JPH09260625A - Aligning method of optical element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the aligning method capable of improving the positional precision in the package of optical element and eliminating the adjustment of optical axis precision in the set packaging time, as well as cutting down the man-hours and adjusting jigs or the part numbers for the same. SOLUTION: In case of molding a package 1 (plastic, etc.) into metallic force, two heights 10, 10 in circular sectional shape are formed on a cavity part, whereon a CCD image pickup element 5 is mounted. Since the metallic force used for the molding step usually molds multiple package simultaneously, the positions of the heights can be processed in about ±5nm. to the configuration of the package 1. In such a constitution, in the assembling step of the CCD image pickup element 5, the heights 10, 10 are recognized as picture images by a known picture image recognizer in case of mounting the element 5 on the package, so as to decide the mounting positions for mounting the CCD image pickup element 5, using recognized picture images as origins.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element positioning method for fixing an optical element such as a CCD image pickup element in an accurate position when the optical element is mounted in a package.

[0002]

2. Description of the Related Art Generally, an optical element such as a CCD image pickup element is mounted on a package for leading out the terminal of the element to the outside or protecting the element before being mounted on a device as a set. After the CCD image pickup device is mounted in a package, the CCD image pickup device is connected to lead terminals for driving the device and for extracting signals to the outside, and a protective glass plate for protection is installed on the image pickup surface.

Here, FIG. 6 is a top view of a package in which a CCD image pickup device is mounted, and FIG. 7 is a line A- shown in FIG.
It is sectional drawing in B. As shown in FIGS. 6 and 7, the package 1 is provided with a cavity 2 for mounting a CCD image pickup device, and a CC is provided around the cavity 2.
Leads 3 and 3 for pulling out the terminals of the D image sensor to the outside
Is provided. Since the CCD image pickup device is an optical device, the accuracy of the optical axis with the lens is important. Therefore, the CCD image pickup device must be accurately mounted at a predetermined position of the cavity 2.

Therefore, in the conventional positioning, the package outline (edge) is mechanically supported at three points as shown in FIG. 8 or the package outline (edge) is recognized by image recognition based on the package outline. By detecting the position of the package outline (edge), CC
The mounting position of the D image sensor 5 has been determined.

[0005]

However, in the above-described conventional CCD image sensor positioning method, the repeatability (reproducibility) is poor in the case of mechanical support, and the package outline in the case of image recognition. There is a problem in that there is a limit to the accuracy due to the difference in how the light hits the edges and the reflection condition on the surface.

That is, in the conventional positioning method, the accuracy is ± 50 to 100 μm, which is guaranteed by the specification (±
Although it satisfies 150 μm), it is not sufficient for the actual optical axis accuracy. Therefore, at the time of mounting the set, it was necessary to adjust the position so as to be ± 20 μm or less with respect to the lens axis. Therefore, there has been a problem that a man-hour for position adjustment is required and a special jig for that is required.

Therefore, the present invention can improve the positional accuracy of the optical element with respect to the package, can eliminate the need for adjusting the optical axis accuracy during set mounting, and can reduce the number of man-hours, adjustment jigs, or parts therefor. It is an object of the present invention to provide a positioning method of.

[0008]

In order to achieve the above object, a semiconductor element positioning method according to the present invention comprises forming a marker at a predetermined position of a package in which the optical element is mounted and mounting the optical element in the package. In doing so, the marker is identified by image recognition, and the position where the optical element is to be mounted is determined based on the marker.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

A. Configuration of Embodiment FIG. 1 is a top view of a package for explaining a method of positioning a CCD image sensor according to an embodiment of the present invention.
FIG. 2 is a sectional view of the same package. The parts corresponding to those in FIG. 6 or 7 are designated by the same reference numerals and the description thereof will be omitted. In the figure, in the present embodiment, when the package (plastic or the like) 1 is molded by a mold, CC
In the cavity portion 2 in which the D image pickup device 5 is mounted, two convex portions 10, 10 are formed on a substantially diagonal line. The convex portion 1
In the present embodiment, the cross-sectional shape of 0 and 10 is circular as shown in FIG. 1, but any shape such as circular or rectangular may be used as long as the center can be easily detected. . Since the mold used for molding generally molds a large number of packages at the same time, the positions of the convex portions 10 and 10 can be processed to be ± 5 μm with respect to the outer shape of the package 1.

Next, in the process of assembling the CCD image pickup device 5, when the device is mounted on the package 1, the convex portions 10, 10 are recognized as an image by a known image recognition,
With this as the origin, the mounting position of the CCD image pickup device 5 is determined and mounted. The accuracy of the mounting position at this time is ± 10μ
It can be realized in about m. Thus, as shown in FIG. 3, the CCD image pickup device 5 mounted on the package 1 is completed by wire-bonding the leads 3 and 3 provided on the outer periphery and then sealing the glass 11.

In the completed CCD image pickup device, the convex portion 1
The element mounting position can be determined with high accuracy of ± 10 μm for 0 and 10 and ± 15 μm for the package outer shape. Further, at the time of set mounting, it may be mounted based on the package outer shape or based on the convex portions 10 and 10, and two methods can be selected depending on the situation at that time. Further, the optical accuracy can be mounted without adjustment.

When only the package outer shape is used at the time of mounting the set, as shown in FIGS. 4 and 5, a convex portion 12 may be provided at a position where the element 5 is mounted. In this case, after the element 5 is mounted, the convex portion 12 is removed from the element 5
It will be hidden underneath, so it will not affect the set implementation at all. In the example shown in FIGS. 4 and 5,
Although the projections 12 are of the same size as the element 5, the present invention is not limited to this, and a plurality of circular projections as described above may be provided. Further, the shape of the convex portion 12 is not limited to the rectangular shape, and as described above, any shape may be used as long as the center thereof can be easily detected.

In the above-described embodiment, the convex portion 10 or the convex portion 12 is provided in the cavity 2 in which the element 5 is mounted. However, if the position can be identified by image recognition, the convex portion (projection) ), But may be a recess (a dent).

[0015]

As described above, when a marker is formed at a predetermined position of a package in which an optical element is mounted and the optical element is mounted in the package, the marker is identified by image recognition, Since the position where the optical element should be mounted is determined based on the marker, the positional accuracy of the optical element with respect to the package can be improved, and the optical axis accuracy adjustment at the time of mounting the set can be eliminated,
The advantage is that the number of man-hours, the adjustment jig, or parts therefor can be reduced.

[Brief description of drawings]

FIG. 1 is a top view of a package for explaining a method of positioning a CCD image pickup device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the package.

FIG. 3 is a top view showing a completed form of a CCD image pickup device 5.

FIG. 4 is a top view of a package for explaining a modified example in which only the package outer shape is used when the set is mounted.

FIG. 5 is a cross-sectional view of the same package.

FIG. 6 is a top view of a package in which a CCD image sensor according to the related art is mounted.

FIG. 7 is a cross-sectional view of the same package.

[Explanation of symbols]

1 ... Package, 2 ... Cavity, 3 ... Lead,
5 ... Element (optical element), 10 ... Convex portion (marker), 1
1 ... glass, 12 ... convex part (marker).

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[Procedure amendment]

[Submission date] July 18, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of drawings]

FIG. 1 is a top view of a package for explaining a method of positioning a CCD image pickup device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the package.

FIG. 3 is a top view showing a completed form of a CCD image pickup device 5.

FIG. 4 is a top view of a package for explaining a modified example in which only the package outer shape is used when the set is mounted.

FIG. 5 is a cross-sectional view of the same package.

FIG. 6 is a top view of a package in which a CCD image sensor according to the related art is mounted.

FIG. 7 is a cross-sectional view of the same package.

FIG. 8 shows the detection of the package external position in the conventional technique.
It is a figure for explaining.

[Explanation of symbols] 1 ... Package, 2 ... Cavity, 3 ... Lead,
5 ... Element (optical element), 10 ... Convex portion (marker), 1
1 ... glass, 12 ... convex part (marker).

Claims (5)

[Claims] 1. A marker is formed at a predetermined position of a package on which an optical element is mounted, and when the optical element is mounted on the package, the marker is identified by image recognition, and the marker is used as a reference to identify the marker. A method for positioning an optical element, characterized in that the position at which the optical element is to be mounted is determined. 2. The method for positioning a semiconductor element according to claim 1, wherein the marker has a convex shape with respect to a surface on which the optical element is mounted and is formed when the package is molded. . 3. The method for positioning a semiconductor element according to claim 1, wherein the marker is a recess with respect to a surface on which the optical element is mounted, and is formed when the package is molded. 4. The semiconductor element positioning method according to claim 1, wherein the marker is formed around a position where the optical element is mounted. 5. The marker is formed at a position where the optical element is mounted.
A method for positioning a semiconductor device as described above.