JPH09260271A - Exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of a positional deviation of a mask from a mask holding member by a method wherein a sealed space is formed between the mask and the mask holding member and the atmospheric pressure in the sealed space is adjusted so that the mask is fixed on the member. SOLUTION: A sealed space 32 is formed between the lower surface of a mask 12 and a mask holding member 18 and the atmospheric pressure in the space 32 is made lower than that in the outside of the space 32 by an atmospheric pressure adjusting member 36. Or with a first space 18 formed between the lower surface of the mask 12 and the member 18, a second space 58 is formed between the upper surface of the mask 12 and a mask holding member 54. The atmospheric pressures in the spaces 32 and 58 are respectively made lower than those in the outsides of the spaces 32 and 58. At this time, it is preferable to make equal the atmospheric pressures in the spaces 32 and 58 with each other. Moreover, in such the case, a suction means for vacuum-sucking the mask 12 to the member 18 may be used jointly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for transferring an image of a pattern formed on a mask onto a photosensitive substrate, and more particularly to a scanning type exposure apparatus for relatively moving the mask and the photosensitive substrate relative to each other. Optimal mask holding mechanism

[0002]

2. Description of the Related Art A projection exposure apparatus used for manufacturing a semiconductor integrated circuit or a liquid crystal display substrate irradiates a mask with illumination light emitted from an illumination optical system to project a pattern image of the mask onto the projection optical system. An image is formed on the photosensitive substrate via. In this type of apparatus, a plurality of patterns are overlapped and exposed in the same area on the substrate, and therefore, high overlay accuracy is required between the layer to be exposed and the layer subjected to the previous exposure.

At present, as a projection exposure apparatus, a step-and-scan type exposure apparatus is proposed and put into practical use, in which exposure is performed while synchronously scanning a mask and a photosensitive substrate relative to illumination light for exposure. Has been done. In such a step-and-scan exposure apparatus, a mask held by a mask holder is mounted on a movable mask stage, and a photosensitive substrate is mounted on a movable substrate stage. The mask on the mask stage has a part of its outer periphery fixed to the mask holder by vacuum suction. Then, the transfer pattern formed on the mask is projected onto the photosensitive substrate by moving the mask stage and the substrate stage in synchronization. In such a step-and-scan exposure apparatus, in order to improve the processing capacity (throughput), it is necessary to move the mask stage with a mask and the substrate stage with a photosensitive substrate at high speed and to increase the acceleration. Is becoming.

[0004]

However, when the mask stage is driven at high speed, the position of the mask on the mask holder may shift. That is, the mask may slide on the mask holder due to the inertial force when the mask stage is accelerated or decelerated. Particularly, in the reduction projection type exposure apparatus, since the moving distance of the mask is longer than that of the photosensitive substrate by the reduction magnification, the problem of the mask position shift becomes significant. Here, since the position of the mask is measured by, for example, a moving mirror system using an interferometer moving mirror on the mask stage, if the position of the mask shifts on the mask holder, the position of the mask with respect to the interferometer moving mirror will change. It will change. Such a positional deviation of the mask is not only a problem on the mask stage, but eventually leads to deterioration of the overlay accuracy of the mask pattern on the photosensitive substrate.

The present invention has been made in view of the above situation, and an object of the present invention is to provide an exposure apparatus capable of preventing the displacement of the mask.

[0006]

In order to solve the above-mentioned problems, the first invention of the present application is to provide an image of a pattern formed on a mask (12) through a projection optical system (14) to a photosensitive substrate. (16) A mask holding member (18) on which a mask (12) is placed, in an exposure device that transfers and exposes light onto the mask (12);
Sealing means (30, 54, 56, 68, 70) forming a sealed space (32, 58, 67, 72) between the mask (12) and the mask holding member (18); the mask (12)
So as to be fixed to the holding member (18), and atmospheric pressure adjusting means (36, 76, 78) for adjusting the atmospheric pressure of the closed space (32, 58, 67, 72).

As an aspect of the first invention, a mask (1
A closed space (32) is formed between the lower surface of 2) and the mask holding member (18). Then, the air pressure in the closed space (32) is made lower than the air pressure outside the space (32) by the air pressure adjusting means (36). In another aspect, the first portion is provided between the lower surface of the mask (12) and the mask holding member (18).
The space (18) is formed, and the second space (58) is formed between the upper surface of the mask (12) and the mask holding member (54). Then, by the atmospheric pressure adjusting means (36), the first
And the atmospheric pressure of the second space (32, 58)
Lower than the atmospheric pressure outside 58). At this time, it is desirable to make the atmospheric pressures of the first space (32) and the second space (58) equal to each other. In still another aspect, the mask (1
A closed space (72) is formed between the upper surface of 2) and the mask holding member (68), and the air pressure of the closed space (72) is adjusted to the outside of the space (72) by the air pressure adjusting means (76, 78). Make it higher than atmospheric pressure.

In each of the above modes, the mask (1
You may use together the adsorption | suction means (64, 66) which vacuum-sucks 2) with respect to the holding member (18, 62). In addition, the closed space (32, 5) by the air pressure adjusting means (36, 76, 78)
8, 67, 72) and the outside of the space to adjust the projection optical system (14) to correct the image forming error of the projected image of the pattern caused by the bending of the mask (12). 38, 40) may be further provided.

In the second invention of the present application, in order to prevent the displacement of the mask, the image of the pattern formed on the mask (12) is transferred through the projection optical system (14) to the photosensitive substrate (1).
6) In an exposure device that transfers and exposes light onto a mask (1
A mask holding member (80) on which 2) is placed; fixing means (82a, 82b, 90a, 90b, for fixing the mask (12) to the mask holding member (80) by magnetic force.
92a, 92b, 94, etc.).

As one aspect of the second aspect of the invention as described above, the pressing members (88a, 88b) provided so as to be in contact with and removable from the mask (12); and fixed to the mask holding member (80). And the electromagnets (82a, 82b) that are fixed to the pressing members (88a, 88b).
a, 82b) and a permanent magnet (90a,
90b) and; the mask holding member (80) of the mask (12)
The electromagnet (82
The mask (12) is fixed to the mask holding member (80) by the control means (94) for controlling the magnetism of a, 82b).

[0011]

In the first invention of the present application as described above,
By forming a closed space (32, 58, 67, 72) between the mask (12) and the mask holding member (18) and adjusting the atmospheric pressure of the closed space (32, 58, 67, 72), Since the mask (12) is configured to be fixed to the holding member (18), the suction surface of the mask (12) with respect to the mask holding member (18) covers a wide range including the region where the transfer pattern is formed. Can be expanded to. That is,
It can be expanded to an area slightly smaller than the area of the mask (12) itself.

At this time, if a closed space (32) is formed between the lower surface of the mask (12) and the mask holding member (18) and the atmospheric pressure is made lower than the external atmospheric pressure, the mask (1
2) is in a state where it is adsorbed on the entire surface by the mask holding member (18). Further, between the lower surface of the mask (12) and the mask holding member (18), and between the upper surface and the mask holding member (5).
By forming two spaces (32, 58) between them and 4), making the pressure in both spaces (32, 58) lower than the external pressure, and making the pressures in both spaces (32, 58) equal, The bending (deformation) of the mask (12) can be minimized. In addition, the upper surface of the mask (12) and the mask holding member (6
When a closed space (72) is formed between the mask holding member (68) and the mask holding member (68) by the pressure of the closed space (72).
It will be pressed against.

Here, the inertial force during movement of the mask (12) is Fk, the holding force on the mask holding member (18) due to the friction of the mask (12) is Fh, the mass of the mask (12) is m, and the mask ( 12) normal force acting on N, mask (1
When the acceleration in the movement of 2) is a and the friction coefficient between the mask (12) and the mask holding member (18) is μ, the following expressions (A) and (B) are established. Fk = ma (A) Fh = Nμ (B)

Further, in order that the mask (12) does not move due to inertial force during movement, it is necessary to satisfy the condition of the following expression (C). Fk <Fh (C) Then, from the above formulas (A), (B) and (C),
The following formula (D) is derived. a <Nμ / m (D)

Here, the mass m of the mask (12) and the coefficient of friction μ between the mask (12) and the mask holding member (18) are substantially constant values, and therefore, in order to increase the acceleration a, , N should be increased. Further, the mask holding member (18) is formed by vacuum suction of the mask (12).
When the adsorption area is S, the external pressure is Po, and the vacuum pressure is Pv, the following equation (E) is established. N = S (Po-Pv) (E)

In any of the first aspects of the present invention, the suction area S of the mask (12) with respect to the mask holding member (18) is expanded to an area slightly smaller than the area of the mask (12). Can be seen as equivalent to As a result, it is possible to increase the acceleration a when the mask (12) moves from the equations (D) and (E).

On the other hand, in the second invention of the present application, since the mask (12) is fixed to the mask holding member (80) by magnetic force, only a part of the mask is vacuum-adsorbed as in the conventional case. The mask (12) can be strongly fixed to the mask holding member (80) as compared with the case of fixing. For example, when the mask (12) is replaced, the electromagnets (82a, 82b) and the permanent magnets (90a, 9a)
0b) repel each other, and presser members (88a, 8a)
8b) is retracted upward. Then, after placing the mask (12) on the mask holding member (80), the electromagnet (82
a, 82b) and the permanent magnets (90a, 90b) are attracted to each other, and the holding members (88a, 88b) are attached to the electromagnets (8
The mask (12) is pressed against the mask holding member (80) by the attraction force of 2a, 82b) and the permanent magnets (90a, 90b). At this time, the holding force of the mask (12) can be controlled by adjusting the value of the current passed through the electromagnets (82a, 82b).

The respective effects of the first and second inventions are greatly effective when applied to a scanning type exposure apparatus in which the mask (12) and the photosensitive substrate (16) move relative to each other in synchronization. This is because in this type of exposure apparatus, there is a strong demand for driving the mask (12) at high acceleration in order to improve throughput.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the following examples. It should be noted that each of the embodiments described below applies the present invention to a scanning projection exposure apparatus for manufacturing a semiconductor device.

[0020]

FIG. 1 shows the overall construction of a projection exposure apparatus according to the first embodiment of the present invention, and FIG. 2 shows the construction around a reticle stage of the projection exposure apparatus. The projection exposure apparatus of the present embodiment irradiates the reticle 12 with the exposure light emitted from the illumination optical system through the condenser lens 10, and projects the image of the predetermined pattern formed on the reticle 12 into the projection optical system. It is transferred onto the wafer 16 via 14. The projection optical system 14 is fixed to the apparatus by a pedestal 17, and is adapted to project an image of the pattern of the reticle 12 onto the wafer 16 at a predetermined reduction magnification (1/4, 1/5, etc.). There is.

The reticle 12 is mounted on the reticle stage 20 in a state where it is fixed to the reticle holder 18 by vacuum suction at four locations on its outer peripheral portion. The reticle stage 20 can be moved at a predetermined speed in the scanning direction (Y direction) by a reticle stage drive system 24. On the reticle stage 20, the reticle interferometer 2
A movable mirror 28 that reflects the laser light output from the laser 6 is fixedly arranged, and the position of the reticle stage 20 can be constantly monitored by the reticle interferometer 26. In FIG. 1, only the reticle interferometer 26 and the movable mirror 28 that measure the position in the scanning direction (Y direction) are shown, but in reality, the interferometer that measures the position in the non-scanning direction (X direction). And a moving mirror is also provided.

An aperture glass 30 is attached to the bottom of the reticle holder 18, and the reticle holder 18 and
The closed space 3 below the reticle 12 is shielded from the outside air by the reticle 12 and the aperture glass 30.
2 are formed. The reason why the aperture glass 30 is used to form the closed space 32 is to transmit the illumination light. A vacuum source 36 is connected to the closed space 32 via a vacuum pipe 34.
The reticle 12 can be strongly held by the reticle holder 18 by lowering the atmospheric pressure of the closed space 32 below the atmospheric pressure by the vacuum source 36. At this time, the reticle 12 may be deformed due to the atmospheric pressure difference between the closed space 32 and the outside air. However, the control unit 38 causes an error in the projection image of the reticle pattern due to the deformation via the lens controller 40. Projection optical system 14
It is designed to be canceled by adjusting the image forming state of.

The wafer 16 arranged below the projection optical system 14 is mounted on the wafer stage 44 in a state of being vacuum-sucked by the wafer holder 42. The wafer stage 44 is configured to be movable in a plane (XY plane) perpendicular to the optical axis of the projection optical system 14 by a wafer stage drive system 46 so that the wafer 16 moves in synchronization with the scanning of the reticle 12. Driven to. On the wafer stage 44,
A movable mirror 50 that reflects the laser light output from the wafer interferometer 48 is fixed, and reflected light from the movable mirror 50 and a fixed mirror (not shown) installed at the lower end of the projection optical system 14 are fixed. The position of the wafer stage 44 can be constantly monitored by the interference light including the reflected light. In FIG. 1, only the wafer interferometer 48 and the movable mirror 50 for measuring the position in the Y direction are shown, but actually, an interferometer and a movable mirror for measuring the position in the X direction are also provided.

Next, the operation and principle of the first embodiment having the above configuration will be described. When the reticle 12 is illuminated with the uniform illumination light condensed through the condenser lens 10, the reticle stage 20 moves in the scanning direction (Y direction) with respect to the illumination area on the reticle 12, and is synchronized with this. Then, the wafer stage 44 on which the wafer 16 is mounted moves in the direction opposite to the moving direction of the reticle stage 20. At this time, the relative positions of the reticle 12 and the wafer 16 are monitored by the reticle interferometer 26 and the wafer interferometer 48, respectively.

Here, the inertial force during movement of the reticle 12 is Fk, the holding force on the reticle holder 18 due to friction of the reticle 12 is Fh, the mass of the reticle 12 is m, and the reticle 1 is
When the normal force acting on 2 is N, the acceleration when the reticle 12 is moving is a, and the friction coefficient between the reticle 12 and the reticle holder 18 is μ, the following equations (1) and (2) are established. Fk = ma (1) Fh = Nμ (2)

Further, in order that the reticle 12 does not move due to inertial force during movement, it is necessary to satisfy the condition of the following expression (3). Fk <Fh (3)

Then, the following equation (4) is derived from the above equations (1), (2) and (3). a <Nμ / m (4)

Here, since the mass m of the reticle 12 and the friction coefficient μ between the reticle 12 and the reticle holder 18 are substantially constant values, in order to increase the acceleration a,
It can be seen that N should be increased. Also, reticle 1
When holding 2 on the reticle holder 18 by vacuum suction, the following equation (5) is established, where S is the suction area, P is the external pressure, and Pv is the vacuum pressure. N = S (Po-Pv) (5)

In this embodiment, since the air pressure in the closed space 32 below the reticle 12 is set lower than the atmospheric pressure, the suction surface of the reticle 12 with respect to the reticle holder 18 includes the area where the transfer pattern is formed. It can be expanded to a wide range. That is, it can be regarded as equivalent to expanding the suction area S to an area slightly smaller than the area of the reticle 12. As a result, formula (4) and formula (5)
As a result, the acceleration a when the reticle 12 moves can be increased. Further, since the pattern surface of the reticle 12 is shielded from the outside air, there is an advantage that the reticle 12 can be prevented from being contaminated.

FIG. 3 shows the structure around the reticle stage (20) of the projection exposure apparatus according to the second embodiment of the present invention. Since the configuration of the projection exposure apparatus of this embodiment other than the periphery of the reticle stage is the same as that of the first embodiment shown in FIG. 1, illustration and description thereof will be omitted in this embodiment. Further, in FIG. 3, the same or corresponding constituent elements as those of the first embodiment are designated by the same reference numerals, and a duplicate description thereof will be omitted here. In the figure, an aperture glass 30 is arranged near the bottom surface of the reticle holder 18, and the reticle 12, the reticle holder 18, and the aperture glass 30 form a first closed space 32 as in the first embodiment. At the top of the reticle 12,
A partition wall 54 is provided, and an aperture glass 56 is installed on the ceiling portion of the partition wall 54. And reticle 12
A second closed space 58 is formed by the upper surface of the partition wall 54, the partition wall 54, and the aperture glass 56.

A vacuum pipe 60 is connected to the first and second closed spaces 32 and 58, and the vacuum source 36 adjusts the atmospheric pressure of the first and second closed spaces 32 and 58 to be lower than the atmospheric pressure. There is. As a result, the reticle 12 can be strongly held by the reticle holder 18. In this case, the first closed space 32 on the lower side of the reticle 12 and the closed space 58 on the upper side of the reticle 12 are connected to each other by a vacuum pipe 60, and the pressures of the closed spaces 32 and 58 are made equal to each other, so that the reticle 12 is closed. It is possible to prevent the reticle 12 from being deformed due to the pressure difference between the upper surface and the lower surface of the reticle 12.

Also in this embodiment, since the atmospheric pressures of the upper and lower closed spaces 32 and 58 of the reticle 12 are set to be lower than the atmospheric pressure, the suction surface of the reticle 12 to the reticle holder 18 is set to the area where the transfer pattern is formed. It can be expanded to a wide range including. That is, it can be regarded as equivalent to expanding the suction area S to an area slightly smaller than the area of the reticle 12. As a result, it is possible to increase the acceleration a when the reticle 12 is moving, from the expressions (4) and (5).

FIG. 4 shows the structure around the reticle stage (20) of the projection exposure apparatus according to the third embodiment of the present invention. Since the configuration of the projection exposure apparatus of this embodiment other than the periphery of the reticle stage is the same as that of the first embodiment shown in FIG. 1, illustration and description thereof will be omitted in this embodiment. Further, in FIG. 4, the same or corresponding constituent elements as those of the first and second embodiments are designated by the same reference numerals, and a duplicate description thereof will be omitted here. In the figure, a suction hole (not shown) is formed on the upper surface of the reticle holder 62 on which the reticle 12 is placed, and a vacuum source 66 is provided via a vacuum pipe 64 to
The reticle 12 is fixed by vacuum suction.

Further, the aperture glass 30 is arranged on the bottom surface of the reticle holder 62, and the reticle 12, the reticle holder 62 and the aperture glass 30 form a first closed space 67 as in the first and second embodiments. Has been done. A partition 68 is provided above the reticle 12, and an aperture glass 70 is installed on the ceiling of the partition 68. Then, the upper surface of the reticle 12, the partition wall 68 and the aperture glass 70 form a second closed space 72. The second closed space 72 is connected to the compressor 78 via an air pipe 74 and a regulator 76. Then, by the compressor 78,
First and second closed spaces 67, 72 above and below the reticle 12.
The pressure of is set higher than the atmospheric pressure. As a result, the reticle 12 is pressed against the reticle holder 62, and the reticle holder 62 of the reticle 12 is pressed.
The holding power for becomes stronger. In this case, regulator 7
6, the holding force of the reticle 12 can be controlled by controlling the pressure in the first and second closed spaces 67, 72 above and below the reticle 12. For example, the atmospheric pressure in the second closed space 72 on the upper side of the reticle 12 is set to be slightly larger than the atmospheric pressure in the first closed space 67 on the lower side.

In the present embodiment, the pressure difference between the closed spaces 67 and 72 above and below the reticle 12 is set to be higher than the atmospheric pressure, and the contact surface between the reticle 12 and the reticle stage 62 is vacuum-adsorbed. Po-
Pv) can be increased. As a result, equation (4),
From the equation (5), it is possible to increase the acceleration a when the reticle 12 moves.

FIG. 5 shows the structure around the reticle stage (20) of the projection exposure apparatus according to the fourth embodiment of the present invention. Since the configuration of the projection exposure apparatus of this embodiment other than the periphery of the reticle stage is the same as that of the first embodiment shown in FIG. 1, duplicated illustration and description thereof will be omitted in this embodiment. Further, in FIG. 5, regarding the same or corresponding components as those of the first, second and third embodiments,
The same symbols shall be attached. In the figure, reticle 1
Electromagnets 82a and 82b are fixedly arranged on both sides of the reticle holder 80 on which the 2 is placed. Electromagnet 82a,
The support blocks 84a and 84 are provided on the side portions of 82b, respectively.
b is installed.

Reticle holding members 88a, 8b are attached to the support blocks 84a, 84b via hinges 86a, 86b.
8b are attached to each of the reticle pressing members 88.
The lower surfaces of a and 88b respectively have permanent magnets 90a and 90b.
b is attached. Current supply units 92a and 92b for generating magnetic force are connected to the electromagnets 82a and 82b, respectively. When current is supplied to the electromagnets 82a and 82b from the current supply units 92a and 92b under the control of the current control unit 94, a magnetic field is generated above the electromagnets 82a and 82b.

In the embodiment as described above, the current controller 94 controls the electromagnet 82 when the reticle 12 is replaced.
In order to generate a magnetic force in a direction in which the permanent magnets 90a and 90b repel each other with respect to a and 82b, the current supply unit 9
2a and 92b are controlled. Then, the electromagnets 82a, 82
The reticle pressing members 88a and 88b retreat upward due to the repulsive force of b and the permanent magnets 90a and 90b. After the reticle 12 is placed on the reticle holder 80 in a state where the reticle pressing members 88a and 88b are opened (retracted), the current control unit 94 causes the permanent magnets 90a and 90b with respect to the electromagnets 82a and 82b. The current supply units 92a and 92b are controlled so that a magnetic force in a direction that attracts Then, the reticle pressing members 88a and 88b press the reticle 12 against the reticle holder 80 by the attraction force of the electromagnets 82a and 82b and the permanent magnets 90a and 90b. As a result, the reticle 12 is fixed to the reticle holder 80. In this case, the electromagnets 82a,
The reticle 1 is adjusted by adjusting the value of the current flowing through 82b.
The holding power of 2 can be controlled. Further, if the distance between the electromagnets 82a, 82b and the permanent magnets 90a, 90b is made small, a large holding force can be obtained with a small current value.

In this embodiment, the normal force N can be increased by pressing the reticle 12 against the reticle holder 80 by the magnetic force, and the acceleration a when the reticle is moved can be increased from the equation (4). Becomes

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments and does not deviate from the gist of the technical idea of the present invention shown in the claims. Various changes can be made within the range.

[0041]

According to the first invention of the present application, a closed space (32, 58, 67, 72) is formed between the mask (12) and the mask holding member (18), and the closed space ( Since the mask (12) is fixed to the holding member (18) by adjusting the atmospheric pressure of (32, 58, 67, 72), even when the mask (12) is driven at high acceleration, the positional deviation occurs. Does not occur. Also in the second invention of the present application, since the mask (12) is fixed to the mask holding member (80) by the magnetic force, the mask (12) is strongly fixed to the mask holding member (80). Therefore, even when the mask (12) is driven at high acceleration, there is no displacement.

[Brief description of drawings]

FIG. 1 is a conceptual diagram (front view) showing a configuration of a projection exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional front view showing the configuration around a reticle stage, which is an essential part of the first embodiment.

FIG. 3 is a partial cross-sectional front view showing the configuration around a reticle stage, which is an essential part of a second embodiment of the present invention.

FIG. 4 is a partial cross-sectional front view showing the configuration around a reticle stage, which is an essential part of a third embodiment of the present invention.

FIG. 5 is a partial cross-sectional front view showing the configuration around a reticle stage, which is an essential part of a fourth embodiment of the present invention.

[Explanation of symbols]

 12 ... Reticle 14 ... Projection optical system 16 ... Wafer 18, 62, 80 ... Reticle holder 20 ... Reticle stage 30, 56, 70 ... Aperture glass 32 ... Closed space 34 , 64 ... Vacuum piping 36, 66 ... Vacuum source 38 ... Control unit 40 ... Lens controller 54, 68 ... Partition wall 56 ... Aperture glass 58 ... Second sealed space 60 ... ..Vacuum piping 67 ... first sealed space 72 ... second sealed space 74 ... air piping 76 ... regulator 78 ... compressor 82a, 82b ... electromagnet 84a, 84b ... block 86a, 86b ... Hinge 88a, 88b ... Reticle holding member 90a, 90b ... Permanent magnet 92a, 92b ... Current supply Section 94 ... Current control section

Claims (10)

[Claims] 1. An exposure apparatus that transfers and exposes an image of a pattern formed on a mask onto a photosensitive substrate via a projection optical system; a mask holding member on which the mask is placed; the mask and the mask holding member. And an air-tightness adjusting unit that adjusts the air pressure in the hermetically sealed space so that the mask is fixed to the holding member. . 2. The closed space is formed between the lower surface of the mask and the mask holding member, and the atmospheric pressure adjusting means makes the atmospheric pressure of the closed space lower than the atmospheric pressure outside the space. The exposure apparatus according to claim 1. 3. The closed space is a first space formed between the lower surface of the mask and the mask holding member, and a second space formed between the upper surface of the mask and the mask holding member. The exposure apparatus according to claim 1, wherein the atmospheric pressure adjusting unit sets the atmospheric pressure of the first and second spaces lower than the atmospheric pressure outside the spaces. 4. The exposure apparatus according to claim 3, wherein the atmospheric pressure adjusting means makes the atmospheric pressures of the first space and the second space equal to each other. 5. The closed space is formed between an upper surface of the mask and the mask holding member, and the atmospheric pressure adjusting means makes the atmospheric pressure of the closed space higher than the atmospheric pressure outside the space. The exposure apparatus according to claim 1. 6. The exposure apparatus according to claim 1, further comprising suction means for vacuum-sucking the mask to the holding member. , 7. The projection optical system is adjusted to correct an image forming error of a projected image of the pattern caused by a bending of the mask caused by a pressure difference between the closed space and the outside of the closed space by the atmospheric pressure adjusting means. 6. The exposure apparatus according to claim 1, further comprising: an adjusting unit that adjusts. 8. An exposure apparatus for transferring and exposing an image of a pattern formed on a mask onto a photosensitive substrate via a projection optical system, comprising: a mask holding member on which the mask is mounted; An exposure apparatus comprising: fixing means for fixing to a holding member. 9. The fixing means comprises: a pressing member provided so as to be in contact with and removable from the mask; an electromagnet fixed to the mask holding member; and fixed to the pressing member,
A permanent magnet arranged to face said electromagnet; and a control means for controlling magnetism of said electromagnet so as to fix and release said mask to said mask holding member. 8. The exposure apparatus according to item 8. 10. A structure in which the image of the pattern of the mask is transferred and exposed on the photosensitive substrate by synchronously moving the mask and the photosensitive substrate relative to each other. 1, 2, 3, 4, 5, 6, 7,
The exposure apparatus according to 8 or 9.