JPH09197981A - Led display device - Google Patents

Led display device

Info

Publication number
JPH09197981A
JPH09197981A JP8010341A JP1034196A JPH09197981A JP H09197981 A JPH09197981 A JP H09197981A JP 8010341 A JP8010341 A JP 8010341A JP 1034196 A JP1034196 A JP 1034196A JP H09197981 A JPH09197981 A JP H09197981A
Authority
JP
Japan
Prior art keywords
cover member
led
display device
led display
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8010341A
Other languages
Japanese (ja)
Inventor
Rikio Shiratori
力男 白鳥
Norio Fukuda
宣男 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Signal Co Ltd
Original Assignee
Nippon Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Signal Co Ltd filed Critical Nippon Signal Co Ltd
Priority to JP8010341A priority Critical patent/JPH09197981A/en
Publication of JPH09197981A publication Critical patent/JPH09197981A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate the maintenance of other components such as a cooling fan which cools an LED element and make the device itself thin and small-sized. SOLUTION: The surface of an LED element 20 is brought into contact with the internal surface of a cover member 16 or a metal plate which has high heat conductivity is interposed between the cover member 16 and an LED element unit 18 to radiate the heat generated by the LED element 20 to the outside through the cover member 16 or/and the metal plate.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】この発明は、駅や空港や道路
等において、発光ダイオード（以下、ＬＥＤと略す）を
用いて旅客や運転者に案内・情報・サービスを提供でき
るＬＥＤ表示装置に関し、特にＬＥＤによって発生され
る熱を放熱冷却するようにしたＬＥＤ表示装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display device capable of providing guidance, information and services to passengers and drivers by using light emitting diodes (hereinafter abbreviated as LEDs) at stations, airports, roads, etc. The present invention relates to an LED display device that radiates and cools heat generated by LEDs.

【０００２】[0002]

【従来の技術】ＬＥＤ表示装置は、ＬＥＤ表示本体に多
数のＬＥＤをマトリックス状に配列したものである。そ
して、ＬＥＤが発生する熱によりＬＥＤ自体の表面温度
は、６０゜にも達してしまう。通常のＬＥＤの動作温度
は、−２０゜〜＋６０゜の範囲であるので、多数のＬＥ
Ｄの発熱により更に温度が上昇し、ＬＥＤ自体が故障し
てしまうか寿命が半減してしまうこととなる。従って、
ＬＥＤを冷却する必要があり、ファンを用いて冷却する
表示器の冷却装置が特開平４−３４５１９２号公報に開
示されている他、冷却流体を用いてＬＥＤを冷却する技
術が特開平４−９７１９４号公報に開示されている。2. Description of the Related Art An LED display device has a large number of LEDs arranged in a matrix on an LED display body. The surface temperature of the LED itself reaches 60 ° due to the heat generated by the LED. Since the operating temperature of a normal LED is in the range of -20 ° to + 60 °, a large number of LEs are used.
Due to the heat generated by D, the temperature further rises, and the LED itself may fail or the life may be halved. Therefore,
A cooling device for an indicator, which needs to cool the LED and is cooled by using a fan, is disclosed in JP-A-4-345192, and a technique for cooling the LED by using a cooling fluid is JP-A-4-97194. It is disclosed in the publication.

【０００３】特開平４−３４５１９２号公報に開示のフ
ァンを用いてＬＥＤを冷却する技術は、単にファンを外
気取入れ口に設けてＬＥＤを冷却するのでは、外気の塵
や水分を同時に吸込み、塵等がＬＥＤに付着しＬＥＤが
腐食するのを防止するため、防塵用のフィルタを外気取
入れ口に設けた構成をしている。In the technique of cooling an LED using a fan disclosed in Japanese Patent Laid-Open No. 4-345192, if a fan is simply provided at an outside air intake port to cool the LED, dust and water in the outside air are sucked in at the same time. In order to prevent the LED and the like from adhering to the LED and corroding the LED, a dustproof filter is provided at the outside air intake port.

【０００４】しかし、この技術では、ファン自体および
防塵用フィルタが汚れたり、故障したりするため、ファ
ンおよび防塵用フィルタのメンテナンスが必要となって
くるため非常に煩わしい。また、冷却用のファンおよび
防塵用フィルタによりＬＥＤ表示装置自体が大型化して
しまう。However, this technique is very troublesome because the fan itself and the dustproof filter are contaminated or damaged, and maintenance of the fan and dustproof filter is required. Further, the cooling fan and the dustproof filter increase the size of the LED display device itself.

【０００５】また、特開平４−９７１９４号に開示の技
術は、前述したように冷却流体により行うものであるた
め、流体経路および流体を送り出すポンプが必要とな
り、前記技術と同様にポンプ等のメンテナンスが必要と
なる他、表示装置自体が大型化してしまう。Further, since the technique disclosed in Japanese Patent Laid-Open No. 4-97194 is performed by using a cooling fluid as described above, a fluid path and a pump for delivering the fluid are required, and like the above technique, maintenance of the pump and the like is required. In addition, the display device itself becomes large.

【０００６】[0006]

【発明が解決しようとする課題】本発明は上記点に着目
してなされたものであって、簡単な構成でＬＥＤの発熱
を放熱することができるようにし、ＬＥＤ表示装置以外
の冷却ファン等の他の部品のメンテナンスを行うことも
必要なく、かつ装置自体を薄型に構成することができる
ＬＥＤ表示装置を提供することを課題とするものであ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and enables heat generation of an LED to be dissipated with a simple structure, and a cooling fan or the like other than the LED display device can be provided. It is an object of the present invention to provide an LED display device that does not require maintenance of other components and that can be configured thinly.

【０００７】[0007]

【課題を解決するための手段】上記課題を解決するため
本発明は、箱体（１２）に窓部（１４）を有し、該窓部
（１４）に透過性を有するカバー部材（１６）を設け、
該カバー部材（１６）に対面するようＬＥＤ素子ユニッ
ト（１８）を内部に設けたＬＥＤ表示装置であって、前
記カバー部材（１６）を熱伝導性を有する材質とし、前
記ＬＥＤ素子ユニット（１８）にマトリックス状に配列
された多数のＬＥＤ素子（２０，２０）の表面を、前記
カバー部材（１６）の内側面に接触させてなり、もっ
て、前記ＬＥＤ素子（２０，２０）から発生した熱を、
前記カバー部材（１６）を介して外部に放熱冷却させる
ようにしたＬＥＤ表示装置とした。In order to solve the above-mentioned problems, the present invention has a box (12) having a window (14), and the window (14) has a transparent cover member (16). Is provided
An LED display device in which an LED element unit (18) is provided so as to face the cover member (16), wherein the cover member (16) is made of a material having thermal conductivity, and the LED element unit (18) is provided. The surface of a large number of LED elements (20, 20) arranged in a matrix is brought into contact with the inner side surface of the cover member (16), so that the heat generated from the LED elements (20, 20) is absorbed. ,
The LED display device is designed to be cooled by radiating outside through the cover member (16).

【０００８】第２の発明として、箱体（１２）に窓部
（１４）を有し、該窓部（１４）に透過性を有するカバ
ー部材（１６）を設け、該カバー部材（１６）に対面す
るようＬＥＤ素子ユニット（１８）を内部に設けたＬＥ
Ｄ表示装置であって、前記ＬＥＤ素子ユニット（１８）
にマトリックス状に配列された多数のＬＥＤ素子（２
０，２０）が挿入される嵌合孔（３０，３０）を有し、
前記カバー部材（１６）と前記ＬＥＤ素子ユニット（１
８）間に介在される熱伝導板（２６）と、前記熱伝導板
（２６）の周囲に配し、前記箱体（１２）と接触する熱
伝導性を有するパッキン（２８）と、を有し、前記ＬＥ
Ｄ素子（２０，２０）の表面を前記カバー部材（１６）
の内側面に接触させて、前記ＬＥＤ素子（２０，２０）
から発生した熱を、前記熱伝導板（２６）、前記パッキ
ン（２８）および前記カバー部材（１６）を介して外部
に放熱冷却させるようにしたＬＥＤ表示装置とした。As a second invention, the box (12) has a window (14), and the window (14) is provided with a transparent cover member (16). LE with LED element unit (18) provided inside to face each other
A D display device, wherein the LED element unit (18)
A large number of LED elements (2
0, 20) has a fitting hole (30, 30) to be inserted,
The cover member (16) and the LED element unit (1
8) a heat conduction plate (26) interposed between the heat conduction plate (26) and a packing (28) having heat conductivity arranged around the heat conduction plate (26) and in contact with the box body (12). And the LE
The surface of the D element (20, 20) is covered with the cover member (16).
To contact the inner surface of the LED element (20, 20)
The LED display device is configured to radiate and cool the heat generated from the outside through the heat conduction plate (26), the packing (28) and the cover member (16).

【０００９】前記カバー部材（１６）としては、透過性
を有する薄い樹脂、例えばポリカーボネートであっても
よく、ガラスに熱伝導性を有する金属粉（２２）を混入
させるようにしてもよく、またガラスの少なくとも内側
面に透過性を有する金属箔（２４）を張り付けるように
してもよい。The cover member (16) may be made of a thin resin having transparency, such as polycarbonate, or may be made by mixing a metal powder (22) having heat conductivity into glass. A transparent metal foil (24) may be attached to at least the inner surface of the metal foil.

【００１０】前記熱伝導板（２６）としては、熱伝導率
の高い金属であればよい。特に、熱伝導率が高く、かつ
比較的安価な材料が好ましく、例えばアルミニウム、銅
などが好ましい。The heat conducting plate (26) may be any metal having a high heat conductivity. In particular, a material that has a high thermal conductivity and is relatively inexpensive is preferable, and for example, aluminum or copper is preferable.

【００１１】[0011]

【作用】ＬＥＤ素子（２０，２０）の面をカバー部材
（１６）の内面に接触させ、あるいはカバー部材（１
６）とＬＥＤ素子ユニット（１８）間に熱伝導板（２
６）を介在させるようにすることにより、ＬＥＤ素子
（２０，２０）により発生した熱を、カバー部材（１
６）および／または熱伝導板（２６）を介して外部に放
熱させる。The surface of the LED element (20, 20) is brought into contact with the inner surface of the cover member (16), or the cover member (1
6) and the LED element unit (18) between the heat conduction plate (2
By interposing 6), the heat generated by the LED elements (20, 20) is transferred to the cover member (1).
6) and / or heat is radiated to the outside through the heat conducting plate (26).

【００１２】[0012]

【発明の実施の形態】以下、本発明を図面に示す一実施
例に基づき詳細に説明する。図１はＬＥＤ表示装置（１
０）の外観を示した図であり、（１２）は中空状の箱体
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on one embodiment shown in the drawings. FIG. 1 shows an LED display device (1
It is a figure showing appearance of (0), and (12) is a hollow box.

【００１３】箱体（１２）の表面側には窓部（１４）が
形成され、該窓部（１４）には防水用のカバー部材（１
６）が設けられている。箱体（１２）の内部にはＬＥＤ
素子を有する複数のＬＥＤ素子ユニット（１８，１８）
が窓部（１４）側に設けられている。A window portion (14) is formed on the front surface side of the box body (12), and a waterproof cover member (1) is formed in the window portion (14).
6) is provided. LED inside the box (12)
Multiple LED element units (18, 18) having elements
Is provided on the window (14) side.

【００１４】図２は図１のＩＩ−ＩＩ線拡大断面図であ
り、本発明に係るＬＥＤ表示装置（１０）の第１実施例
を示すものである。すなわち、各ＬＥＤ素子ユニット
（１８，１８）にマトリックス状に多数配列されている
ＬＥＤ素子（２０，２０）の表面をカバー部材（１６）
の裏面に直接接触させる構造をしている。従って、カバ
ー部材（１６）とＬＥＤ素子（２０，２０）との間に
は、隙間がなくなり、熱伝導性の悪い空気の介在が少な
くなるよう配慮されている。FIG. 2 is an enlarged sectional view taken along line II-II of FIG. 1, showing a first embodiment of the LED display device (10) according to the present invention. That is, the surface of the LED elements (20, 20) arranged in a matrix in each LED element unit (18, 18) is covered with a cover member (16).
The structure is such that it directly contacts the back surface of. Therefore, it is considered that there is no gap between the cover member (16) and the LED element (20, 20), and the inclusion of air having poor heat conductivity is reduced.

【００１５】カバー部材（１６）としては、透過性を有
し、かつ熱伝導率の高い材料を使用するのが好ましく、
例えば、従来使用されているガラス板を用いるようにす
る。その他、熱伝導率としてはあまり高くはないが、薄
い板状とすれば効果が上がるポリカーボネート等の透過
性樹脂を用いるようにしてもよい。As the cover member (16), it is preferable to use a material having permeability and high thermal conductivity,
For example, a conventionally used glass plate is used. In addition, although the thermal conductivity is not so high, a permeable resin such as polycarbonate, which is more effective if formed into a thin plate, may be used.

【００１６】図２に示した第１実施例は前述したような
構造をしているため、ＬＥＤ素子（２０，２０）が発熱
した熱は、カバー部材（１６）を伝わって外に放熱され
る。従って、箱体（１２）の内部の温度はこもることは
なく、ＬＥＤ素子（２０，２０）の温度は冷却されるこ
ととなる。Since the first embodiment shown in FIG. 2 has the structure as described above, the heat generated by the LED elements (20, 20) is transmitted to the outside through the cover member (16). . Therefore, the temperature inside the box body (12) does not remain, and the temperature of the LED elements (20, 20) is cooled.

【００１７】具体的な実験を行ったところ、カバー部材
（１６）として、ガラスまたは薄いポリカーボネートを
用いたところ、ＬＥＤ素子（２０，２０）の表面をカバ
ー部材（１６）の裏面に接触させないで隙間が形成され
るよう離隔して設けた場合に比較して、本発明のように
接触させた場合の方が、箱体（１２）の内部の温度は約
３゜〜４゜低くなった。In a concrete experiment, when glass or thin polycarbonate was used as the cover member (16), the front surface of the LED element (20, 20) was not contacted with the back surface of the cover member (16) and a gap was formed. The temperature inside the box body (12) was lower by about 3 ° to 4 ° in the case of contacting as in the present invention, as compared with the case of providing them so as to be separated from each other.

【００１８】特に、薄いポリカーボネートをカバー部材
（１６）として用いた場合は、ＬＥＤ素子（２０，２
０）より伝わった熱が散乱し、該熱が均一化され、特定
のＬＥＤ素子（２０，２０）が損傷を受けることがなか
った。In particular, when thin polycarbonate is used as the cover member (16), the LED elements (20, 2)
The heat transmitted from 0) was scattered, the heat was made uniform, and the specific LED element (20, 20) was not damaged.

【００１９】図３はカバー部材（１６）の他の実施例で
あって、ガラスの内部に熱伝導率の高い金属粉（２２）
を混入した例を示したものである。金属粉（２２）とし
ては、熱伝導の良い物質が良く、例えば、アルミニウ
ム、銅などが良い。ガラス自体でも熱伝導性が良いが、
金属粉（２２）を混入することによりさらに熱伝導性が
良くなり、ＬＥＤ素子（２０，２０）が発生した熱は、
金属粉（２２）混入のカバー部材（１６）を介して直接
外部に放熱される。FIG. 3 shows another embodiment of the cover member (16), in which a metal powder (22) having a high thermal conductivity is provided inside the glass.
This is an example in which is mixed. The metal powder (22) is preferably a substance having good heat conductivity, such as aluminum or copper. The glass itself has good thermal conductivity,
By mixing the metal powder (22), the thermal conductivity is further improved, and the heat generated by the LED elements (20, 20) is
The heat is directly radiated to the outside through the cover member (16) mixed with the metal powder (22).

【００２０】図４は金属箔（２４）をカバー部材（１
６）の面に張り付けた例を示したものである。この場
合、金属箔（２４）はカバー部材（１６）の透過性に影
響を与えない程度に薄いものがよい。金属箔（２４）
は、カバー部材（１６）の内面（裏面）側のみに設けて
もよく、また、表面側および内面側の両方に張り付ける
ようにしてもよい。金属箔（２４）としては、錫箔等が
用いられる。In FIG. 4, the metal foil (24) is covered with the cover member (1
6 shows an example of sticking to the surface of 6). In this case, the metal foil (24) is preferably thin so as not to affect the transparency of the cover member (16). Metal foil (24)
May be provided only on the inner surface (back surface) side of the cover member (16), or may be attached to both the front surface side and the inner surface side. A tin foil or the like is used as the metal foil (24).

【００２１】図５は本発明の第２実施例を示したもので
あって、図２に示した第１実施例に対して、カバー部材
（１６）とＬＥＤ素子ユニット（１８，１８）との間に
熱伝導性を有する熱伝導板（２６）を介在させたもので
ある。FIG. 5 shows a second embodiment of the present invention, which is different from the first embodiment shown in FIG. 2 in that a cover member (16) and an LED element unit (18, 18) are provided. A heat conductive plate (26) having heat conductivity is interposed therebetween.

【００２２】熱伝導板（２６）の材質としては、熱伝導
率の高い材質のものであれば、どのようなものであって
もよいが、好ましくは金属板、具体的にはアルミニウム
板、銅板等が挙げられる。その他、ガラス板、熱伝導性
を良くした合成樹脂板であってもよい。さらに、ガラス
板または合成樹脂板に金属粉を混入するようにしてもよ
い。The material of the heat conduction plate (26) may be any material as long as it has a high heat conductivity, but is preferably a metal plate, specifically, an aluminum plate or a copper plate. Etc. In addition, a glass plate or a synthetic resin plate having good thermal conductivity may be used. Further, metal powder may be mixed into the glass plate or the synthetic resin plate.

【００２３】熱伝導板（２６）の周囲は、熱伝導性を有
するパッキン（２８）を介して箱体（１２）に接触する
ようにしている。The periphery of the heat conducting plate (26) is in contact with the box body (12) through a packing (28) having heat conductivity.

【００２４】図６および図７に詳細に示すように、熱伝
導板（２６）には、ＬＥＤ素子（２０，２０）が嵌まり
込むための嵌合孔（３０，３０）が多数形成されてい
る。As shown in detail in FIGS. 6 and 7, the heat conducting plate (26) is provided with a large number of fitting holes (30, 30) into which the LED elements (20, 20) are fitted. There is.

【００２５】このようにＬＥＤ素子（２０，２０）は、
熱伝導板（２６）の嵌合孔（３０，３０）に嵌まり込
み、かつＬＥＤ素子（２０，２０）の先端面はカバー部
材（１６）の内面側に接触しているため、ＬＥＤ素子ユ
ニット（１８）とカバー部材（１６）間には隙間がなく
なり、熱伝導率の悪い空気を排除することができる。Thus, the LED elements (20, 20) are
The LED element unit is fitted in the fitting holes (30, 30) of the heat conduction plate (26) and the tip end surface of the LED element (20, 20) is in contact with the inner surface side of the cover member (16). Since there is no gap between (18) and the cover member (16), it is possible to eliminate air having poor thermal conductivity.

【００２６】ＬＥＤ素子（２０，２０）から発生した熱
は、熱伝導板（２６）を伝って、パッキン（２８）を介
して箱体（１２）に伝わり外気に放熱されるとともに、
ＬＥＤ素子（２０，２０）の先端面はカバー部材（１
６）の内面に接触しているので、図２に示した第１実施
例と同様にカバー部材（１６）を介して外気に放熱され
る。従って、ＬＥＤ素子（２０，２０）より発生した熱
は、単にカバー部材（１６）にＬＥＤ素子（２０，２
０）の面を接触させた第１実施例よりも放熱効果が高く
なり好ましい。The heat generated from the LED elements (20, 20) is transmitted to the box body (12) through the heat conduction plate (26) and the packing (28) and is radiated to the outside air.
The front end surface of the LED element (20, 20) is a cover member (1
Since it is in contact with the inner surface of 6), heat is radiated to the outside air via the cover member (16) as in the first embodiment shown in FIG. Therefore, the heat generated from the LED elements (20, 20) simply causes the LED elements (20, 2) to cover the cover member (16).
The heat dissipation effect is higher than that of the first embodiment in which the surface (0) is contacted, which is preferable.

【００２７】この第２実施例に用いられるカバー部材
（１６）としては、第１実施例に挙げたものと同様であ
り、例えば、ガラス、薄いポリカーボネート、図３に示
すようなガラスに金属粉（２２）を混入したもの、図４
に示すようなガラスの少なくとも内面に透過性を有する
金属箔（２４）を張り付けたものが用いられる。The cover member (16) used in the second embodiment is the same as that described in the first embodiment. For example, glass, thin polycarbonate, glass as shown in FIG. 22) mixed, FIG.
A glass having a transparent metal foil (24) attached to at least the inner surface thereof is used.

【００２８】本発明は、以上のように図面に示された実
施例に限定されるものではなく、特にカバー部材、熱伝
導板の材質については、熱伝導性がよいものであればど
のような材質のものであってもよく、上記実施例に挙げ
たものに限定されるものではない。The present invention is not limited to the embodiments shown in the drawings as described above, and in particular, as for the material of the cover member and the heat conducting plate, any material can be used as long as it has good heat conductivity. The material may be any material, and the material is not limited to the ones described in the above embodiments.

【００２９】[0029]

【発明の効果】以上説明したように本発明によれば、Ｌ
ＥＤ素子の面をカバー部材の内面に接触させ、あるいは
カバー部材とＬＥＤ素子ユニット間に熱伝導板を介在さ
せるようにすることにより、ＬＥＤ素子により発生した
熱を、カバー部材および／または熱伝導板を介して外部
に放熱させるようにしたので、ＬＥＤ素子を冷却するた
めのファン等が必要なくなり、余分な部品のメンテナン
スが必要なくなるとともに、ＬＥＤ表示装置自体を薄く
小型にすることが可能となる。As described above, according to the present invention, L
The surface of the ED element is brought into contact with the inner surface of the cover member, or the heat conduction plate is interposed between the cover member and the LED element unit, so that the heat generated by the LED element is transferred to the cover member and / or the heat conduction plate. Since the heat is radiated to the outside through the device, a fan or the like for cooling the LED element is not required, maintenance of extra parts is not required, and the LED display device itself can be made thin and small.

【図面の簡単な説明】[Brief description of drawings]

【図１】ＬＥＤ表示装置の外観を示した斜視図である。FIG. 1 is a perspective view showing an appearance of an LED display device.

【図２】本発明の第１実施例に係るＬＥＤ表示装置であ
って、図１におけるＩＩ−ＩＩ線拡大断面図である。FIG. 2 is an enlarged cross-sectional view of the LED display device according to the first embodiment of the present invention, taken along line II-II in FIG.

【図３】カバー部材に金属粉を混入した例を示した要部
拡大図である。FIG. 3 is an enlarged view of a main part showing an example in which metal powder is mixed in a cover member.

【図４】カバー部材に金属箔を張り付けた例を示した要
部拡大図である。FIG. 4 is an enlarged view of a main part showing an example in which a metal foil is attached to a cover member.

【図５】本発明の第２実施例を示したＬＥＤ表示装置の
図２に対応する拡大断面図である。FIG. 5 is an enlarged sectional view of an LED display device showing a second embodiment of the present invention, corresponding to FIG.

【図６】熱伝導板の一部を示した斜視図である。FIG. 6 is a perspective view showing a part of a heat conduction plate.

【図７】第２実施例の要部を示した一部拡大断面図であ
る。FIG. 7 is a partially enlarged cross-sectional view showing a main part of the second embodiment.

【符号の説明】[Explanation of symbols]

１２ 箱体 １４ 窓部 １６ カバー部材 １８ ＬＥＤ素子ユニット ２０ ＬＥＤ素子 ２２ 金属粉 ２４ 金属箔 ２６ 熱伝導板 ２８ パッキン ３０ 嵌合孔 12 Box Body 14 Window 16 Cover Member 18 LED Element Unit 20 LED Element 22 Metal Powder 24 Metal Foil 26 Thermal Conductive Plate 28 Packing 30 Fitting Hole

Claims (9)

【特許請求の範囲】[Claims] 【請求項１】 箱体（１２）に窓部（１４）を有し、該
窓部（１４）に透過性を有するカバー部材（１６）を設
け、該カバー部材（１６）に対面するようＬＥＤ素子ユ
ニット（１８）を内部に設けたＬＥＤ表示装置であっ
て、 前記カバー部材（１６）を熱伝導性を有する材質とし、 前記ＬＥＤ素子ユニット（１８）にマトリックス状に配
列された多数のＬＥＤ素子（２０，２０）の表面を、前
記カバー部材（１６）の内側面に接触させてなり、 もって、前記ＬＥＤ素子（２０，２０）から発生した熱
を、前記カバー部材（１６）を介して外部に放熱冷却さ
せるようにしたことを特徴とするＬＥＤ表示装置。1. A box (12) has a window (14), a transparent cover member (16) is provided in the window (14), and an LED is provided so as to face the cover member (16). An LED display device in which an element unit (18) is provided, wherein the cover member (16) is made of a material having thermal conductivity, and a large number of LED elements arranged in a matrix in the LED element unit (18). The surface of (20, 20) is brought into contact with the inner surface of the cover member (16), so that the heat generated from the LED element (20, 20) is transferred to the outside via the cover member (16). An LED display device characterized in that it is designed to dissipate heat and cool it. 【請求項２】 前記カバー部材（１６）が、透過性を有
する薄い樹脂からなることを特徴とする請求項１に記載
のＬＥＤ表示装置。2. The LED display device according to claim 1, wherein the cover member (16) is made of a transparent thin resin. 【請求項３】 前記カバー部材（１６）が、ガラスに熱
伝導性を有する金属粉（２２）を混入させてなることを
特徴とする請求項１に記載のＬＥＤ表示装置。3. The LED display device according to claim 1, wherein the cover member (16) is formed by mixing glass with a metal powder (22) having thermal conductivity. 【請求項４】 前記カバー部材（１６）が、ガラスの少
なくとも内側面に透過性を有する金属箔（２４）を張り
付けてなることを特徴とする請求項１に記載のＬＥＤ表
示装置。4. The LED display device according to claim 1, wherein the cover member (16) is formed by attaching a transparent metal foil (24) to at least an inner surface of glass. 【請求項５】 箱体（１２）に窓部（１４）を有し、該
窓部（１４）に透過性を有するカバー部材（１６）を設
け、該カバー部材（１６）に対面するようＬＥＤ素子ユ
ニット（１８）を内部に設けたＬＥＤ表示装置であっ
て、 前記ＬＥＤ素子ユニット（１８）にマトリックス状に配
列された多数のＬＥＤ素子（２０，２０）が挿入される
嵌合孔（３０，３０）を有し、前記カバー部材（１６）
と前記ＬＥＤ素子ユニット（１８）間に介在される熱伝
導板（２６）と、 前記熱伝導板（２６）の周囲に配し、前記箱体（１２）
と接触する熱伝導性を有するパッキン（２８）と、を有
し、前記ＬＥＤ素子（２０，２０）の表面を前記カバー
部材（１６）の内側面に接触させて、前記ＬＥＤ素子
（２０，２０）から発生した熱を、前記熱伝導板（２
６）、前記パッキン（２８）および前記カバー部材（１
６）を介して外部に放熱冷却させるようにしたことを特
徴とするＬＥＤ表示装置。5. The box (12) has a window (14), the window (14) is provided with a transparent cover member (16), and the LED is provided so as to face the cover member (16). An LED display device having an element unit (18) provided therein, wherein a plurality of LED elements (20, 20) arranged in a matrix in the LED element unit (18) are inserted into fitting holes (30, 30) having the cover member (16)
And a heat conducting plate (26) interposed between the LED element unit (18) and the heat conducting plate (26), and the box body (12).
And a packing (28) having thermal conductivity that makes contact with the LED element (20, 20) by bringing the surface of the LED element (20, 20) into contact with the inner surface of the cover member (16). ) Heat generated from the heat conducting plate (2
6), the packing (28) and the cover member (1)
6) An LED display device characterized in that the heat is radiated and cooled to the outside via 6). 【請求項６】 前記熱伝導板（２６）が、熱伝導率の高
い金属からなることを特徴とする請求項５に記載のＬＥ
Ｄ表示装置。6. The LE according to claim 5, wherein the heat conducting plate (26) is made of a metal having a high heat conductivity.
D display device. 【請求項７】 前記カバー部材（１６）が、透過性を有
する薄い樹脂からなることを特徴とする請求項５または
６に記載のＬＥＤ表示装置。7. The LED display device according to claim 5, wherein the cover member (16) is made of a transparent thin resin. 【請求項８】 前記カバー部材（１６）が、ガラスに熱
伝導性を有する金属粉（２２）を混入させてなることを
特徴とする請求項５または６に記載のＬＥＤ表示装置。8. The LED display device according to claim 5, wherein the cover member (16) is formed by mixing glass with a metal powder (22) having thermal conductivity. 【請求項９】 前記カバー部材（１６）が、ガラスの少
なくとも内側面に透過性を有する金属箔（２４）を張り
付けてなることを特徴とする請求項５または６に記載の
ＬＥＤ表示装置。9. The LED display device according to claim 5, wherein the cover member (16) is formed by attaching a transparent metal foil (24) to at least an inner surface of glass.
JP8010341A 1996-01-24 1996-01-24 Led display device Pending JPH09197981A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8010341A JPH09197981A (en) 1996-01-24 1996-01-24 Led display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8010341A JPH09197981A (en) 1996-01-24 1996-01-24 Led display device

Publications (1)

Publication Number Publication Date
JPH09197981A true JPH09197981A (en) 1997-07-31

Family

ID=11747496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8010341A Pending JPH09197981A (en) 1996-01-24 1996-01-24 Led display device

Country Status (1)

Country Link
JP (1) JPH09197981A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106170A (en) * 2004-10-01 2006-04-20 Nagoya Electric Works Co Ltd Display device and transmission light control method
JP2019014474A (en) * 2013-03-15 2019-01-31 本田技研工業株式会社 Solid head-up display comprising dynamic focal plane

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106170A (en) * 2004-10-01 2006-04-20 Nagoya Electric Works Co Ltd Display device and transmission light control method
JP2019014474A (en) * 2013-03-15 2019-01-31 本田技研工業株式会社 Solid head-up display comprising dynamic focal plane

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