JPH09181252A - Electronic parts housing case for mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount electronic parts on an external circuit board simultaneously with other electronic parts by a solder reflow method or a flow solder dipping method even when the electronic parts are composed a multilayered circuit board, IC package, etc., having a weak heat resistance. SOLUTION: In order to prevent the transmission of external heat to electronic parts 4, an electronic parts housing case 1 for mounting is provided. The case 1 is provided with a resin case main body section 3 for housing the parts 4 and a plurality of terminal blocks 6 which are partially buried in the main body section 3 so that the blocks 6 can be positioned along the edge section 5 of the section 3 which controls the opening 2 of the section 3. Each terminal block 6 is connected to the terminals of the parts 4 and, at the same time, soldered to an external circuit board 21. Each terminal block 6 has exposed parts on both surfaces so that heat can be radiated efficiently from the block 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a terminal board which is electrically connected to an electronic component while accommodating the electronic component, and the electronic component is soldered and mounted on an external circuit board. Therefore, the present invention relates to a mounting electronic component storage case in which these terminal plates are used as terminal means for soldering.

[0002]

2. Description of the Related Art In recent years, technological advances in home electric appliances, communications, industrial electronic devices, etc. have been remarkable, and accordingly, the characteristics, precision, cost, etc. required of electronic parts used in those devices are infinite. Although the demands are becoming severe, the technology related to electronic parts has been significantly advanced to meet these requirements.

In particular, the demands from the aspect of mounting technology of electronic parts are realized every day, the mounting area is smaller, and the intervals between the parts are becoming narrower. Against this background, in order to be able to more efficiently mount more components on a smaller area, for example, all of the various electronic components to be mounted, or as many as possible at once. It is desirable to be able to solder
As a soldering method capable of satisfying this demand, there are a solder reflow method and a flow solder dip method.

In order to be able to apply the above-mentioned solder reflow method, all the various electronic components to be mounted by this must have heat resistance capable of withstanding the temperature during the solder reflow operation. On the other hand, in order to enable the application of the flow solder dipping method, the heat conducted from the terminals should not adversely affect the electronic component body while applying the flow solder.

On the other hand, one form of electronic component is, for example, an IC package, a multilayer circuit board, or a composite electronic component in which another discrete electronic component or an IC package is mounted on the multilayer circuit board.
However, electronic components such as the above-mentioned IC package, multilayer circuit board, or other discrete electronic components or composite electronic components in which an IC package or the like is mounted on the multilayer circuit board have a problem in heat resistance, and therefore, in mounting. In some cases, it is difficult to simply adopt the solder reflow method or the flow solder dip method as described above to perform soldering simultaneously with other electronic components.

Therefore, in an IC package, for example, a socket electrically connected to the IC package is previously mounted on the circuit board by the solder reflow method or the flow solder dip method, and then mounted on the socket in a later step. Doing what you do. In addition, in the case of a multilayer circuit board, after mounting other electronic components, soldering for this multilayer board is performed again.

[0007]

However, any of the methods adopted for mounting the IC package or the multilayer circuit board as described above impedes the efficiency of the mounting process, and is desired to be improved. is there. Further, when the socket is mounted in advance, the area required for mounting is increased, which hinders the improvement of the mounting density. Therefore, improvement in this respect is also desired.

Therefore, an object of the present invention is to satisfy the above-mentioned demand.

[0009]

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned technical problem by providing a mounting electronic component storage case for storing electronic components in which heat resistance is a problem at the time of mounting. To do. That is, the mounting electronic component storage case according to the present invention is for storing an electronic component including a plurality of component terminals, and includes a resin case main body portion having an opening formed on one surface thereof. Then, a plurality of terminal boards are positioned along the edge portion that defines the opening of the resin case body. These terminal plates are partially embedded in the resin case main body while the remaining portions are exposed from the resin case main body, and at these exposed portions, they are electrically connected to the component terminals of the housed electronic components, respectively. Soldered to each external circuit board.

[0010]

The mounting electronic component storage case according to the present invention stores the electronic components therein while keeping the component terminals of the electronic components electrically connected to the terminal board.
By soldering the terminal board to the circuit board, the electronic component can be mounted on the circuit board as a result.

As described above, when the electronic component is stored in the mounting electronic component storage case according to the present invention, the external heat is less likely to be transferred to the internal electronic component. For example, in the solder reflow process, the electronic component is removed from the heat. It can be protected advantageously. Further, in the flow solder dipping process, since the terminal board relays between the component terminal of the electronic component and the circuit board, the heat transfer path from the circuit board to the electronic component becomes longer, and heat is transferred to the electronic component. It gets harder.

Therefore, by using the mounting electronic component storage case according to the present invention, the solder reflow method or the flow can be applied even to electronic components having a problem of heat resistance, such as IC packages and multilayer circuit boards. It becomes possible to mount on the circuit board by applying the solder dipping method. Therefore, even these electronic parts that have problems with heat resistance,
The solder reflow method and the flow solder dip method can be applied at the same time under the same conditions as those of other electronic components for mounting, and the efficiency of the mounting process can be improved.

In the mounting electronic component storage case according to the present invention, further comprising means for positioning the electronic component in the resin case body with respect to the insertion direction from the opening, the electronic component is mounted on the mounting electronic component. The work of mounting in the component storage case becomes easy. At this time, the positioning means includes a step portion that receives the electronic component inserted into the resin case main body portion from the opening, and a claw that engages with the peripheral portion of the electronic component so as to sandwich the electronic component between the step portion and the step portion. With, it does not hinder the insertion operation of electronic parts, and
After the insertion, the electronic component can be surely positioned.

Further, in this case, if the step portion is formed on the resin case body portion and the claw is formed on the terminal plate, the die and molding operation for molding the resin case body portion become complicated. Without it, the step and the claw can be formed. In addition, if the claws contact the component terminals of the electronic component, the contact area for electrical connection between the terminal plate and the component terminals can be made wider, and more reliable electrical connection can be achieved. can do.

In the mounting electronic component storage case according to the present invention, it is preferable that the above-mentioned exposed portion of each terminal plate has portions for exposing both surfaces thereof. In this way, if the terminal board has exposed portions on both sides, heat dissipation on the terminal board is promoted. Therefore, for example, when applying the flow solder dip method, in order to prevent adverse effects on electronic components, It is possible to further suppress heat transfer to the electronic component and also suppress heat transfer to the resin case main body, and prevent undesired deformation and deterioration of the resin case main body.

If the above-mentioned exposed portions on both sides are formed at the tip of the terminal board, the heat radiation effect can be further enhanced. Also, if the tip of the terminal board with both surfaces exposed is used as the portion to be soldered to the external circuit board, the distance from the soldered portion to the resin case body can be made longer, and therefore the soldering It is possible to make it more difficult for heat to be transferred to the resin case body.

As described above, when the front end portion of the terminal plate whose both surfaces are exposed is to be soldered to the external circuit board, the terminal plate, including the front end surface thereof, has good solderability. It is preferred that the surface coating to be applied is formed.
According to this, a solder fillet is easily formed at the time of soldering, which can contribute to improvement of reliability of soldering.

Further, when a notch is formed in the edge portion that defines the opening of the resin case body portion so as to widen the exposed portions on both sides of each terminal plate, the terminal plate is removed from the edge portion of the opening of the resin case body portion. It is possible to enhance the heat dissipation effect without projecting too much. Further, by thus preventing the terminal plate from protruding so much from the resin case main body portion, when mounting the mounting electronic component storage case according to the present invention on the circuit board, surface mounting can be applied without problems. .

Further, in the present invention, when a plurality of terminal boards are to be obtained by cutting them from the hoop material, it is preferable that a cut portion for facilitating the cutting is formed in advance in the cutting portion of the hoop material. preferable. As a result, the terminal board can be separated without using a special tool, the process for obtaining the mounting electronic component storage case according to the present invention can be streamlined, and the terminal board is not removed at the time of separation. The desired deformation can be prevented.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings are for explaining a mounting electronic component storage case 1 according to an embodiment of the present invention. Here, FIGS. 1, 2, and 3 are a perspective view, a front view, and a bottom view, respectively, showing the mounting electronic component storage case 1 from below, and FIG. 4 is a line IV in FIG.
FIG. 4 is an enlarged sectional view taken along line IV.

First, a schematic description will be given. The mounting electronic component storage case 1 is provided with a resin case body 3 having an opening 2 on one surface, that is, a lower surface in the illustrated posture. As shown in FIG. 9, the resin case body 3 is for housing the electronic component 4 to be mounted. Along the edge 5 that defines the opening 2 of the resin case body 3,
A plurality of terminal boards 6 are located. These terminal boards 6 are
As shown in FIG. 4, each part is embedded in the resin case body 3, while the remaining part is exposed from the resin case body 3. Such a mounting electronic component storage case 1 can be obtained by molding the resin case body 3 with the terminal plate 6 inserted.

The above-mentioned exposed portion of each terminal board 6 has portions for exposing both surfaces thereof. In this embodiment, these double-sided exposed portions are formed at the tip of each terminal plate 6, and in order to further widen these double-sided exposed portions,
In the edge portion 5 that defines the opening 2 of the resin case body portion 3,
The cutout 7 is formed. The exposed portion on both sides has a portion extending along the side wall of the resin case body portion 3 and a portion extending along the end surface of the end edge portion 5 that defines the opening 2 by being bent from the portion. The front end surface 8 of the portion extending along the side faces the outside of the resin case body 3.

The widthwise dimension of each terminal plate 6 is the same as the widthwise dimension of the notch 7 described above. Therefore, while the notch 7 is advantageously closed by the terminal plate 6,
It is possible to minimize the contact area between the exposed portions of both surfaces and the resin case body 3. The end surfaces of both side portions of the terminal plate 6 are in contact with both side portions of the cutout 7. Also, each terminal board 6
A through hole 9 is provided in the embedded part of the terminal plate 6, and a part of the resin forming the resin case main body 3 is filled in the through hole 9 so that the terminal plate 6 can be removed from the resin case main body 3. Is prevented.

The mounting electronic component storage case 1 is also provided.
Has a positioning means for positioning the stored electronic component 4 in the resin case body 3 with respect to the insertion direction from the opening 2. In this embodiment, the positioning means includes a step portion 10 for receiving the electronic component 4 inserted from the opening 2 into the resin case body portion 3, and a step portion 1 for the electronic component 4.
And a claw 11 that engages with the peripheral edge portion of the electronic component 4 so as to be sandwiched between the electronic component 4 and the electronic component 4. More specifically, the step portion 10 is formed on the resin case body portion 3, and the claw 11 is formed on the terminal plate 6. The claw 11 is formed by cutting and raising a part of the terminal board 6, for example.

The above-mentioned plurality of terminal boards 6 are obtained by being separated from the hoop material 12 shown in FIGS. 5 and 6. FIG. 5 is a front view of the hoop member 12, and FIG.
Is a bottom view of the same. 7 is an enlarged view of a portion VII surrounded by a circle in FIG. 6, and FIG. 8 is an enlarged sectional view taken along line VIII-VIII of FIG. The hoop material 12 has a set of a plurality of terminal plates 6 for each of the plurality of mounting electronic component storage cases 1 distributed in its longitudinal direction, and is obtained by sheet-metal working a strip-shaped metal plate. is there. Each terminal board 6
The above-described through hole 9 is formed in the portion to be formed, and the U-shaped slit 1 for cutting and raising the claw 11 is formed.
3 is formed. At this stage, the slits 13 are simply formed, and the claws 11 are raised after the molding of the resin case body 3 is completed.

A rectangular through hole 14 is formed in the hoop material 12 adjacent to the portion to be the terminal plate 6. The widthwise dimension of the through hole 14 is made larger than the widthwise dimension of the terminal plate 6. The front end surface 8 of the terminal plate 6 described above has the through hole 14
It is given with one side. To get the hoop material 12,
For example, a band-shaped metal plate is punched by a press to obtain a desired planar shape, and then a surface coating made of gold, silver, tin, solder or the like is usually plated to give good solderability to the terminal plate 6. Is formed on the hoop material 12. Therefore, this surface coating can also be formed on the inner peripheral surface of the through hole 14, that is, on the tip surface 8 of the terminal plate 6. Then, as shown in FIGS. 5 and 6, a process for bending the portion to be the terminal plate 6 in a direction perpendicular to the extending direction of the hoop material 12 is performed.

Further, the tip surface 8 of the terminal plate 6 is defined by one side of the through hole 14 as described above, but in order to separate the terminal plate 6 from the hoop material 12, from the side of the through hole 14. Two parallel lines extending vertically, that is, the terminal board 6
A cut must be made along the side edges 15 of the part to be the tip of the. In this embodiment, in order to facilitate such separation, notches 16 having a V-shaped cross section, for example, are formed in advance along the both side edges 15 as shown in FIG. These cuts 16 are formed, for example, in the above-described press working process.

The hoop material 12 thus obtained is
After being inserted into the mold, the resin case body 3 is molded in that state. Although illustration of the mold is omitted, the cavity shape of the mold is the resin case body 3
It will be obvious from the outer surface shape of the terminal board 6. And
After such a molding process, the above-mentioned claw 11 is raised,
In addition, the terminal board 6 is separated from the hoop material 12 along the notches 16, and thereby the individual mounting electronic component storage cases 1 are obtained.

An electronic component 4 is inserted into the mounting electronic component storage case 1 as shown in FIG. Electronic components 4
Is sandwiched between the step portion 10 formed on the resin case body portion 3 and the claw 11 formed on the terminal plate 6 and positioned in the resin case body portion 3. The electronic component 4 includes a plurality of component terminals 17 corresponding to the plurality of terminal boards 6, and when inserted as described above, these component terminals 17 are respectively
It contacts each exposed part of the corresponding terminal plate 6.

In this embodiment, the electronic component 4 comprises a multilayer circuit board 18 and a plurality of discrete electronic component elements 19 mounted thereon. Alternatively, the electronic component 4 may include only the multilayer circuit board 18, the multilayer circuit board 18 and the IC package mounted on the multilayer circuit board 18, or only the IC package.

The above-mentioned component terminal 17 is a related terminal board 6.
Solder 20 is soldered to each exposed portion of the. In addition, this soldering and the insertion of the electronic component 4 described above,
It may be performed at a stage where the mounting electronic component storage case 1 is not yet separated from the hoop material 12. Also, nail 1
If 1 can be brought into spring contact with the component terminal 17, such electrical soldering may be achieved by simply contacting the component terminal 17 and the terminal plate 6 without soldering.

As described above, the mounting electronic component storage case 1 in which the electronic components 4 are stored is mounted on the external circuit board 21. More specifically, the circuit board 21 has a plurality of conductive lands 22 corresponding to the plurality of terminal boards 6, and the exposed front ends of the terminal boards 6 associated with the conductive lands 22 have solder 23. To be soldered. At this time,
As described above, since each terminal plate 6 is also formed with a surface coating on the tip surface 8 thereof so as to give good solderability, the solder 23 can easily form a solder fillet, and a reliable solder can be obtained. Achieve a date.

The above-mentioned soldering can be efficiently performed by, for example, the solder reflow method or the flow solder dip method. When carrying out the solder reflow method, the mounting electronic component storage case 1 advantageously protects the electronic component 4 from heat during the solder reflow operation. On the other hand, when the flow solder dip method is carried out, as described above, the terminal plate 6 exposes a large part of the resin case main body portion 3, so that the heat generated during the solder dip operation is the exposed portion of the terminal plate 6. The heat is efficiently dissipated from the resin, and therefore is less likely to be transmitted to the resin case body 3 and the electronic component 4. The above-described soldering of the component terminal 17 and the terminal plate 6 with the solder 20 may also be performed during this solder dip operation.

Although the present invention has been described above with reference to the preferred embodiments, without departing from the scope of the present invention,
The above-described embodiment can be variously modified. For example, the terminal board 6 may be taken out from a hoop material having another shape instead of the hoop material 12 having the illustrated shape, or may be obtained by a method other than the method using the hoop material. .

Further, the shape of the resin case body 3 is arbitrarily changed according to the shape of the electronic component 4 housed therein. Further, the arrangement state of the terminal board 6 is also arbitrarily changed according to the arrangement state of the component terminals 17 included in the stored electronic component 4. Further, although the step portion 10 for positioning the electronic component 4 is located at the peripheral portion inside the resin case body portion 3, it may be located at the central portion inside the resin case body portion 3.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a mounting electronic component storage case 1 according to an embodiment of the present invention from below.

FIG. 2 is a front view of the mounting electronic component storage case 1 shown in FIG.

3 is a bottom view of the mounting electronic component storage case 1 shown in FIG. 1. FIG.

FIG. 4 is an enlarged cross-sectional view of a main part taken along line IV-IV in FIG.

FIG. 5 is a terminal board 6 included in the mounting electronic component storage case 1.
It is a front view which shows the hoop material 12 for obtaining.

6 is a bottom view of the hoop member 12 shown in FIG.

FIG. 7 is an enlarged view of a circled portion VII of FIG.

8 is an enlarged cross-sectional view taken along the line VIII-VIII in FIG.

9 is a sectional view taken along line IV-IV in FIG. 2 showing a state in which the electronic component 4 is stored in the mounting electronic component storage case 1 and the mounting electronic component storage case 1 is mounted on the external circuit board 21. It is sectional drawing shown with a considerable cross section.

[Explanation of symbols]

 1 electronic component storage case for mounting 2 opening 3 resin case body 4 electronic component 5 edge 6 terminal plate 7 notch 8 tip surface 10 step 11 claw 12 hoop material 14 through hole 16 notch 17 component terminal 20, 23 solder 21 circuit board

Claims (10)

[Claims] 1. A resin case body for accommodating an electronic component having a plurality of component terminals, wherein an opening is formed in one surface, and an edge defining the opening of the resin case body. Along the portion, each remaining portion is exposed from the resin case body portion while each part is embedded in the resin case body portion, and is electrically connected to the component terminal at the exposed portion and externally. An electronic component storage case for mounting, comprising a plurality of terminal boards which are respectively soldered to a circuit board. 2. The mounting electronic component storage case according to claim 1, further comprising means for positioning the electronic component in the resin case body with respect to a direction of insertion from the opening. 3. The positioning means includes a stepped portion that receives the electronic component inserted from the opening in the resin case body, and a peripheral edge of the electronic component so as to sandwich the electronic component between the stepped portion. 3. A claw that engages the portion.
Electronic component storage case for mounting described in. 4. The step portion is formed on the resin case body portion, and the claw is formed on the terminal plate.
Electronic component storage case for mounting described in. 5. The mounting electronic component storage case according to claim 1, wherein the exposed portion of each terminal plate has portions exposing both surfaces thereof. 6. The mounting electronic component storage case according to claim 5, wherein the exposed portions on both sides are formed at a tip end portion of the terminal board. 7. The mounting electronic component storage case according to claim 6, wherein a tip portion of the terminal board is a portion to be soldered to the external circuit board. 8. The terminal plate, including the tip surface thereof,
A surface coating is formed that gives good solderability,
The mounting electronic component storage case according to claim 7. 9. The cutout for expanding the exposed portions on both sides of each terminal plate is formed in an edge portion defining the opening of the resin case main body portion.
The electronic component storage case for mounting according to any one of 1. 10. The plurality of terminal plates are obtained by being cut from a hoop material, and a cut portion for facilitating the cutting is formed in advance at a cut portion of the hoop material. Item 10. A mounting electronic component storage case according to any one of items 1 to 9.