JPH09244053A - Production of liquid crystal display device and liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively produce a liquid crystal display device which is small in size and has high image quality and high reliability while having a large capacity by alternately superposing substrates formed with wiring patterns at both ends and spacers to form a laminate and applying a conductive adhesive on this laminate. SOLUTION: The array substrates 2 formed with electrodes consisting of ITO, TFTs, etc., and the hollow spacers 17 having approximately the same outer peripheries as the outer peripheries of the array substrates 2 are alternately superposed on each other to form the laminate 18. Next, the conductive adhesive 31 is dropped on the connecting positions of the lead lines and branch lines of the array substrates 2 by a dispenser 20 while the laminate 18 is moved back and forth in a lamination direction. As a result, the required number of pieces of the line-like conductive adhesives 21 of the min. width of 110μm are acquired on the laminate 18. The spacers 17 are thereafter removed from the laminate 18 and the array substrates 2 are heated to thermoset the conductive adhesives 21, by which the adhesive parts are formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a method of manufacturing a liquid crystal display device and a liquid crystal display device for improving a connection portion of a wiring pattern provided in a frame region of a substrate.

[0002]

2. Description of the Related Art In recent years, with the practical use of a liquid crystal display device having a large capacity, high speed and high definition, thin film transistors (hereinafter abbreviated as TFT) arranged in a matrix on a glass substrate are used as driving elements. Liquid crystal display device (hereinafter TFT-L
Abbreviated as CD. ) Is used, and recently, a large TFT-LCD having a diagonal size of 10 inches or more has been put into practical use.

In this TFT-LCD, a liquid crystal driving semiconductor integrated circuit element (hereinafter referred to as a driver IC) for driving the TFT has been conventionally mounted in 80.
TAB (Tape-Autom) that enables connection at a narrow pitch of about μm pitch and can reduce the mounting area.
aged-bonding) was frequently used.

However, due to the increase in the number of pixels associated with the further increase in size of the TFT-LCD, the number of driving signal lines tends to increase, and the number of input / output terminals of the driver IC tends to increase to 300 terminals or more. there were. For this reason, if a TAB is used for a multi-terminal driver IC, the width of the TAB tape becomes wider. However, the wider the TAB tape becomes, the more difficult it is to make the tape in terms of tape accuracy and the finer the TAB connection pitch. There is a limit to the size reduction, and the mounting area is increased, which hinders the miniaturization of the large capacity TFT-LCD.

On the other hand, a chip-on-glass (COG) in which a driver IC is directly mounted on a substrate as an IC chip
The implementation method called is developed. The COG is,
Since the mounting area is the size of the driver IC, TAB
In comparison with TAB, the frame area around the display area on the substrate can be further reduced, and since members such as a tape carrier are not required, the cost can be reduced as compared with TAB.

In this COG, wiring to the driver IC may be performed on an external substrate such as a flexible printed circuit (FPC) or directly on a glass substrate. In the former case, the external substrate is used. In addition to the above, the glass substrate and the external substrate are required to be connected to each other, resulting in an increase in cost and a problem that the frame region is enlarged and the miniaturization is prevented because the external substrate is arranged. . On the other hand, in the latter case, the wiring to the driver IC can be formed with high precision at the same time as the TFT manufacturing process of the pixel portion, which is conventionally performed by using the thin film photolithography technique on the glass substrate, so that the cost increase can be suppressed. In addition, there is an advantage that the wiring area can be small.

However, since the latter wiring on the glass substrate has a very thin film thickness of 1 μm or less, the wiring resistance becomes large, the driver IC malfunctions, and the display unevenness and the gradation defect occur. Particularly in a large TFT-LCD, there is a new problem that the deterioration of image quality due to an increase in wiring resistance becomes remarkable.

Therefore, for example, as disclosed in Japanese Patent Laid-Open No. 5900/1993, a driver IC is mounted on one surface of a glass substrate, a bus line is formed on the surface opposite to the mounting surface, and a frame region is formed. The wiring width is expanded without increasing,
A device for reducing wiring resistance has also been developed. In such a device, the reliability of the connecting portion between the lead wire wired on the driver IC mounting surface of the glass substrate and the bus line wired on the opposite surface is required. In order to connect the lead wire and the bus line, a conductive adhesive was applied to the side surface of each glass substrate by a dispenser.

[0009]

However, in the method of applying the conductive adhesive to each glass substrate and electrically connecting the wirings formed on both surfaces of the glass substrate, the conductivity of each glass substrate is increased. There is a problem that the coating amount of the adhesive is different, the conductive adhesive is cut off or the film thickness becomes non-uniform, the wiring resistance varies, the image quality is deteriorated, and the electrical continuity becomes impossible. Moreover, there is a problem in that it takes time to apply the conductive adhesive, which eventually leads to an increase in cost.

Therefore, the present invention eliminates the above-mentioned problems and provides a large capacity by electrically and reliably connecting wiring patterns formed on both surfaces of a glass substrate and reducing the manufacturing cost. However, it is an object of the present invention to manufacture a liquid crystal display device that is small in size, high in image quality, and highly reliable at low cost.

[0011]

In order to solve the above problems, the present invention is formed on a pair of substrates having electrodes and holding a liquid crystal composition, and on both surfaces of at least one of the substrates. In a method of manufacturing a liquid crystal display device, comprising: a wiring pattern; and a connecting means which is provided on a side surface of the substrate having the wiring pattern and electrically connects the wiring patterns formed on both surfaces of the substrate, Forming a laminated body by alternately stacking a plurality of spacers which are the same as or slightly smaller than the substrate, and a conductive adhesive is dropped linearly in the laminating direction of the laminated body to connect to the side surface of the substrate. And a step of forming means.

In order to solve the above problems, the present invention provides a pair of substrates having electrodes and holding a liquid crystal composition, a wiring pattern formed on both surfaces of at least one of the substrates, The substrate having a wiring pattern,
A plurality of spacers whose outer circumference is the same as or slightly smaller than that of the substrate are alternately stacked to form a laminated body, and a conductive adhesive or a thermosetting conductive adhesive is linearly formed in the laminating direction of the laminated body. Connection means for electrically connecting wiring patterns formed on both sides of the substrate on the side surface of the substrate.

According to the present invention having such a structure, the conductive adhesive for connecting the wiring patterns formed on both sides of the substrate on the side surfaces of the substrate is formed uniformly and at high speed so that the wiring patterns can be formed between both wiring patterns. It is possible to reduce the size of a liquid crystal display device having a large capacity and a high definition image quality and to be manufactured at low cost without causing disconnection or variation in wiring resistance.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. Figure 1 shows a TFT
Array substrate 2 in which (not shown) are arranged in a matrix
FIG. 3 is a plan view of a liquid crystal display device 1 including a liquid crystal composition 4 between a substrate 3 and a counter substrate 3.

On the first surface 2a of the frame area [B] around the display area [A] of the array substrate 2, the lead wire 7 which is a wiring pattern for inputting to the driver IC 6 mounted by the face-down method is provided. A bus line, which is a wiring pattern to which a control signal from the outside is input by the flexible printed board 9, is provided on the second surface 2b of the frame area [B] which is the surface opposite to the mounting surface of the driver IC 6 and which is wired by the photolithography technique. 8 and its branch line 8a are wired by the photolithography technique. An insulating film 10 is formed between the bus line 8 and the branch line 8a.
They are electrically connected via a via hole 10a provided at 0.

The wires such as the lead wire 7 and the bus line 8 are made of aluminum (Al) or Indium-Tin-Oxi.
de (hereinafter abbreviated as ITO) or the like, and the number of wirings thereof is, for example, assuming that the driver IC 6 has 256 gradations, 24 (8 × 8 × 8) RGB gradation data of each pixel.
3), about 5 clocks and control signals, and about 9 reference voltages for halftone correction are required. If power and ground are added, the total will be about 40. 11 is T
Reference numeral 12 is a scanning line terminal of the FT, and 12 is a signal line terminal of the TFT.

The driver IC 6 is connected to the lead wire 7 via the bump 13a, and is connected to the scanning line terminal 11 and the signal line terminal 12 via the bump 13b. The bumps 13a and 13b are connected to the wirings 7, 11 and 12 by using an anisotropic conductive film (ACF), melting solder or the like, or solid phase bonding between metals. ing.

The end portion 7b of the lead wire 7 formed on the first surface 2a of the frame area [B] and the end portion 8b of the branch line 8a of the bus line 8 formed on the second surface 2b are shown in FIG. Is a conductive adhesive that is formed wide on the side surface of the array substrate 2 and is silver (Ag), nickel (Ni), gold (A).
u) Adhesive part 1 formed from thermosetting conductive adhesive 21 made of epoxy resin mixed with conductive fine particles
6 is conducted.

Next, a method of manufacturing the adhesive portion 16 of the array substrate 2 will be described. First, an array substrate 2 on which an electrode made of ITO, a TFT and wirings 11 and 12 thereof, a lead wire 7, a bus line 8 and a branch line 8a thereof are formed, and a hollow spacer having a substantially same outer periphery as the array substrate 2 1
7 are alternately stacked to form a laminated body 18. Next, while reciprocating the laminated body 18 in the laminating direction, the dispenser 20
Thus, the conductive adhesive 21 is dropped on the connection position of the lead wire 7 and the branch wire 8a of the array substrate 2. As a result, the required number of line-shaped conductive adhesives 21 having a minimum width of 100 μm are attached onto the laminate 18.

After this, the spacers 17 are removed from the laminated body 18, the array substrate 2 is heated, and the conductive adhesive 21 is thermally cured to form the adhesive portion 16. On the other hand, the spacer 17
The adhesive 16 is washed with ethanol or the like for reuse.

According to this structure, the adhesive portions 16 can be applied uniformly and at high speed to the plurality of array substrates 2 by a single applying process, and disconnection may occur between the lead wire 7 and the branch wire 8a. It is possible to obtain a good connection without variation in wiring resistance, and to obtain a liquid crystal display device having a large capacity, a small frame area, and high definition image quality. Moreover, since the adhesive portions 16 can be mass-produced in a large amount and the formation time can be shortened, the manufacturing cost at the time of manufacturing the array substrate 2 is also reduced.

Next, a second embodiment of the present invention will be described. In the second embodiment, the application of the adhesive portion 16 to the laminated body 18 according to the first embodiment is performed by a screen printing method without using a dispenser, and the others are performed in the first embodiment. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. That is, in the second embodiment, after forming the laminated body 18 in which the array substrate 2 and the spacer 17 are alternately stacked, the conductive adhesive 21 is applied by printing on the patterned mask on the side surface of the laminated body 18. Further, the array substrate 2 is further heated to cure the conductive adhesive 21 to form the adhesive portion 16.

With this structure, as in the first embodiment, the lead wire and the branch wire 8a can be connected and conducted uniformly with high precision and at high speed.

Next, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the shape of the spacer 17 in the first embodiment is different, but the others are the first.
The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

That is, in the third embodiment, in order to regulate the width of the conductive adhesive 21 dropped on the dispenser 20, the spacers 2 alternately stacked with the array substrate 2 are arranged.
The notch 22a having the same width as that of the adhesive portion 16 is formed on the side surface of No. 2.

When the conductive adhesive 21 is dropped in a line on the laminate 23 using the spacer 22 as described above, the spacer 2
The two notches 22a act as a mask, and the array substrate 2
The protrusion of the conductive adhesive 21 on the side surface is eliminated, the uniformity of the adhesive portion 16 is further improved, and the lead wire and the branch wire 8 are provided.
The connection accuracy of a is further improved.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, a protrusion 24 having the same width as that of the adhesive portion 16 is provided in the portion where the adhesive portion 16 is formed on the side surface of the array substrate 2 in the first embodiment, and the same portion as that of the first embodiment. Are denoted by the same reference numerals, and description thereof will be omitted.

That is, the array substrate 2 having the projections 24 and the spacers 17 are alternately stacked to form a laminated body 26, and the conductive adhesive 21 is applied at the positions of the protrusions 24 while reciprocating the laminated body 26. It is dropped in a line shape, and the array substrate 2 is further heated to heat and cure the conductive adhesive 21 to form the connection portion 16.

According to this structure, the uniformity of the adhesive portion 16 is further improved, and the lead wire and the branch wire 8a can be connected reliably and highly accurately.

Next, a fifth embodiment of the present invention will be described with reference to FIGS. 9 and 10. In the fifth embodiment, the bus line 8 and the branch line 8a in the first embodiment are provided on the first surface 27a of the frame region [B] of the array substrate 2, which is different from the first embodiment. The same parts are designated by the same reference numerals and the description thereof will be omitted.

That is, the array substrate 27 has the bus line 28 and the branch line 28 on the first surface 27a of the frame region [B].
In addition, the frame region [B] is provided for the wiring of the power supply system or the like, in which the wiring line a is further wired and the resistance of the bus line 28 is particularly required to be low.
The auxiliary wiring 30 for reducing the resistance is formed on the second surface 27b. And such an array substrate 27
And a spacer 17 are alternately stacked to form a laminated body (not shown), and while the laminated body is reciprocally moved, the array substrate 2
A conductive adhesive (not shown) is linearly dropped on the connection position between the branch line 28a and the auxiliary wiring 30 of No. 7, and the array substrate 27 is further heated to connect the branch line 28a and the auxiliary wiring 30. The part 31 is formed.

According to this structure, the branch line 28a and the auxiliary wiring 30 can be uniformly and precisely connected at the connecting portion 31, so that the auxiliary wiring 30 can be used as a power source for reducing the resistance of the power source line. If it is wiring, the auxiliary wiring 30
By providing the surface 27b, the voltage drop due to the wiring resistance of the power supply line of the power supply supplied to the driver IC 6 can be reduced without increasing the frame area [B], the malfunction of the driver IC 6 can be prevented, and the auxiliary wiring 30 is wide. Since it can be wired, the inductance is reduced, the inductive noise of the power supply system can be reduced, and a high-definition and good image can be obtained.

Next, a sixth embodiment of the present invention will be described with reference to FIGS. 11 and 12. In the sixth embodiment, as in the fifth embodiment, the bus line 8 and the branch line 8a in the first embodiment are provided on the first surface 2a of the frame region [B] of the array substrate 2. The same parts as those in the first and fifth embodiments are designated by the same reference numerals and the description thereof will be omitted.

That is, the bus line 28 and the branch line 28a are wired on the first surface 27a of the frame region [B] of the array substrate 27, and the auxiliary power supply wiring 32 of the bus line 28 which is required to have a particularly low resistance. Second surface 27b of frame area [B]
In addition to the above, the auxiliary ground wiring 33 is formed and the capacitor 34 for power supply decoupling is mounted.
The array substrate 2 and the spacer 17 are alternately stacked while the laminate (not shown) is reciprocally moved.
A conductive adhesive (not shown) is linearly dropped at a position where the branch line 28a of 7 and the auxiliary power supply line 32 or the auxiliary ground line 33 are connected, and the array substrate 27 is further heated to form the branch line 28a. The connection portion 36 is formed to conduct the auxiliary power supply wiring 32 or the auxiliary ground wiring 33.

According to this structure, the branch line 28a and the auxiliary power supply wiring 32 or the auxiliary ground wiring 33 can be uniformly and precisely connected at the connecting portion 36, and the capacitor 34 is provided on the second surface 27b. The frame area [B]
The space for the capacitor 34 on the first surface 27a of the first surface 27a is unnecessary, and the frame area [B] can be downsized, or
It is possible to increase the width of other wiring on 7a. Further, by mounting the capacitor 34 on the auxiliary power supply wiring 32 formed wide on the second surface 27b, the impedance of the power supply system can be further reduced, and a good image can be obtained by improving the noise resistance.

Next, a seventh embodiment of the present invention will be described with reference to FIG. In the seventh embodiment, as in the fifth embodiment, the bus line 8 and the branch line 8a in the first embodiment are connected to the first surface 2a of the frame region [B] of the array substrate 2.
The same parts as those of the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

That is, the bus line 28 and the branch line 28a made of non-translucent aluminum (Al) are laid on the first surface 27a of the frame region [B] of the array substrate 27, and the second line of the frame region [B] is further provided. An auxiliary wiring 37 for reducing the resistance is formed on the surface 27b. The auxiliary wiring 37 is formed wide so as to cover the back surface of the driver IC 6 mounted on the first surface 27a. While reciprocating a laminated body (not shown) in which the array substrate 27 and the spacers 17 having such wirings are alternately stacked, electrical conductivity is provided at a position where the branch line 28a of the array substrate 27 and the auxiliary wiring 37 are connected. Adhesive (not shown)
Is dropped in a line shape, and the array substrate 27 is further heated to form a connecting portion 38 for electrically connecting the branch line 28a and the auxiliary wiring 37.

According to this structure, the branch line 28a and the auxiliary wiring 37 can be uniformly and precisely connected at the connecting portion 38 at high speed, so that the wiring can be easily and inexpensively regardless of the resistance of the wiring. As a result, the frame area [B] can be downsized. Further, since the non-translucent auxiliary wiring 37 is formed on the back surface of the driver IC 6 and the light from the backlight (not shown) does not directly enter the driver IC 6, it is possible to prevent the threshold value of the driver IC 6 from changing. , Better drive can be obtained.

Next, an eighth embodiment of the present invention will be described with reference to FIG. In the eighth embodiment, as in the fifth embodiment, the bus lines 8 and the branch lines 8a in the first embodiment are connected to the first surface 2a of the frame region [B] of the array substrate 2.
The same parts as those of the first and fifth embodiments are designated by the same reference numerals and the description thereof will be omitted.

That is, the bus line 28 and the branch line 28a are wired on the first surface 27a of the frame area [B] of the array substrate 27, and the auxiliary wiring for lowering the resistance on the second surface 27b of the frame area [B]. 40 is formed. While reciprocating a laminate (not shown) in which the array substrate 27 having such wiring and the spacers 17 are alternately stacked, a conductive adhesive is dropped in a line at a predetermined position of the array substrate 27. Then, the array substrate 27 is further heated to form the connection portion 41 that electrically connects the branch line 28a and the auxiliary wiring 40. Further, a chip capacitor 42 is mounted on this connecting portion 41.

According to this structure, by providing the chip capacitor 42 on the side surface of the array substrate 27 with the connecting portion 41 as an electrode, the space for the capacitor 34 in the first surface 27a of the frame region [B] is unnecessary, and the frame is formed. It is possible to reduce the size of the region [B] or increase the width of other wiring on the first surface 27a. In addition, the connection portion 41 can be formed uniformly with high precision and at high speed, and the manufacturing cost can be reduced.

Next, a ninth embodiment of the present invention will be described with reference to FIGS. The ninth embodiment is the first embodiment.
In addition to the adhesive portion 16 in the embodiment, the array substrate 2
An input terminal for inputting a control signal from the flexible printed circuit board 9 is provided on the side surface. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

That is, the driver IC 44 is mounted by COD on the first surface 43a of the frame area [B] of the array substrate 43, and the lead wire 46 is wired, while the bus line is formed on the second surface 43b of the frame area [B]. The branch line 47a connected to the lead wire 47 and the lead wire 46 is wired. While the array body 43 and the spacers (not shown) formed in this way are reciprocally moved in a laminated body (not shown) in which they are alternately stacked,
And a position for connecting the lead wire 46 and the branch wire 47a of
A conductive adhesive (not shown) is dropped linearly at a position where the flexible printed circuit board 51 for inputting a control signal from the outside is connected.

After removing the spacers, the array substrate 4
3 is heated to form the connecting portion 50 for electrically connecting the lead wire 46 and the branch wire 47a, and the input terminal portion 52 for connecting the flexible printed circuit board 51 is formed, and then the input terminal portion 52 is provided with the flexible printed circuit board. 51 is attached.

According to this structure, the lead wire 46 and the branch wire 47a are connected at the connection portion 50 at a uniform and high precision and at a high speed, and the uniform and fine input / output terminal portion 52 is formed in the same step. It is possible to form the input terminal portion 52 which is a connection terminal with the flexible printed circuit board 51 without increasing the manufacturing process and the cost, and the flexibility in mounting the flexible printed circuit board 51 on the array substrate 43 is increased. Realization of miniaturization is made easier.

The present invention is not limited to the above-described embodiment, and modifications can be made without departing from the spirit of the invention. For example, the material and structure of the wiring formed on the substrate are not limited, and ITO is not limited. Nickel (Ni), copper (Cu), chromium (Cr), on the wiring made of aluminum or aluminum (Al),
It is also possible to stack gold (Au) or the like to further increase the body resistance of the wiring. The number of wirings and the wiring width are also arbitrary.
Further, the viscosity of the conductive adhesive, the moving speed of the laminated body, and the like can be arbitrarily selected according to the width of the connecting means.

Further, the mounting surface of the liquid crystal driving semiconductor element on the substrate is not limited, and it may be mounted on the surface opposite to the surface on which the liquid crystal driving element such as TFT is formed.

Further, when forming the connecting means, the substrate on which the connecting means is alternately laminated with the spacers to form the connecting means on the side surface may be a single substrate, or a cell substrate or a cell substrate in which a pair of substrates are assembled facing each other. It may be a cell substrate in which a liquid crystal composition has been injected into a liquid crystal.

[0049]

As described above, according to the present invention, a substrate on which wiring patterns are formed on both surfaces and spacers are alternately laminated to form a laminated body, and a conductive adhesive is applied to the laminated body. By coating, the frame area is small but the frame area is small, and the size of the device is reduced. On the side surface of the substrate, the connecting means for electrically connecting the wiring patterns on both sides of the substrate are collectively and uniformly formed at high speed. I can. Therefore, unlike the conventional case, there is no disconnection between the wirings on both sides of the substrate, the reliability of the connection between the wirings is improved, the wiring resistance is made uniform, and the large capacity and the miniaturization of the device are realized. However, it is possible to obtain a high-definition image by a highly accurate wiring pattern. Moreover, the connecting means can be collectively formed on a plurality of substrates, and the forming time of the connecting means can be shortened as compared with the conventional one.
The manufacturing cost can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a partial side view of the liquid crystal display device according to the first embodiment of the present invention.

FIG. 3 is a plan view showing bus lines and branch lines according to the first embodiment of this invention.

FIG. 4 is a partial perspective view showing a frame region [B] of the liquid crystal display device according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram showing the arrangement of the array substrate and the spacer of the laminated body according to the first embodiment of the present invention in a developed state.

FIG. 6 is a schematic perspective view showing dropping of a conductive adhesive onto the laminated body according to the first embodiment of the present invention.

FIG. 7 is a schematic perspective view showing a laminated body according to a third embodiment of the present invention.

FIG. 8 is a schematic perspective view showing a laminated body according to a fourth embodiment of the present invention.

FIG. 9 is a partial side view showing a frame region [B] according to a fifth embodiment of the present invention.

FIG. 10 is a plan view showing an auxiliary wiring according to a fifth embodiment of the present invention.

FIG. 11 is a frame area [B] of the sixth embodiment of the present invention.
It is a partial side view which shows.

FIG. 12 is a plan view showing an auxiliary power supply wire according to a sixth embodiment of the present invention.

FIG. 13 is a plan view showing an auxiliary wiring according to a seventh embodiment of the present invention.

FIG. 14 is a partial perspective view showing an array substrate according to an eighth embodiment of the present invention.

FIG. 15 is a partial plan view showing a ninth embodiment of the present invention.

FIG. 16 is a partial side view showing a ninth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Liquid crystal display device 2 ... Array substrate 3 ... Counter substrate A ... Display area B ... Frame area 6 ... Driver IC 7 ... Lead wire 8 ... Bus line 8a ... Branch line 16 ... Adhesive part 17 ... Spacer 18 ... Laminated body

Claims (12)

[Claims] 1. A pair of substrates having electrodes and holding a liquid crystal composition, wiring patterns formed on both surfaces of at least one of the pair of substrates, and a wiring pattern provided on a side surface of the substrate having the wiring pattern. In a method for manufacturing a liquid crystal display device, which comprises a connecting means for electrically connecting wiring patterns formed on both surfaces of a substrate, the substrate and spacers whose outer circumference is the same as or slightly smaller than the substrate are alternately formed. A step of stacking a plurality of sheets to form a laminated body; and a step of dropping a conductive adhesive in a line shape in the laminating direction of the laminated body to form the connecting means on the side surface of the substrate. Method for manufacturing liquid crystal display device. 2. A pair of substrates having electrodes and holding a liquid crystal composition, wiring patterns formed on both surfaces of at least one substrate of the pair of substrates, and a wiring pattern provided on a side surface of the substrate having the wiring pattern. In a method for manufacturing a liquid crystal display device, which comprises a connecting means for electrically connecting wiring patterns formed on both surfaces of a substrate, the substrate and spacers whose outer circumference is the same as or slightly smaller than the substrate are alternately formed. A step of stacking a plurality of sheets to form a laminated body, and a step of dropping a thermosetting conductive adhesive in a line shape in the laminating direction of the laminated body and attaching the thermosetting conductive adhesive to the side surface of the substrate. And a step of removing the substrate from the laminate, heat-curing the thermosetting conductive adhesive to form the connecting means on the side surface of the substrate, and manufacturing the liquid crystal display device. Method. 3. A pair of substrates having electrodes and holding a liquid crystal composition, wiring patterns formed on both surfaces of at least one substrate of the pair of substrates, and a wiring pattern provided on a side surface of the substrate having the wiring pattern. A method of manufacturing a liquid crystal display device, comprising: a connecting means for electrically connecting wiring patterns formed on both surfaces of a substrate, wherein a plurality of the substrates and spacers whose outer circumference is the same as or slightly smaller than the substrate are alternately arranged. A step of forming a laminated body by stacking sheets, and a step of arranging a conductive adhesive in a line shape in the laminating direction of the laminated body by a printing method to form the connecting means on the side surface of the substrate. A method for manufacturing a liquid crystal display device, comprising: 4. A pair of substrates having electrodes and holding a liquid crystal composition, wiring patterns formed on both surfaces of at least one of the pair of substrates, and a wiring pattern provided on a side surface of the substrate having the wiring pattern. A method of manufacturing a liquid crystal display device, comprising: a connecting means for electrically connecting wiring patterns formed on both surfaces of a substrate, wherein a plurality of the substrates and spacers whose outer circumference is the same as or slightly smaller than the substrate are alternately arranged. A step of stacking the sheets to form a laminated body, and a thermosetting conductive adhesive is arranged in a line in the laminating direction of the laminated body by a printing method, and the thermosetting conductive adhesive is attached to the side surface of the substrate. And a step of removing the substrate from the laminate and heat-curing the thermosetting conductive adhesive to form the connecting means on the side surface of the substrate. The method of production. 5. The method of manufacturing a liquid crystal display device according to claim 1, wherein the substrate further comprises a liquid crystal driving semiconductor element mounted by a face-down method. 6. The liquid crystal display device according to claim 1, wherein the outer periphery of the spacer has a cutout portion for guiding a conductive adhesive or a thermosetting conductive adhesive. Production method. 7. The liquid crystal display device according to claim 1, wherein a side surface of the substrate has a convex portion for guiding a conductive adhesive or a thermosetting conductive adhesive. Method. 8. A pair of substrates having electrodes and holding a liquid crystal composition, wiring patterns formed on both surfaces of at least one substrate of the pair of substrates, the substrate having the wiring pattern, and the outer periphery. A plurality of spacers that are the same as or slightly smaller than the substrate are alternately stacked to form a laminated body, and a conductive adhesive or a thermosetting conductive adhesive is dripped in a line shape in the laminating direction of the laminated body. A liquid crystal display device, comprising: a connection unit that electrically connects wiring patterns formed on both sides of the substrate on the side surface of the substrate. 9. The liquid crystal display device according to claim 8, further comprising a liquid crystal driving semiconductor element mounted on the substrate in a face-down manner. 10. A semiconductor device for driving a liquid crystal, which is mounted by a face-down method, is further provided on the first surface of the substrate, and a wiring pattern formed on the second surface of the substrate is non-translucent. 9. The liquid crystal display device according to claim 8, wherein the liquid crystal display device comprises a conductive member and covers the back surface of the liquid crystal driving semiconductor element. 11. The liquid crystal display device according to claim 8, further comprising a passive component mounted on the side surface of the substrate. 12. The liquid crystal display device according to claim 8, wherein the connecting means is an input terminal to the wiring pattern.