JPH09273915A - Optical sensor and method for inspecting using the sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accelerae emeasuring speed by providing a second optical sensor system integrally with a first optical sqnsor, precedently sensing the position to be inspected, operating a deflector, and directing the spot light of a light emitting unit to the position. SOLUTION: An optical sensor 1 has a second optical sensor system 7. The system 7 is formed, for example, of a line sensor to conduct the operation for recognizing the position to be inspected of an object 7 to be measured. The line sensor focuses the image of an object 4 on an element via a lens 8 provided at the casing of the sensor 1, and converts it into an electric signal. The obtained signal is sent to a scanning unit 9 after processing. An operating unit 11 is formed, for example, of a galvanometer, which rapidly, accurately follows up and scans the input signal. That is, the angle of a mirror 10 is controlled based on the input signal, and the spot light from a light emitting unit 2 is directed toward the object to be inspected on a lead 4d.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical sensor, an IC lead appearance inspection method using this sensor, a ball grid array (BGA) package, a chip size package (CSP), a bare chip, a ball such as a wafer bump, and the like. The present invention relates to a bump inspection method, a bonding wire shape inspection method, and a mounting state inspection method on a substrate.

[0002]

2. Description of the Related Art In general, a laser beam is made into a spot shape to irradiate a measurement target portion of an object, the reflected light thereof is received and converted into an electric signal, and this signal is processed to obtain the shape of the object, particularly a high-level signal. Optical sensors for detecting depth (depth) are known.

When the shape of an object distributed in a certain range is measured using this optical sensor, a CC
There is a method of moving a laser beam after measuring a target portion of an object using a plane image detector such as a D camera, or a method of scanning a laser beam for one axis or two axes within a certain range.

A method of moving a laser beam after a plane image is separately measured by using a plane image detector such as a CCD camera will be described with reference to an inspection of an IC lead as an example.
As shown in FIG. 2, the camera 50 recognizes the two-dimensional data of the tip position of the lead 52 of the IC 51, and based on this data, the laser sensor 53 is operated so as to scan the measurement target portion of the IC lead 52. Therefore, two types of detection operations are required, resulting in expensive measurement.

On the other hand, in the method of two-dimensionally scanning the laser light itself in a certain pattern within a certain range, for example, as shown in FIG. The scanning system of (1) gives a motion in the X direction, and the measurement with the laser beam is performed along the zigzag locus drawn by the dotted line 54. In the figure, the points indicated by black dots and cross marks are sampling positions, and normally it is only necessary to measure the black dot parts, but inevitably the data acquisition of the non-targeted cross marks part is necessary. It has to be done, which is inefficient and difficult to speed up.

As described above, the method of two-dimensionally scanning the laser light itself within a certain range is inefficient because it inevitably needs to take in unnecessary data, and it is difficult to increase the speed.

Next, a conventional technique of the IC lead appearance inspection method will be described.

FIG. 9 shows a case where the lead appearance inspection method of the IC 56 by the laser sensor 55 is performed by using spot light. In the case of spot light, although high accuracy can be obtained, the spot light is applied to each lead 57. X and y scan axes 58 and 59 for moving the laser sensor 55 to
Is required and the cost is inevitable.

FIG. 10 shows a method of inspecting the lead of the IC 61 by the laser sensor 60 using slit light. The slit light from the laser sensor 60 is applied to the lead 62, and the reflected light is received by the camera 63. , Measure the lead 62 on one side, then rotate the IC 61,
The lead of the next side is measured similarly. In the case of such an inspection method using slit light, it is necessary to receive a wide field of view as the IC package to be inspected becomes large, but the resolution is lowered due to the expansion of the field of view. Further, in order to maintain the resolution, it is necessary to divide the field of view for measurement, resulting in an increase in processing time.

FIG. 11 shows a conventional IC lead appearance inspection method by image processing using a camera. According to this method, similar to the above-described inspection method using the slit light, there is an advantage that the x and y scanning axes are unnecessary, the cost can be reduced by that amount, and the image data can be captured at high speed. However, there is a drawback that the resolution is lowered due to the expansion of the field of view accompanying the increase in size of the IC package. Further, in order to maintain the resolution, it is necessary to divide the field of view for measurement, resulting in an increase in processing time.

Next, a ball grid array (BGA)
A conventional technique regarding a ball inspection method for a package will be described.

Conventionally, this inspection is generally performed by a method of measuring the height, pitch, etc. of the ball by two-dimensionally scanning the laser spot light. That is, FIG.
As shown in FIG. 2, the laser scanning path of the laser sensor is zigzag with respect to the ball 64 of the package, the ball is scanned, and the height, pitch, etc. of the ball are measured using the effective data at the black dots. To do. In such a two-dimensional scanning method, it is inevitable that the measurement is required at the crossed portion and the portion where the ball is out of FIG. 12, and the efficiency is poor and high-speed measurement is difficult.

Next, a conventional technique for a bonding wire shape inspection method will be described.

With the thinning of IC packages and the increase in the number of pins, the accuracy with respect to the height and pitch of the bonding wires becomes strict, and the demand for shape inspection thereof is increasing. Conventionally,
The pitch and bend of the wire are measured by a camera, but the height is measured by the focusing method. As shown in FIG. 13, the wire height measurement using the in-focus method is carried out by the wire-bonded IC package 67.
A light receiving unit (for example, a CCD camera) 66 having a light receiving lens 65 is disposed above, and the light receiving lens 65 is moved up and down to detect the wire height from the lens position in focus, and at the same time, to detect the wire pitch and bend. It is something to detect. According to this method, since the moving part is only the lens, there is an advantage that the measurement can be performed with a simple device configuration, but the movement of the lens and the focus detection operation are required for each wire, and it is difficult to increase the speed. There is a drawback.

The above method uses a CCD camera and a movable light-receiving lens, but even a focusing sensor using a laser spot light needs an operation for each wire, and similarly it is difficult to increase the speed. Is.

Next, a conventional technique for inspecting a mounting state on a substrate will be described.

The method of inspecting the mounting state of the chip components on the substrate is becoming more and more important due to the miniaturization of the components and the fine pitch. However, the apparatus for carrying out this method has various defective states. In order to recognize, classify, etc., a complicated light emitting and receiving unit and a height measuring sensor using a laser are provided, and inevitably many are expensive.

FIG. 14 shows the outline of an inspection device having several light receiving surfaces among such inspection devices. The soldering part 70 of the chip component 69 mounted on the upper surface of the printed circuit board 68 is shown in FIG. The inspection device arranged above the chip component 69 for inspection includes a light receiving surface A to which the reflected light of the laser light emitted from the laser generator 71 to the soldering part 70 via the half mirror 72 is received. E is provided, and the soldering state is detected depending on which of the light receiving surfaces the reflected light is incident on. This inspection apparatus has a drawback in that the projecting / receiving unit is complicated due to installation of a large number of light receiving surfaces and the cost is high.

FIG. 15 shows the outline of another inspection device having several height detection units. This inspection device is a laser for the measurement site of the chip part 69 mounted as shown in the drawing. It has a laser generator 73 for generating light, and a height detection unit for receiving the reflected light from the chip measurement site, and each height detection unit has a position detection unit 7
4 and a light receiving lens 75. By providing several height detection units in this way, even if the reflected light from the measurement site is diffusely reflected, one of the height detection units receives the reflected light and detects the position of the measurement site. You can However, even with this device, the configuration is complicated and the cost is inevitable.

[0020]

SUMMARY OF THE INVENTION An object of the present invention is to provide an optical sensor capable of detecting a measurement target portion and measuring its shape at high speed.

Another object of the present invention is to detect the inspection position of the IC lead and measure the height and pitch of the lead in parallel, and as a result, it is possible to perform efficient inspection in a short time.
It is to provide a lead visual inspection method.

Another object of the present invention is to provide a ball grid array, a chip size package (CSP), a bare chip, a ball such as a wafer bump, a bump, etc. capable of measuring the height, pitch, etc. of the ball at high speed. It is to provide an inspection method.

Another object of the present invention is to measure the height and pitch of the bonding wire with high accuracy and high speed.
It is to provide a bonding wire shape inspection method.

Another object of the present invention is to provide a mounting state inspecting method on a substrate which can easily determine the mounting state without using a complicated and expensive measuring device.

[0025]

According to the present invention, the above-mentioned first object is to provide a projector for generating spot light directed to the object to be measured and a light receiver for receiving reflected light from the object to be measured. Optical sensor system having an optical device, a deflector for deflecting the spot light from the light projector, and an operating device for operating the deflector, and an optical sensor provided integrally with the first optical sensor system. In the relative movement between the object to be measured and the object to be measured, the inspection target portion of the object to be measured is detected prior to the first optical sensor system, and based on the detection result, the actuator is deflected by the above-mentioned operation device. And a second optical sensor system for detecting the target portion for directing the spot light of the projector to the inspection target portion, which is solved by the optical sensor.

According to this configuration of the present invention, in the relative movement between the object to be measured and the optical sensor, first, the position to be measured is detected, and the data obtained by the detection is used,
The deflector is operated so that the light from the projector passes through the detection target point, and the height of the measurement target point can be detected by performing predetermined processing based on the amount of light received by the light receiver. The measurement speed can be increased because the measurement can be performed by the relative movement of and the measurement of an unnecessary portion is reduced.

It is preferable that the above-mentioned light projector is a laser generator, whereby the accuracy and speed of measurement can be further improved.

According to the present invention, the second object mentioned above is such that a light projector for generating spot light directed to the object to be measured, a light receiver for receiving reflected light from the object to be measured, and a light projector. First optical sensor system having a deflector for deflecting the spot light and an operating device for operating the deflector; and an optical sensor and an object to be measured, which are integrally provided with the first optical sensor system. In the relative movement with, the inspection target portion of the object to be measured is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result, A method for inspecting the external appearance of an IC lead using an optical sensor having a second optical sensor system for detecting a target portion for directing spot light of a light projector to the above-mentioned inspection target portion IC package with leads While rotating in the plane, the target position of each lead to be detected by the second optical sensor system of the optical sensor arranged at a fixed position is detected prior to the first optical sensor system, A signal according to each detection result is sent to the actuating device to operate the deflector, direct the spotlight of the projector to the target location detected by the second optical sensor system, and rotate all of the leads while rotating the IC package once. It is solved by measuring the shape and height of the.

According to this configuration of the present invention, the method can be implemented at a low cost because it does not require the x and y scan axes,
Moreover, it can be performed with high accuracy as in the conventional case. Also,
Since the measurement of each side of the IC package can be performed without stopping the rotation, high-speed measurement can be realized.

According to the present invention, the above-mentioned third problem is that a light projector for generating spot light directed to the object to be measured, a light receiver for receiving reflected light from the object to be measured, and a light projector. First optical sensor system having a deflector for deflecting the spot light and an operating device for operating the deflector; and an optical sensor and an object to be measured, which are integrally provided with the first optical sensor system. In the relative movement with, the inspection target portion of the object to be measured is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result, A ball grid array (BGA) package or a chip size package using an optical sensor having a second optical sensor system for detecting the target portion for directing the spot light of the projector to the inspection target portion. (CSP) In a method for inspecting balls or bumps such as bare chips and wafer bumps, the second optical sensor system precedes the first optical sensor system while moving the optical sensor relative to the ball grid array. The apex position of each ball is detected, a signal according to the detection result for each ball is sent to the actuator to operate the deflector, and the spot light of the projector is detected by the second optical sensor system. Solved by pointing through the vertices.

According to this configuration of the present invention, the second optical sensor system detects the ball apex position prior to the first optical sensor system, and the actuation device is provided so that the measuring light passes through the ball apex. Since the irradiation position can be controlled and measured with, relatively high speed measurement is possible.

According to the present invention, the above-mentioned fourth problem is that the projector for producing the spot light directed to the object to be measured, the receiver for receiving the reflected light from the object to be measured, and the projector. First optical sensor system having a deflector for deflecting the spot light and an operating device for operating the deflector; and an optical sensor and an object to be measured, which are integrally provided with the first optical sensor system. In the relative movement with, the inspection target portion of the object to be measured is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result, In the method of inspecting the shape of a bonding wire using an optical sensor having a second optical sensor system for detecting a target portion for directing spot light of a light projector to the inspection target portion, wire bonding I went to While moving the above-mentioned optical sensor relative to the probe, the apex of each bonding wire is detected prior to the first optical sensor system by the second optical sensor system, and the detection result for each bonding wire is obtained. The solution is to send a compliant signal to the actuator to actuate the deflector and direct the spotlight of the projector through the apex of each corresponding wire detected by the second optical sensor system.

According to this structure of the present invention, the wire optical vertex is detected by the second optical sensor system prior to the first optical sensor system so that the measuring spot light passes through the wire apex. Since the irradiation position can be controlled and measured, it is possible to shorten the measurement time per package for measuring the height of a predetermined portion of the bonding wire.

According to the present invention, the above-mentioned fifth problem is that the projector for generating the spot light directed to the object to be measured, the receiver for receiving the reflected light from the object to be measured, and the projector. First optical sensor system having a deflector for deflecting the spot light and an operating device for operating the deflector; and an optical sensor and an object to be measured, which are integrally provided with the first optical sensor system. In the relative movement with, the inspection target portion of the object to be measured is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result, Using an optical sensor that has a second optical sensor system for detecting the target portion that directs the spot light of the projector to the above-mentioned inspection target portion, the mounting state of parts, coupling points, etc. on the board can be determined. In the inspection method, the object of the measurement object While moving relatively an optical sensor described above with respect to Tokoro, prior to the first optical sensor system detects the position to be measured by the second optical sensor system,
By sending a signal according to the detection result for each target point to the actuator, operating the deflector, and directing the spot light of the projector through the corresponding target point detected by the second optical sensor system. Will be resolved.

According to this configuration of the present invention, the vicinity of the mounting state inspection target portion (for example, the soldering portion) is scanned, and the second optical sensor system precedes the first optical sensor system to obtain the solder and chip parts. , The lead portion of the IC is recognized, and the deflection device is driven and controlled by the actuator so that the spot light passes over them, and the irradiation position of the spot light is controlled.
Since the mounting state can be inspected by measuring the height of the target location and the obtained position / height data of the target location, low-cost and high-speed inspection is possible using a relatively simple device.

It goes without saying that the present invention can be applied not only to the mounting state of the substrate but also to the inspection and measurement of the protrusions on the relatively flat surface.

[0037]

1 is a schematic view of an embodiment of an optical sensor according to the present invention, in which 1 is an optical sensor, 2 is a light projector for generating spot light, and 3 is a light projector. A light receiver for receiving the reflected light of the spot light from the light projector 2 reflected by the measured object 4 (for example, the lead of an IC), and the spot light from the light projector 2 is mounted on the casing of the sensor 1. The light is refracted and converged by the optical lens 5 and projected onto the object to be measured 4, and the reflected light is refracted and converged by the light receiving lens 6 which is also attached to the casing of the sensor 1 and is incident on the light receiver 3. The projector 2 is preferably a laser projector. The light receiver 3 is composed of, for example, a PSD element or a line sensor. The height of the object to be measured 4 is measured by the optical sensor 1 by applying the principle of triangulation.
When an element is used, it can be obtained by deriving the distance to the object to be measured by arithmetic processing (implemented by a circuit or software) based on the focus position of the element. The focusing method can be used instead of the triangulation method.

The optical sensor 1 according to the invention further comprises a second optical sensor system 7, which comprises, for example, a line sensor, and which comprises the height measuring system (2, 5, Prior to the measurement by (6, 3,), the function of recognizing the inspection target portion of the measured object is performed. The line sensor forms an image (bright and dark image) of the object 4 on the element by the lens 8 provided in the casing of the sensor 1, and converts it into an electric signal (video pulse) that exactly matches the light and dark image, It outputs a video pulse signal, processes the video pulse output, and "is the end face when there is no output suddenly" or "the highest point of output is the peak".
Recognize something. The second optical sensor system 7 may be a PSD or CCD camera other than the line sensor.

The signal of the inspection target portion obtained by the second optical sensor system 7 is transmitted to the scan unit 9 provided in the sensor 1 after appropriate processing. Scan unit 9
Has a deflector 10 for deflecting the spot light from the projector 2 and comprising a mirror and the like, and an actuator 11 for operating the deflector. The actuator 11 is composed of, for example, a galvanometer, and this galvanometer scans an input signal at high speed and with high accuracy. That is, the angle of the mirror 10 is controlled based on the input signal.

The operation of the optical sensor 1 will be described. While moving the sensor 1 in the direction of the arrow with respect to the lead of the IC (the lead 4 may be moved), the second optical sensor system 7 precedes the height position measurement.
The position of the lead 4d to be inspected is recognized by (the height measurement of the leads 4a to 4c has already been completed in FIG. 1), and the recognized position signal is transmitted to the galvanometer 11 of the scan unit 9 and in response to the signal. Galvanometer 1
Reference numeral 1 controls the angle of the mirror 10 and directs the spot light from the light projector 2 to a location to be inspected on the lead 4d. The reflected light enters the light receiver 3 as described above, and the height is detected.

As described above, since the heights of the leads 4a to 4x are measured in accordance with the movement of the sensor 1 or the lead 4, only required portions are continuously selected in a series of movements. As described above, it is possible to eliminate the two types of operations and the measurement of unnecessary portions, and it is possible to speed up the measurement.

Next, with reference to FIGS. 2 and 3, an embodiment of a method for inspecting the external appearance of an IC lead according to the present invention will be described.

As shown in FIG. 2, the IC package 12 is arranged on the rotating device 13 so as to rotate in a plane, and the sensor 1 for inspecting the appearance of the leads 14 of the package 12 is predetermined. Placed in position. The structure of the sensor 1 is the same as that shown in FIG.

In the measurement, while rotating the IC package 12 by the rotation device 13, the second optical sensor system 7 of the sensor 1 detects in advance one target portion for each lead 14 and the result is detected. The light is sent to the actuator 11, the deflector 10 is operated, the spot light of the projector 2 is directed to a desired target portion of the corresponding lead, and the reflected light is received by the light receiver 3. According to the result, as described above, This is done by deriving the distance to the corresponding lead 14.

As described above, according to this method, the leads on each side can be measured only by rotating the package 12, so that the conventional x and y scanning axes are not required. Further, since the discontinuous movement as in the conventional scanning operation is eliminated (see FIG. 3), high speed measurement becomes possible.

Next, with reference to FIG. 4, an embodiment of the method for inspecting balls of the ball grid array package of the present invention will be described.

As shown in the figure, the sensor 1 is arranged with respect to the ball grid array package 15, and the sensor 1 or the package 15 is arranged so that the irradiation position of the spot light of the sensor 1 moves in the array direction of the balls 16. Movably support. The configuration of the sensor 1 is the same as that shown in FIG.

As shown in the figure, for example, while moving the package 15 in the direction of the arrow, the second optical sensor system 7 of the sensor 1 measures one object on each ball 16 on the center line of the ball. The position is detected in advance of the first optical sensor system, the result is sent to the actuator 11, the deflector 10 is operated, and the spot light of the projector 2 is
The ball is directed by passing through the apex of the ball 16 and scanned, the reflected light is received by the light receiver 3, and the signal obtained from the light receiver 3 corresponding to the desired measurement location is used to perform the ball calculation processing. This is done by finding the height of the ball and the pitch between the balls. As described above, according to this method, the measuring spot light can be scanned so as to pass through the ball apex, as compared with the two-dimensional scanning method, so that the scanning speed can be relatively high.

Next, an embodiment of the bonding wire shape inspection method of the present invention will be described with reference to FIG.

As shown in the figure, the sensor 1 is arranged on the wire-bonded chip 17, and the sensor 1 or the chip is arranged so that the spot light from the sensor 1 moves in the direction in which the bonding wires 18 are arranged. 17 is movably supported. During such relative movement, the second optical sensor system 7 of the sensor 1 precedes the first optical sensor system to detect the vertices of the wires one by one, and the signal is processed appropriately. After that, it is transmitted to the actuator 11. The actuating device changes the angle of the deflector 10 according to the received signal, so that the spot light of the projector 2 is controlled to pass through the apex of the wire. The height of the wire apex is measured by arithmetic processing using the signal when the light receiver 3 receives the reflected light when the spot light passes through the apex of the wire. It is possible to measure the pitch and bending of the wires by sequentially performing this operation on the adjacent wires.

As described above, according to this method, since the height of the bonding wire can be measured continuously with the vertex detection, the inspection can be performed at a relatively high speed.

Next, with reference to FIG. 6, a method of inspecting the mounting state on the board of the present invention will be described.

As shown in the figure, the above-mentioned sensor 1 is arranged on the printed circuit board 19, the position of the chip component 20 is given as information, and the sensor 1 and / or the substrate 19 is moved by the x / y stage. It can be moved with respect to each chip component according to the position information. The chip component 20a on the right side of the drawing is currently under inspection, and the chip component 20b on the left side is one in which recognition work of the inspection target portion is performed prior to the inspection.

The second optical sensor system 7 is brought to a predetermined position by the xy stage. Chip parts 20
The inspection target location (one location or a plurality of locations) of b is recognized, and the information is transmitted to the operating device 11. After the inspection of the chip component 20a is completed, the actuator 11 operates the deflector 10 according to the information of the chip component 20b to deflect the spot light of the projector 2 into the path passing through the recognized inspection target portion, and then the sensor 1 Alternatively, the printed circuit board 19 is moved to move the spot light along the above path to scan the inspection target portion of the chip component 20b, and the information about the reflected light received by the light receiver 3 at that portion is arithmetically processed. The condition of the chip component 20b, for example, the height is measured. When there are a plurality of measurement points for the chip component 20b, the sensor 1 is reciprocated with respect to the chip component 20b, in which case the second optical sensor system 7 precedes the first optical sensor system for each measurement point. The angle of the deflector 10 is controlled by using the recognized information, and the movement path of the spot light is changed.

As described above, according to this method, a complicated unit is not required, a simple unit can be used, and a high-speed inspection can be performed with a low-cost system.

[0056]

As described above, according to the present invention, the target portion can be recognized and scanned in the relative continuous motion operation between the optical sensor and the measuring object, and it is relatively simple. Since various measurements can be effectively performed by the system, there is an advantage that high-speed inspection and measurement can be performed relatively inexpensively.

[Brief description of drawings]

FIG. 1 is a schematic view of an optical sensor of the present invention.

FIG. 2 is a schematic diagram illustrating a method for inspecting the external appearance of an IC lead using the above optical sensor.

FIG. 3 is a plan view showing a scanning path of measuring spot light on an IC lead in the method of FIG.

FIG. 4 is a schematic diagram illustrating a method of inspecting balls of a ball grid array package using the optical sensor.

FIG. 5 is a schematic diagram illustrating a method of inspecting a bonding wire shape using the above optical sensor.

FIG. 6 is a schematic diagram illustrating a method of inspecting a mounting state on a substrate using the optical sensor.

FIG. 7 is a diagram illustrating a conventional inspection method using an optical sensor.

FIG. 8 is a schematic view illustrating a conventional inspection method using the same optical sensor.

FIG. 9 uses an optical sensor that generates spot light,
It is a schematic diagram explaining the conventional IC lead appearance inspection method.

FIG. 10 is a schematic diagram illustrating a conventional IC lead appearance inspection method using an optical sensor that generates spot light.

FIG. 11 is a schematic diagram illustrating a conventional IC lead appearance inspection method using a camera.

FIG. 12 is a schematic view illustrating a method of inspecting a ball of a conventional ball grid array package using an optical sensor.

FIG. 13 is a schematic diagram illustrating a conventional bonding wire shape inspection method.

FIG. 14 is a schematic diagram illustrating a conventional method for inspecting a mounting state on a board.

FIG. 15 is a schematic diagram illustrating another conventional method for inspecting a mounting state on a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical sensor 2 Light emitter 3 Light receiver 4 Object to be measured 5 Light emitting lens 6 Light receiving lens 7 Second optical sensor system 8 Lens 9 Scan unit 10 Deflector (mirror) 11 Actuator (galvanometer etc.) 12 IC package 13 Rotating device 14 Lead 15 Ball grid array package 16 Ball 17 Chip 18 Bonding wire 19 Printed circuit board 20 Chip parts

Claims (6)

[Claims] 1. A light projector for generating spot light directed to an object to be measured, a light receiver for receiving reflected light from the object to be measured, a deflector for deflecting spot light from the light projector, and this deflector. A first optical sensor system having an actuating device for activating the object, and an object to be measured in a relative movement between the optical sensor and the object to be measured, which is provided integrally with the first optical sensor system. The inspection target portion of the object is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result to direct the spot light of the projector to the inspection target portion. An optical sensor having a second optical sensor system for detecting a target portion. 2. The optical sensor according to claim 1, wherein the projector is a laser light generator. 3. A light projector for generating spot light directed to an object to be measured, a light receiver for receiving reflected light from the object to be measured, a deflector for deflecting spot light from the light projector, and this deflector. A first optical sensor system having an actuating device for activating the object, and an object to be measured in a relative movement between the optical sensor and the object to be measured, which is provided integrally with the first optical sensor system. The inspection target portion of the object is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result to direct the spot light of the projector to the inspection target portion. In a method of inspecting the appearance of an IC lead by using an optical sensor having a second optical sensor system for detecting a target location, rotating an IC package in which a lead comes out from the periphery in a plane. While a certain number The second optical sensor system of the above-mentioned optical sensor placed at the location detects the target position of each lead to be detected in advance of the first optical sensor system, and operates the signal according to each detection result. Sending to the device, operating the deflector, directing the spot light of the projector to the target location detected by the second optical sensor, and measuring the shape and height of all the leads while rotating the IC package once. A method for inspecting IC lead appearance, which is a feature. 4. A light projector for generating spot light directed to an object to be measured, a light receiver for receiving reflected light from the object to be measured, a deflector for deflecting spot light from the light projector, and this deflector. A first optical sensor system having an actuating device for activating the object, and an object to be measured in a relative movement between the optical sensor and the object to be measured, which is provided integrally with the first optical sensor system. The inspection target portion of the object is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result to direct the spot light of the projector to the inspection target portion. A ball grid array (BGA) package using an optical sensor having a second optical sensor system for detecting a target location,
In a method for inspecting balls and bumps such as chip size packages (CSP), bare chips, and wafer bumps, while moving the optical sensor relative to, for example, a ball grid array, The optical sensor system detects the apex position of each ball prior to the first optical sensor system, sends a signal according to the detection result for each ball to the actuator, operates the deflector, and changes the spot light of the projector. A method for inspecting balls and the like in a ball grid array package, characterized in that the balls are directed so as to pass through the vertices of the corresponding balls detected by the second optical sensor system, and the shape and position of the balls are measured. 5. A light projector for generating spot light directed to an object to be measured, a light receiver for receiving reflected light from the object to be measured, a deflector for deflecting spot light from the light projector, and this deflector. A first optical sensor system having an actuating device for activating the object, and an object to be measured in a relative movement between the optical sensor and the object to be measured, which is provided integrally with the first optical sensor system. The inspection target portion of the object is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result to direct the spot light of the projector to the inspection target portion. In a method of inspecting the shape of a bonding wire using an optical sensor having a second optical sensor system for detecting a target location, the above optical sensor is attached to a chip subjected to wire bonding. Straight line The relative position of each bonding wire is detected by the second optical sensor system prior to the first optical sensor system while moving relative to each other mechanically or rotationally, and the signal according to the detection result for each bonding wire is activated. Sending to the device, operating the deflector, directing the spot light of the projector through the apex of each corresponding wire detected by the second optical sensor system, and measuring the wire shape and position, A method to inspect the shape of the bonding wire. 6. A light projector for generating spot light directed to an object to be measured, a light receiver for receiving reflected light from the object to be measured, a deflector for deflecting spot light from the light projector, and this deflector. A first optical sensor system having an actuating device for activating the object, and an object to be measured in a relative movement between the optical sensor and the object to be measured, which is provided integrally with the first optical sensor system. The inspection target portion of the object is detected prior to the first optical sensor system, and the deflector is operated by the operating device based on the detection result to direct the spot light of the projector to the inspection target portion. In the method of inspecting the mounting state of the parts on the board, the bonding location, etc. using the optical sensor that has the second optical sensor system for detecting the target location, Relative to the above optical sensor The second optical sensor system detects the measurement target points in advance of the first optical sensor system while moving automatically, and sends a signal to the actuator according to the detection result for each target point to operate the deflector. The mounting state on the board is inspected, characterized in that the spot light of the projector is directed so as to pass through the respective target portions detected by the second optical sensor system, and the mounting height and position are measured. Method.