JPH09199400A - Semiconductor manufacturing apparatus and manufacture of semiconductor using the apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve operability by displaying an image from a microscope upon alignment on the operating screen of a computer terminal for operating the apparatus and by operating a mask stage and a wafer stage in the image displayed on the operating screen of the computer terminal. SOLUTION: A console part 1 is connected to a display part 2, an input part 3, and a storage 4, and send a control command to an illumination system control part 5, an A-scope control part 6, a mask stage control part 7, a B-scope control part 8, and a wafer stage control part to control the apparatus. The A-scope 10 is a microscope for observing an alignment mark on a mask and generates and transmits a video-signal, etc., representing the image thereof to an image input part 16. The B-scope 11 is a microscope for observing an alignment mark on a wafer and generates and transmits a video-signal, etc., representing the image thereof to the image input part 16. The image input part 16 stores the image signals from the A-scope 10 and the B-scope 11 in an internal image memory and inputs the stored signals to the console part 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus which operates via a computer terminal and a semiconductor manufacturing method using the apparatus.

[0002]

2. Description of the Related Art A semiconductor manufacturing apparatus for printing a circuit pattern on a wafer, for example, in a step, a mask or a transmission plate on which an original drawing of a circuit pattern called a reticle is drawn, a wafer is set at a predetermined position, and an illumination light is set. Is irradiated onto the wafer through a mask to print a circuit pattern. At the time of positioning (alignment) for setting the mask and the wafer, the marks (alignment marks) written on the mask and the wafer are observed with a microscope, the image is captured by a CCD camera, etc., and the deviation is detected by image processing. , Align the position. At that time, if no notable mark is detected in the captured image, the operator manually views the image from the CCD camera on the monitor and manually moves the mask stage so that the alignment mark is included in the CCD image. Move the wafer stage.

The above operation can be performed by an operation screen of a computer terminal installed in the semiconductor manufacturing apparatus, but the CCD image at the time of alignment can be viewed on a monitor installed separately.

[0004]

In the prior art, when searching for alignment marks by manual operation, the operator can operate the mask stage and wafer stage on the operation screen of the computer terminal while looking at the monitor dedicated to alignment provided separately. Since it had to be carried out, the operability was not good and it was a cause of inefficient work. The present invention takes the above problems into consideration, and in a semiconductor manufacturing apparatus, it is possible to improve the operability of the apparatus by improving the inconvenience of operating the operation screen of a computer terminal while looking at a monitor dedicated to alignment. The purpose is to

[0005]

To achieve this object, in the semiconductor manufacturing apparatus of the present invention, a computer terminal for operating the apparatus, a mask stage on which a circuit pattern mask is placed, and the mask stage are provided. Mask stage control means for controlling, wafer stage for placing a semiconductor wafer, wafer stage control means for controlling the wafer stage, mask alignment image capturing means for detecting alignment marks of the circuit pattern mask, and mask alignment image capturing Means for detecting the alignment mark of the circuit pattern mask from the image obtained by the means, a wafer alignment image capturing means for detecting the alignment mark of the semiconductor wafer, and an image of the semiconductor wafer from the image obtained by the wafer alignment image capturing means. And means for detecting gastric instrument mark,
It has a mask alignment image capturing means and a means for displaying an image obtained by the wafer alignment image capturing means on the computer terminal.

Further, in the semiconductor manufacturing method of the present invention, in this semiconductor manufacturing apparatus, an operator for the computer terminal on which the image obtained by the mask alignment image capturing means or the wafer alignment image capturing means is displayed. When the input determination step of determining an input and the input determined by the input determination step is an operation of operating the mask stage, the mask stage is moved so as to move in a movement amount and a movement direction designated by the input. The steps required of the mask stage control means,
Requesting the wafer stage control means to move the wafer stage in a movement amount and a movement direction designated by the input when the input determined by the input determination step is an input for operating the wafer stage; A step of moving the mask stage in the requested moving amount and moving direction by the mask stage control means in response to the movement request of the mask stage; and the wafer stage control means in response to the movement request of the wafer stage. And a step of moving the wafer stage in a required moving amount and moving direction.

Alternatively, an image input position detecting step of detecting a position input by an operator on an image obtained by the mask alignment image capturing means or the wafer alignment image capturing means displayed on the computer terminal. A stage movement amount calculating step for calculating a movement amount of the mask stage or the wafer stage so that the input position detected by the image input position detecting step is located at the center of the image; and the mask stage control means or the wafer stage. A step of requesting the control means to move the mask stage or the wafer stage by the movement amount calculated in the stage movement amount calculating step; and a movement of the request when the mask stage control means receives a movement request of the mask stage. Move the mask stage by the amount And extent, when the wafer stage control unit receives a request to move the wafer stage, characterized by a step of moving the wafer stage in the movement amount of the request.

With the above features, the image of the microscope at the time of alignment is displayed on the operation screen of the computer terminal for operating the apparatus, and the mask stage and wafer stage are operated on the image displayed on the operation screen of the computer terminal. It becomes possible to do.

[0009]

1 is a schematic diagram showing a configuration example of a semiconductor exposure apparatus of the present invention. In this device, an operator operates the device via a console unit 1 including a computer or the like. The console unit 1 is connected to a display unit 2 such as a CRT and a liquid crystal display, an input unit 3 such as a keyboard, a mouse, a pen input device and a touch panel, and a storage device 4 such as a hard disk and MO, and an illumination system control unit 5 and A scope control. Part 6, mask stage control part 7,
The apparatus is controlled by sending control commands to the B scope control unit 8 and the wafer stage control unit 9. The illumination system control unit 5 receives a control command from the console unit 1 and controls the illumination unit 12 that emits exposure light.
The A scope control unit 6 receives a control command from the console unit 1 and controls the A scope 10. A scope 1
Reference numeral 0 is a microscope used for alignment of the mask, and is a microscope for observing the alignment mark written on the mask, and transmits its image to the image input unit 16 as a video signal or the like. The mask stage control unit 7 receives a control command from the console unit 1, controls the mask stage 13, and operates the mask. The B-scope control unit 8 receives a control command from the console unit 1 and controls the B-scope 11. The B-scope 11, which is used during wafer alignment, is a microscope for observing the alignment marks on the wafer, and transmits its image to the image input unit 16 as a video signal or the like. The wafer stage control unit 9 receives a control command from the console unit 1, controls the wafer stage 15, and operates the wafer. The projection lens 14 is necessary when the mask pattern is reduced and printed on the wafer, and is not necessarily required when the mask pattern is not reduced. The image input unit 16 is A
Video signals from the scope 10 and the B scope 11 are taken into an internal image memory and input to the console section 1.

In the configuration example of FIG. 1, a mask alignment scope and a wafer alignment scope are separately provided, but a configuration in which both are performed by one scope is also possible. In addition, there may be a plurality of scopes for mask alignment and wafer alignment, respectively.

The flow of processing during alignment will be described below.

FIG. 2 is a flowchart for mask alignment. An image is captured by the A scope 10, and a window as shown in FIG. 6 is opened on the display unit 2 to display the captured image (step S5). At this stage, the user cannot press the buttons 19 to 27. When the image is captured, the alignment mark of the mask is detected by image processing in the console unit 1 (step S2). If the alignment mark is not in the image or cannot be detected due to rotation etc.,
In step S5, the manual operation mode is set. On the other hand, if the alignment mark of the mask is detected and it is confirmed that the alignment mark is at the designated position, the mask alignment is ended. When the alignment mark of the mask is detected but there is a deviation from the designated position, the deviation is calculated (step S3), and the mask stage is moved to correct this (step S3).
4) Return to step S1.

FIG. 3 is a subroutine corresponding to step S5 of FIG. 2, and is a flowchart of a process for manually moving the mask stage during mask alignment. When in manual operation mode,
It becomes possible to press the buttons 19 to 27 on the window 17 in FIG. 6, and the user waits for an input. Buttons 19 to 22 are buttons for moving the stage in parallel, and buttons 23 and 24 are buttons for rotating the stage, respectively. The button 25 is a button for expanding and capturing an image, and the button 26 is a button for expanding an imaging range and capturing an image. The button 27 is a button for restarting the alignment (automatic alignment) process. When the operator moves the alignment mark near the center of the image by operating the stage with the buttons 19 to 24, the operator presses the button 27 and returns to step S1 in FIG. 2 to restart the alignment process. When the button 28 is pressed, the alignment process ends.

When the user input indicates the stage operation by the buttons 19 to 24, the stage movement amount by the designated operation is calculated, the stage is moved, and the image is captured and displayed. When the image input unit 18 is pressed by the user input, the amount of movement of the stage is calculated so that the pressed position is in the center of the image display unit 18, the stage is moved, and the image is captured and displayed. To do. When the user input is button 25 or button 26, the magnification of the scope is changed and the image is captured and displayed.

FIG. 4 is a flowchart for wafer alignment. An image is captured by the B scope 11, and the window 17 as shown in FIG. 6 is opened on the display unit 2 to display the captured image as in the mask alignment. (Step S6). At this stage, the user cannot press the buttons 19 to 27. When the image is captured, the console unit 1 detects the alignment mark by image processing (step S7). If the alignment mark is not present in the image or cannot be detected due to rotation or the like, the process proceeds to step S10 to enter the manual operation mode. On the other hand, if the alignment mark is detected and it is confirmed that the alignment mark is at the designated position, the mask alignment is ended. If the alignment mark is detected but there is a deviation from the specified position, the deviation is calculated (step S8), and the mask stage is moved to correct this (step S8).
9) Return to step S6.

FIG. 5 is a subroutine corresponding to S10 of FIG. 4, and is a flowchart of a process for manually moving the wafer stage during wafer alignment. In the manual operation mode, the buttons 19 to 27 on the window shown in FIG. 6 can be pressed, and the user waits for an input. Each of the buttons 19 to 27 has the same function as in the above-mentioned mask alignment.

When the operator moves the alignment mark of the wafer near the center of the image by operating the stage with the buttons 19 to 24, the operator presses the button 27 and returns to S6 in FIG. 4 to restart the wafer alignment process. When the button 28 is pressed, the alignment process ends. When the user input indicates a stage operation using the buttons 19 to 24, the amount and direction of movement of the wafer stage by the designated operation is calculated, the stage is moved, and an image is captured and displayed. When the user presses the inside of the image display unit 18, the moving amount and the moving direction of the wafer stage are calculated so that the pressed position comes to the center of the image display unit 18, the stage is moved, and the image is moved. Capture and display. User input is button 2
5. When the button 26 is pressed, the magnification of the scope is changed to capture and display the image.

As described above, in the semiconductor exposure apparatus, an image observed by a microscope during alignment is displayed on the operation screen displayed on the display unit 2 by the console unit 1, and the stage is displayed on the displayed image. The operability of the device can be greatly improved by providing a graphical interface for operating the.

[0019]

According to the present invention, the image of the microscope at the time of alignment is displayed on the operation screen of the computer terminal for operating the apparatus, and the mask stage and the wafer are displayed on the image displayed on the operation screen of the computer terminal. It becomes possible to operate the stage. Therefore, the operability of the device can be improved and the work efficiency can be improved.

Further, by displaying the image of the microscope at the time of alignment on the operation screen of the computer terminal for operating the apparatus, a dedicated monitor is not required and the cost of the apparatus can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration example of a semiconductor exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart at the time of mask alignment in the apparatus of FIG.

FIG. 3 is a flowchart of a process for manually moving the mask stage in the apparatus shown in FIG.

4 is a flowchart at the time of wafer alignment in the apparatus of FIG.

5 is a flowchart of a process when manually moving the wafer stage in the apparatus of FIG.

6 is an example of a window for performing scope image display and stage operation in the apparatus of FIG.

[Explanation of symbols]

1: console control unit, 2: display device, 3: input device,
4: storage device, 5: illumination system control unit, 6: A scope control unit, 7: mask stage control unit, 8: B scope control unit, 9: wafer stage control unit, 10: A scope, 1
1: B scope, 12: illumination unit, 13: mask stage, 14: projection lens, 15: wafer stage, 16:
Image input unit, 17: window, 18: image display unit, 1
9 to 22: buttons for moving the stage in parallel, 23 and 24: buttons for rotating the stage, 25: button for enlarging and capturing the image, 26: button for enlarging the image capturing range and capturing the image, 27: restarting the alignment process. Button, 28: Button for ending the alignment process.

Claims (3)

[Claims] 1. A mask stage for placing a circuit pattern mask, a mask stage control means for controlling the mask stage, a wafer stage for placing a semiconductor wafer, and a wafer stage control means for controlling the wafer stage,
Mask alignment image capturing means for detecting alignment marks of the circuit pattern mask, means for detecting alignment marks of the circuit pattern mask from an image obtained by the mask alignment image capturing means, and alignment mark detecting means for detecting alignment marks of the semiconductor wafer. In a semiconductor manufacturing apparatus which comprises a wafer alignment image capturing means and a means for detecting an alignment mark of the semiconductor wafer from an image obtained by the wafer alignment image capturing means, and which is operated through a computer terminal, the mask alignment image capturing And a means for displaying an image obtained by the wafer alignment image capturing means on the computer terminal. 2. A computer terminal for operating the apparatus, a mask stage on which a circuit pattern mask is placed, mask stage control means for controlling the mask stage, a wafer stage on which a semiconductor wafer is placed, and the wafer stage is controlled. A wafer stage control means, a mask alignment image capturing means for detecting the alignment mark of the circuit pattern mask, a means for detecting the alignment mark of the circuit pattern mask from an image obtained by the mask alignment image capturing means, and the semiconductor A wafer alignment image capturing means for detecting a wafer alignment mark; and a means for detecting the alignment mark of the semiconductor wafer from an image obtained by the wafer alignment image capturing means, the mask alignment image capturing means, And a semiconductor manufacturing method using a semiconductor manufacturing apparatus having a means for displaying the image obtained by the wafer alignment image capturing means on the computer terminal, the image obtained by the mask alignment image capturing means or the wafer alignment image capturing means When the input discriminating step for discriminating the input from the operator to the computer terminal in which is displayed, and the input discriminated by the input discriminating step is an input for operating the mask stage, the movement amount designated by the input And a step of requesting the mask stage control means to move the mask stage in the moving direction, and when the input discriminated in the input discriminating step is an input for operating the wafer stage, the movement designated by the input Move the wafer stage in quantity and direction of movement Requesting the wafer stage control means to move the mask stage in the requested moving amount and moving direction in response to the mask stage moving request. And a step of moving the wafer stage in a requested moving amount and moving direction according to a moving request of the wafer stage. 3. A computer terminal for operating the apparatus, a mask stage for placing a circuit pattern mask, mask stage control means for controlling the mask stage, a wafer stage for placing a semiconductor wafer, and controlling the wafer stage. A wafer stage control means, a mask alignment image capturing means for detecting the alignment mark of the circuit pattern mask, a means for detecting the alignment mark of the circuit pattern mask from an image obtained by the mask alignment image capturing means, and the semiconductor A wafer alignment image capturing means for detecting a wafer alignment mark; and a means for detecting the alignment mark of the semiconductor wafer from an image obtained by the wafer alignment image capturing means, the mask alignment image capturing means, And a semiconductor manufacturing method using a semiconductor manufacturing apparatus having a means for displaying an image obtained by the wafer alignment image capturing means on the computer terminal, the mask alignment image capturing means or the wafer being displayed on the computer terminal. An image input position detecting step of detecting a position input by an operator on the image obtained by the alignment image capturing means, and an input position detected by the image input position detecting step are located at the center of the image. A stage movement amount calculating step of calculating a movement amount of the mask stage or the wafer stage; and the mask stage or wafer stage with the movement amount calculated by the mask stage control means or the wafer stage control means in the stage movement amount calculating step. Move Requesting that the mask stage be moved, the mask stage control unit moving the mask stage by a required movement amount in response to the movement request of the mask stage, and the wafer stage control unit requesting the movement of the wafer stage. And a step of moving the wafer stage by a required movement amount according to the above.