JPH09239929A - Polyamide film laminate and packing body for air containing boil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a polyamide laminate and a packing body air containing boil consisting of the laminate of good adhesiveness between a polyamide film and a sealant layer even during a moisture period and heat treatment such as an air containing boil finish. SOLUTION: The polyamide laminate is of a type having an adhesive-modified layer, an adhesive layer, and a sealant layer formed successively on at least one surface of a polyamide base material film, wherein at least one of the longitudinally directional stress when stretched by 75% in the longitudinal direction or the laterally directional stress when stretched by 75% in the lateral direction is 2.8×10<7> Pa or lower.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide film laminate and a package comprising the laminate, and more specifically, it is a severe treatment such as a boiling water treatment or a retort treatment, and particularly an extremely severe treatment. The present invention relates to a polyamide film laminate capable of withstanding air boiling treatment and a package for air-containing boiling made of the laminate.

[0002]

2. Description of the Related Art Biaxially stretched polyamide films are excellent in toughness, pinhole resistance, bending resistance, heat resistance and the like and are widely used for various purposes. When using such a polyamide film as a packaging bag, generally,
If necessary, printing is performed on at least one side, and an adhesive layer is provided thereon. Then, a polyamide film film laminate in which a sealant layer made of polyethylene, polypropylene or the like is provided on the adhesive layer by a dry laminating method or an extrusion laminating method is manufactured.
Then, this laminated body is formed into a bag by a known method, the contents are filled through the opening, and then the opening is heat-sealed. Such a packaging bag is used, for example, for packaging seasonings such as miso and soy sauce, water-containing foods such as soups and retort foods, or medicines.

In recent years, there has been an increasing demand for genuine products due to the improvement of food culture, and the switching of dry noodle type to raw noodle type is progressing even for instant noodle foods.

[0004] Such raw noodle type instant food is generally subjected to heat sterilization treatment after the raw noodles are hermetically packaged. Since this heat sterilization treatment is carried out by a boiling boil treatment, air and water vapor inside the sealed body are expanded by heating and a large stress is applied to the sealing portion of the packaging bag. In addition, in recent years, in order to meet the high demand for taste,
The temperature conditions of this air-containing boil treatment tend to become more severe. Therefore, there is a demand for a packaging material having sufficient water-resistant adhesiveness that can withstand the increase in internal pressure caused by the air-containing boiling treatment.

Conventionally, it has been known to provide a polyamide film with an adhesion-modifying layer obtained by crosslinking a polyester resin with polyisocyanate in order to improve the water-resistant adhesion of the packaging material using the polyamide film. However, although the laminate of the polyamide film having such an adhesion modifying layer certainly improves the resistance to air-containing boil puncture,
There is a problem in that the characteristics do not reach a level that sufficiently satisfies the market demand, and the water-resistant adhesion is not sufficiently improved by the time it can withstand the above-mentioned air-containing boiling treatment.

[0006]

DISCLOSURE OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and more specifically, the adhesiveness between the polyamide base film and the sealant layer is the same as in wet and air-containing boil treatment. It is an object of the present invention to provide a polyamide film laminate and a package for air-containing boiling, which is good even during various heat treatments.

[0007]

A first aspect of the present invention is a polyamide film laminate having an adhesion modifying layer, an adhesive layer, and a sealant layer on at least one side of a polyamide base film, 90 degreeC of this laminated body
In hot water, at least one of the longitudinal stress when stretched by 75% in the longitudinal direction or the lateral stress when stretched by 75% in the lateral direction is 2.8 × 10 ⁷ Pa or less. .

A second aspect of the present invention is a polyamide film laminate having an adhesion modifying layer, a printing ink layer, an adhesive layer, and a sealant layer on at least one side of a polyamide substrate film, the laminate comprising: At least one of the longitudinal stress when the body is stretched 75% in the longitudinal direction or the lateral stress when the body is stretched 75% in the transverse direction in hot water of 90 ° C. is 2.8 × 10 ^7. Pa or less.

A third aspect of the present invention is a package for an air-containing boil containing a water-containing food in a packaging bag,
The packaging bag is obtained by heat-sealing the polyamide film laminate. The above objects are solved by the first to third inventions.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A polyamide film laminate having a polyamide base film, an adhesion modifying layer, an adhesive layer and a sealant layer, which is the first invention of the present invention,
From the standpoint of improving heat-resistant water adhesion, especially air-containing boil puncture resistance, which is a harsh condition, longitudinal stress when stretched 75% in the longitudinal direction in hot water at 90 ° C (hereinafter, longitudinal direction) 2.) or at least one lateral stress (hereinafter abbreviated as lateral stretching stress) when stretched by 75% in the lateral direction is 2.8 × 10 ⁹ Pa or less, preferably 2.
It is 6 × 10 ⁷ Pa or less.

The polyamide base film used in the present invention is a film containing a polyamide resin as a main component.
As such a polyamide resin, a polyamide resin obtained by polycondensation of lactams having three or more membered rings, a polyamide resin obtained by polycondensation of ω-amino acid, a polyamide resin obtained by polycondensation of dibasic acid and diamine Is mentioned. More specifically, examples of lactams having 3 or more membered rings include ε-caprolactam, enanthlactam, capryllactam, lauryllactam and the like. Examples of ω-amino acids include 6-aminocaproic acid, 7-aminoheptanoic acid, 9-aminononanoic acid, 11
-Amino undecanoic acid and the like. Examples of dibasic acids are adipic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecadioic acid, hexadecadioic acid, eicosandioic acid, eicosadiendioic acid, 2 , 2,4-trimethyladipic acid, terephthalic acid, isophthalic acid, 2,
6-naphthalenedicarboxylic acid, xylylenedicarboxylic acid and the like can be mentioned. Examples of diamines include ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, pentamethylenediamine, undecamethylenediamine, 2,2,4 (or 2,4,4) -trimethylhexamethylenediamine, cyclohexane. Examples thereof include diamine, bis- (4,4′-aminocyclohexyl) methane, and metaxylylenediamine. Examples of polymers obtained by polycondensation of these or copolymers thereof include nylon 6, nylon 7, nylon 11, nylon 12, nylon 6.6, nylon 6.9, nylon 6.11, nylon 6. 12,
Nylon 6T, Nylon 6I, Nylon MXD6, Nylon 6 / 6.6, Nylon 6/12, Nylon 6/6
T, and nylon 6/61, nylon 6 / MXD6. In particular, it is preferable to use nylon 6 or a blend system of nylon 6 and a nylon elastomer.

Further, the polyamide-based film is a variety of additives such as antioxidants, light stabilizers, anti-gelling agents, lubricants, anti-blocking agents, pigments, antistatic agents, and surfactants, as long as the purpose is not impaired. Of at least one of

The polyamide substrate film used in the present invention may be a monolayer film or a multilayer film obtained by coextrusion or the like.

Optimizing the stretching conditions, relaxation rate, and heat setting temperature at the time of molding the polyamide base film used for obtaining a polyamide film laminate satisfying the above-mentioned longitudinal or transverse stretching stress. It is one of the major factors. Such a polyamide substrate film is molded as follows.

First, an unstretched film is formed by a known film forming method such as a T-die method and an inflation method, using the above polyamide resin and, if necessary, the above additives. This unstretched film may be molded into a uniaxially stretched polyamide film obtained by roll-stretching (longitudinal stretching) a continuous sheet of the unstretched film in the longitudinal direction, if necessary. Further, the biaxially stretched polyamide film may be formed by tenter stretching (transverse stretching) in the width direction.

In such a method for producing a polyamide substrate film, in the longitudinal stretching step, the unstretched film can be stretched by using two or more rolls having different peripheral speeds. As the heating means at this time, a method using a heating roll, a method of performing non-contact heating, or a method of using them in combination can be used.

Thus, the polyamide base film used in the present invention is molded. The obtained polyamide substrate film is preferably 15 μm or more and 50 μm or less,
More preferably, it has a thickness of 20 μm or more and 30 μm or less.

Next, an adhesion modifying layer is laminated on the polyamide base film. This adhesion modifying layer contains the following adhesion modifying resin.

The adhesion-modifying resin is not particularly limited as long as it has water-resistant adhesion, and conventionally known synthetic resins can be appropriately selected. Examples of such an adhesion-modifying resin include those obtained by crosslinking a polyester resin with a crosslinking agent such as a polyfunctional isocyanate, oxazoline, melamine, and an epoxy compound silane compound, or an acrylic resin, a polyurethane resin, and a polyester resin. Examples thereof include an acrylic graft polymer with a polyurethane resin, and those crosslinked with the crosslinking agent.

Further, the adhesion modifying layer may contain additives such as an antistatic agent, an inorganic lubricant and an organic lubricant within the range not impairing the object of the present invention.

The adhesion modifying resin is applied to at least one surface of the polyamide base film to form an adhesion modifying layer. As a method for laminating the adhesion modifying layer on such a polyamide substrate film, a usual coating method such as a gravure method, a reverse method, a die method, a bar method, a dip method can be used.

The coating amount of the adhesion modifying resin is not particularly limited,
Preferably, the solid content of the polyamide base film is 1 m.
Per ² 0.01 g to 1 g, more preferably 0.02
It is g or more and 0.5 g or less. The amount of the adhesion-modifying resin used can be appropriately selected depending on its type.

After applying the adhesion-modifying resin to the polyamide-based film, the resulting film is dried. The temperature used in the drying step after coating is preferably 150 ° C.
That is all. Next, heat setting is performed at 200 ° C. or higher. This improves the adhesiveness between the adhesion modifying layer and the polyamide base film.

Alternatively, after applying the adhesion-modifying resin to the polyamide-based film, the resulting film may be dried and optionally uniaxially or biaxially stretched. In the drying step at this time, it is preferable to control the water content of the polyamide base film in the range of 0.1% to 2% so as not to impair the stretchability of the film in the subsequent stretching step.

In the first aspect of the present invention, an adhesive layer is further provided on the adhesion modifying layer. Since the elongation stress in the machine direction or the transverse direction is affected by the hardness of the adhesive used, it is preferable to use a soft type adhesive. As the adhesive used for this adhesive layer, when a sealant layer described later is provided on the adhesive layer by extrusion lamination, a one-component or two-component isocyanate adhesive is preferably used. An example of the one-pack type isocyanate adhesive is a reaction product of diisocyanate and a polyhydric alcohol, and examples thereof include polyurethane having an NCO group at the terminal or polyurethane prepolymer having an NCO group at the terminal. An example of a two-pack type isocyanate adhesive is an adhesive in which polyisocyanate is mixed with a polyester polyol or a polyurethane prepolymer having an OH group at the end just before use.

When a sealant layer described below is provided on the adhesive layer by dry lamination, examples of the adhesive used for this adhesive layer include vinyl resins, acrylic resins, polyamide resins, and epoxy resins. In addition to a one-pack type adhesive such as urethane resin, a two-pack type polyurethane adhesive in which a polyisocyanate and a polyol are mixed immediately before use can be given. In particular, it is preferable to use a two-component polyurethane adhesive in which polyisocyanate and polyol are mixed immediately before use.

The adhesive layer is formed by applying a solution or emulsion containing the above-mentioned adhesive on the above-mentioned adhesion-modified layer according to a conventional method. The thickness of the adhesive layer can be reduced within a range that does not impair the adhesive performance in order to set the extension stress of the polyamide film laminate within the above range. The preferable thickness of the adhesive layer is 1 μm to 3.5 μm.

In the first aspect of the present invention, a sealant layer is provided on the adhesive layer. Examples of the material of the sealant layer used in the present invention include synthetic resins such as LDPE (low density polyethylene), EVA (ethylene-vinyl acetate copolymer), ionomer and PP (polypropylene). The sealant layer is provided by extrusion laminating or dry laminating on the adhesive layer according to a conventional method. The thickness of the sealant layer is preferably 20 μ from the viewpoint of satisfying the sealing property.
It can be from m to 80 μm.

The second invention of the present invention, which is also a polyamide film laminate having an adhesion-modifying layer, a printing ink layer, an adhesive layer, and a sealant layer on at least one side of a polyamide substrate film in this order is also resistant. From the viewpoint of improving the air boil puncture property, it has the same tensile stress in the longitudinal direction or the transverse direction as above in hot water of 90 ° C.

The materials used for the polyamide base film and the adhesion-modifying layer contained in this polyamide film laminate and the method for sequentially laminating them are the same as above.

Examples of the component constituting the printing ink layer include an ink mainly containing a cellulose derivative as a binder, or a gravure ink containing a synthetic resin such as vinyl chloride, polyester or polyurethane as a binder. Alternatively, when the produced polyamide film laminate is required to have boiling water resistance, components constituting this printing ink layer include vinyl chloride, polyester, polyether, polyol, etc. having a functional group such as a hydroxyl group at the terminal. An ink containing a curing agent such as isocyanate may be used as the ink contained as the binder. The printing ink layer may be printed on the entire surface or a part of the adhesion modifying layer, or may be printed by any known method as an arbitrary pattern.

After the printing ink layer is printed on the adhesion modifying layer, the same adhesive layer and sealant layer as described above are successively laminated in the same manner as described above.

In this way, the polyamide film laminate of the present invention is manufactured.

A third invention of the present invention, a package for an air-containing boil containing a water-containing food in a packaging bag, is manufactured as follows.

First, the above polyamide film laminate is
A known method is used to cut into an arbitrary size, and the laminate is heat-sealed to form a packaging bag such as a three-sided bag having an opening. Next, this packaging bag is filled with water-containing food such as raw noodles, soy sauce, miso, soup, sauce, and seasonings, medicines, etc. through the opening, and the opening is heat-sealed using a known method. Thus, a package for air-containing boiling is manufactured.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments. Parts in the examples represent parts by weight, and% means% by weight. Each measurement item followed the following method.

(1) Elongational stress in hot water The laminated polyamide film was placed in hot water at 90 ° C. in a tensile tester at a pulling speed of 100 mm / min and a longitudinal direction of 7 mm.
Longitudinal stress when stretched by 5%, and lateral 7
The lateral stress when stretched by 5% was measured.

(2) Aerated boil puncture resistance From a polyamide film laminate, internal dimensions 13 cm × 13 c
m three-sided bag was made into a bag, and 200 cc of water and 200 cc of air were filled in each bag and heat-sealed. Boil the heat-sealed three-sided bag at 99 ° C for 60 minutes,
The burst rate at the heat-sealed portion was calculated as follows.

[0039]

[Equation 1]

Example 1 (Production of Polyamide Substrate Film) A blend consisting of 98 parts of polycaproamide resin and 2 parts of polyamide elastomer resin was heated and melted at 260 ° C. using a screw type extruder, and T-die After further extruding, it was cooled by a cooling drum to obtain an unstretched film. This unstretched film
A longitudinal stretching of 3.1 times was performed at 0 ° C. to form a polyamide base film.

(Preparation of Adhesion Modifying Resin Coating Solution) Stirrer,
In a reactor equipped with a thermometer, a reflux device, and a constant amount dropping device, 75 parts of an acrylic graft polyester resin having the composition shown in Table 1, 56 parts of methyl ethyl ketone and 19 parts of isopropyl alcohol were put, and heated at 65 ° C. and stirred. The polyester resin was dissolved.

[0042]

[Table 1]

After the polyester resin was completely dissolved, a mixture of 17.5 parts of methacrylic acid and 7.5 parts of ethyl acrylate, and a solution of 1.2 parts of azobisdimethylvaleronitrile dissolved in 25 parts of methyl ethyl ketone were added. 0.2
It was added dropwise to the reactor at ml / min, and stirring was continued for another 2 hours. After sampling for analysis (5 g) from this reaction solution, 300 parts of water and 25 parts of triethylamine were added to the reaction solution, and the mixture was further stirred for 1 hour. Then, the temperature of this reaction solution was raised to 100 ° C., and methyl ethyl ketone, isopropyl alcohol, and excess triethylamine were distilled off by distillation. The resulting graft polymer was a white water dispersion having an average particle size of 300 nm and had a B type viscosity at 25 ° C. of 50 cps. Then, the copolymerized polyester portion of the solid content of this aqueous dispersion was hydrolyzed, and the molecular weight of the graft portion was measured by GPC. The weight average molecular weight was 10,000. Finally,
An aqueous dispersion of the graft polymer was added to give a solid content concentration of 20.
The coating liquid of the adhesion-modifying resin was prepared by diluting with water so as to become 10%.

(Preparation of Polyamide Film Laminate) On one surface of the obtained polyamide substrate film, the coating solution of the adhesion-modifying resin was applied by a gravure method so that the coating amount was 4 g / m ² . Then, the polyamide substrate film coated with this adhesion-modifying resin was dried. The moisture content of the obtained polyamide substrate film was 1%. Next, this film was transversely stretched 4 times at 120 ° C., then relaxed by 6% in the transverse direction and heat set at 215 ° C.
A laminate comprising a polyamide base film having a thickness of μm and an adhesion-modified layer was obtained.

Furthermore, an aromatic / aliphatic copolymerized polyester polyol having a Tg of -16 ° C. as a main component, and a cross-linking agent as a cross-linking agent are formed on the adhesion-modified layer of the laminate composed of the polyamide base film and the adhesion-modified layer. Using a polyester polyurethane adhesive containing hexamethylene diisocyanate trimer, an unstretched polypropylene film having a thickness of 40 μm (Pyrene P1503 manufactured by Toyobo Co., Ltd.) as a sealant layer was dry laminated by a conventional method. Thus, a polyamide film laminate was manufactured. Table 2 shows the evaluation results of the obtained polyamide film laminate.

<Comparative Example 1> A longitudinal stretching ratio at the time of molding a polyamide substrate film was 3.2 times, and a relaxation rate in the lateral direction after lamination of an adhesion modifying layer was 3%, and heat setting was performed at 210 ° C. A polyamide film laminate was obtained in the same manner as in Example 1 except that the steps were performed. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 2 A polyamide film laminate was obtained in the same manner as in Example 1 except that the acrylic graft polyester resin coating solution was not applied as the adhesion modifying layer. Table 2 shows the evaluation results of the obtained polyamide film laminate.

<Example 2> Gravure ink (Lamiace 61 white two-liquid type manufactured by Toyo Ink Co., Ltd.) was gravure-printed on the entire surface of the adhesion-modified layer made of an acrylic graft polyester resin to form a printing ink layer. On the printing ink layer, a polyester polyurethane-based adhesive containing an aromatic / aliphatic copolymerized polyester polyol having a Tg of −16 ° C. as a main component and a hexamethylene diisocyanate trimer as a cross-linking agent, is used as a sealant. A polyamide film laminate was obtained in the same manner as in Example 1 except that an unstretched polypropylene film having a thickness of 40 μm (Pyrene P1503 manufactured by Toyobo Co., Ltd.) was dry laminated as a layer by a conventional method. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 3 Example 2 was repeated except that the polyamide base film molding conditions described in Comparative Example 1 were used.
A polyamide film laminate was obtained in the same manner as. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Example 3 A polyamide substrate film was molded in the same manner as in Example 1.

Then, a linear polyester resin (Vylon 300 manufactured by Toyobo Co., Ltd.) and polyisocyanate (Coronate L manufactured by Nippon Polyurethane Co.) were used in a solid content ratio of 10.
Mixed at 0: 100, diluted with ethyl acetate to a solid content concentration of 4%, and amorphous silica (Silicia 310 manufactured by Fuji Silysia Chemical Ltd.) for the purpose of preventing blocking and imparting lubricity.
Was added so that the solid content ratio was 0.5% to obtain a mixed solution. This mixed solution was applied to one surface of the above polyamide substrate film by a gravure method, dried and then aged at 40 ° C. for 2 days to form an adhesion-modified layer. The coating amount of the polyester resin in the adhesion-modified layer was 0.15 g / m ² in the dried state.

Further, as in Example 1, an adhesive layer was provided on the adhesion-modified layer to form a sealant layer, to produce a polyamide film laminate. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 4 Example 3 was repeated except that the polyamide base film molding conditions described in Comparative Example 1 were used.
A polyamide film laminate was obtained in the same manner as. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Example 4 Instead of the acrylic graft polyester resin used in Example 1, a water dispersion type polyurethane resin (Hydran HW-manufactured by Dainippon Ink and Chemicals, Inc.) was used.
140) and methylol melanin (Beckamine PM-N manufactured by Dainippon Ink and Chemicals, Inc.) at a solid content ratio of 100: 20.
A polyamide film laminate was obtained in the same manner as in Example 1, except that the polyamide film laminate was used. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 5 Example 3 was repeated except that the molding conditions for the polyamide substrate film described in Comparative Example 1 were used.
A polyamide film laminate was obtained in the same manner as. Table 2 shows the evaluation results of the obtained polyamide film laminate.

<Example 5> Instead of the acrylic graft polyester resin used in Example 1, a water dispersion type polyester resin (Vylonal MD19 manufactured by Toyobo Co., Ltd.) was used.
30) and blocked isocyanate (Daiichi Kogyo Yakuhin Co., Ltd.)
Elastron BN11) manufactured by the company, the solid content ratio of 10
A polyamide film laminate was obtained in the same manner as in Example 1 except that the polyamide film laminate was used at 0:43. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 6 Example 5 was repeated except that the molding conditions for the polyamide base film described in Comparative Example 1 were used.
A polyamide film laminate was obtained in the same manner as. Table 2 shows the evaluation results of the obtained polyamide film laminate.

<Example 6> The longitudinal stretching ratio at the time of molding the polyamide substrate film was 3.2 times, the lateral stretching ratio after the adhesion reforming layer was laminated was 3.2 times, and heat setting was performed at 220 ° C. A polyamide film laminate was obtained in the same manner as in Example 1 except that the steps were performed. Table 2 shows the evaluation results of the obtained polyamide film laminate.

Comparative Example 7 A polyamide film laminate was obtained in the same manner as in Example 1 except that the acrylic graft polyester resin coating solution was not applied as the adhesion modifying layer. Table 2 shows the evaluation results of the obtained polyamide film laminate.

[0060]

[Table 2]

As shown in Table 2, the polyamide film laminates of Examples 1 to 6 had a low rupture rate and were excellent in resistance to air-containing boil puncture.

[0062]

EFFECTS OF THE INVENTION According to the present invention, a polyamide film laminate having good adhesion to a sealant layer and having sufficient water resistance can be obtained. A packaging bag produced using this polyamide laminate is, for example, miso, seasonings such as soy sauce, soups, water-containing foods such as retort foods, or in addition to being used for packaging medicines It can be suitably used for packaging raw noodle type instant foods and the like that require the heat sterilization treatment.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical display location B29K 77:00 B29L 9:00 (72) Inventor Chikao Morishige 2-chome Katata, Otsu City, Shiga Prefecture No. Toyobo Co., Ltd. Research Institute (72) Inventor Tsutomu Isaka 2-8 Dojimahama, Kita-ku, Osaka-shi, Osaka Toyobo Co., Ltd.

Claims (3)

[Claims] 1. A polyamide film laminate comprising a polyamide base film, which has an adhesion-modifying layer, an adhesive layer, and a sealant layer on at least one side of the polyamide base film, and the laminate is vertically heated in hot water at 90 ° C. A polyamide film laminate in which at least one of the longitudinal stress when stretched by 75% in the direction and the lateral stress when stretched by 75% in the transverse direction is 2.8 × 10 ⁷ Pa or less. 2. A polyamide film laminate having an adhesion modifying layer, a printing ink layer, an adhesive layer, and a sealant layer on at least one side of a polyamide base film in this order, wherein the laminate is hot water at 90 ° C. Among them, at least one of the longitudinal stress when stretched by 75% in the longitudinal direction or the lateral stress when stretched by 75% in the lateral direction is 2.8 ×
A polyamide film laminate having a pressure of 10 ⁷ Pa or less. 3. A package for an air-containing boil containing a moisture-containing food in a packaging bag, which packaging bag is obtained by heat-sealing the polyamide film laminate according to claim 1 or 2. A package for air-containing boiling.