JPH0918177A - Cooler for electronic apparatus - Google Patents

Abstract

PURPOSE: To cool an IC mounted on a board by fixing a cooling fan, for supplying cooling air between the boards, on the chassis and fixing a plate for blocking conduction of cooling air between the board and chassis thereby supplying the cooling air between the chassis and board. CONSTITUTION: A chassis 6 containing boards 2 and cooling fans for feeding the air from an inlet duct 3 through the boards 2 to an outlet duct 4 is housed in a housing 1. Blocking plates 7 are bonded to the board 2 or chassis 6 such that the gaps between the boards 2 and the chassis 6 are closed alternately. Cooling air is sucked by the fans 5 through the inlet vent 8 of housing into the inlet duct 3 and deflected by the blocking plates 7 to pass between the boards 2 and discharged through the outlet duct 4 and the outlet vent 9 of housing 1 to the outside. Since the cooling air, fed through the inlet duct, is deflected to pass between the boards 2, ICs mounted on the board 2 are cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device cooling device.

[0002]

2. Description of the Related Art Conventional electronic devices such as electronic calculators are ICs.
It is configured by housing a chassis containing a plurality of boards on which a large number of boards are mounted and other peripheral devices in a housing.
Since C has a large amount of heat generation and tends to become hot, it is necessary to maintain a constant temperature to maintain reliability. Therefore, a fan is attached to the chassis to absorb room temperature air from the inlet vent installed in the chassis. The cooling device cools the IC by passing the air between the vertically arranged substrates through the inlet duct and discharging the IC from the outlet vent through the outlet duct. In addition, the arrangement of the substrates may be changed from vertical to horizontal.

[0003]

In the above method, when the board is arranged horizontally, the air absorbed from the inlet vent passes through the gap between the substrate and the chassis and then exits from the outlet vent. Since the air does not pass between the substrates because it is discharged, the IC on the substrates is not cooled.

The present invention solves the above-mentioned drawbacks, and provides an electronic device cooling apparatus which can obtain an electronic computer and an electronic device which can supply cooling air between substrates of a chassis to cool an IC on the substrates. The purpose is to

[0005]

SUMMARY OF THE INVENTION An electronic device cooling apparatus according to the present invention includes a chassis in which a plurality of substrates of an electronic device are accommodated in a stack with a gap between them, and a cooling air mounted between the chassis and the substrates. It is characterized in that it is provided with a cooling fan for passing air, and a closing plate attached between a part or the other ends of the plurality of substrates and the chassis for allowing cooling air to flow along the substrate surface. According to another aspect of the electronic device cooling apparatus of the present invention, one end or the other end of each of the plurality of substrates mounted on the chassis via the closing plate is coupled to the chassis, and the air flow is provided near the coupling portion. It is characterized by having a deflector plate provided with a portion. The electronic device cooling device according to a third aspect of the invention is characterized in that the air flow portion of the flow diverter plate is provided with a mesh.

[0006]

In the electronic equipment cooling apparatus of the present invention, the board of the electronic equipment is housed in the chassis, the cooling fan is attached to the chassis to allow the cooling air to pass between the boards, and the blocking plate is provided between the board and the chassis. It is characterized by being installed and closing the flow of cooling air. Further, in the electronic device cooling device according to the second aspect, the substrate of the electronic device is housed in the chassis, the cooling fan is attached to the chassis to allow the cooling air to flow between the substrates, and the current is diverted between the substrate and the chassis. The feature is that a plate is attached to restrict the flow of cooling air. Further, in the electronic device cooling device according to claim 3, the substrate of the electronic device is housed in the chassis, the cooling fan is attached to the chassis to allow cooling air to pass between the substrates, and the mesh is provided between the substrate and the chassis. It is characterized by attaching a mesh-like mesh to restrict the flow of cooling air.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the electronic device cooling apparatus of the present invention will be described below. In FIG. 1, a chassis 6 is an electronic device mounting plate that is housed in a housing 1 and houses a board 2 of the electronic device. The cooling fan 5 is a blower that is attached to the chassis 6 and ventilates the cooling air for the substrate 2. The cooling fan 5 takes in the cooling air from the inlet ventilation port 8 opened at the bottom of the housing 1 through the inlet duct 3 to cool the electronic device. After that, the air is discharged from the outlet vent 9 through the outlet duct 4. The closing plate 7 is a plate attached between the substrate 2 and the chassis 6 to close the flow of cooling air.

That is, FIG. 1 shows a housing 1 of an electronic device, a substrate 2
And a cooling fan 5 that discharges air from the inlet duct 3 through the substrate 2, the outlet duct 4, and the like. Closure plates 7 are fixed to the board 2 or the chassis 6 so as to alternately close the gaps between the board 2 and the chassis 6. The cooling air is absorbed by the fan 5 from the inlet ventilation port 8 of the housing 1, passes through the inlet duct 3, changes the direction of the flow by the closing plate 7, passes between the substrates 2, and passes from the outlet duct 4 to the housing 1. It is discharged to the outside of the casing through the outlet vent hole 9 of the. Since the cooling air from the inlet duct passes between the substrates 2 by the closing plate 7, the ICs on the substrates 2 are uniformly cooled.

Another embodiment will be described with reference to FIG. Instead of a part of the closing plate 7 of the embodiment of FIG.
The deflector plate 10 is installed to partially close the gap between and. Since the cooling air sucked from the inlet duct 3 by the cooling fan 5 partially changes its direction in the deflector plate 10, and the remaining flow changes its direction in the closing plate 8 and passes between the respective substrates 2. , The ICs on each substrate 2 are cooled uniformly.

Further, another embodiment will be described with reference to FIG. FIG.
Instead of a part of the deflector plate 10 of the above embodiment, a mesh 11 that partially closes the gap between the substrate 2 and the chassis 6 is installed. Since the cooling air sucked from the inlet duct 3 by the cooling fan 5 partially changes its direction in the mesh 11 and the remaining flow changes its direction in the closing plate 8 and passes between the respective substrates 2, The IC on each substrate 2 is cooled uniformly.

[0011]

As described above, according to the present invention, since the cooling air supplied by the cooling fan passes between the substrates, the air velocity distribution between the substrates becomes uniform, and the cooling efficiency does not decrease. A computer and electronic equipment can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electronic device cooling device showing an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic device cooling apparatus showing an embodiment of claim 2;

FIG. 3 is a sectional view of an electronic device cooling device showing an embodiment of claim 3;

[Explanation of symbols]

 2 ... Substrate 5 ... Cooling fan 6 ... Chassis 7 ... Blocking plate 10 ... Drift plate 11 ... Mesh

Claims (3)

[Claims] 1. A chassis in which a plurality of boards of an electronic device are housed in a stacked state while keeping a distance from each other, a cooling fan attached to the chassis for passing cooling air between the boards, and the plurality of boards. A cooling device for electronic equipment, which is provided between a part or the other end of the above and a chassis and has a closing plate that allows the cooling air to flow along the substrate surface. 2. A deflector plate having one end or the other end between a plurality of substrates attached to the chassis via a closing plate, the one end or the other end being connected to the chassis, and an air circulating part provided near the connecting part. The electronic device cooling device according to claim 1. 3. The electronic device cooling apparatus according to claim 2, wherein the air flow portion of the flow diverter plate is provided with a mesh mesh.