JPH09266134A - Manufacture of composite ceramic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for fabricating a composite ceramic capacitor which can require mounting operation of terminal electrode plates to a single composite ceramic capacitor at a single process, facilitate its mounting, be made high in its mounting accuracy, and be able to cope with automation of the mounting operation, by employing improved terminal electrode plates. SOLUTION: First prepared are a capacitor body 21 which includes a plurality of bonded multilayered ceramic capacitors 22 having a pair of terminal electrodes 23 and 23, and a pain of terminal electrode member 10 for coupling a pair of terminal electrode plates 11 via a linkage 12 and 11. Then, a capacitor body 21 is disposed between a pain of the pair of terminal electrode plates 11 and the terminal member 10 so that the terminal electrodes 23 are faced with the terminal electrode plates 11, and then the terminal electrode plates 11 are mounted to the respective terminal electrodes 23. Thereafter, the linkage 12 is cut off and removed from the terminal electrode plates 11. As a result, there can be fabricated a capacitor which facilitates mounting of the terminal electrode plates 11 through a single process accurately.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite ceramic capacitor which is composited by stacking and joining a plurality of laminated ceramic capacitors and connecting respective terminal electrodes with terminal electrode plates.

[0002]

2. Description of the Related Art A monolithic ceramic capacitor is widely used in various electronic circuits and electronic devices as a small surface-mounting circuit element capable of obtaining stable electrostatic capacitance characteristics over a wide range from small capacity to large capacity. The demand for them is increasing more and more in recent years. This multilayer ceramic capacitor is
On the ceramic green sheet that will become the dielectric layer after firing, a conductive paste that will also become internal electrodes after firing is printed as an internal electrode pattern, and a plurality of these are laminated and pressure-bonded and cut into a chip shape of a predetermined size. It is manufactured by a process of firing and then applying external electrodes (terminal electrodes) for surface mounting.

In order to obtain a small-sized and large-capacity capacitor in the monolithic ceramic capacitor manufactured as described above, the dielectric layer is made to have a high dielectric constant, and the number of laminated layers of the dielectric layer and the internal electrode is increased. The body layer must be thinned. However, as the number of stacked layers increases or the film thickness decreases, the positional displacement between the internal electrodes becomes large, and desired characteristics cannot be obtained, or delamination called delamination occurs due to firing. Therefore, there are many problems in manufacturing and there is a limit to increase the capacity by increasing the number of layers and thinning. Therefore, an electrolytic capacitor is generally used for a large-capacity capacitor such as a smoothing capacitor used in a power supply circuit of an electronic device.

However, when an electrolytic capacitor is mounted on a printed circuit board of an electronic device such as a transceiver or a mobile communication device such as a mobile phone or a cordless phone which is used in an environment with a large temperature change, the temperature is 0 ° C. or less. Reliance on temperature changes such as electrolytic capacitor leaking due to contraction of sealing part of electrolytic capacitor in low temperature environment and leakage of electrolyte solution, or insufficient mechanical strength of electrolytic capacitor due to expansion and contraction of circuit board due to temperature change There was a problem that it was inferior in sex. Further, since the electrolytic capacitor has polarity and the high frequency characteristics are inferior to those of the ceramic capacitor, there is also a problem that the EMI noise countermeasure becomes insufficient.

On the other hand, a monolithic ceramic capacitor is excellent in mechanical strength and temperature characteristics, has no trouble such as liquid leakage, is non-polar and has excellent high frequency characteristics. As a capacitor
A composite ceramic capacitor has been proposed in which a plurality of laminated ceramic capacitors are stacked and each terminal electrode is integrally joined by a terminal electrode plate to form a composite.

FIG. 12 is a front view showing an example of such a composite ceramic capacitor. According to the composite ceramic capacitor 1 shown in FIG.
Are stacked with the terminal electrodes 3 aligned, and the adhesive 4
Are joined together to form the capacitor body. A terminal electrode plate 5 is joined and fixed to the terminal electrode 3 with solder 6 so that the terminal electrodes 3 are electrically connected to each other. The composite ceramic capacitor 1 having such a structure is mounted and used by connecting the terminal electrode plate 5 to the surface mounting connection electrodes (connection lands) provided on the circuit board by a method such as soldering. It As a result, a large-capacity composite ceramic capacitor which is superior in mechanical strength and temperature characteristics to an electrolytic capacitor, has no trouble such as liquid leakage, is nonpolar, and has excellent high frequency characteristics.

For such a composite ceramic capacitor, terminal electrode plates of various shapes and configurations are disclosed, for example, in Japanese Patent Laid-Open Nos. 2-304910, 3-245515, and 4-188810.
It is proposed in Japanese Patent Application Laid-Open No. 4-302123, Japanese Utility Model 6-14458, Japanese Utility Model 7-47902, Japanese Patent Application No. 6-149529.

Further, Japanese Patent Laid-Open No. 3-245515 discloses a method of mounting a terminal electrode plate of a stack capacitor chip (composite ceramic capacitor), which includes a first step of arranging folding holding portions of the terminal electrode plate so as to face each other inside. , The first
The terminal electrode portion of the terminal electrode plate arranged by the step of (1) and the end surface electrodes on both sides of the stack capacitor chip are made to face each other, and the stack capacitor chip is mounted on the folding holding portion of the terminal electrode plate facing each other. Process,
A third step of sandwiching the stacked capacitor chip mounted by the second step between the terminal electrode plates on both sides thereof, and solder-bonding the end face electrodes and the terminal electrode plate in this state;
A method of mounting a terminal electrode plate has been proposed, which includes a fourth step of cutting a portion of the terminal electrode plate that is solder-fused by the third step, which is exposed from the end surface electrode of the stack capacitor chip. A method is also disclosed in which a plurality of terminal electrode plates formed in a frame shape are used as the terminal electrode plates and the folding holding portions of the two frame-shaped terminal electrode plates are arranged so as to face each other inside. ing.

[0009]

However, since the conventional terminal electrode plates including the above proposals are independent members corresponding to the opposing terminal electrodes, a plurality of laminated ceramic capacitors are stacked. It was necessary to separately attach the terminal electrodes on both sides of the capacitor body. That is, when manufacturing a composite capacitor, it was necessary to attach the terminal electrode plate to the capacitor body twice. In addition, these capacitor bodies and terminal electrode plates are small in size, and it is necessary to attach the terminal electrode plates in order to obtain stable capacitor characteristics. Especially, in the case of cap type terminal electrode plates, the required accuracy of attachment is high. Therefore, in the conventional method for manufacturing a composite ceramic capacitor, a pallet or the like is required to prevent the terminal electrode plate from being displaced with respect to the capacitor body in the solder reflow process, and it is difficult to automate the mounting work of the terminal electrode plate. There was a problem.

When it is necessary to manually attach the terminal electrode plate to one composite ceramic capacitor twice, the work efficiency is improved and the number of work processes is increased because the manual operation is performed. There was a problem that it was not possible to sufficiently stabilize characteristics and reduce mounting defects.

Further, according to the method of mounting the terminal electrode plate proposed in Japanese Patent Laid-Open No. 3-245515, the stress absorption function of various stresses is deteriorated, the risk of solder shavings, the adhesion of flux, solder balls, etc. There was a problem.

Therefore, as a method of manufacturing a composite ceramic capacitor, particularly with respect to mounting of the terminal electrode plate on the capacitor body, a manufacturing method that can be mounted accurately and easily has been desired.

The present invention has been completed to solve the above-mentioned problems, and an object thereof is to use an improved terminal electrode plate so that the work of attaching the terminal electrode plate to one composite ceramic capacitor is performed once. Another object of the present invention is to provide a method for manufacturing a composite ceramic capacitor, which can be easily mounted, has high mounting accuracy, and can be easily adapted to automation of mounting work.

[0014]

SUMMARY OF THE INVENTION A method of manufacturing a composite ceramic capacitor according to the present invention comprises a plurality of monolithic ceramic capacitors having a pair of terminal electrodes at opposite ends thereof, and a capacitor body in which the respective terminal electrodes are aligned and joined. A terminal electrode member in which a pair of terminal electrode plates are connected by a connecting portion is prepared, and the capacitor body is arranged between the pair of terminal electrode plates of the terminal electrode member so that each terminal electrode of the capacitor body faces the terminal electrode plate. At the same time, each terminal electrode plate is attached to each terminal electrode so as to have electrical connection, and thereafter, the connecting portion of the terminal electrode member is cut and removed from the terminal electrode plate.

According to the method for manufacturing a composite ceramic capacitor of the present invention, a pair of terminal electrode plates to be attached to the terminal electrodes of the capacitor body are connected by a connecting portion to form a terminal electrode member, and each terminal electrode plate is attached to the capacitor body. After connecting and electrically connecting to each terminal electrode, the connecting part is cut and removed from the terminal electrode plate, so that the insertion and positioning of the capacitor body between the terminal electrode plates can be performed smoothly, easily and accurately. In addition, since the work of attaching the terminal electrode plate to one composite ceramic capacitor only needs to be done once, the number of work steps can be reduced, the work and product reliability can be improved, and automation of work is easily supported. You will be able to.

Further, since the pair of terminal electrode plates are connected to each other by the connecting portion and attached to the capacitor body, the pallet for preventing the displacement of the terminal electrode plate with respect to the capacitor body, which is conventionally required in the solder reflow process or the like. It is possible to eliminate the need for jigs and the like, which also makes it possible to reduce the number of man-hours for the work, and it is possible to easily cope with automation.

Further, when the hoop material is used as the terminal electrode member, the steps from the molding of the terminal electrode member to the application of solder to the insertion of the capacitor body to the attachment to the soldering to the cutting to the completion of the composite ceramic capacitor are continuously performed. It will be much easier to automate.

[0018]

DETAILED DESCRIPTION OF THE INVENTION A method of manufacturing a composite ceramic capacitor according to the present invention will be described below with reference to the drawings.

1 to 3 are views showing an example of a terminal electrode member used in the method for manufacturing a composite ceramic capacitor of the present invention. FIG. 1 is a front view, FIG. 2 is a plan view, and FIG. 3 is a side view. is there.

In the terminal electrode member 10 shown in FIGS. 1 to 3, 11 is a terminal electrode plate attached to each terminal electrode of the capacitor body, and 12 is a connection for connecting a pair of terminal electrode plates 11 and 11 so as to face each other. It is a department. Further, 13 is a horizontal holding portion for holding the terminal electrodes of the capacitor body from the left and right, 14 is a bending holding portion for holding the terminal electrodes of the capacitor body from above and below by bending the capacitor body, and 15 is a bending holding portion. Opposite holding portions for holding the terminal electrodes of the capacitor body from above and below, facing 14 Bending holding part 14
The opposite holding portion 15 also plays a role as a mounting terminal connected to a connection land on the circuit board at the time of mounting on the mounting circuit board. It should be noted that the lateral holding portion 13, the bending holding portion 14, and the facing holding portion 15 are not essential, and may be appropriately provided in various positions and in various shapes and sizes as desired.

Since the terminal electrode plate 11 is attached to each terminal electrode of the capacitor body so as to have electrical connection, it usually has a shape and an area that substantially cover each terminal electrode of the capacitor body. Although it is formed as a thing, if each laminated capacitor can be mechanically joined and each terminal electrode of the capacitor body can be electrically connected, it may be attached to only a part of each terminal electrode. It may have a shape and a size, and may be one that meets the specifications of the composite ceramic capacitor.

Further, when the pair of terminal electrode plates 11 and 11 are arranged so as to face each other, if they are arranged so as to have a spread on the side where the capacitor body is inserted, the insertion of the capacitor body becomes smooth and easy, and workability is improved. It is preferable because it improves.
In order to arrange the pair of terminal electrode plates 11, 11 so as to face each other with such a spread, for example, the connecting portion 12 may be slightly bent or curved as shown in FIG.

The connecting portion 12 has a pair of terminal electrode plates 11, 11 arranged so that the capacitor body is inserted between them so as to face the terminal electrodes, and after the terminal electrode plates 11 are attached to the terminal electrodes, It is to be cut and removed from the electrode plate 11.
This makes it possible to obtain a composite ceramic capacitor in which the pair of terminal electrode plates 11 and 11 are independently attached to the terminal electrodes of the capacitor body.

The position, shape, dimensions, etc. of the connecting portion 12 may be appropriately set according to the desired specifications of the composite ceramic capacitor and the terminal electrode 11. In addition to the example shown in FIGS. 1 to 3, as in the example of the terminal electrode member 16 shown in the perspective view of FIG. 4, for example, the connecting portion 17 is provided only on one side of the pair of terminal electrode plates 11.
5 may be provided, and as in the example of the terminal electrode member 18 shown in the perspective view of FIG.
A linear connecting portion 19 may be provided below the. In FIGS. 4 and 5, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals. Also in these examples, it goes without saying that it is preferable to dispose the pair of terminal electrode plates 11 and 11 so as to be widened on the side where the capacitor body is inserted by bending the connecting portions 17 or 19.

As the connecting portion, as shown in FIGS. 1 to 3, the surface of the terminal electrode plate 11 is provided on one side of the pair of terminal electrode plates 11 and 11, that is, on the side opposite to the side where the capacitor body is inserted. When installed to form a nearly vertical surface, this connection
The pair of terminal electrode plates 11 and 11 can be stably erected by using 12, and it becomes possible to perform stable and reliable mounting work of the terminal electrode plates in both manual work and automated work. preferable.

Examples of the material for forming the terminal electrode member as described above include metals such as Ni, Cu, Fe, Cr, Ag and Au and alloys thereof. These are all preferable in that they can be attached to the terminal electrodes of the capacitor body by using solder, cream solder, conductive paste, brazing material or the like so as to have an electrical connection. Also, SUS
Metals such as (stainless steel), Al, W, Ti, Mo, and alloys thereof can be used. When a material that cannot be soldered such as these is used, it is preferable to use a conductive adhesive or the like for attachment.

The size of the terminal electrode member may be appropriately set as described above, and the thickness varies depending on the material, but it is 0.1 to 0.2 mm considering that there is an appropriate loss capable of absorbing residual stress. It is good to set it to a degree.

In order to manufacture a desired terminal electrode member, a die is manufactured and processed into a single terminal electrode member 10 as shown in FIGS.
What is punched out by these dies may be continuously formed without being cut off to form a so-called hoop shape which is wound in a reel shape. For hoops, bend them before inserting the capacitor body.

Next, a method of manufacturing the composite ceramic capacitor of the present invention will be described in the order of manufacturing steps with reference to the drawings, taking the case of using the terminal electrode member 10 as an example. In these figures, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals.

FIG. 6 is a front view of the terminal electrode member 10 similar to FIG. The terminal electrode member 10 in the figure includes a pair of terminal electrode plates.
Cream solder 20 is applied to 11/11. Instead of the cream solder 20, a conductive adhesive or the like may be used depending on the material of the terminal electrode plate 11 or the terminal electrode of the capacitor body. Further, these may be applied to the end surface side of the capacitor body to which the terminal electrode 11 is attached.

Here, the area where the cream solder 20 is applied to the terminal electrode plate 11 may be set according to the size of the multilayer ceramic chip capacitor and the type of the cream solder 20, the conductive adhesive, etc., but the upper limit thereof is set. Is set to 60% or less, preferably 50% or less with respect to the entire area of the end surface of the capacitor body. When the application area of the cream solder 20 exceeds 60% of the entire end face, thermal stress is likely to remain and the reliability tends to decrease. On the other hand, the lower limit of the coating area is
Although it depends on the attachment strength of the terminal electrode plate 11 with the cream solder 20 or a conductive adhesive, it is 20% or more, preferably 30% or more with respect to the entire area of the end face so that the desired attachment strength can be obtained. It is better to set it to% or more. If the coating area is smaller than 20%, the attachment strength of the terminal electrode plate 11 may be insufficient, or the electrical connection between the terminal electrode and the terminal electrode plate 11 may be insufficient, resulting in deterioration of conduction. When the cream solder 20 and the conductive adhesive are dispersed and applied to a plurality of places, the total area of them is set within the above range. Further, it is desirable to set the coating area as small as possible within the above range in order to reduce the residual stress.

Further, it is desirable that the thickness of the cream solder 20 or the conductive adhesive applied after the attachment is in the range of 150 to 250 μm. The thickness after attachment is
If the thickness is less than 150 μm, the attachment strength of the terminal electrode plate 11 tends to be insufficient, and the weather resistance and environment resistance tend to be poor. On the other hand, 250 μm
If thicker, cream solder will be applied to the entire end face of the capacitor body.
The conductive adhesive and the like tend to spread and the function of absorbing thermal stress tends to deteriorate.

Next, as shown in the front view of FIG. 7, a capacitor body 21 in which a plurality of laminated ceramic capacitors 22 each having a pair of terminal electrodes 23, 23 at opposite ends are aligned and joined to each other, is formed. The terminal electrode member 10 is inserted between the pair of terminal electrode plates 11, 11 as indicated by an arrow in the figure.

The ceramic dielectric used for the laminated ceramic capacitor 21 of the composite ceramic capacitor of the present invention includes, for example, BaTiO ₃ , LaTiO ₃ , and CaTi.
_{O 3, NdTiO 3, MgTiO 3} , SrTiO 3, C
aZrO ₃ , SrSnO ₃ and BaTiO ₃ with Nb ₂ O
₅ , a composition containing Ta ₂ O ₅ , ZnO, CoO, etc.,
Ba which is a constituent atom of BaTiO ₃ is Ca and Ti is Z.
Barium titanate-based materials such as solid solutions partially substituted with r or Sn, Pb (Mg _1/3 Nb _2/3 ) O ₃ , Pb (F
e, Nd, Nb) O ₃ -based perovskite structure compound,
Binary composition such as Pb (Mg _1/3 Nb _2/3 ) O ₃ -PbTiO ₃ , Pb (Mg _1/3 Nb _2/3 ) O ₃ -PbTi
O ₃ -Pb (Mg _1/2 W _1/2 ) O ₃ , Pb (Mg _1/3 N
_{b 2/3) O 3 -Pb (Zn} 1/3 Nb 2/3) O 3 -PbT
iO ₃ , Pb (Mg _1/3 Nb _2/3 ) O ₃ -Pb (Zn
_1/3 Nb _2/3 ) O ₃ -Pb (Sm _1/2 Nb _1/2 ) O _{3 and} other three-component compositions, or MnO and Mn
Examples thereof include lead-based relaxor materials such as those to which O ₂ , CuO, BaTiO _{3 and the} like are added.

The material forming the internal electrodes of the monolithic ceramic capacitor 22 using these ceramic dielectrics is
Examples thereof include Pd, Ag, Pt, Ni, Cu, Pb and alloys thereof.

Further, in forming the terminal electrode 23, a conductive paste prepared by adding glass frit or the like to the same electrode material as the internal electrode and mixing it with a binder is used. This conductive paste is applied to both end faces of the main body of the multilayer ceramic capacitor 22 or both end faces and the outer surfaces around the end faces and baked to form desired terminal electrodes 23.

The plurality of monolithic ceramic capacitors 22 are bonded by an adhesive agent, and as such an adhesive agent, an epoxy-based, silicone-based, acrylic-based, or other resin adhesive is used. Above all, it is preferable to use the UV-curable adhesive in that the electric power and heat generation of the drying furnace can be reduced as compared with the thermosetting adhesive.

The monolithic ceramic capacitors 22 forming the capacitor body 21 may be stacked vertically not only as shown in FIG. 7 but also side by side.

Next, after inserting the capacitor main body 21, as shown in the front view of FIG. 8, in order to attach the terminal electrode plate 11 to each terminal electrode 23, for example, by a jig such as a simple press, the connecting portion 12
By pressing the vicinity of the center of the above from above, the terminal electrode plate 11 is brought close to the terminal electrode 23 side as shown by the arrow in the figure.

Next, as shown in the front view of FIG. 9, the bending holding portion 14 of each terminal electrode plate 11 is bent toward the capacitor body 21 side to hold the capacitor body 21 at the position of the terminal electrode 23. After that, the terminal electrode plate 11 is attached to each of the terminal electrodes 23 so as to have an electrical connection by melting the cream solder 20 in a reflow oven. When a conductive adhesive is used instead of the cream solder 20, it is put in a drying oven and attached in the same manner.

As a result, the pair of terminal electrode plates 11, 11 can be attached to the pair of terminal electrodes 23, 23 of the capacitor body 21 in one step.

At this time, since the pair of terminal electrode plates 11 and 11 are connected by the connecting portion 12, the connecting portion 12 is attached when the terminal electrode plates 11 are attached to the terminal electrodes 23 of the capacitor body 21. Plays a role of a fixing jig for the terminal electrode plate 11, and also has an effect of preventing the positional displacement of the terminal electrode plate 11.
As a result, the terminal electrode plate 11 can be attached accurately.

After that, as shown in the plan view of FIG. 10, the connecting portion 12 of the terminal electrode member 10 is cut and removed from the terminal electrode plate 11 at a portion indicated by A in the figure, for example. As such a cutting method, for example, a notch (cutout) such as a V-groove shape is previously formed in a portion indicated by A, and is cut by a simple press, or is manually cut by 2-3 times. A method such as bending and cutting may be used. In addition to the portion indicated by A in the figure, the portion to be cut may be appropriately set in the vicinity thereof according to the specifications of the composite capacitor.

As a result, the pair of terminal electrode plates 11 and 11 are independently attached to the terminal electrodes 23 of the capacitor body 21 so as to be electrically connected to the terminal electrodes 23.
The composite ceramic capacitor 24 as the final product as shown in the front view is completed.

[0045]

The present invention will be described in detail below based on specific examples, but these do not limit the content of the present invention in any way.

Example 1 A 5750 type (length 5.7 mm, using a lead-based perovskite dielectric material having characteristics of 10 μF and 25 V)
Prepare two monolithic ceramic capacitors with a width of 5.0 mm), apply an adhesive containing acrylic resin as the main component,
After aligning the terminal electrodes and overlapping them in two stages, dry oven (80-100
The main body of the capacitor was obtained at 180 ° C for 180 to 200 seconds.

Further, as the terminal electrode member, as shown in FIGS.
The shape shown in was prepared. Here, the thickness of the terminal electrode plate is 0.15 mm, and the size of the terminal electrode plate is the width.
5.5mm x 5.0mm in size, covering the terminal electrodes of the above capacitor body, and the width of the horizontal holding part is 1.5mm.
× Length 5.0 mm, fold holder size is width 1.5 mm ×
Height 1.0 mm, opposite holding dimensions are 5.5 mm width x length
It was set to 1.5 mm. The dimensions of the connecting part are 1.3 mm wide x 5.9 mm long, and the distance from the horizontal holding part to the outside of the connecting part is
As a U-shaped type with a size of 1.6 mm, the terminal electrode of the capacitor body and the terminal electrode plate can be made to face each other with a gap of 0.4 to 0.5 mm, and slightly bent as shown in Fig. 1. The capacitor body can be easily inserted.

Next, as shown in FIG. 6, high temperature cream solder having a liquid phase of 295 ° C. and a solid phase of 280 ° C. was applied to the terminal electrode plate of the terminal electrode member with an area of 60% to 20% of the terminal electrode of the capacitor body. It is applied by a dispenser with a coating thickness of 150 to 250 μm so that the capacitor body is inserted from above between the terminal electrode members by an adsorption method using an air nozzle as shown in FIG. 7, and the central portion of the connecting portion 12 can be pushed in. By pressing the connecting portion with such a bifurcated simple press, as shown in FIG.
As shown in Fig. 9, the terminal electrode plate is moved to the terminal electrode side of the capacitor body, and the bending holding portions are respectively bent from the sides by a simple press to bend the terminal electrode plate to the capacitor body side as shown in Fig. I attached it. As a result, the terminal electrode plate is fixed to the capacitor body with high positional accuracy, so that the pallet for preventing the displacement of the terminal electrode plate, which has been conventionally used in the next reflow soldering step, is unnecessary.

After that, the capacitor body to which the terminal electrode member is attached as described above is put into a reflow furnace by using a jig of an alumina plate, and the cream solder is melted to melt the terminal electrode plate and the terminal electrode of the capacitor body. And attached.

Then, the connecting portion is cut and removed at a portion A shown in FIG. 10 by pushing down from above with a simple press, and finally, using an ultrasonic cleaning machine, an organic solvent (IPA) is added to remove it.
After washing for 10 minutes to remove the flux residue, a 20 μF / 25 V composite ceramic capacitor was obtained as the composite ceramic capacitor of the present invention.

This composite ceramic capacitor was evaluated by performing an appearance inspection and an electrical characteristic inspection (measurement of capacitance, dielectric loss tangent, insulation resistance) as follows.

Further, as a test of reliability against thermal stress and environmental temperature change, tests such as temperature cycle, high temperature load, load in wet and tensile strength, and vibration test were conducted and evaluated.

In the appearance inspection, a binocular microscope with a magnification of 10 was used to visually inspect the appearance of abnormality in the soldered portion between the terminal electrode and the terminal electrode plate and the presence or absence of residue after cleaning. As a result, there were no appearance defects in 500 inspections, and none was found.

Capacitance and dissipation factor are digital LC
Using an R meter (4274A made by YHP), frequency 1 kHz
A signal of z and a measurement voltage of 1 Vrms was input, and measurement was performed on 50 pieces. As a result, the average value of capacitance is 21.3 μF,
The minimum value was 20.2 μF and the maximum value was 22.1 μF, which was a good characteristic with little variation. Also, the dielectric loss tangent is 0.28%
It was good as below.

The insulation resistance is measured by an insulation resistance meter (TOA SM-
It measured about 50 pieces using 9E). As a result, the average value of insulation resistance is 2.5 × 10 ⁴ MΩ, and the minimum value is 2.0 × 10 ⁴
MΩ, the maximum value was 4.9 × 10 ⁴ MΩ, which was a good characteristic with little variation.

Temperature cycle (after leaving at -30 ° C for 10 minutes +
5 cycles of leaving at 85 ℃ for 10 minutes) High temperature load (1000 hours)
・ Humidity load (1000 hours) ・ Tensile strength etc.
As a result of performing 100 pieces, the number of defects was 0 in any test. Further, in the vibration test as well, no defect occurred in 50 tests. From these results,
It was confirmed that the composite ceramic capacitor of the present invention has excellent reliability.

[Example 2] In manufacturing the composite ceramic capacitor of the present invention in the same manner as in [Example 1], as a terminal electrode member, a strip-shaped base material having a shape obtained by expanding the terminal electrode member of [Example 1]. A terminal electrode member using a hoop material, which was continuously punched so as to be connected to each other at a connecting portion and wound on a reel, was used.

Using this terminal electrode member, first, the terminal electrode plates provided with the lateral holding portion and the bending holding portion on both sides of the connecting portion while the connecting portions are connected to each other are separated from the base material in a developed state, and are simply pressed. The terminal electrode plates were bent and raised to face each other, and the lateral holding portions were also bent to form the same shape as the terminal electrode member of [Example 1].

Next, cream solder was applied to the terminal electrode plate with a dispenser, and the capacitor body was inserted. Then, the folding and holding part is bent by a simple press, put into a reflow furnace, and after the evacuation, the connecting parts are cut off from each other and the terminal electrode plate and the connecting part by the simple press, so that the above steps are continuously performed in accordance with the feeding of the hoop material. The composite ceramic capacitor manufactured by the present invention was obtained.

By using the hoop material as the terminal electrode member in this way, since each terminal electrode member is continuously connected in a strip shape, bending of the terminal electrode member-application of cream solder-insertion of the capacitor body ~Soldering~
It was confirmed that it became easier to continuously automate the process up to the cutting and removal of the connecting portion. Also, since each terminal electrode member is continuously connected in a strip shape,
It has become possible to manufacture composite ceramic capacitors with constant tact. Furthermore, even in this case, the pallet used in the conventional solder reflow process or the like is not necessary, which can reduce the number of steps and facilitate the automation.

Then, the composite ceramic capacitors thus obtained were subjected to the appearance inspection and the electrical characteristic inspection in the same manner as in [Example 1].
The same excellent evaluation result was obtained.

From the above results, according to the method for manufacturing the composite ceramic capacitor of the present invention, it is possible to reduce the number of working steps, improve the working efficiency, stabilize the product characteristics, and reduce the defective mounting of the terminal electrode plate. It was confirmed that it is possible to easily cope with the automation of the mounting work of the terminal electrode plate.

[0063]

As described in detail above, according to the present invention,
A plurality of monolithic ceramic capacitors having a pair of terminal electrodes at opposite ends are attached to the terminal electrodes of a capacitor body by aligning and joining the respective terminal electrodes. After mounting the capacitor body between the pair of terminal electrode plates so that each terminal electrode faces each terminal electrode plate and attaching each terminal electrode plate to each terminal electrode so as to have electrical connection By cutting and removing the connecting portion from the terminal electrode plate, the insertion and positioning of the capacitor body between the terminal electrode plates can be performed smoothly, easily and accurately, and the terminal electrode for one composite ceramic capacitor Since only one plate installation work is required, the number of work steps can be reduced and the work and product reliability can be improved. Even if it is necessary, we will provide a method for manufacturing composite ceramic capacitors that can sufficiently improve work efficiency, increase the number of work processes, stabilize product characteristics, reduce mounting defects, etc., and can easily cope with automation of mounting work. We were able to.

Further, according to the method of manufacturing the composite ceramic capacitor of the present invention, the pair of terminal electrode plates are integrated as the terminal electrode members, so that the terminal electrode plate for the capacitor body, which has been conventionally required for solder reflow or the like. It is possible to eliminate the need for a jig such as a pallet for preventing the displacement of the capacitor, and it is possible to stably manufacture the composite ceramic capacitor.

Further, when the hoop material is used as the terminal electrode member, it becomes much easier to continuously automate the steps from the molding of the terminal electrode member / insertion of the capacitor body to the completion of the composite ceramic capacitor.

[Brief description of drawings]

FIG. 1 is a front view showing an example of a terminal electrode member used in a method for manufacturing a composite ceramic capacitor of the present invention.

FIG. 2 is a plan view showing an example of a terminal electrode member used in the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 3 is a side view showing an example of a terminal electrode member used in the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 4 is a perspective view showing another example of the terminal electrode member used in the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 5 is a perspective view showing another example of the terminal electrode member used in the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 6 is a front view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 7 is a front view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 8 is a front view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 9 is a front view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 10 is a plan view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 11 is a front view showing the method for manufacturing the composite ceramic capacitor of the present invention.

FIG. 12 is a front view showing an example of a composite ceramic capacitor.

[Explanation of symbols]

 10, 16, 18 ... ・ Terminal electrode member 11 ・ ・ ・ ・ ・ ・ Terminal electrode plate 12, 17, 19 ・ ・ ・ ・ Coupling 21 ・ ・ ・ ・ ・ ・ Capacitor body 22 ・ ・ ・・ ・ ・ Multilayer ceramic capacitor 23 ・ ・ ・ ・ ・ ・ Terminal electrode 24 ・ ・ ・ ・ ・ ・ ・ ・ Composite ceramic capacitor

Claims (1)

[Claims] 1. A capacitor body in which a plurality of laminated ceramic capacitors having a pair of terminal electrodes at opposite ends thereof are aligned and joined to each other, and a terminal electrode member in which a pair of terminal electrode plates are connected by a connecting portion. And disposing the capacitor body between the pair of terminal electrode plates of the terminal electrode member so that each terminal electrode of the capacitor body faces the terminal electrode plate and electrically connecting each terminal electrode plate to each terminal electrode. A method for manufacturing a composite ceramic capacitor, characterized in that it is attached so as to have it, and then the connecting portion of the terminal electrode member is cut and removed from the terminal electrode plate.