JPH09178805A - Contact structure of ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sound contact even when the contact area is limited by pressing an IC by the thermal expansion of a thermal expanding member to finelymove the IC, and causing a wiping in the contact critical surface between the IC and a contact object by the fine movement of the IC. SOLUTION: A square IC 1 has an infinite number of fine contacts 2 arranged at fine pitches on the surface, and contacts 3 of contact object are vertically pressurized to and brought into contact with the surfaces of the contacts 2. A thermal expanding member 4 is arranged to regulate the side surface of the IC 1, thereby functioning it as a positioning member, while it presses the side surface of the IC 1 by thermal expansion to provide a wiping action. One of the opposed side surfaces of the IC 1 is regulated by the member 4, the other is elastically regulated by a side surface regulating member 5 elastically held by a spring member 6, and the member 4 is arranged so as to press the IC 1 against the elastic force of the member 5. The member 6 elastically presses the member 5 to one side surface of the IC 1, and the member 4 finely moves the IC 1 against the pressing force of the members 5, 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact structure of an IC for causing good wiping at a contact interface between the IC and an object to be contacted with the IC.

[0002]

2. Description of the Related Art The contact portion of an IC tends to have a very small pitch and to be miniaturized, and it is difficult to secure a contact area with the contact portion.

As typified by Japanese Patent Publication No. 7-50762, the inventor superimposes a wiring sheet on the surface of the IC having the fine contact portions, and attaches the contact portion of the IC to one end of a lead on the wiring sheet. A contact structure is disclosed in which the pitch of the other end of the lead is made to be in contact with the contact of the IC socket by expanding the pitch at the same time, but according to this contact structure, the pitch is arranged at a fine pitch via the wiring sheet. The contact between the contact portion of the IC and the contact on the IC socket side arranged at a relatively wide pitch becomes possible, but the contact area between the IC contact portion and the lead having a small area cannot be sufficiently obtained, and the IC and the socket cannot be connected. The problem is that the reliability of the contact of the user is reduced.

[0004]

SUMMARY OF THE INVENTION The present invention provides an IC contact structure capable of appropriately remedying the above-mentioned problems. As a means thereof, the IC is slightly moved to make contact with an object to be contacted, for example, a wiring sheet. Wiping is caused at the interface, and a thermal expansion member is used as a means for minutely moving the IC.

[0005] This thermal expansion member is intended, for example, to thermally expand in a high-temperature furnace for burn-in testing an IC, and to press and move the IC slightly by this thermal expansion to cause wiping at the contact interface. .

The thermal expansion member is arranged so as to regulate the side surface of the IC, and has a function as a positioning member, and presses the side surface of the IC by the thermal expansion to obtain the wiping action.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 and 2 are diagrams showing an outline of the basic concept of the present invention.

As shown in FIGS. 1A and 2, a square I
C1 has a myriad of fine contacts 2 arranged at a fine pitch on the surface, and contacts 3 to be contacted are vertically pressed against the surface of the contacts 2 as shown in FIG. 1B. The contact target is a wiring sheet or an IC socket described later.

A thermal expansion member 4 is used as a means for moving the IC 1 while maintaining the above-mentioned pressure contact state.

The thermal expansion member 4 is provided for the purpose of causing thermal expansion in a high-temperature furnace for performing a burn-in test of the IC 1 and for causing the IC 1 to be slightly moved by the thermal expansion to cause wiping at the contact interface.

The thermal expansion member 4 is arranged so as to regulate the side surface of the IC 1 and has a function as a positioning member, while pressing the side surface of the IC 1 by the thermal expansion to obtain the wiping action. .

As shown in FIGS. 1A and 1B, one of the opposing side surfaces of the IC 1 is regulated by the thermal expansion member 4, and the other is elastically regulated by a side regulating member 5 held by a spring member 6. The thermal expansion member 4 is disposed so as to press the IC 1 against the elasticity of the side surface regulating member 5.

The spring member 6 elastically presses the regulating member 5 against one side surface of the IC, and the thermal expansion member 4 minutely pushes the IC 1 against the pressing force of the spring member 6 and the regulating member 5. Let me move.

In FIGS. 1A and 1B, the arrow a indicates the thermal expansion member 1.
, And the arrow b indicates the pressing direction of the spring member 6. Each pressing direction is a direction orthogonal to the side surface of the IC 1.

FIG. 2 shows the thermal expansion member 5 arranged so as to regulate two side surfaces forming one corner of the IC 1. FIG.
The L-shaped thermal expansion member 4 as shown in FIG.
It fills one corner on one diagonal and regulates two sides forming the corner. This thermal expansion member 4 is an IC
When placed in a hot atmosphere in a high-temperature test furnace for performing a burn-in test, a pressing force indicated by an arrow c is applied to two sides forming a corner of the IC 1 by thermal expansion, and as a result, a pressing force d on a diagonal line is obtained. The pressing force d causes the IC 1 to slightly move along the diagonal line. . By this small movement,
Wiping is caused at the contact interface between the contact 2 of the IC 1 shown in B and the contact 3 to be contacted.

When the thermal expansion member 4 is disposed along two sides forming one corner on the diagonal line of the IC 1 as shown in FIG. 2, the regulating member 5 is connected to the two sides forming the other corner. Arrange to regulate. The corner restricting member 5 has an inner angle that matches the angular shape of the IC 1, and the inner angle
One corner is accommodated, and two side surfaces forming the corner are pressed.

This pressing force is applied by the spring member 6 and generates a pressing force on a diagonal line indicated by an arrow e. Therefore, the IC 1 is disposed in such a manner that the thermal expansion member 4 also serving as the above-described corner regulating member and the other corner regulating member 5 press a pair of corners, which are the diagonals of the IC 1, in the relative directions with the pressing forces d and e. When the thermal expansion member 4 thermally expands, the spring 6 is compressed by the pressing force d, and the IC 1 is slightly moved to cause the wiping. At the same time, the IC 1 is held at a fixed position at a position where the pressing forces d and e are balanced. .

As shown in FIG. 3, the IC is formed by the thermal expansion member 4.
When regulating the side surface of the IC, the thermal expansion member 4 can be configured to press the IC with another regulating member 7 interposed between the thermal expansion member 4 and the side surface of the IC. As the regulating member 7, a member that does not thermally expand at the temperature of the high-temperature test furnace of the IC 1 is used.

The temperature in the high-temperature test furnace for performing the burn-in test on the IC 1 is usually 80 ° C. to 250 ° C. The thermal expansion member 4 is made of a material that thermally expands in this temperature range or below this temperature. The members 7 and 5 are made of a material that does not thermally expand in the above temperature range. Examples of a thermal expansion material having a large thermal expansion coefficient that meets the above conditions include polyethersulfone and polyetherimide.

As shown in FIG. 4, the IC 1 can be protected by fitting it into a casing 8 having a window-shaped opening, and the casing 8 can be pressed by the thermal expansion member 4 and the regulating member 5. The casing 8 corresponds to the regulating member 7.

The present invention is implemented when the contact between the IC 1 and the IC socket is mediated through a wiring sheet based on the basic concept shown in FIGS. This type of contact structure is disclosed in, for example, Japanese Patent Publication No. 7-50762 owned by the applicant.

FIGS. 5 to 8 show a case where the present invention is applied to a contact structure of this type. The IC 1 is detachably held on a carrier base 10 which is an insulator.
1, the IC sheet 2 is brought into contact with the contact 3 formed at one end of the lead 11 on the wiring sheet, and the contact 3 'formed at the other end of the lead 11 is connected to the IC socket. Make contact with the contact 25.

The wiring sheet 9 is provided for contact with the contacts 25 of the sockets arranged at a relatively wide pitch while obtaining contact with the fine IC contacts 2 arranged at a fine pitch. By setting one end of 11 to a minute pitch suitable for the arrangement of the IC contacts and the other end to an enlarged pitch conforming to the arrangement of the contacts of the IC socket, it is possible to effectively cope with the minute pitch of the IC contacts.

A thermal expansion member 4 for regulating the side surface of the IC is provided in an IC accommodating portion 12 of a carrier base 10 serving as an insulator body for detachably holding the IC, and the thermal expansion of the thermal expansion member 4 makes the IC 1 minute. It is configured to move to cause wiping between the contact 25 and the contact 3.

In the IC 1, two side surfaces of one of two opposing corner portions are regulated by the thermal expansion member 4, and two side surfaces of the other corner portion are elastically regulated by a regulating member 5. The thermal expansion member 4 is arranged to press the IC 1 against the elasticity of the regulating member 5.

As described with reference to FIGS. 3 and 4, when the side surface of the IC 1 is regulated by the thermal expansion member 4, another regulating member 7 is interposed between the thermal expansion member 4 and the side surface of the IC. To press the IC.

As shown in FIG. 5, the carrier base 10 made of an insulating material has a flat and rectangular shape, and has a substantially square IC accommodating portion 12 at a substantially central portion of one surface thereof. A thermal expansion member 4 that regulates one corner of the IC 1 is disposed at one corner of the pair of diagonals, and a regulating member that elastically presses the IC 1 against the thermal expansion member 4 at the other corner. 5 is held by a spring 6.

On the surface of the carrier base 10, the I
Around the C accommodating portion 12 and the outer peripheral edge of the carrier base 10,
A backup frame accommodating portion 14 for receiving the backup frame 13 of the flexible wiring sheet 9 with a step is formed in a diagonally extending region of the carrier base, and a portion of the backup frame accommodating portion 14 extending diagonally is formed. A connection hole 17 into which a connection pin 16 of a carrier cover 15 to be described later is press-fitted is provided on the bottom surface, and a carrier assembly is mounted on each corner of the carrier base 10 to provide a socket for a test such as burn-in. A positioning hole 19 into which the positioning pin 18 (see FIG. 7) is inserted is provided.

That is, at the corners of the carrier base 10, positioning pieces 20 projecting from the respective corners of the flexible wiring sheet 9 are formed, and the positioning holes 20 are provided in the positioning pieces 20.

The contacts 3 of the flexible wiring sheet 9 are superimposed on a large number of contacts 2 arranged side by side on the surface of the IC 1 to make contact.

On the other hand, the flexible wiring sheet 9 is shown in FIG.
As shown in FIG. 1, a contact 3 made of a flexible insulating material such as a synthetic resin film and having conductive bumps corresponding to the contact 2 of the IC 1 is provided on the surface thereof. A lead 11 having conductivity is formed toward each side of the lead, and a contact 3 ′ formed of a contact pad provided for contact with a contact 25 (see FIG. 6) of the socket is formed on the lead 11. .

That is, the leads 11 extend in parallel from the center of the wiring sheet 9 toward the outer edge, and each lead 1
The contact 3 is formed at the inner end and the contact 3 'is formed at the outer end. That is, the contacts 3 are arranged at the center of the wiring sheet 9, and the contacts 3 ′ are arranged along each edge of the wiring sheet 5.

Further, a relatively rigid backup frame 13 is adhered to the flexible wiring sheet 9 via an adhesive to form a rigid laminated plate structure.

The backup frame 13 has an IC accommodating window 21 corresponding to the IC 1 in the center thereof, and the wiring sheet 9 covers one opening surface of the IC accommodating window 21 as shown in FIGS. The contact 3 is arranged so as to be exposed therein.

The flexible wiring sheet 9 and the backup frame 13 are provided with a plurality of through holes 22 communicating therewith. The through hole 22 is provided in the carrier base 1.
A plurality of diagonal lines of the backup frame 13 correspond to the 0 connection holes 17.

Further, at each corner of the backup frame 13, a positioning hole 23 is formed at a position opposite to the positioning hole 19.
Is provided. That is, a positioning piece 24 protruding from each corner of the wiring sheet 9 is formed at each corner of the frame-shaped backup frame 13, and a positioning hole 23 is provided in the positioning piece 24. The positioning pieces 20 and 24 overlap with each other to bring the positioning holes 19 and 23 into concentric communication.
The positioning pin 18 of the socket penetrating the positioning hole 19 is inserted into the positioning hole 23.

On the other hand, the carrier cover 15 is made of an insulating material as shown in FIG. 5 and has a flat and rectangular shape. On its diagonal line, a connecting pin 18 which is pressed into the connecting hole 17 of the carrier base 10 from one surface thereof is provided. It is protruding.

The movable corner regulating member 5 of the carrier base 10 is displaced so as to be separated from the thermal expansion member 4 against its elasticity, and the IC 1 is mounted on the IC accommodating portion 12. By returning the IC 1 according to the elasticity of the member 6, the IC 1 is sandwiched between the IC 1 and the thermal expansion member 4 and fixedly held on the carrier base 10.

Next, as shown in FIG.
The flexible wiring sheet 9 attached to the backup frame 13 so as to overlap the surface of the flexible wiring sheet 9 is placed. At this time, the connection hole 17 and the through hole 22 and the positioning holes 19 and 23 are in communication with each other, and the IC 1 is received in the accommodation window 21 and the contact 2 is opposed to the contact 3 facing the window 21.

In this state, the carrier cover 15 is closed, the connecting pins 16 of the carrier cover 15 are pressed into the connecting holes 17 of the carrier base 10 through the through holes 22, and the flexible wiring sheet 9 is connected to the backup frame 1.
3 together with the carrier cover 15 and the carrier base 10 so as to securely hold the position of the wiring sheet 9 with respect to the IC 1.

At this time, as shown in FIG. 6, the contacts 3'and the backup frame 13 arranged on the peripheral portion of the wiring sheet 9 are formed.
Are protruded laterally from the edges of the cover 15 to provide contact with the contacts 25 of the socket.

Although the connecting pins 16 are provided on the carrier cover 15, the connecting pins 16 are provided on the carrier base 13 and the connecting holes 17 into which the connecting pins 16 are press-fitted.
Can be provided on the carrier cover 15.

Thus, as shown in FIG. 8 and FIG.
The contact sheets 2 and 3 are pressed on the IC socket to form a state where the wiring sheet 9 is overlaid on the IC socket.

As described above, when the burn-in test of the IC is performed in a state where the contacts 2 and 3 are in pressure contact, the thermal expansion member 4 thermally expands to the position shown by the broken line as shown in FIG. The IC1 is slightly moved, and as a result, the contact 2 is
As shown by a broken line in FIG. 5, the slidable body can slide and cause wiping at the contact interface while being brought into pressure contact with the surface of the contact 3.

[0045]

According to the present invention, the IC 1 is minutely moved by the thermal expansion of the thermal expansion member 4 to cause a good wiping effect at the contact interface between the contact 2 of the IC 1 and the contact 3 of the target component. A sound contact can be obtained even when the contact area is very limited due to the minute pitch and miniaturization of the IC contacts, and it is particularly effective as a contact structure in a burn-in test of an IC applying a high temperature to the IC1.

The wiping effect can be obtained while positioning the IC by the thermal expansion member 4.

According to the present invention, highly reliable contact can be secured when the contacts of the IC chips arranged at a very small pitch are brought into contact with the contacts of the IC socket via the wiring sheet.

[Brief description of the drawings]

1A is a plan view showing a basic concept of pressing an IC by a thermal expansion member to cause wiping, and FIG. 1B is a side view of the same.

FIG. 2 is a plan view showing another example of the basic concept.

FIG. 3 is a sectional view showing a modification of FIGS. 1 and 2;

FIG. 4 is a plan view showing another modification of FIGS. 1 and 2;

5 is an exploded perspective view showing a contact structure in which an IC and an IC socket are brought into contact with each other using a wiring sheet as a contact medium based on the basic idea of FIG.

FIG. 6 is a perspective view of an IC carrier formed by assembling the above elements.

FIG. 7 is a sectional view of the IC carrier.

FIG. 8 is a sectional view showing a contact structure between an IC formed by the IC carrier and a wiring sheet.

FIG. 9 is an enlarged sectional view showing a contact portion between the IC and the wiring sheet in FIG. 7;

[Explanation of reference numerals] 1 IC 2 Contact point of IC 3 Contact point of contact such as socket 4 Thermal expansion member 5 Regulation member 6 Spring member 9 Wiring sheet

Claims (5)

[Claims] 1. A structure in which the IC is pressed by the thermal expansion of a thermal expansion member to move the IC minutely, and the minute movement of the IC causes wiping at a contact interface between the IC and a contact target. IC contact structure. 2. The contact structure for an IC according to claim 1, wherein the thermal expansion member also serves as a positioning member that regulates a side surface of the IC. 3. A contact structure for an IC, comprising: an insulator body having an IC accommodating portion detachably holding the IC and a wiring sheet laminated on the IC accommodated in the IC accommodating portion. A thermal expansion member that restricts the side surface of the IC is arranged, the side surface of the IC is pressed by the thermal expansion of the thermal expansion member to make a minute movement, and the minute movement of the IC causes wiping at the contact interface between the wiring sheet and the IC. A contact structure of an IC characterized by being configured. 4. A regulating member for elastically restricting a side surface of the IC opposite to the side surface against a pressing force of the thermal expansion member, wherein the thermal expansion member opposes the elasticity of the regulating member.
4. The I according to claim 3, characterized in that
C contact structure. 5. The thermal expansion member is connected to another I member through another restriction member.
The IC contact structure according to claim 3, wherein the side surface of C is pressed while being regulated.