JPH09262767A - Exhaust structure of polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the exhaust structure of a polishing device dispensing with attaching and detaching an exhaust duct when a table dome is attached and detached and facilitating maintenance of a turntable. SOLUTION: The exhaust structure of a polishing device is provided with a top ring 75 for holding a polishing object, a turntable 73 including a polishing surface for polishing the surface of the polishing object held by the top ring 75, and a dressing ring 79 for regenerating the polishing surface of the turntable 73. A table dome 10 of a shape covering the turntable 73 is fitted to the top of the turntable 73. A discharge water tray 20 for receiving fluid dropping from the turntable 73 is provided on the underside of the outer circumference of the turntable 73. Gas inside the table dome 10 is exhausted through the exhaust duct 23 by connecting the exhaust duct 23 to the discharge water tray 20.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing the surface of an object to be polished such as a semiconductor wafer, and more particularly to an exhaust structure of a polishing apparatus suitable for exhausting mist generated on a turntable. .

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor wafer, a polishing apparatus is used to make the surface of the semiconductor wafer flat and mirror-finished.

4A and 4B are views showing a conventional polishing apparatus of this type. FIG. 4A is a schematic plan sectional view and FIG. 4B is a schematic side sectional view.

As shown in the figure, the polishing apparatus comprises a top ring unit 122 having a top ring 121 attached to both sides of a turntable 101 and a dressing unit 142 having a dressing tool 141 attached thereto. Further, this polishing apparatus is provided with various waterproofing mechanisms in order to prevent scattering or dropping of a polishing liquid or the like that occurs when polishing a semiconductor wafer.

That is, the upper surface of the turntable 101 is covered with a table dome 111 for preventing the splash of liquid splashing during polishing. A ring-shaped toy 105 for receiving the falling liquid is attached to the lower side of the outer circumference of the turntable 101. Further, a flat plate-shaped waterproof pan 107 is attached around the toy 105 to prevent the liquid from invading downward.

Further, the table dome 111 is provided with openings 113 and 115 for inserting the top ring 121 and the dressing tool 141, and exhaust duct mounting portions 117 and 117 are projected from the upper surface thereof.

Exhaust ducts 151 and 151 are connected to the exhaust duct mounting portions 117 and 117, respectively.
151 is connected to an exhaust duct 153 extending in the lateral direction,
The exhaust duct 153 is connected to an exhaust duct 155 extending further upward.

Then, the semiconductor wafer held on the lower surface of the top ring 121 is moved to the opening 113 of the turntable 101 and brought into contact with a polishing cloth provided on the turntable 101 to polish the surface of the semiconductor wafer. In addition, the dressing tool 141 is attached to the opening 115 of the turntable 101.
To contact the polishing surface of the turntable 101 to regenerate (dress) the surface of the polishing cloth after polishing.

When polishing or dressing a semiconductor wafer, a polishing liquid or dressing liquid (pure water) is supplied to the upper surface of the rotating turntable 101, and the polishing liquid or dressing liquid rotates the rotating turntable 101 or top. It is scattered around by the ring 121 or the like.

The scattered liquid drops from the outer periphery of the turntable 101, is caught by the toy 105, and is drained to the outside from the drain pipe 106. Further, the mist (fog) floating around the turntable 101 is sucked in from the exhaust ducts 151 and 151 and exhausted to the exhaust duct 153.
Exhausted from 155 to the outside.

[0011]

By the way, the turntable 101 requires periodic maintenance such as replacement of the polishing cloth, but at that time, the table dome 111 must be removed.

However, in order to attach / detach the table dome 111, the exhaust ducts 151, 151 attached to the table dome 111 must be attached / detached each time, and the attaching / detaching work is complicated.

The present invention has been made in view of the above points, and an object thereof is an exhaust structure of a polishing apparatus which does not require attachment / detachment of an exhaust duct when attaching / detaching a table dome and can easily perform turntable maintenance. To provide.

[0014]

In order to solve the above problems, the present invention provides a turntable having a top ring for holding a polishing object and a polishing surface for polishing the surface of the polishing object held by the top ring. And a table dome having a shape that covers the turntable is attached to the upper surface of the turntable, and a drainage toy for receiving and draining liquid falling from the turntable is provided on at least the outer peripheral lower surface of the turntable. In the polishing apparatus, the exhaust duct is connected to the drainage toy so that the gas in the table dome is exhausted from the exhaust duct.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. Here, first, the structure of the entire polishing apparatus using this embodiment will be briefly described. FIG. 3 is a schematic plan view showing the polishing device 70. However, in the figure, the table dome 10 described below is used.
It shows a state where the is removed.

As shown in FIG.
Has a turntable 73 arranged in the center thereof, a polishing unit 77 having a top ring 75 attached to both sides thereof, and a dressing unit 81 having a dressing tool 79 attached thereto, and a work transfer device beside the polishing unit 77. 83 is installed.

Next to the polishing device 70, a cleaning device 90 is installed so as to be in close contact with the polishing device 70. Inside the cleaning device 90, a work transfer robot, a cleaning device, a drying device, etc., which are not shown, are housed.

The semiconductor wafer externally supplied to the delivery part a of the cleaning device 90 is transferred to the polishing device 70 by the work transfer robot in the cleaning device 90 and placed on the work transfer device 83.

The semiconductor wafer on the work transfer device 83 is
After being transferred to the top ring 75 of the polishing unit 77 which rotates as indicated by the one-dot chain line arrow A and polished by the polishing cloth on the upper surface of the turntable 73, it is returned to the work transfer device 83 again to be cleaned 90. It is carried to a cleaning device by a work transfer robot therein, cleaned, and then dried, and then transferred to a delivery section a and taken out to the outside.

In the dressing unit 79, the dressing tool 79, which moves and rotates on the turntable 73 as indicated by the one-dot chain line arrow B, is pressed against the polishing cloth on the rotating turntable 73 after polishing to regenerate (dress) it. ).

FIG. 1 is a schematic side sectional view of the polishing apparatus 70. As shown in the figure, the turntable 73
The upper surface of is covered with the table dome 10. The table dome 10 is made of a synthetic resin plate that covers the upper surface of the turntable 73. As shown in FIG. 2, an opening 11 for inserting the top ring 75 and a dressing tool are provided at predetermined positions thereof. An opening 13 for inserting 79 is provided.

The top ring 75 is shown by the alternate long and short dash line A in FIG.
As shown in FIG. 4, the dressing tool 79 moves in the recess 17 provided in the table dome 10, and the dressing tool 79 moves in the recess 19 as shown by a chain line B in FIG. Reference numerals 15 and 15 are handles used when the table dome 10 is attached to and detached from the turntable 73.

Returning to FIG. 1, a ring-shaped drainage toy 20 is provided on the lower surface of the outer periphery of the turntable 73. A drainage pipe 21 is connected to the bottom surface of the drainage toy 20.

A tubular exhaust duct 23 is connected to the side surface of the drainage toy 20, and the other end of the exhaust duct 23 is connected to an exhaust duct 25 extending upward. The exhaust duct 25 is further connected to an exhaust duct (not shown) led out of the polishing device 70.

Further, on the outer circumference of the drainage toy 20, a flat waterproof pan 30 for partitioning the upper part and the lower part of the polishing device 70 is provided.
Is attached.

When the polishing device 70 is in operation, the exhaust ducts 23 and 25 are made to have a negative pressure by a fan (not shown), and the polishing device 70 is operated.
Is exhausted from the inside to the outside. Here, as shown in FIG. 1, the lower surface of the turntable 73 and the drainage toy 2
Since the space between 0 is close and the gap is small, the exhaust duct 23
When air is exhausted from the air, air is sucked through the openings 11 and 13 provided in the table dome 10, and the air is sucked into the exhaust duct 23 after passing through the table dome 10 and the drainage toy 20. .

As described above, the polishing liquid is sprinkled during the polishing of the semiconductor wafer, and the dressing liquid is sprinkled during the dressing. The sprinkled liquid is stored in the drainage toy 20. It falls and is drained to the outside from the drain pipe 21.

On the other hand, the mist of the scattered liquid is sucked into the drainage duct 23 through the drainage toy 20 and exhausted from the exhaust duct 25 to the outside. Therefore, the mist generated on the turntable 73 is exhausted to the outside without staying inside the polishing device 70.

That is, these liquids and mists are discharged to the outside without adversely affecting various devices in the polishing device 70.

When the table dome 10 is removed for replacing the polishing cloth of the turntable 73 or the like, the exhaust duct is not connected to the table dome 10, so that the exhaust duct does not have to be removed or installed, and the turn is not necessary. The table 10 can be easily maintained.

[0031]

As described above in detail, according to the present invention, the exhaust duct is connected to the drainage toy and the gas in the table dome is exhausted from the exhaust duct. In this case, there is no need to attach or detach the exhaust duct, which has an excellent effect that the turntable can be easily maintained.

[Brief description of drawings]

FIG. 1 is a schematic side sectional view of a polishing device 70.

FIG. 2 is a perspective view of the table dome 10.

FIG. 3 is a schematic plan view of a polishing device 70.

4A and 4B are views showing a conventional polishing apparatus, in which FIG. 4A is a schematic plan view and FIG. 4B is a schematic side sectional view.

[Explanation of symbols]

 10 Table Dome 20 Drain Toy 23,25 Exhaust Duct 70 Polishing Device 73 Turntable 75 Top Ring

Claims (1)

[Claims] 1. A top ring for holding a polishing object, and a turntable having a polishing surface for polishing a surface of the polishing object held by the top ring, the turntable being provided on an upper surface of the turntable. In the polishing device, a table dome having a shape that covers the turntable is attached, and a drainage toy that receives and drains liquid falling from the turntable is provided on at least the lower peripheral surface of the turntable, and an exhaust duct is connected to the drainage toy. The exhaust structure of the polishing apparatus is characterized in that the gas in the table dome is exhausted from the exhaust duct.