JPH09180124A - Method for forming slide surface of magnetic head - Google Patents
Method for forming slide surface of magnetic headInfo
- Publication number
- JPH09180124A JPH09180124A JP33364995A JP33364995A JPH09180124A JP H09180124 A JPH09180124 A JP H09180124A JP 33364995 A JP33364995 A JP 33364995A JP 33364995 A JP33364995 A JP 33364995A JP H09180124 A JPH09180124 A JP H09180124A
- Authority
- JP
- Japan
- Prior art keywords
- sliding surface
- tape
- magnetic head
- chip core
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は磁気ヘッドのテープ
摺動面の形成方法に係り、特にテープ摺動面の曲率形成
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a tape sliding surface of a magnetic head, and more particularly to a method of forming a curvature of the tape sliding surface.
【0002】[0002]
【従来の技術】従来からVTR等の磁気記録再生装置に
用いられる磁気ヘッドとしては種々の形状のものが提案
されフェライトヘッド、MIGヘッド(メタル・イン・
ギャップヘッド)、或いは積層型ヘッド等が知られてい
る。近時磁気テープの高密度化に伴い、デジタルVTR
ではヘッドに対するテープの相対速度は8mmVTRの
約3倍の10.2m/sの高速となっていることや、V
TRの小型化に伴って磁気テープの厚みが薄くなって来
ていること等から、磁気ヘッドの磁気テープとの対接面
は良好な当りを確保する為に高精度の摺動面曲率が要求
されている。2. Description of the Related Art Conventionally, various types of magnetic heads have been proposed as magnetic heads used in magnetic recording / reproducing devices such as VTRs, and ferrite heads and MIG heads (metal in.
Gap heads) or laminated heads are known. Digital VTRs have recently been added to the increasing density of magnetic tapes.
The relative speed of the tape to the head is 10.2 m / s, which is about three times as fast as the 8 mm VTR.
The thickness of the magnetic tape has become thinner with the miniaturization of TR. Therefore, the contact surface of the magnetic head with the magnetic tape requires a highly accurate sliding surface curvature to ensure a good contact. Has been done.
【0003】従来の例えば8mmVTR等に用いる磁気
ヘッド等では、上述の各種磁気ヘッドの1つを完成させ
た状態、例えばMIGヘッドのチップコアに巻線を施し
た図5に示す状態でテープ摺動面1をラッピング用テー
プ(研磨テープ)2でラッピングして所定形状の曲面
(以下R面と記す)と成す様に成されている。In a conventional magnetic head used in, for example, an 8 mm VTR, a tape sliding surface is obtained in a state in which one of the above-mentioned various magnetic heads is completed, for example, in the state shown in FIG. 1 is lapped with a lapping tape (polishing tape) 2 to form a curved surface (hereinafter referred to as R surface) having a predetermined shape.
【0004】即ち、円筒状のスピンドル3の下側にはモ
ータ4を配設し、スピンドル3を矢印方向に回転させ
て、該スピンドル3上に配設した磁気ヘッド5を回転さ
せて、テープ摺動面1のR面を研磨する。この磁気ヘッ
ド5をスピンドル3上に取り付ける際には先ずVTRの
ドラム等に磁気ヘッド5を取り付ける際に用いるヘッド
ベース6上に磁気ヘッド5を固定し、所定の位置出しを
行った後に、更にヘッドベース6をスピンドル3に固定
し、所定寸法の位置出しを行なう様に成されていた。That is, a motor 4 is disposed below the cylindrical spindle 3, the spindle 3 is rotated in the direction of the arrow, and the magnetic head 5 disposed on the spindle 3 is rotated to move the tape. The R surface of the moving surface 1 is polished. When mounting the magnetic head 5 on the spindle 3, first, the magnetic head 5 is fixed on the head base 6 used for mounting the magnetic head 5 on the drum of the VTR and the like, and after predetermined positioning, the head is further moved. The base 6 is fixed to the spindle 3 so that the base 3 is positioned to a predetermined size.
【0005】[0005]
【発明が解決しようとする課題】上述した様に磁気ヘッ
ドのテープ摺動面のR面研磨の為の工数はヘッドベース
6のスピンドル3への取り付け調整並びに磁気ヘッド5
のヘッドベース6への取付け調整と、その工数が多く煩
雑なものであった。As described above, the number of man-hours for polishing the R surface of the tape sliding surface of the magnetic head is such that the mounting of the head base 6 on the spindle 3 and the magnetic head 5 are adjusted.
It was troublesome to adjust and attach the head to the head base 6, and the number of steps was large.
【0006】又、一般的にこのテープの摺動面のR面形
状の作製工程は、上述の様にラッピングテープを用いて
ラッピングが行われている。然しながらこのラッピング
テープを用いての研磨は、機械研削と異なり出来上がる
R面形状がラッピングテープの剛性(Stiffness)に大き
く依存し、最終的にはラッピングテープとヘッドチップ
先端との接触状態によって決定される一様な形状とな
る。[0006] In general, in the manufacturing process of the R surface shape of the sliding surface of this tape, lapping is performed using a wrapping tape as described above. However, polishing using this wrapping tape differs from mechanical grinding in that the shape of the finished R surface largely depends on the stiffness (Stiffness) of the wrapping tape, and is ultimately determined by the contact state between the wrapping tape and the tip of the head chip. It has a uniform shape.
【0007】更に、磁気ヘッド5のテープ摺動面1のラ
ッピングテープによる研磨では所定の設計値で定められ
るテープ摺動面の曲率よりやや大きめの曲率にR面が形
成された磁気ヘッド5をヘッドベース6上に固定し、ス
ピンドル3の外周から磁気ヘッド5のテープ摺動面1の
先端までの距離(以下突出し量と記す)をATとする
と、図6Bに示す様に基準の突出し量に比べ図6Aの様
にラッピングテープ2に対して押し込んだ状態(+AT
方向)ではギャップ8部分のR形状に比べて両端9L及
び9RのR形状が小さくなって、磁気テープ摺動面積が
減少するためヘッド寿命の短命化及び良好な当りが困難
となる問題があった。Further, in lapping the tape sliding surface 1 of the magnetic head 5 with a lapping tape, the magnetic head 5 having the R surface formed with a curvature slightly larger than the curvature of the tape sliding surface determined by a predetermined design value is used. When fixed on the base 6 and the distance from the outer periphery of the spindle 3 to the tip of the tape sliding surface 1 of the magnetic head 5 (hereinafter referred to as the protrusion amount) is AT, as compared with the reference protrusion amount as shown in FIG. 6B. A state in which the wrapping tape 2 is pushed in as shown in FIG. 6A (+ AT
(Direction), the R shape of both ends 9L and 9R is smaller than the R shape of the gap 8 part, and the sliding area of the magnetic tape is reduced, so that there is a problem that the life of the head is shortened and good hitting is difficult. .
【0008】更に、この突出し量ATを図6Cに示す様
に図6Bに示す基準の突出し量ATに比べて−AT方向
にラッピングテープ2から引き込むと図6Cの破線で示
す磁気ヘッド5の両端9L及び9R部分に当り残りが発
生し、テープ摺動面1を基準のR面形状とすることが出
来ない問題があった。Further, as shown in FIG. 6C, when the protrusion amount AT is pulled in from the wrapping tape 2 in the −AT direction as compared with the reference protrusion amount AT shown in FIG. 6B, both ends 9L of the magnetic head 5 shown by a broken line in FIG. 6C. There was a problem that the tape sliding surface 1 could not be formed into the standard R surface shape because of the occurrence of contact residue at the 9R portion.
【0009】本発明は叙上の問題点を解消した磁気ヘッ
ドの摺動面形成方法を提供しようとするもので、その課
題とするところは高精度のテープ摺動面のR面形状が得
られる形成方法を得るにある。The present invention is intended to provide a method for forming a sliding surface of a magnetic head which solves the above problems. The object of the invention is to obtain a highly accurate R surface shape of a tape sliding surface. In order to obtain a forming method.
【0010】[0010]
【課題を解決するための手段】本発明の磁気ヘッドの摺
動面形成方法はその例が図1に示されている様にチップ
コア7の完成状態でテープ摺動面1に所定の曲率を形成
する様に成した磁気ヘッドの摺動面形成方法に於いて、
チップコア7を所定直径を有する回転部材3の円周から
上記チップコア7のテープ摺動面1を突き出して配設
し、チップコア7のテープ摺動面1に対接する様に配設
したラッピング手段2とを具備し、回転部材3の直径及
びチップコア7の大きさ及び所望曲率で定まるチップコ
ア7の突き出し基準値ATより余分に突出させてラッピ
ングを行なう様に成したものである。As shown in FIG. 1, a method of forming a sliding surface of a magnetic head according to the present invention forms a predetermined curvature on a tape sliding surface 1 in a completed state of a chip core 7. In the method of forming the sliding surface of the magnetic head configured as described above,
Lapping means 2 in which the chip core 7 is arranged so as to project the tape sliding surface 1 of the chip core 7 from the circumference of the rotating member 3 having a predetermined diameter, and is arranged so as to be in contact with the tape sliding surface 1 of the chip core 7. The diameter of the rotating member 3, the size of the chip core 7 and the protrusion reference value AT of the chip core 7 which is determined by the desired curvature are set to cause the protrusion to exceed the reference value AT for lapping.
【0011】本発明の磁気ヘッド摺動面形成方法によれ
ば極めて高精度でチップコアのテープ摺動面1の研磨を
行なうことが出来るので高品位の磁気ヘッドを容易に得
ることが出来る。According to the magnetic head sliding surface forming method of the present invention, the tape sliding surface 1 of the chip core can be polished with extremely high accuracy, so that a high quality magnetic head can be easily obtained.
【0012】[0012]
【発明の実施の形態】以下、本発明の磁気ヘッドのテー
プ摺動面を所定の曲率に研磨する方法を図面によって詳
記する。BEST MODE FOR CARRYING OUT THE INVENTION A method of polishing a tape sliding surface of a magnetic head of the present invention to a predetermined curvature will be described in detail below with reference to the drawings.
【0013】本発明に適用する磁気ヘッドとしてはフェ
ライトヘッド、積層型ヘッド、或はMIGヘッド等のテ
ープ摺動面に所定の曲率を形成させる為のR面形成方法
に適用可能であるが、以下には民生用のデジタルVTR
等に適用して好適なMIGヘッドについて説明する。本
発明の構成を説明するに先立ち図4A〜HによってMI
Gヘッドチップコア1の製作工程を詳記する。The magnetic head applied to the present invention is applicable to an R surface forming method for forming a predetermined curvature on a tape sliding surface such as a ferrite head, a laminated head, or a MIG head. Digital VTR for consumer use
A suitable MIG head applied to the above will be described. Prior to explaining the configuration of the present invention, MI is described with reference to FIGS.
The manufacturing process of the G head chip core 1 will be described in detail.
【0014】先ずMIGヘッドのチップコアを得るため
に、図4Aに示す如く、酸化物磁性材(以下フェライト
と記す)基板11を平面研削盤等を用いて平面出しが行
なわれる。本例では基板11としてMn−Znフェライ
トを用いたが、Ni−Znフェライト等の他のフェライ
ト材を用いても良い。又、図4Aの様な面方位の単結晶
基板を用いたが、他の面方位での単結晶基板や多結晶基
板、あるいは単結晶フェライトと多結晶フェライトとの
接合基板を用いても良い。First, in order to obtain the chip core of the MIG head, as shown in FIG. 4A, the oxide magnetic material (hereinafter referred to as ferrite) substrate 11 is flattened by using a surface grinder or the like. Although Mn-Zn ferrite is used as the substrate 11 in this example, other ferrite materials such as Ni-Zn ferrite may be used. Further, although the single crystal substrate having the plane orientation as shown in FIG. 4A is used, a single crystal substrate or a polycrystal substrate having another plane orientation or a bonded substrate of the single crystal ferrite and the polycrystal ferrite may be used.
【0015】次に図4Bの様に磁性フェライト基板11
の長手方向に沿ってスライシングマシン等を用いて巻線
溝17及びガラス溝19を形成する。Next, as shown in FIG. 4B, the magnetic ferrite substrate 11
The winding groove 17 and the glass groove 19 are formed using a slicing machine or the like along the longitudinal direction.
【0016】更に、図4Cに示す様にスライシングマシ
ン等を用いて、巻線溝17及びガラス溝19と略直交す
る方向にトラック幅規制溝12を形成し、トラック幅出
しを行なう。このトラック幅規制溝12のA部拡大図を
図4C′に示す。図4C′のトラック幅規制溝12間が
磁気ギャップ8を構成するトラック13となる、トラッ
ク13の表面はポリッシング等で鏡面加工される。Further, as shown in FIG. 4C, a slicing machine or the like is used to form a track width regulating groove 12 in a direction substantially orthogonal to the winding groove 17 and the glass groove 19 to perform track width setting. An enlarged view of part A of the track width regulation groove 12 is shown in FIG. 4C '. The track 13 between the track width regulating grooves 12 of FIG. 4C 'becomes the track 13 constituting the magnetic gap 8. The surface of the track 13 is mirror-finished by polishing or the like.
【0017】次に図4Dに示す様に磁性フェライト基板
11を長手方向に同一幅w1 で切断する。この工程でガ
ラス溝19及び巻線溝17を形成した基板11aと巻線
溝17等のない基板11bが一対となり基板11a及び
11bが最終的には後述するチップコア1の外側コア7
b及び内側コア7aと成る。Next, as shown in FIG. 4D, the magnetic ferrite substrate 11 is cut in the longitudinal direction with the same width w 1 . In this step, the substrate 11a on which the glass groove 19 and the winding groove 17 are formed and the substrate 11b without the winding groove 17 and the like form a pair, and the substrates 11a and 11b finally form the outer core 7 of the chip core 1 described later.
b and the inner core 7a.
【0018】次に図4Eに示す様に一対の基板11a及
び11b上にスパッタリング等を用いて磁性メタル14
を図4EのB部拡大図の4E′及びC部拡大図の図4
E″に示す様に形成し、更に、その上に磁気ギャップ8
となるギャップ膜15を形成する(図4E′参照)。Next, as shown in FIG. 4E, the magnetic metal 14 is formed on the pair of substrates 11a and 11b by sputtering or the like.
4E 'of the enlarged view of the B part of FIG. 4E and FIG. 4 of the enlarged view of the C part.
E ″, and a magnetic gap 8 is formed on it.
A gap film 15 is formed (see FIG. 4E ').
【0019】本例では磁性メタル14としてFeRuG
aSi(SMX)膜を用いたが、その他にセンダスト,
センダスト+O,センダスト+N,SMX+O,SMX
+N等の結晶質磁性膜、或はFe系微結晶膜、Co系微
結晶膜を用いても良い。また、本例は磁気ギャップ8と
なるギャップ膜15にSiO2 膜を用いたが、Ta2O
5 等の他の酸化物膜,Si3 N4 等の窒化物膜、あるい
はCr,Al,Si,Pt等の金属膜およびそれらの合
金膜、あるいはそれらを組み合わせた積層膜を用いても
良い。また、基板とメタル膜との付着力向上の為にSi
O2 ,Ta2 O 5 等の酸化物膜,Si3 N4 等の窒化物
膜、あるいはCr,Al,Si,Pt等の金属膜及びそ
れらの合金膜、あるいはそれらを組み合わせた積層膜を
メタル膜の下地膜として用いても良い。本例は、この付
着力向上の為の下地膜として5nm厚のSiO2 膜を用
いた。この工程において基板11aと基板11bで別個
に磁性メタル膜14の形成を行い、基板11bに形成し
たメタル膜厚を変化させた。In this example, FeRuG is used as the magnetic metal 14.
Although an aSi (SMX) film was used, sendust,
Sendust + O, Sendust + N, SMX + O, SMX
+ N or other crystalline magnetic film, Fe-based microcrystalline film, Co-based fine film
A crystal film may be used. In this example, the magnetic gap 8
On the gap film 15TwoA membrane was used, but TaTwoO
FiveOther oxide film such as Si, SiThreeNFourNitride film, etc.
Is a metal film of Cr, Al, Si, Pt, etc. and their combination.
Even if a gold film or a laminated film combining them is used
good. In addition, Si is used to improve the adhesion between the substrate and the metal film.
OTwo, TaTwoO FiveOxide film of Si, SiThreeNFourNitride, etc.
Film or metal film such as Cr, Al, Si, Pt and the like
These alloy films or laminated films combining them
You may use as a base film of a metal film. In this example,
5 nm thick SiO as a base film for improving adhesionTwoUse membrane
Was. In this process, the substrate 11a and the substrate 11b are separated
Then, the magnetic metal film 14 is formed on the substrate 11b.
The metal film thickness was changed.
【0020】次に図4Fの様に基板11a及び11bを
ギャップ膜15を形成した面を突き合わせ加圧しながら
ガラス溝9内に挿入した低溶融ガラスロッド16を50
0〜700℃に加熱し、ガラス接合する。Next, as shown in FIG. 4F, the low melting glass rod 16 is inserted into the glass groove 9 while pressing the surfaces of the substrates 11a and 11b on which the gap film 15 has been formed but against each other.
It is heated to 0 to 700 ° C. and glass bonded.
【0021】次に、図4Gの様に接合されたブロックの
基板11a側を平面研削盤等を用いて所定の厚み(w)
にした後にヘッド摺動面1側の円筒研削を行なう。Next, the substrate 11a side of the blocks joined as shown in FIG. 4G is given a predetermined thickness (w) using a surface grinder or the like.
After that, the head sliding surface 1 side is subjected to cylindrical grinding.
【0022】次に巻線ガイド溝の加工、並びに当り溝加
工等を行った後に目的とするチップ厚t及びチップ幅w
に図4Hの様に接合ブロックの長手方向と直交する様に
切断し、ガラス溝19も略半分位置から下側を切り落と
す様に加工される。このチップ厚tの切断は2本の仮設
平行線に対しアジマス角の異なる2個の接合ブロックの
基板11a及び11aを内側にしてアジマス角度分だけ
傾けてハの字状に固定した状態で所定のチップ厚t及び
チップ幅wとなる様に切断し、当り幅加工時は目的とす
るチップコアのアジマス角に平行に切り落とされる。Next, after the winding guide groove is processed and the contact groove is processed, the target chip thickness t and chip width w are obtained.
4H, the glass block 19 is cut so as to be orthogonal to the longitudinal direction of the joining block, and the glass groove 19 is also cut off from the substantially half position. This cutting of the chip thickness t is performed in a predetermined state with the substrates 11a and 11a of the two joining blocks having different azimuth angles being inward with respect to the two temporary parallel lines and being tilted by the azimuth angle and being fixed in a V shape. It is cut to have a chip thickness t and a chip width w, and is cut off in parallel with the azimuth angle of the target chip core during the processing of the contact width.
【0023】この様に基板11から作製されたチップコ
ア7は図3Aの様に構成され、接合ブロック11a及び
11bがチップ厚tで切断され内側コア7a及び外側コ
ア7bと成され、トラック幅を定める磁気ギャップ8は
磁性メタル膜14上にスパッタリングされたSiO2 等
の酸化膜等で構成され、巻線溝17及び巻線ガイド溝1
8並びにガラス溝19が外側コア1bに形成され、内側
コア7aは板状と成され、内側コア7aと外側コア7b
は低融点ガラス20等で接合されて一体化されている。The chip core 7 thus manufactured from the substrate 11 is constructed as shown in FIG. 3A, and the joint blocks 11a and 11b are cut at the chip thickness t to form the inner core 7a and the outer core 7b, and determine the track width. The magnetic gap 8 is composed of an oxide film such as SiO 2 sputtered on the magnetic metal film 14, and the winding groove 17 and the winding guide groove 1 are formed.
8 and the glass groove 19 are formed in the outer core 1b, the inner core 7a is formed in a plate shape, and the inner core 7a and the outer core 7b are formed.
Are joined and integrated by a low melting point glass 20 or the like.
【0024】そして、かかる一対のヘッドチップ7A,
7Bを使用して記録再生を行なうダブルアジマスヘッド
を作製する場合、図3Bの様にヘッドベース6には一対
のチップコア7A,7Bの内側コア7aを対向する様に
配設されてVTRの回転ドラムに180度対向配置して
取り付けられ回転ドラムの1回転で磁気テープ上に同時
に4本の斜めトラックの記録再生を行なうことが出来る
様に成される。The pair of head chips 7A,
When a double azimuth head for recording / reproducing using 7B is manufactured, the head core 6 is arranged with the inner cores 7a of the pair of chip cores 7A and 7B facing each other as shown in FIG. They are mounted so as to face each other by 180 degrees so that recording and reproduction of four oblique tracks can be simultaneously performed on the magnetic tape by one rotation of the rotating drum.
【0025】本例では図4Hで得られたチップコア7の
作製段階でテープ摺動面1の研磨を行なう様に成す。即
ち、チップコア7のテープ摺動面1は円筒研削されて所
定の曲率となされているが、この場合のR面は所定の設
計値より大きな値と成されている。In this example, the tape sliding surface 1 is polished at the stage of manufacturing the chip core 7 obtained in FIG. 4H. That is, the tape sliding surface 1 of the chip core 7 is cylindrically ground to have a predetermined curvature, but the R surface in this case has a value larger than a predetermined design value.
【0026】この様なチップコア7を図1に示す様にモ
ータ4で回転駆動される回転手段、例えば円筒状のスピ
ンドル3の上面円形部21に図2の平面図に示す様に接
着剤を介して固定する。勿論、螺子等を介して固定して
もよい。この様にスピンドルの上面円形部21に配設さ
れたチップコア7は切欠部16を形成した蓋10で押さ
えられ動かない様に固定される。As shown in FIG. 1, such a chip core 7 is rotated by a motor 4 as rotating means, for example, an upper surface circular portion 21 of a cylindrical spindle 3 via an adhesive as shown in the plan view of FIG. To fix. Of course, it may be fixed via a screw or the like. In this manner, the chip core 7 arranged on the upper circular portion 21 of the spindle is pressed by the lid 10 having the notch 16 and is fixed so as not to move.
【0027】上述の構成では1つのチップコア7をスピ
ンドルの上部円形部21上に固定した場合を示したが円
周を等配した角度位置に複数のチップコア7を配設して
もよい。In the above-mentioned structure, one chip core 7 is fixed on the upper circular portion 21 of the spindle, but a plurality of chip cores 7 may be arranged at angular positions where the circumference is evenly arranged.
【0028】上述の構成でのスピンドル3の上部円形部
21の外周からの研磨されるチップコア7の突き出し量
ATの基準値はチップコア7の所望曲率、チップコアの
幅wとチップコア厚みt及びスピンドル2の直径から計
算値で求められる。The reference value of the protrusion amount AT of the chip core 7 to be polished from the outer circumference of the upper circular portion 21 of the spindle 3 having the above-described structure is the desired curvature of the chip core 7, the width w of the chip core 7 and the chip core thickness t and the spindle 2. Calculated from the diameter.
【0029】今、図3の斜視図でチップコア7の幅方向
w(X−X軸方向)の曲率だけを考え、下記のチップコ
ア7の突き出し量ATを求める。Now, considering only the curvature of the chip core 7 in the width direction w (X-X axis direction) in the perspective view of FIG. 3, the following protrusion amount AT of the chip core 7 is obtained.
【0030】チップコアの所望曲率=7mm チップコア幅w=1.5mm スピンドル3の直径=40mm とすれば基準の突き出し量ATは75μmとなる。If the desired curvature of the chip core = 7 mm, the chip core width w = 1.5 mm, and the diameter of the spindle 3 = 40 mm, the reference protrusion amount AT is 75 μm.
【0031】この様な設計(基準)突き出し量75μm
でラッピングを行なうために研磨材を塗布したラッピン
グテープ2をスピンドル3を囲繞する様に配設し、スピ
ンドル3をモータ4を介して所定速度で回転させれば所
定の曲率が得られるはずであるが、実際には作製時のテ
ープ摺動面1の曲率のばらつき、チップコア幅wのばら
つき等の原因で図6Cの様に磁気ヘッド5(チップコア
7)の両端9L及び9Rに当り残りが発生することが確
認された。Such a design (standard) protrusion amount 75 μm
If a lapping tape 2 coated with an abrasive for lapping is arranged so as to surround a spindle 3 and the spindle 3 is rotated at a predetermined speed via a motor 4, a predetermined curvature should be obtained. However, in reality, due to variations in the curvature of the tape sliding surface 1 at the time of production, variations in the chip core width w, etc., residuals occur at both ends 9L and 9R of the magnetic head 5 (chip core 7) as shown in FIG. 6C. It was confirmed.
【0032】そこで、本発明では基準の突き出し量AT
よりも余分にラッピングテープ2側に突き出した結果、
テープ摺動面1の曲率に研磨残りのない高精度のチップ
コアが得られた。Therefore, in the present invention, the reference protrusion amount AT
As a result of protruding further to the wrapping tape 2 side,
A highly accurate chip core having no polishing residue on the curvature of the tape sliding surface 1 was obtained.
【0033】実施例 以下にチップ曲率7mm,チップコア幅1.5mm,ス
ピンドル直径40mmでの設計突き出し量AT75μm
のチップコアを順次+AT方向(ラッピングテープ方
向)に突き出した下記表1によって本例を説明する。Example The design protrusion amount AT75 μm when the chip curvature is 7 mm, the chip core width is 1.5 mm, and the spindle diameter is 40 mm is as follows.
This example will be described with reference to Table 1 below in which the chip cores of the above are sequentially projected in the + AT direction (wrapping tape direction).
【0034】[0034]
【表1】 [Table 1]
【0035】表1に示す様に突き出し量ATを基準突き
出し量ATに比べて+AT方向に増加させ、75μmか
ら80μm,85μm,90μmとさせた場合のテープ
摺動面1の両端9L及び9Rでの当り残りは80μm以
上では発生しないがテープ摺動面1の両端9L及び9R
部分での摩耗が90μm以上では発生し、R形状が5.
5mm以下となって、R形状は7mm>5.5mmとな
り、両端9L及び9Rで研磨されすぎる問題が生じた。As shown in Table 1, when the protrusion amount AT is increased in the + AT direction as compared with the reference protrusion amount AT to change from 75 μm to 80 μm, 85 μm, 90 μm, both ends 9L and 9R of the tape sliding surface 1 The remaining contact does not occur at 80 μm or more, but both ends 9L and 9R of the tape sliding surface 1
Partial wear occurs at 90 μm or more, and the R shape is 5.
When it was 5 mm or less, the R shape was 7 mm> 5.5 mm, and there was a problem of excessive polishing at both ends 9L and 9R.
【0036】従って、設計(基準)突き出し量ATに対
し5μm乃至15μmの範囲を選択することで表1の判
断例(×不良、○可)に示す様にテープ対接面1の曲率
形状が良好なチップコア7が得られた。Therefore, by selecting a range of 5 μm to 15 μm with respect to the design (reference) protrusion amount AT, the curvature shape of the tape contact surface 1 is good as shown in the judgment example of Table 1 (x defective, o acceptable). The chip core 7 was obtained.
【0037】尚、図3Aに示す様にチップコア7のテー
プ摺動面1の曲率はチップコア7の厚み方向t(Y−Y
方向)にもつけられる様に成される。この場合、ラッピ
ングテープ2はこのテープの幅方向にもカールされた状
態で研磨される。従って、チップコア7の厚みt方向に
も上述したと同様に基準の設計曲率に対し突き出し量A
Tを+AT方向(ラッピングテープ2方向)に突っ張る
様に構成させれば図3Aでヘッドチップ7の前後方向
(厚み方向)の当り残りや研磨しすぎの問題も解消され
ることは明らかである。実際にはチップコア7の幅方向
wの寸法(例えば1100μm)に対し厚み方向tの寸
法(例えば80μm)が極めて小さいのでY−Y軸方向
での当り残りや前後方向の研磨のしすぎは問題にならな
いと言える。As shown in FIG. 3A, the curvature of the tape sliding surface 1 of the chip core 7 depends on the thickness direction t (Y-Y) of the chip core 7.
It is made so that it can also be attached to (direction). In this case, the wrapping tape 2 is polished while being curled also in the width direction of the tape. Therefore, in the direction of the thickness t of the chip core 7, the protrusion amount A with respect to the reference design curvature is also similarly described above.
It is apparent that if T is stretched in the + AT direction (the lapping tape 2 direction), the problem of the head chip 7 remaining in the front-rear direction (thickness direction) and overpolishing can be solved in FIG. 3A. Actually, the dimension in the thickness direction t (for example, 80 μm) is extremely small with respect to the dimension in the width direction w (for example, 1100 μm) of the chip core 7, so that a hit residue in the Y-Y axis direction and excessive polishing in the front-back direction are problems. It can not be said that.
【0038】上述の様に本発明の磁気ヘッドの摺動面形
成方法によれば極めて高精度にテープ摺動面の曲率を形
成出来て高品質の磁気ヘッドが得られハイビジョンVT
R等に適した磁気ヘッドが提供可能となる。上述の実施
例ではMIGヘッドについて説明したが他のフェライト
ヘッド等の他の構成のヘッドについても本発明が適用可
能であることは明らかである。As described above, according to the method of forming the sliding surface of the magnetic head of the present invention, the curvature of the tape sliding surface can be formed with extremely high precision and a high quality magnetic head can be obtained.
A magnetic head suitable for R etc. can be provided. Although the MIG head has been described in the above embodiments, it is obvious that the present invention can be applied to heads having other configurations such as other ferrite heads.
【0039】[0039]
【発明の効果】本発明の磁気ヘッドのテープ摺動面の形
成方法によればテープ摺動面の曲率(R面形状)を基準
設計値に極めて近い値に研磨可能な高精度のチップコア
を得ることが出来る。According to the method of forming the tape sliding surface of the magnetic head of the present invention, a highly accurate chip core capable of polishing the curvature (R-shaped surface) of the tape sliding surface to a value extremely close to the reference design value is obtained. You can
【図1】本発明の磁気ヘッドの摺動面形成方法を説明す
る斜視図である。FIG. 1 is a perspective view illustrating a method of forming a sliding surface of a magnetic head according to the present invention.
【図2】本発明の研磨方法説明図の平面図である。FIG. 2 is a plan view of a polishing method explanatory diagram of the present invention.
【図3】本発明のチップコアの説明図である。FIG. 3 is an explanatory diagram of a chip core of the present invention.
【図4】本発明のチップコアの作製方法説明図である。FIG. 4 is an explanatory view of a method of manufacturing the chip core of the present invention.
【図5】従来の磁気ヘッドの研磨方法説明図である。FIG. 5 is an explanatory view of a conventional method of polishing a magnetic head.
【図6】従来の磁気ヘッド突き出し量の説明図である。FIG. 6 is an explanatory diagram of a conventional magnetic head protrusion amount.
1 テープ摺動面 2 ラッピングテープ 3 スピンドル 7 チップコア AT 突き出し量 1 Tape sliding surface 2 Lapping tape 3 Spindle 7 Chip core AT protrusion amount
Claims (2)
所定の曲率を形成する様に成した磁気ヘッドの摺動面形
成方法に於いて、 上記チップコアを所定直径を有する回転部材の円周から
上記チップコアのテープ摺動面を突き出して配設し、該
チップコアのテープ摺動面に対接する様に配設したラッ
ピング手段とを具備し、 上記回転部材直径及び上記チップコアの大きさ及び所望
曲率で定まる該チップコアの突き出し基準値より余分に
突出させてラッピングを行うことを特徴とする磁気ヘッ
ドの摺動面形成方法。1. A method of forming a sliding surface of a magnetic head, wherein a predetermined curvature is formed on a tape sliding surface in a completed state of the chip core, wherein the chip core is formed from a circumference of a rotary member having a predetermined diameter. A tape sliding surface of the chip core is provided so as to project, and a lapping means is arranged so as to be in contact with the tape sliding surface of the chip core, the diameter of the rotating member, the size of the chip core, and a desired curvature. A method for forming a sliding surface of a magnetic head, wherein lapping is performed by projecting the chip core more than a predetermined protrusion standard value.
μmであることを特徴とする請求項1記載の磁気ヘッド
の摺動面形成方法。2. The protrusion amount of the chip core is 5 to 15
The method for forming a sliding surface of a magnetic head according to claim 1, wherein the sliding surface is μm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33364995A JPH09180124A (en) | 1995-12-21 | 1995-12-21 | Method for forming slide surface of magnetic head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33364995A JPH09180124A (en) | 1995-12-21 | 1995-12-21 | Method for forming slide surface of magnetic head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09180124A true JPH09180124A (en) | 1997-07-11 |
Family
ID=18268425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33364995A Pending JPH09180124A (en) | 1995-12-21 | 1995-12-21 | Method for forming slide surface of magnetic head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09180124A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012218086A (en) * | 2011-04-05 | 2012-11-12 | Honda Motor Co Ltd | Grinding method |
-
1995
- 1995-12-21 JP JP33364995A patent/JPH09180124A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012218086A (en) * | 2011-04-05 | 2012-11-12 | Honda Motor Co Ltd | Grinding method |
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