JPH09243493A - Pressure sensor module - Google Patents

Pressure sensor module

Info

Publication number
JPH09243493A
JPH09243493A JP5005296A JP5005296A JPH09243493A JP H09243493 A JPH09243493 A JP H09243493A JP 5005296 A JP5005296 A JP 5005296A JP 5005296 A JP5005296 A JP 5005296A JP H09243493 A JPH09243493 A JP H09243493A
Authority
JP
Japan
Prior art keywords
pressure sensing
housing
sensing element
connector
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5005296A
Other languages
Japanese (ja)
Inventor
Kazutaka Hayashi
和孝 林
Satoshi Nakao
悟志 中尾
Kiyoyuki Tanaka
清之 田中
Hideki Tanigami
英樹 谷上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to KR1019970707675A priority Critical patent/KR19990008150A/en
Priority to JP5005296A priority patent/JPH09243493A/en
Priority to US08/945,847 priority patent/US5932808A/en
Priority to PCT/JP1997/000717 priority patent/WO1997033146A1/en
Publication of JPH09243493A publication Critical patent/JPH09243493A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensor module which can restrain a high pressure from being applied to a connector, in which the number of components is reduced and which can be made compact. SOLUTION: A flange part 3g is installed at the base part of a connector body 3a. A coupling ring-shaped recessed part 4b is formed in a ring-shaped support 4 formed of a material which is hard to deform under a high pressure than the connector body 3a. The ring-shaped support 4 is fitted to the outside of the connector body 3a, and the flange part 3g is coupled to the coupling ring-shaped recessed part 4b. The edge 4a, on one side, of the ring-shaped support 4 is brought into contact with an insulating substrate 5a, on the pressure not-sensing side, of a pressure sensing element 5 at the outer side from the base part of the connector body 3a. The cylindrical coupling part 7g1 of a housing 1 is curled and worked so as to wrap the outer edge of the edge 4c of the ring-shaped support 4, and a housing 7 is coupled to the ring-shaped support 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、圧力センサモジュ
ールに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure sensor module.

【0002】[0002]

【従来の技術】ガス圧力検知装置等に用いる圧力センサ
モジュールとして、圧力感知素子、回路基板、コネクタ
の一部等がハウジングに収納された構造を有するものが
知られている。圧力感知素子は、静電容量形センサ素子
からなるセンサ素子である。この圧力感知素子は、少な
くとも一方が印加圧力に対して可動または可撓性を有す
る一対のセラミック板のような絶縁性基体の対向面にそ
れぞれ対向電極を配置して対向電極間の容量の変化から
圧力の変化を検出する構造を有している。コネクタは金
属製端子部材が合成樹脂製の絶縁性材料により形成され
たコネクタ本体に固定された構造を有している。特開昭
63−19527号公報に示された圧力センサモジュー
ルでは、コネクタ本体の下端にフランジ部を一体に成形
して、このフランジ部を支持環を介して圧力感知素子の
上に積層した状態でハウジングに収納し、ハウジングの
端部でコネクタ本体のフランジ部を包むようにカーリン
グ加工(かしめ加工)している。しかしながら、フラン
ジ部を形成する絶縁性材料は耐圧強度が低いため、ハウ
ジングの端部でフランジ部を包むようにカーリング加工
をしてコネクタを取付けると、圧力感知素子及び支持環
を通して継続的にフランジ部に大きな力が加わると、コ
ネクタが外れたり、コネクタが破損するおそれがある。
そこで、特開平2−190731号公報に示す圧力セン
サモジュールでは、圧力感知素子を通して合成樹脂製の
コネクタ本体に力が加わるのを防止するために金属製の
支持部材(支持基体)を圧力感知素子とコネクタとの間
に配置して両者を絶縁している。
2. Description of the Related Art As a pressure sensor module used in a gas pressure detecting device or the like, a pressure sensor module having a structure in which a pressure sensing element, a circuit board, a part of a connector, and the like are housed in a housing is known. The pressure sensing element is a sensor element composed of a capacitance type sensor element. In this pressure sensing element, at least one is provided with opposing electrodes on opposing surfaces of a pair of insulating substrates, such as a pair of ceramic plates, which are movable or flexible with respect to an applied pressure. It has a structure for detecting a change in pressure. The connector has a structure in which a metal terminal member is fixed to a connector body formed of a synthetic resin insulating material. In the pressure sensor module disclosed in JP-A-63-19527, a flange is integrally formed at the lower end of the connector body, and the flange is laminated on the pressure sensing element via a support ring. It is housed in a housing, and is subjected to curling (caulking) so that the flange of the connector body is wrapped around the end of the housing. However, since the insulating material forming the flange portion has a low pressure resistance, when the connector is mounted by curling so as to wrap the flange portion at the end of the housing, the connector is continuously attached to the flange portion through the pressure sensing element and the support ring. When a large force is applied, the connector may be disconnected or the connector may be damaged.
Therefore, in the pressure sensor module disclosed in Japanese Patent Application Laid-Open No. 2-190731, a metal supporting member (supporting base) is formed as a pressure sensing element in order to prevent a force from being applied to the synthetic resin connector body through the pressure sensing element. They are arranged between the connector and insulate them.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、金属製
の支持基体を圧力感知素子とコネクタとの間に配置する
と、支持基体の厚み分だけ全体の厚み寸法または高さ寸
法が大きくなって圧力センサモジュールのコンパクト化
を図ることができない。また支持基体が金属であると、
この支持基体を通してモジュールの外部に帯電する静電
気が支持基体を通って回路基板に入りノイズを発生した
り、最悪の場合には電子素子を破壊する。また支持基体
の加工精度、特に圧力感知素子との接触面の加工精度が
悪いと、点接触または部分接触状態となり圧力感知素子
に局部的な力が加わって圧力感知素子が破壊されるおそ
れがある。
However, when a metal support base is disposed between the pressure sensing element and the connector, the overall thickness or height is increased by the thickness of the support base, and the pressure sensor module is increased. Cannot be made compact. When the supporting base is a metal,
Static electricity charged to the outside of the module through the support base enters the circuit board through the support base and generates noise, or in the worst case, destroys the electronic element. If the processing accuracy of the supporting base, especially the processing accuracy of the contact surface with the pressure sensing element is poor, a point contact or a partial contact state is caused, and a local force is applied to the pressure sensing element, and the pressure sensing element may be broken. .

【0004】本発明の目的は、コネクタに大きな力が加
わるのを抑制することができ、しかも高さまたは厚さ方
向の寸法を小さくして、コンパクト化を図ることができ
る圧力センサモジュールを提供することにある。
An object of the present invention is to provide a pressure sensor module capable of suppressing a large force from being applied to a connector and reducing the size in the height or thickness direction to achieve compactness. It is in.

【0005】本発明の他の目的は、コネクタに大きな力
が加わるのを抑制することができ、しかも静電気が回路
基板に入るのを抑制できる圧力センサモジュールを提供
することにある。
Another object of the present invention is to provide a pressure sensor module capable of suppressing a large force from being applied to a connector and suppressing static electricity from entering a circuit board.

【0006】本発明の更に他の目的は、コネクタに大き
な力が加わるの抑制することができ、しかも圧力感知素
子に局部的な力が加わって圧力感知素子が破壊されるの
を防ぐことができる圧力センサモジュールを提供するこ
とにある。
Still another object of the present invention is to prevent a large force from being applied to the connector, and also to prevent the pressure sensing element from being destroyed due to a local force applied to the pressure sensing element. To provide a pressure sensor module.

【0007】[0007]

【課題を解決するための手段】本発明は、一対の絶縁性
基体の対向面にそれぞれ対向電極を配置して対向電極間
の容量の変化から圧力の変化を検出する圧力感知素子
と、圧力感知素子の非圧力感知側の絶縁性基体上に配置
されて圧力感知素子に電気的に接続される信号変換回路
を備えた回路基板と、一端が信号変換回路と電気的に接
続され他端に相手側コネクタの端子が接続される端子部
材及び端子部材が固定される絶縁性材料により形成され
たコネクタ本体を有するコネクタと、圧力感知素子,回
路基板及びコネクタ本体の基部を収納する収納室、収納
室と連通して圧力感知素子の圧力感知面に被測定流体を
供給する高圧力流体供給路及びコネクタ本体の基部に対
して結合される結合部を備えたハウジングとを具備し、
コネクタ本体がハウジングよりも高圧により変形しやす
い材料により形成され、コネクタ本体の基部に回路基板
を囲む基板収納凹部を形成し、基板収納凹部を囲む端面
が非圧力感知側の絶縁性基体と接触し且つ端子部材の一
端が基板収納凹部内に位置している圧力センサモジュー
ルを対象にする。本発明では、コネクタ本体よりも高圧
で変形し難い材料により形成され且つ一方の端面がコネ
クタ本体の基部よりも外側で非圧力感知側の絶縁性基体
と接触する環状支持体をコネクタ本体の基部の外側に嵌
合する。そして、コネクタ本体が非圧力感知側の絶縁性
基体から離れる方向にコネクタ本体が環状支持体から抜
け出るのを阻止する第1の係合構造をコネクタ本体の基
部と環状支持体との両者間に形成する。また、ハウジン
グには環状支持体の一方の端面を支持する支持段部を形
成し、環状支持体が支持段部から離れるのを阻止する第
2の係合構造をハウジングの結合部と環状支持体との両
者間に形成する。
SUMMARY OF THE INVENTION The present invention provides a pressure sensing element for disposing a counter electrode on each of the opposing surfaces of a pair of insulating substrates and detecting a change in pressure from a change in capacitance between the counter electrodes, and a pressure sensing element. A circuit board provided with a signal conversion circuit arranged on an insulating substrate on the non-pressure sensing side of the element and electrically connected to the pressure sensing element, and one end electrically connected to the signal conversion circuit and the other end mated. A connector having a terminal member to which the terminal of the side connector is connected and a connector body formed of an insulating material to which the terminal member is fixed, a pressure sensing element, a circuit board, and a storage chamber for storing the base portion of the connector body. A housing provided with a high pressure fluid supply path that communicates with the pressure sensing surface of the pressure sensing element and supplies a fluid to be measured to the pressure sensing surface, and a coupling portion that is coupled to the base of the connector body.
The connector body is made of a material that is more easily deformed by high pressure than the housing.The base of the connector body is provided with a board housing recess surrounding the circuit board, and the end face surrounding the board housing recess contacts the insulating base on the non-pressure sensing side. Moreover, the pressure sensor module in which one end of the terminal member is located in the substrate accommodating recess is targeted. According to the present invention, an annular support body formed of a material that is less likely to be deformed at a higher pressure than the connector body and one end surface of which is outside the base portion of the connector body and contacts the insulating base body on the non-pressure sensing side is provided on the base portion of the connector body. Fits on the outside. A first engaging structure is formed between the base of the connector body and the annular support body to prevent the connector body from coming out of the annular support body in the direction in which the connector body is separated from the non-pressure sensing side insulating base body. To do. Further, a supporting step portion for supporting one end surface of the annular support member is formed in the housing, and a second engaging structure for preventing the annular support member from separating from the supporting step portion is provided with a coupling portion of the housing and the annular support member. And both.

【0008】本発明では、コネクタを圧力感知素子に接
触させて、回路基板をコネクタの基板収納凹部で囲む構
造を維持する。そして、コネクタ本体よりも高圧で変形
し難い材料により形成した環状支持体をコネクタ本体に
嵌合し、この環状支持体とハウジングとを係合させて、
コネクタをハウジングに対して固定する。このようにす
ると、圧力感知素子に高圧が加わったときに、環状支持
体とハウジングの係合部には大きな力が加わるが、コネ
クタ本体にはそれほど大きな力が加わることはない。そ
のため、コネクタが外れたり、コネクタが高圧により破
損するのを防ぐことができる。また、金属製の支持基体
を圧力感知素子とコネクタとの間に用いない分だけ圧力
センサモジュール全体の厚み寸法または高さ寸法を小さ
くすることができる。更に、圧力感知素子の導電部や回
路基板から間隔を隔てた箇所において環状支持体は圧力
感知素子に接合するため、従来のように支持基体を通し
て静電気が回路基板に入り込む問題を解決することがで
きる。なお、圧力感知素子は、全体を支持するよりも、
外周部のみを支持するほうが、環状支持体や圧力感知素
子の加工精度のばらつきによる電気特性への悪影響が少
なく、しかも印加圧力に対しても十分に支持できること
が分った。そして、中央部を支持するよりも、外周部を
支持した方が、圧力感知素子の加工精度が低くてもよい
ことが分った。
In the present invention, the connector is brought into contact with the pressure sensing element to maintain the structure in which the circuit board is surrounded by the board receiving recess of the connector. Then, an annular support body formed of a material that is less likely to be deformed at a higher pressure than the connector body is fitted to the connector body, and the annular support body and the housing are engaged with each other,
Secure the connector to the housing. With this configuration, when a high pressure is applied to the pressure sensing element, a large force is applied to the engaging portion between the annular support and the housing, but not so much force to the connector body. Therefore, disconnection of the connector and breakage of the connector due to high pressure can be prevented. Further, the thickness dimension or height dimension of the entire pressure sensor module can be reduced by the amount that the metal supporting base is not used between the pressure sensing element and the connector. Further, since the annular support is bonded to the pressure sensing element at a location spaced from the conductive part of the pressure sensing element and the circuit board, the problem of static electricity entering the circuit board through the support base as in the related art can be solved. . It should be noted that the pressure sensing element, rather than supporting the whole,
It has been found that supporting only the outer peripheral portion has less adverse effect on electrical characteristics due to variations in processing accuracy of the annular support and the pressure sensing element, and can sufficiently support applied pressure. And it turned out that processing accuracy of the pressure sensing element may be lower when supporting the outer peripheral portion than when supporting the central portion.

【0009】圧力感知素子の一対の絶縁性基体はセラミ
ック基板により構成することができる。この一対の絶縁
性基体は、少なくとも圧力感知側の絶縁性基体が可撓性
を有している構造のものを用いればよい。
The pair of insulating bases of the pressure sensing element can be made of ceramic substrates. The pair of insulating bases may have a structure in which at least the insulating bases on the pressure sensing side have flexibility.

【0010】またコネクタ本体はPBT(ポリブチレン
テレフタレート)、PPS(ポリフェニレンサルファイ
ド)等からなる合成樹脂により形成することができる。
またハウジングはアルミ合金、鉄合金等からなる金属に
より形成することができる。コネクタ本体をこれらの材
質により形成する場合には、環状支持体はアルミ合金、
鉄合金等からなる金属により形成すればよい。
The connector body can be made of synthetic resin such as PBT (polybutylene terephthalate) or PPS (polyphenylene sulfide).
The housing can be made of a metal such as an aluminum alloy or an iron alloy. When the connector body is made of these materials, the annular support is made of aluminum alloy,
It may be formed of a metal such as an iron alloy.

【0011】また、コネクタ本体が環状支持体から抜け
出るのを阻止する第1の係合構造は適宜に構成すればよ
い。例えば、コネクタ本体の基部の外周部に外側に向か
って突出する突起部を一体に設け、環状支持体の一方の
端面側の開口部に突起部が係合するように入る係合凹部
を形成し、突起部と係合凹部との係合により第1の係合
構造を構成することができる。この突起部は環状に連続
していてもよいが、複数個放射状に突出するものであっ
てもよい。具体的な例としては、コネクタ本体の基部の
端部の外周部に外側に向かって突出する環状のフランジ
部を一体に設け、環状支持体の一方の端面側の開口部に
フランジ部が係合するように入る係合環状凹部を形成す
る。このようにすると嵌め合いだけでの係合で抜け止め
を図ることができるので、組立が容易になる。また、コ
ネクタ本体を基部と相手側コネクタが嵌合される相手コ
ネクタ嵌合部とから構成し、相手コネクタ嵌合部の外形
寸法を基部の外形寸法よりも小さく形成し、環状支持体
の他方の端面部には、相手コネクタ嵌合部の通過は許容
するが基部と相手コネクタ嵌合部との間に形成された境
界部と係合する係合部を一体に設け、境界部と係合部と
の係合により第1の係合構造が構成しても構わない。こ
のようにすれば、フランジ部を形成する必要がないた
め、コネクタの端部の外形寸法を小さくできる。そのた
め、環状支持体と圧力感知素子との接触面積を増やすこ
とができて、コネクタに加わる力を減少させることがで
きる。なお、この場合も、環状支持体にコネクタ本体を
嵌入しただけで、第1の係合構造により抜け止めを図る
ことができるので、組立が容易になる。
Further, the first engaging structure for preventing the connector body from coming out of the annular support may be appropriately constructed. For example, a protrusion protruding outward is integrally provided on the outer periphery of the base of the connector body, and an engagement recess is formed in the opening on one end face side of the annular support so that the protrusion engages. The first engagement structure can be configured by engaging the protrusion and the engagement recess. The protrusion may be continuous in an annular shape, or may be a plurality of protrusions radially. As a specific example, an annular flange portion that projects outward is integrally provided on the outer peripheral portion of the end portion of the base portion of the connector body, and the flange portion engages with the opening portion on one end surface side of the annular support body. To form an engaging annular recess. In this way, the engagement can be prevented only by the fitting, so that the assembling can be facilitated. In addition, the connector body is composed of a base portion and a mating connector fitting portion into which the mating connector is fitted, and the outer dimensions of the mating connector fitting portion are formed to be smaller than the outer dimensions of the base portion. The end surface portion is integrally provided with an engaging portion that allows passage of the mating connector fitting portion but engages with a boundary portion formed between the base portion and the mating connector fitting portion. The first engagement structure may be configured by engagement with. With this configuration, since it is not necessary to form the flange portion, the outer dimensions of the end portion of the connector can be reduced. Therefore, the contact area between the annular support and the pressure sensing element can be increased, and the force applied to the connector can be reduced. In this case as well, the connector body can be fitted into the annular support member to prevent the disengagement from occurring by the first engagement structure, so that the assembly becomes easy.

【0012】また環状支持体が支持段部から離れるのを
阻止する第2の係合構造も適宜に構成すればよい。例え
ば、次のように構成することができる。まず、圧力感知
素子が収納される感知素子収納部と、圧力感知素子収納
部に連続して設けられて環状支持体が収納される支持体
収納部とを有するようにハウジングの収納室を構成し、
感知素子収納部と支持体収納部との間に支持段部を形成
する。そして、支持体収納部に収納された環状支持体の
他方の端面を越えて延びる位置まで延長された結合部を
支持体収納部を囲む壁部に形成し、結合部を環状支持体
の他方の端面の外縁部を包むようにカーリング加工し、
カーリング加工された結合部と環状支持体の他方の端面
との係合により第2の係合構造を構成することができ
る。このようにすれば、かしめ(カーリング加工)だけ
で組み立てを完了できるので、簡単に圧力センサモジュ
ールを組み立てることができる。
Further, the second engagement structure for preventing the annular support member from separating from the support step portion may be appropriately constructed. For example, the following configuration is possible. First, the storage chamber of the housing is configured so as to have a sensing element housing portion in which the pressure sensing element is housed, and a support body housing portion which is provided continuously to the pressure sensing element housing and accommodates the annular support body. ,
A support step is formed between the sensing element housing and the support housing. Then, a connecting portion extended to a position extending beyond the other end surface of the annular support housed in the support housing portion is formed on the wall portion surrounding the support housing portion, and the connecting portion is formed on the other side of the annular support body. Curling to wrap the outer edge of the end face,
The second engagement structure can be configured by engaging the curling-processed coupling portion and the other end surface of the annular support. By doing so, the assembly can be completed only by caulking (curling), so that the pressure sensor module can be easily assembled.

【0013】また支持体収納部の内周部に雌捩子部を形
成し、環状支持体の外周部に前述の捩子部に螺合される
雄捩子部を形成し、雌捩子部と雄捩子部の螺合により第
2の係合構造を構成することもできる。このように螺合
により第2の係合構造を構成する場合は、非圧力感知側
の絶縁性基体の外周部に、圧力感知側の絶縁性基体に向
かうに従って直径寸法が大きくなる円錐面状のテーパ部
を形成し、環状支持体の内周部に、円錐面状のテーパ部
と整合するテーパ部を形成するのが好ましい。このよう
にすると、環状支持体と圧力感知素子の非圧力感知側の
絶縁性基体との接合面積が大きくなるので、圧力感知素
子への応力の集中が発生し難くなって、耐圧強度が高く
なる。即ち、接触面積が大きくなるほど、圧力感知素子
に加わる力を環状支持体で支持したときに、単位面積あ
たりに加わる力が小さくなるから、耐圧強度が高くな
る。また圧力感知素子から環状支持体に加わる力は、テ
ーパ部の傾斜面と直交する方向に作用するが、この力は
コネクタ側に向う力と環状支持体を押し広げる力に分力
される。その結果、螺合部を剪断する力(コネクタ側に
向う力)が小さくなり、螺合部の耐圧強度が大きくな
る。
Further, a female screw portion is formed on the inner peripheral portion of the support accommodating portion, and a male screw portion screwed to the screw portion is formed on the outer peripheral portion of the annular support member. The second engagement structure can also be configured by screwing the male thread portion with the male thread portion. When the second engagement structure is formed by screwing in this way, a conical surface shape whose diameter dimension increases toward the pressure sensing side insulating base body is formed on the outer peripheral portion of the non-pressure sensing side insulating base body. It is preferable to form a taper portion and to form a taper portion on the inner peripheral portion of the annular support member so as to match the conical surface taper portion. This increases the joint area between the annular support and the insulating substrate on the non-pressure sensing side of the pressure sensing element, so that stress concentration is less likely to occur on the pressure sensing element and the pressure resistance is increased. . That is, the larger the contact area, the smaller the force applied per unit area when the force applied to the pressure sensing element is supported by the annular support, and the higher the pressure resistance. Further, the force applied from the pressure sensing element to the annular support acts in a direction orthogonal to the inclined surface of the taper portion, and this force is divided into a force toward the connector side and a force to spread the annular support. As a result, the force for shearing the screwed portion (the force toward the connector side) is reduced, and the pressure resistance of the screwed portion is increased.

【0014】またコネクタの端子部材と回路基板の接続
部との接続も各種の方法で行うことができる。例えば、
回路基板の接続部を端子部材の一方の端部が嵌入される
雌形端子構造を有する形状に形成し、この雌形端子構造
と端子部材とを嵌合してコネクタの端子部材と回路基板
の接続部との接続を行ってもよい。
Further, the connection between the terminal member of the connector and the connection portion of the circuit board can be made by various methods. For example,
The connecting portion of the circuit board is formed in a shape having a female terminal structure into which one end of the terminal member is fitted, and the female terminal structure and the terminal member are fitted to each other to connect the terminal member of the connector and the circuit board. You may connect with a connection part.

【0015】[0015]

【発明の実施の形態】以下、本発明の実施の形態の一例
を図面を参照して詳細に説明する。図1は本発明の実施
の形態の一例の圧力センサモジュールの断面図である。
図1に示すように圧力センサモジュールはコネクタアセ
ンブリ1が圧力センサアセンブリ2に固定された構造を
有している。コネクタアセンブリ1はコネクタ3に環状
支持体4が係合された構造を有している。また圧力セン
サアセンブリ2は、圧力感知素子5と回路基板6とハウ
ジング7とから構成されている。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view of a pressure sensor module according to an example of an embodiment of the present invention.
As shown in FIG. 1, the pressure sensor module has a structure in which a connector assembly 1 is fixed to a pressure sensor assembly 2. The connector assembly 1 has a structure in which an annular support 4 is engaged with a connector 3. The pressure sensor assembly 2 is composed of a pressure sensing element 5, a circuit board 6 and a housing 7.

【0016】コネクタ3は、コネクタ本体3aに一対の
端子部材3b,3bがインサート成形された構造を有し
ている。コネクタ本体3aは、筒体3cと一対の端子部
材3b,3bが固定された端子部材固定部3dとから構
成されており、後述するハウンジング7の材質(アルミ
合金)よりも高圧により変形しやすいPBT(ポリブチ
レンテレフタレート)からなる合成樹脂(絶縁樹脂材
料)により一体成形されている。筒体3cの基部(ハウ
ジング7側の部分)には、回路基板6を囲む基板収納凹
部3eが形成されている。そして、コネクタ本体3a
は、基板収納凹部3eを囲む端面3fが圧力感知素子5
の非圧力感知側の面と接触している。また、筒体3cの
基部の外周部には径方向外側に向かって突出する環状の
突起部即ちフランジ部3gが一体に設けられている。一
対の端子部材3b,3bは一方の端部が回路基板6に電
気的に接続され、他方の端部が図示しない相手側コネク
タの端子に接続される。
The connector 3 has a structure in which a pair of terminal members 3b, 3b are insert-molded on a connector body 3a. The connector body 3a is composed of a tubular body 3c and a terminal member fixing portion 3d to which a pair of terminal members 3b, 3b are fixed, and is more easily deformed by high pressure than the material (aluminum alloy) of the housing 7 described later. It is integrally molded with a synthetic resin (insulating resin material) made of (polybutylene terephthalate). A board housing recess 3e that surrounds the circuit board 6 is formed in the base portion (portion on the housing 7 side) of the cylindrical body 3c. And the connector body 3a
Is an end face 3f that surrounds the substrate housing recess 3e.
Is in contact with the non-pressure sensitive side of the. In addition, an annular projection portion, that is, a flange portion 3g, that projects outward in the radial direction is integrally provided on the outer peripheral portion of the base portion of the cylindrical body 3c. One end of the pair of terminal members 3b, 3b is electrically connected to the circuit board 6, and the other end is connected to a terminal of a mating connector (not shown).

【0017】環状支持体4は、一方の端面4aがコネク
タ本体3aの基部よりも外側で圧力感知素子5と接触す
るようにコネクタ本体3aの基部の外周部を囲むように
配置されている。環状支持体4は、コネクタ本体3aの
材質(PBT)よりも高圧で変形し難いアルミ合金から
なる金属材料により形成されている。環状支持体4の端
面4a側の開口部にはコネクタ3のフランジ部3gが係
合する係合凹部(係合環状凹部)4bが形成されてい
る。この係合環状凹部4bとフランジ部3gとの嵌め合
い構造からなる係合(第1の係合構造)により、コネク
タ本体3aに環状支持体4が取付けられている。
The annular support 4 is arranged so as to surround the outer periphery of the base of the connector body 3a so that one end surface 4a contacts the pressure sensing element 5 outside the base of the connector body 3a. The annular support 4 is formed of a metal material made of an aluminum alloy that is less likely to be deformed at a higher pressure than the material (PBT) of the connector main body 3a. An engaging recess (engaging annular recess) 4b with which the flange portion 3g of the connector 3 engages is formed in the opening of the annular support 4 on the side of the end surface 4a. The annular support body 4 is attached to the connector main body 3a by the engagement (first engagement structure) having a fitting structure of the engagement annular concave portion 4b and the flange portion 3g.

【0018】圧力センサアセンブリ2の圧力感知素子5
は公知の圧力感知素子である。例えば、図2の断面図に
示すように、セラミック基板からなる非圧力感知側絶縁
性基体5aと可撓性を有するダイヤフラムを構成する圧
力感知側絶縁性基体5bとが環状のガラス層5cを介し
て封着された構造を有している。非圧力感知側絶縁性基
体5a及び圧力感知側絶縁性基体5bの対向面には、そ
れぞれ対向電極5d,5eが形成されている。これらの
対向電極5d,5eはそれぞれ図示しない導電性の接続
手段により回路基板6の回路パターンに接続されてい
る。この圧力感知素子5は、対向電極5d,5e間の容
量の変化から圧力の変化を検出する。
Pressure sensing element 5 of pressure sensor assembly 2
Is a known pressure sensing element. For example, as shown in the cross-sectional view of FIG. 2, a non-pressure sensing side insulating base body 5a made of a ceramic substrate and a pressure sensing side insulating base body 5b forming a flexible diaphragm have an annular glass layer 5c therebetween. It has a sealed structure. Opposite electrodes 5d and 5e are formed on the opposing surfaces of the non-pressure sensing insulating substrate 5a and the pressure sensing insulating substrate 5b, respectively. These opposing electrodes 5d and 5e are connected to the circuit pattern of the circuit board 6 by conductive connecting means (not shown). The pressure sensing element 5 detects a change in pressure from a change in capacitance between the counter electrodes 5d and 5e.

【0019】回路基板6は、圧力感知素子5の非圧力感
知側絶縁性基体5aの上に配置されており、回路基板即
ち絶縁性基体6aに信号変換回路6bと一対の接続部6
c,6cとを備えた構造を有している。接続部6cは、
コネクタ3の端子部材3bの一方の端部が嵌入される雌
形端子構造を有している。
The circuit board 6 is arranged on the non-pressure sensing side insulating substrate 5a of the pressure sensing element 5, and the signal converting circuit 6b and the pair of connecting portions 6 are provided on the circuit substrate or insulating substrate 6a.
c, 6c. The connecting portion 6c is
It has a female terminal structure into which one end of the terminal member 3b of the connector 3 is fitted.

【0020】ハウジング7はハウジング本体7aと高圧
力流体供給用筒体7bとが一体に成形された構造を有し
ており、このハウジング7はアルミ合金からなる金属に
より形成されている。ハウジング本体7aは、底壁部7
a1 と周壁部7a2 とを有するほぼ円筒形状をなしてお
り、内部には収納室7cが形成されている。収納室7c
は圧力感知素子5が収納される圧力感知素子収納部7d
と、該圧力感知素子収納部7dに連続して設けられて環
状支持体4、回路基板6及びコネクタ本体3aの基部を
収納する支持体収納部7eとを有している。支持体収納
部7eが圧力感知素子収納部7dよりも大径に形成され
ているため、圧力感知素子収納部7dと支持体収納部7
eとの間には、環状支持体4の一方の端面4aの外縁部
を支持する支持段部7fが形成されている。なお本実施
例では、圧力感知素子5の圧力感知側絶縁性基体5bと
圧力感知素子収納部7dの底面(底壁部7a1 )との間
にOリング8aと、該Oリング8aの外側に同心的に配
置されたバックアップリング8bとを備えている。この
バックアップリング8bはテフロン(商標)から形成さ
れている。ハウジング本体7aの底壁部7a1 の上に
は、Oリング8aとバックアップリング8bとを収納す
る環状の溝が形成されている。これらのOリング8a及
びバックアップリング8bの存在によって圧力感知側絶
縁性基体5bに圧力を作用する室が形成されている。支
持体収納部7eを囲むハウジング本体7aの周壁部7a
2 の一部を構成する壁部7gは支持体収納部7eに収納
された環状支持体4の端面4cを越えて延びる位置まで
延長されており、この延長された部分により結合部7g
1 が形成されている。結合部7g1 は、環状支持体4の
端面4cの外縁部を包むようにカーリング加工されてお
り、このカーリング加工された結合部7g1 と環状支持
体4の端面4cとの係合(第2の係合構造)によりコネ
クタアセンブリ1は圧力センサアセンブリ2に対して取
付けられる。高圧力流体供給用筒体7bはハウジング本
体7aより小さい径寸法の円筒形状を有しており、外周
部には捩子部7hが形成されている。高圧力流体供給用
筒体7bの内部には高圧力流体供給路7iが形成されて
いる。高圧力流体供給路7iは収納室7cと連通するよ
うに形成されており、圧力感知素子5の圧力感知側絶縁
性基体5bに圧力を作用させる高圧力流体からなる被測
定流体を供給する。
The housing 7 has a structure in which a housing body 7a and a high-pressure fluid supply cylinder 7b are integrally molded, and the housing 7 is made of a metal made of an aluminum alloy. The housing body 7a has a bottom wall portion 7
It has a substantially cylindrical shape having a1 and a peripheral wall portion 7a2, and a storage chamber 7c is formed inside. Storage room 7c
Is a pressure sensing element housing portion 7d in which the pressure sensing element 5 is housed.
And a support body storage portion 7e which is provided continuously with the pressure sensing element storage portion 7d and stores the annular support body 4, the circuit board 6 and the base portion of the connector body 3a. Since the support housing 7e is formed to have a larger diameter than the pressure sensing element housing 7d, the pressure sensing element housing 7d and the support housing 7 are formed.
A support step 7f that supports the outer edge of one end surface 4a of the annular support 4 is formed between the support step 7f and e. In this embodiment, an O-ring 8a is provided between the pressure sensing side insulating base 5b of the pressure sensing element 5 and the bottom surface (bottom wall 7a1) of the pressure sensing element housing 7d, and concentric with the outside of the O-ring 8a. And a backup ring 8b that is arranged in a uniform manner. The backup ring 8b is made of Teflon (trademark). An annular groove for accommodating the O-ring 8a and the backup ring 8b is formed on the bottom wall 7a1 of the housing body 7a. Due to the presence of the O-ring 8a and the backup ring 8b, a chamber for applying pressure to the pressure sensing side insulating base 5b is formed. Peripheral wall portion 7a of the housing body 7a surrounding the support housing portion 7e
The wall portion 7g forming a part of 2 is extended to a position extending beyond the end surface 4c of the annular support 4 housed in the support body housing portion 7e, and the joint portion 7g is extended by this extended portion.
1 is formed. The joint portion 7g1 is curled so as to wrap the outer edge of the end face 4c of the annular support 4, and the engagement between the curled joint portion 7g1 and the end face 4c of the annular support 4 (second engagement) The structure) attaches the connector assembly 1 to the pressure sensor assembly 2. The high-pressure fluid supply cylinder 7b has a cylindrical shape with a diameter smaller than that of the housing body 7a, and a screw portion 7h is formed on the outer peripheral portion. A high-pressure fluid supply passage 7i is formed inside the high-pressure fluid supply cylinder 7b. The high-pressure fluid supply path 7i is formed so as to communicate with the storage chamber 7c, and supplies a fluid to be measured consisting of a high-pressure fluid that applies pressure to the pressure-sensing-side insulating base 5b of the pressure sensing element 5.

【0021】本発明では、コネクタ本体3aよりも高圧
で変形し難い材料により形成した環状支持体4をコネク
タ本体3aに第1の係合構造により係合して抜け止めを
図り、環状支持体4とハウジング7とを第2の係合構造
により係合してコネクタ3のハウジング7への取付けを
行っているため、高圧力流体供給路7iを通る高圧力流
体により圧力感知素子5に高圧が加わると、環状支持体
4に圧力が伝わり、環状支持体4の端面4cとハウジン
グ7の結合部7g1 で最終的にその力を受ける。コネク
タ本体3aに伝わる力も同様にして端面4cと結合部7
g1 で受けることになり、環状支持体4とコネクタ本体
3aとの係合部にはそれほど大きな力が加わることはな
い。そのため、従来のように、コネクタ3が外れたり、
コネクタ3が高圧により破損するのを防ぐことができ
る。この例では、金属製の支持基体をコネクタ3と圧力
感知素子5との間に配置しない分だけ圧力センサモジュ
ール全体の厚み寸法または高さ寸法を小さくすることが
できる。しかもコネクタ本体3aの基部で回路基板6の
周囲を囲むため、環状支持体4を通して静電気が回路基
板6に入ることがない。また環状支持体4は圧力感知素
子5の外縁部と接触し、圧力感知素子5の中央部とは接
触しないので、圧力感知素子5にそりがあっても、圧力
感知素子5に局部に集中的に力が加わることがない。そ
のため、圧力感知素子5の特に非圧力感知側絶縁性基体
5aの加工精度が多少悪くても圧力感知素子5が破損す
るのを防止できる。
In the present invention, the annular support 4 is made of a material that is less likely to be deformed at a higher pressure than the connector body 3a, and is engaged with the connector body 3a by the first engagement structure to prevent the annular support 4 from coming off. Since the housing 3 and the housing 7 are engaged with each other by the second engagement structure to attach the connector 3 to the housing 7, high pressure is applied to the pressure sensing element 5 by the high pressure fluid passing through the high pressure fluid supply passage 7i. Then, the pressure is transmitted to the annular support 4, and the end face 4c of the annular support 4 and the connecting portion 7g1 of the housing 7 finally receive the force. Similarly, the force transmitted to the connector body 3a is also applied to the end face 4c and the connecting portion 7.
Since it is received by g1, no great force is applied to the engaging portion between the annular support 4 and the connector body 3a. Therefore, as in the conventional case, the connector 3 may come off,
It is possible to prevent the connector 3 from being damaged by high pressure. In this example, the thickness dimension or height dimension of the entire pressure sensor module can be reduced by the amount that the metal supporting base is not arranged between the connector 3 and the pressure sensing element 5. Moreover, since the circuit board 6 is surrounded by the base of the connector body 3a, static electricity does not enter the circuit board 6 through the annular support 4. Further, since the annular support 4 contacts the outer edge portion of the pressure sensing element 5 and does not contact the central portion of the pressure sensing element 5, even if the pressure sensing element 5 has a warp, the pressure sensing element 5 is locally concentrated. Power is not applied to. Therefore, it is possible to prevent the pressure sensing element 5 from being damaged even if the processing precision of the pressure sensing element 5, especially the non-pressure sensing side insulating substrate 5a is somewhat poor.

【0022】本実施例では、圧力センサモジュールを次
のようにして組み立てた。まず図3の分解断面図に示す
ように、環状支持体4の係合環状凹部4bにコネクタ3
のフランジ部3gを係合するようにコネクタ本体3aに
環状支持体4を嵌合してコネクタアセンブリ1を作る。
次に図3の矢印Aに示す方向にコネクタアセンブリ1を
圧力センサアセンブリ2のハウジング7内に収納する。
これにより、環状支持体4の一方の端面4a及びコネク
タ本体3aの基部の端面3fを圧力感知素子5の非圧力
感知側絶縁性基体5aに当接すると共に回路基板6の一
対の接続部6c,6cとコネクタ3の一対の端子部材3
b,3bとを嵌合する。次にハウジング7の結合部7g
1 を、環状支持体4の他方の端面4cの外縁部を包むよ
うに矢印Bに示す方向にかしめ加工即ちカーリング加工
して、コネクタアセンブリ1を圧力センサアセンブリ2
に固定して組み立てを完了する。
In this example, the pressure sensor module was assembled as follows. First, as shown in the exploded cross-sectional view of FIG. 3, the connector 3 is inserted into the engaging annular recess 4 b of the annular support 4.
The annular support 4 is fitted into the connector body 3a so as to engage the flange portion 3g of the connector assembly 1 to make the connector assembly 1.
Next, the connector assembly 1 is housed in the housing 7 of the pressure sensor assembly 2 in the direction shown by the arrow A in FIG.
As a result, one end surface 4a of the annular support 4 and the end surface 3f of the base portion of the connector body 3a are brought into contact with the non-pressure sensing side insulating base body 5a of the pressure sensing element 5 and the pair of connection portions 6c, 6c of the circuit board 6 are provided. And a pair of terminal members 3 of the connector 3
b and 3b are fitted together. Next, the connecting portion 7g of the housing 7
1 is swaged or curled in the direction shown by arrow B so as to wrap the outer edge of the other end surface 4c of the annular support 4, and the connector assembly 1 is attached to the pressure sensor assembly 2
Fix to and complete the assembly.

【0023】図4は本発明の圧力センサモジュールの他
の実施の形態を示す断面図である。この実施の形態が図
1〜3に示した例と異なるのは、螺合により第2の係合
構造(環状支持体14とハウジング17との係合構造)
を構成している点であり、その他の点は前の例とほぼ同
じである。したがって、図1〜3の例と同様の部分には
図1〜3に付した符号に10を加えた数の符号を付して
説明を省略する。本実施例では、ハウジング17の支持
体収納部17e(周壁部17a2 )の内周部に雌捩子部
17jを形成し、環状支持体14の外周部に雄捩子部1
4eを形成し、雌捩子部17jと雄捩子部14eとの螺
合により第2の係合構造を構成して、コネクタアセンブ
リ11を圧力センサアセンブリ12に取付けている。環
状支持体14の内周部には、コネクタ13のフランジ部
13gを係合する係合環状凹部14bが形成され、また
この凹部14bと連続してテーパ部14dが形成されて
いる。このテーパ部14dは、端面14aに向うにした
がって径寸法が大きくなるような頭部をカットした円錐
面形状を有している。また圧力感知素子15の非圧力感
知側絶縁性基体15aの外周部には、圧力感知側絶縁性
基体15bに向かうに従って直径寸法が大きくなる円錐
面状のテーパ部15hが形成されている。環状支持体1
4のテーパ部14dと圧力感知素子15のテーパ部15
hとを整合させて接触させると、環状支持体14と圧力
感知素子15との接触面積が大きくなるので、圧力感知
素子15に発生する応力を緩和することができる。即
ち、接触面積が大きくなるほど、圧力感知素子15に加
わる力を環状支持体14で支持したときに、単位面積あ
たりに加わる力が小さくなるから、耐圧強度が高くな
る。また圧力感知素子15から環状支持体14に加わる
力は、テーパ部の傾斜面と直交する方向に作用するが、
この力はコネクタ13側に向う力と環状支持体14を押
し広げる力に分力される。その結果、螺合部を剪断する
力(コネクタ13側に向う力)が小さくなり、螺合部の
耐圧強度が大きくなる。
FIG. 4 is a sectional view showing another embodiment of the pressure sensor module of the present invention. This embodiment differs from the example shown in FIGS. 1 to 3 in that a second engagement structure (engagement structure between the annular support 14 and the housing 17) is formed by screwing.
The other points are almost the same as the previous example. Therefore, the same parts as those in the example of FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. In this embodiment, a female screw portion 17j is formed on the inner peripheral portion of the support accommodating portion 17e (peripheral wall portion 17a2) of the housing 17, and a male screw portion 1 is formed on the outer peripheral portion of the annular support 14.
4e is formed, and the female screw portion 17j and the male screw portion 14e are screwed together to form a second engagement structure, and the connector assembly 11 is attached to the pressure sensor assembly 12. An engagement annular recess 14b that engages the flange 13g of the connector 13 is formed on the inner peripheral portion of the annular support 14, and a tapered portion 14d is formed continuously with the recess 14b. The tapered portion 14d has a conical surface shape in which the head is cut so that the diameter dimension increases toward the end surface 14a. Further, on the outer peripheral portion of the non-pressure sensing side insulating base 15a of the pressure sensing element 15, there is formed a conical taper portion 15h whose diameter dimension increases toward the pressure sensing side insulating base 15b. Annular support 1
4d and the taper portion 15 of the pressure sensing element 15
When h is aligned and brought into contact with each other, the contact area between the annular support 14 and the pressure sensing element 15 increases, so that the stress generated in the pressure sensing element 15 can be relaxed. That is, the larger the contact area, the smaller the force applied per unit area when the force applied to the pressure sensing element 15 is supported by the annular support 14, and the higher the pressure resistance. Further, the force applied from the pressure sensing element 15 to the annular support 14 acts in the direction orthogonal to the inclined surface of the tapered portion,
This force is divided into a force toward the connector 13 side and a force to spread the annular support 14. As a result, the force for shearing the threaded portion (the force toward the connector 13 side) is reduced, and the pressure resistance of the threaded portion is increased.

【0024】図5は本発明の圧力センサモジュールの更
に他の実施の形態を示す断面図である。この実施の形態
が図1〜3に示した例と異なるのは、第1の係合構造
(コネクタ本体23aと環状支持体24との係合構造)
の構成であり、その他の点は前の例とほぼ同じである。
したがって、図1〜3の例と同様の部分には図1〜3に
付した符号に20を加えた数の符号を付して説明を省略
する。本実施例ではコネクタ本体23aの相手側コネク
タが嵌合される部分(相手コネクタ嵌合部)23hの外
形寸法を基部23iの外形寸法よりも小さく形成し、環
状支持体24の他方の端面部には、相手コネクタ嵌合部
23hの通過は許容するが基部23iと相手コネクタ嵌
合部23hとの間に形成された境界部23jと係合する
係合部24dを一体に設けている。本実施例では、第1
の係合構造により抜け止めを図るように、環状支持体2
4にコネクタ本体23aを嵌入して、コネクタ23に環
状支持体24を取付けた。この実施例では、フランジ部
を形成する必要がないため、コネクタ23の端部の外形
寸法を小さくできる。そのため、環状支持体24と圧力
感知素子25との接触面積を増やすことができて、コネ
クタ23に加わる力を減少させることができる。
FIG. 5 is a sectional view showing still another embodiment of the pressure sensor module of the present invention. This embodiment differs from the example shown in FIGS. 1 to 3 in the first engagement structure (the engagement structure between the connector body 23a and the annular support 24).
Other configurations are almost the same as the previous example.
Therefore, the same parts as those in the example of FIGS. 1 to 3 are denoted by the same reference numerals as those in FIGS. In the present embodiment, the outer dimension of a portion (mate connector fitting portion) 23h of the connector body 23a into which the mating connector is fitted is formed smaller than the outer dimension of the base portion 23i, and the other end surface portion of the annular support 24 is formed. Is integrally provided with an engaging portion 24d that allows passage of the mating connector fitting portion 23h but engages with a boundary portion 23j formed between the base portion 23i and the mating connector fitting portion 23h. In the present embodiment, the first
The ring-shaped support 2
The connector main body 23 a was fitted into the connector 4 and the annular support 24 was attached to the connector 23. In this embodiment, since it is not necessary to form the flange portion, the outer dimension of the end portion of the connector 23 can be reduced. Therefore, the contact area between the annular support 24 and the pressure sensing element 25 can be increased, and the force applied to the connector 23 can be reduced.

【0025】以下本願明細書に記載した複数の発明のう
ち、いくつかの発明についてその構成要件を記載する。
The constituent features of some of the inventions described in this specification will be described below.

【0026】(1) 一方が測定圧力に対して可撓性を
有する一対の絶縁性基体5a,5bを備え、該一対の絶
縁性基体の対向面にそれぞれ対向電極5d,5eを配置
して前記対向電極間の容量の変化から圧力の変化を検出
する圧力感知素子5と、前記圧力感知素子5の可撓性を
持たない非圧力感知側の絶縁性基体5a上に配置されて
前記圧力感知素子5に電気的に接続される信号変換回路
6bを備えた回路基板6と、一端が前記信号変換回路6
bと電気的に接続され他端に相手側コネクタの端子が接
続される端子部材3b及び前記端子部材3bが固定され
る絶縁性材料により形成されたコネクタ本体3aを有す
るコネクタ3と、前記圧力感知素子5,前記回路基板6
及び前記コネクタ本体3aの基部を収納する収納室7
c、前記収納室7cと連通して前記圧力感知素子5の可
撓性を有する圧力感知面に被測定流体を供給する高圧力
流体供給路7i及び前記コネクタ本体3aの前記基部に
対して結合される結合部7g1 を備えたハウジング7と
を具備し、前記コネクタ本体3aが前記ハウジング7よ
りも高圧により変形しやすい材料により形成され、前記
コネクタ本体3aの前記基部には前記回路基板6を囲む
基板収納凹部3eが形成され、前記基板収納凹部3eを
囲む端面3fが前記非圧力感知側の絶縁性基体5aと接
触し且つ前記端子部材3bの前記一端が前記基板収納凹
部3e内に位置している圧力センサモジュールであっ
て、前記コネクタ本体3aよりも高圧で変形し難い材料
により形成され且つ一方の端面が前記コネクタ本体3a
の前記基部よりも同心円上の外側で前記非圧力感知側の
絶縁性基体5aと接触する環状支持体4が前記コネクタ
本体3aの前記基部の外側に嵌合され、前記コネクタ本
体3aの前記基部と前記環状支持体4とは、前記コネク
タ本体3aが前記非圧力感知側の絶縁性基体5aから離
れる方向に前記コネクタ本体3aが前記環状支持体4か
ら抜け出るのを阻止する第1の係合構造を両者間に形成
するように構成され、前記ハウジング7には前記環状支
持体4の前記一方の端面を支持する支持段部7fが形成
され、前記ハウジング7の前記結合部7g1 と前記環状
支持体4とは、前記環状支持体4が前記支持段部7fか
ら離れるのを阻止する第2の係合構造7g,4cを両者
間に形成するように構成されていることを特徴とする圧
力センサモジュール。
(1) One is provided with a pair of insulating bases 5a, 5b, one of which is flexible with respect to the measured pressure, and the counter electrodes 5d, 5e are arranged on the facing surfaces of the pair of insulating bases, respectively. A pressure sensing element 5 for detecting a change in pressure from a change in capacitance between the opposing electrodes, and the pressure sensing element disposed on the non-pressure sensing side insulating substrate 5a having no flexibility of the pressure sensing element 5. 5, a circuit board 6 provided with a signal conversion circuit 6b electrically connected to the terminal 5, and one end of the signal conversion circuit 6
a connector 3 having a terminal member 3b electrically connected to b and a terminal of a mating connector connected to the other end, and a connector body 3a formed of an insulating material to which the terminal member 3b is fixed; Element 5, the circuit board 6
And a storage chamber 7 for storing the base of the connector body 3a
c, the high pressure fluid supply path 7i for communicating the fluid to be measured to the flexible pressure sensing surface of the pressure sensing element 5 in communication with the storage chamber 7c, and the base of the connector body 3a. A housing 7 having a coupling portion 7g1 for connecting the circuit board 6 to the connector body 3a. The connector body 3a is formed of a material that is more easily deformed by high pressure than the housing 7, and the base of the connector body 3a surrounds the circuit board 6. A storage recess 3e is formed, an end surface 3f surrounding the substrate storage recess 3e is in contact with the non-pressure sensing side insulating substrate 5a, and the one end of the terminal member 3b is located in the substrate storage recess 3e. In the pressure sensor module, the connector body 3a is made of a material that is less likely to be deformed at a higher pressure than the connector body 3a, and one end surface of the connector body 3a
An annular support 4 which is in contact with the insulating base 5a on the non-pressure sensing side outside the base of the connector main body 3a is fitted on the outside of the base of the connector main body 3a. The annular support 4 is a first engagement structure that prevents the connector main body 3a from coming out of the annular support 4 in a direction in which the connector main body 3a moves away from the non-pressure sensing side insulating base 5a. The housing 7 is formed with a support step 7f for supporting the one end face of the annular support 4, and the housing 7 is formed between the connecting portion 7g1 of the housing 7 and the annular support 4. The pressure sensor module is characterized in that second annular engaging structures 7g and 4c for preventing the annular support 4 from separating from the support step 7f are formed between the two. .

【0027】(2) 前記コネクタ本体3aの前記基部
の端部の外周部には外側に向かって突出する突起部3g
が一体に設けられ、前記環状支持体4の前記一方の端面
4a側の開口部には前記突起部3gが係合するように入
る係合凹部4bが形成され、前記突起部3gと前記係合
凹部4bとの係合により前記第1の係合構造が構成され
ている上記(1)に記載の圧力センサモジュール。
(2) A protruding portion 3g protruding outward is provided on the outer peripheral portion of the end portion of the base portion of the connector body 3a.
Is integrally provided, and an engaging recess 4b into which the protrusion 3g is engaged is formed in an opening portion of the annular support 4 on the side of the one end surface 4a, and the protrusion 3g and the engagement are formed. The pressure sensor module according to (1) above, wherein the first engagement structure is configured by engagement with the recess 4b.

【0028】[0028]

【発明の効果】本発明によれば、コネクタを圧力感知素
子に接触させて、回路基板をコネクタで囲む構造を維持
し、コネクタ本体よりも高圧で変形し難い材料により形
成した環状支持体をコネクタ本体に係合し、この環状支
持体とハウジングとを係合させてコネクタをハウジング
に対して固定するため、圧力感知素子に高圧が加わった
ときには、環状支持体とハウジングとの係合部に大きな
力は加わるが、コネクタ本体にはそれほど大きな力が加
わることがない。そのため、コネクタが外れたり、コネ
クタが高圧により破損するのを防ぐことができる。ま
た、金属製の支持基体を圧力感知素子とコネクタとの間
に配置しない分だけ圧力センサモジュール全体の厚み寸
法または高さ寸法を小さくすることができる。また金属
製の支持基体が回路基板の下に存在しないため、従来の
ように支持基体を通して静電気が回路基板に入ることが
ない。また環状支持体は圧力感知素子と全体的に接触す
ることがないため、圧力感知素子にそりがあるような場
合でも局部的な力が加わることがなく、圧力感知素子が
破損するのを防止できる。
According to the present invention, the connector is brought into contact with the pressure sensing element to maintain the structure in which the circuit board is surrounded by the connector, and the annular support formed of a material that is less likely to be deformed at a higher pressure than the connector main body is used. Since the connector is fixed to the housing by engaging the main body and the annular support and the housing, when the high pressure is applied to the pressure sensing element, the engagement portion between the annular support and the housing is large. Although the force is applied, the connector body is not so strongly applied. Therefore, disconnection of the connector and breakage of the connector due to high pressure can be prevented. Further, the thickness dimension or height dimension of the entire pressure sensor module can be reduced by the amount that the metal supporting base is not arranged between the pressure sensing element and the connector. Further, since the metal supporting base is not present under the circuit board, static electricity does not enter the circuit board through the supporting base unlike the conventional case. Further, since the annular support does not come into contact with the pressure sensing element as a whole, even if there is a warp in the pressure sensing element, no local force is applied and damage to the pressure sensing element can be prevented. .

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施の形態の一例の圧力センサモジ
ュールの断面図である。
FIG. 1 is a sectional view of a pressure sensor module according to an example of an embodiment of the present invention.

【図2】 本発明の実施の形態の一例の圧力センサモジ
ュールに用いる圧力感知素子の断面図である。
FIG. 2 is a cross-sectional view of a pressure sensing element used in the pressure sensor module according to the exemplary embodiment of the present invention.

【図3】 本発明の実施の形態の一例の圧力センサモジ
ュールの分解断面図である。
FIG. 3 is an exploded cross-sectional view of a pressure sensor module according to an example of an embodiment of the present invention.

【図4】 本発明の圧力センサモジュールの他の実施の
形態を示す断面図である。
FIG. 4 is a sectional view showing another embodiment of the pressure sensor module of the present invention.

【図5】 本発明の圧力センサモジュールの更に他の実
施の形態を示す断面図である。
FIG. 5 is a cross-sectional view showing still another embodiment of the pressure sensor module of the present invention.

【符号の説明】 3 コネクタ 3a コネクタ本体 3b 端子部材 3e 基板収納凹部 3f 端面 3g 突起部(フランジ部) 4 環状支持体 4a 端面 4b 係合凹部(係合環状凹部) 5 圧力感知素子 5a 非圧力感知側絶縁性基体 5b 圧力感知側絶縁性基体 5d,5e 対向電極 6 回路基板 6a 絶縁性基体 6b 信号変換回路 6c 接続部 7 ハウジング 7c 収納室 7d 感知素子収納部 7e 支持体収納部 7f 支持段部 7g1 結合部 7i 高圧力流体供給路[Explanation of Codes] 3 Connector 3a Connector Main Body 3b Terminal Member 3e Substrate Storage Recess 3f End Face 3g Projection (Flange) 4 Annular Support 4a End Face 4b Engagement Recess (Engaging Recess) 5 Pressure Sensing Element 5a Non-Pressure Sensing Side insulating substrate 5b Pressure sensing side insulating substrate 5d, 5e Counter electrode 6 Circuit board 6a Insulating substrate 6b Signal conversion circuit 6c Connection portion 7 Housing 7c Storage chamber 7d Sensing element storage portion 7e Support storage portion 7f Support step portion 7g1 Coupling part 7i High pressure fluid supply path

───────────────────────────────────────────────────── フロントページの続き (72)発明者 谷上 英樹 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Hideki Tanigami 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 一対の絶縁性基体の対向面にそれぞれ対
向電極を配置して前記対向電極間の容量の変化から圧力
の変化を検出する圧力感知素子と、 前記圧力感知素子の非圧力感知側の絶縁性基体上に配置
されて前記圧力感知素子に電気的に接続される信号変換
回路を備えた回路基板と、 一端が前記信号変換回路と電気的に接続され他端に相手
側コネクタの端子が接続される端子部材及び前記端子部
材が固定される絶縁性材料により形成されたコネクタ本
体を有するコネクタと、 前記圧力感知素子,前記回路基板及び前記コネクタ本体
の基部を収納する収納室、前記収納室と連通して前記圧
力感知素子の圧力感知面に被測定流体を供給する高圧力
流体供給路及び前記コネクタ本体の前記基部に対して結
合される結合部を備えたハウジングとを具備し、 前記コネクタ本体が前記ハウジングよりも高圧により変
形しやすい材料により形成され、前記コネクタ本体の前
記基部には前記回路基板を囲む基板収納凹部が形成さ
れ、前記基板収納凹部を囲む端面が前記非圧力感知側の
絶縁性基体と接触し且つ前記端子部材の前記一端が前記
基板収納凹部内に位置している圧力センサモジュールで
あって、 前記コネクタ本体よりも高圧で変形し難い材料により形
成され且つ一方の端面が前記コネクタ本体の前記基部よ
りも外側で前記非圧力感知側の絶縁性基体と接触する環
状支持体が前記コネクタ本体の前記基部の外側に嵌合さ
れ、 前記コネクタ本体の前記基部と前記環状支持体とは、前
記コネクタ本体が前記非圧力感知側の絶縁性基体から離
れる方向に前記コネクタ本体が前記環状支持体から抜け
出るのを阻止する第1の係合構造を両者間に形成するよ
うに構成され、 前記ハウジングには前記環状支持体の前記一方の端面を
支持する支持段部が形成され、 前記ハウジングの前記結合部と前記環状支持体とは、前
記環状支持体が前記支持段部から離れるのを阻止する第
2の係合構造を両者間に形成するように構成されている
ことを特徴とする圧力センサモジュール。
1. A pressure sensing element for disposing a counter electrode on each of the opposing surfaces of a pair of insulating substrates to detect a change in pressure from a change in capacitance between the counter electrodes, and a non-pressure sensing side of the pressure sensing element. A circuit board provided with a signal conversion circuit arranged on the insulating base body and electrically connected to the pressure sensing element; and one end electrically connected to the signal conversion circuit and the other end having a terminal of a mating connector. A connector having a terminal member to which is connected and a connector body formed of an insulating material to which the terminal member is fixed; a storage chamber for storing the pressure sensing element, the circuit board, and a base portion of the connector body; A high pressure fluid supply path communicating with the chamber for supplying a fluid to be measured to the pressure sensing surface of the pressure sensing element, and a housing having a coupling portion coupled to the base portion of the connector body. The connector body is formed of a material that is more easily deformed by a high pressure than the housing, a board housing recess that surrounds the circuit board is formed in the base portion of the connector body, and an end surface that surrounds the board housing recess is formed. A pressure sensor module, which is in contact with an insulating base on the non-pressure sensing side and has the one end of the terminal member located in the substrate accommodating recess, the pressure sensor module being formed of a material that is less likely to be deformed at a higher pressure than the connector body. An annular support, one end surface of which is in contact with the non-pressure sensing side insulating base outside the base of the connector main body, is fitted outside the base of the connector main body, and the base of the connector main body. And the annular support, the connector body is removed from the annular support in a direction in which the connector body moves away from the non-pressure sensing side insulating substrate. The housing is formed with a first engagement structure that prevents the first engagement structure from coming out, and a supporting step portion that supports the one end surface of the annular support body is formed in the housing. Portion and the annular support body are configured to form a second engagement structure between the annular support body and the annular support body to prevent the annular support body from separating from the support step portion. .
【請求項2】 前記コネクタ本体の前記基部の端部の外
周部には外側に向かって突出する突起部が一体に設けら
れ、前記環状支持体の前記一方の端面側の開口部には前
記突起部が係合するように入る係合凹部が形成され、前
記突起部と前記係合凹部との係合により前記第1の係合
構造が構成されている請求項1に記載の圧力センサモジ
ュール。
2. A projecting portion projecting outward is integrally provided on an outer peripheral portion of an end portion of the base portion of the connector body, and the projecting portion is formed in an opening portion on the one end face side of the annular support body. The pressure sensor module according to claim 1, wherein an engagement recess is formed so that the parts engage with each other, and the first engagement structure is configured by engagement between the protrusion and the engagement recess.
【請求項3】 前記コネクタ本体は前記基部と前記相手
側コネクタが嵌合される相手コネクタ嵌合部とからな
り、 前記相手コネクタ嵌合部は外形寸法が前記基部の外形寸
法よりも小さく形成され、 前記環状支持体の他方の端面部には、前記相手コネクタ
嵌合部の通過は許容するが前記基部と前記相手コネクタ
嵌合部との間に形成された境界部と係合する係合部が一
体に設けられ、 前記境界部と前記係合部との係合により前記第1の係合
構造が構成されていることを特徴とする請求項1に記載
の圧力センサモジュール。
3. The connector main body comprises the base portion and a mating connector fitting portion into which the mating connector is fitted, and the mating connector fitting portion is formed so that an outer dimension thereof is smaller than an outer dimension of the base portion. An engaging portion that allows passage of the mating connector fitting portion, but engages with a boundary portion formed between the base portion and the mating connector fitting portion, on the other end surface portion of the annular support. The pressure sensor module according to claim 1, wherein the first engagement structure is formed by engaging the boundary portion and the engagement portion.
【請求項4】 前記ハウジングの前記収納室は、前記圧
力感知素子が収納される感知素子収納部と、前記圧力感
知素子収納部に連続して設けられて前記環状支持体が収
納される支持体収納部とを有し、 前記感知素子収納部と前記支持体収納部との間に前記支
持段部が形成され、 前記支持体収納部を囲む壁部が前記支持体収納部に収納
された前記環状支持体の他方の端面を越えて延びる位置
まで延長されて前記結合部が構成され、 前記結合部が前記環状支持体の他方の端面の外周部を包
むようにカーリング加工され、 前記カーリング加工された前記結合部と前記環状支持体
の前記他方の端面との係合により前記第2の係合構造が
構成されている請求項1または2に記載の圧力センサモ
ジュール。
4. The sensing chamber of the housing is provided with a sensing element housing portion for housing the pressure sensing element, and a support body continuously provided to the pressure sensing element housing portion for housing the annular support body. A storage part, the support step part is formed between the sensing element storage part and the support storage part, and a wall part surrounding the support storage part is stored in the support storage part. The coupling portion is configured to extend to a position extending beyond the other end surface of the annular support, and the coupling portion is curled so as to wrap the outer peripheral portion of the other end surface of the annular support, and the curling is performed. The pressure sensor module according to claim 1 or 2, wherein the second engagement structure is configured by engagement of the coupling portion and the other end surface of the annular support.
【請求項5】 前記ハウジングの前記収納室は、前記圧
力感知素子が収納される感知素子収納部と、前記圧力感
知素子収納部に連続して設けられて前記環状支持体の一
部が収納される支持体収納部とを有し、 前記感知素子収納部と前記支持体収納部との間に前記支
持段部が形成され、 前記支持体収納部の内周部に雌捩子部が形成されて前記
結合部か構成され、 前記環状支持体の前記一部の外周部に前記雌捩子部に螺
合される雄捩子部が形成され、 前記雌捩子部と前記雄捩子部の螺合により前記第2の係
合構造が構成されている請求項1または2に記載の圧力
センサモジュール。
5. The housing chamber of the housing houses a sensing element housing part for housing the pressure sensing element, and a part of the annular support housed continuously from the pressure sensing element housing part. A support accommodating portion, the support step is formed between the sensing element accommodating portion and the support accommodating portion, and a female screw portion is formed on an inner peripheral portion of the support accommodating portion. The connecting portion, and a male screw portion screwed into the female screw portion is formed on an outer peripheral portion of the part of the annular support, and the female screw portion and the male screw portion are The pressure sensor module according to claim 1, wherein the second engagement structure is configured by screwing.
【請求項6】 前記非圧力感知側の絶縁性基体の外周部
には、圧力感知側の絶縁性基体に向かうに従って直径寸
法が大きくなる円錐面状のテーパ部が形成され、 前記環状支持体の内周部には、前記円錐面状のテーパ部
と整合するテーパ部を有している請求項5に記載の圧力
センサモジュール。
6. A conical taper portion whose diameter dimension increases toward the pressure sensing side insulating base is formed on the outer peripheral portion of the non-pressure sensing side insulating base, The pressure sensor module according to claim 5, wherein the inner peripheral portion has a taper portion that matches the conical taper portion.
【請求項7】前記回路基板の前記端子部材と電気的に接
続される接続部は、前記端子部材の前記一方の端部が嵌
入される雌形端子構造を有している請求項1に記載の圧
力センサモジュール。
7. The connecting portion electrically connected to the terminal member of the circuit board has a female terminal structure into which the one end of the terminal member is fitted. Pressure sensor module.
【請求項8】 対向するように配置された一対のセラミ
ック基体の対向面にそれぞれ対向電極を配置して前記対
向電極間の容量の変化から圧力の変化を検出する圧力感
知素子と、 前記圧力感知素子の非圧力感知側のセラミック基体上に
配置されて前記圧力感知素子に電気的に接続される信号
変換回路を備えた回路基板と、 一端が前記信号変換回路と電気的に接続され他端に相手
側コネクタの端子が接続される端子部材及び前記端子部
材が固定される絶縁樹脂材料により形成されたコネクタ
本体を有するコネクタと、 前記圧力感知素子,前記回路基板及び前記コネクタ本体
の基部を収納する収納室、前記収納室と連通して前記圧
力感知素子の圧力感知面に圧力を作用させる被測定流体
を供給する高圧力流体供給路及び前記コネクタ本体の前
記基部に対して結合される結合部を備えた金属製のハウ
ジングとを具備し、 前記コネクタ本体の前記基部には前記回路基板を囲む基
板収納凹部が形成され、前記基板収納凹部を囲む端面が
前記非圧力感知側のセラミック基体と接触し且つ前記端
子部材の前記一端が前記基板収納凹部内に位置している
圧力センサモジュールであって、 一方の端面が前記コネクタ本体の前記基部よりも外側で
前記非圧力感知側のセラミック基体と接触する環状支持
体が前記コネクタ本体の前記基部の外側に嵌合され、 前記コネクタ本体の前記基部の端部の外周部には外側に
向かって突出する環状のフランジ部が一体に設けられ、
前記環状支持体の前記一方の端面側の開口部には前記フ
ランジ部が係合するように入る係合環状凹部が形成さ
れ、 前記ハウジングの前記収納室は、前記圧力感知素子が収
納される感知素子収納部と、前記圧力感知素子収納部に
連続して設けられて前記環状支持体が収納される支持体
収納部とを有し、 前記感知素子収納部と前記支持体収納部との間に前記環
状支持体の前記一方の端面の外縁部と接触して前記環状
支持体を支持する支持段部が形成され、 前記ハウジングの前記支持体収納部を囲む壁部が前記支
持体収納部に収納された前記環状支持体の他方の端面を
越えて延びる位置まで延長されて前記結合部が構成さ
れ、 前記結合部が前記環状支持体の前記他方の端面の外縁部
を包むようにカーリング加工されていることを特徴とす
る圧力センサモジュール。
8. A pressure sensing element for disposing a counter electrode on each of the facing surfaces of a pair of ceramic bases arranged so as to face each other and detecting a change in pressure from a change in capacitance between the counter electrodes, and the pressure sensing device. A circuit board having a signal conversion circuit arranged on the ceramic substrate on the non-pressure sensing side of the element and electrically connected to the pressure sensing element; one end electrically connected to the signal conversion circuit and the other end A connector having a terminal member to which a terminal of a mating connector is connected and a connector body formed of an insulating resin material to which the terminal member is fixed, the pressure sensing element, the circuit board, and the base portion of the connector body are housed. A storage chamber, a high-pressure fluid supply path that communicates with the storage chamber and supplies a fluid to be measured that exerts a pressure on a pressure sensing surface of the pressure sensing element, and the base of the connector body. A housing made of metal having a coupling portion coupled to a portion, a board housing recess for surrounding the circuit board is formed in the base of the connector body, and an end surface surrounding the board housing recess is A pressure sensor module which is in contact with a ceramic base on the non-pressure sensing side and has the one end of the terminal member located in the substrate accommodating recess, wherein one end face is outside the base portion of the connector body. An annular support body, which is in contact with the ceramic base on the non-pressure sensing side, is fitted to the outside of the base portion of the connector body, and an annular flange projecting outward is provided on the outer peripheral portion of the end portion of the base portion of the connector body. Part is provided integrally,
An engagement annular recess is formed in the opening on the one end face side of the annular support body so that the flange portion engages, and the storage chamber of the housing is configured to detect the pressure sensing element. An element housing portion and a support housing portion that is provided continuously to the pressure sensing element housing portion and accommodates the annular support body, and is provided between the sensing element housing portion and the support body housing portion. A support step portion is formed to contact the outer edge portion of the one end surface of the annular support body to support the annular support body, and a wall portion surrounding the support body storage portion of the housing is stored in the support body storage portion. The coupling portion is formed by extending to a position extending beyond the other end surface of the annular support body, and the coupling portion is curled so as to wrap the outer edge portion of the other end surface of the annular support body. It is characterized by Sensor module.
【請求項9】 対向するように配置された一対のセラミ
ック基体の対向面にそれぞれ対向電極を配置して前記対
向電極間の容量の変化から圧力の変化を検出する圧力感
知素子と、 前記圧力感知素子の非圧力感知側のセラミック基体上に
配置されて前記圧力感知素子に電気的に接続される信号
変換回路を備えた回路基板と、 一端が前記信号変換回路と電気的に接続され他端に相手
側コネクタの端子が接続される端子部材及び前記端子部
材が固定される絶縁樹脂材料により形成されたコネクタ
本体を有するコネクタと、 前記圧力感知素子,前記回路基板及び前記コネクタ本体
の基部を収納する収納室、前記収納室と連通して前記圧
力感知素子の圧力感知面に圧力を作用させる被測定流体
を供給する高圧力流体供給路及び前記コネクタ本体の前
記基部に対して結合される結合部を備えた金属製のハウ
ジングとを具備し、 前記コネクタ本体の前記基部には前記回路基板を囲む基
板収納凹部が形成され、前記基板収納凹部を囲む端面が
前記非圧力感知側のセラミック基体と接触し且つ前記端
子部材の前記一端が前記基板収納凹部内に位置している
圧力センサモジュールであって、 一方の端面が前記コネクタ本体の前記基部よりも外側で
前記非圧力感知側のセラミック基体と接触する環状支持
体が前記コネクタ本体の前記基部の外側に嵌合され、 前記コネクタ本体は前記基部と前記相手側コネクタが嵌
合される相手コネクタ嵌合部とからなり、 前記相手コネクタ嵌合部は外形寸法が前記基部の外形寸
法よりも小さく形成され、 前記環状支持体の他方の端面部には、前記相手コネクタ
嵌合部の通過は許容するが前記基部と前記相手コネクタ
嵌合部との間に形成された境界部と係合する係合部が一
体に設けられ、 前記ハウジングの前記収納室は、前記圧力感知素子が収
納される感知素子収納部と、前記圧力感知素子収納部に
連続して設けられて前記環状支持体が収納される支持体
収納部とを有し、 前記感知素子収納部と前記支持体収納部との間に前記環
状支持体の前記一方の端面の外縁部と接触して前記環状
支持体を支持する支持段部が形成され、 前記ハウジングの前記支持体収納部を囲む壁部が前記支
持体収納部に収納された前記環状支持体の他方の端面を
越えて延びる位置まで延長されて前記結合部が構成さ
れ、 前記結合部が前記環状支持体の前記他方の端面の外周部
を包むようにカーリング加工されていることを特徴とす
る圧力センサモジュール。
9. A pressure sensing element for detecting a change in pressure from a change in capacitance between the opposite electrodes by disposing opposite electrodes on opposite surfaces of a pair of ceramic bases arranged so as to face each other. A circuit board having a signal conversion circuit arranged on the ceramic substrate on the non-pressure sensing side of the element and electrically connected to the pressure sensing element; one end electrically connected to the signal conversion circuit and the other end A connector having a terminal member to which a terminal of a mating connector is connected and a connector body formed of an insulating resin material to which the terminal member is fixed, the pressure sensing element, the circuit board, and the base portion of the connector body are housed. A storage chamber, a high-pressure fluid supply path that communicates with the storage chamber and supplies a fluid to be measured that exerts a pressure on a pressure sensing surface of the pressure sensing element, and the base of the connector body. A housing made of metal having a coupling portion coupled to a portion, a board housing recess for surrounding the circuit board is formed in the base of the connector body, and an end surface surrounding the board housing recess is A pressure sensor module which is in contact with a ceramic base on the non-pressure sensing side and has the one end of the terminal member located in the substrate accommodating recess, wherein one end face is outside the base portion of the connector body. An annular support body that contacts the ceramic base on the non-pressure sensing side is fitted to the outside of the base portion of the connector body, and the connector body is composed of the base portion and a mating connector fitting portion to which the mating connector is fitted. The outer dimensions of the mating connector fitting portion are smaller than the outer dimensions of the base portion, and the other end face portion of the annular support is provided with the mating connector fitting portion. The pressure sensing element is accommodated in the accommodation chamber of the housing, which is integrally provided with an engagement portion that engages with a boundary portion formed between the base portion and the mating connector fitting portion. A sensing element housing portion, and a support housing portion that is provided continuously with the pressure sensing element housing portion and houses the annular support, the sensing element housing portion and the support body housing portion. A support step portion that supports the annular support member by contacting with an outer edge portion of the one end surface of the annular support member is formed between, and a wall portion that surrounds the support accommodating portion of the housing stores the support member. Curled so that the connecting portion is extended to a position extending beyond the other end surface of the annular support housed in the portion, and the connecting portion wraps the outer peripheral portion of the other end surface of the annular support. Pressure characterized by being Sensor module.
【請求項10】 対向するように配置された一対のセラ
ミック基体の対向面にそれぞれ対向電極を配置して前記
対向電極間の容量の変化から圧力の変化を検出する圧力
感知素子と、 前記圧力感知素子の非圧力感知側のセラミック基体上に
配置されて前記圧力感知素子に電気的に接続される信号
変換回路を備えた回路基板と、 一端が前記信号変換回路と電気的に接続され他端に相手
側コネクタの端子が接続される端子部材及び前記端子部
材が固定される絶縁樹脂材料により形成されたコネクタ
本体を有するコネクタと、 前記圧力感知素子,前記回路基板及び前記コネクタ本体
の基部を収納する収納室、前記収納室と連通して前記圧
力感知素子の圧力感知面に圧力を作用させる被測定流体
を供給する高圧力流体供給路及び前記コネクタ本体の前
記基部に対して結合される結合部を備えた金属製のハウ
ジングとを具備し、 前記コネクタ本体の前記基部には前記回路基板を囲む基
板収納凹部が形成され、前記基板収納凹部を囲む端面が
前記非圧力感知側のセラミック基体と接触し且つ前記端
子部材の前記一端が前記基板収納凹部内に位置している
圧力センサモジュールであって、 一方の端面が前記コネクタ本体の前記基部よりも外側で
前記非圧力感知側のセラミック基体と接触する環状支持
体が前記コネクタ本体の前記基部の外側に嵌合され、 前記コネクタ本体の前記基部の端部の外周部には外側に
向かって突出する環状のフランジ部が一体に設けられ、
前記環状支持体の前記一方の端面側の開口部には前記フ
ランジ部が係合するように入る係合環状凹部が形成さ
れ、 前記ハウジングの前記収納室は、前記圧力感知素子が収
納される感知素子収納部と、前記圧力感知素子収納部に
連続して設けられて前記環状支持体が収納される支持体
収納部とを有し、 前記感知素子収納部と前記支持体収納部との間に前記環
状支持体の前記一方の端面の外縁部と接触して前記環状
支持体を支持する支持段部が形成され、 前記支持体収納部の内周部に雌捩子部が形成されて前記
結合部が構成され、 前記環状支持体の前記一部の外周部に前記雌捩子部に螺
合される雄捩子部が形成されていることを特徴とする圧
力センサモジュール。
10. A pressure sensing element for disposing a counter electrode on each of the facing surfaces of a pair of ceramic bases arranged so as to face each other and detecting a change in pressure from a change in capacitance between the counter electrodes, and the pressure sensing device. A circuit board having a signal conversion circuit arranged on the ceramic substrate on the non-pressure sensing side of the element and electrically connected to the pressure sensing element; one end electrically connected to the signal conversion circuit and the other end A connector having a terminal member to which a terminal of a mating connector is connected and a connector body formed of an insulating resin material to which the terminal member is fixed, the pressure sensing element, the circuit board, and the base portion of the connector body are housed. The housing chamber, the high-pressure fluid supply path that communicates with the housing chamber and supplies the fluid to be measured for exerting a pressure on the pressure sensing surface of the pressure sensing element, and the connector body. A metal housing having a coupling portion coupled to a base portion, wherein the base portion of the connector body is provided with a board housing recess that surrounds the circuit board, and an end face that surrounds the board housing recess is A pressure sensor module which is in contact with a ceramic base on the non-pressure sensing side and has the one end of the terminal member located in the substrate accommodating recess, wherein one end face is outside the base portion of the connector body. An annular support body, which is in contact with the ceramic base on the non-pressure sensing side, is fitted to the outside of the base portion of the connector body, and an annular flange projecting outward is provided on the outer peripheral portion of the end portion of the base portion of the connector body. Part is provided integrally,
An engagement annular recess is formed in the opening on the one end face side of the annular support body so that the flange portion engages, and the storage chamber of the housing is configured to detect the pressure sensing element. An element housing portion and a support housing portion that is provided continuously to the pressure sensing element housing portion and accommodates the annular support body, and is provided between the sensing element housing portion and the support body housing portion. A support step is formed to contact the outer edge of the one end surface of the annular support to support the annular support, and a female screw thread is formed on the inner periphery of the support housing to form the connection. And a male screw portion screwed to the female screw portion is formed on the outer peripheral portion of the part of the annular support body.
JP5005296A 1996-03-07 1996-03-07 Pressure sensor module Withdrawn JPH09243493A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019970707675A KR19990008150A (en) 1996-03-07 1996-03-07 Pressure sensor module
JP5005296A JPH09243493A (en) 1996-03-07 1996-03-07 Pressure sensor module
US08/945,847 US5932808A (en) 1996-03-07 1997-03-07 Pressure sensor module having dual insulating substrates on the pressure sensing and non-pressure sensing sides
PCT/JP1997/000717 WO1997033146A1 (en) 1996-03-07 1997-03-07 Pressure sensor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5005296A JPH09243493A (en) 1996-03-07 1996-03-07 Pressure sensor module

Publications (1)

Publication Number Publication Date
JPH09243493A true JPH09243493A (en) 1997-09-19

Family

ID=12848234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5005296A Withdrawn JPH09243493A (en) 1996-03-07 1996-03-07 Pressure sensor module

Country Status (1)

Country Link
JP (1) JPH09243493A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012088192A (en) * 2010-10-20 2012-05-10 Denso Corp Sensor device and its manufacturing method
KR102127255B1 (en) * 2019-03-18 2020-06-29 세종공업 주식회사 Connector assembly for sensor of vehicle

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012088192A (en) * 2010-10-20 2012-05-10 Denso Corp Sensor device and its manufacturing method
KR102127255B1 (en) * 2019-03-18 2020-06-29 세종공업 주식회사 Connector assembly for sensor of vehicle

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