JPH09260727A - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JPH09260727A JPH09260727A JP8068571A JP6857196A JPH09260727A JP H09260727 A JPH09260727 A JP H09260727A JP 8068571 A JP8068571 A JP 8068571A JP 6857196 A JP6857196 A JP 6857196A JP H09260727 A JPH09260727 A JP H09260727A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- parabolic
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光素子上にレン
ズ面を有するモールド部によって封止されている発光装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device in which a light emitting element is sealed with a mold portion having a lens surface.
【０００２】[0002]
【従来の技術】従来、発光装置は、その指向特性（指向
特性とは光軸方向における発光強度分布で示される特性
であり、光の広がりを表すものである）を良好にするた
めに、例えば、次のような構造を有する。すなわち、こ
の発光装置は、図６に示すように、一対のリード端子３
１、３２と、一方のリード端子３１の先端に形成された
平面視円形状且つ縦断面凹形状のパラボラ部３３上にダ
イボンディングされた発光ダイオード素子等の発光素子
３４と、この発光素子３４と他方のリード端子３２の先
端との間を電気的に接続する金線等のワイヤー３５と、
発光素子３４上に楕円球面形状のレンズ面が形成され且
つ平面視楕円形状のモールド部３６とを備えたものであ
る。モールド部３６は、透光性のエポキシ樹脂からな
り、そのレンズ面の頂部が発光素子３４の光軸（発光面
に対してほぼ垂直方向に照射される光の軸であって最も
光の輝度の大きい部分である）上に位置するように構成
されている。パラボラ部３３は、発光素子３４がボンデ
ィングされたほぼ平坦状の底面と、この底面を囲うよう
に立設された側壁とを有する。2. Description of the Related Art Conventionally, in order to improve its directional characteristics (a directional characteristic is a characteristic represented by a light emission intensity distribution in the optical axis direction and represents the spread of light), for example, , Has the following structure. That is, as shown in FIG. 6, this light emitting device has a pair of lead terminals 3
1, 32, a light emitting element 34 such as a light emitting diode element die-bonded to a parabolic portion 33 formed in the tip of one of the lead terminals 31 and having a circular shape in plan view and a concave vertical section, and the light emitting element 34. A wire 35 such as a gold wire for electrically connecting the tip of the other lead terminal 32,
A light-emitting element 34 is provided with a lens portion having an elliptic spherical shape and a mold portion 36 having an elliptical shape in plan view. The mold portion 36 is made of a translucent epoxy resin, and the top of the lens surface thereof is the optical axis of the light emitting element 34 (the axis of light that is irradiated in a direction substantially perpendicular to the light emitting surface and has the highest brightness). Is a large part) is configured to be located above. The parabolic portion 33 has a substantially flat bottom surface to which the light emitting element 34 is bonded, and a side wall provided upright so as to surround the bottom surface.
【０００３】このような構成の発光装置では、発光素子
３４からの照射光のうちモールド部３６の長軸方向Ｘ’
に沿って照射される光（特に光軸に対する照射角度の大
きい光）を、楕円球面形状のレンズ面を用いてモールド
部３６前面に集光させている。ここで、発光素子３４か
らほぼ水平方向に照射されパラボラ部３３の側壁に反射
した光は、あまり広がらずにレンズ面の中央部付近を通
って外部へと放射されている。In the light emitting device having such a structure, of the irradiation light from the light emitting element 34, the direction X'of the mold portion 36 in the major axis direction.
Light radiated along (particularly light having a large irradiation angle with respect to the optical axis) is condensed on the front surface of the mold portion 36 using the lens surface having an elliptic spherical shape. Here, the light emitted from the light emitting element 34 in a substantially horizontal direction and reflected on the side wall of the parabolic portion 33 is emitted to the outside through the vicinity of the central portion of the lens surface without spreading very much.
【０００４】図７は、この発光装置の照射光の指向特性
（照射角度と光の輝度との関係）を示す図であり、図７
（ａ）がモールド部３６の長軸Ｘ’を含み発光面に対し
て垂直方向に照射される光の指向特性を示し、図７
（ｂ）がモールド部３６の短軸Ｙ’を含み発光面に対し
て垂直方向に照射される光の指向特性を示している。こ
れらの図において、光軸の部分が角度０°であり、３０
°、６０°、９０°はこの光軸に対する角度を示してい
る。そして、基準位置Ｈ’から放射状に遠ざかる程光の
輝度が大きいことを示している。FIG. 7 is a diagram showing the directional characteristics of the irradiation light of this light emitting device (relationship between the irradiation angle and the brightness of the light).
FIG. 7A shows the directional characteristic of the light irradiated in the direction perpendicular to the light emitting surface including the long axis X ′ of the mold portion 36, and FIG.
(B) shows the directional characteristic of the light emitted in the direction perpendicular to the light emitting surface including the minor axis Y ′ of the mold portion 36. In these figures, the optical axis portion has an angle of 0 °,
°, 60 °, and 90 ° indicate angles with respect to this optical axis. Then, it is shown that the brightness of light increases as the distance from the reference position H ′ increases in a radial direction.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、モール
ド部３６の長軸方向に向かって照射される光は、上述し
たように照射角度の大きな部分でも楕円球面形状のレン
ズ面を用いることで或る程度集光させ輝度が上がってい
るが、照射角度が大きなるにつれて輝度が小さくなって
しまう。However, the light radiated in the major axis direction of the mold portion 36 is, to a certain extent, obtained by using the elliptic spherical lens surface even in the portion where the irradiation angle is large as described above. Although the brightness is increased by condensing the light, the brightness decreases as the irradiation angle increases.
【０００６】特に、このような発光装置をマトリクス状
に隣接するように配置した発光表示装置（図示せず）で
は、モールド部３６の長軸方向における発光装置間の隙
間周辺において照射光の輝度が小さくなってしまい、表
示を行った際に上記発光装置間の隙間が強調されて連続
した表示になりにくく、質の悪い表示状態となってしま
う。Particularly, in a light emitting display device (not shown) in which such light emitting devices are arranged so as to be adjacent to each other in a matrix, the brightness of the irradiation light is around the gap between the light emitting devices in the major axis direction of the mold portion 36. When the display is performed, the gap between the light emitting devices is emphasized and the continuous display is difficult to be performed, resulting in a poor display state.
【０００７】本発明は、このような事情に鑑みてなされ
たものであって、大きな照射角度のときの光の輝度が大
きな指向特性の向上した発光装置を提供することを目的
とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light emitting device in which the brightness of light at a large irradiation angle is large and the directional characteristics are improved.
【０００８】[0008]
【課題を解決するための手段】上記課題を達成するた
め、本発明は、先端に縦断面凹形状のパラボラ部を有し
このパラボラ部上に発光素子が接続されたリード端子
と、該リード端子の先端部分および発光素子を封止し且
つ該発光素子上に楕円球面形状のレンズ面が形成された
透光性樹脂製のモールド部と、からなる発光装置であっ
て、前記パラボラ部は、平面視楕円形状であり且つその
長軸がモールド部の長軸とほぼ同一方向に延びているこ
とを特徴とする発光装置を提供するものである。In order to achieve the above object, the present invention provides a lead terminal having a parabolic portion having a concave vertical cross section at its tip, to which a light emitting element is connected, and the lead terminal. A light-transmitting resin mold part that seals the tip part of the light-emitting element and has an elliptical spherical lens surface formed on the light-emitting element, wherein the parabolic part is a flat surface. It is intended to provide a light emitting device having an elliptical shape and having a major axis extending substantially in the same direction as the major axis of a mold part.
【０００９】本発明におけるパラボラ部とは、ほぼ平坦
な底面とこの底面のほぼ全周縁に底面を囲むように立設
された側壁とを有する縦断面凹形状のものである。The parabolic portion in the present invention has a concave shape in vertical cross section having a substantially flat bottom surface and sidewalls provided upright on substantially the entire periphery of the bottom surface so as to surround the bottom surface.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施の形態を図を
参照しつつ説明するが、本発明はこれらに限定されるも
のでない。図１は、発光装置としてのランプ型ＬＥＤを
示す斜視図である。このランプ型ＬＥＤは、一対のリー
ド端子１、２と、そのうち一方のリード端子１の先端に
パンチング加工等により形成された平面視楕円形状且つ
縦断面凹形状のパラボラ部３上に銀ペースト（図示せ
ず）を介してダイボンディングにより電気的に接続され
た発光ダイオード素子（発光素子）４と、この発光ダイ
オード素子４と他方のリード端子２の先端との間を電気
的に接続した金線等のワイヤー５と、発光ダイオード素
子４上に楕円球面形状のレンズ面７ａを有する平面視楕
円形状の（エポキシ樹脂からなる）モールド部７とを備
えている。Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. FIG. 1 is a perspective view showing a lamp type LED as a light emitting device. This lamp-type LED includes a pair of lead terminals 1 and 2, and a silver paste on a parabolic portion 3 having an elliptical shape in plan view and a concave vertical section formed by punching or the like at the tip of one of the lead terminals 1 (see FIG. A light emitting diode element (light emitting element) 4 electrically connected by die bonding via (not shown) and a gold wire or the like electrically connected between the light emitting diode element 4 and the tip of the other lead terminal 2. Wire 5 and the mold portion 7 (made of epoxy resin) having an elliptical spherical lens surface 7a on the light emitting diode element 4 and having an elliptical shape in plan view.
【００１１】パラボラ部３は、図２（ａ）にランプ型Ｌ
ＥＤの水平方向の断面図を示すとおり、平面視楕円形状
をなしており、その長軸がモールド部７の長軸とほぼ同
一方向に延びている。また、パラボラ部３の長軸と短軸
とのほぼ交点上には、発光ダイオード素子４が存在し、
この発光ダイオード素子４の光軸上にモールド部７の頂
上部が位置するように構成されている。The parabolic portion 3 is a lamp type L shown in FIG.
As shown in the horizontal sectional view of the ED, it has an elliptical shape in plan view, and its major axis extends substantially in the same direction as the major axis of the mold part 7. In addition, the light emitting diode element 4 is present substantially on the intersection of the long axis and the short axis of the parabolic portion 3,
The top of the mold part 7 is arranged on the optical axis of the light emitting diode element 4.
【００１２】また、パラボラ部３は、図２（ｂ）にラン
プ型ＬＥＤの縦断面図を示すとおり、ほぼ平坦状の底面
３ａとこの底面３ａの全周縁においてこれを囲うように
立設された側壁３ｂとで構成されており、この底面３ａ
上には銀ペースト８を介して発光ダイオード素子４がダ
イボンディングされている。ここで、（パラボラ部３の
長軸方向の）発光ダイオード素子４と側壁３ｂとの間隔
寸法Ｌは、従来の平面視円形状のパラボラ部（先述した
図６を参照）に比して大きくなっている。Further, as shown in the longitudinal sectional view of the lamp type LED in FIG. 2B, the parabolic portion 3 is erected so as to surround the substantially flat bottom surface 3a and the entire peripheral edge of the bottom surface 3a. It is composed of the side wall 3b and the bottom surface 3a.
The light emitting diode element 4 is die-bonded on the upper side of the silver paste 8. Here, the distance dimension L between the light emitting diode element 4 (in the long axis direction of the parabolic portion 3) and the side wall 3b is larger than that of the conventional parabolic portion having a circular shape in plan view (see FIG. 6 described above). ing.
【００１３】さらに、モールド部７は、上述したように
発光ダイオード素子４上の部分が楕円球形状であり、そ
の下層部が楕円柱形状をなしている。このような構成の
ランプ型ＬＥＤにおいて、図３に示すように、発光ダイ
オード素子４からモールド部７の長軸方向に沿って照射
される光のうちほぼ水平方向に照射される光（図３にお
ける２点鎖線）は、間隔寸法Ｌの大きくなった位置に立
設されたパラボラ部３の側壁３ｂに反射し、レンズ面７
ａの（モールド部７の長軸方向における）両端部を通っ
て外部へと放射されることになる（この光は先述した従
来の発光装置ではレンズ面７ａのほぼ中央部を通って放
射されていた）ので、この光の分だけレンズ面７ａの両
端部での輝度がかなり大きくなり、ランプ型ＬＥＤ自体
の指向特性が極めて向上するのである。Further, as described above, in the mold portion 7, the portion on the light emitting diode element 4 has an elliptic spherical shape, and the lower layer portion has an elliptic cylindrical shape. In the lamp-type LED having such a configuration, as shown in FIG. 3, among the light emitted from the light emitting diode element 4 along the long axis direction of the mold portion 7, the light emitted in a substantially horizontal direction (in FIG. 3). The alternate long and two short dashes line) is reflected on the side wall 3b of the parabolic portion 3 which is erected at the position where the interval dimension L is increased, and the lens surface 7
The light is emitted to the outside through both ends (in the long axis direction of the mold portion 7) of a (this light is emitted through almost the central portion of the lens surface 7a in the above-described conventional light emitting device). Therefore, the brightness at both ends of the lens surface 7a is considerably increased by the amount of this light, and the directional characteristics of the lamp type LED itself are significantly improved.
【００１４】これを示したのが、図４である。図４は、
この発光装置の指向特性を示す図であり、図４（ａ）が
モールド部７の長軸を含み発光面に対して垂直方向に照
射される光の指向特性を、図４（ｂ）がモールド部７の
短軸を含み発光面に対して垂直方向に照射される光の指
向特性を示している。この図と従来品の指向特性の図
（図６）とを比較してもわかるように、明らかに、本発
明のランプ型ＬＥＤは大きな照射角度のときの輝度が大
きく、指向特性が良好となっている。This is shown in FIG. FIG.
It is a figure which shows the directional characteristic of this light-emitting device, FIG.4 (a) shows the directional characteristic of the light radiated | perpendicular to the light emission surface including the long axis of the mold part 7, and FIG.4 (b) shows the mold. The directional characteristics of the light including the short axis of the portion 7 and radiated in the direction perpendicular to the light emitting surface are shown. As can be seen from a comparison between this figure and the diagram of the directional characteristic of the conventional product (FIG. 6), it is clear that the lamp type LED of the present invention has a large luminance at a large irradiation angle and has a good directional characteristic. ing.
【００１５】このような指向特性の良好な本発明のラン
プ型ＬＥＤを複数個用い、これらを可撓性もしくは剛性
を有する回路基板上にマトリクス状に配置した発光表示
装置（図示せず）によると、各ランプ型ＬＥＤ間の隙間
周辺の輝度が大きくなるので、表示をする際のランプ型
ＬＥＤ間の隙間が強調されにくく、比較的連続した表示
を行うことが可能となる。According to a light-emitting display device (not shown) in which a plurality of lamp-type LEDs of the present invention having such a good directional characteristic are used and these are arranged in a matrix on a flexible or rigid circuit board. Since the brightness around the gaps between the lamp-type LEDs is large, the gaps between the lamp-type LEDs are not easily emphasized during display, and relatively continuous display can be performed.
【００１６】本実施例では、パラボラ部３の側壁３ｂ
は、そのテーパ角度が底面３ａを囲うすべての領域でほ
ぼ同一としているが、これに限定するものでなく、モー
ルド部７の長軸方向における側壁３ｂのテーパ角度を、
モールド部７の短軸方向におけるそれよりも大きく（な
だらかになるように）して、大きな照射角度に対する輝
度をより大きくすることが可能である。In this embodiment, the side wall 3b of the parabolic portion 3 is used.
Has substantially the same taper angle in all regions surrounding the bottom surface 3a, but the present invention is not limited to this, and the taper angle of the side wall 3b in the long axis direction of the mold part 7 is
It is possible to make it larger (so as to be gentle) than that in the minor axis direction of the mold part 7 to further increase the luminance for a large irradiation angle.
【００１７】また、本実施例におけるパラボラ部は、図
２（ａ）に示すような平面視楕円形状となっているが、
楕円の寸法等については、これを限定するものでなく、
長軸、短軸を有する楕円形状のものであればよい。ま
た、側壁３ｂの高さ寸法については、発光ダイオード素
子４の上面よりも高く且つ発光ダイオード素子４のほぼ
厚み分だけ高いぐらいが好ましい。Further, although the parabolic portion in this embodiment has an elliptical shape in plan view as shown in FIG.
The size of the ellipse is not limited to this,
Any elliptical shape having a major axis and a minor axis may be used. Further, the height of the side wall 3b is preferably higher than the upper surface of the light emitting diode element 4 and higher by almost the thickness of the light emitting diode element 4.
【００１８】さらに、本発明のモールド部の形状につい
ては、上記実施例では、楕円球面形状のレンズ面７ａか
ら連続した楕円柱形状となっているが、これに限定する
ものでなく、レンズ面のみが凸状に突出形成された発光
装置等にも適用可能である。また、本実施例において
は、リード端子が２本であるが、これに限定するもので
なく、リード端子を３本以上用いたものにも適用可能で
あり、例えば、図５に示すように、リード端子９を３本
用いこのうちの１本の先端にパラボラ部９ａを形成し、
このパラボラ部９ａ上に複数の異なる色の発光素子１０
をダイボンディングし、各発光素子１０と各リード端子
９とを個別にワイヤ１１で接続するといった複数色発光
装置にも適用可能である。Further, the shape of the mold portion of the present invention is an elliptic cylinder shape continuous from the elliptic spherical lens surface 7a in the above embodiment, but the shape is not limited to this, and only the lens surface is formed. The present invention can also be applied to a light emitting device or the like in which a convex shape is formed. Further, in the present embodiment, the number of lead terminals is two, but the present invention is not limited to this, and it is also applicable to one using three or more lead terminals. For example, as shown in FIG. The parabolic portion 9a is formed at the tip of one of the three lead terminals 9,
A plurality of light emitting elements 10 of different colors are provided on the parabolic portion 9a.
It is also applicable to a multi-color light emitting device in which each light emitting element 10 and each lead terminal 9 are individually connected by a wire 11 by die bonding.
【００１９】[0019]
【発明の効果】以上の説明からも明らかなように、本発
明によれば、パラボラ部を平面視楕円形状とし、その長
軸がモールド部の長軸とほぼ同一方向としているので、
発光ダイオード素子からモールド部の長軸方向に沿って
照射される光のうちほぼ水平方向に照射される光は、例
えば、パラボラ部の側壁に反射し、モールド部の長軸方
向におけるレンズ面の両端部を通って外部へと放射する
ので、この放射する光の分だけレンズ面の両端部での輝
度が大きくなり、ランプ型ＬＥＤ自体の指向特性が極め
て向上することになる。As is apparent from the above description, according to the present invention, the parabolic portion has an elliptical shape in plan view, and its major axis is substantially in the same direction as the major axis of the mold portion.
Of the light emitted from the light emitting diode element along the long-axis direction of the mold portion, the light emitted in a substantially horizontal direction is reflected on, for example, the side wall of the parabolic portion, and both ends of the lens surface in the long-axis direction of the mold portion. Since the light is emitted to the outside through the portion, the brightness at both ends of the lens surface is increased by the amount of the emitted light, and the directional characteristics of the lamp-type LED itself are significantly improved.
【図１】 本実施例のランプ型ＬＥＤを示す斜視図で
ある。FIG. 1 is a perspective view showing a lamp-type LED of this embodiment.
【図２】 本実施例のランプ型ＬＥＤを示す図であ
り、（ａ）はランプ型ＬＥＤの水平方向の断面図を示
し、（ｂ）はランプ型ＬＥＤの縦断面図を示す。2A and 2B are diagrams showing a lamp-type LED of the present embodiment, FIG. 2A is a horizontal sectional view of the lamp-type LED, and FIG. 2B is a vertical sectional view of the lamp-type LED.
【図３】 発光ダイオード素子から照射される光の軌
跡を説明する説明図である。FIG. 3 is an explanatory diagram illustrating a trajectory of light emitted from a light emitting diode element.
【図４】 本実施例におけるランプ型ＬＥＤの指向特
性を示す図であり、（ａ）はパラボラ部の長軸を含み発
光面に対して垂直方向の光の指向特性を示す図であり、
（ｂ）はその短軸を含み発光面に対して垂直方向の光の
指向特性を示す図である。FIG. 4 is a diagram showing a directional characteristic of a lamp-type LED in the present embodiment, and FIG. 4 (a) is a diagram showing a directional characteristic of light in a direction perpendicular to a light emitting surface including a long axis of a parabolic portion,
(B) is a figure which shows the directivity characteristic of light including the minor axis and perpendicular to the light emitting surface.
【図５】 本発明の発光装置の変形例を説明する説明
図である。FIG. 5 is an explanatory diagram illustrating a modified example of the light emitting device of the present invention.
【図６】 従来例の発光装置を示す斜視図である。FIG. 6 is a perspective view showing a conventional light emitting device.
【図７】 図６の発光装置の指向特性を示す図であ
り、（ａ）はＸ’軸を含み発光面に対して垂直方向の光
の指向特性を示す図であり、（ｂ）はＹ’軸を含み発光
面に対して垂直方向の光の指向特性を示す図である。7A and 7B are diagrams showing directional characteristics of the light emitting device of FIG. 6, FIG. 7A is a diagram showing directional characteristics of light in a direction perpendicular to a light emitting surface including an X ′ axis, and FIG. It is a figure which shows the directional characteristic of the light including a'axis and perpendicular to a light emitting surface.
１、２ リード端子 ３ パラボラ部 ４ 発光ダイオード素子 ５ ワイヤー ７ モールド部 1, 2 Lead terminal 3 Parabolic part 4 Light emitting diode element 5 Wire 7 Mold part
Claims (1)
このパラボラ部上に発光素子が接続されたリード端子
と、該リード端子の先端部分および発光素子を封止し且
つ該発光素子上に楕円球面形状のレンズ面が形成された
透光性樹脂製のモールド部と、からなる発光装置であっ
て、 前記パラボラ部は、平面視楕円形状であり且つその長軸
がモールド部の長軸とほぼ同一方向に延びていることを
特徴とする発光装置。1. A lead terminal having a parabolic portion having a concave vertical cross section at its tip, to which a light emitting element is connected, and a tip portion of the lead terminal and the light emitting element are sealed and on the light emitting element. A light emitting device comprising a light-transmissive resin mold part having an ellipsoidal spherical lens surface formed thereon, wherein the parabolic part has an elliptical shape in a plan view, and its major axis is the major axis of the mold part. A light-emitting device characterized in that it extends in substantially the same direction as.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068571A JPH09260727A (en) | 1996-03-25 | 1996-03-25 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068571A JPH09260727A (en) | 1996-03-25 | 1996-03-25 | Light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09260727A true JPH09260727A (en) | 1997-10-03 |
Family
ID=13377598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8068571A Pending JPH09260727A (en) | 1996-03-25 | 1996-03-25 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09260727A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094130A (en) * | 1999-01-05 | 2002-03-29 | Nichia Chem Ind Ltd | Light emitting diode, its manufacturing method and indicating device using the same |
-
1996
- 1996-03-25 JP JP8068571A patent/JPH09260727A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002094130A (en) * | 1999-01-05 | 2002-03-29 | Nichia Chem Ind Ltd | Light emitting diode, its manufacturing method and indicating device using the same |
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