JPH09193080A - Cutting method of thin film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut a thin film without causing a tear or the like of the film when it is cut in a predetermined position. SOLUTION: A cutting edge 4 is contacted with a thin film from which tensile force is released as (b), and film tension is gradually increased as (c), and a flaw is marked on the film by an edge of the cutting edge 4 in the initial stage of tensile force, and tensile force is increased further, and stress concentration is caused in this flaw generated part, and the film is cut by this flaw generated line 7 as (d).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film cutting method for accurately cutting a strip-shaped thin film at a target cutting position.

[0002]

2. Description of the Related Art Conventionally, the cutting of this kind of thin film is carried out by any of the methods shown in FIGS. 4 (a) (c) (e).

The cutting method shown in FIG. 4A has a width of about 50.
In the process of winding the strip-shaped thin film 2 having a thickness of 0 mm and a thickness of about 1 to 5 μm, when cutting the end of the thin film 2 wound on the winding body 1, a sharp blade 11 is provided on a part of the thin film 2. The thin film is divided by inserting the blade 11 and moving the blade 11 in the direction of the arrow 12 along the line 3 to be cut. In addition, when the blade 11 is moved, it is carried out either in a state where some tension is applied to the thin film 2 in the longitudinal direction of the thin film 2 or in a state where the tension is released on the contrary. .

In the cutting method shown in FIG. 4 (c), when a similar thin film 2 is cut, a nichrome wire 14 longer than the width of the thin film is used. The nichrome wire 14 is energized to generate heat and is lowered toward the thin film 2 as shown by an arrow 15, and is brought into contact with the thin film 2 in a straight line at the same time to be melted and divided.

The cutting method shown in FIG. 4 (e) uses a sharp blade 17 longer than the width of the thin film 2 when cutting the same thin film 2. As shown by the arrow 18, the blade 17 is lowered toward the thin film 2 to divide it.

[0006]

However, in any of these methods, there are problems that the actual cutting point is out of the line to be cut and a heat-melting section is generated in the cutting section. Was there.

Specifically, in the case of FIG. 4A, as shown in FIG. 4B, at the moment when the blade 11 is inserted into the object having film tension, the thin film 2 is tensioned by 13 It will be torn randomly as shown in. Also,
When the blade 11 is inserted into the thin film 2 in a state where the tension is released, the blade 11 pushes the thin film 2 so that the line 3 to be cut cannot be accurately divided.

In the case of FIG. 4C, as in the case of FIG.
As shown in (d), the melted thin film 16 adheres to the nichrome wire 14, causing a problem that repeated cutting is difficult.

In the case of FIG. 4 (e), it is difficult to bring the blade 17 into contact with the film surface in a straight line at the same time, and further, the blade 1 is slightly attached to the thin film 2.
It is very difficult to press 7, and a slight difference causes a partial contact state difference in a straight line, and a figure from a portion where the thin film 2 and the blade 18 strongly contact each other first. There is a problem that a crack is generated in the thin film 2 as shown in (f) of 4.

It is an object of the present invention to provide a thin film cutting method capable of accurately cutting at a target cutting point and improving the edge treatment and productivity of the thin film.

[0011]

The method of cutting a thin film of the present invention is such that, when a strip-shaped thin film is cut, a cutting blade is brought into contact with a target cutting point of the thin film while the film tension is released. In this state, the film tension is gradually increased to cut the thin film at the above-mentioned target cutting point.

According to this method, a cutting blade, preferably a saw-toothed cutting blade, is used at the cutting position, and the film tension is gradually increased. The thin film is cut at this scratching part.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The method for cutting a thin film of the present invention will be described below with reference to specific embodiments.

FIG. 1 shows an example in which the thin film cutting method of the present invention is adopted in a winding device, and FIG. 2 shows the cutting process. Width of about 500mm and thickness of about 1.2μ
The strip-shaped PPS (polyphenylene sulfide) thin film 2 of m is wound around the winding body 1, and the thin film 2
At the time of cutting and separating the end of the line 3 at the position of the line 3 to be cut, first, as shown in FIG. The thin film 2 is pinched so as not to move. At this time, the thin film 2 between the wound body 1 and the film chuck portion 5 is maintained in a state of zero tension.

Next, as shown in FIG. 2B, a saw blade 4 longer than the film width is lightly pressed against the line 3 to be cut in the thin film 2 in the state of zero tension. And FIG.
As shown in (c), the winding body 1 is moved in the direction in which the film tension is increased [the direction of arrow 6] while the film chuck 5 and the saw blade 4 are fixed. The thin film 2 in FIG. 2 (c) shows the state of the film without slack when the tension is increased. At this time, in detail, at the position where the saw blade 4 and the thin film 2 are in contact with each other, the thin film 2 is first scratched during the movement of the winding body 1 and the film tension is further increased. As a result, load concentration occurs at the location of the scratch, and
(D), the end of the thin film 2 wound around the winding body 1 at the position 7 is cut and separated from the thin film 2 on the supply side.

The saw blade 4 has a thickness of 0.6 mm. As shown in FIG. 3, the tip of the saw blade has a blade pitch 9 of 3 mm and a blade cutting depth 10 of 3 mm. The thickness is still 0.6 mm and is not in a sharp state.

In the case of a sharp blade tip, the film is torn at the moment when the blade tip comes into contact with the thin film.
In the present invention, as shown in this embodiment, the film is scratched when it comes into contact with the film.

Incidentally, the division using a saw blade like the one used in the cutting method for household wrap products brings the saw blade into contact with the film which is hard to tear like wrap products in the entire width direction of the film. However, as a method of applying tension at the time of cutting, instead of applying the same tension to the entire length of the blade and the entire width direction of the film at the same time, cutting is performed by gradually moving the tension from the width direction end of the film. The cutting method of the present invention is different from this conventional example.

According to the conventional cutting method as found in such a household wrap, the 1.2 μm PPS thin film described in the above embodiment has a very difficult result.

That is, in the case of a thin and easily tearable material such as a PPS 1.2 μm film, if a crack is generated at one place of the film, even if the film is pretensioned, it is re-tensioned later. In any case, random film tearing due to tension occurs from the cracked portion in any case. In other words, with such a household wrap cutting method, it is impossible to divide the film into the intended cutting lines as in the cutting method of the present invention.

Therefore, the method of performing cutting by making a scratch on the entire surface of the cutting portion and increasing the tension while keeping the saw blade in contact as in the above embodiment is very effective and effective. Processes during film division, film unwinding, and seam processing in the winding section can be easily performed, and it is possible to automate the switching work of the material such as the winding device, and after the end of each winding unit. Since no processing is required, productivity can be improved.

In the above embodiment, the winding body 1 was moved in the direction of arrow 6 shown in FIG. 2C to apply tension to the thin film 2. However, the winding body 1 is moved in the direction of arrow 6 as shown in FIG. The film chuck 5 is rotated further in the winding direction without moving.
Between the winding body 1 and the line 3 to be cut, and the thin film film 2 between the winding body 1 and the line 3 to be cut is similarly sandwiched by another film chuck to cut the winding body 1. The same applies when the film chuck between the film 3 and the line 3 is moved in the direction of the arrow 6 to apply tension to the thin film 2 between the film chuck 5 and the film chuck 5 on the upper side of the line 3 to be cut.

In each of the above-mentioned embodiments, the cutting of the end of the thin film 2 wound around the winding body 1 has been described as an example, but it is necessary to start from the tip of the thin film 2 pulled out from the winding body 1. The same operation can be performed when the thin film 2 having a length is cut and separated.

[0024]

As described above, in the method for cutting a thin film of the present invention, when cutting the strip-shaped thin film, the cutting blade is brought into contact with the target cutting point of the thin film while the film tension is released. In this state, the film tension is gradually increased to cut the thin film at the above-mentioned cutting target point.Therefore, the cutting blade is brought into contact with the thin film without tension to gradually increase the tension of this film to make the initial tension. It is possible to scratch the film and cut the film along the scratch at the final limit tension, and improve the edge treatment of the film, productivity, etc. in contrast to the method that was difficult to cut according to the determined cutting line be able to.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cutting device according to an embodiment.

FIG. 2 is a side view showing a cutting step of the same embodiment.

FIG. 3 is a perspective view showing a cutting blade of the same embodiment.

FIG. 4 is an explanatory diagram of a conventional cutting method.

[Explanation of symbols]

 1 Winding body of thin film 2 Thin film 3 Line to be cut [Target cutting point] 4 Saw blade [Cutting blade] 5 Film chuck

Claims (2)

[Claims] 1. When cutting a strip-shaped thin film,
A method of cutting a thin film, wherein a cutting blade is brought into contact with a target cutting point of the thin film in a state where the film tension is released, and the film tension is gradually increased in this state to cut the thin film at the target cutting point. 2. The method for cutting a thin film according to claim 1, wherein the cutting blade has a saw blade shape.