JPH09180975A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve perfect sealing without making a reaction product attach to a sealing surface by providing a valve disc having a seal in contact with the sealing surface of a valve part of an exhaust pipe and providing in place of the valve disc a protective member in contact with the sealing surface of the valve part of the exhaust pipe. SOLUTION: An exhaust pipe 26 has a valve part 32 having an annular sealing surface 32a. A cutoff valve 30 is provided with a valve disc 34 and a protective member 36. The valve disc 34 and the protective member 36 are the same each other and have an external shape corresponding to the cross-sectional shape of the valve part 32 of the exhaust pipe 26. The valve disc 34 has a solid structure so that it cuts off the flow of a gas and has an annular seal 34a which can be in contact with the sealing surface 32a of the valve part 32 of the exhaust pipe 26. The protective member 36 has an opening 38 to allow the flow of the exhaust gas, and has an annular seal 36a which can be in contact with the sealing surface 32a of the valve part 32 of the exhaust pipe 26.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus having a reaction chamber for CVD or etching, for example.

[0002]

2. Description of the Related Art In a semiconductor manufacturing apparatus for performing CVD or etching, a gas required for processing is introduced into a reaction chamber,
A wafer or the like is processed in the reaction chamber. An exhaust pipe is connected to the reaction chamber, and exhaust is performed by a vacuum pump. In addition, a shutoff valve is placed in the middle of the exhaust pipe, and the shutoff valve is closed to open the reaction chamber to the atmosphere while operating the vacuum pump, check the reaction chamber for leaks, and check the exhaust system for abnormalities. If so, it prevents the back diffusion of pollutants from the exhaust system. This shutoff valve is equipped with a seal that comes into close contact with the sealing surface of the valve portion of the exhaust pipe,
When the shutoff valve is closed, the reaction chamber is completely shut off from the exhaust system.

[0003]

The gas exhausted from the reaction chamber is decomposed by plasma or the like in the reaction chamber,
It contains an adhesive reaction product formed by reacting with a sample (object to be treated). When the shutoff valve is closed, the shutoff valve seal is in close contact with the exhaust pipe sealing surface.
Exhaust gases and adhering reaction products do not enter the sealing surface of the exhaust pipe.

When the shutoff valve is opened, the sealing surface of the exhaust pipe is exposed. There, the exhaust gas flows through the exhaust pipe, and the adhering reaction products also flow along with the exhaust gas along the exhaust pipe. However, when the shutoff valve opens, the seal of the shutoff valve moves together with the valve element and the sealing surface of the exhaust pipe is exposed.
Adhesive reaction products contained in the exhaust gas may adhere to the sealing surface of the exhaust pipe. If adherent reaction products adhere to the seal surface of the exhaust pipe, the next time the shutoff valve is closed, the adhered material will be caught between the seal of the shutoff valve and the seal surface of the exhaust pipe, and There is a problem that the sealing surface of the exhaust pipe does not adhere to it.

Therefore, when the shut-off valve cannot be closed completely and the reaction chamber is opened to the atmosphere, the atmosphere flows into the exhaust pipe through the gap formed on the sealing surface, and the vacuum pump is overloaded. Alternatively, even if the shutoff valve is closed to perform the leak test of the reaction chamber, the gas in the reaction chamber is minutely exhausted from the gap of the sealing surface, so that the accurate leak test cannot be performed.

An object of the present invention is to have a shut-off valve capable of completely sealing the reaction surface without adhering reaction products to prevent overloading of the vacuum pump and perform an accurate leak test. The present invention is to provide a semiconductor manufacturing apparatus as described above.

[0007]

A semiconductor manufacturing apparatus according to the present invention comprises a reaction chamber, an exhaust pipe connected to the reaction chamber, and a shutoff valve device arranged in a valve portion having a sealing surface of the exhaust pipe. The shut-off valve device has a seal having a shape corresponding to the cross-sectional shape of the valve portion of the exhaust pipe so as to shut off the flow of exhaust gas, and having a seal which is brought into close contact with the sealing surface of the valve portion of the exhaust pipe. It is characterized by comprising a valve body provided with the exhaust gas, and a protection member having a seal that allows the exhaust gas to flow and instead of the valve body, is brought into close contact with the sealing surface of the valve portion of the exhaust pipe. .

In this structure, together with the valve body having a seal which is brought into close contact with the sealing surface of the valve portion of the exhaust pipe,
Instead of the valve body, a protective member is provided which is brought into close contact with the sealing surface of the valve portion of the exhaust pipe. When closing the shutoff valve device, this valve body is positioned in the valve portion of the exhaust pipe,
When opening the shut-off valve device, the protection member is positioned at the valve portion of the exhaust pipe. Therefore, the exhaust gas can flow through the exhaust pipe when the shut-off valve device is opened, and in this case the sealing surface of the valve portion of the exhaust pipe is protected by the protective member. Therefore, the adhesive reaction product does not adhere to the sealing surface of the exhaust pipe when the shutoff valve device is opened.

The valve body and the seal protection member are preferably mounted on a support member so as to move simultaneously.
In this case, the support member may be rotatably arranged, and the valve body and the protection member may be alternately positioned on the valve portion of the exhaust pipe by the rotational movement of the support member. Alternatively, the support member may be configured to be reciprocally movable, and the valve body and the protection member may be alternately positioned on the valve portion of the exhaust pipe by the reciprocal movement of the support member.

[0010]

1 is a diagram showing a semiconductor manufacturing apparatus 10 according to a first embodiment of the present invention. The semiconductor manufacturing apparatus 10 has a reaction chamber 12. An RF power source 14 is provided in the reaction chamber 12.
The RF electrode 16 and the counter electrode 18, which are connected to each other, are arranged. The wafer 20 to be processed is placed on the RF electrode 16, and the plasma 2 is placed between the RF electrode 16 and the counter electrode 18.
2 are formed.

A gas introduction pipe 24 and an exhaust pipe 26 are connected to the reaction chamber 12. The gas required for processing is introduced into the reaction chamber 12 from the gas introduction pipe 24 as indicated by arrow I, and the wafer 20 is processed in the reaction chamber 12, and the gas is then exhausted as indicated by arrow O. 26
Exhausted through. The exhaust gas contains adhesive reaction products, and the adhesive reaction products together with the exhaust gas are exhaust pipe 2
Go through 6.

A pressure adjusting valve 28 and a shutoff valve device 30 are arranged in the exhaust pipe 26. As shown in FIGS. 1 to 3, the exhaust pipe 26 has a valve portion 3 having an annular sealing surface 32a.
2 The shutoff valve device 30 includes a valve body 34 and a protection member 3.
6 is provided. The valve element 34 and the protection member 36 are the same as each other and have an outer shape corresponding to the cross-sectional shape of the valve portion 32 of the exhaust pipe 26. Therefore, when the cross-sectional shape of the exhaust pipe 26 is circular, the outer shapes of the valve element 34 and the protection member 36 are circular. If the cross-sectional shape of the exhaust pipe 26 is rectangular, the outer shapes of the valve element 34 and the protection member 36 are rectangular.

The valve element 34 has a solid structure so as to block the flow of the exhaust gas, and the sealing surface 3 of the valve portion 32 of the exhaust pipe 26.
It has an annular seal 34a that can be in close contact with 2a. The protection member 36 has an opening 38 that allows the flow of exhaust gas, and has an annular seal 36a that can be in close contact with the sealing surface 32a of the valve portion 32 of the exhaust pipe 26. Therefore, the valve body 34 is attached to the exhaust pipe 2
6, the exhaust gas flow is blocked, and when the protective member 36 is positioned on the valve portion 32 of the exhaust pipe 26, the exhaust gas flow is allowed and the seal 36 is provided.
a is in close contact with the sealing surface 32a, and the reaction product is the sealing surface 3
2a is prevented and the sealing surface 32a is protected.

The exhaust pipe 26 communicates with a vacuum pump (not shown), and the reaction chamber 12 is exhausted while the shut-off valve device 30 is opened (with the protective member 36 positioned in the valve portion 32). Vacuum and CVD for semiconductor manufacturing
Processing such as etching or etching can be performed. Further, the shut-off valve device 30 is closed (the valve body 34 is positioned in the valve portion 32), and the reaction chamber 12 is operated while operating the vacuum pump.
Can be opened to the atmosphere and leaks in the reaction chamber 12 can be checked. Further, when there is an abnormality in the exhaust system, the reverse diffusion of pollutants from the exhaust system is prevented.

Further, the valve element 34 and the protection member 36 are attached to the support member 40 so as to move simultaneously. 2 and 3, the support member 40 is disposed integrally with the shaft 42 so as to be rotatable around the axis of the shaft 42, and the valve body 34 and the protection member 36 are alternately arranged by the rotational movement of the support member 40. It is adapted to be positioned on the valve portion 32 of 26. The valve element 34, the protection member 36, and the support member 40 are arranged in a case 44 including the valve portion 32 of the exhaust pipe 26.

The shaft 42 extends vertically by projecting from an upper wall and a bottom wall of the case 44, and seals 44a and 44b are arranged on the upper wall and the bottom wall of the case 44, respectively. The upper end of the shaft 42 is biased downward by a spring 46. The shaft 42 is supported by a bearing 48 at a position below the bottom wall of the case 44. A roller 52 is attached to the lateral protrusion 50 of the shaft 42,
2 is mounted on the cam member 54.

The cam member 54 is the valve body 34 or the protection member 3.
6 is provided with a raised portion at the rotational position where the valve portion 32 of the exhaust pipe 26 comes to the position of the valve portion 32, so that the valve element 34 or the protection member 36 has a ridge 46.
Against the sealing surface 32a of the valve portion 32 of the exhaust pipe 26. Further, in the cam member 54, at other positions of the valve body 34 and the protection member 36, the valve body 34 and the protection member 36 are pushed down by the spring 46 so that the support member 40 can rotate smoothly. Further, the shaft 42 is coupled to the motor 58 via a coupling 56. Therefore, the motor 58 can be driven by the command of the control means (not shown) to alternately bring the valve element 34 or the protection member 36 to the position of the valve portion 32 of the exhaust pipe 26.

FIG. 4 is a diagram showing a shutoff valve device 30 of a semiconductor manufacturing apparatus according to a second embodiment of the present invention. Other parts of the semiconductor manufacturing apparatus may have the same configuration as that shown in FIG. The shutoff valve device 30 is similar to that of the previous embodiment.
The valve portion 32 of the exhaust pipe 26 so as to block the flow of exhaust gas.
34a having a shape corresponding to the cross-sectional shape of the exhaust pipe 26 and closely fitted to the sealing surface 32a of the valve portion 32 of the exhaust pipe 26
And a sealing surface 32a of the valve portion 32 of the exhaust pipe 26 instead of the valve body 34 while allowing the flow of exhaust gas.
Protective member 36 provided with a seal 36a that can be closely attached to
Consists of

Further, the valve element 34 and the protection member 36 are attached to the support member 40 so as to move simultaneously. In this embodiment, the support member 40 is attached to the piston rod 62 of the air cylinder 60. Therefore, the support member 40 is disposed so as to be reciprocally movable, and the valve element 34 and the protection member 36 are alternately moved by the reciprocating movement of the support member 40.
It is adapted to be positioned at the valve portion 32 of 6. The operation of the semiconductor manufacturing apparatus of this embodiment is similar to that of the previous embodiment.

[0020]

As described above, according to the present invention,
To obtain a semiconductor manufacturing device that has a shut-off valve that can completely seal the reaction surface without attaching reaction products to prevent overloading of the vacuum pump and to perform an accurate leak test. You can

[Brief description of the drawings]

FIG. 1 is a diagram showing a semiconductor manufacturing apparatus according to a first embodiment of the present invention.

2 is a detailed view of a valve portion of an exhaust pipe of the semiconductor manufacturing apparatus of FIG.

FIG. 3 is a plan view of a support member that supports the valve body and the protection member of FIG.

FIG. 4 is a diagram showing a shutoff valve device of a semiconductor manufacturing apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

 12 ... Reaction chamber 26 ... Exhaust pipe 30 ... Shutoff valve device 32 ... Valve part 32a ... Sealing surface 34 ... Valve body 34a ... Seal 36 ... Protecting member 36a ... Seal 40 ... Supporting member

Claims (4)

[Claims] 1. A shutoff valve device (12) arranged in a reaction chamber (12), an exhaust pipe (26) connected to the reaction chamber, and a valve section (32) having a sealing surface (32a) of the exhaust pipe. 30), the shut-off valve device has a shape corresponding to the cross-sectional shape of the valve portion of the exhaust pipe so as to shut off the flow of exhaust gas, and a sealing surface (32a) of the valve portion of the exhaust pipe. A valve body (34) provided with a seal (34a) that is closely attached to the seal, and a seal (32a) that is closely attached to the seal surface (32a) of the valve portion of the exhaust pipe instead of the valve body while allowing the flow of exhaust gas. 36
A semiconductor manufacturing apparatus comprising a protective member (36) having a). 2. The semiconductor manufacturing apparatus according to claim 1, wherein the valve body (34) and the protection member (36) are attached to a support member (40) so as to move simultaneously. 3. The support member (40) is rotatably arranged, and the valve body (34) and the protection member (36) are alternately positioned on the valve portion of the exhaust pipe by the rotational movement of the support member. The semiconductor manufacturing apparatus according to claim 2, wherein: 4. The support member (40) is arranged so as to be reciprocally movable, and the valve element (34) and the protection member (36) are alternately positioned on the valve portion of the exhaust pipe by the reciprocal movement of the support member. The semiconductor manufacturing apparatus according to claim 2, wherein the semiconductor manufacturing apparatus is provided.