JPH0629681A - Arrangement structure of large electronic equipment - Google Patents

Arrangement structure of large electronic equipment

Info

Publication number
JPH0629681A
JPH0629681A JP4183873A JP18387392A JPH0629681A JP H0629681 A JPH0629681 A JP H0629681A JP 4183873 A JP4183873 A JP 4183873A JP 18387392 A JP18387392 A JP 18387392A JP H0629681 A JPH0629681 A JP H0629681A
Authority
JP
Japan
Prior art keywords
face
exhaust
vents
intake
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4183873A
Other languages
Japanese (ja)
Other versions
JP2744554B2 (en
Inventor
Naoki Shudo
直樹 首藤
Takashi Kitahara
孝志 北原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PFU Ltd
Original Assignee
PFU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PFU Ltd filed Critical PFU Ltd
Priority to JP4183873A priority Critical patent/JP2744554B2/en
Publication of JPH0629681A publication Critical patent/JPH0629681A/en
Application granted granted Critical
Publication of JP2744554B2 publication Critical patent/JP2744554B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To improve cooling efficiency of a large electronic equipment, by constituting an equipment row by arranging, in parallel, a plurality of large electronic equipments wherein intake vents and exhaust vents are so installed on the front surfaces and the rear surfaces of a casing, respectively, that the intake vents and the exhaust vents face the same surface, and arranging the equipment rows in the manner in which the exhaust vent arrangenet surfaces face each other. CONSTITUTION:An electronic equipment 3 like a large computer system has an intake vent 1 and an exhaust vent 2, on the front surface side and the rear surface side, respectively, of a main body or a casing accommodating an external storage. Cooling wind inhaled from the intake vent by operating an inner cooling fan is compulsorily discharged from the exhaust vent 2, thereby cooling the inner equipment. A plurality of the large electronic equipments are so arranged that the intake vents 1 and the exhaust vents 2 face the same surface, and equipment rows 4 are constituted. The equipment rows 4 are so arranged that exhaust vent rear surfaces 5 face each other keeping specified intervals. Cold air jetting vents 6 opened on the bottom surface or the like are formed in the area where the arrangement surfaces of the intake vents 1 of the equipment rows 4 face each other. An air-conditioner 7 is installed in the vicinity of the facing area of the exhaust vent arrangement surfaces 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、大型電子装置の配置構
造に関するものである。大型コンピュータ装置をはじめ
とする大型電子装置は、その処理情報量の莫大さのため
に、筐体内に収納された装置モジュールを適宜に組み合
わせる等して使用に供されることが一般的であり、コン
ピュータルーム等には、複数の大型電子装置が配置され
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a layout structure for large electronic devices. Large electronic devices such as large computer devices are generally used by appropriately combining device modules housed in a housing due to the huge amount of processing information, A plurality of large electronic devices are arranged in a computer room or the like.

【0002】一方、個々の大型電子装置は、内部での発
熱量が大きなために、強制空冷等により冷却が必要であ
り、大型電子装置の配列に当たっては、装置の冷却効率
にも注意を払う必要がある。
On the other hand, since each large electronic device has a large amount of heat generated inside, it is necessary to cool it by forced air cooling or the like. In arranging the large electronic devices, attention must be paid to the cooling efficiency of the devices. There is.

【0003】[0003]

【従来の技術】大型電子装置の配置構造の従来例を大型
コンピュータ装置を例にとって図3に示す。この従来例
において、各電子装置3、3・・は、正面に吸気口1
を、背面に排気口2を備えており、図示しない内部の冷
却ファン等により強制空冷される。
2. Description of the Related Art A conventional example of the arrangement structure of a large electronic device is shown in FIG. In this conventional example, each electronic device 3, 3 ...
Is equipped with an exhaust port 2 on the back surface, and is forcedly cooled by an internal cooling fan or the like (not shown).

【0004】これら、電子装置3は、正面と背面を互い
に対向させた状態で配置されており、例えば床面等に形
成された冷却風吹き出し口6から吹き出された冷却風
は、吸気口1から電子装置3内に強制導入され、内部の
電子ユニットを冷却した後、排気口2から排出され、空
調機7に引き込まれる。
These electronic devices 3 are arranged with their front and back surfaces facing each other. For example, the cooling air blown out from the cooling air blowout port 6 formed on the floor surface or the like is discharged from the intake port 1. After being forcibly introduced into the electronic device 3 to cool the internal electronic unit, it is discharged from the exhaust port 2 and drawn into the air conditioner 7.

【0005】なお、図3において冷却風の流れは、同図
において矢印で示されている。
The flow of cooling air in FIG. 3 is indicated by an arrow in FIG.

【0006】[0006]

【発明が解決しようとする課題】しかし、上述した従来
例においては、各電子装置3の吸気口1は、対向する他
の電子装置3の排気口2に対面しているために、該他の
電子装置3からの熱せられた排気が吸気口1から導入さ
れ、冷却効率が低下するという欠点を有するものであっ
た。
However, in the above-described conventional example, since the intake port 1 of each electronic device 3 faces the exhaust port 2 of the other electronic device 3 that faces the other electronic device 3, this The heated exhaust gas from the electronic device 3 is introduced from the intake port 1 and the cooling efficiency is lowered.

【0007】本発明は、以上の欠点を解消すべくなされ
たものであって、冷却効率の良好な大型電子装置の配置
構造を提供することを目的とする。
The present invention has been made to solve the above drawbacks, and an object of the present invention is to provide an arrangement structure for a large electronic device having a good cooling efficiency.

【0008】[0008]

【課題を解決するための手段】本発明によれば上記目的
は、実施例に対応する図1に示すように、筐体の前面に
設けた吸気口1から吸気した冷却風を背面に設けた排気
口2から強制排出する大型電子装置3を室内に複数個配
置する大型電子装置の配置構造であって、大型電子装置
3の吸排気口1、2を同一面に向けて並列配置して装置
列4を形成し、各装置列4の排気口配置面5同士を所定
の間隔を置いて対向させた大型電子装置の配置構造を提
供することにより達成される。
According to the present invention, the above-mentioned object is to provide cooling air, which is taken in through an intake port 1 provided on the front surface of the housing, on the rear surface, as shown in FIG. 1 corresponding to the embodiment. The arrangement structure of a large-sized electronic device in which a plurality of large-sized electronic devices 3 forcibly discharged from an exhaust port 2 are arranged in a room, and the intake / exhaust ports 1, 2 of the large-sized electronic device 3 are arranged in parallel facing the same plane. This is achieved by providing a large electronic device arrangement structure in which the rows 4 are formed and the exhaust port arrangement surfaces 5 of the respective apparatus rows 4 are opposed to each other with a predetermined gap.

【0009】また、前記大型電子装置3が設置される部
屋の冷気吹き出し口6を、吸気口1の配置面同士が対向
するエリアに集中配置し、かつ、空調機7を、排気口配
置面5同士の対向エリアの近傍に集中配置することも可
能である。
Further, the cool air outlets 6 of the room in which the large electronic device 3 is installed are centrally arranged in an area where the arrangement surfaces of the intake ports 1 face each other, and the air conditioner 7 and the exhaust port arrangement surface 5 are arranged. It is also possible to dispose them centrally in the vicinity of the area where they face each other.

【0010】さらに、前記各装置列4の天井面4aと部
屋の天井面8との間隙部を、前記装置列4に沿って設置
されるロールカーテンにより閉塞することも可能であ
る。
Further, the gap between the ceiling surface 4a of each apparatus row 4 and the ceiling surface 8 of the room can be closed by a roll curtain installed along the apparatus row 4.

【0011】[0011]

【作用】本発明において、複数の大型電子装置3は、吸
排気口1、2を同一面に向けて配置され、装置列4が構
成される。各装置列4は、排気口配置面5同士が所定の
間隔を置いて対向するように、配置される。
In the present invention, the plurality of large electronic devices 3 are arranged so that the intake / exhaust ports 1 and 2 face the same plane to form the device row 4. The device rows 4 are arranged such that the exhaust port arrangement surfaces 5 face each other with a predetermined gap.

【0012】この結果、装置列4からの熱せられた排気
は、吸気口1側から吸気されることがなくなり、各電子
装置3における冷却効率が向上する。また、請求項2記
載の発明において、冷気吹き出し口6から吹き出される
冷気は速やかに吸気口1から吸入されるとともに、排気
口2からの排気は空調機7に吸い込まれる結果、冷却効
率がより向上する。
As a result, the heated exhaust gas from the device row 4 is not taken from the intake port 1 side, and the cooling efficiency of each electronic device 3 is improved. Further, in the invention according to claim 2, the cool air blown out from the cool air outlet 6 is quickly sucked in through the intake port 1, and the exhaust air from the exhaust port 2 is sucked into the air conditioner 7, resulting in a higher cooling efficiency. improves.

【0013】さらに、請求項3記載の発明において、装
置列4間のエリアはロールカーテンにより遮蔽されるた
めに、エリア間が完全に遮断されて冷却効率がより向上
し、かつ、設置作業が容易になる。
Further, in the invention according to claim 3, since the area between the device rows 4 is shielded by the roll curtain, the areas are completely shielded, the cooling efficiency is further improved, and the installation work is easy. become.

【0014】[0014]

【実施例】以下、本発明の望ましい実施例を添付図面に
基づいて詳細に説明する。図1に示す実施例は、大型コ
ンピュータシステムの配置を例に取ったもので、筐体内
に収納された本体、あるいは外部記憶装置等は、各々正
面側に吸気口1を、背面に排気口2を備えており、図示
しない内部の冷却ファンにより、吸気口1から吸気され
た冷却風を排気口2から強制排気し、内部の各種電子ユ
ニットを冷却する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. In the embodiment shown in FIG. 1, the arrangement of a large-scale computer system is taken as an example. The main body housed in a housing, an external storage device, etc., has an intake port 1 on the front side and an exhaust port 2 on the back side. An internal cooling fan (not shown) forcibly exhausts the cooling air sucked from the intake port 1 from the exhaust port 2 to cool various internal electronic units.

【0015】先ず、複数の電子装置3は、並列に並べら
れて装置列4が構成される。コンピュータシステムの使
い勝手等を考慮して、各装置列4は、単位システムとし
て機能するものの集合であることは望ましいことである
が、必ずしもシステムを単位として並べられたものでな
くても良いことはもちろんである。なお、これら装置列
4は、吸気口1、および排気口2を同一面に向かわせた
状態で並列配置されている。
First, a plurality of electronic devices 3 are arranged in parallel to form a device row 4. In consideration of usability of the computer system and the like, it is desirable that each device array 4 is a set of devices that function as a unit system, but it is not always necessary that the device arrays 4 are arranged as a unit. Is. The device rows 4 are arranged in parallel with the intake port 1 and the exhaust port 2 facing the same plane.

【0016】次に、上記各装置列4は、作業スペースを
考慮して所定の間隔で配置される。これら装置列4、4
間の配置は、排気口配置面5同士が対向するように行わ
れ、かつ、装置列4の天井面4aと部屋の天井面8との
間には、図2に示すように、遮蔽壁9が装置列4の長手
方向に沿って形成される。
Next, the respective device rows 4 are arranged at a predetermined interval in consideration of the work space. These device rows 4, 4
The arrangement is performed so that the exhaust port arrangement surfaces 5 face each other, and between the ceiling surface 4a of the device row 4 and the ceiling surface 8 of the room, as shown in FIG. Are formed along the longitudinal direction of the device row 4.

【0017】この実施例における遮蔽壁9は巻回収納可
能なロールカーテンであり、該ロールカーテンを下げた
状態において、排気口配置面5同士が対向して形成され
るエリアは、吸気口1の配置面同士が対向して形成され
るエリアに対して略遮断される。
The shielding wall 9 in this embodiment is a roll curtain which can be wound and stored, and the area where the exhaust port arrangement surfaces 5 face each other in the state where the roll curtain is lowered is the intake port 1 The area where the disposition surfaces face each other is substantially cut off.

【0018】また、床面、あるいは天井面8に設けられ
る冷気吹き出し口6は、吸気口1配置面同士が対向する
エリアに集中配置されるとともに、空調機7は、排気口
配置面5同士の対向エリアの近傍に配置されており、冷
気が集中的に吸気口1に供給され、排気口2からの排気
を速やかに空調機7により回収される。
Further, the cool air outlets 6 provided on the floor surface or the ceiling surface 8 are centrally arranged in an area where the surfaces on which the intake ports 1 are arranged face each other, and the air conditioner 7 is arranged on the surfaces 5 on which the exhaust ports are arranged. The cool air is intensively supplied to the intake port 1 and is disposed near the facing area, and the exhaust air from the exhaust port 2 is promptly collected by the air conditioner 7.

【0019】したがってこの実施例において、冷気吹き
出し口6からの冷風は、図1において矢印で示すよう
に、各電子装置3内に強制吸気され、内部の電子ユニッ
トを冷却した後、排気口2から排気され、空調機7に吸
い込まれ、この時、図1に示すように、電子装置で熱せ
られた排気は、専用のエリアを通って空調機7に導かれ
るために、吸気口1には、常に吹き出し口6からの冷気
のみが供給されることとなって冷却効率の向上をもたら
し、かつ、排気による室温の上昇が抑えられる。
Therefore, in this embodiment, the cold air from the cool air outlet 6 is forcibly taken into each electronic device 3 as shown by the arrow in FIG. 1 to cool the internal electronic unit, and then from the exhaust port 2. The exhaust gas is sucked into the air conditioner 7, and at this time, as shown in FIG. 1, the exhaust gas heated by the electronic device is guided to the air conditioner 7 through a dedicated area. Since only the cool air is always supplied from the outlet 6, the cooling efficiency is improved, and the rise in the room temperature due to the exhaust is suppressed.

【0020】また、遮蔽壁9としてロールカーテンを使
用すると、設置が簡単で、かつ、必要に応じて上げ下げ
することができる。
If a roll curtain is used as the shielding wall 9, it can be installed easily and can be raised and lowered as required.

【0021】[0021]

【発明の効果】以上の説明から明らかなように、本発明
によれば、排気口からの熱せられた排気が他の電子装置
の吸気口から導入されることがないので、各電子装置に
おける冷却効率を向上させることができる。
As is apparent from the above description, according to the present invention, the heated exhaust gas from the exhaust port is not introduced from the intake port of another electronic device, so that cooling in each electronic device is performed. The efficiency can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.

【図2】図1のA方向矢視図である。FIG. 2 is a view on arrow A in FIG.

【図3】従来例を示す図である。FIG. 3 is a diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1 吸気口 2 排気口 3 電子装置 4 装置列 5 排気口配置面 1 intake port 2 exhaust port 3 electronic device 4 device row 5 exhaust port arrangement surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】筐体の前面に設けた吸気口(1)から吸気し
た冷却風を背面に設けた排気口(2)から強制排出する大
型電子装置(3)を室内に複数個配置する大型電子装置の
配置構造であって、 大型電子装置(3)の吸排気口(1、2)を同一面に向けて
並列配置して装置列(4)を形成し、各装置列(4)の排気
口配置面(5)同士を所定の間隔を置いて対向させた大型
電子装置の配置構造。
1. A large-sized electronic device (3) in which a plurality of large-sized electronic devices (3) for forcibly discharging cooling air sucked from an air-intake port (1) provided on the front side of a housing from an exhaust port (2) provided on the back side are arranged in a room. In the arrangement structure of the electronic device, the intake / exhaust ports (1, 2) of the large electronic device (3) are arranged in parallel so as to face each other to form a device row (4). Arrangement structure of large electronic devices in which the exhaust port arrangement surfaces (5) face each other with a predetermined gap.
【請求項2】前記大型電子装置(3)が設置される部屋の
冷気吹き出し口(6)は、吸気口(1)の配置面同士が対向
するエリアに集中配置され、かつ、空調機(7)は排気口
配置面(5)同士の対向エリアの近傍に集中配置される請
求項1記載の大型電子装置の配置構造。
2. The cool air outlet (6) of the room in which the large electronic device (3) is installed is centrally arranged in an area where the arrangement surfaces of the air inlets (1) face each other, and the air conditioner (7) 2. The arrangement structure of the large-sized electronic device according to claim 1, wherein the plurality of) are concentrated in the vicinity of the area where the exhaust port arrangement surfaces (5) face each other.
【請求項3】前記各装置列(4)の天井面(4a)と部屋の
天井面(8)との間隙部を、前記装置列(4)に沿って設置
されるロールカーテンにより閉塞した請求項1または2
記載の大型電子装置の配置構造。
3. A gap between a ceiling surface (4a) of each device row (4) and a ceiling surface (8) of a room is closed by a roll curtain installed along the device row (4). Item 1 or 2
Arrangement structure of the described large electronic device.
JP4183873A 1992-07-10 1992-07-10 Layout structure of large electronic devices Expired - Lifetime JP2744554B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4183873A JP2744554B2 (en) 1992-07-10 1992-07-10 Layout structure of large electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4183873A JP2744554B2 (en) 1992-07-10 1992-07-10 Layout structure of large electronic devices

Publications (2)

Publication Number Publication Date
JPH0629681A true JPH0629681A (en) 1994-02-04
JP2744554B2 JP2744554B2 (en) 1998-04-28

Family

ID=16143324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4183873A Expired - Lifetime JP2744554B2 (en) 1992-07-10 1992-07-10 Layout structure of large electronic devices

Country Status (1)

Country Link
JP (1) JP2744554B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002156136A (en) * 2000-11-20 2002-05-31 Takasago Thermal Eng Co Ltd Air-conditioning system for communication instruments, etc
JP2006064303A (en) * 2004-08-27 2006-03-09 Ntt Power & Building Facilities Inc Air conditioning and system exhaust guidance device for computer room
JP2008128538A (en) * 2006-11-20 2008-06-05 Kitagami Densetsu Kogyo Kk Cooling method for heat generation equipment and cooling device
JP2009071084A (en) * 2007-09-14 2009-04-02 Hitachi Ltd Controller equipped with forced air-cooling part
JP2009109045A (en) * 2007-10-26 2009-05-21 Wit Japan Co Ltd Air conditioning system for computer room and its air distribution rack
JP2009127940A (en) * 2007-11-22 2009-06-11 Hitachi Plant Technologies Ltd Air conditioning apparatus and air conditioning method for clean room
JP2009266051A (en) * 2008-04-28 2009-11-12 Hitachi Ltd Disk array device and electronic device
JP2010025451A (en) * 2008-07-18 2010-02-04 Ntt Facilities Inc Air conditioning system for computer room
JP2010038480A (en) * 2008-08-07 2010-02-18 Shimizu Corp Air conditioning system
JP2010071482A (en) * 2008-09-16 2010-04-02 Takasago Thermal Eng Co Ltd Air conditioning system for high-density thermal load chamber
JP2010164218A (en) * 2009-01-14 2010-07-29 Shinryo Corp Air-conditioning method of server machine room
JP2010255886A (en) * 2009-04-22 2010-11-11 Ntt Comware Corp Device housing system and method of constructing device housing system
JP2011081528A (en) * 2009-10-06 2011-04-21 Takasago Thermal Eng Co Ltd Air conditioning system
JP2011129149A (en) * 2011-02-10 2011-06-30 Hitachi Cable Ltd Data center

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189790U (en) * 1987-12-07 1989-06-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189790U (en) * 1987-12-07 1989-06-13

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4558177B2 (en) * 2000-11-20 2010-10-06 高砂熱学工業株式会社 Air conditioning system for communication equipment room, etc.
JP2002156136A (en) * 2000-11-20 2002-05-31 Takasago Thermal Eng Co Ltd Air-conditioning system for communication instruments, etc
JP2006064303A (en) * 2004-08-27 2006-03-09 Ntt Power & Building Facilities Inc Air conditioning and system exhaust guidance device for computer room
JP4633407B2 (en) * 2004-08-27 2011-02-16 株式会社Nttファシリティーズ Air conditioning system for computer room
JP2008128538A (en) * 2006-11-20 2008-06-05 Kitagami Densetsu Kogyo Kk Cooling method for heat generation equipment and cooling device
JP2009071084A (en) * 2007-09-14 2009-04-02 Hitachi Ltd Controller equipped with forced air-cooling part
JP2009109045A (en) * 2007-10-26 2009-05-21 Wit Japan Co Ltd Air conditioning system for computer room and its air distribution rack
JP2009127940A (en) * 2007-11-22 2009-06-11 Hitachi Plant Technologies Ltd Air conditioning apparatus and air conditioning method for clean room
JP2009266051A (en) * 2008-04-28 2009-11-12 Hitachi Ltd Disk array device and electronic device
US7872865B2 (en) 2008-04-28 2011-01-18 Hitachi, Ltd. Disk array device and electronic device
JP2010025451A (en) * 2008-07-18 2010-02-04 Ntt Facilities Inc Air conditioning system for computer room
JP2010038480A (en) * 2008-08-07 2010-02-18 Shimizu Corp Air conditioning system
JP2010071482A (en) * 2008-09-16 2010-04-02 Takasago Thermal Eng Co Ltd Air conditioning system for high-density thermal load chamber
JP2010164218A (en) * 2009-01-14 2010-07-29 Shinryo Corp Air-conditioning method of server machine room
JP2010255886A (en) * 2009-04-22 2010-11-11 Ntt Comware Corp Device housing system and method of constructing device housing system
JP2011081528A (en) * 2009-10-06 2011-04-21 Takasago Thermal Eng Co Ltd Air conditioning system
JP2011129149A (en) * 2011-02-10 2011-06-30 Hitachi Cable Ltd Data center

Also Published As

Publication number Publication date
JP2744554B2 (en) 1998-04-28

Similar Documents

Publication Publication Date Title
JPH0629681A (en) Arrangement structure of large electronic equipment
US7254022B2 (en) Cooling system for equipment and network cabinets and method for cooling equipment and network cabinets
US7604535B2 (en) Assembly for extracting heat from a housing for electronic equipment
US4860163A (en) Communication equipment cabinet cooling arrangement
US5497288A (en) Apparatus for tilted serial cooling in an electronic system
US8141621B2 (en) Apparatus and method for providing in situ cooling of computer data centers during service calls
US6512672B1 (en) Modular air flow distribution system
EP2685800B1 (en) Container-type data center
US20070109741A1 (en) Power supply cooling system
US20090122483A1 (en) Water-assisted air cooling for a row of cabinets
JPH05267860A (en) Electronic equipment module housing
JP2020504885A (en) A system that cools components placed in the housing
JPH05102688A (en) Electronic device apparatus
WO2017121302A1 (en) Air-guiding cabinet and communication system
JP2009275994A (en) Ventilation device and air-conditioning ventilation system
KR101134468B1 (en) Cooling apparatus and its method of internet data center
US8345418B2 (en) Cooling configuration for communication boards
EP2444753A2 (en) Air-conditioning system
JP3260063B2 (en) Auxiliary cooling device and its installation method
JPH1096550A (en) Housing for electronic apparatus
JP6338794B1 (en) control panel
JP4919512B2 (en) Air conditioning system for computer room and fan rack thereof
WO2021017595A1 (en) Communication device
KR101912684B1 (en) Cooling system for EMP rack
JP4212441B2 (en) Electronic equipment rack