JPH09270570A - Oscillation circuit board and manufacture thereof - Google Patents
Oscillation circuit board and manufacture thereofInfo
- Publication number
- JPH09270570A JPH09270570A JP10433096A JP10433096A JPH09270570A JP H09270570 A JPH09270570 A JP H09270570A JP 10433096 A JP10433096 A JP 10433096A JP 10433096 A JP10433096 A JP 10433096A JP H09270570 A JPH09270570 A JP H09270570A
- Authority
- JP
- Japan
- Prior art keywords
- trimming
- conductor
- coil
- groove
- oscillation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、絶縁性の基板表
面に銅箔等の回路パターンが設けられて発振回路を形成
した発振回路用基板とその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator circuit substrate in which a circuit pattern such as copper foil is provided on the surface of an insulating substrate to form an oscillator circuit, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、例えば発振回路を構成するコイル
パターンをトリミングして周波数調整を行う電圧制御発
振器は、図４に示すように、チップ部品１が接続された
コイル形成回路パターン２のトリミング部４の銅箔を削
ってインダクタの調整を行ない、周波数調整を行ってい
た。インダクタの調整は、周知のトリミング装置により
基板表面の銅箔を削って、所定の周波数になるまで銅箔
にトリミング溝５を形成するもので、所定の周波数にな
るように１または複数の溝５を形成するものである。ま
た、図５に示すように、大幅な調整を必要とする場合
は、トリミング部４を幅広に削ってトリミング溝５を形
成し、大きな調整を行っていた。2. Description of the Related Art Conventionally, for example, as shown in FIG. 4, a voltage-controlled oscillator for trimming a coil pattern forming an oscillation circuit to adjust a frequency has a trimming portion of a coil forming circuit pattern 2 to which a chip component 1 is connected. The copper foil of No. 4 was scraped to adjust the inductor, and the frequency was adjusted. The adjustment of the inductor is performed by shaving the copper foil on the surface of the substrate by a well-known trimming device and forming the trimming groove 5 in the copper foil until a predetermined frequency is reached. Is formed. Further, as shown in FIG. 5, when a large adjustment is required, the trimming portion 4 is widely cut to form the trimming groove 5, and a large adjustment is performed.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の技術の場
合、図４に示すように、複数の溝５を形成してトリミン
グする場合、トリミングにより残るトリミング部４の幅
狭部４ａの電流方向長さが短く十分なトリミングができ
ないという問題があった。さらに、複数のトリミング溝
５を形成するものであり調整工数も多くかかるものであ
った。また、図５に示すものの場合、大幅な調整が可能
であるが、それでも十分な調整ができない場合があり、
電流方向の幅狭部４ａをより長い距離必要な場合があっ
た。この場合、トリミング部４を図５の２点鎖線で示す
ように長く取れば良いが、その場合、基板面積が大きく
なり、小型化の妨げになるものであった。In the case of the above-mentioned conventional technique, as shown in FIG. 4, when a plurality of grooves 5 are formed and trimming is performed, the length in the current direction of the narrow portion 4a of the trimming portion 4 left by trimming. However, there is a problem that the trimming is short and sufficient trimming cannot be performed. Furthermore, a plurality of trimming grooves 5 are formed, which requires a lot of adjustment man-hours. Further, in the case of the one shown in FIG. 5, although it is possible to make a large adjustment, there are cases where it is still not possible to make a sufficient adjustment.
In some cases, the narrow portion 4a in the current direction needs a longer distance. In this case, the trimming portion 4 may be made long as shown by the chain double-dashed line in FIG. 5, but in that case, the area of the substrate becomes large, which hinders miniaturization.
【０００４】この発明は、上記従来の技術に鑑みて成さ
れたもので、発振周波数の大幅な調整を容易且つ正確に
可能であり、しかも基板の小型にも寄与する発振回路用
基板とその製造方法を提供することを目的とする。The present invention has been made in view of the above-mentioned conventional technique, and allows a large adjustment of the oscillation frequency to be performed easily and accurately, and also contributes to downsizing of the substrate, and its manufacture. The purpose is to provide a method.
【０００５】[0005]
【課題を解決するための手段】この発明は、絶縁基板の
表面に形成された銅箔等の導体パターンを有し、この導
体パターンのうちの発振回路を構成するコイル部に発振
周波数調整用のトリミング部が形成され、このトリミン
グ部に予め上記導体が形成されていない切れ込みである
溝部と、上記トリミング部の内部に導体が形成されてい
ない孔状のスリットを設けた発振回路用基板である。こ
の発振回路用基板は複数の回路基板が積層されたもので
あり、上記発振回路を構成するコイル部は外表面に位置
し、その下方に、スルーホールを介してさらにコイル部
が形成されているものである。The present invention has a conductor pattern such as a copper foil formed on the surface of an insulating substrate, and a coil portion of the conductor pattern that constitutes an oscillation circuit is used for adjusting the oscillation frequency. The oscillation circuit board has a trimming portion formed therein, and has a groove portion which is a notch in which the conductor is not formed in advance in the trimming portion and a hole-shaped slit in which the conductor is not formed inside the trimming portion. This oscillator circuit board is formed by laminating a plurality of circuit boards, and the coil portion forming the oscillator circuit is located on the outer surface, and a coil portion is further formed below the coil portion via a through hole. It is a thing.
【０００６】またこの発明は、絶縁基板の表面に銅箔等
の導体パターンを形成し、この導体パターンのうちの発
振回路を構成するコイル部に発振周波数調整用のトリミ
ング部を形成し、このトリミング部に予め上記導体が形
成されていない切れ込みである溝部を設け、上記トリミ
ング部の内部に導体が形成されていない孔状のスリット
を設け、上記孔状のスリットの側縁部のうち上記溝部の
底部側を側方から切除して上記スリットに開口部を形成
し、上記コイル部のインダクタを変えて発振周波数調整
を行う発振回路用基板の製造方法である。さらに、上記
トリミング部に、上記溝部の底部側からトリミング溝を
形成して上記コイル部のインダクタを変え発振周波数を
調整するものである。Further, according to the present invention, a conductor pattern such as a copper foil is formed on the surface of an insulating substrate, and a trimming portion for adjusting an oscillation frequency is formed in a coil portion of the conductor pattern which constitutes an oscillation circuit. The groove portion that is a notch in which the conductor is not formed in advance is provided in the portion, the hole-shaped slit in which the conductor is not formed is provided inside the trimming portion, and the groove portion of the side edge portion of the hole-shaped slit is formed. This is a method of manufacturing an oscillator circuit substrate in which the bottom side is cut off from the side to form an opening in the slit and the inductor of the coil is changed to adjust the oscillation frequency. Further, a trimming groove is formed in the trimming portion from the bottom side of the groove portion to change the inductor of the coil portion and adjust the oscillation frequency.
【０００７】この発明の発振回路用基板とその製造方法
は、トリミング部に予め上記導体が形成されていない切
れ込みである溝部と、上記トリミング部の内部に導体が
形成されていない孔状のスリットを設け、発振周波数の
調整時にこのスリットの側縁部を切除して、コイル部の
導体距離を簡単に長く取ることができるようにして、周
波数調整幅を拡大したものである。In the oscillator circuit substrate and the method of manufacturing the same according to the present invention, the trimming portion has a groove portion which is a notch in which the conductor is not previously formed, and a hole-shaped slit in which the conductor is not formed inside the trimming portion. When the oscillation frequency is adjusted, the side edge portion of the slit is cut off so that the conductor distance of the coil portion can be easily increased, thereby expanding the frequency adjustment width.
【０００８】[0008]
【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図１〜図３はこの発明の一
実施形態の発振回路用基板を示すもので、発振回路のコ
イル部のトリミングにより周波数調整を行う電圧制御発
振器の回路基板についてのものである。この実施形態の
発振回路基板１０は、例えばフェノール樹脂シートのプ
リプレグ等からなる絶縁基板１２に、銅箔その他の導体
による導体パターンである回路パターン１３が形成さ
れ、その回路パターン１３の一部は発振コイル部１５と
して形成されている。そして、発振コイル部１５の端部
は、発振周波数調整用のトリミング部１４となってい
る。トリミング部１４は、銅箔等の導体が形成されてい
ない切れ込みである溝部２２と、トリミング部１４の内
部に形成された、銅箔等の導体が形成されていない細い
孔状のスリット２４が設けられている。なお、絶縁基板
１２の厚さは、例えば０．１５ｍｍ程度であり、銅箔の
厚さは数十μｍ程度である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show an oscillator circuit board according to an embodiment of the present invention, which relates to a circuit board of a voltage controlled oscillator for performing frequency adjustment by trimming a coil portion of the oscillator circuit. In the oscillator circuit board 10 of this embodiment, a circuit pattern 13, which is a conductor pattern of copper foil or other conductor, is formed on an insulating substrate 12 made of, for example, a prepreg of a phenol resin sheet, and a part of the circuit pattern 13 oscillates. It is formed as the coil portion 15. Then, the end of the oscillation coil portion 15 serves as a trimming portion 14 for adjusting the oscillation frequency. The trimming portion 14 is provided with a groove portion 22 which is a notch in which a conductor such as copper foil is not formed, and a thin hole-shaped slit 24 which is formed inside the trimming portion 14 and in which a conductor such as copper foil is not formed. Has been. The insulating substrate 12 has a thickness of about 0.15 mm, and the copper foil has a thickness of about several tens of μm.
【０００９】この発振回路基板１０は、複数の絶縁基板
１２が積層されたものであり、発振回路を構成するコイ
ル部１５が形成された絶縁基板１２が外表面側に位置
し、その下方に、スルーホール１６を介して、図３に示
すコイル部１８が形成された絶縁基板２０が積層されて
いる。さらに、絶縁基板１２の他の回路パターン１３と
絶縁基板２０の他の回路部ともスルーホール１６を介し
て接続され、さらに、他の積層された回路パターンとも
接続されている。The oscillator circuit board 10 is formed by laminating a plurality of insulating substrates 12, and the insulating substrate 12 on which the coil portion 15 constituting the oscillator circuit is formed is located on the outer surface side and below the insulating substrate 12. The insulating substrate 20 having the coil portion 18 shown in FIG. 3 is laminated via the through hole 16. Further, the other circuit pattern 13 of the insulating substrate 12 and the other circuit portion of the insulating substrate 20 are also connected via the through holes 16, and further connected to other laminated circuit patterns.
【００１０】この実施形態の発振回路用基板の製造方法
は、絶縁基板１２，２０の表面に銅箔等による回路パタ
ーン１３を形成し、この回路パターン１３を形成する際
に、コイル部１５，１８も形成する。そしてこの時、表
面側のコイル部１５に、発振周波数調整用のトリミング
部１４と、銅箔等の導体が形成されていない切れ込みで
ある溝部２２、導体が形成されていない孔状のスリット
２４も形成する。In the method of manufacturing the oscillator circuit substrate of this embodiment, the circuit patterns 13 made of copper foil or the like are formed on the surfaces of the insulating substrates 12 and 20, and when the circuit patterns 13 are formed, the coil portions 15 and 18 are formed. Also forms. At this time, in the coil portion 15 on the front surface side, the trimming portion 14 for adjusting the oscillation frequency, the groove portion 22 which is a cut in which a conductor such as a copper foil is not formed, and the hole-shaped slit 24 in which the conductor is not formed are also formed. Form.
【００１１】そして、発振周波数の調整に際して、孔状
のスリット２４の側縁部のうち溝部２２の底部２５側の
導体を、側方から切除してスリット２４に開口部２６を
形成する。これにより、コイル部１５のインダクタを変
えて、この発振回路の周波数調整を行うものである。さ
らに、より多くの周波数調整または微調整が必要な場
合、トリミング部１４に、溝部２２の底部２５側からさ
らに溝部２２に沿ってトリミング溝２８を適宜の深さだ
け形成して、コイル部１５のインダクタを変え、発振周
波数を調整するものである。When adjusting the oscillation frequency, the conductor on the side of the bottom 25 of the groove 22 of the side edge of the hole-shaped slit 24 is cut off from the side to form the opening 26 in the slit 24. As a result, the inductor of the coil section 15 is changed to adjust the frequency of the oscillation circuit. Further, when more frequency adjustment or fine adjustment is required, a trimming groove 28 is formed in the trimming portion 14 from the bottom portion 25 side of the groove portion 22 along the groove portion 22 to an appropriate depth, and the trimming portion 14 is formed. It changes the inductor and adjusts the oscillation frequency.
【００１２】この実施形態の発振回路用基板とその製造
方法によれば、発振回路の高周波電流が流れるコイル部
の端部のトリミング部１４を、スリット２４の一側縁部
を切除するだけで、図１の矢印で示すように、電流の通
路長を大幅に長くするトリミングを行なうことができ、
簡単なトリミング作業で、大幅な周波数調整を可能にす
るものである。しかも、トリミング部１４は大きく取る
必要がなく、回路基板１０の小型化にも寄与する。さら
に調整が必要な場合は、トリミング部１４の溝部２２の
底部２５側からトリミング部１４を溝部２２に沿って切
除し、トリミング溝２８を所定の深さに形成することに
より、より大幅の周波数調整や、または微調整を可能に
するものである。しかも、このトリミングは、スリット
２４の側縁部を切除する際の方向と同方向にトリミング
装置を作動させれば良く、装置の動作が単純な安価なト
リミング装置で、正確且つ大幅なインダクタの調整が可
能となるものである。According to the oscillator circuit board and the method of manufacturing the same of this embodiment, the trimming portion 14 at the end of the coil portion of the oscillator circuit through which the high-frequency current flows is simply cut off at one side edge of the slit 24. As shown by the arrow in FIG. 1, it is possible to perform trimming for significantly increasing the path length of the current,
A simple trimming operation enables a large frequency adjustment. Moreover, it is not necessary to make the trimming portion 14 large, which contributes to downsizing of the circuit board 10. If further adjustment is necessary, the trimming portion 14 is cut along the groove portion 22 from the bottom portion 25 side of the groove portion 22 of the trimming portion 14, and the trimming groove 28 is formed to a predetermined depth, whereby a larger frequency adjustment is performed. Or, it enables fine adjustment. Moreover, this trimming may be performed by operating the trimming device in the same direction as when cutting the side edge portion of the slit 24, and the operation of the device is simple and inexpensive. Is possible.
【００１３】尚、この発明の発振回路用基板は、上記実
施形態に限られず、トリミング部のスリットや溝部の数
は適宜選定可能なものであり、トリミング方法も適宜の
トリミング装置を使用して可能なものである。The oscillator circuit board according to the present invention is not limited to the above embodiment, and the number of slits and grooves in the trimming portion can be selected as appropriate, and the trimming method can also be performed using an appropriate trimming device. It is something.
【００１４】[0014]
【発明の効果】この発明の発振回路用基板とその製造方
法は、発振周波数の調整に際して、スリットが形成され
たトリミング部の簡単なトリミング操作で大幅な調整が
可能であり、しかも微調整も適宜可能とするものであ
る。また、トリミング部には、予めスリットや溝部が形
成され、大きなスペースを必要とせず、大幅なトリミン
グが可能なものであり、回路基板の小型化にも寄与する
ものである。According to the oscillator circuit board and the method of manufacturing the same of the present invention, when adjusting the oscillation frequency, it is possible to make a large adjustment by a simple trimming operation of the trimming portion in which the slits are formed. It is possible. Further, the trimming portion is preliminarily formed with slits or groove portions, does not require a large space, and can be greatly trimmed, which also contributes to downsizing of the circuit board.
【図１】この発明の一実施形態の発振回路用基板のコイ
ル部とトリミング部の部分拡大正面図である。FIG. 1 is a partially enlarged front view of a coil portion and a trimming portion of an oscillator circuit board according to an embodiment of the present invention.
【図２】この発明の一実施形態の発振回路用基板の表面
側の絶縁基板の正面図である。FIG. 2 is a front view of the insulating substrate on the front surface side of the oscillator circuit substrate according to the embodiment of the present invention.
【図３】この発明の一実施形態の発振回路用基板の積層
された絶縁基板の正面図である。FIG. 3 is a front view of a laminated insulating substrate of the oscillator circuit substrate according to the embodiment of the present invention.
【図４】従来の技術の発振回路用基板の表面側の絶縁基
板のコイル部とトリミング部の部分拡大正面図である。FIG. 4 is a partially enlarged front view of a coil portion and a trimming portion of an insulating substrate on the front surface side of a conventional oscillator circuit substrate.
【図５】他の従来の技術の発振回路用基板の表面側の絶
縁基板のコイル部とトリミング部の部分拡大正面図であ
る。FIG. 5 is a partially enlarged front view of a coil portion and a trimming portion of an insulating substrate on the front surface side of another conventional oscillation circuit substrate.
２，１３ 回路パターン ４，１４ トリミング部 ５，２８ トリミング溝 １０ 回路基板 １２，２０ 絶縁基板 １５，１８ コイル部 １６ スルーホール ２２ 溝部 ２４ スリット ２５ 底部 ２６ 開口部 2, 13 Circuit pattern 4, 14 Trimming part 5, 28 Trimming groove 10 Circuit board 12, 20 Insulating substrate 15, 18 Coil part 16 Through hole 22 Groove part 24 Slit 25 Bottom part 26 Opening part
Claims (4)
ンを有し、この導体パターンのうちの発振回路を構成す
るコイル部に発振周波数調整用のトリミング部が形成さ
れ、このトリミング部に予め上記導体が形成されていな
い切れ込みである溝部と、上記トリミング部の内部に導
体が形成されていない孔状のスリットを設けた発振回路
用基板。1. A conductor pattern is formed on a surface of an insulating substrate, and a coil portion of the conductor pattern that constitutes an oscillation circuit is provided with a trimming portion for adjusting an oscillation frequency. A substrate for an oscillation circuit, which is provided with a groove portion that is a notch in which a conductor is not formed and a hole-shaped slit in which the conductor is not formed inside the trimming portion.
積層されたものであり、上記発振回路を構成するコイル
部は外表面側に位置し、その下方にスルーホールを介し
てさらにコイル部が積層されて形成されている請求項１
記載の発振回路用基板。2. The oscillator circuit board is formed by stacking a plurality of circuit boards, wherein the coil portion constituting the oscillator circuit is located on the outer surface side, and the coil portion is further provided below the coil portion via a through hole. The laminated structure is formed by:
The substrate for the oscillation circuit described.
し、この導体パターンのうちの発振回路を構成するコイ
ル部に発振周波数調整用のトリミング部を形成し、この
トリミング部に予め上記導体が形成されていない切れ込
みである溝部を設け、上記トリミング部の内部に導体が
形成されていない孔状のスリットを設け、上記孔状のス
リットの側縁部のうち上記溝部の底部側の上記トリミン
グ部を側方から切除して上記スリットに開口部を形成
し、上記コイル部のインダクタを変えて発振周波数調整
を行う発振回路用基板の製造方法。3. A conductor pattern is formed on the surface of an insulating substrate, a trimming portion for adjusting the oscillation frequency is formed in a coil portion of the conductor pattern which constitutes an oscillation circuit, and the conductor is previously formed in the trimming portion. Provided with a groove that is a notch, a hole-shaped slit in which a conductor is not formed inside the trimming portion, the trimming portion on the bottom side of the groove portion of the side edge portion of the hole-shaped slit A method of manufacturing an oscillator circuit substrate, which is cut from a side to form an opening in the slit and the inductor of the coil is changed to adjust the oscillation frequency.
から上記溝部に沿ってトリミング溝を形成して、上記コ
イル部のインダクタを変え発振周波数を調整する請求項
３記載の発振回路用基板の製造方法。4. The oscillator circuit board according to claim 3, wherein a trimming groove is formed in the trimming portion from the bottom side of the groove portion along the groove portion to change the inductor of the coil portion to adjust the oscillation frequency. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433096A JPH09270570A (en) | 1996-03-29 | 1996-03-29 | Oscillation circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433096A JPH09270570A (en) | 1996-03-29 | 1996-03-29 | Oscillation circuit board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09270570A true JPH09270570A (en) | 1997-10-14 |
Family
ID=14377933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10433096A Pending JPH09270570A (en) | 1996-03-29 | 1996-03-29 | Oscillation circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09270570A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
-
1996
- 1996-03-29 JP JP10433096A patent/JPH09270570A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
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