

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