JPH09267291A - Substrate cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure a stripperless substrate cutter that is composed of only both vertical cutter bodies and reduces the number of part items sharply, and simultaneously capable of effectively utilizing the whole surface of a wiring substrate as a mounted area of chip parts. SOLUTION: In this substrate cutter of a wiring substrate, it consists of a lower cutter edge 2 at the stationary side and an upper cutter edge 4 at the movable side oppositely set up in this lower cutter edge 2, and both these lower and upper edges 2 and 4 are composed of double-edge type cutter bodies with inclined edge surfaces 2a and 4a of the same angle, and in case of these vertical cutter edges 2 and 4, a lower edge cutter 2b and an upper edge cutter 4b are zero each in terms of overstroke in time of cutting the wiring substrate 5, therefore they are set up so as to be slightly off-centered, and thus plural spots of the wiring substrate 5 are simultaneously cut off by a plural pair of these cutter edges 2 and 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press-type board cutting machine suitable for cutting a printed wiring board or the like.

[0002]

2. Description of the Related Art An example of a conventional substrate cutting machine of this type is shown in FIGS.
Referring to FIG. In FIG. 5, reference numerals 20, 20
Is a pair of fixed-side lower cutter bodies, and rectangular shaped receiving blades 21 and 21 are arranged on the upper inner end sides of both lower cutter bodies 20 and 20, and the outer corners of the receiving blades 21 and 21 are lower edge blades. Two
1a and 21a. Further, on the upper surface of the lower cutter bodies 20, 20, lower strippers 22 and 22 formed of coil springs are arranged adjacent to the receiving blades 21 and 21.

A pair of movable upper cutter bodies 23, 23 are arranged opposite to each other above the lower cutter bodies 20, 20. At the tips of the upper cutter bodies 23, 23, there are provided upper cutter blades 24, 24 having vertical surfaces 24a, 24a whose inner surface is flush with the upper cutter bodies 23, 23 and whose outer surface has a slope. This cutter blade 24,
The leading end of 24 serves as upper edge blades 24b and 24b, which are offset from the lower edge blades 21a and 21a of the receiving blades 21 and 21 described above by a predetermined gap amount.

The vertical surfaces 24a of the upper cutter blades 24, 24,
The upper stripper 25, 2 whose tip is slightly longer than the upper edge blades 24b, 24b of the upper cutter blade so as to contact the upper stripper 25, 2
5 is supported by a support member (not shown), and is arranged so as to be biased in the protruding direction by spring means. The upper strippers 25, 25 are the receiving blades 2 of the lower cutter bodies 20, 20.
It corresponds to 1, 21.

When the substrate is cut by the substrate cutting machine thus constructed, first, the receiving blade 2 of the lower cutter body 20, 20 is cut.
The wiring board 26 is positioned and placed so as to straddle over the parts 1 and 21. Here, when the upper strippers 25, 25 come down together with the upper cutter bodies 23, 23, first, when the tips of the upper strippers 25, 25 hit the wiring board 26, substantially at the same time as the upper edge blades 24b, 24b and the receiving blades. With the lower edge blades 21a, 21a, the wiring board 26 serving as a product board and the end plates 26a, 26a are cut on both outer sides thereof.

FIG. 6 is an enlarged view of a main part showing a cut state of the wiring board 26. According to this, both end portions of the wiring board 26 are sandwiched between the receiving blades 21 and 21 and the upper strippers 25 and 25, and the cut surface is the vertical surface 2 of the upper cutter blades 24 and 24.
The cut surface of the wiring board 26 is in a so-called biting state in contact with the wirings 4a and 24a. Further, the end plates 26a, 26a are pressed down by the inclined surfaces of the upper cutter blades 24, 24 at the same time as the cutting, so that the lower strippers 22, 22 are compressed and divided below the wiring board 26.

Thus, in the lifting operation of the upper cutter bodies 23, 23, only the upper cutter blades 24, 24 move upward, so that the wiring board 26 in the bite state is the upper stripper 2
The upward movement is blocked by the presence of 5, 25 and the receiving blades 21,
You can leave it on 1. On the other hand, the end plates 26a,
In FIG. 26a, the lower strippers 22, 22 are moved upward as the upper cutter bodies 23, 23 are pulled up, and the cut wiring board 26 and the end plates 26a, 26a are placed on the lower cutter bodies 20, 20 as shown in FIG. Located in.

[0008]

By the way, the conventional board cutting machine as described above has a structure in which the cutting surface of the board bites the vertical surfaces 24a, 24a of the upper cutter blades 24, 24 after cutting the wiring board 26. Because there is, upper cutter blade 24,
It is necessary to use the upper strippers 25, 25 to eliminate this bite when the upper side of the wiring board 24 moves up.
Coil spring type lower strippers 22 and 22 are required to allow the end plates 26a and 26a to escape downward when cutting No. 6.

Therefore, as a component structure of the board cutting machine,
In the upper cutter bodies 23, 23, upper strippers 25, 25 are provided as separate members, a support member (not shown) that supports the upper strippers 25, 25 in a vertically movable manner, and a support member that is fixed to the upper cutter bodies 23, 23 is not shown. Since a screw member is required and the lower cutter bodies 20 and 20 need the lower strippers 22 and 22 formed of coil springs, the structure as a board cutting machine becomes complicated and a large number of parts are required. As a result, it took time to assemble and was a factor of cost increase.

When the wiring board 26 is cut, the upper and lower strippers 25, 25 are sandwiched between the receiving blades 21, 21 and the upper strippers 25, 25 at both ends of the board.
There was a limitation that chip parts could not be mounted in the area on the substrate that touches.

The present invention has been made in order to solve the above-mentioned problems, and is composed of only upper and lower cutter bodies to greatly reduce the number of parts, and the entire surface of the wiring board is mounted on the mounting area of chip parts. The purpose is to obtain a stripper-less substrate cutting machine that can be effectively used as.

[0012]

In order to achieve the above-mentioned object, a board cutting machine according to the present invention is a board cutting machine for wiring boards and the like, in which the board cutting machine is provided with a fixed blade and an opposing arrangement to the fixed blade. The fixed blade and the movable blade are composed only of a double-edged blade body having inclined blade surfaces at the same angle, and a plurality of pairs of fixed blades and movable blades are used to simultaneously move multiple locations on the substrate. It is designed to be cut.

With this configuration, since the fixed blade and the movable blade have the inclined blade surfaces, both cutting portions of the wiring board do not bite the fixed blade and the movable blade, and therefore the conventional stripper is used. Can be unnecessary.

Further, the fixed blade and the movable blade are set so that the edge blade is zero in overstroke when the substrate is cut, and is slightly off-centered, so that the important edge blade of the fixed blade and the movable blade is set. It is possible to prevent damage to the product.

Further, by applying the invention to the cutting of the substrate on which the chip parts are mounted, the end surface of the substrate is not interfered by the cutting machine at the time of cutting the substrate. It can be installed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a substrate cutting machine according to the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of a substrate cutting machine according to this example. Reference numerals 1 and 1 denote a pair of fixed lower-side parallel cutter bodies having lower cutter blades 2 and 2 at their tip portions (upper end portions), and reference numerals 3 and 3 respectively oppose the upper portions of the lower cutter bodies 1 and 1. And a pair of movable upper parallel cutter bodies having upper cutter blades 4 and 4 at the tip (lower end).

The lower cutter blade 2 is a double-edged blade body having inclined blade surfaces 2a, 2a, and the tip is a lower edge blade 2b, and the upper cutter blade 4 is a double-edged blade body having inclined blade surfaces 4a, 4a. The upper edge blade 4b has an overall shape having a blade width sufficient to cut one side of a wiring board, which will be described later, as shown in FIG. The cutter bodies 1 and 3 are obtained by quenching a steel material such as iron and grinding both cutter blades 2 and 4.

The upper and lower cutter blades 2 and 4 will be described in more detail. The inclined blade surfaces 2 of the cutter blades 2 and 4 will be described.
a, 2a and 4a, 4a have the same inclination angle, and the angle θ with respect to the perpendicular is set to 30 ° as an example. Therefore, the blade angle of the cutter blades 2 and 4 is 60 ° in this case.

As shown in FIG. 3, the lowest point of the upper cutter 4 with respect to the lower cutter blade 2 is zero overstroke where the upper edge blade 4b does not hit the lower edge blade 2b, and the upper edge blade 4b The lower edge blade 2b is set to the minimum off center S (0.2 mm in the embodiment).

The wiring board cut by the board cutting machine of the present invention thus constructed is made of, for example, glass epoxy resin, and the wiring board is first cut by the lower cutter bodies 1, 1 as shown in FIG. The wiring board 5 is positioned and placed so as to straddle the lower edge blades 2b, 2b. Here, the upper cutter bodies 3 and 3 descend and the upper and lower edge blades 2b,
Wiring board 5 serving as a product board is cut by 2b and 4b, 4b, and end plates 5a, 5a are cut on both outer sides thereof.

FIG. 3 is an enlarged view of a main part in a state where the wiring board 5 is cut. According to this, in the wiring board 5, the upper and lower corner portions of both cutting portions are the inclined blade surfaces 2 of the left and right lower cutter blades 2, 2.
a, 2a and inclined blade surfaces 4a, 4a of the upper cutter blades 4, 4
It is sandwiched between the wiring board 5 and the inclined blade surfaces 4a, 4a.
The clamping force direction (vector) received on the wiring board 5 acts diagonally downward as indicated by the broken line.
There is no biting on the upper and lower cutter blades.
Therefore, during the upward movement of the upper cutter blades 4, 4, the wiring board 5 and the end plates 5a, 5a remain on the lower cutter blades 2, 2 as shown in FIG. 4, and only the upper cutter blades 4, 4 move upward. To do.

Here, the upper and lower cutter blades 2, 2 and 4,
Although the case where the inclined blade surface of 4 is 30 ° has been described, for example, when the inclined blade surface is set to about 15 °, it is suitable for the cutting action of the wiring board, but the angle of the inclined blade surface rises too much for cutting. The wiring board at that time tends to bite. Further, when the inclined blade surface is around 60 °, biting of the wiring board can be avoided, but the cutting action becomes difficult. Therefore, in the present invention, from various experimental results, it is preferable to use an inclined blade surface of about 30 °, which does not bite the wiring board and does not hinder the cutting action.

As described above, the substrate cutting machine according to the present invention can be constituted only by the upper and lower cutter bodies 1 and 3 having the cutter blades, and the stripper which does not require the conventional stripper for preventing the bite of the wiring substrate is eliminated. It can be a substrate cutting machine without a touch panel. As a result, the structure can be simplified, the number of parts can be significantly reduced, and the cost can be reduced.

Further, the lowermost point of the upper cutter 4 with respect to the lower cutter blade 2 is set to zero overstroke so that the upper edge blade 4b does not hit the lower edge blade 2b. Since it does not hit, the edge blade can be prevented from being damaged.

Further, since the end surface of the board is not interfered by the cutting blade at the time of cutting the wiring board, the chip parts can be mounted on the entire surface of the board without the restriction of mounting the chip parts.

The present invention is not limited to the embodiments described above and shown in the drawings, and various modifications can be made without departing from the scope of the invention.

In the above-described embodiment, the wiring board 5 is cut at two places in the parallel direction by the pair of upper and lower cutter blades 2, 4, but it is also possible to cut at three or more places in the parallel direction. Or, it is possible to cut in the orthogonal direction at the same time.

Further, in the embodiment, the cutting of the wiring board on which the chip components are mounted has been described, but it goes without saying that the wiring board may be cut before the mounting of the chip components, and further, a resin-based board other than the wiring board. It is also widely applicable to cutting of.

[0029]

As described above, the board cutting machine according to the present invention is a board cutting machine for wiring boards and the like, in which the board cutting machine is composed of a fixed blade and a movable blade opposed to the fixed blade. , Both the fixed blade and the movable blade are composed only of a double-edged blade body having an inclined blade surface of the same angle, so that a plurality of pairs of fixed blades and movable blades are used to simultaneously cut a plurality of positions of the substrate, It is possible to use a stripper-less board cutting machine that does not require a stripper for preventing the bite of the conventional wiring board. Moreover, the structure can be simplified and the number of parts can be greatly reduced, and cost reduction can be achieved. There is an effect that you can.

Further, the fixed blade and the movable blade are set so that the edge blade has zero overstroke when the substrate is cut and is slightly off-centered, so that the edge blade of the fixed blade and the movable blade is damaged. Can be prevented in advance.

Further, by applying to the cutting of the substrate on which the chip component is mounted, the edge surface of the substrate is not interfered by the cutting machine at the time of cutting the substrate, so that the mounting area of the chip component is limited. Instead, chip components can be mounted on the entire surface of the substrate.

[Brief description of drawings]

FIG. 1 is a view of a substrate cutting machine according to the present invention before cutting a substrate.

FIG. 2 is a perspective view of the upper and lower cutter blades of the present invention.

FIG. 3 is an enlarged view of a main part when a substrate is cut.

FIG. 4 is a diagram showing a state where the upper cutter blade is pulled up after cutting the substrate.

FIG. 5 is a diagram of a conventional substrate cutting machine before substrate cutting.

FIG. 6 is an enlarged view of a main part of the same when a substrate is cut.

FIG. 7 is a diagram showing a state where the upper cutter is pulled up after cutting the substrate.

[Explanation of symbols]

1 lower cutter body, 2 lower cutter blade, 2a inclined blade surface, 2b lower edge blade, 3 upper cutter body, 4a inclined blade surface, 4b upper edge blade, 5 wiring board

Claims (3)

[Claims] 1. A board cutting machine for wiring boards and the like, wherein the board cutting machine comprises a fixed blade and a movable blade opposed to the fixed blade, and both the fixed blade and the movable blade have the same angle. A substrate cutting machine comprising only a double-edged blade body having an inclined blade surface and simultaneously cutting a plurality of positions on a substrate using a plurality of pairs of fixed blades and movable blades. 2. The substrate cutting machine according to claim 1, wherein the fixed blade and the movable blade are set so that the edge blade has zero overstrlock and is slightly off-centered when the substrate is cut. A substrate cutting machine characterized by the above. 3. The board cutting machine according to claim 1, wherein the board cutting machine is applied to cutting a board on which a chip component is mounted.