JPH09219010A - Production of perpendicular thin-film magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a perpendicular thin-film magnetic head having excellent slidability, high yield and good mass productivity by cutting and dividing a head block formed by producing main magnetic pole cores and coil substrates by separate stages and joining both to each other. SOLUTION: Plural pieces of the main magnetic cores consisting of soft magnetic metallic thin films are arranged on the magnetic substrate and are subjected to patterning and cutting in prescribed positions, by which the main magnetic pole core block connected with the main magnetic pole cores like a comb is obtd. The main magnetic pole core block is then joined to the coil substrate 24 formed with the conductive coils and connecting electrodes formed in another stage, by which the head block 30 arranged with the plural magnetic heads joined with the individual main magnetic pole cores 21 to the coil substrate 24 is obtd. The head block 30 is cut at the plane H-H to obtain magnetic heads. Then, the combination of the good characteristics of the main magnetic pole cores 21 and the coil substrates 24 is easily obtd. The production of the thin-film magnetic heads having the excellent recording and reproducing characteristics at a high yield is thus made possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head for recording and reproducing information signals such as a computer and an image on a magnetic disk in a perpendicular magnetic recording system, and particularly to a sliding characteristic with a recording medium and mass productivity. The present invention relates to a method of manufacturing an excellent vertical thin film magnetic head (hereinafter abbreviated as magnetic head).

[0002]

2. Description of the Related Art At present, a perpendicular magnetic recording system is being put into practical use in order to increase the capacity and density of magnetic disk devices. As a magnetic head for this perpendicular magnetic recording, FIG.
As shown in, a magnetic substrate 52 in which a non-magnetic material 51 is embedded
A main magnetic pole excitation type thin film magnetic head having a structure in which an insulating layer 53a, a signal coil 54, an insulating layer 53b, a main magnetic pole film thickness portion 55 and a main magnetic pole 56 are sequentially formed on the above by film forming means such as sputtering and vapor deposition. However, for example, Japanese Patent Laid-Open No. 4-5720
No. 5 discloses this. An example of the manufacturing method is disclosed in Japanese Patent Laid-Open No. 4-134605.

A large number of such thin film magnetic heads are generally formed on a wafer (not shown) made of a substrate material by using a semiconductor technique such as a photolithography technique and a vacuum thin film forming technique, and are excellent in mass productivity. .

[0004]

In order to reproduce a magnetic signal vertically recorded on a magnetic recording medium with high resolution, the film thickness of the main magnetic pole 56 must be made equal to or less than the recording bit length. However, it is usually 1 μm or less. The track width (width of the main magnetic pole in the direction substantially orthogonal to the disc rotation direction) is also set to 10 μm or less in order to increase the recording density in the track width direction. Further, in order to obtain good recording / reproducing characteristics, the magnetic characteristics are also required to have high magnetic permeability and low coercive force.

However, in the conventional magnetic head, since the coil 54, the non-magnetic films 53a and 53b, etc. are laminated on one substrate, the substrate warps due to film stress, thermal stress, etc. during formation. This makes it difficult to perform highly accurate patterning when forming the main pole. Since the warp amount of the substrate generally increases in proportion to the substrate shape,
It becomes difficult to increase the substrate shape and increase the head production amount per substrate. Further, since the main magnetic pole is patterned after the main magnetic pole magnetic film is formed on the substrate, when the magnetic characteristics of the magnetic film are deteriorated, the magnetic head on the entire substrate becomes defective and the yield is remarkably deteriorated.

The conventional magnetic head has a signal coil 54.
Is formed on a surface of the magnetic substrate that slides on the magnetic recording medium perpendicular to the magnetic recording medium. Therefore, if the height H from the head sliding surface to the suspension arm bonding surface is reduced, the signal coil It is necessary to reduce the outer diameter of 54. As a result, when the number of turns of the coil is increased, the cross-sectional area of the coil is reduced and the electrical resistance is increased. Therefore, it is difficult to set the height H of the magnetic head to 500 μm or less, and there is a limit to downsizing and weight reduction of the magnetic head. It was

Further, since the main magnetic pole and the signal coil are formed on the same surface, the shape of the sliding surface (the shape of the surface contacting the magnetic disk) is also restricted by this.

In order to achieve high-density recording, it is necessary to make the spacing with respect to the magnetic disk as small as possible. For this purpose, it is sufficient to increase the contact pressure between the magnetic head and the magnetic disk, but if the pressing load of the magnetic head is simply increased, the magnetic disk is easily damaged and the wear life of the magnetic head is shortened. It is necessary to reduce the weight and minimize the contact area. However, since the conventional magnetic heads have limitations due to the reasons described above, there is a problem in that it is difficult to obtain a running performance and a high performance magnetic head. It is an object of the present invention to provide a method of manufacturing a thin film magnetic head for perpendicular magnetic recording, which has excellent slidability in perpendicular magnetic recording and has a high yield and good mass productivity.

[0009]

In order to achieve the above object, a method of manufacturing a magnetic head according to the present invention comprises a step of forming a non-magnetic film on a first substrate composed of a magnetic substrate, and a step of forming a non-magnetic film on the non-magnetic film surface. Forming a plurality of grooves for burying the magnetic film in parallel at a predetermined interval at least to a depth that does not reach the magnetic substrate, and forming a magnetic film having a thickness that fills at least the groove in the groove of the non-magnetic film surface. A step of polishing the magnetic film surface to remove a portion other than the inner film in the groove, a step of forming a magnetic thin film to be a main magnetic pole in a predetermined thickness on the groove forming surface, the magnetic thin film physically,
It has a predetermined track width and depth (throat height) by a chemical method, and the center line that divides the pattern is almost orthogonal to the boundary line between the inner film of the groove and the non-magnetic film, and at least the position of depth = 0 is in the groove. A step of arranging a plurality of main magnetic poles in a predetermined shape so as to be outside the film and patterning, a step of cutting the substrate at a predetermined position to obtain a core block, a step of polishing a surface abutting with the coil substrate, A pair of V-shaped grooves and a V-shaped cutout for obtaining a main magnetic pole forming core having a predetermined width in a direction substantially perpendicular to the polishing surface so as to have a predetermined sliding width around the track portion of the core block. A step of processing a plurality of bottom surfaces of the groove, a step of processing a substantially trapezoidal groove and a substantially rectangular groove in predetermined positions on the polished surface of the block obtained in the above step to obtain a main magnetic pole forming core block, on the magnetic substrate Signal to A step of obtaining a block in which a plurality of magnetic heads are arranged by aligning the positions of main magnetic poles of the core block on a second substrate having a ruled portion, and the block is cut at a predetermined position to obtain one magnetic head. And

In the method of manufacturing a magnetic head of the present invention, since the main magnetic pole core and the signal coil are manufactured in separate steps and then bonded to each other, it is possible to easily make a combination exhibiting good characteristics, so that the recording / reproducing characteristics are good. In addition, the variation in characteristics can be reduced and the overall yield is improved. Further, since the shape of the main magnetic pole core is not affected by the signal coil, the contact area with the magnetic disk and the contact surface shape can be easily optimized, so that a thin film magnetic head having good sliding characteristics can be obtained. Further, by bonding a core block in which a plurality of main magnetic poles are arranged to a coil substrate, a plurality of magnetic heads can be easily obtained and mass productivity is excellent.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Various methods for manufacturing a thin film magnetic head according to the present invention will be described in detail below with reference to embodiments.

(Embodiment 1) An explanation of each step of the first manufacturing method of the present invention is shown in FIGS.

FIG. 1 shows a substrate 1 made of high-permeability ferrite.
1. Non-magnetic ceramic film 12 by thin film manufacturing method such as sputtering method, vacuum deposition method and ion plating method.
Is a step of depositing so that its thickness falls within the range of 10 to 100 μm. (Hereinafter, the step corresponding to FIG. 1 is referred to as step 1, the step corresponding to FIG. 2 is referred to as step 2, etc.) In this embodiment, a nonmagnetic ceramic film 12 having a thickness of 40 μm is formed on a substrate 11 having a thickness of 1.0 mm. Formed.

The high permeability ferrite substrate 11 is M
It is made of single crystal or polycrystal of n-Zn ferrite or Ni-Zn ferrite and forms a part of the magnetic circuit. The non-magnetic ceramic film 12 is made of Al ₂ O ₃ , 2MgO-Si.
O _2, MgO-SiO _2, the thermal expansion coefficient is close to high permeability ferrite etc., made of a material having good film-forming properties.

Step 2 is a step of processing a plurality of grooves 13 in the non-magnetic ceramic film 12 deposited on the high-permeability ferrite substrate 11 in parallel with each other at a predetermined interval. Groove 13
The depth is such that a groove is formed in the non-magnetic ceramic film, and the bottom surface thereof does not reach the high-permeability ferrite substrate. The groove 13 is processed with a high-speed dicing saw using a metal bond grindstone or a resin bond grindstone whose tip is shaped into a substantially U shape or a substantially trapezoidal shape. Alternatively, it is possible to process the groove by using a semiconductor technique such as a photolithography technique or an etching technique. In this example, a substantially trapezoidal grindstone was used to form grooves having a depth of 30 μm at a pitch of 1.2 mm.

Step 3 is a step of embedding the first metal soft magnetic film 14 which becomes a part of the magnetic circuit in the groove 13 processed in Step 2. The metal soft magnetic film 14 is made of Fe-Si alloy, Fe-
A crystalline alloy such as an Al-Si alloy or a Fe-Ni alloy or an amorphous alloy such as a Co-Nb-Zr alloy or a Co-Ta-Zr alloy is used. First, the metal soft magnetic film 1 is formed on the groove forming surface.
4 is formed by sputtering or vacuum evaporation to a thickness so that at least the groove is filled. Next, the metal soft magnetic film on the portion other than the groove is removed by mechanical grinding and polishing to obtain the substrate shown in FIG. Here, the finish of the polished surface is a mirror-polished surface. Specifically, a Co—Nb—Zr alloy is deposited on the groove formation surface using a high frequency sputtering device having a thickness of 45 μm, and
The surface to be adhered is polished by 5 μm with diamond abrasive grains having a particle size of 6 μm to remove the unnecessary portion of the metal magnetic film, and a substrate having the metal soft magnetic film 14 embedded in the groove having a depth of 40 μm is manufactured.

Step 4 is a step of depositing the second metal soft magnetic film 15 serving as a main pole on the polished surface of the substrate manufactured in Step 3. The second metal magnetic film 15 may be an alloy having the same composition as the first metal soft magnetic film 14 deposited in step 3, but a metal soft magnetic film having a different composition may be deposited depending on the performance of the magnetic head. good. In addition, the film thickness of the second metal soft magnetic film deposited in this step must be at least equal to or less than the recording bit length recorded on the recording medium, which is why the film thickness is 1 μm.
The following is assumed. The deposition of the metal soft magnetic film 15 is performed using the same method as in step 3, but the sputtering method is suitable because it is difficult to control the film thickness by the vacuum evaporation method.
However, other thin film manufacturing methods may be used as long as the thickness and the composition of the metal soft magnetic film can be controlled, and this patent does not limit the deposition method. Specifically, Co-Nb-
Using a high frequency sputtering device, the Zr alloy was 0.2
Deposited to a thickness of μm.

Step 5 is a step of processing the second metal soft magnetic film deposited in step 4 into a predetermined main pole shape. The second metal soft magnetic film 15 is processed by a photolithography technique, an ion milling technique, or a semiconductor manufacturing technique such as chemical etching so that the plurality of main magnetic poles 16 are arranged at predetermined intervals on the substrate.

FIG. 5B is a front view of the substrate showing the shape of the main pole. The main pole 16 has a predetermined track width Tw and an initial depth Gd at its tip, and the other portions are at least wider than the track width in order to improve the efficiency of the magnetic circuit. Although the track width Tw is set based on the recording density on the recording medium, it is at least 10 μm or less. Further, the initial depth Gd is not particularly limited, but if it is set to 5 μm or less, the depth accuracy is likely to deteriorate due to the influence of the processing accuracy of the subsequent process, etc., so it is desirable to set it to at least 5 μm or more. Further, from the viewpoint of magnetic circuit efficiency, the position of Gd = 0 μm is at least at a position other than the portion other than the first metal magnetic film 14 embedded in the groove.
6 is arranged. Further, the center line (not shown) of the main pole is formed so as to be substantially orthogonal to the boundary line between the non-magnetic ceramic film 12 and the first metal soft magnetic film 14 embedded in the groove. Specifically, the track width is 2.0 μm and the initial depth is 20 μm.
The main pole 16 was formed in a shape of 0 μm.

In step 6, a plurality of main magnetic pole core blocks each having a main magnetic pole formed by cutting the substrate of step 5 by AA ', BB', CC ', and DD' by machining ( Hereinafter, it is a step of manufacturing a core block). The cutting is performed by a high-speed dicing saw device using a metal bond grindstone or a resin bond grindstone as in the step 2.

Step 7 is a step of polishing the cut surface 18 of the core block 17. The polishing process is performed on the cut surface 18 on the side that opposes the cut surface on the track forming side, which will be the abutting surface with the coil substrate in a later step. Processing 1-6
Although diamond abrasive grains having a grain size of μm are used, diamond abrasive grains having other grain sizes may be used depending on the precision of the processed surface. Furthermore, if the required surface accuracy is obtained, S
Other polishing grains such as iC polishing grains and Al ₂ O ₃ polishing grains may be used. The polished surface is a mirror finished surface. In addition, in order to improve the shape accuracy such as the parallelism of the core block 17, both cut surfaces may be polished.

Step 8 is a step of processing a pair of V-shaped groove 19 and U-shaped groove 20 from the core block 17 with the main magnetic pole 16 sandwiched between the main magnetic poles 16 to obtain individual main magnetic pole cores having a predetermined shape. . The V-shaped groove 19 is processed to set the contact width of the track portion with the recording medium, and the U-shaped groove 20 is processed to set the main magnetic pole core width. First, the V-shaped groove processing will be described.

FIG. 8B is a groove sectional view showing a groove processing state. By processing the V-shaped groove 19, the contact width W1 between the track portion and the recording medium is set. Machining opens the tip angle θ
Using a metal or resin-bonded grindstone formed into a V-shape in a high-speed dicing saw device, the main magnetic pole 1
A pair of V-shaped grooves is formed on one main magnetic pole at a position where the track center of 6 is substantially the center of the contact width W1. Here, if the angle θ is made small, the abrasion of the grindstone at the time of processing becomes large, so that the groove shape changes in the core block and the variation of the contact width W1 becomes large. Further, increasing the opening angle θ is advantageous in terms of grindstone wear, but changes in the contact width W1 with respect to the groove depth also increase, and high machining accuracy is required to reduce variations in the contact width W1.
For this reason, the opening angle θ is set within the range of 60 ° to 120 °. The contact width W1 is 1 track width.
Since it is as small as 0 μm or less, if it is made large, the ratio of the track width Tw to the contact width W1 becomes large and it becomes difficult to bring only the track portion into stable contact with the recording medium.
Stable recording and playback cannot be performed. On the contrary, if the contact width W1 is made small, the wear speed of the main magnetic pole 16 becomes fast, and it becomes difficult to extend the life. In addition, it is susceptible to chipping during grooving, which reduces the yield. Therefore, the contact width is set within the range of 10 μm to 100 μm. Next, the U-shaped groove processing will be described.

The U-shaped groove 20 is processed to set the main magnetic pole core width W2, and the processing is performed with a high-speed dicing saw device using a metal or a resin bond grindstone having a flat tip. The main magnetic pole core width W2 is determined by the head performance, inductance, etc., but it goes without saying that it needs to be at least larger than the contact width W1. Further, the U-shaped groove 19 is processed to a depth such that the individual main magnetic pole cores 21 are not separated from the core block 17 and deeper than the length of the main magnetic pole cores 21 as described in the next step, so that the plurality of main magnetic pole cores 21 are combed. The core block is connected in a tooth shape.

Specifically, the main magnetic pole core was processed with a contact width W1 of 50 μm, a core width W2 of 100 μm, an angle θ of 60 °, and a U-shaped groove depth of 0.8 mm.

In step 9, a relief trapezoidal groove 22 of the coil forming portion is provided on the side of the main magnetic pole core 21 that abuts against the coil substrate, and a U-shaped groove 23 for setting the length of the main magnetic pole core 21. This is a process of processing. Grooving is performed on each of the main magnetic pole cores, so that the V-shaped grooves 19 processed in step 8 are processed in a direction orthogonal to the machining direction. FIG.
(B) is a groove cross-sectional view showing a groove processing state. First, the escape groove 22 will be described.

The relief groove is processed by a high-speed dicing saw device using a metal or resin-bonded grindstone whose tip is formed into a substantially trapezoidal shape. The groove shape is set according to the recording / reproducing characteristics of the magnetic head, the inductance, the coil shape, etc., but the tip of the groove position is the first metal soft magnetic film 1
Do not cut 4. Further, if the groove depth is increased, it is effective in reducing the inductance, but it is also necessary to increase the thickness of the main magnetic pole core, which makes it difficult to reduce the size and weight of the magnetic head. Therefore, the groove depth is set to 100 μm or less. On the other hand, the U-shaped groove 23 is processed to set the length 1 of the main magnetic pole core as described above, and therefore its position is the distance position of the set core length 1 from the main magnetic pole. . The groove depth is deeper than the escape groove 22 and the final main magnetic pole core thickness and does not separate the core. Further, the groove width is made larger than that of the connecting electrode of the coil substrate so that the connecting electrode can enter the groove 23 at the time of joining with the coil substrate in a later step.

Specifically, the trapezoidal groove 22 is processed at a tip position of 40 μm from the main pole and a depth of 50 μm, and the U-shaped groove 23 has a width at a position where the main magnetic pole core length 1 is 400 μm. Grooves having a depth of 0.3 mm and a depth of 0.9 mm were formed.

Step 10 is a step of joining the core block 17 and the coil substrate 24 at a predetermined position. Coil board 2
Reference numeral 4 denotes a substrate on which conductor coils, electrodes and the like have been formed by a semiconductor manufacturing technique such as a photolithography technique, a thin film forming technique and an etching technique. FIG. 10B is an external view of the coil substrate, and FIG. 10C is a cross-sectional view taken along line EE ′.

Although details of the manufacturing method, conditions, etc. are not described in this patent, for example, as an example of the manufacturing method,
S is placed on a magnetic substrate 25 such as ferrite that is mirror-polished.
A non-magnetic film 26 such as iO ₂ or Al ₂ O ₃ is formed by using a high frequency sputtering device or the like, and S is formed on the non-magnetic film 26.
The coil 27 is formed by using a non-magnetic film such as iO ₂ as an insulating material and a conductor film such as Cu in a predetermined number of turns to obtain a coil substrate 24.
At the same time, the connection electrode 28 for external connection is formed at the same time when the coil is formed. The coil center portion of the coil substrate, the non-magnetic film between the connection electrode and the coil are removed to a predetermined shape, and the ferrite substrate 25 is exposed to form a butt surface portion with the main magnetic pole core.

The abutting surface of the main magnetic pole core on the main magnetic pole forming side is aligned with the exposed ferrite portion of the central portion of the coil, and the coil substrate and the main magnetic pole core are joined to obtain a head block 29 in which a plurality of magnetic heads are arranged. For joining, a resin joining method is used in which an organic resin adhesive such as an epoxy resin adhesive or a cyanoacrylate adhesive is filled into the coil clearance groove 22 of the main magnetic pole core and joined, or at least one abutting surface is made of, for example, PbO. It is also possible to use a glass bonding method in which a --SiO ₂ -based low melting point glass thin film is formed to a film thickness of 1 μm or less using a high frequency sputtering device and the glass thin films are heated and melted to bond each other. In any joining method, in order to obtain joining strength, a joining agent filling groove for reinforcement may be provided in addition to the joining surface. Alternatively, the head block can be obtained by using another metal joining method in which a metal thin film such as Au or Al is formed on the abutting surfaces and they are pressed together to join.

Specifically, a core block was bonded to a coil substrate having a coil winding number of 20 T using an epoxy resin adhesive.

In step 11, the core block 17 of the head block and the coil substrate 24 are sliced so that the head block 29 has a predetermined thickness and the main magnetic pole core is divided into individual pieces. Processing is performed with a high-speed dicing saw device using a resin or metal bond grindstone. FIG. 11 is a side view of the head block 29 showing a processing position. FF ′ of the core block 17 and GG ′ of the coil substrate 24 are processed to be thin plates each having a predetermined thickness. Here, the processing of the core block 17 is for determining the gap depth Gd of the main magnetic pole, and the processing position F-
F ′ is processed at a position where a predetermined gap depth can be obtained. Therefore, processing is performed using a grindstone with a grain size of 10 μm or less so that the accuracy of the gap depth can be obtained and that the surface to be machined is a surface facing the recording medium and thus good surface roughness can be obtained. Do. Further, the final core thickness t1 of the main magnetic pole core is determined by this processing, and the U-shaped groove 23 processed in step 9 is cut to separate the main magnetic pole cores individually.

On the other hand, the processing on the coil substrate 24 side is mainly for determining the weight of the entire magnetic head. Although the weight can be reduced by reducing the thickness t2 of the coil substrate,
The internal stress of the non-magnetic thin film or the like on the coil substrate causes the coil substrate to warp during processing, resulting in poor processing accuracy. Further, if the thickness t2 is increased, the weight of the magnetic head is increased and the contact load is increased, so that the recording medium is easily damaged.
Moreover, in order to prevent this, a highly accurate load control mechanism is required. For the above reasons, the thickness t2 of the coil substrate is
Is set within the range of 0.05 to 0.5 mm.

Specifically, the thickness t1 of the main magnetic pole core is 0.
Slice processing was performed so that the thickness t1 of the coil substrate was 1 mm and the thickness t2 of the coil substrate was 0.3 mm.

FIG. 12 is an external view showing the head block 29 after slicing, and a head block 30 in which a plurality of magnetic heads in which individual main magnetic pole cores 21 are bonded to the coil substrate 24 are arranged is obtained. This head block 3
0 is cut by H-H 'to obtain a magnetic head 31 shown in FIG.

In the present invention, the main magnetic pole core and the coil substrate are formed in separate steps and joined to each other to obtain the magnetic head, so that the steps can be controlled individually and the yield of the magnetic head can be improved by the optimum combination. You can Further, since the main magnetic pole core is manufactured by a separate process, the core width, length, shape of the contact surface with the recording medium, etc. can be arbitrarily and easily changed more than ever before. Therefore, by optimizing the shape of the main magnetic pole core, it is possible to obtain a magnetic head that is in good contact with the recording medium. Further, since the magnetic head is obtained from a block in which a plurality of main magnetic poles and coils are arranged, mass productivity is excellent.

(Embodiment 2) Next, another embodiment of the present invention will be described. In the embodiment shown in FIGS. 1 to 13, FIG.
In the step shown in FIG. 0, as shown in the coil substrate sectional view of FIG. 10C, a non-magnetic film is formed on a ferrite substrate and a plurality of conductor coils, connection electrodes, etc. are formed on the coil by semiconductor technology. Although the substrate is used and it is excellent in mass productivity, since a ferrite substrate having a large volume is put in the magnetic circuit of the magnetic head, the head inductance becomes large and it is difficult to obtain a low-inductance magnetic head.

With respect to this problem, as shown in FIG. 14, by forming a groove in the non-magnetic substrate 41 of the coil substrate 40 and embedding the metal soft magnetic film 42 in the groove, only the metal magnetic film 42 is formed. Since it becomes a part of the magnetic circuit, the inductance of the magnetic head can be reduced. Further, the inductance can be controlled by changing the shape of the groove width and the depth and changing the volume of the metal soft magnetic film. Figure 15 shows I
In the cross-sectional view taken along the line -I ', the structure is such that the nonmagnetic insulating film 43 is deposited on the metal soft magnetic film 42 buried in the groove of the nonmagnetic substrate 41, and the coil is formed thereon.

FIG. 16, FIG. 17, and FIG. 18 show steps of the coil substrate of this embodiment. In the step shown in FIG. 16, the nonmagnetic substrate 41 is subjected to a semiconductor manufacturing method such as a milling device or a high-speed dicing saw device. According to the machining method described above, the groove 45 having a predetermined shape whose cross-sectional shape is a substantially U shape or a substantially trapezoidal shape.
Are formed in parallel. The groove depth is 10 μm
In the above cases, the machining method is superior in terms of processing time. The non-magnetic substrate 41 is selected from MnO—NiO based non-magnetic ferrite, ceramic substrates such as Al ₂ O ₃ or glass substrates such as crystallized glass. Specifically, processing is performed by a high-speed dicing saw device using a resin or a metal bond grindstone whose tip is formed into a substantially trapezoidal shape. The groove depth is 20 μm and the groove width in this case is 60 μm
The grindstone was shaped so that

Next, in the step shown in FIG. 17, a metal magnetic film is applied to the groove forming surface with a high frequency sputtering device to a thickness such that at least the groove is filled, and then the adhered surface is polished to remove unnecessary portions of the metal soft magnetic material. By removing the film, the metal soft magnetic film 4 is formed only in the groove.
Obtain a substrate in which 2 is embedded. The metal magnetic film 45 is similar to the process shown in FIG. Surface polishing is performed using, for example, diamond abrasive grains, and the polished surface is a mirror finished surface. Photolithography on the groove substrate obtained in the above steps,
Conductor coil 45, connection electrode 4 by semiconductor manufacturing technology such as film formation
6, the conductor coil 42 is formed at a position where the center portion of the conductor coil 42 and the center portion of the in-groove metal soft magnetic film 42 are substantially aligned with each other.

By using the coil substrate of the present invention,
Since a part of the magnetic circuit is composed only of the metal magnetic film embedded in the coil substrate, the inductance of the magnetic head can be reduced. Further, the inductance can be controlled by changing the cross-sectional area of the metal magnetic film by changing the groove depth and width.

[0043]

According to the present invention, (1) the main magnetic pole core and the coil substrate are manufactured in separate steps, and the magnetic head is manufactured by bonding them to each other. Therefore, good characteristics can be easily combined, and recording / reproducing is performed. A thin film magnetic head having excellent characteristics can be manufactured with a high yield.

(2) Since the main magnetic pole core that comes into contact with the recording medium is manufactured in a single process, restrictions on the core shape are reduced,
By optimizing the core shape, it is possible to easily obtain a magnetic head that is in good contact with the recording medium.

(3) The main magnetic pole and the coil are manufactured by using a block and a substrate in which a plurality of coils are arranged, so that mass productivity is excellent.

There are advantages such as the following.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a first step of a thin film magnetic head of a first embodiment of the invention.

FIG. 2 is an explanatory diagram of a second step of the thin film magnetic head of the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of a third step of the thin film magnetic head of the first embodiment of the present invention.

FIG. 4 is an explanatory view of a fourth step of the thin film magnetic head of the first embodiment of the invention.

FIG. 5 is an explanatory view of a fifth step of the thin film magnetic head of the first embodiment of the invention.

FIG. 6 is an explanatory view of a sixth step of the thin film magnetic head of the first embodiment of the present invention.

FIG. 7 is an explanatory view of a seventh step of the thin film magnetic head of the first embodiment of the invention.

FIG. 8 is an explanatory view of an eighth step of the thin film magnetic head of the first embodiment of the invention.

FIG. 9 is an explanatory view of a ninth step of the thin film magnetic head of the first embodiment of the invention.

FIG. 10 is a first thin film magnetic head according to the first embodiment of the present invention.
Explanatory drawing of 0 process.

FIG. 11 is a first thin film magnetic head according to the first embodiment of the present invention.
Explanatory drawing of 1 process.

FIG. 12 is a first thin film magnetic head according to the first embodiment of the present invention.
Explanatory drawing after 1 process.

FIG. 13 is a perspective view of a thin film magnetic head according to a first embodiment of the invention.

FIG. 14 is an explanatory diagram of a coil substrate of the thin film magnetic head of the second embodiment of the present invention.

FIG. 15 is an explanatory diagram of a coil substrate of the thin film magnetic head of the second embodiment of the present invention.

FIG. 16 is an explanatory diagram of a first step of forming the coil substrate of the thin film magnetic head of the second embodiment of the present invention.

FIG. 17 is an explanatory diagram of a second step of forming the coil substrate of the thin film magnetic head of the second embodiment of the present invention.

FIG. 18 is a front view of the substrate for explaining the coil forming position of the coil substrate of the thin film magnetic head of the second embodiment of the present invention.

FIG. 19 is a side view of a conventional vertical thin film magnetic head.

[Explanation of symbols]

 21 ... Main magnetic pole core, 24 ... Coil substrate, 31 ... Magnetic head.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Tsuchiya 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd. Hitachi, Ltd. multimedia system development headquarters (72) Hitoshi Yanagihara Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd.Multimedia System Development Headquarters (72) Inventor Yuko Shibayama Yoshidacho, Totsuka-ku, Yokohama, Kanagawa Prefecture 292 Hitachi, Ltd. Multimedia System Development Headquarters (72) Inventor Hirotomo Nagato Kanagawa 292 Yoshida-cho, Totsuka-ku, Yokohama-shi Hitachi, Ltd. multimedia system development headquarters (72) Inventor Nobuo Konishi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi Ltd. multimedia system development headquarters (72) Inventor Norio Uemura Thousands of Tokyo Field-ku, Marunouchi 2-chome No. 2 Hitachi metal within Co., Ltd.

Claims (3)

[Claims] 1. A step of forming a non-magnetic film on a first substrate made of a magnetic substrate to a predetermined thickness, and a cross-sectional shape for embedding a metal soft magnetic film on the surface of the non-magnetic film is substantially U-shaped. Alternatively, a step of forming a plurality of substantially trapezoidal grooves at a predetermined interval in parallel to each other at a depth that does not reach the magnetic substrate, and covering the non-magnetic film surface with a metal soft magnetic film having a thickness that at least fills the grooves. The step of polishing, the step of polishing the adhered surface of the metal soft magnetic film to remove the portion other than the groove inner film, the step of forming a metal soft magnetic thin film to be the main pole to a predetermined thickness on the polished surface, the metal soft magnetic The thin film has a predetermined track width and depth by a physical or chemical method, the center line of the pattern is substantially orthogonal to the boundary line between the metal soft magnetic film and the non-magnetic film in the groove, and at least the depth =
Patterning by arranging a plurality of main magnetic poles in a predetermined shape so that the position 0 is outside the inner film of the groove; and cutting the substrate at a predetermined position to form a main magnetic pole core block in which a plurality of main magnetic pole patterns are arranged. The step of obtaining, a step of polishing at least a cut surface of the main magnetic pole core block that abuts against the coil substrate, V
A step of processing notches for obtaining a main magnetic pole core having a V-shaped groove and a predetermined width into each of the main magnetic pole patterns, and a substantially trapezoidal groove and a substantially rectangular shape on the polishing surface of the main magnetic pole core block that abuts the coil substrate. A method of manufacturing a thin film magnetic head, comprising the steps of processing a groove in a predetermined position and cutting the head block at a predetermined position to obtain one magnetic head. 2. A head in which a plurality of magnetic heads are arranged by bonding the main magnetic pole core block to a second substrate having a plurality of signal coils and connection electrodes formed on the magnetic substrate with the positions of the main magnetic pole patterns aligned. In the step of obtaining the block, the coil substrate is formed into a groove having a U-shape or a trapezoid shape having a predetermined width and depth in a non-magnetic substrate, and a metal soft magnetic film is embedded only in the groove to form a metal soft magnetic film. The method of manufacturing a thin-film magnetic head according to claim 1, wherein a conductor coil is formed on the film via a non-magnetic insulating film. 3. A head in which a plurality of magnetic heads are arrayed by bonding the main magnetic pole core block to a second substrate having a plurality of signal coils and connection electrodes formed on the magnetic substrate with the positions of the main magnetic pole patterns aligned. The step of obtaining a block, wherein the opening angle of the substantially V groove is within the range of 60 ° to 120 °, and the contact width of the main magnetic pole core is within the range of 10 to 100 μm.
Alternatively, the method of manufacturing the thin-film magnetic head according to the item 2.