JPH09199898A - Part-mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a part-mounting device which is capable of reducing a part mounting cost by a method wherein a part is held, the holding point of the part and the objective reference mark of a board are picked up with a camera, errors in the holding point and holding angle of the part are calculated, and a part mounting head is moved to position a part at a target position. SOLUTION: The picture images of the objective reference marks 6 of a printed board 4 are picked up with cameras 7 respectively, and the positions of the marks 6 are detected by a picture image processing device. The picture image of a TCP 3 held by the vacuum-sucking nozzle of a part mounting head 8 is picked up with cameras 7, and the position of the TCP 3 is detected. The position of the part reference mark of the TCP 3 is calculated through a CPU. A holding angle difference between the mounting angle and the holding angle and the positional error of the TCP 3 are calculated comparing the position of the target reference mark 6 with that of the part reference mark 7, and the TCP 3 is corrected so as to make the holding angle difference and the positional error both zero, and then the TCP 3 is mounted on a printed board 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a component at a target position. More specifically, the present invention relates to a component mounting apparatus including a camera that detects a component position and a target mounting position.

[0002]

2. Description of the Related Art For example, TCP (Tape Carrier)
In a component mounting device that mounts components such as r Package) on a printed circuit board for mounting on a PC using a robot, the position of the component held by the robot is detected by one camera fixed on the device side, and The target position of the substrate is detected by another fixed camera. Then, the movement distances of the robot in the X-axis direction and the Y-axis direction are calculated from these component positions and the target positions to move the robot,
Parts are mounted at the target position on the board.

[0003]

However, in the component mounting apparatus described above, the component position and the target position are detected by separate cameras, and the robot moves based on the component position and the target position. Position accuracy and robot movement accuracy directly affect the component mounting accuracy, making it difficult to mount the component at the target position with high accuracy.

That is, since the moving distance of the robot is calculated from the component position detected by each camera and the target position, if there is an error in the position between the cameras, an error will also occur in the moving distance. Also, the calculated travel distance,
An error also occurs with the actual movement distance of the robot moved based on this. Further, even if the temperature or humidity changes during the work, an error occurs at each place.
For these reasons, it becomes difficult to improve the accuracy of component mounting.

In order to improve the accuracy of movement of the robot,
It may be possible to provide a linear scale, but this will increase the cost.

Therefore, an object of the present invention is to provide a component mounting apparatus which can mount components at low cost and with high precision.

[0007]

In order to achieve the above object, a component mounting apparatus according to a first aspect of the invention has a holding portion for holding a supplied component and mounting the component at a predetermined target position, and a target position A component mounting head having a camera capable of detecting the position of the target reference mark formed in the vicinity and the holding position of the held component with respect to the holding portion, and simultaneously detecting the position and the holding position of the target reference mark, An error calculating means for calculating an error in the holding angle of the component based on the position and the holding position of the target reference mark, an angle adjusting mechanism for adjusting the angle of the holding portion based on the holding angle error, a position of the target reference mark and the holding of the component. And a head moving mechanism for moving the component mounting head based on the position to position the component at the target position.

Therefore, the component mounting head before holding the component is moved to the target position by the head moving mechanism and the target reference mark is detected by the camera. After the detection, the supplied part is held by the holding part, and the holding position of the part with respect to the holding part is detected by the camera. Here, the error calculating means calculates the holding angle error of the component based on the holding position of the component and the position of the target reference mark previously detected. Then, based on this holding angle error, the angle of the holding portion is adjusted by the angle adjusting mechanism to match the angle between the component and the target position.

Then, the component mounting head moves to the target position again, and the component and the target position are made to substantially coincide with each other. Here, the target reference mark is detected at the same time when the camera detects the component. Then, the position of the component and the position of the target reference mark are compared. Based on this comparison, the position of the component mounting head is finely adjusted, and the component position and the target position are matched and mounted.

The operation of detecting the position of the component, adjusting the angle, aligning the component, and the like may be performed after the component mounting head moves to the target position while holding the component.

In the component mounting apparatus according to the second aspect, the error calculating means calculates the component reference mark position corresponding to the component from the component holding position, and calculates the holding angle error using the component reference mark position. I have to. Therefore, the error of the holding angle is calculated with higher accuracy.

Further, in the component mounting apparatus according to the third aspect, the holding portion provided on the component mounting head is composed of the suction nozzles for sucking and holding the components, the cameras are provided at two positions sandwiching the suction nozzle, and the angle adjusting mechanism is the suction unit. As a rotating means for rotating the nozzle, a suction / removal mechanism for the suction nozzle is provided on the component mounting head, and the head moving mechanism is a means for moving the component mounting head in the X-axis direction and the Y-axis direction on the work table.

Therefore, when the holding portion takes out the supplied components, the suction / holding mechanism sucks and holds the suction nozzles by the nozzle moving mechanism. Then, the suction / retraction mechanism pulls in the suction nozzle, thereby lifting the component. Also, when mounting the component at the target position,
The suction nozzle is moved out by the nozzle moving mechanism, and suction holding is released in this state, and the component is mounted.

Further, when adjusting the angle of the holding portion based on the holding angle error of the component, the suction nozzle is rotated together with the component by the rotating means. Also, with two cameras,
Each position of the target reference mark formed at least at two positions sandwiching the target position is detected.

Further, in the component mounting apparatus of claim 4, the two cameras are arranged at diagonal positions of the components.
Therefore, the position of the target reference mark and the holding position can be detected with high accuracy.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The structure of the present invention will be described below in detail based on the embodiments shown in the drawings. It should be noted that in the present embodiment, the component mounting apparatus that mounts the TCP on the printed circuit board is described, but it goes without saying that the component mounting apparatus that mounts other components on another board or the like can be used.

As shown in FIGS. 2 and 3, the component mounting apparatus 1 holds a component such as TCP 3 supplied from the feeder 2 and places the TCP 3 at a predetermined target position, for example, a mounting position of the printed circuit board 4. The holding portion including the suction nozzle 5 to be mounted, the position detection of the target reference marks 6, 6 formed in the vicinity of the target position, and the holding position of the held TCP 3 with respect to the suction nozzle 5 are performed, and the target reference marks 6, 6 are detected. Component mounting head 8 having cameras 7 and 7 capable of simultaneously detecting the position and the holding position, and an error calculating means for calculating an error in the holding angle of the TCP 3 based on the positions and the holding positions of the target reference marks 6 and 6. CPU6 as
0, the rotation means as the angle adjustment mechanism for adjusting the angle of the suction nozzle 5 based on the holding angle error, that is, the rotation motor 9
Based on the positions of the target reference marks 6 and 6 and the holding position of the TCP 3, the component mounting head 8 is placed on the work board 11 (hereinafter,
It is called the XY plane. ) To move the TCP 3 to the target position.

As shown in FIG. 3, the component mounting head 8 is
A suction nozzle 5 that suction-holds the TCP 3 in a direction perpendicular to the work board 11 (hereinafter, referred to as Z-axis direction), and two cameras 7 and 7 that have two fields of view F and F near the suction nozzle 5 therebetween. A light 13 for irradiating the TCP 3 held by the suction nozzle 5, a rotary motor 9 as an angle adjusting mechanism for rotating the suction nozzle 5 about the Z axis, and a nozzle for sliding the suction nozzle 5 along the Z axis. A reciprocating motor 10 as an in-and-out mechanism and a spring 14 for urging the suction nozzle 5 in a direction separating from the work board 11 along the Z-axis direction.
And

Optical elements such as a lens 15 and a mirror 16 are arranged on the optical path S of the photographing optical system of each camera 7, 7. For this reason, each optical path S is bent, and the cameras 7 and 7 can be attached at positions not facing the photographing position.
Here, another photographing optical system may be used as long as it is possible to separately detect images at two places on the XY plane that sandwich the suction nozzle 5. The mounting positions of the cameras 7 and 7 are not limited as long as they are integrated with the component mounting head 8.

According to this embodiment, the two diagonally arranged
Since the two cameras 7 and 7 are used, the longest portion of the TCP 3 can be detected by the minimum number of cameras, and the detection position accuracy can be improved. In this embodiment, the two cameras 7 and 7 provided at diagonal positions are used, but one camera or three or more cameras may be used.

As shown in FIG. 2, the head moving mechanism 12
Is two Y axes 17 and 17 fixed to the work board 11,
Head X-axis 18 movable along each Y-axis 17, 17
And a slider 19 which is slidable with respect to the head X-axis 18 and to which the component mounting head 8 is fixed. By the movement of the head X-axis 18 and the slider 19,
The component mounting head 8 can move on the work board 11 in the X-axis direction and the Y-axis direction.

The feeder 2 is a stack of TCs.
Work board 11
Supply on top. The TCP 3 has a shape in which a large number of fine electrodes are radially provided on each side of a square thin plate-shaped main body. Further, the work board 11 has a Z-axis direction.
The light stage 20 that irradiates from the side and the printed circuit board 4
And a conveyor 34 for transporting the. In addition, as shown in FIG. 7, the operation control unit 35 that controls the operation controls the sequencer 40 that supervises and controls the overall operation by the conveyor 34.
The heater head 24 and the robot controller 50 are connected to each other, the image processing device 70 is connected to the robot controller 50 via the CPU 60, and the two cameras 7 and 7 are connected to the image processing device 70. It is configured. Here, the robot controller 50
The operations of the component mounting head 8 and the heater head 24 are controlled.

As shown in FIG. 1, a die attach pad 21 having a substantially square shape for attaching the TCP 3 is provided at the center of the printed circuit board 4. Die attach pad 21
Around the periphery of, a large number of printed patterns 22 for electrode attachment are formed orthogonal to each side of the square. In addition, four small circular target reference marks 6 are formed near the four corners of the die attach pad 21. The print pattern 22 is plated with solder. In addition,
Although four target reference marks 6 are formed in the present embodiment, the number of formed target reference marks 6 may be changed according to the accuracy required for component mounting. However, in order to obtain sufficient accuracy, it is preferable to provide the target reference marks 6 at two or more places.

On the other hand, as shown in FIGS. 2 and 4, on the work board 11 of the component mounting apparatus 1, a heater head 24 for soldering and a heater moving mechanism 25 for moving the heater head 24 on the XY plane. And are arranged. The heater head 24 includes a heater 26 having a square outlet that blows hot air toward the work board 11, and a cover 2 that surrounds a surface of the heater 26 other than the surface facing the work board 11 from the side.
7, 27, blowers 28, 28 for sucking the air in the covers 27, 27, a syringe 29 for supplying an adhesive, and a syringe 30 for supplying a flux.

The heater moving mechanism 25 is slidable with respect to the heater X-axis 31 and the heater X-axis 31 movable along the Y-axis 17, 17 fixed on the work board 11. A slider 32 to which the heater head 24 is fixed is also provided. By moving the heater X-axis 31 and the slider 32, the heater head 24 can move on the work board 11 in the X-axis direction and the Y-axis direction.

In this embodiment, since the component mounting head 8 and the heater head 24 are separately provided, the heat of the heater head 24 is not transferred to the component mounting head 8. Therefore, the mounting of the TCP 3 by the component mounting head 8 is performed with high accuracy without being affected by heat. Further, since the component mounting head 8 and the heater head 24 are separate, for example, the work of taking out the TCP 3 from the feeder 2 by the component mounting head 8 and the work of applying the adhesive or the like by the heater head 24 can be performed simultaneously. it can. Therefore, the mounting work of the component can be speeded up.

Further, in the present embodiment, since the soldering is performed by blowing hot air from the heater 26, the accuracy of mounting on the soldering portion is low as compared with the case of using the conventional hot bar. That is, since the hot air is blown out slightly from the air outlet, the heater 26 and the TCP
While the allowable range of positional deviation from 3 is relatively large,
This is because the allowable range of positional deviation between the hot bar and TCP3 is small. Therefore, it is not necessary to make the movement accuracy of the heater head 24 particularly high. In addition, it is not necessary to parallelize the contact portions and clean the contact portions, which are required in the hot bar. Therefore, the manufacturing cost and maintenance cost of the heater moving mechanism 25 and the heater head 24 can be reduced.

When the TCP 3 is mounted on the printed circuit board 4 by the component mounting apparatus 1 described above, the printed circuit board 4 is carried by the conveyor 34 to a predetermined position on the work board 11. Then, the head moving mechanism 12 moves the component mounting head 8 onto the printed circuit board 4, and the light 1 of the component mounting head 8 is moved.
3 is turned on and the target reference marks 6 and 6 at the corresponding positions are picked up by the cameras 7 and 7, respectively, and the image processing device 7
The positions of the marks 6 and 6 are detected by 0. Then, the detected position is stored in the CPU 60. The component mounting head 8 is further moved and positioned on the TCP 3 supplied by the feeder 2. Here, the suction nozzle 5 is extended by the reciprocating motor 10, and the TC is moved by the suction nozzle 5.
P3 is adsorbed and held. Then, the suction nozzle 5 is pulled in to lift the TCP 3. The component mounting head 8 is moved onto the light stage 20 while holding the TCP 3.

Here, each of the cameras 7 and 7 receives a light beam from the light stage 20 and images a part of the contour of the TCP3, and the image processing device 70 detects the position of the TCP3. Then, the detected position is stored in the CPU 60. TCP
Since 3 is detected by the transmitted light, the detection can be performed with high accuracy. The position of the TCP 3 is detected by sending the images picked up by the two cameras 7 and 7 to the image processing device 70 shown in FIG. 7 and detecting the positions of the corners in the image or the electrode parts protruding in a radial pattern. . Also, TCP3
If a mark that can be used for positioning is written on this mark, this mark may be detected, or the characteristic shape of other parts may be detected.

At the time of this detection, the suction nozzle 5 is rotated by 45 ° by the rotation motor 9. As a result, each electrode of TCP3 and the outline of TCP3 are grasped as a whole.
P3 chipping, number of electrodes and bending can be detected, TCP3
The quality of can be determined. In this embodiment, since the two cameras 7 and 7 are used, the suction nozzle 5 rotates 180 °.
Is enough. Therefore, the detection time can be shortened. However, not limited to this, only one camera 7
The detection may be performed by rotating it by 0 °. In this case, since it is not necessary to correct the positional relationship between the two cameras 7, 7, this adjustment work can be simplified.

Here, the CPU 60 calculates the positions of the component reference marks 33, 33 corresponding to TCP3 from the detected position of TCP3. The component reference marks 33, 33 are TCP
3 is a calculated mark that is formed at a position that coincides with the target reference marks 6 and 6 when the device 3 is attached to the target position.

Since the target reference marks 6 and 6 on the printed circuit board 4 have already been detected and stored, the position of the target reference mark 6 and the positions of the component reference marks 33 and 33 are CP.
By comparing with U60, the holding angle error between the angle at which the TCP 3 should be mounted and the angle currently held can be calculated. The suction nozzle 5 is rotated based on this holding angle error to match the holding angle of the TCP 3 with the mounting angle. Then, the component mounting head 8 is moved again onto the printed circuit board 4.

On the other hand, between the time when the component mounting head 8 before holding the TCP 3 is retracted from the printed circuit board 4 until the time when the TCP 3 is held and the component mounting head 8 is positioned on the printed circuit board 4 again.
The heater moving mechanism 25 moves the heater head 24 onto the printed circuit board 4 based on the target reference marks 6 and 6 stored in the CPU 60. Then, the flux and the adhesive are applied to the printed circuit board 4 by the respective injectors 29 and 30, and the heater head 24 returns to the standby position.

Then, the component mounting head 8 holding the TCP 3 is again positioned on the printed circuit board 4, the light 13 is turned on, and the target reference marks 6, 6 are again set by the cameras 7, 7.
Is detected. As shown in FIG. 1, at this time, in the visual fields F, F of the cameras 7, 7, the target reference marks 6, 6 and part of the contour of the TCP 3 are simultaneously captured. Here, the calculated TC
The positions of the component reference marks 33, 33 of P3 are compared with the positions of the actually detected target reference marks 6, 6 to calculate the position error between them. The component mounting head 8 is moved by feedback control so that this position error becomes zero. When the position error becomes 0 and the TCP 3 reaches the position where the printed circuit board 4 should be mounted, the suction nozzle 5 is extended and the TCP 3 is supplied onto the die attach pad 21 of the printed circuit board 4 and bonded.

Then, the heater moving mechanism 25 repositions the heater head 24 on the printed circuit board 4. At this time, the heater 26 is TCed with the covers 27, 27 opened.
After being positioned on P3, the covers 27, 27 are closed. Then, by blowing hot air from the heater 26, TC
Each electrode of P3 is soldered to the printed pattern 22. At the same time, the blower 28 sucks the evaporated flux. Therefore, the flux vapor does not spread around.

The above-described embodiment is an example of the preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention. For example, without providing the light stage 20, when the component mounting head 8 sucks the TCP 3 from the feeder 2, the component mounting head 8 moves to the target position as it is, and the component position is detected at the target position.
The TCP 3 may be supplied onto the printed circuit board 4 by performing angle adjustment and position adjustment. Further, in this embodiment, the component mounting apparatus 1 is provided with the heater head 24, but this may be a separate apparatus. That is, the component mounting device 1 may be a device that simply bonds the TCP 3 onto the printed circuit board 4.

[0037]

As is apparent from the above description, in the component mounting apparatus according to the first aspect, the target reference mark and the component can be simultaneously detected by the same camera. Therefore, the position of the target reference mark and the component position can be detected. It is possible to determine the mounting position of the component by feedback control while comparing with. Therefore, it is possible to mount the components with high accuracy and to maintain a stable and highly accurate state without being affected by the external environment such as temperature and humidity. Further, since the positional accuracy of the component mounting head and the component mounting accuracy are not directly related to each other, it is not necessary to set the positional control accuracy of the component mounting head particularly high. Therefore, the manufacturing cost and maintenance cost of the head moving mechanism and the like can be reduced.

Further, in the component mounting apparatus of the second aspect, the error calculating means calculates the component reference mark position corresponding to the component from the component holding position, and calculates the holding angle error using the component reference mark position. Therefore, the error of the holding angle can be calculated with high accuracy, and the components can be mounted with high accuracy.

Further, in the component mounting apparatus according to the third aspect, the cameras are provided at two positions sandwiching the suction nozzle, so that the positions of the two target reference marks can be detected centering on the held component. Therefore, the holding angle error of the component can be calculated with high accuracy, and thus the component can be mounted with high accuracy. Further, since the holding portion is formed by the suction nozzle, it is possible to securely hold the component from one direction.

Further, in the component mounting apparatus according to the fourth aspect, since the two cameras are arranged at diagonal positions of the components, the position of the target reference mark and the holding position can be detected with high accuracy, This allows the components to be mounted with high accuracy.

[Brief description of drawings]

FIG. 1 is a plan view showing a positional relationship among a printed circuit board, a TCP, and a field of view of each camera in an embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a plan view showing the entire component mounting apparatus.

3A and 3B are views showing a component mounting head, in which FIG. 3A is a plan view, FIG. 3B is a front view, and FIG.

FIG. 4 is a diagram showing a heater head, in which (A) is a plan view and (B) is a front view.

FIG. 5 is a bottom view showing a heater head.

FIG. 6 is a side view showing a state in which one cover of the heater head is removed.

FIG. 7 is a block diagram showing an operation control unit.

[Explanation of symbols]

 1 Component Mounting Device 3 TCP (Component) 4 Printed Circuit Board 5 Adsorption Nozzle (Holding Part) 6 Target Reference Mark 7 Camera 8 Component Mounting Head 9 Rotating Motor (Angle Adjusting Mechanism, Rotating Means) 10 Reciplocation Motor (Nozzle Inlet / Outlet Mechanism) 12 Head moving mechanism 33 Parts reference mark 60 CPU (error calculation means)

Claims (4)

[Claims] 1. A holding unit for holding a supplied component and mounting the component at a predetermined target position, and a holding unit for detecting and holding the position of a target reference mark formed near the target position. And a holding position of the target reference mark and a camera capable of simultaneously detecting the position of the target reference mark and the holding position, and the position of the target reference mark and the holding position of the component based on the holding position. An error calculating unit that calculates an error of a holding angle, an angle adjusting mechanism that adjusts an angle of the holding unit based on the holding angle error, and the component mounting based on a position of the target reference mark and a holding position of the component. And a head moving mechanism for moving the head to position the component at the target position. 2. The error calculating means calculates a component reference mark position corresponding to the component from a holding position of the component, and calculates the holding angle error using the component reference mark position. The component mounting device according to claim 1. 3. The holding section provided on the component mounting head comprises suction nozzles for holding the component by suction, the cameras are provided at two positions sandwiching the suction nozzle, and the angle adjusting mechanism includes the suction nozzle. As a rotating means to rotate,
2. The mechanism for moving the suction nozzle in and out is provided on the component mounting head, and the head moving mechanism is means for moving the component mounting head in the X-axis direction and the Y-axis direction on a work table. 2. The component mounting device according to any one of 2. 4. The component mounting apparatus according to claim 3, wherein the two cameras are arranged at diagonal positions of the component.