JPH09183202A - Laminated film structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a film which has good heat resistance in spite of its thinness and is suitable for various industrial applications in view of its good heat insulation by a method in which on both sides of a polyester film as a support, polyphenylene sulfide films which are thinner than the polyester film are laminated. SOLUTION: On both sides of a film of a polyester or a copolyester as a support film, polyphenylene sulfide films which are thinner than the support film are laminated. These films are preferably bonded together by adhesive force of 0.1-2.0g/cm to form a film laminate. Moreover, in the film laminate, a metal film can be formed at least on one side. When a laminated film structure is to be manufactured, in a coextrusion method, both T-die and inflation method are applicable. For lamination parts, all the methods of an adopter part, the inside of a die, and the outside of a die are applicable.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a laminated film structure. More specifically, for example, the present invention relates to a laminated film structure that can be used for, for example, a vapor-deposited laminated film for a capacitor, and can be suitably used particularly for various industrial uses such as miniaturization and lightening of capacitors and electric insulation. Things.

[0002]

2. Description of the Related Art Conventionally, plastic films have been widely used for various industrial purposes, but in recent years there has been an increasing demand for smaller and lighter equipment, and the accompanying use under severe environmental conditions, and thin products. The demands for realization are becoming more prominent.

For example, in an environment close to a high-temperature heat source,
In addition, it has been demanded that even a thin film can be used while realizing high operation accuracy of the device for a long period of time.

[0004]

In view of the above points, the object of the present invention is to have good heat resistance even for a thin material, and this heat resistance and good insulation performance make it suitable for various industrial applications. The object is to provide a plastic film that is preferably used.

[0005]

The plastic film of the present invention which achieves the above-mentioned object has the following constitution.

That is, the present invention provides a laminated film structure comprising a polyphenylene sulfide film thinner than the support film laminated on both surfaces of a polyester or polyester copolymer film as the support film.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The laminated film laminate of the present invention will be described in more detail below.

[0008] The film of the present invention has a laminated structure in which a polyphenylene sulfide film having a thickness smaller than that of the support film is laminated on both surfaces of a polyester or polyester copolymer film as the support film. It becomes. The films are preferably adhered with an adhesive force of 0.1 to 2.0 g / cm to form a film laminate. Further, in the film laminate, a metal film may be formed on at least one surface.

The film laminate of the present invention is typically
With polyester such as polyethylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalate, polyethylene α, β-bis (2-chloro (phenoxy) ethane 4,4′-dicarboxylate) in the center, on both sides Polyphenylene sulfide can be obtained by locating the polyphenylene sulfide, laminating and extruding them by melt coextrusion, and then uniaxially or sequentially or simultaneously biaxially stretching. Further, it may contain another organic polymer, and may contain appropriate additives such as a lubricant and a plasticizer.

In the polyphenylene sulfide film, at least 85 mol% of the repeating units have the following structural formula (I)
Are preferred from the viewpoint of obtaining good properties such as heat resistance.

[0011]

Embedded image The film laminated structure of the present invention is not particularly limited,
Especially for ultra-thin objects, the total thickness is 1.5 μm to 30 μm
Is preferable, and the film thickness of one (single) polyphenylene sulfide film is preferably 0.2 to 3.0 μm. That is, it is important that the support film is thicker than the polyphenylene sulfide film thickness,
After all, the thickness of one of the polyphenylene sulfide films is 1/3 to 1/1 of the total thickness of the laminated film structure.
Those which are within the range of 10, preferably about 1/7 to 1/10 are preferred.

By adopting such a multi-layer structure, it is possible to obtain a laminated film structure having good heat resistance and insulating properties by making good use of the inherent strength characteristics of the support film. It is important that the polyphenylene sulfide film is laminated on both sides of the support film, and if only one side is used, the above-mentioned properties cannot be exhibited well.
There are many restrictions on how to use it, and it is not industrially practical. The lamination and integration of the film can be performed by a coextrusion method or an adhesive.

When the laminated film structure of the present invention is to be produced by a coextrusion method, the coextrusion method can be any of a T-die method and an inflation method. Further, the lamination can be performed by any method of the adapter part, the inside of the die, and the outside of the die.

As the subsequent stretching method, any of a tenter method and a tubular method can be adopted. Stretching conditions should be carefully set because the polymers to be combined have different melting points, glass transition points, and stretchability.

Usually, film stretching is performed as uniaxial stretching or biaxial stretching. Stretching ratio, in the case of uniaxial stretching,
In general, it is preferably 1.5 to 13 times, particularly 3 to 9 times, and in the case of biaxial stretching, it is generally 2.5 to 80 times, preferably 6 to 50 times in terms of area.

The surface of the laminated film structure of the present invention is subjected to a surface treatment such as a corona discharge treatment, a fire treatment, a plasma treatment, a glow discharge treatment, or various surface roughening treatments, or a so-called anchor coat treatment. Is also good.

When a thin metal film is formed on the laminated film structure of the present invention, it can be used as an electrode of a capacitor. The metal film can be formed by a method such as vapor deposition, sputtering, ion plating, and plating. The thickness of the metal thin film is preferably in the range of 50 to 5000 angstroms. Although the material of these metal films is not particularly limited, aluminum, zinc, tin, nickel, chromium, iron, copper, titanium, or an alloy thereof is preferable, and zinc, nickel, chromium, or an alloy thereof having moisture resistance is preferable. More preferred. A thin layer of a metal oxide may be formed on the metal surface, and the coefficient of linear expansion of the metal oxide is preferably in the range of ^{5 to} 30 × 10 ⁻⁵ (cm / cm / ° C.).

The thickness of the thin layer of the metal oxide may be determined in accordance with the intended capacitance range and the film substrate to be used. In the present invention, the thickness is preferably in the range of 50 to 10000 angstroms. More preferably 10
It is in the range of 0 to 2000 angstroms, more preferably in the range of 100 to 1000 angstroms.
If it is less than 50 angstroms, the dielectric breakdown voltage is particularly low, and the withstand voltage characteristics are not sufficient. If it is 10000 angstroms or more, the electrostatic capacity is not sufficient, and the flatness may be impaired by curling of the entire film laminated structure.

As a method of forming a thin layer of a metal oxide, powder or a solid of the metal oxide is vacuum-deposited, sputtered,
A method performed by vacuum deposition such as ion plating,
A method of forming a metal or metal alloy by vacuum deposition, sputtering, or ion plating while introducing oxygen gas can be adopted.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described based on embodiments.

Example 1 Hereinafter, examples will be described.

The following methods were used for measuring the characteristics in the examples.

(1) Film Thickness It was measured with a normal dial gauge. For a film having a thickness of 1 μm or less, the film is stuck on a glass support in a wrinkle-free state, and measured with a stylus-type surface roughness tester. Was measured and determined as the film thickness.

(2) Thickness of vapor-deposited metal layer A calibration curve for the thickness of the vapor-deposited layer and its electric resistance or eddy current is prepared for each type of metal. The eddy current was measured and determined from the calibration curve.

(3) Thickness of Metal Oxide Layer A polyester adhesive tape was previously attached to a substrate film, vapor-deposited, the adhesive tape was peeled off, and the step portion was measured with a high precision step measuring machine. Creates a step between the deposited and undeposited parts.

(4) Adhesive force When the width of the vapor-deposited laminated film is W (cm), the vapor-deposited PET film layer is continuously formed at a peeling angle of 180 degrees from this to 2
The tension applied to the deposited PET film when peeling at a speed of m / min was measured with a tensiometer. This tension is T
(G), the adhesion is T / W (g / cm)
Can be obtained by

Example The following two kinds of raw materials (pellets) were prepared.

(1) PET (polyethylene terephthalate): polyethylene terephthalate in which diethylene glycol is copolymerized at 0.2% by weight. Melting point 258 [deg.] C. 0.08% by weight of calcium montanate and an average particle size of 0.
It contains 0.15% by weight of 05 μm fumed silica.

(2) PPS: sodium sulfide, 1,4
Poly-P-phenylene sulfide having a melt viscosity of 2,500 poise made of dichlorobenzene. 285 ° C. It contains 0.1% by weight of silica fine powder having an average particle diameter of 0.7 μm and 0.05% by weight of calcium stearate.

Melt coextrusion at 305 ° C., PPS / PET
/ PPS has a three-layer structure, and it is 4.0 times in the vertical direction at 98 ° C.
The film was stretched 3.5 times in the transverse direction at 100 ° C., and the obtained film had a PPS layer on both sides of 1.8 μm and a central PET layer of 13 μm in thickness.

The adhesion between the PPS layer and the PET layer was 0.3 g / cm.

This laminated film was excellent in heat resistance.

The laminated film was placed in a vacuum evaporation apparatus, and aluminum was evaporated on both sides (thickness: 500).
Angstrom) and then reactively deposited amorphous aluminum on both sides (thickness: 1000 Angstroms) and metallized on both sides with aluminum (thickness: 50 Angstroms).
0 Å), it was confirmed that the film was good as a deposited film for manufacturing a capacitor.

[0034]

EFFECTS OF THE INVENTION According to the present invention, it is possible to have good heat resistance, insulation properties, etc., and to make it thin. A film structure is provided.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H01B 3/30 H01B 3/30 Q

Claims (2)

[Claims] 1. A laminated film structure characterized in that a polyphenylene sulfide film thinner than the support film is laminated on both sides of a film made of polyester or a polyester copolymer as a support film. 2. The thickness of one polyphenylene sulfide film is 1/4 of the total thickness of the laminated film structure.
The laminated film structure according to claim 1, wherein the laminated film structure is in the range of 1/10.