JPH09174264A - Laser beam machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a fire in case of an earthquake by detecting the vibration and actuating an emergency stop when the detected value reaches a set value. SOLUTION: A vibration detecting sensor 35 is provided in a laser beam machine 3 or a laser generating unit of a laser beam machining device 1 or in proximity to the device; also provided in the laser beam machining device 1 is an NC device 33, to which a signal detected by the vibration detecting sensor 35 is transmitted; in the NC device 33, a comparator 37 is provided which, upon comparison between the detected value and a preliminarily set value, if the detected value is equal to or higher than the set value, stops the laser beam processing device 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus which can be stopped when an earthquake occurs.

[0002]

2. Description of the Related Art Conventionally, various types of laser processing apparatuses have been known, but even if an earthquake occurs during laser processing, an earthquake is particularly detected and the laser processing apparatus is brought to an emergency stop. The laser processing was continued without any means for providing it.

[0003]

By the way, in the above-mentioned conventional laser processing apparatus, when an earthquake occurs during laser processing, not only does the product become a product due to undulation due to vibration on the processing surface, but also laser beam alignment is performed. Gap,
In some cases there was also the most dreadful fire hazard.

An object of the present invention is to provide a laser processing apparatus for preventing a fire by detecting an oscillation of an earthquake during laser processing and stopping the emergency when the detected value reaches a set value. To provide.

[0005]

In order to achieve the above object, a laser processing apparatus according to the present invention according to claim 1 has a vibration detecting sensor in the vicinity of the processing machine main body, the laser oscillator unit or the laser processing apparatus in the laser processing apparatus. It is characterized by being prepared.

Therefore, when an earthquake occurs during laser processing of a work by the laser processing apparatus, vibration is detected by the vibration detection sensor provided near the processing machine main body, the laser oscillator unit or the laser processing apparatus. It

According to a second aspect of the present invention, there is provided a laser processing apparatus including an NC device in the laser processing device, transmitting a detection signal detected by the vibration detecting sensor to the NC device, and setting the detected value and the detected value in advance. It is characterized in that the NC device is equipped with a comparator for stopping the laser processing device when the detected value is equal to or more than the set value.

Therefore, the vibration detected by the vibration detection sensor at the time of earthquake is transmitted to the NC device as a detection signal.
In the C device, the detected value detected and the preset value are compared by the comparator. When the detected value exceeds the set value, an emergency stop signal is transmitted from the NC device to the laser processing device, and the laser processing device is emergency stopped. Thus, the fire of the laser processing device is prevented.

According to a third aspect of the present invention, there is provided a laser processing apparatus in which the vibration detecting sensor detects a preset vibration, and a switch for stopping the laser processing apparatus when the vibration detecting sensor is activated is provided. It is characterized by.

Therefore, when a preset vibration is detected by the vibration detection sensor at the time of an earthquake, the switch works to stop the laser processing apparatus in an emergency. Thus, the fire of the laser processing device is prevented.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1, the laser processing apparatus 1 is provided with a processing machine main body 3 which is provided upright.
1, a plurality of X-axis guide rails 5 extending in the X-axis direction (direction orthogonal to the paper surface in FIG. 1) are laid on the left side surface. This X-axis guide rail 5
Is provided with an X-axis carriage 9 which is movable in the X-axis direction via a plurality of guide members 7.

With the above structure, when an X-axis drive motor (not shown) is driven, the ball screw is rotated and the X-axis carriage 9 moves the X-axis guide rail 5 through the nut member.
And will be moved in the X-axis direction.

On the front surface of the X-axis carriage 9, a plurality of Y-axis guide rails 11 extending in the Y-axis direction (horizontal direction in FIG. 1) are laid, and a ball screw 13 extending in the Y-axis direction is provided. It is provided. The Y-axis drive motor 15 attached to the X-axis carriage 9 is connected to the right end of the ball screw 13 in FIG. 1, and the left end of the ball screw 13 in FIG. 1 is attached to the X-axis carriage 9. It is supported by bearings 17.

A Y-axis carriage 19 is provided on the Y-axis guide rail 11 via a guide member, and the Y-axis carriage 19 is screwed onto the ball screw 13. The Y-axis carriage 19 is provided with a Z-axis carriage 21 movable in the Z-axis direction (vertical direction in FIG. 1), and a laser processing head 23 is mounted on the Z-axis carriage 21.

With the above structure, when the Y-axis drive motor 15 is driven, the Y-axis carriage 19 is guided by the Y-axis guide rail 11 and moved in the Y-axis direction by the rotation of the ball screw 13. become. Since the laser processing head 23 is provided on the Y-axis carriage 19 via the Z-axis carriage 21, the laser processing head 23 is also moved in the Y-axis direction according to the movement of the Y-axis carriage 19.

The laser processing head 23 moves in the X-axis direction, Y
A processing table 25, on which the work W to be machined is mounted and fixed, is arranged immediately below the moving range that is moved in the axial direction. A laser oscillator 29 is arranged on the front side of the processing machine body 3 through a laser oscillator frame 27 as shown in FIG. 2 together, and the left side of the processing machine body 3 in FIG. An NC device 33 is provided via the frame 31.

With the above construction, the NC processing unit 31 controls the laser processing apparatus 1 to move the X-axis carriage 9 in the X-axis direction and the Y-axis carriage 19 in the Y-axis direction so that the laser processing head 23 moves the processing table 25. The work W placed and fixed on the top is positioned at a desired position. In this state, the laser beam oscillated from the laser oscillator 27 is focused on the condenser lens of the laser processing head 23 through the plurality of bend mirrors, and then is irradiated toward the work W, so that the work W is laser processed. Will be done.

As shown in FIGS. 1 and 2, the vibration detecting sensor 3 is provided on the laser oscillator frame 27.
5 are provided. Further, in the NC device 33, for example, a comparator 37 and a set value memory 39 are respectively provided. The vibration detection sensor 35 is connected to a comparator 37 of the NC device 33 by a transmission line 41.

With the above configuration, when an earthquake occurs while the laser processing apparatus 1 is performing laser processing on the work W, the vibration detection sensor 35 detects the vibration. This vibration is captured as a detection signal in the comparator 37 of the NC device 33 via the transmission line 41. Since the comparator 37 is loaded with the set value preset in the set value memory 39 and stored, for example, the vibration "4", the comparator 37 compares the detected value with the set value, and the detected value is detected. When is above the set value, an emergency stop signal is sent from the NC device 33 to the laser processing device 1 and the laser processing device 1 is brought to an emergency stop.

Explaining with reference to the flow chart shown in FIG. 3, when an earthquake occurs in step S1, the vibration is detected by the vibration detecting sensor 35 in step S2 and is taken into the comparator 37 of the NC device 33. The comparator 37 compares the detected value with the vibration "4" as the set value. If the detected value is less than the vibration "4", an emergency stop signal is sent to the laser processing apparatus 1 in step S3. No
Laser processing is continued.

When the detected value becomes equal to or higher than the vibration factor "4", the process proceeds to step S4, an emergency stop signal is sent from the NC device 33 to the laser processing device 1, and the laser processing device 1 is sent at step S5.
Will be stopped. Therefore, the vibration can be accurately and reliably detected by the vibration detection sensor 35 at the time of an earthquake, and the laser processing apparatus 1 can be brought to an emergency stop when the detected value becomes equal to or larger than a preset set value. Thus, it is possible to prevent a secondary disaster such as a fire caused by an earthquake.

Further, as the vibration detecting sensor 35, a vibration detecting sensor 3 for preset vibration, for example, a vibration "4" is used.
5, a switch for a B contact is provided in the electric circuit to stop the laser processing apparatus 1 in an emergency when the vibration detection sensor 35 detects a vibration during an earthquake.

With the above configuration, when the laser processing apparatus 1 is operated, an earthquake occurs, and the vibration detection sensor 35 is activated, the switch for the B contact operates to bring the laser processing apparatus 1 to an emergency stop. Thus, it is possible to prevent a secondary disaster such as a fire caused by an earthquake.

The present invention is not limited to the above-described embodiment, but can be embodied in other modes by making appropriate changes. Although the vibration detection sensor 35 is attached to the laser oscillator frame 27 in the example of the present embodiment, the vibration detection sensor 35 may be attached in the vicinity of the processing machine body 3, the laser oscillator 29, or the laser processing apparatus 1. Further, in the example of the present embodiment, the laser processing apparatus 1 is described as a single machine, but a punch / laser combined processing apparatus can also be used.

[0026]

As will be understood from the examples of the embodiment as described above, according to the invention of claim 1, when an earthquake occurs during laser processing of a work by a laser processing apparatus, processing is performed. Vibration can be detected by a vibration detection sensor provided near the machine body, the laser oscillator unit, or the laser processing apparatus.

Further, according to the invention of claim 2, the vibration detected by the vibration detecting sensor at the time of an earthquake is transmitted to the NC device as a detection signal, and in this NC device, the detected value and the preset setting are set. The values are compared in a comparator. When the detected value exceeds the set value, an emergency stop signal is transmitted from the NC device to the laser processing device, and the laser processing device can be brought to an emergency stop. As a result, it is possible to prevent a fire of the laser processing apparatus.

According to the third aspect of the present invention, when the vibration detection sensor for detecting a preset vibration at the time of an earthquake is activated, the switch works to stop the laser processing apparatus. Thus, it is possible to prevent a fire in the laser processing device or the like.

[Brief description of the drawings]

FIG. 1 is a front view of a laser processing apparatus showing an example of an embodiment for carrying out the present invention.

FIG. 2 is a perspective view in which a part of a laser oscillator is omitted.

FIG. 3 is a flowchart showing the operation of the present invention.

[Explanation of symbols]

 1 Laser processing device 3 Processing machine main body 9 X-axis carriage 19 Y-axis carriage 23 Laser processing head 25 Processing table 27 Laser oscillator frame 29 Laser oscillator 33 NC device 35 Vibration detection sensor 37 Comparator 39 Set value memory

Claims (3)

[Claims] 1. A laser processing apparatus comprising a processing machine main body, a laser oscillator unit, or a vibration detection sensor in the vicinity of the laser processing apparatus in the laser processing apparatus. 2. A laser processing apparatus is provided with an NC device, a detection signal detected by the vibration detection sensor is transmitted to the NC device, and the detected value is compared with a preset setting value to detect the detected value. 2. The laser processing apparatus according to claim 1, wherein the NC apparatus is provided with a comparator that stops the laser processing apparatus when is greater than or equal to a set value. 3. The laser according to claim 1, wherein the vibration detection sensor detects a preset vibration, and a switch for stopping the laser processing device when the vibration detection sensor is activated is provided. Processing equipment.