JPH09197990A - Electronic component embedded molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the electronic component embedded molding which is easily manufacture, and made thin and small-sized by uniting an electronic component fitted to a substrate and molding resin together. SOLUTION: This molding is equipped with a chip type light emitting element 20 which is provided with electrode terminals 21 and 21 and a flexible substrate 10 which is provided with terminal patterns 13 and 13 on the top surface; and the chip type light emitting element 20 is mounted on the flexible substrate 10, the electrode terminals 21 and 21 and terminal patterns 13 and 13 are connected with a conductive adhesive 15, and a UV setting type light-transmissive resin material 30 is applied so as to cover the top of the chip type light emitting element 20, and set. Directly on the flexible substrate 10, a lighttransmissive molding resin material 60 is formed so that it is adhered with the adhesive layer 35 provided on the flexible substrate 10 at the periphery of the resin material 30.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component-embedded molded product obtained by embedding an electronic component such as a light emitting element mounted on a substrate in a mold resin material.

[0002]

Conventionally, for example, in order to illuminate a key top with a light emitting element, the light emitting element mounted on a substrate is placed under the key top made of a light-transmissive mold resin material, and the light emitting element is illuminated. The light emitted from the element was introduced into the key top.

However, in this method, the key top, the substrate, and the light emitting element are separate parts, so that the assembly is complicated and the thickness increases. In addition, since the light emitted from the light emitting element is emitted into the air and then enters the key top again, there is a large amount of light leakage, which is not efficient.

On the other hand, a light emitting element is usually formed by covering the periphery of a light emitting portion (functional portion) with a general-purpose molding resin. However, in order to solve the above problems, only the light emitting portion of the light emitting element is directly attached. A method of mounting on a substrate and molding a keytop-shaped molding resin directly around the light emitting portion of the substrate has also been considered. According to this method, the substrate, the light emitting portion, and the key top are integrated with each other, so that the device can be made thin and compact, and there is no light leakage.

However, in this method, a general mass-produced light emitting element, that is, a light emitting element in which the periphery of the light emitting portion is covered with a general-purpose molding resin and the electrode terminals are exposed on the surface cannot be used, so that the production cost is high. turn into. In addition, since the light emitting part is mechanically weak, it is not possible to use a high-temperature and high-pressure molten mold resin for injection molding as the mold resin.
The production cost could not be reduced.

The above problems are not limited to the case of the key top. For example, even when a predetermined portion of an outer case made of mold resin is made to emit light from the back side thereof, a light emitting element is provided on the back side of the outer case. The attached substrate had to be installed, and like the above keytop, the assembly was complicated, the thickness was increased, and light was leaked.

Further, when the board on which electronic parts other than the light emitting element are mounted is arranged on the lower side of the key top or the case, the assembly is complicated and the thickness cannot be reduced.

The present invention has been made in view of the above points, and an object thereof is to integrate an electronic component mounted on a substrate and a molding resin into one piece, thereby facilitating manufacture and reducing the thickness and size of an electronic device. It is to provide molded products with embedded parts.

[0009]

In order to solve the above problems, the present invention comprises an electronic component having electrode terminals and a substrate having a terminal pattern on the upper surface thereof, and the electronic component is provided on the substrate. The electrode component of the electronic component is placed and connected to the terminal pattern of the substrate, a resin material is applied and cured so as to cover the upper portion of the electronic component, and further on the substrate around the resin material or the resin. An electronic component-embedded molded article was constructed by molding a mold resin material on the substrate so that the resin was adhered by an adhesive layer provided on the material.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing a first embodiment in which the present invention is applied to an illuminated key top. FIG. 1 (a) is a plan view and FIG. 1 (b) is a sectional view taken along line AA of FIG. 1 (a). is there. As shown in the figure, this illuminated key top is
The chip-type light emitting element 20 is attached on the flexible substrate 10, and a keytop-shaped molding resin material 60 is molded so as to cover the chip-type light emitting element 20. The structure of each part of the illuminated key top will be described below together with its manufacturing method.

2 and 3 are views showing a method of manufacturing the illuminated key top. That is, in order to manufacture this illuminated key top, first, as shown in FIGS. 1 and 2A, a flexible synthetic resin film (for example, a thickness of 38 to 3) is used.
50 μm polyethylene terephthalate film) 11
A flexible substrate 10 having two terminal patterns 13 and 13 formed thereon is screen-printed with silver paste or the like, and anisotropic hot-melt type conductive material is formed so as to cover the terminal patterns 13 and 13. Adhesive 1
5. Screen print 5. Circuit patterns 14 and 14 are connected to the terminal patterns 13 and 13, respectively. The terminal patterns 13 and 13 and the circuit patterns 14 and 14
Needless to say, it may be formed by another method such as etching.

The conductive adhesive 15 is made of a polyester thermoplastic resin (other resin may be used as long as it is a thermoplastic resin) mixed with metal powder (eg copper powder, silver powder) and a solvent. I am using.

Then, the conductive adhesive 15 is placed in an atmosphere of 150 ° C. for 5 minutes to volatilize the solvent in the conductive adhesive 15 and dry it. At this time, since the surface of the conductive adhesive 15 is not covered with anything, it is easy to volatilize the solvent, and not only the surface of the conductive adhesive 15 but also the solvent inside thereof can be easily and completely removed in a short time. Volatilize.

Next, as shown in FIGS. 2A and 1, an adhesive layer 35 is printed in a substantially ring shape on the flexible substrate 10 around the conductive adhesive 15. As a material for the adhesive layer 35, a thermosetting adhesive or a hot melt adhesive is used.

Next, as shown in FIG. 2B, the chip type light emitting device 20 is placed on the conductive adhesive 15. At this time, the electrode terminals 21 and 21 provided from the both side surfaces to the lower surface of the chip type light emitting device 20 are respectively connected to the terminal pattern 1
Located directly above 3,13. The length × width × height dimensions of the chip type light emitting device 20 used in this embodiment are 1.
It is 6 × 0.8 × 0.8 mm.

Next, the chip type light emitting device 2 shown in FIG.
0 is brought into contact with a rubber-made supporting member (not shown), and then a heat press (not shown) is pressed against the lower surface of the flexible substrate 10 so as to press upward, thereby providing an anisotropic hot-melt type conductive adhesive. 15 is melted and pressed, whereby the electrode terminals 21 and 21 and the terminal patterns 13 and 13 are electrically connected and mechanically fixed.

Then, as shown in FIG. 2C, a resin material 30 made of a UV-curing (ultraviolet-curing) insulating adhesive is placed on the chip-type light-emitting element 20 and sealed, and then the resin material 30 is sealed. Is placed in a UV furnace and irradiated with ultraviolet rays to be solidified. Since this resin material 30 is UV curable, it is transparent.

This completes the attachment of the chip type light emitting device 20 to the flexible substrate 10.

Then, as shown in FIG. 3A, the upper and lower sides of the flexible substrate 10 are clamped by the upper and lower molds A and B.

Next, a high temperature and high pressure molten mold resin is pressed into the cavity A1 provided in the upper mold A. The molten mold resin is press-fitted from a gate A3 connected to a cavity A2 provided so as to project like a tongue from a side portion of the cavity A1 of the upper mold as shown in FIG. 3 (b). . The cross section of FIG. 3B corresponds to the BB cross section shown in FIG.

As shown in FIG. 3C, a gate B3 is provided on the lower die B side, and in this case, the flexible substrate 10 is provided.
The through hole 17 is provided in the
The molten mold resin through the cavities A2, A1
It may be configured to fill the inside.

Here, as the material of the mold resin material 60, a transparent synthetic resin such as PMMA (polymethylmethacrylate), polycarbonate (PC), or a mixture of polycarbonate (PC) and polyethylene terephthalate (PET). Use material.

After the molten mold resin press-fitted into the cavities A1 and A2 is solidified, the upper and lower molds A and B are removed, and as shown in FIG.
The mold resin material 60 is adhered and fixed by the adhesive layer 35 on the top.

Then, as required, the surface of the mold resin material 60 is covered with an opaque paint 65 having a desired pattern (see FIG. 1).
By applying (b), the illuminated key top according to the present embodiment is completed. The application of the non-transparent paint 65 is not always necessary.

When the chip-type light emitting element 20 is caused to emit light, the light directly passes through the translucent resin material 30 and the molding resin material 60, and efficiently illuminates the surface of the illuminated keytop brightly.

Then, as shown in FIG. 4 (a), a UV curable synthetic resin is printed and solidified on the lower surface of the flexible substrate 10 so as to press the switch mechanism 80.
(The thickness is, for example, 150 to 300 μm), or as shown in FIG.
If a rubber sheet 68 provided with a protrusion 69 for pressing the switch mechanism 80 is arranged on the lower surface of the switch, and the illuminated key top is pressed, the switch mechanism 80 is pressed and turned on and off.

The push rod portion 67 and the rubber sheet 68 may have other structures, and are not always necessary.
A structure in which the lower surface of 0 directly presses the switch mechanism 80 may be used.

FIG. 5 is a schematic side sectional view of a main part showing a second embodiment of the present invention. In this embodiment, an example is shown in which the light emitting element and the substrate are integrally molded in a cabinet made of synthetic resin for exterior of electronic equipment such as a video deck.
The same or corresponding parts as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in the figure, in the case of this embodiment, first, the chip type light emitting device 20 is attached to a predetermined portion of the flexible substrate 10 by the same method as in the first embodiment, an adhesive layer 35 is printed, and UV is applied. A curable, translucent resin material 30 is applied and solidified.

Next, this is sandwiched by upper and lower molds (not shown) for molding the cabinet, and a light-transmissive molten mold resin is press-fitted into a cavity formed by the upper and lower molds. Then, after the molten mold resin is solidified, the upper and lower molds are removed, and then a desired non-transparent paint 65 'is masked on the surface of the mold resin material 60' (or laser cutting after the entire surface is coated). A cabinet in which the light emitting element shown in FIG.

When the chip-type light emitting element 20 is caused to emit light, the light is directly transmitted through the light-transmitting resin material 30 and the mold resin material 60 ', and the non-light-transmitting paint 65 on the surface of the cabinet is efficiently provided. Brightly illuminate the parts that do not have ‘printed.

FIG. 6 is a schematic side sectional view of a main portion showing a third embodiment of the present invention. In this embodiment, an example is shown in which the light emitting element and the substrate are integrally molded in a mold resin material serving as a light guide, and the mold resin material is further attached to a synthetic resin for a cabinet. The same or corresponding parts as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in the figure, in the case of this embodiment, first, the chip type light emitting device 20 is attached to a predetermined portion of the flexible substrate 10 by the same method as in the first embodiment, an adhesive layer 35 is applied, and UV is applied. A curable, translucent resin material 30 is applied and solidified.

Next, as in the first embodiment, the adhesive layer 3
A translucent mold resin material 60 is molded and integrated so as to cover the portion coated with 5 and the resin material 30.

Next, the flexible substrate 10 to which the mold resin material 60 is attached is sandwiched by upper and lower molds (not shown) for molding the cabinet 70, and an opaque molten mold resin is placed in the cavity formed by the upper and lower molds. (Any thermoplastic synthetic resin such as ABS) is injected. If the upper and lower molds are removed after the molten mold resin is solidified, as shown in FIG.
The cabinet 70 in which the light emitting element 20 and the mold resin material 60 shown in FIG.

When the chip-type light emitting element 20 is caused to emit light, the light passes through the mold resin material 60 serving as a light guide member and efficiently exposes the portion of the surface of the cabinet 70 where the mold resin material 60 is exposed. Illuminate brightly.

It is to be noted that only the cabinet 70 shown in FIG. 6 to which the molding resin material 60 and the like are not attached is separately preliminarily molded, and the flexible substrate 10 integrally molded with the molding resin 60 is bonded to the cabinet 70 later. You may comprise so that it may attach with a chemical | medical agent.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications such as the following are possible. In each of the above-described embodiments, the adhesive layer 35 is applied on the substrate 10 around the resin material (UV curing type insulating adhesive) 30 that covers the upper portion of the light emitting element 20, but the adhesive layer 35 is the resin material 30.
Needless to say, it may be applied only to the upper surface of the above, or may be applied simultaneously to the upper surface of the resin material 30 and the upper surface of the substrate 10 around the resin material 30.

In each of the above embodiments, the chip type light emitting element 20 is used as the embedded electronic component, but the electronic component may be a light receiving element other than the light emitting element 20 or another electronic component.
Further, the electronic component is not necessarily a chip type and may have a structure in which a metal terminal piece is projected.

In each of the above embodiments, the flexible substrate 1
Although 0 is used, a hard laminated substrate or the like may be used instead.

In each of the above-described embodiments, the example in which the electrode terminal 21 of the light emitting element 20 and the terminal pattern 13 of the substrate 10 are connected by the hot melt type conductive adhesive 15 is shown.
The connection method is not limited to this embodiment, and various other methods such as connection using low-temperature solder can be used.

Since the light emitting element 20 is used as an electronic component in each of the above embodiments, both the resin material 30 and the mold resin material 60 for covering the light emitting element 20 are made of a light transmissive material.
Depending on the electronic component, these materials do not necessarily have to be translucent.

[0043]

As described in detail above, the present invention has the following excellent effects. Since the electronic components attached to the board and the mold resin material that covers them are integrated, the assembly work required when these components are separate is not required, which not only facilitates their manufacturing but also makes them thinner. It can be miniaturized.

In particular, when a chip-type light emitting element is used as an electronic component and both the resin material and the mold resin material covering the same are transparent materials, the light emitted from the light emitting element is directly injected into the mold resin. Since the light enters the material, there is no light leakage and efficient use of light can be achieved.

[Brief description of drawings]

1A and 1B are diagrams showing a first embodiment in which the present invention is applied to an illuminated key top, where FIG. 1A is a plan view and FIG.
FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 2 is a diagram showing a method of manufacturing an illuminated key top.

FIG. 3 is a diagram showing a method for manufacturing an illuminated key top.

FIG. 4 is a diagram showing an example of use of an illuminated key top.

FIG. 5 is a schematic side sectional view of an essential part showing a second embodiment of the present invention.

FIG. 6 is a schematic side sectional view of an essential part showing a third embodiment of the present invention.

[Explanation of symbols]

 10 Flexible Board 13 Terminal Pattern 15 Conductive Adhesive 20 Chip Type Light Emitting Element (Electronic Component) 21 Electrode Terminal 30 Resin Material 35 Adhesive Layer 60 Mold Resin Material

Claims (2)

[Claims] 1. An electronic component provided with an electrode terminal, and a substrate having a terminal pattern provided on an upper surface thereof. The electronic component is placed on the substrate and the electrode terminal of the electronic component and the terminal pattern of the substrate. And a resin material is applied and cured so as to cover the upper part of the electronic component, and further adhered by an adhesive layer provided on the substrate around the resin material or on the resin material. An electronic component-embedded molded product, characterized in that a molded resin material is molded on a substrate. 2. The electronic component is a chip-type light emitting element or light receiving element, and both the resin material and the mold resin material are formed of a translucent material. The electronic component embedded molding described.