JPH09258241A - Display substrate and its production, and liquid crystal display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease the resistance value of transparent wiring while maintaining the function of the wiring and to enhance the display grade by lessening the occurrence of crosstalk of a liquid crystal display. SOLUTION: The transparent wiring 3 is provided thereon with metallic wiring 4 of a width sufficiently narrower than the wiring. The metallic wiring 4 has a first wiring part 41 disposed at a prescribed spacing in the direction orthogonal to the longitudinal direction of the transparent wiring 3 and a second wiring part 42 disposed along the longitudinal direction of the transparent wiring 3 so as to connect the first wiring part 41. The metallic wiring 4 is formable in correspondence to the adjacent part of the color elements constituting the color filter 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display substrate having transparent wiring and a liquid crystal display using the same.

[0002]

2. Description of the Related Art In a display such as a liquid crystal display, a transparent conductive wiring such as ITO (indium oxide thin film) is generally used as a wiring for applying a voltage to a pixel portion. However, since the resistance value of transparent wiring such as ITO is higher than that of metal wiring, it has been a cause of crosstalk when, for example, a simple matrix type liquid crystal display is time-division driven. Further, when performing color display, a color filter is provided. Since the color filter is provided with a black matrix having a good light-shielding property at the boundary portion of the color elements in order to make the color vivid, The number of manufacturing processes is increasing.

[0003]

An object of the present invention is to reduce the resistance value of the transparent wiring while maintaining its function. Another object is to reduce the occurrence of crosstalk in the liquid crystal display and improve the display quality.
Further, it is another object to provide a manufacturing method thereof.

[0004]

According to the present invention, a metal wiring having a width sufficiently narrower than that of the wiring is provided on the transparent wiring, and the metal wiring has a predetermined width in a direction orthogonal to the longitudinal direction of the transparent wiring. It is characterized in that it has a first wiring portion provided at intervals and a second wiring portion provided along the longitudinal direction of the transparent wiring so as to connect the first wiring portion.

A display substrate, in which a color filter is formed on a transparent substrate and transparent wiring is provided above or below the color filter, the width being sufficiently narrower than the wiring on the transparent wiring. A metal wiring is provided, and the metal wiring has a first wiring portion provided corresponding to a portion adjacent to a color element forming the color filter, and a second wiring portion connecting the first wiring portion. Characterize.

As a method of manufacturing a display substrate, a step of forming a transparent wiring layer on the substrate, a step of forming the formed transparent wiring layer in a predetermined transparent wiring pattern, and a step of forming the transparent wiring layer on the transparent wiring. A step of forming a predetermined metal wiring pattern by electroless plating can be used, and as another manufacturing method, a step of continuously forming a transparent wiring layer and a metal layer on a substrate and a predetermined metal layer can be used. And the step of forming the transparent wiring layer into a predetermined transparent wiring pattern after this step.

Further, the display substrate is provided on one of the substrates,
A liquid crystal display can be configured by providing transparent wiring on the other substrate facing the substrate in correspondence with a region formed between the first wiring portions.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. As shown in the schematic sectional view of FIG. 1 and the plan view of the main part of FIG.
Conductive transparent wiring 3 made of O (indium oxide thin film) or the like
Are arranged in parallel. The substrate 2 may be composed only of a transparent substrate 21 such as a glass plate, but in this example, in order to support color display, color filters 22r, 22g, 22b are arranged on the transparent substrate 21 in a stripe shape. 22 is provided, and a protective film 23 is laminated on almost the entire surface of the transparent substrate 21 so as to cover it if necessary. The transparent wiring 3 has a thickness of about 50 to 100 nm and a width of about 200 μm, and is provided so as to be orthogonal to the color filter 22.

On the transparent wiring 3, a metal wiring 4 made of a metal having a resistance lower than that of the transparent wiring 3 and having a light shielding property is provided. The metal wiring 4 has a line width of 10 to 40 μm.
The width is set to be sufficiently narrower than that of the transparent wiring 3. The metal wiring 4 is provided with a first wiring portion 41 provided at a predetermined interval in a direction orthogonal to the longitudinal direction of the transparent wiring 3.
And a second wiring portion 42 provided along the longitudinal direction of the transparent wiring 3 so as to connect the first wiring portion 41. The first wiring part 41 includes the color elements 22r, 22 of the color filter 22 so as to form a black matrix.
It is provided along the boundary between g and 22b. That is,
The first wiring part 41 includes the color elements 22 of the color filter 22.
The transparent wirings 3 are arranged along the longitudinal direction at the same pitch as the widths of r, 22g, and 22b. The second wiring portions 42 provided along the longitudinal direction of the transparent wiring 3 are provided at both ends of the transparent wiring 3.

In the region surrounded by the first wiring portion 41 and the second wiring portion 42, the opening 4 through which the color elements 22r, 22g, 22b of the color filter 22 are exposed via the transparent wiring 3.
Constituting No. 3. The width of the opening 43 is set to be approximately the same as the width of the opposite transparent wiring 62 described later. And
The openings 43 located along the direction orthogonal to the longitudinal direction of the transparent wiring 3 are arranged face-to-face along the opposing transparent wiring 62. In this way, by forming the opening 43 in the metal wiring 4, it is possible to minimize the blocking of light by the metal wiring 4 and maintain the optical function of the transparent wiring 3. In addition, the first wiring portion 41 and the second wiring portion 42 surrounding the opening 43 can function as a black matrix that makes clear the contours of the color elements that form one pixel.

Next, the first and second manufacturing methods of the display substrate 1 will be described with reference to FIGS.

First, the first manufacturing method will be described with reference to FIG. A transparent wiring layer 30 is formed on the substrate 2 with the color filter 22 (FIG. 11A) (FIG. 11B), and a resist agent 50 is applied thereon (FIG. 11C) to form a transparent wiring pattern. After exposure using a mask corresponding to No. 3, photolithography processing for development is performed (FIG. 3D), and the transparent wiring layer 3
0 is subjected to an etching treatment ((e) in the figure), and the resist agent 50
Are peeled off ((f) in the figure). Next, a resist agent 51 for plating treatment is applied (FIG. 9 (g)), and a photolithography process for developing is performed after exposure using a mask corresponding to the metal wiring pattern 4 (FIG. 11 (h)). After electroplating to form the metal wiring 4 ((i) in the figure), the resist material 51 is peeled off to form the display substrate 1 ((j) in the figure).
Here, the electroless plating is performed by using copper (C
u), nickel (Ni), gold (Au), etc., a single layer structure or a multilayer structure thereof can be adopted. In this example, a multilayer structure in which gold (Au) is laminated on nickel (Ni) is used. It is adopted. Thus, the transparent wiring layer 30 is formed on the substrate 2.
And a step of forming the formed transparent wiring layer 30 in a predetermined pattern of the transparent wiring 3, and the transparent wiring 3
And a step of forming a predetermined pattern of the metal wiring 4 by electroless plating thereon,
The metal wiring 4 can be accurately formed at low cost.

In the above first manufacturing method, the substrate 2
Alternatively, a transparent wiring layer 30 formed in advance on the color filter 22 may be used, and in this case, the step of forming the transparent wiring layer 30 shown in FIG. 3B can be omitted.

Next, the second manufacturing method will be described with reference to FIG. The transparent wiring layer 30 is formed on the substrate 2 with the color filter 22 (FIG. 11A) (FIG. 11B), and the metal layer 40 is continuously formed thereon (FIG. 11C). . Next, a first resist agent 52 is applied (FIG. 2D), and a photolithography process for developing after exposure using a mask corresponding to the metal wiring pattern 4 is applied (FIG. 2E), and the metal layer 40 is etched (FIG. 6F), and the resist agent 52 is removed (FIG. 6G).
Next, a second resist agent 53 is applied (FIG. 6 (h)),
After exposure using a mask corresponding to the transparent wiring pattern 3,
Photolithography processing for development is performed (FIG. 2I), the transparent wiring layer 30 is etched (FIG. 2J), and the resist agent 53 is peeled off to form the display substrate 1 (FIG. 2K). . Here, the transparent wiring layer 30 can be made of ITO and has a thickness of 1 by sputtering, for example.
It can be formed to a thickness of about 00 nm. The metal layer 40 can be made of an aluminum (Al) alloy or the like, and has a thickness of 100 to 4 by, for example, sputtering.
It can be formed to a thickness of about 00 nm. Such a step of continuously forming the transparent wiring layer 30 and the metal layer 40 on the substrate 2, a step of forming the metal layer 40 in a predetermined pattern of the metal wiring 4, and a transparent wiring layer after this step. Thirty
The manufacturing method of the display substrate 1 can be simplified by the manufacturing method of the display substrate including the step of forming the above in the pattern of the predetermined transparent wiring 3.

FIG. 5 shows a simple matrix type liquid crystal display using the display substrate 1 as one of the substrates.
The other display substrate 6 of the display, which faces the display substrate 1, has the transparent wiring 3 on the transparent substrate 61 such as a glass plate.
It is configured by providing a plurality of transparent wirings 62 in a direction orthogonal to. The display substrates 1 and 6 are bonded and fixed with a slight gap provided by making the surfaces provided with the transparent wirings face each other and providing a sealant 7 around them. The liquid crystal 8 is so arranged that the liquid crystal molecules have a predetermined twist angle therebetween.
Is enclosed. On the opposite surface of both display boards,
The alignment film 9 and the like can be provided as necessary. This liquid crystal display is time-division driven by a drive circuit (not shown).

Since the transparent wiring 3 is provided with the low-resistance metal wiring 4 along the longitudinal direction thereof, even if the length of the transparent wiring 3 becomes long due to the enlargement of the display screen, The voltage drop is reduced, crosstalk can be prevented, and good display quality can be maintained. Further, the metal wiring 4 has at least the first wiring portion 41.
Are located along the boundaries of the color filter color elements 22r, 22g, 22b, so that the light passing through the boundary portions of the color elements can be effectively shielded and the occurrence of color mixture can be prevented. In this way, the metal wiring 4 formed on the transparent wiring 3
Can function as a light-shielding portion and can also serve as a black matrix to simplify the configuration.

Although the second wiring portion 42 of the metal wiring 4 is provided at both ends of the transparent wiring 3 in the above embodiment, it may be provided at one end, and as shown in FIG. It can also be provided in the center of

In the above embodiment, the transparent wiring 3 is provided on the color filter 22, but the present invention can be applied to the case where the transparent wiring 3 is provided under the color filter 22. it can. Also, the case where the metal wiring 4 is provided on the transparent wiring 3 formed on the substrate 2 on the side where the color filter 22 is provided has been taken as an example, but the present invention is not limited to this, and it faces the substrate where the color filter 22 is provided. It can also be applied to the transparent wiring 62 of the substrate 6 on the side, and the resistance of the wiring can be further reduced by applying the metal wiring 4 to the transparent wiring of both substrates. In this case, it is preferable that only the second wiring portion 42 is provided on the other substrate 6. Although the substrate 2 with the color filter 22 is taken as an example of the substrate 2, the transparent substrate 21 can be used as the substrate 2 when a color filter is not needed.

[0019]

As described above, according to the present invention, the display quality can be improved by reducing the resistance of the transparent wiring, and the structure can be simplified.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of a display substrate according to an embodiment of the present invention.

FIG. 2 is a schematic partial plan view of the embodiment.

FIG. 3 is a process drawing showing one of the methods for manufacturing the display substrate.

FIG. 4 is a process drawing showing another one of the methods for manufacturing the display substrate.

FIG. 5 is a cross-sectional view of a main part of a liquid crystal display.

FIG. 6 is a schematic partial plan view of another embodiment.

[Explanation of symbols]

 1 Display Substrate 2 Substrate 21 Transparent Substrate 22 Color Filter 3 Transparent Wiring 4 Metal Wiring 41 First Wiring Section 42 Second Wiring Section

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Satoshi Morita 3-201 Minamiyoshikata, Tottori City, Tottori Prefecture Tottori Sanyo Electric Co., Ltd.

Claims (7)

[Claims] 1. A first wiring part provided on the transparent wiring with a metal wiring having a width sufficiently narrower than the wiring, the metal wiring being provided at a predetermined interval in a direction orthogonal to the longitudinal direction of the transparent wiring. And a second wiring portion provided along the longitudinal direction of the transparent wiring so as to connect the first wiring portion. 2. A display substrate in which a color filter is formed on a transparent substrate, and transparent wiring is provided above or below this color filter, the width being sufficiently narrower than the wiring above the transparent wiring. A metal wiring is provided, and the metal wiring has a first wiring portion provided corresponding to a portion adjacent to a color element forming the color filter, and a second wiring portion connecting the first wiring portion. Characteristic display board. 3. The display substrate according to claim 1, wherein the second wiring portion is provided along a center or an end of the transparent wiring. 4. A step of forming a transparent wiring layer on a substrate,
A method of manufacturing a display substrate, comprising: a step of forming the formed transparent wiring layer in a predetermined transparent wiring pattern; and a step of forming a predetermined metal wiring pattern on the transparent wiring by electroless plating. 5. A step of continuously forming a transparent wiring layer and a metal layer on a substrate, a step of forming the metal layer in a predetermined metal wiring pattern, and a transparent wiring layer having a predetermined transparent wiring after this step. A method of manufacturing a display substrate, the method including the step of forming a pattern. 6. The method of manufacturing a display substrate according to claim 4, wherein the substrate is a substrate provided with a color filter. 7. A liquid crystal display comprising the display substrate according to claim 1 on one substrate, which is formed between the first wiring portions on the other substrate facing the one substrate. A liquid crystal display characterized by comprising transparent wiring wired corresponding to a region.