JPH09260933A - Feeding pin mount method for patch antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the feeding pin mount method for a patch antenna by which desired characteristics are obtained. SOLUTION: A patch electrode 13 is formed to cover an upper end inner peripheral ridge of a throughhole 11a of a dielectric insulation board 11 and a feeding pin 13 whose diameter is slowly increased in a tapered shape is used for an upper end and the feeding pin 12 is inserted to the throughhole 11a and pushed therein and the upper end of the feeding pin 12 is soldered to the patch electrode 13. Thus, the patch electrode 13 is interposed in a gap between an inner wall of the throughhole opening end and the feeding pin 12 and the feeding pin 12 has a fixing force against a surface tension at solder heating through the depression of the patch electrode 13 and in the case of soldering, the feeding pin 12 is not pulled by the surface tension of solder 17 and the upper end of the feeding pin 12 is mounted in close contact with the patch electrode 13 and solder is not flowed into the gap, then the desired characteristics are obtained without causing a change in the antenna impedance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a feeding pin of a patch antenna used in high frequency radio equipment.

[0002]

2. Description of the Related Art In recent years, demand for high frequency radio equipment such as a navigation system using GPS has been increasing.
A patch antenna compatible with high frequencies is used in these high-frequency wireless devices. The patch antenna is generally called a microstrip antenna.

FIG. 2 shows a configuration example of a patch antenna.
2A is an external perspective view, and FIG. 2B is a side view. In the figure, reference numeral 1 is a patch antenna, which is a rectangular parallelepiped dielectric insulating substrate 11 having a predetermined thickness, and a feeding pin 1.
2 is comprised.

A cylindrical through hole 11a penetrating from the upper surface to the lower surface of the dielectric insulating substrate 11 is formed at a predetermined position. Further, a rectangular patch electrode 13 is formed on the upper surface of the dielectric insulating substrate 11, and an opening 13a is formed in the patch electrode 13 at a position corresponding to the through hole 11a, except for the peripheral edge of the opening 13a. An overcoat 14 is applied to the other part. Further, a rectangular ground electrode 15 is formed on the lower surface of the dielectric insulating substrate 11 so as to substantially face the patch electrode 13. This ground electrode 1
5 also has a through hole 11a and an opening portion 15 including this peripheral portion.
A is formed and an overcoat 16 is applied so as to cover the entire surface of the ground electrode 15.

The power supply pin 12 has a cylindrical shape with a diameter slightly smaller than that of the through hole 11a, and its upper end is formed into a disk shape with a diameter larger than that of the through hole 11a. The power supply pin 12 has a through hole 11a from the upper surface side of the dielectric insulating substrate 11.
Is inserted into the patch electrode 13 and is electrically conductively connected to the patch electrode 13 by the solder 17 in a state where the peripheral edge of the disc at the upper end is in contact with the patch electrode 13. In this state, the lower end of the power supply pin 12 projects from the lower surface of the dielectric insulating substrate 11 by a predetermined length.

When the patch antenna 1 is mounted on the wiring board 2, the protruding lower end portion of the feeding pin of the patch antenna 1 is inserted into the through hole 2a for inserting the feeding pin formed in the wiring board 2, and the wiring board 2 Conductive connection is made to the high-frequency circuit formed by soldering or the like.

As a result, the patch electrode 13 serving as an antenna radiator is connected to the high frequency circuit via the power feeding pin 12.

On the other hand, when the patch antenna 1 is manufactured, as shown in FIG. 3, the solder 17 is placed on the patch electrode 13 on the periphery of the through hole 11a of the dielectric insulating substrate 11, and in this state, the through hole 11a is formed. The power supply pin 12 is inserted into the. After that, the solder 17 is heated from the upper side of the through hole 11a, the solder 17 is melted, and the upper end portion of the power supply pin 12 is soldered to the patch electrode 13.

[0009]

As described above, when the patch antenna 1 is manufactured, the feeding pin 12 and the patch electrode 13 are electrically heated by melting and melting the solder 17 arranged on the patch electrode 13. In addition, the physical connection is made. At that time, as shown in FIG.
In some cases, the power supply pin 12 is pulled by the surface tension, and the upper end portion of the power supply pin 12 is soldered to the patch electrode 13 without being in close contact with it. Therefore, the patch electrode 1
The height of the power feeding pin 12 on 3 was increased, and the antenna impedance was changed, so that desired characteristics could not be obtained.

Further, as shown in FIG. 5, the melted solder 17 flows into the gap between the through hole 11a and the power feeding pin 12, and the diameter of the power feeding pin 12 in the through hole 11a becomes apparently thick. Therefore, the antenna impedance is changed, and desired characteristics cannot be obtained.

In view of the above problems, it is an object of the present invention to provide a method for mounting a feeding pin of a patch antenna which can obtain desired characteristics.

[0012]

In order to achieve the above object, the present invention provides a dielectric material having a predetermined thickness and a through hole having a predetermined diameter and penetrating from the upper surface to the lower surface. An insulating substrate, a patch electrode of a predetermined area provided on the upper surface of the dielectric insulating substrate, a ground electrode of a predetermined area provided on the lower surface of the dielectric insulating substrate, and a diameter slightly smaller than the through hole. In the method of mounting a feeding pin of a patch antenna, the feeding pin is inserted into the through hole, the upper end of which is conductively connected to the patch electrode, and the lower end of which is projected from the ground electrode by a predetermined length in a non-conductive state. The patch electrode is formed so as to cover the inner peripheral edge of the upper end of the through hole, and a power feeding pin whose diameter gradually increases in a tapered shape at the upper end is used, and the power feeding pin is pushed into the through hole from the upper surface side. Power supply The upper end portion proposes a feed pin method of mounting the patch antenna to be fixed to the patch electrode.

According to the method of mounting the feeding pin of the patch antenna, when the feeding pin is inserted into the through hole of the dielectric insulating substrate, the taper portion at the upper end of the feeding pin pushes the patch electrode around the through hole. A very small amount of the patch electrode is embedded in the through hole. Thus, the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power feeding pin, and the power feeding pin is fitted into the through hole by pressing the patch electrode. Further, even when the power supply pin is soldered, the power supply pin has a fixing force sufficient to withstand the surface tension during solder heating. Furthermore, since the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power supply pin, the melted solder does not flow into the gap.

Further, according to a second aspect of the present invention, it has a predetermined thickness,
A dielectric insulating substrate having a through hole penetrating from the upper surface to the lower surface, a patch electrode having a predetermined area provided on the upper surface of the dielectric insulating substrate, and a patch electrode having a predetermined area provided on the lower surface of the dielectric insulating substrate. The ground electrode has a diameter slightly smaller than that of the through hole, is inserted into the through hole, has an upper end conductively connected to the patch electrode, and has a lower end protruding a predetermined length in a non-conductive state from the ground electrode. In a method of mounting a power feeding pin of a patch antenna including a power feeding pin, the patch electrode having a predetermined thickness is formed so as to cover the upper end surface of the through hole,
A power supply pin whose diameter gradually increases in a tapered shape at the upper end is used, the power supply pin is inserted into the through hole from the upper surface side through the patch electrode, and the upper end of the power supply pin is fixed to the patch electrode. We propose a method to attach the feeding pin of the patch antenna.

According to the method for mounting the power feeding pin of the patch antenna, when the power feeding pin is inserted into the through hole of the dielectric insulating substrate through the patch electrode, the taper portion at the upper end of the power feeding pin causes the patch at the peripheral edge of the through hole to be inserted. The electrode is pushed so that a very small amount of the patch electrode is embedded in the through hole. Thus, the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power feeding pin, and the power feeding pin is fitted into the through hole by pressing the patch electrode. Further, even when the power supply pin is soldered, the power supply pin has a fixing force sufficient to withstand the surface tension during solder heating. Furthermore, since the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power supply pin, the melted solder does not flow into the gap.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In the present embodiment, when the feeding pin is mounted in the through hole of the dielectric insulating substrate, the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the feeding pin,
By pressing the patch electrode, the power supply pin has a fixing force sufficient to resist the surface tension at the time of heating the solder, and prevents the solder from flowing into the through hole to obtain desired characteristics. There is.

Next, a first example of this embodiment will be described. FIG. 1 is a diagram for explaining a method of mounting a feeding pin of a patch antenna according to the first embodiment. In the figure,
The same components as those of the conventional example described above are designated by the same reference numerals and the description thereof is omitted. Further, the difference between the conventional example and the first embodiment is that the diameter of the opening 13a of the patch electrode 13 is reduced so as to cover the inside of the through hole 11a slightly, and the diameter of the upper end of the power supply pin 12 is increased. Is provided with a tapered portion 12a that gradually becomes thicker. Here, the power supply pin 12
And the diameter of the opening 13a of the patch electrode 13 are set to be substantially equal.

The feeding pin 12 described above is connected to the dielectric insulating substrate 1.
1 is mounted on the non-overcoated patch electrode 13 at the periphery of the opening 13a, a predetermined amount of solder 17 is placed thereon, and in this state, the feed pin 12 is penetrated from the lower end to the opening 13a and the penetrating portion. Insert into the hole 11a and push in.
As a result, the patch electrode 13 protruding slightly inward from the opening of the through hole 11 a causes the taper portion 12 at the upper end of the power supply pin 12 to move.
a is pushed into the through hole 11a by
The gap between the inner wall of a and the feed pin 12 is filled. As a result, the pressing of the patch electrode 13 interposed in the gap causes the power supply pin 12 to have a fixing force sufficient to withstand the surface tension of the solder 17 during heating.

After that, the solder 17 is heated and melted to cover the upper end of the power feeding pin 12 with the solder, and the patch electrode 13 and the power feeding pin 12 are conductively connected. At this time, since the patch electrode 13 is present in the gap between the inner wall of the opening end of the through hole 11a and the power supply pin 12, the melted solder does not flow into this gap.

Therefore, the power supply pin 12 is not pulled by the surface tension when the solder 17 is melted, and the solder connection can be performed in a state where the upper end portion of the power supply pin 12 is in close contact with the patch electrode 13. Thereby, the patch electrode 13
Since the height of the upper power supply pin 12 does not increase,
The desired characteristics can be obtained without changing the antenna impedance.

Further, since the melted solder 17 does not flow into the gap between the through hole 11a and the power feeding pin 12, the diameter of the power feeding pin 12 in the through hole 11a does not seem to be thick unlike the conventional case. Therefore, desired characteristics can be obtained without changing the antenna impedance.

Normally, a paste-like conductor is printed to form the patch electrode 13, but as described above, the through hole 11 is formed.
In order to form the patch electrode 13 slightly inside of a, the shape and shape of the patch electrode 13 around the opening 13a is adjusted by appropriately adjusting the viscosity and thickness of the paste-like conductor and the protruding length to the inside of the through hole 11a. be able to.

For example, when the patch electrode 13 is formed by printing using a soft paste-like conductor, the patch electrode 13 drips in the through hole 11a as shown in FIG. When a thin patch electrode 13 is formed by printing using a strip-shaped conductor, FIG.
As shown in, the patch electrode 13 is formed so as to adhere to the inner wall of the through hole 11a. A slightly thicker patch electrode 1 using a paste-like conductor having a viscosity of appropriate hardness
When 3 is formed by printing, it is possible to form a desired patch electrode 13 that horizontally protrudes slightly inside the through hole 11a as shown in FIG. 6C.

Next, a second example of this embodiment will be described. FIG. 7 is a diagram for explaining a method of mounting the feeding pin of the patch antenna in the second embodiment. In the figure,
The same components as those of the conventional example described above are designated by the same reference numerals and the description thereof is omitted. Further, the difference between the conventional example and the second embodiment is that the patch electrode 13 is provided in the opening 1 of the conventional example.
3a is formed by adhering a metal foil such as a copper foil in a state in which 3a is not formed, and a taper portion 12a having a gradually increasing diameter is provided at the upper end portion of the power supply pin 12.

The above-mentioned feeding pin 12 is connected to the dielectric insulating substrate 1
1 is mounted on the non-overcoated patch electrode 13 at the periphery of the through hole 11a, a predetermined amount of solder 17 is placed thereon, and in this state, the feeding pin 12 penetrates the patch electrode 13 from the lower end thereof. And then push it into the through hole 11a. As a result, the patch electrode 13 that has covered the opening of the through hole 11a is moved to the tapered portion 12a at the upper end of the power supply pin 12.
Is pushed into the through hole 11a by the
The gap between the inner wall of the power supply pin 12 and the power supply pin 12 is filled. As a result, the pressing of the patch electrode 13 interposed in the gap causes the power supply pin 12 to have a fixing force sufficient to withstand the surface tension of the solder 17 during heating.

Thereafter, the solder 17 is heated and melted, the upper end of the power feeding pin 12 is covered with the solder, and the patch electrode 13 and the power feeding pin 12 are conductively connected. At this time, since the patch electrode 13 is present in the gap between the inner wall of the opening end of the through hole 11a and the power supply pin 12, the melted solder does not flow into this gap.

Therefore, the power supply pin 12 is not pulled by the surface tension of the solder 17 when the solder 17 is melted, and the solder connection can be performed while the upper end of the power supply pin 12 is in close contact with the patch electrode 13. Thereby, the patch electrode 13
Since the height of the upper power supply pin 12 does not increase,
The desired characteristics can be obtained without changing the antenna impedance.

Further, since the melted solder 17 does not flow into the gap between the through hole 11a and the power supply pin 12, the diameter of the power supply pin 12 in the through hole 11a does not seem to be thick unlike the conventional case. Therefore, desired characteristics can be obtained without changing the antenna impedance.

Although the power supply pin 12 is soldered in the present embodiment, the same effect can be obtained by fitting and fixing the power supply pin 12 without soldering.

The shape of the dielectric insulating substrate 11 in this embodiment is an example, and may be, for example, a square, a circle, a square, an ellipse, a pentagon, a ring, or a short-circuit on one side.

[0031]

As described above, according to the first aspect of the present invention, the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power feeding pin, and the power feeding pin is pierced by the pressing of the patch electrode. It is fixed by being inserted into a hole, and even when soldering, it has a fixing force that resists the surface tension at the time of solder heating, so when soldering the upper end of the power supply pin to the patch electrode, Since the power supply pin is not pulled by the surface tension of the solder when the solder is heated, and the upper end of the power supply pin can be attached in close contact with the patch electrode, the desired characteristics can be obtained without changing the antenna impedance. Obtainable. Further, since the patch electrode is present in the gap between the inner wall of the opening end of the through hole and the power feeding pin, the melted solder does not flow into the gap, and this does not cause a change in the antenna impedance either. The characteristics of can be obtained.

According to the second aspect, the patch electrode is interposed in the gap between the inner wall of the opening end of the through hole and the power feeding pin, and the power feeding pin is fitted and fixed in the through hole by pressing the patch electrode. Even when soldering, since it has a fixing force sufficient to withstand the surface tension during solder heating, when soldering the upper end of the power supply pin to the patch electrode, the surface tension of the solder during heating the solder. Since the feeding pin is not pulled by and the upper end portion of the feeding pin can be attached in close contact with the patch electrode, desired characteristics can be obtained without changing the antenna impedance. Further, since the patch electrode is present in the gap between the inner wall of the opening end of the through hole and the power feeding pin, the melted solder does not flow into the gap, and this does not cause a change in the antenna impedance either. The characteristics of can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a method of mounting a feeding pin of a patch antenna according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram showing a conventional patch antenna.

FIG. 3 is a diagram illustrating a method of mounting a power feeding pin on a patch antenna of a conventional example.

FIG. 4 is a diagram illustrating a problem in a conventional example.

FIG. 5 is a diagram illustrating a problem in a conventional example.

FIG. 6 is a diagram illustrating a method of forming a patch electrode according to the first embodiment of the present invention.

FIG. 7 is a diagram for explaining a method of mounting a feeding pin of a patch antenna according to a second embodiment of the present invention.

[Explanation of symbols]

1 ... Patch antenna, 11 ... Dielectric insulating substrate, 11a ...
Through hole, 12 ... Feed pin, 12a ... Tapered portion, 13 ...
Patch electrode, 13a ... opening, 14 ... overcoat,
15 ... Ground electrode, 16 ... Overcoat, 17 ... Solder.

Claims (2)

[Claims] 1. A dielectric insulating substrate having a predetermined thickness and having a through hole of a predetermined diameter penetrating from the upper surface to the lower surface, and a patch electrode having a predetermined area provided on the upper surface of the dielectric insulating substrate. And a ground electrode having a predetermined area provided on the lower surface of the dielectric insulating substrate, and having a diameter slightly smaller than the through hole, inserted into the through hole, and the upper end portion is conductively connected to the patch electrode. In a method of mounting a feeding pin of a patch antenna, the lower end of which extends from the ground electrode by a predetermined length in a non-conductive state, the patch electrode is formed so as to cover the inner peripheral edge of the upper end of the through hole, and the upper end In the patch antenna, a power supply pin whose diameter is gradually increased in a taper shape is used, and the power supply pin is pushed into the through hole from the upper surface side to fix the upper end portion of the power supply pin to the patch electrode. How to attach the power supply pin of Tena. 2. A dielectric insulating substrate having a predetermined thickness and having a through hole penetrating from the upper surface to the lower surface, a patch electrode having a predetermined area provided on the upper surface of the dielectric insulating substrate, and A ground electrode having a predetermined area provided on the lower surface of the dielectric insulating substrate and having a diameter slightly smaller than the through hole, inserted into the through hole, and the upper end portion is conductively connected to the patch electrode and the lower end portion. In a method for mounting a feeding pin of a patch antenna, which comprises a feeding pin protruding to a predetermined length in a non-conducting state from the ground electrode, the patch electrode having a predetermined thickness is formed so as to cover an upper end surface of the through hole, and an upper end portion is formed. In the case of using a feed pin whose diameter gradually increases in a taper shape, the feed pin is inserted into the through hole from the upper surface side through the patch electrode, and the upper end of the feed pin is fixed to the patch electrode. Features and How to install the feeding pin of the patch antenna.